WO2014207867A1

WO2014207867A1 - Bonded device manufacturing method

Info

Publication number: WO2014207867A1
Application number: PCT/JP2013/067691
Authority: WO
Inventors: 坂下　光邦; 義和大谷
Original assignee: 信越エンジニアリング株式会社
Priority date: 2013-06-27
Filing date: 2013-06-27
Publication date: 2014-12-31
Also published as: JP5512061B1; JPWO2014207867A1; CN105359203B; TWI603848B; CN105359203A; TW201505843A; KR20160026908A

Abstract

The purpose of a manufacturing method for a bonded device according to the present invention is to control the extension of the outer periphery of an adhesive sandwiched between a first substrate and a second substrate and fill the entirety of the inside of a display area with the adhesive. After a first substrate (1), second substrate (2), or both are supplied with an adhesive (3) such that the adhesive (3) is disposed within a display area (D), in the periphery (3a) of the adhesive (3), a filled portion (3b) excluding a specific portion (3a') is semi-cured such that the viscosity thereof is higher than the viscosity of other portions while the adhesiveness thereof is maintained. Thereafter, the first substrate (1) and second substrate (2) are caused to overlap so that the adhesive (3) is sandwiched therebetween, and the resulting capillary action, natural flow, or pressurized flow occurring between the first substrate (1) and second substrate (2) causes the specific portion (3a'), which is not semi-cured, in the periphery (3a) of the adhesive (3) to extend toward an unfilled area (D1) further to the outside than the periphery (3a) of the adhesive (3) and spread throughout the entirety of the inside of the display area (D).

Description

Manufacturing method of bonding device

The present invention may be a flat panel display (FPD) such as a liquid crystal display (LCD), an organic EL display (OLED), a plasma display (PDP), or a flexible display, or a touch panel FPD, 3D (three-dimensional) display, electronic A method of manufacturing a bonding device, such as a book, for bonding another substrate such as a cover glass, a cover film, or an FPD to a substrate such as a liquid crystal module (LCM) or a flexible printed wiring board (FPC). About.

Conventionally, as a manufacturing method of this kind of bonding device, a supply unit supplies an adhesive (ultraviolet curable resin) so as to spread over one side of one workpiece, and one of the adhesives spread over the whole side of the workpiece. Part of the adhesive (outer edge of the adhesive supply area) or the entire adhesive on one side of the workpiece is irradiated with electromagnetic waves (ultraviolet rays) in the atmosphere before bonding. By pre-curing part (outer edge) or all, and bonding the other workpiece to the pre-cured adhesive, the flow of the adhesive before bonding is suppressed, and the applied shape is lost or moved out of the workpiece. There is a bonding method for preventing the protrusion of the film (for example, see Patent Document 1).
Furthermore, in this bonding method, the adhesive R is dropped from the nozzle of the dispenser onto the entire surface of the workpiece S1 (the entire one surface) as a method for supplying the adhesive so that it spreads over the entire surface of one of the workpieces. An example in which the adhesive is spread over the entire surface of the workpiece by moving it with a scanning device, an example in which the adhesive is spread over the entire part of the workpiece after it has been supplied, and an adhesive that is connected to many dispensers Examples where the agent is applied in a number of lines, examples where the supply unit applies the adhesive in a planar manner and uniformly applies in a short time, a device for applying with a roller, a device for applying with a squeegee, a device for applying spin, etc. Examples of applying various devices are shown.

JP 2012-73533 A

By the way, as for the bonding device such as LCD and LCM, the substrate constituting it is a rectangular thin plate like the work described in Patent Document 1, and an adhesive is filled between the two substrates, The entire display area formed in a rectangular shape is filled with an adhesive.
In recent years, due to improvements in adhesive application technology and the like, the size of the display area with respect to the size of the substrate tends to expand, but the marginal portion of the outer edge of the substrate that is not filled with the adhesive tends to be as narrow as possible. Recently, there is a desire to enlarge the size of the display area to the vicinity of the outer edge of the substrate.
Even in such a situation, in the rectangular display area, particularly when the adhesive is not filled up to the corner and the edge of the adhesive is visually recognized in the display area, the display quality is deteriorated. There is no change in becoming a good product.
However, in the conventional method for manufacturing a bonding device described above, it has been difficult to supply the adhesive so that the entire surface of the rectangular workpiece is spread.
The reason for this is that liquid adhesives such as UV curable resins are rounded into a spherical shape in the longitudinal and lateral directions (XY direction) and thickness direction (Z direction) of the workpiece due to surface tension, so a rectangular display on one side of the workpiece It is impossible to spread the adhesive at right angles to the corners of the region.
That is, even if the adhesive is applied by a supply device as described in Patent Document 1, the supplied adhesive is spread over the entire surface, or the adhesive is applied to the surface in the supply portion, The adhesive could not be supplied so as to spread in the desired thickness over the entire designated area.
For this reason, in order to spread the adhesive to the corner of the rectangular display area, the end of the adhesive that has been rounded by the surface tension is rectangular so that it reaches the corner of the rectangular display area. In other words, the adhesive must be supplied (applied) so as to be wider than the display area. However, in this method, when the workpieces are pasted together after the adhesive is supplied (applied) on one side of the workpiece so as to be wider than the rectangular display area, the end portion of the adhesive spread between the workpieces. However, it protrudes from the side of the rectangular display area. If there is not enough room in the margin from the rectangular display area to the outer edge of the workpiece as in recent years, the adhesive will protrude outside the workpiece due to the bonding of the workpieces, and it will be necessary to wipe it off in the subsequent process There is. As a result, the productivity is lowered and the production cost is increased.
Furthermore, depending on the type of bonding device, there is a demand for the film thickness (thickness dimension) of the adhesive to be about 0.1 to 0.5 mm. This size is several tens of times larger than the adhesive film thickness (about 1 to 10 μm) in general LCDs and LCMs, so the fluidity of the adhesive is increased and the entire display area is covered. It tends to be more difficult to fill with adhesive.

