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WO2016176981A1 - 扬声器模组 - Google Patents

扬声器模组 Download PDF

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Publication number
WO2016176981A1
WO2016176981A1 PCT/CN2015/094898 CN2015094898W WO2016176981A1 WO 2016176981 A1 WO2016176981 A1 WO 2016176981A1 CN 2015094898 W CN2015094898 W CN 2015094898W WO 2016176981 A1 WO2016176981 A1 WO 2016176981A1
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WO
WIPO (PCT)
Prior art keywords
ultrasonic
module
casing
speaker
housing
Prior art date
Application number
PCT/CN2015/094898
Other languages
English (en)
French (fr)
Inventor
李兆鹏
刘华伟
宋学平
韩志磊
Original Assignee
歌尔声学股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 歌尔声学股份有限公司 filed Critical 歌尔声学股份有限公司
Priority to US15/571,494 priority Critical patent/US10219055B2/en
Publication of WO2016176981A1 publication Critical patent/WO2016176981A1/zh

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/023—Screens for loudspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/025—Arrangements for fixing loudspeaker transducers, e.g. in a box, furniture

Definitions

  • the invention relates to the technical field of electroacoustic products, and in particular to a speaker module.
  • the speaker module is an important acoustic component of a portable electronic device for converting between an electrical signal and a sound signal, and is an energy conversion device.
  • the existing speaker module usually includes a module housing.
  • the module housing houses a speaker unit, and the speaker unit divides the entire module cavity into two chambers, a front sound chamber and a rear sound chamber.
  • the speaker unit is usually positioned by a positioning structure disposed on the module casing, and then fixed on the module casing by a glue seal.
  • the module is provided with a positioning structure on the module casing to fix the module of the speaker unit.
  • the structure of the group casing is very complicated, the processing of the module casing is difficult, and the positioning structure occupies the space of the cavity of the module, which seriously affects the acoustic performance of the module; at the same time, the glue sealing process is complicated, the fixing firmness is poor, and the sealing glue is It is prone to cracking, which seriously reduces the service life of the module.
  • the structure of the speaker module is also adapted to the internal space of the electronic device.
  • the space of the module cavity is ensured to be large enough. Therefore, the structure of the speaker module is mostly irregular, so that the speaker unit in some modules will infinitely approach the edge of the module casing, and even some of the speaker parts will be exposed outside the module casing.
  • the exposed speaker module of the single unit has a more difficult sealing of the inner cavity.
  • the current common solution is to apply a large amount of sealant between the speaker unit and the module shell. This sealing method is not only difficult to assemble, but also difficult to assemble. The complexity is high and the production cost is high; at the same time, the sealing performance is poor, the appearance quality is low, and the product qualification rate is low.
  • the technical problem to be solved by the present invention is to provide a speaker module having a simple outer casing structure, strong bonding strength between the speaker unit and the module outer casing, simple assembly process, and good acoustic performance. ,long lasting.
  • the technical problem to be solved by the present invention is to provide a speaker module in which a single speaker portion is exposed.
  • the speaker module has a simple structure and a combination of a speaker unit and a module housing. It has strong firmness, simple assembly process, good acoustic performance and long service life. At the same time, the speaker module has good sealing performance, high appearance quality and high product qualification rate.
  • the technical solution of the present invention is:
  • a speaker module includes a module housing, wherein the module housing houses a speaker unit, and the speaker unit includes a unitary housing and a unit front cover that are combined together, the unit housing and the a vibration system and a magnetic circuit system are housed in a space surrounded by the front cover of the unit, and an end surface of at least one side wall of the single body casing is provided with an ultrasonic surface ultrasonically welded to the module casing, and the module casing An ultrasonic line that is ultrasonically coupled to the ultrasonic surface is provided at a position corresponding to the ultrasonic surface.
  • the speaker unit is disposed adjacent to a side edge of the module housing, and one side wall of the single housing is exposed outside the module housing, and the ultrasonic surface is disposed on the single body
  • the outer casing is exposed on a side wall of the exterior of the module housing.
  • the ultrasonic side surface is also disposed on the other side wall of the single body casing, and the side wall is disposed corresponding to the side wall exposed outside the module casing.
  • the ultrasonic surface is lower than the corresponding end surface of the magnetic circuit system, and the position of the module housing corresponding to the ultrasonic surface is provided with a blocking wall extending toward the ultrasonic surface, and the ultrasonic wire is disposed in the On the end face of the retaining wall.
  • the middle portion of the ultrasonic surface is a flat surface, and both ends thereof are inclined surfaces extending toward the upper end surface of the single-shell and extending to the upper end surface; the end surface structure of the retaining wall and the structure of the ultrasonic surface Fitted.
  • the single-shell outer casing is provided with a step end surface of the ultrasonic surface, and includes a stepped end surface on the inner side and a second step surface on the outer side, wherein the position of the first step surface is higher than the a position of the second step surface, the first step surface is the ultrasonic surface; an end surface of the blocking wall is a stepped structure adapted to the step end surface, and the ultrasonic line is disposed at the step structure
  • the step surface corresponding to the first step surface is described.
  • the module housing includes an upper shell and a lower shell joined together, and a side wall of the single housing exposed outside the module housing is located between the upper shell and the lower shell, the block A wall is disposed on the lower casing.
  • a position of the upper shell corresponding to the speaker unit is provided with a first mounting hole
  • the single unit a front cover is located at the first mounting hole, and an outer surface of the single front cover is flush with an outer surface of the upper case; and an inner side of the upper case is provided with a retaining wall around an outer side of the first mounting hole.
  • a coating tape is formed on the inner surface of the upper casing between the retaining wall and the edge of the first mounting hole.
