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WO2016098397A1 - Élément de connexion électrique, module électroluminescent organique, et procédé de production de module électroluminescent organique - Google Patents

Élément de connexion électrique, module électroluminescent organique, et procédé de production de module électroluminescent organique Download PDF

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Publication number
WO2016098397A1
WO2016098397A1 PCT/JP2015/075020 JP2015075020W WO2016098397A1 WO 2016098397 A1 WO2016098397 A1 WO 2016098397A1 JP 2015075020 W JP2015075020 W JP 2015075020W WO 2016098397 A1 WO2016098397 A1 WO 2016098397A1
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WO
WIPO (PCT)
Prior art keywords
organic
electrical connection
connection member
layer
panel
Prior art date
Application number
PCT/JP2015/075020
Other languages
English (en)
Japanese (ja)
Inventor
夏樹 山本
Original Assignee
コニカミノルタ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by コニカミノルタ株式会社 filed Critical コニカミノルタ株式会社
Priority to JP2016564702A priority Critical patent/JPWO2016098397A1/ja
Publication of WO2016098397A1 publication Critical patent/WO2016098397A1/fr

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/06—Electrode terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional radiating surfaces
    • H05B33/26—Light sources with substantially two-dimensional radiating surfaces characterised by the composition or arrangement of the conductive material used as an electrode
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details

Definitions

  • the present invention relates to an electrical connection member, an organic electroluminescence module, and a method for manufacturing the organic electroluminescence module.
  • the present invention relates to an electrical connection member that can suppress the thickness of the entire organic electroluminescence module when laminated on an organic electroluminescence panel, an organic electroluminescence module including the electrical connection member, and a method of manufacturing the organic electroluminescence module.
  • organic electroluminescence (hereinafter also referred to as “organic EL”) element is known as a surface emitting light source.
  • organic EL element is surface emitting, can be made thinner than conventional light sources, and can be flexible.
  • a so-called can-sealed configuration is adopted for an organic EL panel in which an organic EL element is formed on a glass substrate.
  • Can sealing means that a glass member formed into a concave shape or a metal plate processed into a hollow structure is placed with a desiccant that adsorbs moisture inside, and the organic functional layer is covered with an epoxy adhesive or the like It is the structure which joins (for example, refer patent document 1).
  • a so-called solid sealing configuration also called laminate sealing.
  • Solid sealing is a configuration in which, for example, an epoxy-based sealing adhesive is applied to a thin glass sheet, a metal foil layer, a resin film, and the like, and is bonded to the entire necessary portion of the organic EL panel by thermocompression bonding.
  • an epoxy-based sealing adhesive is applied to a thin glass sheet, a metal foil layer, a resin film, and the like, and is bonded to the entire necessary portion of the organic EL panel by thermocompression bonding.
  • a flexible printed circuit board (hereinafter also referred to as “FPC”) in which a wiring pattern is formed on a substrate such as polyimide is used.
  • FPC flexible printed circuit board
  • an organic EL module is manufactured by attaching an FPC to the sealed organic EL panel, it is necessary to arrange the FPC so as to overlap the region where the organic functional layer of the organic EL panel is formed, depending on the use mode of the organic EL module. There is. In such a case, in the region where the organic functional layer of the organic EL panel and the FPC overlap, there arises a problem that the thickness of the entire organic EL module increases.
  • organic EL panels are not limited to lighting, but are used as backlights for smart devices and light sources for icon keys, and in combination with user interfaces such as keyboards and sensing devices.
  • application to fields is being studied, and when the thickness of the organic EL module is large, application to these fields is often difficult.
  • the present invention has been made in view of the above-described problems and situations, and its solution is an electrical connection member that can suppress the thickness of the entire organic electroluminescence module when laminated on an organic electroluminescence panel, and And an organic electroluminescence module comprising the above and a method for producing the organic electroluminescence module.
  • the electrical connection member laminated and attached to the organic EL panel has an organic functional layer of the organic EL panel in addition to the wiring pattern normally provided
  • the electrical connection member itself functions as a sealing material for the organic EL panel, and the sealing configuration normally provided on the organic EL panel can be omitted. It was found that the thickness of the entire module can be suppressed. That is, the subject concerning this invention is solved by the following means.
  • An electrical connection member that is stacked and attached so as to overlap an area where an organic functional layer of an organic electroluminescence panel is formed, A substrate, In order to seal the organic functional layer, a sealing pattern formed on the surface facing the organic electroluminescence panel among both surfaces of the substrate; In order to drive the organic electroluminescence panel, a wiring pattern formed on at least the surface facing the organic electroluminescence panel among both surfaces of the substrate;
  • An electrical connection member comprising:
  • the electrical connection member according to any one of items 1 to 3, An organic electroluminescence panel, The electrical connection member is stacked and attached so as to overlap an area where the organic functional layer of the organic electroluminescence panel is formed, the organic functional layer is sealed with the sealing pattern, and the organic electroluminescent panel An organic electroluminescence module, wherein the connection electrode portion and the wiring pattern are electrically connected.
  • An organic electroluminescence module manufacturing method in which an electrical connection member is laminated and attached so as to overlap an area where an organic functional layer of an organic electroluminescence panel is formed, Forming a sealing pattern for sealing the organic functional layer and a wiring pattern for driving the organic electroluminescence panel on one surface of the substrate to produce the electrical connection member; When, Laminating the electrical connection member on the organic electroluminescence panel, and sealing the organic functional layer with the sealing pattern; Electrically connecting the connection electrode portion of the organic electroluminescence panel and the wiring pattern;
  • the manufacturing method of the organic electroluminescent module characterized by having.
  • the electrical connection member of the present invention when laminated on an organic electroluminescence panel, the electrical connection member capable of suppressing the thickness of the entire organic electroluminescence module, the organic electroluminescence module including the same, and the organic electroluminescence module A manufacturing method can be provided.
  • the expression mechanism or action mechanism of the effect of the present invention is as follows. That is, the electrical connection member of the present invention includes a sealing pattern for sealing the organic functional layer of the organic EL panel in addition to the wiring pattern. For this reason, while the said electrical connection member is laminated
  • the electrical connection member itself functions as a sealing material for the organic EL panel, the sealing configuration provided in the conventional organic EL panel can be omitted, and the organic EL is reduced by the amount that the sealing configuration is omitted.
  • the thickness of the module can be reduced.
  • Schematic plan view showing an example of the configuration of the organic electroluminescence panel constituting the organic electroluminescence module 1A is a cross-sectional view of the plane along the line IB-IB shown in FIG. 1A
  • Schematic sectional view showing an example of the configuration of the organic electroluminescence element constituting the organic electroluminescence panel Schematic bottom view showing an example of the configuration of the electrical connection member Cross-sectional view taken along the line IIIB-IIIB shown in FIG. 3A
  • Schematic sectional view showing an example of the configuration of the organic electroluminescence module of the present invention Schematic bottom view showing Modification 1 of the configuration of the electrical connection member Sectional view of the surface along the line VB-VB shown in FIG.
