WO2015173947A1 - Optimization device - Google Patents

Abstract

In the present invention, given that "maximum separation distance" (31 mm) is defined as being the distance between a circuit board (34) and the bottom end of a pick-up nozzle (70) raised to the maximum height and "all subject components" is defined as all the electronic components that are scheduled to be mounted by the mounting head, an assessment is made as to whether the height dimension of a mounting scheduled component that is scheduled to be mounted is less than a first assessment value 11 mm (= 31 - 20) which is calculated by subtracting the height dimension (20 mm) of the electronic component having the largest height dimension among all subject components from the maximum separation distance. Then, if the height dimension of the mounting scheduled component is not smaller than the first assessment value, a moving path for the mounting head and/or a mounting order for the mounting scheduled component is determined. That is, if there is a risk of an electronic component mounted on the circuit board coming into contact with an electronic component held by the mounting head, the work procedure is set in such a manner that the electronic component mounted on the circuit board and the electronic component held by the mounting head do not come into contact.

Description

Optimization device

The present invention relates to an optimization device for optimizing a mounting operation by an electronic component mounting machine that performs a mounting operation of an electronic component on a circuit board.

Since a plurality of electronic components are mounted on the circuit board, a work procedure at the time of mounting operation is set for each of the plurality of electronic components. At this time, the work procedure is set so that the tact time is as short as possible. The following patent document describes an example for setting a work procedure at the time of mounting work for each of a plurality of electronic components.

Japanese Patent Laid-Open No. 11-330790

It is possible to shorten the tact time by setting the work procedure by the technique described in the above patent document. However, since a plurality of electronic components are sequentially mounted on the circuit board during mounting work, there is a possibility that the electronic component mounted on the circuit board and the circuit board held on the mounting head may come into contact with each other. It is necessary to set a work procedure for each of the plurality of electronic components so that they do not contact each other. The present invention has been made in view of such circumstances, and sets the work procedure so that the electronic component mounted on the circuit board and the electronic component held by the mounting head do not contact at the time of mounting work. The task is to do.

In order to solve the above problem, an optimization device according to claim 1 of the present application includes at least one mounting head having a suction nozzle that moves up and down in the vertical direction, and the mounting head in a first direction and a first direction thereof. A moving device that moves in a second direction intersecting at right angles to the direction; a supply device that supplies an electronic component; and a substrate holding device that holds a circuit board. The electronic component supplied from the supply device is An optimization device for optimizing a mounting operation by an electronic component mounting machine that performs a mounting operation for mounting on a circuit board held by a holding device, wherein the optimization device is held by the substrate holding device From the maximum separation distance that is the distance between the upper surface of the circuit board and the lower end of the suction nozzle in the most elevated state when the electronic component supplied from the supply device is transported to the mounting position on the circuit board A value obtained by subtracting the height dimension of the electronic component having the largest height among all the target components that are all electronic components to be mounted on the circuit board by one mounting head of the at least one mounting head. A first determination unit that determines whether a height dimension of a component to be mounted, which is an electronic component scheduled to be mounted on the circuit board by the one mounting head, is smaller than a first determination value determined based on When the height dimension of the component to be mounted is not smaller than the first determination value, the moving path of the first mounting head by the moving device when the component to be mounted is mounted on the circuit board, and the mounting And a determining unit that determines at least one of the order in which the scheduled parts are to be mounted.

Further, in the optimization device according to claim 2, in the optimization device according to claim 1, when the optimization device has a height dimension of the part to be mounted that is not smaller than the first determination value, In a state where all of the target parts except the part to be mounted are mounted on the circuit board, the part to be mounted is placed in the first direction on the part to be mounted on the part to be mounted and the suction nozzle is placed on the part to be mounted. A second determination unit configured to determine whether or not the component to be mounted comes into contact with all of the target components excluding the component to be mounted when the one mounting head held by suction is moved. And when the determination unit determines that the component to be mounted out of all the target components except the component to be mounted does not come into contact with the component to be mounted, Above the circuit board The movement path of the first mounting head by the moving device is determined so as to be moved in the first direction to the planned mounting position above the circuit board after being moved in the second direction at the position. It is characterized by that.

The optimization device according to claim 3 is the optimization device according to claim 1 or 2, wherein the optimization device is configured such that a height dimension of the part to be mounted is smaller than the first determination value. In the case where none of the target components to be mounted is mounted on the circuit board, all the target components are mounted on the circuit board in the first direction on the planned mounting position of the components to be mounted in the first direction. When the one mounting head that is held by suction by the suction nozzle is moved, it is determined whether or not the part to be mounted and the part to be mounted are in contact with all the target parts except for the part to be mounted. A circuit board provided with a second determination unit, and when the determination unit determines that the component to be mounted is in contact with the component to be mounted out of all the target components by the second determination unit. To the mounting of 1 above The mounting order of the components to be mounted is determined so that the electronic components are mounted on the circuit board in order from the position farthest from the supply device in the mounting area of all the target components by the .

Further, in the optimization device according to claim 4, in the optimization device according to claim 3, the determination unit excludes the parts to be mounted among the all target components by the second determination unit. Is determined to be in contact with the component to be mounted, the mounting order of the component to be mounted is determined, and the first mounting head is moved in the second direction at a place other than above the circuit board. After that, the moving path of the one mounting head by the moving device is determined so as to move in the first direction to the mounting position above the circuit board.

Further, in the optimization device according to claim 5, in the optimization device according to any one of claims 2 to 4, the second determination unit is configured to schedule the mounting of all the target components. Among electronic components scheduled to be mounted in the first direction of position, a height equal to or greater than a second determination value determined based on a value obtained by subtracting the height dimension of the component to be mounted from the maximum separation distance It is determined whether or not there is an electronic component having a size, and when it exists, it is determined that the component to be mounted comes into contact with the component to be mounted out of all the target components. .

Further, in the optimization device according to claim 6, in the optimization device according to any one of claims 2 to 5, the optimization device causes the second determination unit to determine all the target components. When it is determined that the part to be mounted and the part to be mounted are in contact with each other, the first mounting head in which the part to be mounted is sucked and held by the suction nozzle is disposed above the circuit board. The determination unit includes a third determination unit configured to determine whether or not contact between the target component to be installed and the target component to be installed out of all the target components can be avoided by moving in the direction of 2. When it is determined by the third determination unit that the contact between the part to be mounted and the part to be mounted out of all the target parts can be avoided, the one mounting head is connected to the circuit. substrate After moving in the second direction at a place other than the upper part, the moving device causes the first direction and the second direction to move in the first direction and the second direction to the planned mounting position above the circuit board. The moving path of the mounting head is determined.