  • a position of the lower casing corresponding to the speaker unit is provided with a second mounting hole, a lower end of the magnetic circuit system is located at the second mounting hole, and a lower end surface of the magnetic circuit system and the lower portion
  • the outer surface of the casing is flush; the outer surface of the lower casing located at the periphery of the second mounting hole is provided with a chamfered slope, and the lower end surface of the magnetic circuit system is provided with a depressed edge portion, the chamfered slope
  • a glue groove is formed between the edge portions.
  • the magnetic circuit system comprises a basin frame and an inner magnet and a inner washer which are sequentially fixed in a middle portion of the inner side of the basin frame, and side edges of the basin frame parallel to the ultrasonic surface are sequentially fixed with side magnets and
  • the position of the side shell corresponding to the inner side of the side wall of the two sides of the two sides of the edge is provided with a positioning protrusion extending to the edge of the side, the side
  • the position of the locating portion corresponding to the positioning protrusion is provided with a positioning recess matched with the positioning protrusion.
  • the speaker module of the present invention comprises a module casing
  • the module casing houses a speaker unit
  • the speaker unit comprises a unitary outer casing and a single front cover, and a lower end surface of at least one side wall of the single casing
  • An ultrasonic surface is provided, and an ultrasonic line that is ultrasonically combined with the ultrasonic surface is disposed at a position corresponding to the ultrasonic surface on the outer casing of the module.
  • the ultrasonic welding process is easy to operate and has strong bonding strength.
  • the speaker unit does not fall off the outer casing due to cracking of the sealant, and has a long service life.
  • the ultrasonic surface is disposed on a side wall of the single housing exposed on the outside of the module housing.
  • This feature can realize the combination of the exposed side wall of the single casing and the module casing by the ultrasonic welding process, and the combination method has the advantages of simple assembly process, good sealing performance and no occurrence compared with the prior art glue sealing. Leakage, at the same time, the appearance quality of the module is high, the external dimensions of the module do not change, and the production efficiency is high and the product qualification rate is high.
  • the side wall of the unit casing is also provided with an ultrasonic surface, the side wall is disposed corresponding to the side wall exposed outside the module casing. That is, the corresponding side walls of the single-shell are ultrasonically welded to the module casing, and the single-unit force of the speaker is uniform during ultrasonic welding, which effectively avoids the vibration of the diaphragm during ultrasonic welding. Uneven deformation and deformation of the front cavity sealant occur, further improving the acoustic performance of the speaker module and the yield of the finished product.
  • the middle portion of the ultrasonic surface is a flat surface, both ends thereof are inclined surfaces extending toward the upper end surface of the single casing and extending to the upper end surface; the end surface structure of the retaining wall is adapted to the structure of the ultrasonic surface.
  • the structure of the ultrasonic surface ensures that the side wall of the single casing can be ultrasonically welded to the module casing except for the upper end surface, which further improves the sealing performance of the module and simplifies the assembly process.
  • the side wall end surface of the single housing provided with the ultrasonic surface is a step end surface, including a first step surface located on the inner side and a second step surface located on the outer side, the position of the first step surface is higher than the second step surface, the first step surface
  • the ultrasonic surface; the end surface of the retaining wall is a stepped structure adapted to the step end surface, and the ultrasonic line is disposed on the step surface corresponding to the first step surface of the stepped structure.
  • the end faces of the single casing and the retaining wall are all arranged in a stepped structure.
  • the speaker module of the present invention solves the technical problems of complicated assembly process, poor sealing performance and poor appearance of the speaker module in the prior art.
  • the speaker module of the invention has simple assembly process, good sealing performance, high appearance quality and acoustics. Good performance, high production efficiency and low production cost.
  • FIG. 1 is a schematic exploded view of a speaker module of the present invention
  • Figure 2 is a combination view of Figure 1;
  • Figure 3 is a view taken along line A of Figure 2;
  • Figure 4 is a cross-sectional view taken along line B-B of Figure 3;
  • Figure 5 is an enlarged view of a portion C of Figure 4.
  • Figure 6 is a schematic structural view of the lower case of Figure 1;
  • Figure 7 is a schematic structural view of the speaker unit of Figure 1;
  • orientations referred to in this specification refer to the direction of the speaker unit vibration system, and the orientation refers to the direction of the speaker unit magnetic circuit system;
  • the inner side referred to in this specification refers to the module cavity or the monomer cavity.
  • the inner side and the outer side refer to one side outside the inner cavity of the module or outside the inner cavity of the module.
  • a speaker module is a rectangular structure including a casing composed of an upper casing 20 and a lower casing 10 which are joined together, and a space enclosed by the upper casing 20 and the lower casing 10
  • the speaker unit 30 is housed, and the speaker unit 30 is also rectangular.
  • the speaker unit 30 is located at one side edge of the module.
  • the speaker unit 30 divides the entire module cavity into two chambers, a front cavity and a rear cavity.
  • the speaker unit 30 includes a unitary outer casing 32 and a unit front cover 34 which are joined together, and a space surrounded by the unit outer casing 32 and the unit front cover 34 is accommodated. Vibration system and magnetic circuit system.
  • the lower end faces of the opposite side long side walls of the unit casing 32 are provided with ultrasonic surfaces, and the inner side of the lower casing 10 is provided with an ultrasonic line 140 at a position corresponding to the ultrasonic surface, and the speaker unit 30 is fixed to the lower casing 10 by an ultrasonic welding process. on.
  • one side long side wall of the unit casing 32 is exposed outside the module casing, and the side wall of the unit casing 32 is located between the upper casing 20 and the lower casing 10.
  • the lower end faces of the side walls of the long sides of the unit outer casing 32 are lower than the lower end surface of the magnetic circuit system, that is, the ultrasonic surface is lower than the lower end surface of the magnetic circuit system, that is, It is said that the unitary casing 32 encloses only the portion of the magnetic circuit system close to the vibration system in the longitudinal direction.