An object of the present invention is to cope with such a problem, and controls the extension of the outer edge portion of the adhesive sandwiched between the first substrate and the second substrate so that the entire area in the display area is adhesive. The purpose is to satisfy with.

In order to achieve such an object, the present invention provides a method for manufacturing a bonding device in which a first substrate and a second substrate facing each other are bonded together with a liquid adhesive filled therebetween and having a display region. A supplying step of supplying the adhesive to be arranged in the display area on either the first substrate or the second substrate or both the first substrate and the second substrate; A semi-curing step of semi-curing a filling site from which a specific site is removed at the outer edge of the adhesive so that the viscosity is higher than the viscosity of other sites while maintaining adhesion; and the first substrate; A bonding step of stacking the second substrate so that the adhesive is sandwiched between the opposing surfaces, and in the bonding step, the outer edge of the adhesive that is not semi-cured in the semi-curing step The specific part in the front Wherein it is disposed outside the outer edge of the adhesive, characterized in that to stretch toward the unfilled region of the adhesive.

In the present invention having the above-described features, after supplying the adhesive to one or both of the first substrate and the second substrate so as to be disposed in the display region, the specific portion is removed at the outer edge of the adhesive. By semi-curing the filled part so that its viscosity is higher than the viscosity of other parts while maintaining adhesiveness, and then superimposing the first and second substrates so that the adhesive is sandwiched In the outer edge of the adhesive, the unsemi-cured specific part is a capillary phenomenon generated between the first substrate and the second substrate, natural flow or pressure flow, and the unfilled area outside the outer edge of the adhesive Extends to the entire display area.
Therefore, the extension of the outer edge portion of the adhesive sandwiched between the first substrate and the second substrate can be controlled to fill the entire display area with the adhesive.
As a result, the adhesive is sufficient for the blank area from the rectangular display area to the outer edge of the first substrate and the second substrate as compared with the conventional one in which the adhesive protrudes from the side of the rectangular filling area when the workpieces are bonded to each other. Even when there is no allowance, it is possible to prevent the adhesive from protruding outside the first substrate and the second substrate, and the adhesive has excellent formability and productivity.
Furthermore, even when manufacturing a bonding device in which the film thickness (thickness dimension) of the adhesive is much thicker than the film thickness of the adhesive in general LCDs and LCMs, The adhesive can be filled without sticking out and can be easily handled.

It is explanatory drawing which shows the manufacturing method of the bonding device which concerns on embodiment of this invention, (a) is a top view after a supply process, (b) is a top view of a semi-hardening process, (c) is after a semi-hardening process. (D) is a top view of a joining process, (e) is a top view after a joining process. It is the same front view, (a) is an enlarged front view of FIG.1 (b), (b) is an enlarged front view of FIG.1 (e). It is an enlarged plan view which shows the modification of a joining process. It is explanatory drawing of a semi-hardening process, (a) is a partial enlarged plan view of FIG.1 (b), (b) (c) is a partial enlarged plan view which shows the modification of FIG.4 (a). It is explanatory drawing which shows the manufacturing method of the bonding device which concerns on the other Example of this invention, (a) is a top view after a supply process, (b) is a top view of a semi-hardening process, (c) is semi-hardened. The top view after a process, (d) is a top view of a joining process, (e) is a top view after a joining process. It is the same front view, (a) is an enlarged vertical front view of FIG. 5 (b), (b) is an enlarged vertical front view of FIG. 1 (e).

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
As shown in FIGS. 1 to 6, the bonding device A according to the embodiment of the present invention sandwiches a pair of opposing first substrate 1 and second substrate 2 with a liquid adhesive 3 filled therebetween. As a result, the display area D having a predetermined shape is formed at the predetermined position.
As a manufacturing method of the bonding device A, a supply step of supplying the adhesive 3 so as to be disposed in the display region D on the facing surface of either the first substrate 1 or the second substrate 2, and this supply A semi-curing step of semi-curing the filling site 3b from which the specific site 3a 'is removed at the outer edge 3a of the adhesive 3 so that the viscosity is higher than the viscosity of other sites while maintaining the adhesiveness; A bonding step of overlapping the one substrate 1 and the second substrate 2 so that the adhesive 3 is sandwiched between the

opposing surfaces

1a and 2a.