According to the optimization device of claim 1, the distance between the upper surface of the circuit board and the lower end of the suction nozzle in the most elevated state when the electronic component is transported is defined as the maximum separation distance, and the circuit is mounted by the mounting head. Based on the value obtained by subtracting the height of the electronic component with the largest height among all the target components from the maximum separation distance when all electronic components to be mounted on the board are defined as all target components. From the first determination value determined in this manner, it is determined whether or not the height dimension of the component to be mounted to be mounted on the circuit board by the mounting head is small. When the height dimension of the component to be mounted is not smaller than the first determination value, at least one of the movement path of the mounting head when the component to be mounted is mounted on the circuit board and the mounting order of the component to be mounted is It is determined. That is, when there is a possibility that the electronic component mounted on the circuit board and the electronic component held by the mounting head are in contact with each other, at least one of the movement path of the mounting head and the mounting order is determined. Accordingly, it is possible to set the work procedure so that the electronic component mounted on the circuit board and the electronic component held on the mounting head do not come into contact with each other.

In addition, when the height dimension of the part to be mounted is not smaller than the first judgment value, the part to be mounted is placed in the first direction on the planned mounting position of the part to be mounted. It is determined whether or not the electronic components are in contact with each other when the held mounting head is moved. Then, when it is determined that the electronic components do not contact each other, the mounting head is moved in the second direction at a place other than the upper side of the circuit board, and then in the first direction to the mounting planned position above the circuit board. The movement path of the mounting head is determined so as to move the head. By determining the movement path of the mounting head in this way, it is possible to avoid contact between the electronic component mounted on the circuit board and the electronic component held by the mounting head in a short movement path.

In addition, when the height dimension of the part to be mounted is not smaller than the first determination value, the part to be mounted is placed in the first direction on the planned mounting position of the part to be mounted. It is determined whether or not the electronic components are in contact with each other when the held mounting head is moved. When it is determined that the electronic components are in contact with each other, the mounting is planned so that the electronic components are mounted on the circuit board in order from the position farthest from the supply device in the mounting area by the mounting head on the circuit board. The order of component installation is determined. Thereby, it becomes possible to mount the electronic components in order from the back of the circuit board, and it is possible to avoid contact between the electronic components mounted on the circuit board and the electronic components held by the mounting head. .

In addition, when it is determined by the optimization device according to claim 4 that the electronic components are in contact with each other, the mounting order of the components to be mounted is determined, and the mounting head is set to the second position except for the position above the circuit board. After moving in this direction, the movement path of the mounting head is determined so as to move in the first direction to the planned mounting position above the circuit board. This ensures that the electronic components mounted on the circuit board and the electronic components held on the mounting head are in contact with each other by mounting the electronic components in order from the back of the circuit board and limiting the movement path. It can be avoided.

Further, when the value determined based on the value obtained by subtracting the height dimension of the part to be mounted from the maximum separation distance is defined as the second judgment value by the optimization device according to claim 5, It is determined whether or not an electronic component having a height dimension equal to or larger than the second determination value is present among the electronic components scheduled to be mounted in the first direction of the planned mounting position. Then, when an electronic component having a height dimension equal to or greater than the second determination value exists, it is determined that the electronic component mounted on the circuit board and the planned mounting component are in contact with each other during the mounting operation of the planned mounting component. Thereby, it is possible to appropriately determine whether or not the electronic component mounted on the circuit board and the component to be mounted are in contact with each other.

Further, when it is determined by the optimization device according to claim 6 that the electronic components are in contact with each other, the mounting head holding the mounting scheduled components is moved in the second direction above the circuit board, thereby It is determined whether or not contact between components can be avoided. Then, when it is determined that contact between the electronic components can be avoided, the mounting head is moved in the second direction at a place other than the upper side of the circuit board, and then the first to the mounting expected position above the circuit board. The movement path of the mounting head is determined so as to move in the second direction and the second direction. Accordingly, it is possible to avoid contact between the electronic component mounted on the circuit board and the electronic component held by the mounting head without limiting the mounting order.

It is a figure which shows an electronic component mounting machine It is a block diagram which shows the control apparatus with which an electronic component mounting machine is provided. It is a figure which shows the electronic component with which the circuit board was mounted | worn, and the electronic component hold | maintained at the suction nozzle. It is a figure which shows the circuit board of the state in which the some electronic component was mounted | worn. It is a figure which shows the circuit board of the state with which the several electronic component different from FIG. 4 was mounted | worn. It is a figure which shows the circuit board of the state with which the several electronic component different from FIG. 4 and FIG. 5 was mounted | worn. It is a flowchart which shows an optimization program. It is a figure which shows the work system of the modification 1. It is a figure which shows the electronic component mounting machine with which the work system of FIG. 8 is provided. In the work system of the modification 1, it is a figure which shows the electronic component with which the circuit board was mounted | worn, and the electronic component hold | maintained at the suction nozzle. It is a figure which shows the electronic component mounting machine of the modification 2.

Hereinafter, examples and modifications of the present invention will be described in detail with reference to the drawings as modes for carrying out the present invention.

<Configuration of electronic component mounting machine>
FIG. 1 shows an electronic component mounting machine 10 according to an embodiment of the present invention. The electronic component mounting machine 10 is a device for performing an electronic component mounting operation on a circuit board. The electronic component mounting machine 10 includes a transport device 20, a mounting head moving device (hereinafter sometimes abbreviated as “moving device”) 22, a mounting head 24, and a supply device 26.

The conveying device 20 includes a pair of conveyor belts 30 extending in the X-axis direction and an electromagnetic motor (see FIG. 2) 32 that rotates the conveyor belt 30. The circuit board 34 is supported by the pair of conveyor belts 30 and is conveyed in the X-axis direction by driving the electromagnetic motor 32. Further, the transfer device 20 includes a substrate holding device (see FIG. 2) 36. The substrate holding device 36 fixedly holds the circuit board 34 supported by the conveyor belt 30 at a predetermined position (a position where the circuit board 34 in FIG. 1 is illustrated).

The moving device 22 includes an X-axis direction slide mechanism 50 and a Y-axis direction slide mechanism 52. The X-axis direction slide mechanism 50 has an X-axis slider 56 provided on the base 54 so as to be movable in the X-axis direction. The X-axis slider 56 is moved to an arbitrary position in the X-axis direction by driving an electromagnetic motor (see FIG. 2) 58. The Y-axis direction slide mechanism 52 has a Y-axis slider 60 provided on the side surface of the X-axis slider 56 so as to be movable in the Y-axis direction perpendicular to the X-axis direction. The Y-axis slider 60 is moved to an arbitrary position in the Y-axis direction by driving an electromagnetic motor (see FIG. 2) 62. The mounting head 24 is attached to the Y-axis slider 60. With such a structure, the mounting head 24 is moved to an arbitrary position on the base 54 by the moving device 22.