  • the lower casing 10 is provided with a retaining wall 18 extending toward the ultrasonic surface corresponding to the side walls of the long sides of the unit outer casing 32, and the ultrasonic wire 140 is disposed on the end surface of the retaining wall 18.
  • the ultrasonic line 140 on the 18 forms an annular closed ultrasonic belt with the ultrasonic line 144 on the outer side wall end face of the other portion of the lower casing 10, and the ultrasonic wire 140 on the side retaining wall 18 is ultrasonically welded to the unit casing 32, and is located at the other.
  • the ultrasonic 144 of the portion is ultrasonically welded to the upper casing 20.
  • the other retaining wall 18 is located in the middle of the inner side of the lower casing 10, perpendicular to the bottom of the lower casing 10, preferably its length and single
  • the length of the long side wall of the body casing 32 is the same. Because if the length is too short, the bonding strength between the lower casing 10 and the single casing 32 is lowered; if the length is too long, the excess portion occupies the space of the cavity behind the module, which reduces the acoustic performance of the module.
  • the lower end faces of the side walls of the long sides of the single-shell 32 are approximate bridge shapes, that is, the middle of the end faces is a horizontal plane, and the ends thereof are single-body.
  • An inclined surface of the upper end surface of the outer casing 32 i.e., the upper end surface of the side wall
  • both inclined surfaces extend to the upper end surface.
  • the structure of the ultrasonic surface is also an approximate bridge shape, that is, the ultrasonic surface extends from the end of one inclined surface along the inclined surface, and extends through the horizontal plane to the end of the inclined surface on the other side.
  • the end face structure of the retaining wall 18 is adapted to the end face structure of the long side wall of the single outer casing 32, and is a concave structure having a high height at both ends and a low middle portion, so that the single outer casing 32 exposed outside the module casing forms an equal shape. Waist trapezoid.
  • the structure can ensure that the side wall of the single side casing 32 can be ultrasonically welded to the lower shell 10 except for the upper end surface, which further improves the sealing performance of the module and simplifies the assembly process.
  • the lower end faces of the long side walls of both sides of the unit outer casing 32 are step end faces 320, which are composed of two step faces, including a first step face 322 located at the inner side and located at
  • the outer second step surface 324 has a position of the first step surface 322 higher than that of the second step surface 324, and the first step surface 322 is an ultrasonic surface.
  • the end surface of the retaining wall 18 is also a stepped structure, and is also composed of two stepped surfaces. The position of the step surface on the inner side is lower, the position of the step surface on the outer side is higher, and the ultrasonic line 140 is located on the step surface with a lower position.
  • the step surface on the outer side forms a boss 142 that is blocked outside the ultrasonic line 140.
  • the ultrasonic line 140 is ultrasonically coupled to the first step surface 322, and the boss 142 abuts the second step surface 324.
  • the end faces of the unit outer casing 32 and the retaining wall 18 are both arranged in a stepped structure.
  • the two stepped structures cooperate with each other, which can greatly improve the positioning accuracy of the speaker unit, thereby improving the accuracy of the ultrasonic welding position.
  • the boss 142 is blocked on the outer side of the ultrasonic wire 140, which can effectively prevent the glue from being overflowed during ultrasonic welding, and ensures the outer dimensions of the module and the smoothness of the appearance.
  • the upper casing 20 is provided with a first mounting hole 26 corresponding to the position of the speaker unit 30, the unit front cover 34 is located at the first mounting hole 26, and the outer surface of the unit front cover 34 is provided. It is flush with the outer surface of the upper casing 20, and the structure can effectively reduce the thickness of the module, so that it can adapt to the requirements of thin electronic equipment.
  • the inner side of the upper casing 20 is provided with a retaining wall around the outer side of the first mounting hole 26.
  • the retaining wall 24 only surrounds the three sides of the first mounting hole 26 not near the edge of the upper casing 20, and the inner surface of the upper casing 20 between the retaining wall 24 and the edge of the first mounting hole 26 is used for gluing and the speaker unit 30
  • a portion of the first mounting hole 26 adjacent to the edge of the upper casing 20 and the edge of the upper casing 20 is also provided with a portion for applying glue, thereby forming a closed coating around the first mounting hole 26.
  • Tape 22 is also provided with a portion for applying glue, thereby forming a closed coating around the first mounting hole 26.
  • the unit front cover 34 includes a ridge at the center, and the periphery of the ridge is provided with a flat rim.
  • the ridge is located at the first mounting hole 26, and the rim is overlapped on the adhesive tape 22 and fixed to the upper case 20 by a sealant. Thereby an effective seal is formed between the front and rear sound chambers of the module.
  • the vibration system includes a diaphragm 360 whose edge portion is fixed between the unit casing 32 and the unit front cover 34, and the diaphragm 360 is fixed to the center of the side of the unit front cover 34.
  • the top 362 has a voice coil 364 fixed to the other side of the diaphragm 360.
  • the magnetic circuit system includes a basin frame 380.
  • the basin frame 380 includes a rectangular bottom portion, and the side edges of the bottom sides of the bottom portion are respectively provided with a side wall of the basin frame perpendicular to the bottom portion, and the central portion of the inner side of the bottom portion is sequentially fixed with the inner magnet 382 and the inner washer.
  • the inner magnet 382 and the inner washer 386 constitute the inner magnetic circuit of the magnetic circuit system
  • the side wall of the basin frame and the side magnet 384 and the edge washer 388 constitute the outer magnetic circuit of the magnetic circuit system, and between the inner magnetic circuit and the outer magnetic circuit.
  • a magnetic gap is provided, and the end of the voice coil 364 is located in the magnetic gap.