  • the electrical connection member of the present invention is an electrical connection member that is stacked and attached so as to overlap the region where the organic functional layer of the organic electroluminescence panel is formed, in order to seal the substrate and the organic functional layer A sealing pattern formed on a surface of the substrate facing the organic electroluminescence panel, and at least the organic electroluminescence panel of the both surfaces of the substrate for driving the organic electroluminescence panel; And a wiring pattern formed on the opposing surface.
  • This feature is a technical feature common to or corresponding to each of claims 1 to 5.
  • the sealing pattern and the wiring pattern are made of the same material. Thereby, the sealing pattern and the wiring pattern can be formed collectively on the substrate, and the electrical connection member can be easily manufactured, and the manufacturing cost of the electrical connection member can be reduced.
  • ⁇ representing a numerical range is used in a sense including numerical values described before and after the numerical value as a lower limit value and an upper limit value.
  • the organic EL module of the present invention includes an organic EL panel and an electrical connection member that is stacked and attached so as to overlap an area where the organic functional layer of the organic EL panel is formed.
  • the electrical connection member of the present invention drives the organic EL panel and the sealing pattern formed on the surface facing the organic EL panel among the both surfaces of the substrate in order to seal the substrate and the organic functional layer. In order to do so, a wiring pattern formed on at least the surface of the substrate facing the organic EL panel is provided.
  • the organic EL element refers to a light emitting element composed of a pair of electrodes and a plurality of organic functional layers
  • the organic EL panel refers to a pair of organic EL elements provided on a substrate.
  • An organic EL module is an electrical connection member in which a plurality of organic functional layers of an organic EL panel are sealed and a wiring pattern for driving the organic EL panel is formed. The attached one.
  • FIGS. 1A, 1B, and 2 are schematic views illustrating an example of the configuration of the organic EL panel 10 constituting the organic EL module 100.
  • FIG. 1A is a schematic plan view of the organic EL panel 10 viewed from the side opposite to the light emitting surface 10A.
  • FIG. 1B is a cross-sectional view taken along the line IB-IB in FIG. 1A.
  • FIG. 2 is a schematic cross-sectional view showing an example of the configuration of the organic EL panel 10.
  • the organic EL panel 10 includes an organic EL element 1 having a light emitting region 3 and a transparent substrate 4 that supports the organic EL element 1.
  • a connection electrode portion 5 is drawn out to an end portion of the organic EL element 1 and is connected to a wiring pattern 23 of an electrical connection member 20 described later via a conductive adhesive 8.
  • An organic EL panel 10 shown in FIG. 1A and FIG. 1B is a single-sided light emitting organic EL panel that emits light from the transparent substrate 4 side, and is opposite to the surface of the transparent substrate 4 facing the organic EL element 1. The surface constitutes the light emitting surface 10A from which the emitted light L is emitted.
  • the organic EL element 1 is configured by stacking an anode 52, an organic functional layer 2, and a cathode 55, and the light emitting region 3 is formed in a region where these overlap.
  • the organic functional layer 2 is configured by laminating a first organic functional layer group 53A, a light emitting layer 54, and a second organic functional layer group 53B.
  • the first organic functional layer group 53A includes, for example, a hole injection layer, a hole transport layer, and the like
  • the second organic functional layer group 53B includes, for example, an electron transport layer, an electron injection layer, and the like.
  • a part of the anode 52 and the cathode 55 is formed up to the end of the transparent substrate 4, and constitutes the connection electrode parts 5 and 5, respectively.
  • the organic functional layer 2 is sealed with a sealing pattern 22 and an adhesive layer 24 of the electrical connection member 20 to be described later, thereby suppressing intrusion of gas (oxygen, moisture, etc.) that degrades the organic functional layer 2. Is done. Since the organic EL panel 10 is a single-sided emission type that emits light from the transparent substrate 4 side, the transparent substrate 4, the anode 52, and the first organic functional layer can be efficiently emitted from the light emitting surface 10 ⁇ / b> A. It is preferable that the group 53A and the like are made of a material having high light transmittance. In addition, the concrete component of the organic EL element 1 and the detail of a manufacturing method are mentioned later.
  • 3A is a schematic bottom view of the electrical connecting member 20, and
  • FIG. 3B is a cross-sectional view taken along the line IIIB-IIIB in FIG. 3A.
  • FIG. 4 is a schematic cross-sectional view showing an organic EL module 100 in which the electrical connection member 20 shown in FIG. 3B is laminated on the organic EL panel 10.
  • the adhesive layer 24 is omitted.
  • the electrical connection member 20 includes a flexible substrate 21, a sealing pattern 22, a wiring pattern 23, an adhesive layer 24, and the like.
  • the flexible substrate 21 is formed in substantially the same shape as the transparent substrate 4 of the organic EL panel 10, and is laminated and disposed so as to overlap the region where the organic functional layer 2 of the organic EL panel 10 is formed.
  • the flexible substrate 21 in a shape substantially the same as that of the transparent base material 4, the size of the organic EL module 100 can be reduced.
  • the material used for the flexible substrate 21 is not particularly limited as long as it is a resin material having flexibility and sufficient mechanical strength.
  • polyimide resin (PI), polycarbonate resin, polyethylene terephthalate resin (PET), polyethylene naphthalate resin (PEN), cycloolefin resin (COP) and the like are preferable, and polyimide resin (PI), polyethylene terephthalate resin (PET), polyethylene naphthalate resin (PEN) and the like are preferable.
  • a polyimide resin having high heat resistance is often used.
  • the thickness of the flexible substrate 21 can be in the range of 25 to 50 ⁇ m, for example.
  • the sealing pattern 22 is formed on the surface 21 a facing the organic EL panel 10 out of both surfaces of the flexible substrate 21, and when the electrical connection member 20 is laminated and attached to the organic EL panel 10, The organic functional layer 2 is sealed. That is, the sealing pattern 22 is formed on at least a portion of the surface 21 a of the flexible substrate 21 that faces the organic functional layer 2 of the organic EL panel 10.
  • the sealing pattern 22 is made of an inorganic material, and examples thereof include gold, silver, copper, and ITO. Among these, copper is preferably used from the viewpoint of cost reduction. Moreover, when the material which comprises the pattern 22 for sealing is the same as the wiring pattern 23, the pattern 22 for sealing and the wiring pattern 23 can be formed collectively, and the electrical connection member 20 is easy. The manufacturing cost of the electrical connecting member 20 can be reduced. Further, the thickness of the sealing pattern 22 can be set within a range of 12 to 36 ⁇ m, for example, from the viewpoint of required current amount, thickness, rigidity, and the like required according to the use of the organic EL module 100. It can be selected appropriately.
  • the wiring pattern 23 is formed on at least the surface 21a of both surfaces of the flexible substrate 21, and electrically connects the connection electrode portion 5 of the organic EL panel 10 to a driving IC (not shown) to drive the organic EL panel 10. . That is, the wiring pattern 23 is formed on the surface 21a and the surface 21b on the opposite side via the through hole 231. The wiring pattern 23 is electrically connected to the connection electrode portion 5 of the organic EL panel 10 in the portion formed on the surface 21a side. Connected and electrically connected to a driving IC (not shown) at a portion formed on the surface 21b.