The first substrate 1 and the second substrate 2 are flat panel displays (FPD) such as a liquid crystal display (LCD), an organic EL display (OLED), a plasma display (PDP), a flexible display, or a touch panel type FPD or 3D, for example. Made of liquid crystal module (LCM) and flexible printed wiring board (FPC) such as (three-dimensional) display and electronic book, and transparent glass substrate or transparent heat-resistant resin (PES: Poly-Ether-Sulphone, etc.) A cover film, a synthetic resin substrate, a cover glass, a barrier glass, or the like is used.
In addition, one of the first substrate 1 and the second substrate 2 is not limited to the one that is finally separated in the production stage, and a plurality of first substrates 1 and second substrates are produced in the production stage. It is also possible to use one before separation in which 2 are arranged side by side. Either the first substrate 1 or the second substrate 2 may be configured by assembling a plurality of components such as LCM, and the outer periphery thereof may be supported by a frame-shaped protective frame.
Furthermore, it is preferable that the outer shapes of the first substrate 1 and the second substrate 2 are formed to have the same size, for example, a rectangle, and are bonded so that the outer edges overlap each other in the bonding step.

As the adhesive 3, for example, a photo-curing adhesive having a photo-curing property, which is cured by absorbing light energy and is developed by polymerization, and the like are used. Further, instead of the photo-curing adhesive, it is also possible to use a thermosetting adhesive or a two-component mixed curing adhesive that is cured by polymerization by absorption of thermal energy.
Further, when the adhesive 3 is supplied to either the first substrate 1 or the second substrate 2, the viscosity, specifically, the degree of polymerization (curing degree) is low and has fluidity. The adhesive 3 absorbs light energy, heat energy, and the like in a semi-curing step to be described later, and its fluidity decreases as the viscosity (degree of polymerization, degree of curing) increases. The surface becomes a gelled state that does not harden and maintains adhesiveness, and this gelled state is called a semi-cured state. The semi-cured adhesive 3 is further hard to be deformed by absorbing light energy, heat energy, and the like, and is in a fully cured state.
As a specific example of the adhesive 3, for example, an ultraviolet curable adhesive made of, for example, an acrylic UV curable resin or a silicon UV curable resin is used, and the curing control has an oxygen inhibition property that the surface does not harden particularly in the air. It is preferable to use a material containing a material. In many cases, this type of curing control material has the property of being gasified in a vacuum atmosphere.

And the supply method of the adhesive agent 3 in a supply process is, for example, a linear coating device such as a coater die having a slit-shaped discharge part, a linear coating device such as a quantitative discharge nozzle, or other means, and the first substrate 1 or the first substrate 1 Either one of the opposing surfaces of the two substrates 2 or both the first substrate 1 and the second substrate 2 are supplied in a shape substantially the same as the outer shape of the display region D.
In the specific example of the supply process shown in FIG. 1A, a surface coating device or a linear coating device is used in the atmosphere, and the adhesive 3 is placed in the rectangular display area D on the opposing surface 1a of the first substrate 1. Is applied in a substantially rectangular shape smaller than the outer shape of the display area D.
Although not shown as another example, the adhesive 3 is applied by printing or the like instead of the planar coating device or the linear coating device, or the second substrate 2 is opposed to the opposing surface 1a of the first substrate 1. It is also possible to apply the adhesive 3 to only the surface 2 a or both the facing surface 1 a of the first substrate 1 and the facing surface 2 a of the second substrate 2.
Before supplying the adhesive 3, it is necessary to degas the air bubbles mixed in the adhesive 3 so that the air bubbles are not involved even during application. It is preferable to leave the adhesive 3 for a predetermined period of time after the supply of the adhesive 3 to naturally defoam the bubbles that are involved during application.