  • the voice coil 364 moves according to the magnitude and direction of the acoustic electric signal in the winding, and the reciprocating cutting magnetic field moves in the magnetic gap.
  • the diaphragm 360 and the dome 362 vibrate with the movement of the voice coil 364, and the air is uttered.
  • the middle portion of the unit front cover 34 is provided with an acoustic hole, and the diaphragm 360 and the dome 362 urge the sound emitted by the air to be transmitted from the sound hole.
  • the second housing hole 16 is provided at a position corresponding to the speaker unit 30 on the lower casing 10.
  • the shape of the second mounting hole 16 is adapted to the bottom of the basin frame 380.
  • the side retaining walls 18 are located on the long side edges of both sides of the second mounting hole 16, and together with the side walls of the unitary outer casing 32, the magnetic circuit system is clamped therein.
  • the bottom of the basin frame 380 i.e., the lower end of the magnetic circuit system
  • the outer surface of the bottom of the basin frame 380 is flush with the outer surface of the lower casing 10.
  • the outer surface of the lower casing 10 located at the periphery of the second mounting hole 16 is provided with a chamfered bevel 12, and the outer surface of the bottom of the basin frame 380 is provided at the edge position.
  • the depressed edge portion 3800 forms a glue groove 40 between the chamfered slope 12 and the edge portion 3800.
  • This structure adds density
  • the contact area between the sealant and the lower case 10 and the basin frame 380 effectively improves the firmness of the bonding and the sealing of the rear acoustic cavity.
  • the inner side of the long side wall of the two sides of the unit outer casing 34 is provided with positioning protrusions 326 extending to the edge 377, corresponding to the positions of the two side slabs 388.
  • the outer side of the 388 corresponding to the positioning protrusion 326 is provided with a positioning recess 3880 which is matched with the positioning protrusion 326, and the positioning protrusion 326 is combined at the positioning recess 3880.
  • the above embodiment is only described in detail by taking the ultrasonic welding of the long side wall and the lower case of the single outer casing as an example, but it is not limited to the above solution, and the actual application can be based on the structure of the module only in the single casing.
  • An ultrasonic welding structure is disposed on one side wall, or an ultrasonic structure is disposed on the three side walls and the four side walls of the single body casing.
  • the ultrasonic structure is disposed on the opposite side walls and the ultrasonic structure is disposed on only one side wall, which can effectively prevent the bending deformation of the diaphragm caused by the uneven force of the speaker unit during ultrasonic welding.
  • the anterior cavity sealant cracking phenomenon compared with the three side wall or the four side wall, the structure of the lower shell and the single shell is simpler, and the space of the rear cavity of the module is saved, and the acoustics of the module are ensured. Performance, therefore, the arrangement in which the ultrasonic structure is combined with the lower casing to provide ultrasonic bonding on the opposite side walls of the unit casing is a preferred embodiment of the invention.
  • the invention realizes ultrasonic welding of the speaker unit and the module shell by providing an ultrasonic welding structure between the lower end surface of the single shell and the module shell, thereby effectively simplifying the assembly process of the speaker module and improving the speaker.
  • the acoustic performance of the module extends the life of the speaker module.
  • the assembly process of the speaker module exposed by the speaker unit is simplified, the sealing between the module housing and the speaker unit is improved, and the quality of the module appearance is improved, and the production cost is reduced.
  • the assembly process of the speaker module of the present invention is as follows:
  • a sealant is applied to the adhesive tape 22 to fix the speaker unit 30 to the upper casing 20, and a seal of the front acoustic cavity is formed, which combines the edge of the upper casing 20 of the speaker unit 30 with the ultrasonic of the single casing 32.
  • the faces together form a closed ultrasonic belt;
  • the lower casing 10 is fastened to the upper casing 20, and the joint is sealed by an ultrasonic welding process to complete the sealing of the sound chamber.
  • the basin frame 380 and the lower casing 10 are Apply glue between them, and seal the sound chamber after completion.
  • the above embodiments of the present invention are merely illustrative of the technical solution in which the speaker unit and the module casing are combined by an ultrasonic welding process, wherein the overall structure of the module and the structure of the speaker unit are not limited to the above structure, and the present invention is not limited to the above structure.
  • the technical solution can be applied to any module in which the speaker unit is partially exposed.