  • the material constituting the wiring pattern 23 may be any material as long as it has conductivity, and the same material as that of the sealing pattern 22 can be used.
  • the adhesive layer 24 is formed on the sealing pattern 22 and joins the electrical connection member 20 and the organic EL panel 10.
  • a conventionally known sealing adhesive can be used.
  • a thermosetting adhesive or an ultraviolet curable resin is used, and preferably an epoxy resin, an acrylic resin,
  • a thermosetting adhesive such as a silicone resin, more preferably an epoxy thermosetting adhesive resin that is excellent in moisture resistance and water resistance and has little shrinkage upon curing is used.
  • the thickness of the adhesive layer 24 can be in the range of 10 to 30 ⁇ m, for example. Since the adhesive layer 24 is provided on the electrical connection member 20, the organic EL module 100 can be easily manufactured only by laminating the electrical connection member 20 on the organic EL panel 10.
  • the electrical connection member 20 may not include the adhesive layer 24. In this case, when the organic EL module 100 is manufactured, the organic functional layer 2 of the organic EL panel 10 and the electrical connection member 20 are sealed. The process of providing the adhesive bond layer 24 between the stop patterns 22 is performed.
  • the electrical connection member 20 shall be provided with the wiring pattern 23 on the flexible substrate 21, it is further provided with the cover layer (not shown) which covers them in order to suppress the corrosion of the said wiring pattern 23. It is good as a thing.
  • the organic EL panel 10 is a single-sided light emitting type that emits light from the transparent substrate 4 side.
  • the organic EL panel 10 is a transparent substrate. It is good also as what is the single-sided light emission type which light-emits from the surface on the opposite side of 4, or a double-sided light emission type.
  • the flexible substrate 21 is formed of a transparent resin or the like
  • the sealing pattern 22 is formed of a transparent metal such as ITO, so that the light emitting region 3 of the organic EL panel 10 of the electrical connection member 20 is formed. It is preferable that the overlapping portion is configured to have translucency.
  • surface or both surfaces of the flexible substrate 21 is prepared.
  • a polyimide film is used, and a laminated board is provided by providing copper foil as a metal layer on one surface or both surfaces of the flexible substrate 21 by heat fusion lamination or heat lamination using an adhesive layer.
  • the double-sided laminated board by which the 12-micrometer-thick copper foil was provided on both surfaces of the 25-micrometer-thick polyimide film, for example is used.
  • a CISV series manufactured by Nikkan Kogyo Co., Ltd. is used.
  • the sealing pattern 22 is formed on one side of the prepared double-sided laminated board, and the wiring pattern 23 is formed on one side and the other side of the double-sided laminated board.
  • a pattern formation method a wet patterning process using a photoresist is used.
  • a film type dry resist is preferably used in consideration of the affinity with the film handling process. In this case, all the manufacturing steps of the electrical connection member 20 can be performed by a roll-to-roll method.
  • the dry resist film is laminated on each copper foil by a heat laminating method.
  • the roll temperature of the thermal laminate is in the range of room temperature to 100 ° C., and can be appropriately set according to the physical properties of the dry resist film.
  • the laminated plate on which the dry resist film is laminated is intermittently fed by a roll-to-roll method, and the exposure mask is brought into close contact with the dry resist film.
  • An exposure mask for forming the sealing pattern 22 and the wiring pattern 23 is brought into intimate contact with one side of the laminate, and an exposure mask for forming the wiring pattern 23 is brought into intimate contact with the other side of the laminate.
  • the exposure mask for example, a single wafer glass mask or a film mask using a transparent film such as PET can be used, and is appropriately selected according to the pattern formation accuracy, cost, and the like.
  • the dry resist film is cured by irradiating the laminated plate with the exposure mask adhered thereto with UV light.
  • the exposed portion of the copper foil is etched by immersing the copper foil in the etching solution or applying the etching solution by a shower method. Thereby, the sealing pattern 22 and the wiring pattern 23 are formed.
  • the wiring patterns 23 formed on both surfaces of the flexible substrate 21 are electrically connected.
  • through holes are formed using an end mill having a diameter of about 0.3 mm in regions where the wiring patterns 23 are overlapped on both surfaces of the flexible substrate 21, and the wiring patterns 23 on both surfaces of the through hole portion and the flexible substrate 21 are formed.
  • Apply copper plating to The plating thickness is, for example, in the range of 6 to 10 ⁇ m. For example, if the plating thickness is 6 ⁇ m, the thickness of the wiring pattern 23 increases by 6 ⁇ m, and the thickness of the wiring pattern 23 becomes 18 ⁇ m.
  • an adhesive layer 24 is provided on the sealing pattern 22.
  • the adhesive layer 24 is formed by a sealing adhesive used for sealing an organic functional layer in a conventional organic EL panel.
  • the sealing adhesive is applied by a continuous coating process such as die coating.
  • the adhesive layer 24 is a sealing pattern.
  • it is preferably formed using an ink jet method or the like.
  • an epoxy-based material such as XMF series manufactured by Mitsui Chemicals, Inc. can be used.
  • a lightly peeled transparent protective film is laminated and wound into a roll.
  • the roll-shaped electrical connection member 20 can be produced as described above.
  • the organic EL module 100 of the present invention includes an organic EL panel 10 and an electrical connection member 20, and the electrical connection member 20 is laminated so as to overlap an area where the organic functional layer 2 of the organic EL panel 10 is formed.
  • the organic functional layer 2 is sealed with the sealing pattern 22, and the connection electrode portion 5 of the organic EL panel 10 and the wiring pattern 23 are electrically connected. That is, the organic EL module 100 is configured as shown in FIG.
  • the organic functional layer 2 of the organic EL panel 10 and the sealing pattern 22 of the electrical connection member 20 are joined by an adhesive layer 24 provided on the sealing pattern 22. Thereby, the organic functional layer 2 of the organic EL panel 10 is sealed by the sealing pattern 22 of the electrical connection member 20, and the organic EL panel 10 is additionally provided with a sealing configuration for sealing the organic functional layer 2. There is no need to be. Thus, since the sealing structure of the organic EL panel 10 can be omitted, the thickness of the organic EL module 100 as a whole can be reduced.
  • connection electrode portion 5 of the organic EL panel 10 and the wiring pattern 23 formed on the surface 21 a side of the electrical connection member 20 are joined by the conductive adhesive 8.
  • the conductive adhesive 8 for example, an anisotropic conductive film (ACF), an anisotropic conductive paste (ACP), a metal paste, or the like is used.
  • the conductive adhesive 8 may be provided on the wiring pattern 23 when the electrical connection member 20 is manufactured, and the electrical connection member 20 may be manufactured as a configuration including the conductive adhesive 8. When attached to the organic EL panel 10, it may be provided on the connection electrode portion 5 or the wiring pattern 23.
  • anisotropic conductive film for example, a thermosetting resin film is mixed with fine conductive particles having conductivity.
  • electroconductive particle there is no restriction
  • the commercially available anisotropic conductive film include a low-temperature curing type that can also be applied to a resin film, such as MF-331 (manufactured by Hitachi Chemical Co., Ltd.).