The “specific part 3a ′ in the outer edge 3a of the adhesive 3” that is semi-cured by the semi-curing process means that when the adhesive 3 is supplied in a rectangular shape to the opposing surface of the first substrate 1 or the second substrate 2, Examples include a corner portion 3a1 whose end is rounded into a spherical shape by the surface tension of the adhesive 3. Further, as another example of the specific part 3a ′, it may be a side portion 3a2 having a predetermined length continuous with the corner portion 3a1 or the entire circumference of the outer edge portion 3a including the corner portion 3a1 and the side portion 3a2.
As a semi-curing method of the adhesive 3 by the semi-curing process, the specific portion 3a ′ on the outer edge 3a of the adhesive 3 is covered with the mask 4 or the like, and the specific portion 3a ′ of the adhesive 3 that is not covered with the mask 4 or the like is excluded. The exposed filling portion 3b is exposed and irradiated with light energy, heat energy, or the like, so that only the filling portion 3b in an exposed state absorbs light energy or heat energy, and the viscosity maintains adhesiveness. It is partially semi-cured so as to be higher than the viscosity of other parts.
In the specific example of the semi-curing process shown in FIGS. 1B and 2A, a photo-curing adhesive is used as the adhesive 3, and the corner portion 3a1 is used as the specific portion 3a 'in the outer edge 3a of the adhesive 3. And the like, and a light source 5 such as an ultraviolet lamp is disposed between the mask 4 and the light beam L such as ultraviolet rays from the light source 5. Is being irradiated. As a result, only the filling portion 3b excluding the corner portion 3a1 which becomes the specific portion 3a 'in the outer edge portion 3a of the adhesive 3 gels by absorbing light energy, and the surface also gels, but the adhesiveness Is in a semi-cured state.
In other words, the filling portion 3b excluding the corner portion 3a1 and the like serving as the specific portion 3a ′ of the adhesive 3 becomes the semi-cured portion 3b ′ semi-cured in the semi-curing process. Further, the corner portion 3a1 or the like that becomes the specific portion 3a ′ in the outer edge portion 3a of the adhesive 3 becomes an uncured or uncured portion in an unsemi-cured state that is not semi-cured in the semi-curing process.
In particular, when the adhesive 3 includes a curing control material having oxygen inhibition properties, the surface layer of the filling portion 3b from which the outer edge portion 3a is removed in the air is not completely solidified due to oxygen inhibition properties. Remains adhesive.
In the case of the illustrated example, as the mask 4, a transparent plate 4b having a light shielding portion 4a fixed at a predetermined position is used.
Although not shown in the drawings as another example, a mask 4 having a through-hole formed in a transparent portion excluding the light-shielding portion 4a may be used, or a heat source may be irradiated from a heat source instead of a light beam L such as ultraviolet rays. It is also possible to change the heat energy and the like into a gel and semi-cured or changed.
After the semi-curing step, the state is left for a predetermined time, and the semi-cured portion 3b ′ that has become a semi-cured state (such as the corner portion 3a1 that becomes the specific portion 3a ′ in the outer edge portion 3a of the adhesive 3). The surface 3c in the filling part 3b) excluding the part 3 and the corner part 3a1 or the like (unsemi-hardened part or unsemi-hardened part) which becomes the specific part 3a 'of the outer edge 3a from which the semi-hardened part 3b' is removed It is preferable that the air bubbles are naturally smoothed and the bubbles entrained at the time of application are further defoamed.

The bonding method of the first substrate 1 and the second substrate 2 in the bonding process is as follows: between the facing

surfaces

1a and 2a of the first substrate 1 and the second substrate 2, the specific portion 3a 'and the semi-cured portion of the outer edge portion 3a. The specific part 3a 'of the unsemi-cured state in the outer edge 3a of the adhesive 3 is placed outside the outer edge 3a of the adhesive 3 by overlapping in the Z direction so that the entire adhesive 3 including 3b' is sandwiched. It extends toward the unfilled area D1 of the adhesive 3 to be arranged.
As an example, either one or both of the first substrate 1 and the second substrate 2 that are overlapped are entirely pressed in the Z direction, and each is vertically and horizontally obliquely intersected with the Z direction (hereinafter referred to as XYθ direction). It is preferable that the facing

surfaces

1a and 2a be close to each other in the Z direction so as to be spread.

In the specific example of the bonding step shown in FIGS. 1D and 1E, the second substrate 2 is opposed to the first substrate 1 coated with the adhesive 3 in a vacuum or in the atmosphere. The first substrate 1 and the second substrate 2 are superposed so as to be in contact with the surface 3c of the adhesive 3, and are pressed and bonded together so that the first substrate 1 and the second substrate 2 are parallel to each other with the adhesive 3 interposed therebetween.
Specifically, an elevating drive unit (not shown) that moves either one or both of the first substrate 1 and the second substrate 2 toward each other is provided. This lifting drive is controlled by a controller (not shown) until the distance between the opposing

surfaces

1a and 2a of the first substrate 1 and the second substrate 2 is substantially the same as the coating height of the adhesive 3. It is configured to move closer.
The substantially rectangular adhesive 3 supplied into the rectangular display region D by this overall pressurization has substantially arc-shaped corner portions 3a1 formed at the four corners of the outer edge 3a. At the same time, each of the substantially straight side portions 3a2 formed on the four sides of the outer edge portion 3a is expanded in the XY direction toward the side portion D3 of the display region D. Thereby, as shown in FIG. 1 (e), the corner portion 3 a 1 of the outer edge portion 3 a reaches the corner portion D 2 of the display region D, and the side portion 3 a 2 of the outer edge portion 3 a reaches the side portion D 3 of the display region D.