  • the technical solution of the present invention can be applied to the modules of other structures without any creative labor according to the description of the above embodiments. Therefore, regardless of whether the overall structure of the speaker module is the same as that of the above embodiment, and whether the structure of the speaker unit is the same as that of the above embodiment, the speaker unit and the module housing are combined by ultrasonic welding to simplify assembly. Products, processes that improve module sealing and appearance quality, and lower production costs are all within the scope of the present invention.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Telephone Set Structure (AREA)

Abstract

本发明公开了一种扬声器模组，涉及电声产品技术领域，包括模组外壳，所述模组外壳内收容有扬声器单体，所述扬声器单体包括结合在一起的单体外壳和单体前盖，所述单体外壳与所述单体前盖围成的空间内收容有振动系统和磁路系统，所述单体外壳的至少一侧侧壁的端面设有与所述模组外壳超声焊接的超声面，所述模组外壳上对应所述超声面的位置设有与所述超声面超声结合的超声线。本发明扬声器模组解决了现有技术中扬声器模组组装工艺复杂、密封性差、外观不良等技术问题，本发明扬声器模组组装工艺简单，密封性能良好，外观质量高，声学性能好，且生产效率高，生产成本低。

Description

扬声器模组 技术领域
本发明涉及电声产品技术领域，特别涉及一种扬声器模组。
背景技术
扬声器模组是便携式电子设备的重要声学部件，用于完成电信号与声音信号之间的转换，是一种能量转换器件。现有的扬声器模组通常包括模组外壳，模组外壳内收容有扬声器单体，扬声器单体将整个模组内腔分隔成前声腔和后声腔两个腔体。目前扬声器单体通常通过设置在模组外壳上的定位结构定位，然后通过涂胶密封固定在模组外壳上，此种在模组外壳上设置定位结构来固定扬声器单体的模组，其模组外壳的结构非常复杂，模组外壳的加工难度大，且定位结构会占用模组内腔的空间，严重的影响模组的声学性能；同时涂胶密封工艺复杂，固定的牢固性差，密封胶易发生开裂，严重的降低了模组的使用寿命。
由于目前便携式电子设备不断的向轻薄、小巧的方向发展，从而使得扬声器模组的结构也要适应电子设备内部空间的变化，为了保证模组的声学性能，即保证模组内腔的空间足够大，从而使得扬声器模组的结构多为不规则结构，以至于一些模组内的扬声器单体会无限的接近模组外壳的边缘，甚至有些扬声器单体的部分会裸露在模组外壳的外部，此种单体部分外露的扬声器模组其内腔的密封难度更大，目前常用的解决方案是在扬声器单体与模组外壳之间涂大量密封胶，此种密封方式不但组装工艺难度大，复杂程度高，生产成本高；同时密封性差，外观质量低，产品的合格率低。
发明内容
针对以上缺陷，本发明所要解决的技术问题是提供一种扬声器模组，此扬声器模组外壳结构简单，扬声器单体与模组外壳之间的结合牢固性强，组装工艺简单，且声学性能好，使用寿命长。
更进一步，本发明所要解决的技术问题是提供一种扬声器单体部分外露的扬声器模组，此扬声器模组外壳结构简单，扬声器单体与模组外壳之间的结合 牢固性强，组装工艺简单，且声学性能好，使用寿命长；同时此扬声器模组密封性能好，外观质量高，产品合格率高。
为解决上述技术问题，本发明的技术方案是：
一种扬声器模组，包括模组外壳，所述模组外壳内收容有扬声器单体，所述扬声器单体包括结合在一起的单体外壳和单体前盖，所述单体外壳与所述单体前盖围成的空间内收容有振动系统和磁路系统，所述单体外壳的至少一侧侧壁的端面设有与所述模组外壳超声焊接的超声面，所述模组外壳上对应所述超声面的位置设有与所述超声面超声结合的超声线。
其中，所述扬声器单体靠近所述模组外壳的一侧边缘设置，且所述单体外壳的一侧侧壁裸露在所述模组外壳的外部，所述超声面设置在所述单体外壳裸露在所述模组外壳外部的一侧侧壁上。
其中，所述单体外壳的另一侧侧壁上也设有所述超声面，该侧所述侧壁与裸露在所述模组外壳外部的所述侧壁相对应设置。
其中，所述超声面低于所述磁路系统的对应端面，所述模组外壳上对应所述超声面的位置设有向所述超声面延伸的挡壁，所述超声线设置在所述挡壁的端面上。
其中，所述超声面的中部为平面，其两端为向所述单体外壳的上端面延伸并延伸至所述上端面的倾斜面；所述挡壁的端面结构与所述超声面的结构相适配。
其中，所述单体外壳设有所述超声面的侧壁端面为阶梯端面，包括位于内侧的第一阶梯面和位于外侧的第二阶梯面，所述第一阶梯面的位置高于所述第二阶梯面的位置，所述第一阶梯面为所述超声面；所述挡壁的端面为与所述阶梯端面相适配的阶梯结构，所述超声线设置在所述阶梯结构与所述第一阶梯面相对应的阶梯面上。