The mounting head 24 mounts electronic components on the circuit board. The mounting head 24 has a suction nozzle 70 provided on the lower end surface. The suction nozzle 70 communicates with a positive / negative pressure supply device (see FIG. 2) 76 through negative pressure air and positive pressure air passages. The suction nozzle 70 sucks and holds the electronic component with a negative pressure, and releases the held electronic component with a positive pressure. Further, the mounting head 24 has a nozzle lifting device (see FIG. 2) 78 that lifts and lowers the suction nozzle 70. The mounting head 24 changes the vertical position of the electronic component to be held by the lifting device 78. The suction nozzle 70 can be attached to and detached from the mounting head 24.

The supply device 26 is a feeder-type supply device, and has a plurality of tape feeders 80. The tape feeder 80 accommodates the taped component in a wound state. The taped component is a taped electronic component. Then, the tape feeder 80 feeds out the taped parts by a feeding device (see FIG. 2) 86. Thereby, the feeder type supply device 26 supplies the electronic component at the supply position by feeding the taped component. The tape feeder 80 can be attached to and detached from the base 54, and can cope with replacement of electronic parts, shortage of electronic parts, and the like.

Also, the electronic component mounting machine 10 includes a control device 100 as shown in FIG. The control device 100 includes a controller 102 and a plurality of drive circuits 104. The plurality of drive circuits 104 are connected to the electromagnetic motors 32, 58, 62, the substrate holding device 36, the positive / negative pressure supply device 76, the lifting / lowering device 78, and the feeding device 86. The controller 102 includes a CPU, a ROM, a RAM, and the like, mainly a computer, and is connected to a plurality of drive circuits 104. Thereby, the operations of the transport device 20 and the moving device 22 are controlled by the controller 102.

<Mounting work with electronic component mounting machine>
In the electronic component mounting machine 10, the mounting operation can be performed by the mounting head 24 on the circuit board 34 held by the transport device 20 with the above-described configuration. Specifically, the circuit board 34 is transported to the work position according to a command from the controller 102, and the circuit board 34 is fixedly held by the board holding device 36 at the position. Further, the tape feeder 80 sends out a taped component and supplies an electronic component at a supply position in accordance with a command from the controller 102. Then, the mounting head 24 moves above the supply position of the electronic component according to a command from the controller 102 and sucks and holds the electronic component by the suction nozzle 70. Subsequently, the mounting head 24 moves above the circuit board 34 in accordance with a command from the controller 102 and mounts the held electronic component on the circuit board.

<Optimization of installation work procedure>
In the electronic component mounting machine 10, the mounting operation is executed according to the above-described procedure. Since a plurality of electronic components are mounted on the circuit board, the electronic component previously mounted on the circuit board and the mounting operation are performed. There is a possibility that the electronic component sucked and held by the suction nozzle 70 may interfere.

Specifically, when the suction nozzle 70 mounted on the mounting head 24 rises most when the electronic component is transported from the supply position to the mounting position, the lower end of the suction nozzle 70 as shown in FIG. And the upper surface of the circuit board 34 held by the board holding device 36 (hereinafter, sometimes referred to as “maximum separation distance”) is 31 mm. For this reason, at the time of mounting work by the suction nozzle 70, mounting work of an electronic component having a height dimension of 15 mm or less to the circuit board 34 is recommended. For example, as shown in the drawing, when an electronic component 110 having a height of 15 mm is mounted on a circuit board 34, the suction nozzle 70 holding the electronic component 110 having a height of 15 mm is connected to the circuit. This is because a 1 mm clearance is ensured even when moved on the substrate, so that the electronic component 110 mounted on the circuit board 34 does not contact the electronic component 110 held by the suction nozzle 70.

However, there is a case where the mounting work of the electronic component 110 having a height dimension exceeding 15 mm to the circuit board 34 has to be executed. In such a case, if the sum of the height dimension of the electronic component 110 mounted on the circuit board 34 and the height dimension of the electronic component 110 held by the suction nozzle 70 can be smaller than the maximum separation distance. The electronic component 110 mounted on the circuit board 34 comes into contact with the electronic component 110 held by the suction nozzle 70. Actually, a certain amount of clearance is also required between the electronic component 110 mounted on the circuit board 34 and the electronic component 110 held by the suction nozzle 70. Therefore, for example, when a clearance of 1 mm is provided, as shown in the figure, when an electronic component 110 having a height of 17 mm is mounted on the circuit board 34, an electronic having a height of 13 mm or less is mounted. If the suction nozzle 70 holds the component 110, it is possible to avoid contact between the electronic components. For example, as shown in the drawing, when the electronic component 110 having a height dimension of 19 mm is mounted on the circuit board 34, the suction nozzle 70 holding the electronic component 110 having a height dimension of 11 mm or less may be used. Thus, contact between electronic components can be avoided. Further, for example, as shown in the figure, when the electronic component 110 having a height dimension of 20 mm is mounted on the circuit board 34, the suction nozzle 70 holding the electronic component 110 having a height dimension of 10 mm or less. If so, contact between electronic components can be avoided.

In view of such a situation, in the electronic component mounting machine 10, each of all electronic components (hereinafter sometimes referred to as “all target components”) mounted on one circuit board 34 by the suction nozzle 70. On the basis of the relationship between the height dimension and the maximum separation distance, a mounting work procedure for all target components (hereinafter, may be abbreviated as “work procedure”) is set. Specifically, an electronic component having the largest height dimension (hereinafter, referred to as “maximum height component” in some cases) is extracted from all target components, and the maximum height component height is extracted from the maximum separation distance. The value obtained by subtracting the size is set as the first judgment value. Then, an electronic component whose height dimension is less than the first determination value is extracted from all the target components, and the extracted electronic component is classified into the first type.

For example, when the production of the circuit board 34 shown in FIG. 4 is scheduled, all target parts to be mounted on the circuit board 34 are 18 electronic parts 110a to 110r, and the maximum height parts are The electronic components 110a, 110b, and 110c have a height dimension of 20 mm. Therefore, the first judgment value is 11 mm (maximum separation distance (31 mm) −maximum height of component height (20 mm)), and the electronic component 110 having a height dimension of less than 11 mm is the first type electronic component. Extracted as part 110. That is, nine electronic components 110j, 110k, 110l, 110m, 110n, 110o, 110p, 110q, and 110r are classified into the first type.

The total value (less than 31 mm) of the height dimension (less than 11 mm) of the electronic component 110 classified as the first type and the height dimension (less than 20 mm) of the maximum height component is based on the maximum separation distance (31 mm). small. Therefore, even if the mounting head 24 holding the electronic component 110 classified as the first type is moved to an arbitrary position above the circuit board 34 on which the maximum height component is mounted, the electronic components do not contact each other. . That is, when mounting the electronic component classified as the first type, it is not necessary to consider the mounting order of the electronic components and the movement path of the mounting head 24 holding the electronic components. For this reason, the order of mounting the electronic components classified as the first type and the work procedure including the movement path are set so that the tact time of the mounting work on the circuit board 34 is minimized. The moving path of the mounting head 24 is a path through which the mounting head 24 is moved by the moving device 22 from the position where the electronic component is supplied by the tape feeder 80 to the planned mounting position of the electronic component. In the Y-axis direction, they are disposed on the near side of the circuit board 34 (below the circuit board 34 in FIG. 4). That is, the electronic component mounted on the circuit board 34 is carried from the lower side to the upper side of the drawing while being held by the mounting head 24.