Further, instead of or in addition to the above-described full pressurization in the bonding step, the first substrate 1 and the second substrate 2 are left in a state of being overlapped and bonded for a predetermined time. It is preferable to include a leveling step of naturally extending the specific portion 3a ′ in the outer edge portion 3a of the agent 3 along the opposing

surfaces

1a and 2a. Accordingly, the corner portion 3a1 and the side portion 3a2 that become the specific portion 3a 'in the semi-cured state in the outer edge portion 3a of the adhesive 3 are the corner portion D2 and the side portion D3 that become the unfilled region D1 in the display region D. It naturally flows toward the screen, thereby expanding and extending all over the display area D.
As a modification of the bonding process, as shown in FIG. 3, instead of the above-described full pressurization or leaving, or in addition to full pressurization or leaving, In either one or both of the substrate 1 and the second substrate 2, the specific portion 3 a ′ is unfilled by partially pressing the portion P facing the specific portion 3 a ′ in the outer edge 3 a of the adhesive 3. It is also possible to approach each other so as to extend toward D1.
In the example shown in FIG. 3, the portion P of the second substrate 2 facing the corner portion 3a1 of the outer edge portion 3a is locally pressed into a circular shape by a pressurizing device (not shown) to identify the unsemi-cured state. The corner portion 3a1 that becomes the portion 3a 'is forcibly pushed toward the corner portion D2 of the display region D that becomes the unfilled region D1. In addition to this, when the partial pressurization is performed in addition to the above-described full pressurization and neglecting, the corner portion 3a1 which becomes the specific portion 3a 'in the unsemi-cured state becomes the corner portion of the display region D which becomes the unfilled region D1 Each extension toward D2 can be promoted.
Although not shown as another example, the vicinity of the portion P facing the corner portion 3a1 is locally pressurized with a shape different from the circular shape, or the portion facing the side portion 3a2 is locally pressed instead of the corner portion 3a1. Thus, it is also possible to promote the extension of the side portion 3a2 serving as the specific portion 3a ′ in the unsemi-cured state toward the side portion D3 of the display region D.

Further, as a post process of the bonding process, after confirming that the entire display area D is filled with the adhesive 3, the place where the bonding process is performed or a place different from the execution place of the bonding process It is preferable to carry out main curing by irradiating the entire adhesive 3 including the specific part 3a ′ and the semi-cured part 3b ′ of the outer edge 3a by irradiating light L such as ultraviolet rays or heat rays.
Thereby, the viscosity of the adhesive 3 as a whole is further increased to be in a completely bonded state that cannot be deformed, and the first substrate 1 and the second substrate 2 have an even filling film thickness ( A bonding device A bonded so as to be sandwiched by a gap) is produced.

According to the manufacturing method of the bonding device A according to such an embodiment of the present invention, either or both of the first substrate 1 and the second substrate 2 in the supply step shown in FIG. After supplying the adhesive 3 so as to be arranged in the display area D, in the semi-curing process shown in FIGS. 1B and 2A, a specific part in the outer edge 3a of the supplied adhesive 3 The filling part 3b from which 3a 'is removed is partially semi-cured so that its viscosity is higher than the viscosity of other parts while maintaining the adhesiveness. Thereafter, in the bonding step shown in FIGS. 1C and 1D, the first substrate 1 and the second substrate 1 are sandwiched between the adhesive 3 including the specific portion 3a ′ and the semi-cured portion 3b ′ of the outer edge 3a. The substrate 2 is overlaid. As a result, as shown in FIG. 1 (e), an unsemi-cured specific portion 3 a ′ in the outer edge 3 a of the adhesive 3 is caused by capillarity or natural phenomenon that occurs between the first substrate 1 and the second substrate 2. Due to the flow or pressure flow, it extends and extends toward the unfilled area D1 outside the outer edge 3a of the adhesive 3 and reaches all within the display area D.
Accordingly, it is possible to control the extension of the outer edge 3 a of the adhesive 3 sandwiched between the first substrate 1 and the second substrate 2 and fill the entire display area D with the adhesive 3.
As a result, the adhesive 3 protrudes outside the first substrate 1 and the second substrate 2 even when there is not enough margin in the blank area from the rectangular display region D to the outer edges of the first substrate 1 and the second substrate 2. The manufacturing method of the bonding device A excellent in the shaping property of the adhesive 3 and excellent in productivity can be provided.
Furthermore, even when manufacturing the bonding device A in which the film thickness (thickness dimension) of the adhesive 3 is much thicker than the film thickness of the adhesive in general LCDs and LCMs, the first substrate 1 and the second substrate The adhesive 3 can be filled without sticking out of 2 and can be easily handled.

In particular, in the bonding step, either one or both of the first substrate 1 and the second substrate 2 are fully pressurized, and any one of the facing

surfaces

1a and 2a of the first substrate 1 and the second substrate 2 is pressed. When the adhesive 3 is brought into close contact with the surface 3c, the unevenness generated on the surface 3c of the adhesive 3 is smoothly deformed and brought into close contact.
Accordingly, it is possible to further reduce the residual bubbles when the

substrates

1 and 2 are bonded together.
Therefore, the bubble-free quality can be improved, and the warpage between the

substrates

1 and 2 can be corrected, thereby greatly improving the yield.
In addition, in the bonding step, when the opposing

surfaces

1a and 2a are brought close to each other so that the specific portion 3a 'on the outer edge 3a of the adhesive 3 is pushed and spread along the opposing

surfaces

1a and 2a, In the outer edge portion 3a of the adhesive 3, the specific portion 3a 'in an unsemi-cured state is formed in the unfilled region D1 outside the outer edge portion 3a of the adhesive 3 due to a capillary phenomenon generated between the first substrate 1 and the second substrate 2. It flows and expands and extends all over the display area D.
Therefore, the entire display area D can be reliably filled with the adhesive 3.
As a result, the formability of the adhesive 3 is excellent, the yield is significantly improved, and the productivity can be further improved.