其中，所述模组外壳包括结合在一起的上壳和下壳，所述单体外壳裸露在所述模组外壳外部的侧壁位于所述上壳与所述下壳之间，所述挡壁设置在所述下壳上。
其中，所述上壳上对应所述扬声器单体的位置设有第一安装孔，所述单体 前盖位于所述第一安装孔处且所述单体前盖的外表面与所述上壳的外表面齐平；所述上壳内侧围绕所述第一安装孔的外侧设有挡墙，所述挡墙与所述第一安装孔边缘之间的所述上壳内表面形成涂胶带。
其中，所述下壳上对应所述扬声器单体的位置设有第二安装孔，所述磁路系统的下端位于所述第二安装孔处，所述磁路系统的下端面与所述下壳的外表面齐平；位于所述第二安装孔周边的所述下壳外表面设有倒角斜面，所述磁路系统的下端面设有下陷的边缘部，所述倒角斜面与所述边缘部之间形成容胶槽。
其中，所述磁路系统包括盆架及依次固定在所述盆架内侧中部的内磁铁和内华司，所述盆架的与所述超声面相平行的两侧边缘部依次固定有边磁铁和边华司，所述单体外壳与两条所述边华司同侧的两侧侧壁内侧对应所述边华司的位置设有向所述边华司延伸的定位凸起，所述边华司对应所述定位凸起的位置设有与所述定位凸起相配合的定位凹陷。
采用了上述技术方案后，本发明的有益效果是：
由于本发明扬声器模组包括模组外壳，模组外壳内收容有扬声器单体，扬声器单体包括结合在一起的单体外壳和单体前盖，单体外壳的至少一侧侧壁的下端面设有超声面，模组外壳上对应超声面的位置设有与超声面超声结合的超声线。超声焊接工艺操作简便，结合的牢固性强，扬声器单体不会因为密封胶开裂而从外壳上脱落，使用寿命长。同时模组外壳内不需要设置复杂的定位结构，简化了模组外壳的结构，降低了模组外壳的加工难度，同时还有效的节省了模组的内腔空间，大大提高了扬声器模组的声学性能，降低了生产成本。
由于单体外壳的一侧侧壁裸露在模组外壳的外部，超声面设置在单体外壳裸露在模组外壳外部的一侧侧壁上。此特征可实现单体外壳裸露的侧壁与模组外壳之间通过超声焊接工艺结合，此种结合方式与现有技术中的涂胶密封相比具有组装工艺简单，密封性能好，不会发生漏气，同时模组的外观质量高，模组的外部尺寸不会发生变化，且生产效率高，产品合格率高的优点。
由于单体外壳的另一侧侧壁上也设有超声面，该侧侧壁与裸露在模组外壳外部的侧壁相对应设置。即单体外壳相对应的两侧侧壁均与模组外壳超声焊接，在进行超声焊接时扬声器单体受力均匀，有效的避免了超声焊接时振膜因受力 不均而弯折变形及前腔密封胶开裂的现象发生，进一步的提升了扬声器模组的声学性能及成品合格率。
由于超声面的中部为平面，其两端为向单体外壳的上端面延伸并延伸至上端面的倾斜面；挡壁的端面结构与超声面的结构相适配。超声面的此种结构可保证单体外壳的该侧侧壁除了上端面以外的其它侧面均可以与模组外壳实现超声焊接，进一步的提高了模组的密封性，简化了组装工艺。
由于单体外壳设有超声面的侧壁端面为阶梯端面，包括位于内侧的第一阶梯面和位于外侧的第二阶梯面，第一阶梯面的位置高于第二阶梯面，第一阶梯面为所述超声面；挡壁的端面为与所述阶梯端面相适配的阶梯结构，超声线设置在阶梯结构与第一阶梯面相对应的阶梯面上。单体外壳与挡壁相结合的端面均设为阶梯结构，在进行超声焊接时，两个阶梯结构相互配合，可大大提高扬声器单体的定位精度，提高了超声焊接位置的准确性，进一步的提高了模组的密封性能。
综上所述，本发明扬声器模组解决了现有技术中扬声器模组组装工艺复杂、密封性差、外观不良等技术问题，本发明扬声器模组组装工艺简单，密封性能良好，外观质量高，声学性能好，且生产效率高，生产成本低。
附图说明
图1是本发明扬声器模组的分解结构示意图；
图2是图1的组合图；
图3是图2的A向视图；
图4是图3的B-B线剖视图；
图5是图4的C部放大图；
图6是图1中下壳的结构示意图；
图7是图1中扬声器单体的结构示意图；
图中：10、下壳，12、倒角斜面，140、超声线，142、凸台，144、超声线，16、第二安装孔，18、挡壁，20、上壳，22、涂胶带，24、挡墙，26、第一安装孔，30、扬声器单体，32、单体外壳，320、阶梯端面，322、第一阶梯面，324、第二阶梯面，326、定位凸起，34、单体前盖，360、振膜，362、 球顶，364、音圈，380、盆架，3800、边缘部，382、内磁铁，384、边磁铁，386、内华司，388、边华司，3880、定位凹陷，40、容胶槽。
具体实施方式
下面结合附图和实施例，进一步阐述本发明。
本说明书中涉及到的方位上均指扬声器单体振动系统的方向，方位下均指与扬声器单体磁路系统的方向；本说明书中涉及到的内侧均指位于模组内腔或单体内腔内的一侧，外侧均指位于模组内腔外或单体内腔外的一侧。
如图1和图2共同所示，一种扬声器模组，为矩形结构，包括外壳，外壳由结合在一起的上壳20和下壳10构成，上壳20和下壳10围成的空间内收容有扬声器单体30，扬声器单体30也为矩形结构，扬声器单体30位于模组的一侧边缘部位。扬声器单体30将整个模组内腔分为前声腔和后声腔两个腔体。
如图4、图6和图7共同所示，扬声器单体30包括结合在一起的单体外壳32和单体前盖34，单体外壳32与单体前盖34围成的空间内收容有振动系统和磁路系统。单体外壳32的相对的两侧长边侧侧壁的下端面均设有超声面，下壳10内侧对应超声面的位置设有超声线140，扬声器单体30通过超声焊接工艺固定在下壳10上。
如图2和图3共同所示，单体外壳32的一侧长边侧壁裸露在模组外壳的外部，单体外壳32的该侧侧壁位于上壳20与下壳10之间。