  • the metal particles include nickel, cobalt, silver, copper, gold, palladium and the like. These may be used individually by 1 type and may use 2 or more types together. Among these, nickel, silver, and copper are preferable. In order to prevent these surface oxidations, particles having gold or palladium on the surface may be used. Furthermore, you may use what gave the metal film and the insulating film with the organic substance on the surface.
  • metal-coated resin particles examples include particles in which the surface of the resin core is coated with any metal of nickel, copper, gold, and palladium. Similarly, particles obtained by applying gold or palladium to the outermost surface of the resin core may be used. Further, a resin core whose surface is coated with a metal protrusion or an organic material may be used.
  • anisotropic conductive paste is constituted by mixing the above conductive particles with a paste-like thermosetting resin.
  • examples of the commercially available anisotropic conductive paste include NIR-30E manufactured by Sanyu Rec.
  • an anisotropic conductive paste is used as the conductive adhesive 8, it is on the connection electrode portion 5 of the organic EL panel 10 or the wiring pattern 23 formed on the surface 21 a side of the electrical connection member 20. It can be provided by a printing process such as a screen printing method. Specifically, an anisotropic conductive paste having a thickness of 5 to 30 ⁇ m is provided on the connection electrode portion 5 or the wiring pattern 23 by a screen printing method or the like, and then dried. Although the anisotropic conductive paste after drying can be stored at room temperature, since it has slight adhesiveness, it is preferable to protect it by covering with a slip sheet or a transparent protective film. When the anisotropic conductive paste is provided on the wiring pattern 23, the electrical connection member 20 is wound and stored in a roll shape in a state where the anisotropic conductive paste is protected with a slip sheet or a transparent protective film. Can do.
  • a commercially available metal nanoparticle paste such as a silver particle paste, a silver-palladium particle paste, a gold particle paste, a copper particle paste, or the like, can be appropriately selected and used.
  • the metal paste include silver pastes for organic EL element substrates (CA-6178, CA-6178B, CA-2500E, CA-2503-4, CA-2503N, CA-271, etc., sold by Daiken Chemical Co., Ltd.
  • connection electrode part 5 of the organic EL panel 10 and the wiring pattern 23 formed on the surface 21a side of the electrical connection member 20 are joined by the conductive adhesive 8, they are not limited thereto. However, they may be joined by any means as long as they can be electrically and mechanically connected.
  • connection electrode portion 5 and the wiring pattern 23 may be bonded by means such as ultrasonic connection or heat fusion.
  • the manufacturing method of the organic EL module of the present invention is a manufacturing method of the organic EL module 100 in which the electrical connection member 20 is stacked and attached so as to overlap the region where the organic functional layer 2 of the organic EL panel 10 is formed. Then, a sealing pattern 22 for sealing the organic functional layer 2 and a wiring pattern 23 for driving the organic EL panel 10 are formed on the one surface 21a of the flexible substrate 21.
  • connection member 20 The step of producing the connection member 20, the step of laminating the electrical connection member 20 on the organic EL panel 10, and sealing the organic functional layer 2 with the sealing pattern 22, and the connection electrode portion 5 of the organic EL panel 10 And a step of electrically connecting the wiring pattern 23 to each other.
  • the step of forming the electrical connection member 20 by forming the sealing pattern 22 and the wiring pattern 23 on the flexible substrate 21 is performed.
  • the electrical connection member 20 is produced as described in the method for producing the electrical connection member.
  • an anisotropic conductive paste is provided as the conductive adhesive 8 on the wiring pattern 23 formed on the surface 21 a side of the manufactured electrical connection member 20.
  • the process of laminating the produced electrical connection member 20 on the organic EL panel 10 and sealing the organic functional layer 2 with the sealing pattern 22 is performed.
  • the produced roll-shaped electrical connection member 20 is set in a laminating machine used in a conventional organic EL panel sealing process.
  • the produced electrical connection member 20 is aligned with the roll-shaped organic EL panel 10, and a roll laminating method using a heat roll or a vacuum laminating method using a diaphragm made of an elastomeric material is used.
  • the electrical connection member 20 is laminated on the substrate.
  • the sealing pattern 22 of the electrical connection member 20 and the organic EL element 1 portion of the organic EL panel 10 are bonded together by the adhesive layer 24, and the organic functional layer 2 is formed by the sealing pattern 22 and the adhesive layer 24. Sealed.
  • the roll of the organic EL panel 10 on which the electrical connection member 20 is laminated is roughly cut out so as to be divided into several pieces (primary cut), and then further cut into the actually designed shape. (Secondary cut).
  • a cutting method such as pressing with an upper and lower blade, pressing with an acute angle blade, cutting with a roll cutter, laser cutting, water jet, or the like can be used, and the organic EL panel 10 and the electrical connection member 20 are collectively.
  • Disconnect As a cutting method, a method in which troubles such as cracks and film peeling do not occur in each constituent member of the organic EL panel 10 and the electrical connection member 20 is appropriately selected and performed.
  • connection electrode portion 5 of the organic EL panel 10 and the wiring pattern 23 of the electrical connection member 20 is formed by thermocompression bonding the region where the conductive adhesive 8 is provided in the laminate of the organic EL panel 10 and the electrical connection member 20 using, for example, a heat tool.
  • the pattern 23 is electrically connected.
  • the temperature of the heat tool is set to about 100 to 150 ° C., and pressure bonding is performed at a pressure of about 1 to 3 MPa for 5 to 30 seconds.
  • the wiring pattern 23 of the electrical connection member 20 and the connection electrode part 5 of the organic EL panel 10 are bonded together by the conductive adhesive 8, and both are electrically connected.
  • the organic EL module 100 can be manufactured.
  • FIGS. 5A, 5B, and 6 are schematic bottom views of the electrical connection member 30 according to the first modification
  • FIG. 5B is a cross-sectional view taken along the line VB-VB in FIG. 5A
  • FIG. 6 is a schematic cross-sectional view showing an organic EL module 100A in which the electrical connection member 30 shown in FIG. 5B is laminated on the organic EL panel 10.
  • the adhesive layer 34 is omitted. Since configurations other than those described below are substantially the same as those of the electrical connection member 20 and the organic EL module 100, detailed description thereof is omitted.
  • the flexible substrate 31 has a main body portion 311 formed in a shape substantially similar to the transparent base material 4 of the organic EL panel 10 and an extending portion 312 extending from one side edge portion of the main body portion 311. .
  • the sealing pattern 32 is formed on the main body portion 311 on the surface 31 a facing the organic EL panel 10 out of both surfaces of the flexible substrate 31.
  • An adhesive layer 34 is provided on the sealing pattern 32.
  • the wiring pattern 33 is formed on the surface 31 a of both surfaces of the flexible substrate 31 from the main body portion 311 to the extending portion 312.
  • An end portion 33 a formed in the main body portion 311 of the wiring pattern 33 is electrically connected to the connection electrode portion 5 of the organic EL panel 10, and an end formed in the leading end of the extending portion 312 in the wiring pattern 33.
  • the part 33b is electrically connected to a drive IC (not shown).