Further, after the bonding step, the first substrate 1 and the second substrate 2 are left in a state of being overlapped and left for a predetermined time, and the specific portion 3a ′ in the outer edge portion 3a of the adhesive 3 extends along the opposing

surfaces

1a and 2a. In this case, the specific part 3a ′ that is not semi-cured in the outer edge 3a of the adhesive 3 is naturally flowed toward the unfilled region D1 outside the outer edge 3a of the adhesive 3. As a result, it extends and extends all over the display area D. At the same time, the local vacuum or the like in the adhesive 3 disappears, the adhesive 3 becomes substantially stationary and stable, and the layer thickness of the adhesive 3 is the opposite surface of the first substrate 1 and the second substrate 2. 1a and 2a are substantially uniform in the Z direction, and no further gap adjustment is required.
Accordingly, the entire display area D can be naturally filled with the adhesive 3, and the first substrate 1 and the second substrate 2 can be bonded in a completely bubble-free state with a uniform gap.
As a result, the production equipment is not complicated, the cost can be reduced, and the bubble-free performance can be improved.

In addition, in the bonding step, the portion P facing the specific portion 3a ′ in the outer edge portion 3a of the adhesive 3 is partially applied to either one or both of the superposed first substrate 1 and second substrate 2. In the outer edge 3a of the adhesive 3 so that the specific part 3a 'is not semi-cured at the outer edge 3a of the adhesive 3. It is forced to flow toward the unfilled region D1 outside the outer edge portion 3a and flows, thereby expanding and extending all over the display region D.
Therefore, the entire display area D can be smoothly filled with the adhesive 3.
As a result, the formability of the adhesive 3 is excellent, the yield is significantly improved, and the productivity can be further improved.
Furthermore, in the case where local pressurization is performed in addition to the above-described full pressurization and neglect, the extension of the non-hardened specific portion 3a ′ toward the unfilled region D1 is promoted.
Therefore, it is possible to shorten the time for filling the adhesive 3 in the entire display area D.
As a result, productivity can be improved.
Next, an embodiment of the present invention will be described with reference to the drawings.

Next, each embodiment of the present invention will be described with reference to the drawings.
In the first embodiment, as shown in FIGS. 1 to 4, in the supplying process, the adhesive 3 is supplied in a substantially rectangular shape along the inner side of the boundary line of the rectangular display region D. In the semi-curing process, the adhesive 3 is used. The filling portion 3b from which the corner portion 3a1 is removed as the specific portion 3a 'in the outer edge portion 3a of the outer peripheral portion 3a is semi-cured, and in the joining process, the corner portion 3a1 that becomes the specific portion 3a' It is extended toward the corner | angular part D2 used as the filling area | region D1.
In the case where the bonding device A of Example 1 is an electronic component such as an LCD or an LCM that does not have a sufficient margin in the blank area from the rectangular display region D to the outer edges of the first substrate 1 and the second substrate 2. Is shown.

In the example shown in FIG. 4A, the corner portion 3a1 that becomes the specific portion 3a 'is only a portion that is a quadrant formed at the four corners of the outer edge portion 3a of the adhesive 3 supplied in a substantially rectangular shape. is there.
In the illustrated example, the light-shielding part 4a (4a1) of the mask 4 is rectangular and covers only the part that becomes a quadrant. However, if the part that becomes a quadrant can be covered, the light-shielding part 4a may be a triangle or the like. It is also possible to change the shape.

In the example shown in FIG. 4B, the corner portion 3a1 that becomes the specific portion 3a 'is a portion that is a quadrant of the four corners of the outer edge portion 3a of the substantially rectangular adhesive 3, and one of the arcs 3R. This is a location including a rectangular side portion 3a3 that is continuously formed so as to be adjacent in the XY direction along a side 3L having a predetermined length continuous with one or both.
In the illustrated example, the rectangular light-shielding portion 4a2 larger than that shown in FIG. 4A is used to cover the quadrant and the L-shaped side part 3a3, but the quadrant. If the side part 3a3 along at least one side 3L can be covered, it is also possible to use a light shielding part 4a having another shape such as a triangle.

In the example shown in FIG. 4C, the corner portion 3a1 that becomes the specific portion 3a 'is a portion where the outer edge portion 3a of the substantially rectangular adhesive 3 is a quadrant of the four corners, and the arc 3R and the side 3L. And adjacent portions 3a4 continuously formed so as to be adjacent to each other in the XY direction from the boundary to the filling portion 3b.
In the illustrated example, the light shielding part 4a3 having a shape in which a rectangle and a trapezoid partially overlap is used to cover the quadrant and the adjacent portion 3a4. However, the quadrant and the corner portion 3a1 and the adjacent portion 3a4 are covered. As long as it can be covered, it is also possible to use the light-shielding portion 4a having other shapes such as changing the rectangle into a triangle or changing the trapezoid into a circle.