如图4、图6和图7共同所示，单体外壳32的两侧长边侧壁的下端面低于磁路系统的下端面，即超声面低于磁路系统的下端面，也就是说，单体外壳32在纵向上仅包裹住了磁路系统靠近振动系统的部分。下壳10对应单体外壳32的两侧长边侧壁的位置设有向超声面延伸的挡壁18，超声线140设置在挡壁18的端面上。其中与单体外壳32裸露在模组外壳外部的一侧侧壁超声焊接的挡壁18的两侧与下壳10的其它部位衔接，构成下壳10的环形外侧壁，且位于该侧挡壁18上的超声线140与位于下壳10其它部位外侧壁端面上的超声线144形成环形的闭合的超声带，该侧挡壁18上的超声线140与单体外壳32超声焊接结合，位于其它部位的超声线144与上壳20超声焊接结合。另一个挡壁18位于下壳10内侧的中部，与下壳10的底部相垂直，优选其长度与单 体外壳32的长边侧壁长度相同。因为如果其长度过短会降低下壳10与单体外壳32之间的结合强度；若其长度过长，多出的部分会占用模组后声腔的空间，会降低模组的声学性能。
如图3、图6和图7共同所示，单体外壳32的两侧长边侧壁的下端面均为近似的桥面形状，即该端面的中部为水平面，其两端为向单体外壳32的上端面(即该侧侧壁的上端面)延伸的倾斜面，两个倾斜面均延伸至上端面止。超声面的结构也为近似的桥面形状，即超声面由一侧倾斜面的端部开始沿倾斜面延伸，经过水平面，延伸至位于另一侧的倾斜面的端部结束。挡壁18的端面结构与单体外壳32的长边侧壁的端面结构相适配，为两端高、中间低的凹面结构，从而使得裸露在模组外壳外部的单体外壳32形成一个等腰梯形。此种结构可保证单体外壳32的该侧侧壁除了上端面以外的其它侧面均可以与下壳10实现超声焊接，进一步的提高了模组的密封性，简化了组装工艺。
如图5、图6和图7共同所示，单体外壳32的两侧长边侧壁的下端面为阶梯端面320，由两级阶梯面构成，包括位于内侧的第一阶梯面322和位于外侧的第二阶梯面324，第一阶梯面322的位置高于第二阶梯面324的位置，第一阶梯面322为超声面。挡壁18的端面也为阶梯结构，同样由两级阶梯面构成，其位于内侧的阶梯面位置较低，位于外侧的阶梯面位置较高，超声线140位于位置较低的阶梯面上，从而位于外侧的阶梯面形成了一个挡在超声线140外侧的凸台142。超声线140与第一阶梯面322超声结合，凸台142与第二阶梯面324相抵靠。单体外壳32与挡壁18相结合的端面均设为阶梯结构，在进行超声焊接时，两个阶梯结构相互配合，可大大提高扬声器单体的定位精度，从而提高超声焊接位置的准确性。同时凸台142挡在超声线140的外侧可有效的防止超声焊接时溢胶，保证了模组外形尺寸，及外表的光滑度。
如图1和图4共同所示，上壳20对应扬声器单体30的位置设有第一安装孔26，单体前盖34位于第一安装孔26处，且单体前盖34的外表面与上壳20的外表面齐平，此结构可有效的降低模组的厚度，使其能够适应薄型电子设备的要求。
如图1和图4共同所示，上壳20内侧围绕第一安装孔26的外侧设有挡墙 24，挡墙24仅围绕在第一安装孔26未靠近上壳20边缘的三侧，挡墙24与第一安装孔26边缘之间的上壳20内表面用于涂胶与扬声器单体30结合，第一安装孔26的靠近上壳20边缘的一侧边缘与上壳20的边缘之间也设有一段用于涂胶的部位，从而在第一安装孔26的四周形成了闭合的涂胶带22。单体前盖34包括位于中部的隆起部，隆起部的周边设有平面边沿，隆起部位于第一安装孔26处，边沿搭接在涂胶带22上，并通过密封胶与上壳20固定，从而在模组的前声腔与后声腔之间形成了有效的密封。
如图4和图7共同所示，振动系统包括边缘部固定在单体外壳32与单体前盖34之间的振膜360，振膜360靠近单体前盖34一侧的中部固定有球顶362，振膜360的另一侧固定有音圈364。磁路系统包括盆架380，盆架380包括矩形的底部，底部的两侧短边边缘处分别设有一与底部垂直的盆架侧壁，底部内侧的中部依次固定有内磁铁382和内华司386，底部内侧的两侧长边边缘侧分别依次固定有边磁铁384和边华司388。内磁铁382和内华司386构成了磁路系统的内磁路，盆架侧壁及边磁铁384和边华司388构成了磁路系统的外磁路，内磁路与外磁路之间设有磁间隙，音圈364的端部位于磁间隙内。音圈364根据通过其绕线内的声波电信号的大小和方向在磁间隙内做往复的切割磁力线运动，振膜360和球顶362随着音圈364的运动而产生振动，策动空气发声，从而完成电声之间的能量转换。单体前盖34的中间部位设有出声孔，振膜360和球顶362策动空气发出的声音由出声孔处传出。
如图1、图4、和图6共同所示，下壳10上对应扬声器单体30的位置设有第二安装孔16，第二安装孔16的形状与盆架380的底部相适配，两侧挡壁18位于第二安装孔16的两侧长边边缘，与单体外壳32的两侧侧壁共同将磁路系统夹持在其中。盆架380的底部(即磁路系统的下端)位于第二安装孔16处，且盆架380底部的外表面与下壳10的外表面齐平。此种结构可进一步的降低模组的整体厚度，使其能够满足更薄型电子设备的要求。
如图2、图4和图7共同所示，位于第二安装孔16(见图6)周边的下壳10外表面设有倒角斜面12，盆架380底部的外表面的边缘位置设有下陷的边缘部3800，倒角斜面12与边缘部3800之间形成容胶槽40。此结构增加了密 封胶与下壳10和盆架380之间的接触面积，有效的提高了粘接的牢固度及后声腔的密封性。
如图4和图5共同所示，单体外壳34的两侧长边侧壁的内侧对应两条边华司388的位置均设有向边华司388延伸的定位凸起326，边华司388的外侧对应定位凸起326的位置设有与定位凸起326相适配的定位凹陷3880，定位凸起326结合在定位凹陷3880处。此结构增加了单体外壳32与磁路系统之间的接触面积，可有效的提高单体外壳32与磁路系统之间的结合牢固度。