  • the sealing pattern 32 and the wiring pattern 33 are formed only on the surface 31 a of the flexible substrate 31. For this reason, the electrical connection member 30 is producible using the single area layer board in which metal layers, such as copper foil, were formed only in the single side
  • the electrical connection member 30 configured as described above is stacked and attached on the organic EL panel 10, and the organic EL panel 10 is organically formed by the sealing pattern 32 and the adhesive layer 34.
  • the functional layer 2 is sealed, and the end portion 33a of the wiring pattern 33 and the connection electrode portion 5 of the organic EL panel 10 are electrically connected.
  • the organic EL module 100A according to the first modification is configured.
  • FIGS. 7A and 7B are schematic plan views of an electrical connection member 40 according to Modification Example 2
  • FIG. 7B is a schematic bottom view of the electrical connection member 40 according to Modification Example 2.
  • the adhesive layer is omitted. Since the configuration other than that described below is substantially the same as that of the electrical connection member 20, a detailed description thereof will be omitted.
  • the electrical connection member 40 includes a flexible substrate 41, a sealing pattern 42, a wiring pattern 43, an antenna electrode pattern 45, an adhesive layer (not shown), and the like.
  • the sealing pattern 42 is formed at the center of the surface 41 a that faces the organic EL panel 10 out of both surfaces of the flexible substrate 41, and a part thereof extends to the edge 41 c of the flexible substrate 41.
  • a drawer portion 42a is formed.
  • a connection electrode 42b is formed in a region corresponding to the lead portion 42a on the surface 41b opposite to the surface 41a of the flexible substrate 41, and the connection electrode 42b is connected to the lead portion 42a.
  • an adhesive layer (not shown) is laminated and provided in a portion other than the lead portion 42a.
  • the antenna electrode pattern 45 is formed in a substantially U-shape at the peripheral edge of the surface 41b of the flexible substrate 41, and one end thereof extends to the edge 41c of the flexible substrate 41 to be connected.
  • An electrode 45a is formed.
  • the material constituting the antenna electrode pattern 45 may be any material having conductivity, and the same material as the constituent material of the sealing pattern 42 can be used.
  • connection electrode 42b of the sealing pattern 42 and the connection electrode 45a of the antenna electrode pattern 45 are electrically connected to a driving IC (not shown), respectively, and a pulse signal is input to the antenna electrode pattern 45, thereby
  • the stop pattern 42 can function as a receiver electrode
  • the antenna electrode pattern 45 can function as an antenna electrode. Thereby, it can be set as the electrical connection member in which a mutual capacitive touch detection is possible.
  • the antenna electrode pattern 45 is formed on the surface 41b of the flexible substrate 41.
  • the antenna electrode pattern 45 may be formed on the surface 41a.
  • FIG. 8 is a schematic plan view of the electrical connection member 60 according to the third modification. Since the configuration other than that described below is substantially the same as that of the electrical connection member 20, a detailed description thereof will be omitted.
  • the electrical connection member 60 includes a flexible substrate 61, a sealing pattern 62, a wiring pattern 63, a strain gauge pattern 65, an adhesive layer (not shown), and the like.
  • the sealing pattern 62 and the wiring pattern 63 are configured in the same manner as the electrical connecting member 20 shown in FIGS. 3A and 3B.
  • the strain gauge pattern 65 is formed by meandering on the surface 61 b opposite to the surface facing the organic EL panel 10 of both surfaces of the flexible substrate 61, and both end portions thereof are drawn out to the edge portion 61 c of the flexible substrate 61. Thus, a connection electrode 65a is formed.
  • a material constituting the strain gauge pattern 65 the same material as that of the sealing pattern 42 can be used.
  • connection electrode 65a of the strain gauge pattern 65 By connecting the connection electrode 65a of the strain gauge pattern 65 to a detection unit (not shown), an electrical connection member capable of detecting deformation can be obtained.
  • the strain gauge pattern 65 is preferably configured to have a long length and increase the number of meanders as much as possible within a designable range in order to improve deformation detection accuracy.
  • an organic EL module capable of detecting deformation can be configured.
  • the organic EL element 1 constituting the organic EL panel 10 includes an anode 52, a first organic functional layer group 53 ⁇ / b> A, a light emitting layer 54, and a second organic functional layer on the transparent substrate 4.
  • the group 53B and the cathode 55 are stacked.
  • the first organic functional layer group 53A includes, for example, a hole injection layer, a hole transport layer, an electron blocking layer, and the like
  • the second organic functional layer group 53B includes, for example, a hole blocking layer, an electric transport layer, an electron It consists of an injection layer and the like.
  • Each of the first organic functional layer group 53A and the second organic functional layer group 53B may be composed of only one layer, and the first organic functional layer group 53A and the second organic functional layer group 53B are not provided respectively. May be. Below, the typical example of a structure of an organic EL element is shown.
  • Transparent substrate examples of the transparent substrate applicable to the organic EL element according to the present invention include transparent materials such as glass and plastic. Examples of the transparent substrate preferably used include glass, quartz, and resin film.
  • the glass material examples include silica glass, soda lime silica glass, lead glass, borosilicate glass, and alkali-free glass.
  • a physical treatment such as polishing, a coating made of an inorganic material or an organic material, or these coatings, if necessary.
  • a combined hybrid coating can be formed.
  • polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), polyethylene, polypropylene, cellophane, cellulose diacetate, cellulose triacetate (TAC), cellulose acetate butyrate, and cellulose acetate.
  • Cellulose esters such as propionate (CAP), cellulose acetate phthalate, cellulose nitrate and their derivatives, polyvinylidene chloride, polyvinyl alcohol, polyethylene vinyl alcohol, syndiotactic polystyrene, polycarbonate, norbornene resin, polymethylpentene, poly Ether ketone, polyimide, polyethersulfone (PES), polyphenylene sulfide, Cyclones such as resulfones, polyetherimide, polyetherketoneimide, polyamide, fluororesin, nylon, polymethylmethacrylate, acrylic and polyarylates, Arton (trade name, manufactured by JSR) and Appel (trade name, manufactured by Mitsui Chemicals) An olefin resin etc. can be mentioned.
  • CAP propionate
  • CAP cellulose acetate phthalate
  • cellulose nitrate and their derivatives polyvinylidene chloride
  • polyvinyl alcohol polyethylene vinyl alcohol
  • the organic EL element may have a configuration in which a gas barrier layer is provided on the transparent substrate described above, if necessary.
  • the material for forming the gas barrier layer may be any material as long as it has a function of suppressing intrusion of water or oxygen that causes deterioration of the organic EL element.
  • inorganic materials such as silicon oxide, silicon dioxide, and silicon nitride are used. Can be used.
  • anode constituting the organic EL element examples include metals such as Ag and Au, alloys containing them, CuI, indium-tin composite oxide (ITO), metal oxides such as SnO 2 and ZnO.
  • metals such as Ag and Au, alloys containing them, CuI, indium-tin composite oxide (ITO), metal oxides such as SnO 2 and ZnO.
  • silver or an alloy containing silver is preferable.
  • the anode is composed of an alloy containing silver
  • examples of the alloy include silver / magnesium (Ag / Mg), silver / copper (Ag / Cu), silver / palladium (Ag / Pd), silver, and the like.