As described above, the first determination value may be set, and a value derived as a result of further processing based on a value obtained by subtracting the height dimension of the maximum height component from the maximum separation distance. May be set as the first determination value. For example, a value obtained by further subtracting a predetermined clearance value from a value obtained by subtracting the height dimension of the maximum height component from the maximum separation distance may be set as the first determination value. In the above description, the circuit board 34 in which no electronic component is mounted has been described as being carried into the electronic component mounting machine 10, but another electronic component mounting machine is located upstream of the electronic component mounting machine 10. Is placed, and the circuit board 34 in which several electronic components are already mounted is carried into the electronic component mounting machine 10, the extraction of the “maximum height component” in the electronic component mounting machine 10 is You may extract from all the electronic components with which the suction nozzle 70 was mounted | worn with one circuit board 34, and the electronic component already mounted | worn with the circuit board 34 by the upstream electronic component mounting machine.

On the other hand, the total value (31 mm or more) of the height dimension (11 mm or more) of the electronic component 110 not classified as the first type and the height dimension (20 mm or more) of the maximum height component is the maximum separation distance (31 mm). ) That's it. Therefore, when the mounting head 24 holding the electronic component 110 that is not classified as the first type is moved to an arbitrary position above the circuit board 34 on which the maximum height component is mounted, the electronic components are There is a risk of contact. When the mounting head 24 holding the electronic component 110 having a height dimension of 11 mm is moved to an arbitrary position above the circuit board 34 on which the maximum height component is mounted, the height dimension is 11 mm. Since there is no clearance between the lower surface of the electronic component 110 and the upper surface of the maximum height component, they may come into sliding contact.

For this reason, by considering the movement path of the mounting head 24 when mounting the electronic component 110 that is not classified into the first type, that is, the electronic component 110 whose height dimension is equal to or greater than the first determination value (11 mm), It is determined whether or not contact between the electronic component held by the mounting head 24 and the electronic component mounted on the circuit board 34 can be avoided. And the electronic component judged to be able to avoid contact between electronic components is classified into the 2nd type. However, for example, when the mounting head 24 is moved in both the X-axis direction and the Y-axis direction at positions other than the upper side of the circuit board 34 to bypass the upper side of the circuit board 34, the mounting head 24 There is a possibility that the movement route becomes long and the tact time becomes long. For this reason, the mounting head 24 is moved to either one of the X-axis direction and the Y-axis direction at a place other than the upper side of the circuit board 34, and then the mounting head 24 is placed at the planned mounting position above the circuit board 34. It is determined whether or not contact between the electronic components can be avoided by moving to the other of the X-axis direction and the Y-axis direction.

For example, in the circuit board 34 shown in FIG. 4, the mounting head 24 is moved in the X-axis direction at locations other than the upper side of the circuit board 34, and then the mounting head 24 is moved to the mounting target position above the circuit board 34. It is determined whether or not contact between electronic components can be avoided by moving in the Y-axis direction. And the electronic component judged to be able to avoid contact between electronic components is classified into the 2nd type. In other words, other than the electronic parts to be subjected to the mounting work (any one of the electronic parts not classified as the first type) (hereinafter, may be referred to as “work target parts”) When all the electronic components are mounted on the circuit board 34, the mounting head 24 holding the work target component is moved in the Y-axis direction above the planned mounting position of the work target component. Work target parts that do not contact the mounted electronic parts are classified as the second type.

Specifically, a value obtained by subtracting the height dimension of the work target component from the maximum separation distance is set as the second determination value, and the height dimension is set to the second determination value in the Y-axis direction of the planned mounting position of the work target component. It is determined whether or not the mounting of the electronic components is scheduled. For example, as shown in FIG. 4, since the height dimension of the electronic components 110d, 110e, and 110f among the electronic components not classified into the first type is 11 mm, any one of the electronic components 110d, 110e, and 110f is used. The second determination value when the component is the work target component is 20 mm (maximum separation distance (31 mm) -11 mm). When it is determined whether or not an electronic component having a height dimension of 20 mm or more is planned to be mounted in the Y-axis direction of the planned mounting positions of the electronic components 110d, 110e, and 110f, the electronic components 110d, 110e, and 110f are mounted. There is no plan to mount an electronic component having a height dimension of 20 mm or more in the Y-axis direction of the planned position. That is, in a state where all other electronic components except the electronic components 110d, 110e, and 110f are mounted on the circuit board 34, the electronic component 110d is positioned above the planned mounting position of the electronic components 110d, 110e, and 110f in the Y-axis direction. , 110e, 110f, even if the mounting head 24 is moved, the electronic components do not contact each other. For this reason, the electronic components 110d, 110e, and 110f are classified into the second type.

As described above, the second determination value may be set, and a value obtained as a result of further processing based on a value obtained by subtracting the height dimension of the work target component from the maximum separation distance is obtained as a result. You may set as a 2nd judgment value. For example, a value obtained by further subtracting a predetermined clearance value from a value obtained by subtracting the height dimension of the work target component from the maximum separation distance may be set as the second determination value.

When the electronic component 110 classified as the second type is mounted, the contact between the electronic components can be avoided by moving the mounting head 24 to the planned mounting position along the movement path described above. For this reason, when the work procedure of the electronic component classified as the second type is set, the mounting head 24 moves in the X-axis direction at a place where the moving path of the mounting head 24 is not above the circuit board 34. After that, the path is set above the circuit board 34 to move the mounting head 24 in the Y-axis direction to the mounting position. Note that when mounting electronic components classified as the second type, it is not necessary to consider the mounting order of the electronic components. Therefore, the mounting order of the electronic components classified as the second type is the tact of mounting work on the circuit board. The time is set to be the shortest.

As shown in FIG. 4, since the height dimension of the electronic components 110a, 110b, and 110c is 20 mm, the second judgment value when any of the electronic components 110a, 110b, and 110c is a work target component is 11 mm (maximum separation distance (31 mm) −20 mm). When it is determined whether or not an electronic component having a height dimension of 11 mm or more is planned to be mounted in the Y-axis direction of the planned mounting positions of the electronic components 110a, 110b, and 110c, the electronic components 110a, 110b, and 110c are mounted. The electronic components 110g, 110h, and 110i having a height dimension of 13 mm are scheduled to be mounted in the Y-axis direction of the planned position. That is, contact between the electronic components cannot be avoided even if the movement path of the mounting head 24 is taken into account when the electronic components 110a, 110b, and 110c are mounted. For this reason, the electronic components 110a, 110b, and 110c are not classified into the second type.

Moreover, since the height dimension of the electronic components 110g, 110h, and 110i is 13 mm, the second judgment value when any of the electronic components 110g, 110h, and 110i is a work target component is 18 mm (maximum separation distance ( 31 mm) -13 mm). When it is determined whether or not an electronic component having a height dimension of 18 mm or more is planned to be mounted in the Y-axis direction of the planned mounting positions of the electronic components 110g, 110h, and 110i, the electronic components 110g, 110h, and 110i are mounted. The electronic components 110a, 110b, and 110c having a height dimension of 20 mm are scheduled to be mounted in the Y-axis direction of the planned position. That is, contact between the electronic components cannot be avoided even if the movement path of the mounting head 24 is taken into account when the electronic components 110g, 110h, and 110i are mounted. For this reason, the electronic components 110g, 110h, and 110i are not classified into the second type.

When mounting the electronic component 110 that is not classified into the first type or the second type, as described above, even if the moving path of the mounting head 24 is taken into consideration, the electronic component 110 is classified into the first type and the second type. There is a risk of contact between the electronic components 110 that have not been performed. Specifically, when the electronic component 110 that is not classified as the first type or the second type is the third type, the electronic components 110a, 110b, 110c, 110g, 110h, and 110i are the third type. For example, when the electronic component 110c is mounted, the third type electronic components 110a, 110b, 110g, 110h, 110i, etc. other than the electronic component 110c are already mounted on the circuit board 34. The electronic component 110c held by the mounting head 24 and the electronic components 110a, 110b, 110g, 110h, 110i mounted on the circuit board 34 come into contact with each other. That is, another mounting type 24 on the moving path when the mounting head 24 holding the electronic component of the third type moves from the supply position of the electronic component by the tape feeder 80 to the planned mounting position on the circuit board 34. When the electronic component 110 is mounted, the electronic component 110 held by the mounting head 24 and the electronic component 110 mounted on the circuit board 34 come into contact with each other.

For this reason, the third type electronic component 110 is located farthest from the electronic component supply position by the tape feeder 80 on the circuit board 34, that is, in the circuit board 34 shown in FIG. The third type electronic components can be prevented from contacting each other by being mounted in order from the electronic component supply position. In view of the above, when the work procedure of the third type electronic component is set, the mounting order of the third type is set in the order of the electronic components 110c, 110i, 110b, 110h, 110a, 110g. The

When the second type electronic component is mounted on the circuit board 34 during the mounting operation of the third type electronic component, the third type electronic component held by the mounting head 24 and the circuit board 34 are mounted. There is a risk of contact with the second type electronic component mounted on the. Specifically, for example, when the second type electronic components 110d, 110e and the like are mounted on the circuit board 34, the mounting head 24 holding the third type electronic component 110c is arbitrarily connected to the circuit board 34. When moved to the position, the electronic component 110c held by the mounting head 24 may come into contact with the electronic components 110d and 110e mounted on the circuit board 34. However, even if the electronic components 110d and 110e are mounted on the circuit board 34, the mounting head 24 holding the electronic component 110c is placed on the circuit board 34 above the planned mounting position of the electronic component 110c in the Y-axis direction. When only moving, it is possible to avoid contact between electronic components.

For this reason, when the work procedure of the third type electronic component in which the mounting operation is performed after the second type electronic component is mounted on the circuit board 34, not only the mounting order but also the mounting head The movement path on the 24 circuit boards 34 is set to a path that moves only in the Y-axis direction above the planned mounting position. In addition, when the work procedure of the third type electronic component to be mounted is set before the second type electronic component is mounted on the circuit board 34, the mounting order is set according to the above-described order. The movement path of the mounting head 24 is set so that the tact time of the mounting operation on the circuit board 34 is the shortest.

FIG. 5 shows a circuit board 34 different from the circuit board 34 shown in FIG. All the target components to be mounted on the circuit board 34 in FIG. 5 are the same as all target components to be mounted on the circuit board 34 in FIG. 4 except for the electronic components 110b1, 110e1, and 110k1. The electronic component 110b1 is longer in the X-axis direction than the electronic component 110b in FIG. 4, and the electronic components 110e1 and 110k1 are shorter in the X-axis direction than the electronic components 110e and 110k in FIG. Therefore, the electronic components 110d and 110f are classified as the second type in the circuit board 34 of FIG. 4, but are classified as the third type in the circuit board 34 of FIG.

More specifically, for example, as shown in FIG. 5, the height dimensions of the electronic components 110d and 110f are 11 mm and are not less than the first determination value (11 mm), and thus are not classified into the first type. Further, the second determination value when any one of the electronic components 110d and 110f is a work target component is 20 mm (maximum separation distance (31 mm) −11 mm). When it is determined whether or not an electronic component having a height dimension of 20 mm or more is planned to be installed in the Y-axis direction of the planned mounting position of the electronic components 110d and 110f, the Y of the planned mounting position of the electronic components 110d and 110f is determined. In the axial direction, mounting of the electronic component 110b1 having a height dimension of 20 mm is scheduled. For this reason, the electronic components 110d and 110f are not classified into the second type, but are classified into the third type. All the target components scheduled to be mounted on the circuit board 34 in FIG. 5 are classified into the same type as all target components scheduled to be mounted on the circuit board 34 in FIG. 4 except for the electronic components 110d and 110f.

FIG. 6 shows a circuit board 34 different from the circuit board 34 shown in FIGS. All the target components scheduled to be mounted on the circuit board 34 in FIG. 6 are the same as all target components scheduled to be mounted on the circuit board 34 in FIG. 4 except for the electronic component 110c1. The electronic component 110c1 is a component having a height dimension lower than that of the electronic component 110c in FIG. 4, but is classified into the third type, like the electronic component 110c in FIG.

Specifically, since the height dimension of the electronic component 110c1 is 11 mm, it is not less than the first determination value (11 mm), and thus is not classified into the first type. When the electronic component 110c1 is a work target component, the second determination value is 20 mm (maximum separation distance (31 mm) -11 mm). Then, when it is determined whether or not an electronic component with a height dimension of 20 mm or more is planned to be mounted in the Y-axis direction of the planned mounting position of the electronic component 110c1, the Y-axis direction of the planned mounting position of the electronic component 110c1 is determined. Mounting of electronic components 110a and 110b having a height dimension of 20 mm is scheduled. For this reason, the electronic component 110c1 is not classified into the second type, but is classified into the third type.

However, the electronic component 110c1 is configured so that the mounting head 24 holding the electronic component 110c1 is placed above the circuit board 34 in the Y-axis direction even after other third type electronic components 110a and 110b are mounted. In addition, by moving in the X-axis direction, it is possible to avoid collision between the electronic component 110c1 and the third type electronic components 110a and 110b mounted on the circuit board 34.

Specifically, when the electronic components 110 a and 110 b are mounted on the circuit board 34, the mounting head 24 holding the electronic component 110 c 1 is mounted on the electronic components 110 a and 110 b at locations other than above the circuit board 34. Move in the X-axis direction to a position that does not overlap the Y-axis direction of the planned position. Then, the mounting head 24 holding the electronic component 110c1 is moved in the Y-axis direction above the circuit board 34 to a position overlapping the X-axis direction of the planned mounting position of the electronic component 110c1. Further, the mounting head 24 holding the electronic component 110c1 is moved in the X-axis direction above the circuit board 34 to the mounting position of the electronic component 110c1. As a result, the electronic component 110c1 can be mounted on the circuit board 34 without being brought into contact with the electronic components 110a and 110b.

For this reason, even if the electronic component can be classified into the third type, the mounting head 24 is moved not only in the Y-axis direction but also in the X-axis direction above the circuit board 34 during the mounting operation. When collision between parts can be avoided, it is classified into the fourth type instead of the third type. Then, when the work procedure of the electronic component classified as the fourth type is set, the mounting head 24 moves in the X-axis direction at a place where the moving path of the mounting head 24 is not above the circuit board 34, After that, a path for moving the mounting head 24 in the Y-axis direction and the X-axis direction to the planned mounting position is set above the circuit board 34 so as to avoid collision between the electronic components. Note that when mounting electronic components classified as the fourth type, it is not necessary to consider the mounting order of the electronic components. Therefore, the mounting order of the electronic components classified as the fourth type is the tact of mounting work on the circuit board 34. The time is set to be the shortest.

As described above, all target parts are classified into one of the first type to the fourth type, and the work procedure is set according to the classified type, so that it is necessary to mount an electronic part having a large height dimension. During the production of a circuit board, it is possible to avoid contact between electronic components and to shorten the tact time of the mounting operation.

<Control program>
The work procedure described above is set by executing the optimization program shown in the flowchart of FIG. An optimization device (see FIG. 2) 112 that executes the optimization program is provided in the controller 102 of the control device 100.

In the optimization program, as shown in FIG. 7, in step 100 (hereinafter simply referred to as “S100”. The same applies to other steps), the optimization device 112 determines that the height dimension of the work target component is the first. It is judged whether it is smaller than 1 judgment value. When the height dimension of the work target component is smaller than the first determination value (YES in S100), the process proceeds to S102. In S102, the optimization apparatus 112 classifies the work target component into the first type, and sets the work procedure according to the first type. Then, the execution of the optimization program ends.

Further, when the height dimension of the work target part is not smaller than the first judgment value (NO in S100), the process proceeds to S104. In S104, the optimization device 112 determines whether or not there is an electronic component having a height dimension equal to or larger than the second determination value in the Y-axis direction of the planned mounting position of the work target component. If there is no electronic component whose height dimension is equal to or greater than the second determination value in the Y-axis direction of the planned mounting position of the work target component (NO in S104), the process proceeds to S106. In S106, the optimization apparatus 112 classifies the work target component into the second type, and sets a work procedure according to the second type. Then, the execution of the optimization program ends.

If there is an electronic component whose height dimension is equal to or greater than the second determination value in the Y-axis direction of the planned mounting position of the work target component (YES in S104), the process proceeds to S108. In S <b> 108, the optimization device 112 determines whether or not contact between electronic components can be avoided by moving the mounting head 24 in the X-axis direction above the circuit board 34. If contact between the electronic components cannot be avoided even if the mounting head 24 is moved in the X-axis direction above the circuit board 34 (NO in S108), the process proceeds to S110. In S110, the optimization apparatus 112 classifies the work target component into the third type, and sets a work procedure according to the third type. Then, the execution of the optimization program ends.

If the mounting head 24 is moved in the X-axis direction above the circuit board 34 and the contact between the electronic components can be avoided (YES in S108), the process proceeds to S112. In S112, the optimization apparatus 112 classifies the work target part into the fourth type, and sets the work procedure according to the fourth type. Then, the execution of the optimization program ends.

The optimization apparatus 112 includes a first determination unit 114, a second determination unit 116, a third determination unit 117, and a work procedure setting unit 118, as shown in FIG. Yes. The first determination unit 114 is a functional unit that executes the process of S100, that is, a functional unit that determines whether or not the height dimension of the work target component is smaller than the first determination value. The second determination unit 116 determines whether or not there is a functional unit that executes the process of S104, that is, whether or not there is an electronic component whose height dimension is equal to or greater than the second determination value in the Y-axis direction of the planned mounting position of the work target component. It is a functional part to do. The third determination unit 117 performs a process of S108, that is, a function of determining whether or not contact between electronic components can be avoided by moving the mounting head 24 on the circuit board in the X-axis direction. Part. The work procedure setting unit 118 is a functional unit that executes the processes of S102, S106, S110, and S112, that is, a functional unit that sets a work procedure according to the classified type.

<Modification 1>
In the above embodiment, the work procedure of the mounting work by one electronic component mounting machine 10 is set. However, in the work system including a plurality of electronic component mounting machines, the electronic component mounting is similar to the above embodiment. It is possible to set work procedures for each machine. Specifically, the work system 120 of the first modification includes eight electronic component mounting machines 122a to 122h and a central computer 123, as shown in FIG. The eight electronic component mounting machines 122a to 122h are arranged side by side in the X-axis direction. Further, each of the electronic component mounting machines 122a to 122h includes the same control device as the control device 100, and the general computer 123 is connected to the control device of each of the electronic component mounting machines 122a to 122h.

The eight electronic component mounting machines 122a to 122h have almost the same configuration, and each electronic component mounting machine 122 includes a pair of transfer devices 124 and 126, a moving device 128, as shown in FIG. A mounting head 130 and a supply device 132 are provided. The conveying devices 124 and 126, the moving device 128, the mounting head 130, and the supplying device 132 have substantially the same configuration as the conveying device 20, the moving device 22, the mounting head 24, and the supplying device 26 of the electronic component mounting machine 10, and thus description thereof is omitted. To do. However, since the electronic component mounting machine 122 has a pair of transfer devices 124 and 126, the electronic component mounting machine 122 can transfer the circuit board held on each of the pair of transfer devices 124 and 126 by one mounting head 130. Installation work is performed. In addition, when distinguishing a pair of conveying apparatus 124,126, it may describe as the 1st conveying apparatus 124 and the 2nd conveying apparatus 126. FIG.

Each of the work procedure at the time of mounting operation on the circuit board held by the first transfer device 124 and the work procedure at the time of mounting operation by the circuit board held by the second transfer device 126 is the electronic component mounting machine 10 of the embodiment. It is set in the same way as the work procedure in. Then, according to the set work procedure, the mounting work is performed on the circuit boards held by the respective transport devices 124 and 126. However, since the second transfer device 126 is disposed between the first transfer device 124 and the supply device 132, the second transfer device 126 is mounted during the mounting operation on the circuit board held by the first transfer device 124. There is a possibility that the electronic component mounted on the circuit board held by the electronic component and the electronic component held by the mounting head 130 may come into contact with each other. For this reason, when the mounting operation is performed on the circuit board held by the first transfer device 124, the holding of the circuit board by the second transfer device 126 is prohibited.

Further, in the work system 120, when the mounting operation by the electronic component mounting machine 122a arranged on the most upstream side is completed, the circuit board on which the electronic component is mounted is transferred to the adjacent electronic component mounting machine 122b, and the electronic component A mounting operation is performed in the mounting machine 122b. Then, the mounting work is sequentially performed in each electronic component mounting machine 122, so that the circuit boards that have been mounted by the eight electronic component mounting machines 122a to 122h are unloaded from the electronic component mounting machine 122h. As described above, in the work system 120, the circuit board on which the electronic component is mounted by the upstream electronic component mounting machine 122 is transported to the downstream electronic component mounting machine 122. Therefore, in order to avoid contact between the electronic component mounted on the circuit board and the electronic component held by the mounting head 130, an electronic component having a large height is mounted by the downstream electronic component mounting machine 122. Is done. That is, in the electronic component mounting machine 122 on the upstream side, an electronic component mounting operation with a relatively small height dimension is performed. In view of this, in the work system 120, suction nozzles (see FIG. 10) 136a having a maximum separation distance of 14 mm are mounted on the mounting heads 130 of the six upstream electronic component mounting machines 122a to 122f. A suction nozzle (see FIG. 10) 136b having a maximum separation distance of 31 mm is mounted on the mounting heads 130 of the two electronic component mounting machines 122g and 122h on the downstream side. As described above, in the electronic component mounting machines 122a to 122f for performing the mounting operation of the electronic component having a small height dimension, the suction nozzle 136a having a short maximum separation distance is employed, so that the vertical moving distance of the suction nozzle is small. Thus, the tact time can be shortened.

Further, for example, in the suction nozzle 136a having a maximum separation distance of 14 mm, as shown in FIG. 10, if the electronic component has a height dimension of 6.5 mm or less, the electronic component 110 mounted on the circuit board 34 and the suction nozzle The electronic component 110 held by the nozzle 136a does not come into contact. However, when the electronic component 110 having a height of 6.5 mm is mounted on the circuit board 34 in the upstream electronic component mounting machine 122, the circuit board 34 is transferred to the electronic component mounting machines 122g and 122h. In addition, in the electronic component mounting machines 122g and 122h, there is a possibility that only the mounting operation of the electronic component having a height dimension of 23.5 mm or less can be performed. As can be seen from the figure, when the electronic component 110 having a height of 6.5 mm is mounted on the circuit board 34, if the suction nozzle 136 b holds the electronic component 110 having a height of 23.5 mm, This is because the clearance between the components is 1 mm or less, and the electronic components 110 may be brought into contact with each other when the suction nozzle 136b sucks and holds the electronic component 110 whose height dimension exceeds 23.5 mm.

However, there is a case where the mounting operation of the electronic component 110 having a height dimension exceeding 23.5 mm has to be executed. In such a case, by limiting the height dimension of the electronic component mounted by the upstream electronic component mounting machines 122a to 122f to less than 6.5 mm, in the downstream electronic component mounting machines 122g and 122h, The mounting operation of the electronic component 110 having a height dimension exceeding 23.5 mm can be executed. Specifically, for example, when the mounting operation of the electronic component 110 having a height dimension of 25.4 mm has to be executed, the height of the electronic component 110 mounted on the circuit board 34 is understood from the drawing. The dimension needs to be 4.6 mm or less.

For this reason, in the electronic component mounting machines 122a to 122f on the upstream side, the mounting operation of the electronic component 110 having a height dimension of 4.6 mm or less is performed, and in the electronic component mounting machines 122g and 122h on the downstream side, the height dimension is set. The overall computer 123 sets a work procedure so that the mounting work of the electronic component 110 exceeding 4.6 mm is performed. As described above, in the work system 120, the overall computer 123 performs the work procedure in the work system 120 so that the height dimension of the electronic component 110 mounted by the upstream electronic component mounting machines 122a to 112f is limited. Set.

Also, the overall computer 123 extracts the maximum height component from all the electronic components mounted on one circuit board 34 by the work system 120. Then, the first determination value is determined based on a value obtained by subtracting the height dimension of the maximum height component from the maximum separation distance of the suction nozzle used for mounting the maximum height component. Further, the general computer may mount the electronic component downstream of the mounting operation including the electronic component whose height dimension is not smaller than the first determination value than the mounting operation including the electronic component whose height dimension is not smaller than the first determination value. Set up work procedures to be done on the machine.

<Modification 2>
In addition, when a pair of mounting heads are arranged in one electronic component mounting machine, it is necessary to limit the height dimension of the electronic component as in the work system 120. Specifically, as shown in FIG. 11, the electronic component mounting machine 150 according to the second modification includes a pair of supply devices 152a and 152b, a pair of transport devices 153a and 153b, and a pair of mounting heads 154a and 154b. And a pair of moving devices 156a and 156b. The supply devices 152a and 152b, the transfer devices 153a and 153b, the mounting heads 154a and 154b, and the moving devices 156a and 156b are the same as the transfer device 20, the moving device 22, the mounting head 24, and the supply device 26 of the electronic component mounting machine 10 of the embodiment. Since the configuration is substantially the same, the description is omitted. The mounting head 154a is mounted with a suction nozzle 158a having a maximum separation distance of 14 mm, and the mounting head 154b is mounted with a suction nozzle 158b having a maximum separation distance of 31 mm.

In the electronic component mounting machine 150 having the above-described structure, it is possible to perform a mounting operation with the pair of mounting heads 154a and 154b on the circuit board 34 held by one of the pair of transport devices 153a and 153b. is there. At this time, the mounting head 154a performs a mounting operation for an electronic component having a small height, and the mounting head 154b performs a mounting operation for an electronic component having a large height. As described above, since the suction nozzle 158a having a maximum separation distance of 14 mm is mounted on the mounting head 154a, any electronic component having a height dimension of 6.5 mm or less may be mounted on the circuit board 34. There is no contact between the component 110 and the electronic component 110 held by the suction nozzle 158a (see FIG. 10). That is, in the mounting head 154a, mounting work of electronic components having a height dimension of 6.5 mm or less is allowed. However, when the mounting work by the mounting head 154b includes the mounting work of the electronic component 110 having a height of 25.4 mm, as described in the first modification, the electronic mounted by the mounting head 154a. It is necessary to limit the height dimension of the part to 4.6 mm. For this reason, when a mounting operation is performed on one circuit board by the pair of mounting heads 154a and 154b, the height of the electronic component 110 mounted by one of the pair of mounting heads 154a and 154b is high. The work procedure is set so that the height dimension is limited.

Incidentally, in the above embodiment, the electronic component mounting machine 10 is an example of an electronic component mounting machine. The moving device 22 is an example of a moving device. The mounting head 24 is an example of a mounting head. The supply device 26 is an example of a supply device. The substrate holding device 36 is an example of a substrate holding device. The suction nozzle 70 is an example of a suction nozzle. The optimization device 112 is an example of an optimization device. The first determination unit 114 is an example of a first determination unit. The second determination unit 116 is an example of a second determination unit. The third determination unit 117 is an example of a third determination unit. The work procedure setting unit 118 is an example of a determination unit. The electronic component mounting machine 122 is an example of an electronic component mounting machine. The moving device 128 is an example of a moving device. The mounting head 130 is an example of a mounting head. The supply device 132 is an example of a supply device. The suction nozzles 136a and 136b are examples of suction nozzles. The electronic component mounting machine 150 is an example of an electronic component mounting machine. The supply devices 152a and 152b are examples of the supply device. The mounting heads 154a and 154b are examples of mounting heads. The moving devices 156a and 156b are examples of moving devices. The suction nozzles 158a and 158b are examples of suction nozzles.

In addition, this invention is not limited to the said Example and modification, It is possible to implement in the various aspect which gave various change and improvement based on the knowledge of those skilled in the art. Specifically, for example, in the above embodiment, the moving direction of the mounting head above the circuit board is limited to the Y-axis direction, but can be limited to the X-axis direction.

In the above-described embodiment, the optimization device 112 constitutes a part of the controller 102 of the control device 100, but may constitute another control device. That is, the optimization device 112 may be configured in a control device independent of the electronic component mounting machine 10.

10: Electronic component mounting machine 22: Moving device 24: Mounting head 26: Supply device 36: Substrate holding device 70: Suction nozzle 112: Optimization device 114: First determination unit 116: Second determination unit 117: Third determination unit 118: Work procedure setting unit (determination unit) 122: Electronic component mounting machine 128: Moving device 130: Mounting head 132: Supply device 136: Suction nozzle 150: Electronic component mounting device 152: Supply device 154: Mounting head 156: Moving device 158: Suction nozzle

Claims (6)

1. Supplying at least one mounting head having a suction nozzle that moves up and down in the vertical direction, a moving device that moves the mounting head in a first direction and a second direction perpendicular to the first direction, and an electronic component An electronic component mounting machine that includes a supply device and a substrate holding device that holds a circuit board, and that performs a mounting operation for mounting an electronic component supplied from the supply device on a circuit board held by the substrate holding device. An optimization device for optimizing the mounting work,
   The optimization device comprises:
   The distance between the upper surface of the circuit board held by the substrate holding device and the lower end of the suction nozzle in the most elevated state when the electronic component supplied from the supply device is transported to the mounting position on the circuit board Of the electronic component having the largest height among all the target components which are all electronic components to be mounted on the circuit board by one mounting head of the at least one mounting head. Whether or not the height dimension of the component to be mounted which is an electronic component scheduled to be mounted on the circuit board by the one mounting head is smaller than the first determination value determined based on the value obtained by subtracting the height dimension. A first determination unit for determining;
   When the height dimension of the part to be mounted is not smaller than the first determination value, the moving path of the one mounting head by the moving device when the part to be mounted is mounted on the circuit board, and the mounting schedule An optimization device, comprising: a determination unit that determines at least one of the order of component mounting.
2. The optimization device comprises:
   When the height dimension of the part to be mounted is not smaller than the first determination value, all the target parts except for the part to be mounted are mounted on the circuit board, When the one mounting head that holds the part to be mounted sucked and held by the suction nozzle is moved in the first direction on the position to be mounted, the part to be mounted among all the target parts is removed. A second determination unit for determining whether or not the component and the part to be mounted are in contact with each other;
   The determination unit is
   When the second determination unit determines that the part to be mounted out of all the target parts except the part to be mounted is not in contact with the part to be mounted, the first mounting head is removed from above the circuit board. A movement path of the first mounting head by the moving device is determined so as to move in the first direction up to the planned mounting position above the circuit board after being moved in the second direction at a location. The optimization device according to claim 1.
3. The optimization device comprises:
   When the height dimension of the part to be mounted is not smaller than the first determination value, all the target parts except for the part to be mounted are mounted on the circuit board, When the one mounting head that holds the part to be mounted sucked and held by the suction nozzle is moved in the first direction on the position to be mounted, the part to be mounted among all the target parts is removed. A second determination unit for determining whether or not the component and the part to be mounted are in contact with each other;
   The determination unit is
   The all target parts by the one mounting head on the circuit board when the second determination unit determines that the part to be mounted out of all the target parts is in contact with the part to be mounted. The mounting order of the components to be mounted is determined so that the electronic components are mounted on the circuit board in order from a position farthest from the supply device in the mounting area of the mounting area. 2. The optimization apparatus according to 2.
4. The determination unit is
   When the second determination unit determines that the part to be mounted out of the target parts except the part to be mounted is in contact with the part to be mounted, the mounting order of the parts to be mounted is determined and the 1 The mounting head is moved in the second direction at a place other than the upper side of the circuit board, and then moved in the first direction to the predetermined mounting position above the circuit board. The optimization apparatus according to claim 3, wherein a movement path of one mounting head is determined.
5. The second determination unit;
   Among electronic parts to be mounted in the first direction at the planned mounting position among all the target parts, determined based on a value obtained by subtracting the height dimension of the planned mounting part from the maximum separation distance. It is determined whether or not there is an electronic component having a height dimension equal to or greater than the second determination value, and if there is, the component to be mounted and the component to be mounted are excluded from all the target components. The optimization device according to claim 2, wherein the optimization device is determined to be in contact with each other.
6. The optimization device comprises:
   When the second determination unit determines that the part to be mounted out of all the target parts except the part to be mounted is in contact with the part to be mounted, the mounting target part is sucked and held by the suction nozzle. Whether or not contact between the parts to be mounted and the parts to be mounted can be avoided among all the target parts by moving the mounting head in the second direction above the circuit board. A third determination unit for determining,
   The determination unit is
   When it is determined by the third determination unit that contact between the target parts except the part to be mounted out of the target parts and the part to be mounted can be avoided, the first mounting head is moved above the circuit board. The first mounting by the moving device so as to move in the first direction and the second direction above the circuit board to the planned mounting position after being moved in the second direction except for the position 6. The optimization apparatus according to claim 2, wherein a moving path of the head is determined.

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