上述实施例仅以单体外壳的两侧长边侧壁与下壳实现超声焊接为例进行了详细的说明，但并不限于上述方案，实际应用中可以根据模组的结构仅在单体外壳的一侧侧壁上设置超声焊接结构，或者单体外壳的三侧侧壁及四侧侧壁上均设置超声结构。本实施方式在相对的两侧侧壁设置超声结构与仅在一侧侧壁设置超声结构相比可有效的防止在超声焊接时因扬声器单体受力不均而产生的振膜弯折变形及前腔密封胶开裂现象；与三侧侧壁或四侧侧壁均设置超声结构相比下壳及单体外壳的结构更简单，且节省了模组后腔的空间，保证了模组的声学性能，因此在单体外壳的相对的两侧侧壁上设置超声结构与下壳实现超声结合的方案为本发明的优选方案。
本发明通过在单体外壳的下端面与模组外壳之间设置超声焊接结构，实现了扬声器单体与模组外壳的超声焊接结合，有效的简化了扬声器模组的组装工艺，同时提高了扬声器模组的声学性能，延长了扬声器模组的使用寿命。尤其是简化了扬声器单体部分外露的扬声器模组的组装工艺，提高了模组外壳与扬声器单体之间的密封性，同时还提升了模组外观的质量，降低了生产成本。
如图1所示，本发明扬声器模组的组装工艺如下：
第一步，在涂胶带22上涂密封胶，将扬声器单体30固定在上壳20上，并形成前声腔的密封，结合有扬声器单体30的上壳20边缘及单体外壳32的超声面共同形成了闭合的超声带；
第二步，将下壳10扣合在上壳20上，通过超声焊接工艺密封结合，完成后声腔的密封。
如盆架外露，如图2所示，则在第二步结束后再在盆架380与下壳10之 间涂胶，完成后声腔的密封。
本发明上述实施例仅是对本发明将扬声器单体与模组外壳通过超声焊接工艺结合的技术方案的举例说明，其中模组的整体结构及扬声器单体的结构均不仅限于上述结构，本发明的技术方案可应用于任何一种扬声器单体部分外露的模组中，本领域技术人员根据上述实施例的描述不需要付出任何创造性劳动就可将本发明的技术方案应用到其它结构的模组中，故无论扬声器模组的整体结构是否与上述实施例相同，也无论扬声器单体的结构是否与上述实施例相同，只要是将扬声器单体与模组外壳通过超声焊接工艺结合，用以简化组装工艺、提高模组密封性及外观质量，降低生产成本的产品均落入本发明的保护范围内。
本说明书中涉及到的带有序号的特征命名(如第一阶梯面、第二阶梯面)仅是为了区别技术特征，并不代表各特征之间的位置关系，组装顺序及工作顺序等。
本发明不局限于上述具体的实施方式，本领域的普通技术人员从上述构思出发，不经过创造性的劳动，所做出的种种变换，均落在本发明的保护范围之内。

Claims (10)

  1. 扬声器模组，包括模组外壳，所述模组外壳内收容有扬声器单体，所述扬声器单体包括结合在一起的单体外壳和单体前盖，所述单体外壳与所述单体前盖围成的空间内收容有振动系统和磁路系统，其特征在于，所述单体外壳的至少一侧侧壁的端面设有与所述模组外壳超声焊接的超声面，所述模组外壳上对应所述超声面的位置设有与所述超声面超声结合的超声线。
  2. 根据权利要求1所述的扬声器模组，其特征在于，所述扬声器单体靠近所述模组外壳的一侧边缘设置，且所述单体外壳的一侧侧壁裸露在所述模组外壳的外部，所述超声面设置在所述单体外壳裸露在所述模组外壳外部的一侧侧壁上。
  3. 根据权利要求2所述的扬声器模组，其特征在于，所述单体外壳的另一侧侧壁上也设有所述超声面，该侧所述侧壁与裸露在所述模组外壳外部的所述侧壁相对应设置。
  4. 根据权利要求2或3所述的扬声器模组，其特征在于，所述超声面低于所述磁路系统的对应端面，所述模组外壳上对应所述超声面的位置设有向所述超声面延伸的挡壁，所述超声线设置在所述挡壁的端面上。
  5. 根据权利要求4所述的扬声器模组，其特征在于，所述超声面的中部为平面，其两端为向所述单体外壳的上端面延伸并延伸至所述上端面的倾斜面；所述挡壁的端面结构与所述超声面的结构相适配。
  6. 根据权利要求5所述的扬声器模组，其特征在于，所述单体外壳设有所述超声面的侧壁端面为阶梯端面，包括位于内侧的第一阶梯面和位于外侧的第二阶梯面，所述第一阶梯面的位置高于所述第二阶梯面的位置，所述第一阶梯面为所述超声面；所述挡壁的端面为与所述阶梯端面相适配的阶梯结构，所述超声线设置在所述阶梯结构与所述第一阶梯面相对应的阶梯面上。
  7. 根据权利要求6所述的扬声器模组，其特征在于，所述模组外壳包括结合在一起的上壳和下壳，所述单体外壳裸露在所述模组外壳外部的侧壁位于所述上壳与所述下壳之间，所述挡壁设置在所述下壳上。
  8. 根据权利要求7所述的扬声器模组，其特征在于，所述上壳上对应所述扬声器单体的位置设有第一安装孔，所述单体前盖位于所述第一安装孔处且所 述单体前盖的外表面与所述上壳的外表面齐平；所述上壳内侧围绕所述第一安装孔的外侧设有挡墙，所述挡墙与所述第一安装孔边缘之间的所述上壳内表面形成涂胶带。
  9. 根据权利要求8所述的扬声器模组，其特征在于，所述下壳上对应所述扬声器单体的位置设有第二安装孔，所述磁路系统的下端位于所述第二安装孔处，所述磁路系统的下端面与所述下壳的外表面齐平；位于所述第二安装孔周边的所述下壳外表面设有倒角斜面，所述磁路系统的下端面设有下陷的边缘部，所述倒角斜面与所述边缘部之间形成容胶槽。
  10. 根据权利要求9所述的扬声器模组，其特征在于，所述磁路系统包括盆架及依次固定在所述盆架内侧中部的内磁铁和内华司，所述盆架的与所述超声面相平行的两侧边缘部依次固定有边磁铁和边华司，所述单体外壳与两条所述边华司同侧的两侧侧壁内侧对应所述边华司的位置设有向所述边华司延伸的定位凸起，所述边华司对应所述定位凸起的位置设有与所述定位凸起相配合的定位凹陷。
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