  • -Palladium copper (Ag * Pd * Cu), silver * indium (Ag * In), etc. are mentioned.
  • the anode is preferably a transparent anode composed mainly of silver.
  • silver as a main component means that the silver content in the anode is 60% by mass or more, preferably 80% by mass or more, more preferably 90% by mass or more. Preferably it is 98 mass% or more.
  • transparent means that the light transmittance at a wavelength of 550 nm is 50% or more.
  • the sheet resistance value as the anode is preferably several hundred ⁇ / ⁇ or less, and the thickness is usually in the range of 5 nm to 1 ⁇ m, preferably in the range of 5 to 200 nm, although it depends on the material.
  • the thickness is preferably in the range of 2 to 20 nm, and more preferably in the range of 4 to 12 nm.
  • a thickness of 20 nm or less is preferable because an absorption component and a reflection component of light emitted by the anode are kept low and a high light transmittance is maintained.
  • the anode when the anode is composed mainly of silver, it is preferable to provide a base layer below the silver layer from the viewpoint of improving the uniformity of the silver layer.
  • a base layer it is preferable that it is a layer containing the organic compound which has a nitrogen atom or a sulfur atom, and the method of forming a silver layer on the said base layer is a preferable aspect.
  • the light emitting layer constituting the organic EL element preferably has a structure containing a phosphorescent light emitting compound as a light emitting material.
  • This light emitting layer is a layer that emits light by recombination of electrons injected from the electrode or the electron transport layer and holes injected from the hole transport layer, and the light emitting portion is in the layer of the light emitting layer. Alternatively, it may be the interface between the light emitting layer and the adjacent layer.
  • Such a light emitting layer is not particularly limited in its configuration as long as the light emitting material contained satisfies the light emission requirements. There may be a plurality of layers having the same emission spectrum and emission maximum wavelength. In this case, it is preferable to have a non-light emitting intermediate layer between the light emitting layers.
  • the total thickness of the light emitting layers is preferably in the range of 1 to 100 nm, and more preferably in the range of 1 to 30 nm because a lower driving voltage can be obtained.
  • the sum total of the thickness of a light emitting layer is the thickness also including the said intermediate
  • the light emitting layer as described above is prepared by using a known method such as a vacuum evaporation method, a spin coating method, a casting method, an LB method (Langmuir-Blodget, Langmuir Blodgett method) and an ink jet method. Can be formed.
  • a known method such as a vacuum evaporation method, a spin coating method, a casting method, an LB method (Langmuir-Blodget, Langmuir Blodgett method) and an ink jet method. Can be formed.
  • the light emitting layer may be a mixture of a plurality of light emitting materials, and a phosphorescent light emitting material and a fluorescent light emitting material (also referred to as a fluorescent dopant or a fluorescent compound) may be mixed and used in the same light emitting layer.
  • the structure of the light-emitting layer preferably includes a host compound (also referred to as a light-emitting host) and a light-emitting material (also referred to as a light-emitting dopant compound) and emits light from the light-emitting material.
  • Host compound As the host compound contained in the light emitting layer, a compound having a phosphorescence quantum yield of phosphorescence emission at room temperature (25 ° C) of less than 0.1 is preferable. Furthermore, it is preferable that the phosphorescence quantum yield is less than 0.01. Moreover, it is preferable that the volume ratio in the layer is 50% or more among the compounds contained in a light emitting layer.
  • a known host compound may be used alone, or a plurality of types of host compounds may be mixed and used.
  • a plurality of types of host compounds it is possible to adjust the movement of charges, and the organic EL element can be made highly efficient.
  • a plurality of kinds of light emitting materials described later it is possible to mix different light emission, thereby obtaining an arbitrary light emission color.
  • the host compound used in the light emitting layer may be a conventionally known low molecular compound or a high molecular compound having a repeating unit, and a low molecular compound having a polymerizable group such as a vinyl group or an epoxy group (evaporation polymerizable light emitting host). )
  • Examples of host compounds applicable to the present invention include, for example, JP-A Nos. 2001-257076, 2001-357777, 2002-8860, 2002-43056, 2002-105445, 2002-352957, 2002-231453, 2002-234888, 2002-260861, 2002-305083, US2005 / 0112407, US2009 No./0030202, International Publication No. 2001/039234, International Publication No. 2008/056746, International Publication No. 2005/089025, International Publication No. 2007/063754, International Publication No. 2005/030900, International Publication No. 2009. / 08 028, WO 2012/023947, can be mentioned JP 2007-254297, JP-European compounds described in Japanese Patent No. 2034538 Pat like.
  • Luminescent material As the luminescent material that can be used in the present invention, a phosphorescent compound (also referred to as a phosphorescent compound, a phosphorescent material, or a phosphorescent dopant) and a fluorescent compound (fluorescent compound) Or a fluorescent material).
  • a phosphorescent compound also referred to as a phosphorescent compound, a phosphorescent material, or a phosphorescent dopant
  • fluorescent compound fluorescent compound
  • Phosphorescent compound A phosphorescent compound is a compound in which light emission from an excited triplet is observed, specifically a compound that emits phosphorescence at room temperature (25 ° C.).
  • the phosphorescent quantum yield is defined as a compound having a phosphorescent quantum yield of 0.01 or more at 25 ° C., but the preferred phosphorescent quantum yield is 0.1 or more.
  • the phosphorescent quantum yield can be measured by the method described in Spectroscopic II, page 398 (1992 edition, Maruzen) of the Fourth Edition Experimental Chemistry Course 7.
  • the phosphorescence quantum yield in the solution can be measured using various solvents, but when using a phosphorescent compound in the present invention, the phosphorescence quantum yield is 0.01 or more in any solvent. Should be achieved.
  • the phosphorescent compound can be appropriately selected from known compounds used for the light-emitting layer of a general organic EL device, but preferably contains a group 8 to 10 metal in the periodic table of elements. More preferred are iridium compounds, osmium compounds, platinum compounds (platinum complex compounds) or rare earth complexes, and most preferred are iridium compounds.
  • At least one light emitting layer may contain two or more phosphorescent compounds, and the concentration ratio of the phosphorescent compound in the light emitting layer varies in the thickness direction of the light emitting layer. It may be an embodiment.
  • preferred phosphorescent compounds include organometallic complexes having Ir as a central metal. More preferably, a complex containing at least one coordination mode of a metal-carbon bond, a metal-nitrogen bond, a metal-oxygen bond, or a metal-sulfur bond is preferable.
  • the phosphorescent compound described above (also referred to as a phosphorescent metal complex) is described in, for example, Organic Letter, vol. 16, 2579-2581 (2001), Inorganic Chemistry, Vol. 30, No. 8, pp. 1685-1687 (1991), J. Am. Am. Chem. Soc. , 123, 4304 (2001), Inorganic Chemistry, Vol. 40, No. 7, pages 1704-1711 (2001), Inorganic Chemistry, Vol. 41, No. 12, pages 3055-3066 (2002) , New Journal of Chemistry. 26, 1171 (2002), European Journal of Organic Chemistry, Vol. 4, pages 695-709 (2004), and methods disclosed in the references and the like described in these documents Can be synthesized.
  • the fluorescent compound is, for example, a coumarin dye, a pyran dye, a cyanine dye, a croconium dye, a squalium dye, an oxobenzanthracene dye, a fluorescein dye, or a rhodamine dye.
  • a coumarin dye for example, a coumarin dye, a pyran dye, a cyanine dye, a croconium dye, a squalium dye, an oxobenzanthracene dye, a fluorescein dye, or a rhodamine dye.
  • Examples thereof include dyes, pyrylium dyes, perylene dyes, stilbene dyes, polythiophene dyes, and rare earth complex phosphors.
  • injection layer hole injection layer, electron injection layer
  • the injection layer is a layer provided between the electrode and the light-emitting layer in order to lower the driving voltage and improve the light emission brightness.
  • the organic EL element and its forefront of industrialization June 30, 1998, NTS
  • the details are described in Chapter 2 “Electrode Materials” (pages 123 to 166) of the second volume of “published by the company”.
  • a hole injection layer can exist between an anode and a light emitting layer or a hole transport layer
  • an electron injection layer can exist between a cathode and a light emitting layer or an electron transport layer.
  • the details of the hole injection layer are described in JP-A-9-45479, JP-A-9-260062, JP-A-8-288069, etc.
  • materials used for the hole injection layer include: , Porphyrin derivatives, phthalocyanine derivatives, oxazole derivatives, oxadiazole derivatives, triazole derivatives, imidazole derivatives, pyrazoline derivatives, pyrazolone derivatives, phenylenediamine derivatives, hydrazone derivatives, stilbene derivatives, polyarylalkane derivatives, triarylamine derivatives, carbazole derivatives, Indolocarbazole derivatives, isoindole derivatives, acene derivatives such as anthracene and naphthalene, fluorene derivatives, fluorenone derivatives, polyvinylcarbazole, aromatic amines introduced into the main chain or side chain Child material or oligomer, polysilane, a conductive polymer or oligomer
  • Examples of the triarylamine derivative include benzidine type represented by ⁇ -NPD (4,4′-bis [N- (1-naphthyl) -N-phenylamino] biphenyl), and MTDATA (4,4 ′, 4 ′′).
  • Examples include a starburst type represented by -tris [N- (3-methylphenyl) -N-phenylamino] triphenylamine), a compound having fluorene or anthracene in the triarylamine-linked core.
  • the layer thickness of the hole injection layer is not particularly limited and is usually in the range of about 0.1 to 100 nm, preferably in the range of 2 to 50 nm, and in the range of 2 to 30 nm. Is more preferable.
  • the electron injection layer is also described in JP-A-6-325871, JP-A-9-17574, JP-A-10-74586, and the like.
  • Specific examples of materials preferably used for the electron injection layer are as follows. Metals represented by strontium and aluminum, alkali metal compounds represented by lithium fluoride, sodium fluoride, potassium fluoride, etc., alkali metal halide layers represented by magnesium fluoride, calcium fluoride, etc. Examples thereof include an alkaline earth metal compound layer typified by magnesium, a metal oxide typified by molybdenum oxide and aluminum oxide, and a metal complex typified by lithium 8-hydroxyquinolate (Liq).
  • the electron injection layer is preferably a very thin film, and depending on the constituent material, the layer thickness is preferably in the range of 1 nm to 10 ⁇ m.
  • the hole transport layer is made of a hole transport material having a function of transporting holes.
  • the hole injection layer and the electron blocking layer also have the function of a hole transport layer.
  • the hole transport layer can be provided as a single layer or a plurality of layers.
  • the hole transport material has any one of hole injection or transport and electron barrier properties, and may be either organic or inorganic.
  • triazole derivatives oxadiazole derivatives, imidazole derivatives, polyarylalkane derivatives, pyrazoline derivatives, pyrazolone derivatives, phenylenediamine derivatives, arylamine derivatives, amino-substituted chalcone derivatives, oxazole derivatives, styrylanthracene derivatives, fluorenone derivatives, hydrazone derivatives
  • Examples include stilbene derivatives, silazane derivatives, aniline copolymers, conductive polymer oligomers, and thiophene oligomers.
  • hole transport material those described above can be used, but porphyrin compounds, aromatic tertiary amine compounds and styrylamine compounds can be used, and in particular, aromatic tertiary amine compounds can be used. preferable.
  • aromatic tertiary amine compounds and styrylamine compounds include N, N, N ′, N′-tetraphenyl-4,4′-diaminophenyl, N, N′-diphenyl-N, N′— Bis (3-methylphenyl)-[1,1′-biphenyl] -4,4′-diamine (abbreviation: TPD), 2,2-bis (4-di-p-tolylaminophenyl) propane, 1,1 -Bis (4-di-p-tolylaminophenyl) cyclohexane, N, N, N ', N'-tetra-p-tolyl-4,4'-diaminobiphenyl, 1,1-bis (4-di-p -Tolylaminophenyl) -4-phenylcyclohexane, bis (4-dimethylamino-2-methylphenyl) phenylmethane, bis (4-di-p
  • the hole transport material may be formed by a known method such as a vacuum deposition method, a spin coating method, a casting method, a printing method including an ink jet method, and an LB method (Langmuir Brodget, Langmuir Brodgett method). Thus, it can be formed by thinning.
  • the layer thickness of the hole transport layer is not particularly limited, but is usually about 5 nm to 5 ⁇ m, preferably 5 to 200 nm.
  • This hole transport layer may have a single layer structure composed of one or more of the above materials.
  • the p property can be increased by doping impurities into the material of the hole transport layer.
  • Examples thereof include JP-A-4-297076, JP-A-2000-196140, 2001-102175 and J.P. Appl. Phys. 95, 5773 (2004), and the like.
  • the electron transport layer is made of a material having a function of transporting electrons, and in a broad sense, an electron injection layer and a hole blocking layer are also included in the electron transport layer.
  • the electron transport layer can be provided as a single layer structure or a stacked structure of a plurality of layers.
  • an electron transport material (also serving as a hole blocking material) constituting a layer portion adjacent to the light emitting layer is used as an electron transporting material. What is necessary is just to have the function to transmit.
  • any one of conventionally known compounds can be selected and used. Examples include nitro-substituted fluorene derivatives, diphenylquinone derivatives, thiopyran dioxide derivatives, carbodiimides, fluorenylidenemethane derivatives, anthraquinodimethane, anthrone derivatives, and oxadiazole derivatives.
  • a thiadiazole derivative in which the oxygen atom of the oxadiazole ring is substituted with a sulfur atom, and a quinoxaline derivative having a quinoxaline ring known as an electron-withdrawing group can also be used as a material for the electron transport layer. It can. Furthermore, a polymer material in which these materials are introduced into a polymer chain or a polymer material having these materials as a polymer main chain can also be used.