According to the manufacturing method of the bonding device A according to the first embodiment of the present invention, the adhesive 3 supplied in a substantially rectangular shape by superimposing the first substrate 1 and the second substrate 2 is not semi-cured. The corner portion 3a1 serving as the specific portion 3a 'is a corner that becomes the unfilled region D1 in the rectangular display region D due to capillary action, natural flow, or pressurized flow generated between the first substrate 1 and the second substrate 2. Each extends and extends toward the portion D2, and reaches the corner portion D2 of the unfilled region D1.
Therefore, the corner portion D <b> 2 of the display area D can be reliably filled with the adhesive 3.
As a result, even if the bonding device A has a sufficient margin in the blank area from the rectangular display area D to the outer edges of the first substrate 1 and the second substrate 2, such as LCD or LCM, There is an advantage that the adhesive 3 can be prevented from protruding outside the first substrate 1 and the second substrate 2, the formability of the adhesive 3 is excellent, the yield is greatly improved, and the productivity can be further improved. .

Further, in the case of the example shown in FIG. 4B, the area of the specific part 3a ′ in an unsemi-cured state is increased by the side part 3a3 and bonded compared to the example shown in FIG. Since the extension flow rate of the agent 3 increases, the corner portion D2 of the display region D can be more reliably filled with the adhesive 3. Thereby, the adhesive 3 required for the extension is not insufficient, and the corner portion D2 of the display region D can be filled without being thinner than the other filling portions 3b.

Further, in the case of the example shown in FIG. 4C, the area of the specific part 3a ′ in an unsemi-cured state is increased by the amount of the adjacent part 3a4 compared to the example shown in FIG. As the extension flow rate of the agent 3 increases, the side 3L adjacent to the quadrant is temporarily cured as compared with the example shown in FIG. 4B, and thus the adhesive 3 protrudes from the side 3L to the unfilled region D1. While preventing, the corner | angular part D2 of the display area D can be more reliably filled with the adhesive agent 3. FIG. Thereby, the adhesive 3 required for the extension is not insufficient, and the corner portion D2 of the display region D can be filled without being thinner than the other filling portions 3b.

In the second embodiment, as shown in FIGS. 5 and 6, the adhesive 3 is supplied along the boundary line inside the rectangular display region D in the supply process, and the outer edge portion of the adhesive 3 is used in the semi-curing process. The filling part 3b from which at least the side part 3a2 is removed as the specific part 3a 'in 3a is semi-cured, and in the bonding process, at least the side part 3a2 to be the specific part 3a' is separated from the unfilled area D4 outside the display area D. The configuration in which the first substrate 1 and the second substrate 2 are extended toward the bonding space S between the

outer edge portions

1b and 2b is different from the first embodiment shown in FIGS. This is the same as the first embodiment shown in FIG.
The bonding device A of Example 2 is a case of an electronic component having a relatively large margin in the blank portion from the rectangular display region D to the outer edges of the first substrate 1 and the second substrate 2, such as LCM. Show.

In the example shown in FIGS. 5 and 6, the first substrate 1 has a frame-shaped protective frame 11, and a plurality of components are stacked in the Z direction and supported by the protective frame 11 so as to be integrally assembled. Yes. In the illustrated first substrate 1, the front-side video display component 12 and the back-side backlight unit 13 are assembled and fixed by a metal protective frame 11.
The mask 4 used in the semi-curing process uses a transparent plate 4d to which a frame-shaped light-shielding portion 4c smaller than the protective frame 11 is fixed, and has four side portions 3a2 on the outer edge portion 3a of the substantially rectangular adhesive 3; The part which becomes a quadrant of the four corners is covered with a light-shielding part 4c, and is partially semi-cured so as to continue in a frame shape over the entire circumference of the outer edge part 3a. That is, the case where the “specific part 3a ′ in the outer edge 3a of the adhesive 3” that is semi-cured by the semi-curing process is the entire circumference of the outer edge 3a including all the quadrants and the side part 3a2. Show.
Although not shown as another example, a protective frame 11 made of another material is used in place of the metal protective frame 11, or a through hole is opened in a transparent portion excluding the frame-shaped light shielding portion 4c. It is also possible to use semi-cured materials, to be semi-cured by irradiating heat rays or the like from a heat source instead of the light rays L such as ultraviolet rays, or to replace the first substrate 1 with one without the frame-shaped protective frame 11. is there.