  • metal complexes of 8-quinolinol derivatives such as tris (8-quinolinol) aluminum (abbreviation: Alq 3 ), tris (5,7-dichloro-8-quinolinol) aluminum, tris (5,7-dibromo-8- Quinolinol) aluminum, tris (2-methyl-8-quinolinol) aluminum, tris (5-methyl-8-quinolinol) aluminum, bis (8-quinolinol) zinc (abbreviation: Znq), etc. and the central metal of these metal complexes
  • a metal complex replaced with In, Mg, Cu, Ca, Sn, Ga, or Pb can also be used as a material for the electron transport layer.
  • the electron transport layer can be formed by thinning the above material by a known method such as a vacuum deposition method, a spin coating method, a casting method, a printing method including an inkjet method, and an LB method.
  • the thickness of the electron transport layer is not particularly limited, but is usually about 5 nm to 5 ⁇ m, preferably 5 to 200 nm.
  • the electron transport layer may have a single structure composed of one or more of the above materials.
  • blocking layer hole blocking layer, electron blocking layer
  • the blocking layer examples include a hole blocking layer and an electron blocking layer.
  • the blocking layer is a layer provided as necessary. For example, it is described in JP-A Nos. 11-204258 and 11-204359, and “Organic EL elements and the forefront of industrialization (published by NTT Corporation on November 30, 1998)” on page 237. Hole blocking (hole block) layer and the like.
  • the hole blocking layer has a function of an electron transport layer in a broad sense.
  • the hole blocking layer is made of a hole blocking material that has a function of transporting electrons but has a very small ability to transport holes, and recombines electrons and holes by blocking holes while transporting electrons. Probability can be improved.
  • the structure of an electron carrying layer can be used as a hole-blocking layer as needed.
  • the hole blocking layer is preferably provided adjacent to the light emitting layer.
  • the electron blocking layer has a function of a hole transport layer in a broad sense.
  • the electron blocking layer is made of a material that has the ability to transport holes and has a very small ability to transport electrons. By blocking holes while transporting holes, the probability of recombination of electrons and holes is improved. Can be made.
  • the structure of a positive hole transport layer can be used as an electron blocking layer as needed.
  • the layer thickness of the hole blocking layer and the electron blocking layer according to the present invention is preferably in the range of 3 to 100 nm, more preferably in the range of 5 to 30 nm.
  • the cathode is an electrode film that functions to supply holes to the organic functional layer group and the light emitting layer, and a metal, an alloy, an organic or inorganic conductive compound, or a mixture thereof is used. Specifically, gold, aluminum, silver, magnesium, lithium, magnesium / copper mixture, magnesium / silver mixture, magnesium / aluminum mixture, magnesium / indium mixture, indium, lithium / aluminum mixture, rare earth metal, ITO, ZnO, TiO Oxide semiconductors such as 2 and SnO 2 .
  • the cathode can be produced by forming a thin film of these conductive materials by a method such as vapor deposition or sputtering.
  • the sheet resistance as the cathode is preferably several hundred ⁇ / ⁇ or less, and the thickness is usually in the range of 5 nm to 5 ⁇ m, preferably in the range of 5 to 200 nm, although it depends on the material.
  • the organic EL device may have a structure in which two or more organic functional layer units each composed of an organic functional layer group and a light emitting layer are laminated between an anode and a cathode. Between the layer units, an intermediate electrode layer having independent connection terminals for obtaining electrical connection is provided.
  • An anode, a first organic functional layer group, a light emitting layer, a second organic functional layer group, and a cathode are laminated on a transparent substrate to form a laminate.
  • a transparent substrate is prepared, and a thin film made of a desired electrode material, for example, an anode material is deposited on the transparent substrate so as to have a thickness of 1 ⁇ m or less, preferably in the range of 10 to 200 nm.
  • the anode is formed by a method such as sputtering.
  • a connection electrode portion connected to an external power source is formed at the anode end portion.
  • a hole injection layer and a hole transport layer constituting the first organic functional layer group, a light emitting layer, an electron transport layer constituting the second organic functional layer group, and the like are sequentially laminated thereon.
  • a spin coating method for example, a casting method, an ink jet method, a vapor deposition method, a printing method, or the like is used, but a uniform layer is easily obtained and pinholes are not easily generated. From the point of view, a vacuum deposition method or a spin coating method is particularly preferable. Further, different formation methods may be applied for each layer.
  • the vapor deposition conditions vary depending on the type of compound used, but generally a boat heating temperature of 50 to 450 ° C. and a degree of vacuum of 1 ⁇ 10 ⁇ 6 to 1 ⁇ 10 ⁇ 2 Pa. It is desirable to appropriately select the respective conditions within the range of a deposition rate of 0.01 to 50 nm / second, a substrate temperature of ⁇ 50 to 300 ° C., and a layer thickness of 0.1 to 5 ⁇ m.
  • the cathode is formed by an appropriate forming method such as a vapor deposition method or a sputtering method. At this time, the cathode is patterned in a shape in which terminal portions are drawn from the upper side of the second organic functional layer group to the periphery of the transparent substrate while maintaining an insulating state with respect to the anode by the organic functional layer group.
  • an organic EL element can be manufactured.
  • the transparent substrate, the anode, the first organic functional layer group, the light emitting layer, the second organic functional layer group, and the cathode are sealed with the sealing pattern of the electrical connection member of the present invention. That is, the electrical connection member of the present invention covering at least the organic functional layer is provided on the transparent substrate with the anode and cathode terminal portions exposed.
  • the present invention provides an electrical connection member capable of suppressing the thickness of the entire organic electroluminescence module when laminated on the organic electroluminescence panel, the organic electroluminescence module including the electrical connection member, and the organic electroluminescence module It is suitable for providing a method for manufacturing a luminescence module.
  • Organic functional layer 5 Connection electrode portion 10 Organic EL panel 10A Light emitting surface 20, 30 Electrical connection member 21, 31 Flexible substrate (substrate) 21a, 31a Surface 22, 32 Sealing pattern 23, 33 Wiring pattern 24, 34 Adhesive layer 100, 100A Organic EL module

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Abstract

La présente invention aborde le problème consistant à fournir un élément de connexion électrique au moyen duquel l'épaisseur globale d'un module électroluminescent organique peut être réglée lorsque l'élément de connexion électrique est stratifié sur un panneau électroluminescent organique. Un élément de connexion électrique (20) est stratifié et fixé sur un panneau électroluminescent organique (10) de sorte à chevaucher une région associée au niveau de laquelle est formée une couche fonctionnelle (2) organique, l'élément de connexion électrique étant caractérisé en ce qu'il comprend : un substrat souple (21); un motif d'étanchéité (22) qui est formé sur une surface (21a), qui consiste en la surface parmi les deux surfaces d'un substrat souple (21) qui fait face au panneau électroluminescent organique (10), afin de sceller la couche fonctionnelle (2) organique; et un motif de câblage (23) qui est formé au moins sur la surface (21a), qui consiste en la surface parmi les deux surfaces du substrat souple (21) qui fait face au panneau électroluminescent organique (10), de sorte à attaquer le panneau électroluminescent organique (10).
PCT/JP2015/075020 2014-12-16 2015-09-03 Élément de connexion électrique, module électroluminescent organique, et procédé de production de module électroluminescent organique WO2016098397A1 (fr)

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