According to such a manufacturing method of the bonding device A according to Example 2 of the present invention, the first substrate 1 and the second substrate 2 are superposed to each other in the non-cured state in the bonding space S supplied in a substantially rectangular shape. At least the side portion 3a2 serving as the specific portion 3a 'becomes an unfilled region D4 outside the rectangular display region D due to capillary action, natural flow, or pressurized flow generated between the first substrate 1 and the second substrate 2. Each of the first substrate 1 and the second substrate 2 extends and extends toward the bonding space S between the

outer edge portions

1b and 2b of the second substrate 2 and reaches the bonding space S.
Therefore, the space between the first substrate 1 and the second substrate 2 can be reliably filled with the adhesive 3 to the vicinity of the

outer edge portions

1b and 2b.
As a result, when the bonding device A has a relatively large margin in the blank area from the rectangular display area D to the outer edges of the first substrate 1 and the second substrate 2, such as LCM, the first substrate 1 There is an advantage that the adhesive strength of the second substrate 2 can be improved.

In particular, in the example shown in FIGS. 5 and 6, the adhesive strength between the protective frame 11 of the first substrate 1 and the second substrate 2 can be increased.
Further, when the first substrate 1 is an electronic component in which a plurality of components are stacked in the Z direction and supported and fixed by the protective frame 11, the liquid is discharged from the gap between the protective frame 11 and the video display component 12 on the front side. If soaked, it would damage the internal electronic circuit and cause failure, so an adhesive that soaked through the gap could not be used. However, by using a highly viscous adhesive 3 such as an ultraviolet curable adhesive, it is possible to prevent failure due to penetration into the interior from the gap between the protective frame 11 and the image display component 12 on the surface side.

In the previous embodiment, the method for bonding the first substrate 1 and the second substrate 2 in the bonding process has not been described in detail. However, the first fixed plate that holds the first substrate 1 detachably, Either one of the second surface plates for detachably holding the two substrates 2 or both the first surface plate and the second surface plate are provided with a buffer material, and the first surface plate and the second surface plate are parallel to each other. It is preferable to ensure the parallelism between the first substrate 1 and the second substrate 2 regardless of the degree.
Furthermore, in the previous embodiment, all of the filling portion 3b from which the specific portion 3a 'in the outer edge portion 3a of the adhesive 3 is removed is semi-cured. However, the present invention is not limited to this. May be semi-cured in a state where a part of the center side of the filling portion 3b is partially removed.

A bonding device 1 1st board | substrate 1a Opposing surface 1b Outer edge part 2 2nd board | substrate 2a Opposing surface 2b Outer edge part 3 Adhesive 3a Outer edge part 3a 'Specific part 3a1 Corner | angular part 3a2 Side part 3b Filling part 3b' Semi-hardening part 3c Surface D Display area D1 Unfilled area D2 Corner D4 Unfilled area P Part facing a specific part S Joining space

Claims

The first substrate and the second substrate facing each other are bonded together with a liquid adhesive filled therebetween, and a manufacturing method of a bonding device having a display region,
A supply step of supplying the adhesive to either the first substrate or the second substrate or to both the first substrate and the second substrate so as to be disposed in the display area;
A semi-curing step of semi-curing the filling part from which the specific part is removed at the outer edge of the adhesive so that the viscosity becomes higher than the viscosity of the other part while maintaining the adhesiveness;
A bonding step of overlapping the first substrate and the second substrate so that the adhesive is sandwiched between the opposing surfaces;
In the attaching step, the specific portion in the outer edge portion of the adhesive that has not been semi-cured in the semi-curing step is placed in an unfilled region of the adhesive disposed outside the outer edge portion of the adhesive. The manufacturing method of the bonding device characterized by extending toward the direction.
In the bonding step, either one or both of the first substrate and the second substrate are entirely pressurized, and either the first substrate or the second substrate is opposed to the adhesive. 2. The sticking according to claim 1, wherein the facing surfaces are brought into close contact with each other, and the facing surfaces are brought close to each other so that the specific portion of the outer edge portion of the adhesive is spread along the facing surface. A method for manufacturing a composite device.
After the bonding step, the first substrate and the second substrate are left in a superposed state for a predetermined time, and the specific portion of the outer edge portion of the adhesive is naturally extended along the facing surface. The manufacturing method of the bonding device of Claim 1 or 2 characterized by including a process.
In the bonding step, in either one or both of the superimposed first substrate and second substrate, a part facing the specific part in the outer edge part of the adhesive is partially pressurized, The manufacturing method of the bonding device according to 1, 2 or 3, wherein the specific parts are brought close to each other so as to extend toward the unfilled region.
In the supplying step, the adhesive is supplied along the boundary line inside the rectangular display area,
In the semi-curing step, semi-curing the filling part from which the corner part is removed as the specific part in the outer edge part of the adhesive,
The pasting process according to any one of claims 1 to 4, wherein, in the attaching step, the corner portion serving as the specific portion is extended toward a corner portion serving as the unfilled region in the display region. A method for manufacturing a composite device.
In the supplying step, the adhesive is supplied along the boundary line inside the rectangular display area,
In the semi-curing step, the filling part from which at least a side part is removed as the specific part in the outer edge part of the adhesive is semi-cured,
In the bonding step, extending at least the side portion serving as the specific portion toward a bonding space between the outer edge portion of the first substrate and the second substrate serving as the unfilled region outside the display region. The method for producing a bonding device according to any one of claims 1 to 4, characterized in that: