WO2014171702A1 - Fingerprint sensor module, portable electronic device comprising same, and manufacturing method therefor - Google Patents

Abstract

The present invention relates to a fingerprint sensor module having an excellent sensitivity, a portable electronic device comprising the same, and a manufacturing method therefor. The fingerprint sensor module according to an embodiment of the present invention comprises a fingerprint sensor and a bracket on which the fingerprint sensor is positioned. Here, the fingerprint sensor comprises: a sensing unit formed on a substrate to receive a difference between electric signals of a ridge and a valley of a fingerprint of a finger; and a sensor circuit unit for sensing and processing an image of the fingerprint. The bracket comprises a cover layer for covering the upper surface of the sensing portion; and a touch surface formed on the upper surface of the cover layer. Further, the touch surface has a multi-coating layer formed thereon to face the upper surface of the sensing portion received in the bracket, and the sum of the thicknesses of the cover layer and the multi-coating layer is in a range of 40 to 60 µm.

Description

Fingerprint sensor module, portable electronic device having same, and manufacturing method thereof

The present invention relates to a fingerprint sensor module, a portable electronic device having the same, and a manufacturing method thereof, and more particularly, to a fingerprint sensor module having a superior sensing sensitivity, a portable electronic device having the same, and a manufacturing method thereof.

Recently, as public attention has focused on portable electronic devices, such as smartphones and tablet PCs, research and development in the related technical fields are actively progressing.

BACKGROUND OF THE INVENTION Portable electronic devices often incorporate a touch screen integrated with a display, which is a display device, as one of input devices for receiving a specific command from a user. In addition, the portable electronic device may have various function keys or soft keys as input devices other than the touch screen.

These function keys or softkeys can act as home keys, for example, to exit a running app and return to the home screen, or to return the user interface one layer back, or frequently. Can act as a menu key to call a menu to write. In addition, these function keys or softkeys may be implemented as physical buttons. In addition, the function key or soft key may be implemented in a manner of sensing a capacitance of a conductor, a method of sensing an electromagnetic wave of an electromagnetic pen, or a complex method in which both methods are implemented.

On the other hand, as the use of smart phones has been rapidly expanded to services requiring security, the trend of mounting a fingerprint sensor on a smart phone is increasing. The fingerprint sensor may be implemented integrally with a physical function key.

The fingerprint sensor is a sensor that detects a human finger fingerprint. The fingerprint sensor protects data stored in a portable electronic device and prevents a security accident by performing a user registration or authentication procedure through the fingerprint sensor.

On the other hand, in order to mount the fingerprint sensor to a variety of electronic devices, the fingerprint sensor is manufactured in the form of a module including a peripheral component or structure, in order to match the color of the fingerprint sensor with the color of the electronic device is mounted. For other reasons, it is necessary to implement color on the fingerprint sensor base material including the fingerprint sensor.

In order to realize the color on the fingerprint sensor base material, conventionally, methods such as coating using a colored paint, ultraviolet (UV) curing agent deposition, and the like have been used. By the way, when implementing the color on the fingerprint sensor base material by the conventional method, there is a limit to properly ensure the interlayer configuration and thickness of the coating film. If the coating film is not formed to a sufficient thickness, not only color implementation is difficult, but also a possibility of surface contamination, scratches, and other damages on the fingerprint sensor may occur. These damages adversely affect the image of the fingerprint sensed by the fingerprint sensor.

In addition, in the fingerprint sensor, in particular, the electrostatic fingerprint sensor, the operability changes depending on the thickness of the coating film on the fingerprint sensor base material. In particular, the thicker the coating on the fingerprint sensor base material, the worse the sensing response characteristics of the fingerprint sensor, there is a limit in the thickness of the coating film to implement the color.

Recently, a fingerprint sensor module designed in a chip-on-film (BOC) or ball grid array (BGA) method has been developed in order to manufacture the fingerprint sensor module at a low cost in order to mount it on a portable device. In this fingerprint sensor module, the fingerprint detection IC is separated from the sensing area.

The fingerprint sensor module includes a fingerprint sensor and a bracket or a substrate on which the fingerprint sensor is fixed. Therefore, the fingerprint sensor and the bracket coupling process is required to increase the efficiency and productivity of the process, as well as the process of the bracket is required to increase the sensing sensitivity.

That is, the thickness from the sensing area of the fingerprint sensor to the final cover in contact with the user's finger does not affect the function of the electronic device (for example, the fingerprint sensing sensitivity), while the appearance and reliability of the electronic device are problematic. There is a need for a fingerprint sensor module, a portable electronic device including the same, and a manufacturing method thereof.

In order to solve the above problems, the technical problem to be achieved by the present invention is to provide a fingerprint sensor module, a portable electronic device having the same and a method of manufacturing the same having excellent sensing sensitivity while preventing appearance defects or damage.

In order to achieve the above technical problem, an embodiment of the present invention is a fingerprint sensor module including a fingerprint sensor and a bracket for seating the fingerprint sensor, the fingerprint sensor, the fingerprint of the finger located on the upper side of the substrate and And a sensing unit formed on the substrate to receive a difference in the electrical signal of the bone, and a sensor circuit unit configured to sense and process a fingerprint image, wherein the bracket includes a cover layer formed to cover an upper surface of the sensing unit, and the cover. It has a touch surface formed on the upper surface of the layer, the multi-coating layer is provided on the touch surface to face the upper surface of the sensing unit accommodated in the bracket, the sum of the thickness of the cover layer and the multi-coating layer is 40 ~ 60㎛ It provides a fingerprint sensor module.

In one embodiment of the present invention, the multi-coating layer may include a primer layer, a color paint layer and a protective film layer.

In one embodiment of the present invention, the cover layer or the protective film layer may include a ferroelectric.

In one embodiment of the present invention, the thickness of the primer layer is 2 ~ 3㎛, the thickness of the color coating layer is 3 ~ 5㎛, the thickness of the protective film layer may be 20 ~ 22㎛.

In one embodiment of the present invention, the thickness of the cover layer may be 15 ~ 30㎛.

In one embodiment of the present invention, the fingerprint sensor may be fixed by a molding material filled in the bracket or an additional bracket coupled to the bracket.

On the other hand, in order to achieve the above technical problem, an embodiment of the present invention provides a portable electronic device having the above-described fingerprint sensor module.

On the other hand, in order to achieve the technical problem, an embodiment of the present invention a) a sensing unit formed on the substrate to receive the difference between the electrical signal of the peak and the valley of the fingerprint of the finger located on the substrate and the fingerprint image Mounting a fingerprint sensor having a sensor circuit unit to sense and process the bracket, and allowing the sensing unit to be received in the bracket; And b) providing a multi-coating layer on the touch surface formed on the upper surface of the cover layer formed on the bracket to cover the upper surface of the sensing unit so as to face the upper surface of the sensing unit. The sum of the thicknesses of the coating layer provides a manufacturing method of the fingerprint sensor module is formed to 40 ~ 60㎛.

In one embodiment of the present invention, in the step (b) of preparing the multi-coating layer, the multi-coating layer may be formed in the order of a primer layer, a color paint layer and a protective film layer.

In one embodiment of the present invention, the cover layer or the protective film layer may include a ferroelectric.

In one embodiment of the present invention, the primer layer is formed with a thickness of 2 ~ 3㎛, the color paint layer is formed with a thickness of 3 ~ 5㎛, the protective layer is formed with a thickness of 20 ~ 22㎛ Can be.

In one embodiment of the present invention, the cover layer may have a thickness of 15 ~ 30㎛.

In an embodiment of the present disclosure, the method may further include polishing the touch surface before the preparing of the multi-coating layer (step b).

In one embodiment of the present invention, after the step of mounting the fingerprint sensor to the bracket, and the sensing unit is accommodated in the bracket (step a), by filling the molding material or the additional bracket to the bracket to the The method may further include fixing the fingerprint sensor.

According to an embodiment of the present invention, it is possible to provide a fingerprint sensor module, a portable electronic device including the same, and a method of manufacturing the same, in which a fingerprint sensor is firmly modularized and sensing sensitivity is improved. In particular, it is possible to provide a fingerprint sensor module capable of stably supporting a fingerprint sensor designed in a COF or BGA method, a portable electronic device including the same, and a method of manufacturing the same.

In addition, according to an embodiment of the present invention, while efficiently manufacturing the upper surface portion of the fingerprint sensor module provides a fingerprint sensor module having no problem in the appearance, function, and reliability of the electronic device, a portable electronic device comprising the same and a method of manufacturing can do.

In addition, according to an embodiment of the present invention, by managing the sum of the thickness of the cover layer and the multi-coating layer to 40 ~ 60㎛, it can be effective effective sensing when fingerprint detection.

The effects of the present invention are not limited to the above-described effects, but should be understood to include all the effects deduced from the configuration of the invention described in the detailed description or claims of the present invention.

1 is a perspective view showing a fingerprint sensor module according to an embodiment of the present invention.

2 is an exemplary cross-sectional view taken along the line A-A of FIG.

3 is an exemplary view showing a manufacturing process of a fingerprint sensor module according to an embodiment of the present invention.

Figure 4 is a cross-sectional view showing a manufacturing process of the fingerprint sensor module according to an embodiment of the present invention.

5 is a schematic diagram showing a process of preparing a ceramic paint by the sol-gel method in the fingerprint sensor module according to an embodiment of the present invention.

6 is a cross-sectional view illustrating a fingerprint sensor module according to an embodiment of the present invention.

7 is an exemplary view showing a fingerprint sensor according to an embodiment of the present invention.

8 is a schematic view showing the structure of a fingerprint sensor according to an embodiment of the present invention.

9 is an exemplary view schematically showing the operation of the fingerprint sensor provided in the fingerprint sensor module according to an embodiment of the present invention.

10 is an exemplary view schematically showing a fingerprint sensor provided in the fingerprint sensor module according to another embodiment of the present invention.

11 is an exemplary view schematically showing a fingerprint sensor provided in the fingerprint sensor module according to another embodiment of the present invention.

12 is a perspective view showing a fingerprint sensor module according to another embodiment of the present invention.

13 is a cross-sectional view showing a fingerprint sensor module according to another embodiment of the present invention.

14 is a cross-sectional view showing a manufacturing process of a fingerprint sensor module according to another embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

10,3010: fingerprint sensor module

200,1200,2200: fingerprint sensor

220,1220,2220: sensor circuit

310,3310: bracket

312: home

314,3314: touch surface

315,3315: cover layer

340: jig

350: molding material

360: metal plate

400: ferroelectric

500: multi-coating layer

502: primer layer

503: color paint layer

504: protective film layer

3320: additional bracket

Hereinafter, with reference to the accompanying drawings will be described the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention. In the drawings, parts irrelevant to the description are omitted in order to clearly describe the present invention, and like reference numerals designate like parts throughout the specification.

Throughout the specification, when a part is "connected" to another part, it includes not only "directly connected" but also "indirectly connected" with another member in between. . In addition, when a part is said to "include" a certain component, this means that it may further include other components, without excluding the other components unless otherwise stated.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a perspective view showing a fingerprint sensor module according to an embodiment of the present invention, Figure 2 is a cross-sectional view of the A-A line of FIG.

As shown in FIGS. 1 and 2, the fingerprint sensor module 10 includes a fingerprint sensor 200, a bracket 310, and a multi-coating layer 500.

The fingerprint sensor module 10 may be provided in an electronic device, especially a portable electronic device. Here, the portable electronic device includes a mobile phone, a smart phone, a PDA, a tablet PC, a notebook computer, a portable sound player (MP3 player), and all portable electronic devices of a similar type.

The fingerprint sensor 200 may have a sensing unit 210 formed on the substrate 201 using a conductor, and a sensor circuit unit 220 electrically connected to the sensing unit 210. The fingerprint sensor 200 may sense a fingerprint image by receiving a signal transmitted through a user's finger.

Bracket 310 is a member for receiving and seating the fingerprint sensor 200, while determining the overall shape of the fingerprint sensor module 10 while protecting the fingerprint sensor 200. The bracket 310 may be a mold product formed by a mold. The bracket 310 has a cover layer 315 covering an upper portion of the fingerprint sensor 200, more specifically, the sensing unit 210, and a touch surface 314 is formed on an upper surface of the cover layer 315. That is, the cover layer 315 may be provided between the touch surface 314 from the upper surface of the sensing unit 210. The touch surface 314 is a part where a user's touch is made, and receives a signal transmitted through a user (exactly a user's finger).

The multi-coating layer 500 may be positioned on the touch surface 314 of the bracket 310 to face the upper surface of the sensing unit 210 of the fingerprint sensor 200. In this case, the sum of the thickness D1 of the cover layer 315 and the thickness D2 of the multi-coating layer 500 may be 40 to 60 μm, through which effective effective sensing may be possible when detecting a fingerprint.

3 is an exemplary view showing a manufacturing process of a fingerprint sensor module according to an embodiment of the present invention, Figure 4 is a cross-sectional view showing a manufacturing process of a fingerprint sensor module according to an embodiment of the present invention.

As shown in FIGS. 3 and 4, the bracket 310 has a groove 312 on the inside thereof, and a touch surface 314 protruding corresponding to the shape of the groove 312 on the opposite side of the surface on which the groove 312 is formed. ) Is formed.

The bracket 310 has a cover layer 315 between the bottom surface 313 of the groove 312 and the touch surface 314, and the thickness D1 of the cover layer 315 may be 15 to 30 μm. . Herein, the thickness D1 of the cover layer 315 refers to a thickness measured vertically from the groove 312 to the touch surface 314. That is, the cover layer 315 may be a thickness between the upper surface of the sensing unit 210 and the touch surface 314. If the thickness of the cover layer 315 is too thin, the fingerprint sensor 200 may not be stably accommodated. On the contrary, if the cover layer 315 is too thick, the sensing capability of the fingerprint sensor 200 may be weakened.

The cover layer 315 may include a ferroelectric 400 to increase the dielectric constant. In more detail, when the dielectric constant is high, the fingerprint sensor reduces the loss of the signal that receives the image in the active state, thereby allowing the thickness of the cover layer 315 and the multi-coating layer 500 to be more freely implemented.

The ferroelectric 400 will be described in more detail. The ferroelectric 400 is a kind of dielectric that is an electrically insulator, and refers to materials in which positive and negative electric polarization occurs by itself without applying a voltage from the outside. Representative materials include Al 2 O 3, BaTio 3 (BTO), SrTio 3 (STO), (Ba, Sr) Tio 3 (BST).

The ferroelectric 400 may be mixed in the bracket 310 in the form of powder or liquid, etc., and may be included in the entire bracket 310. Through this, the bracket 310 may be embodied in an EMC mold including the ferroelectric 400. have. The EMC mold including the ferroelectric 400 has a fingerprint on board (COB) type fingerprint sensor and a ball grid array (BGA) type fingerprint sensor, in addition to a chip on film (COF) type fingerprint sensor composed of a flexible substrate as in the present embodiment. And it can be applied to WLP (Wafer Level Package) type fingerprint sensor.

As described above, the ferroelectric 400 is preferably included in the cover layer 315, but may be entirely included in the bracket 310 for convenience of the process.

In addition, the bracket 310 may be made of any one of nylon or polyamide material including epoxy molding compound (EMC), fluorine resin, and 20 to 40% glass. In this case, the glass may increase the strength of the bracket to protect the fingerprint sensor from external impact. However, when the ratio of glass is too high, it is preferable that the glass is added at a ratio of 20 to 40% since the probability of defects during machining increases. Further, the fluorine resin may be polyvinylidene fluoride (PVDF) having a high dielectric constant. If the dielectric constant is high, the detection signal is amplified to facilitate fingerprint recognition, and can be free from thickness during post processing.

In the groove 312, the sensing unit 210 and the sensor circuit unit 220 of the fingerprint sensor 200 are accommodated. In this case, a predetermined amount of epoxy resin 330 may be injected into the groove 312 as an adhesive.

As shown in FIGS. 3B and 4B, the flexible circuit 201 is supported on the step 316 formed at the edge of the groove 312 so as to support the sensor circuit part of the fingerprint sensor 200. 220 may be seated facing the top surface. In this process, the fingerprint sensor 200 may be compressed and seated by the same jig (JIG) 340 as the outer shape of the fingerprint sensor 200. The flatness of the flexible material substrate 201 of the fingerprint sensor 200 may be secured by the fingerprint sensor 200 being compressed and fixed to the bracket 310 provided in advance.

After mounting of the fingerprint sensor 200 is completed, as shown in FIG. 4C, the jig 340 may be removed from the groove 312.

Subsequently, as shown in FIGS. 3C to 3D and 4D, after removing the jig 340, the groove 312 of the bracket 310 may be filled with the molding material 350. have. As shown in FIG. 3B, the sensing unit 210 and the sensor circuit unit 220 are accommodated in the groove 312, and an empty space exists in addition to the accommodated portion. If the empty space is left as it is, the fingerprint sensor 200 may not be fixed and may move in the empty space, thereby filling the molding material 350 in the empty space. As the molding material 350, a liquid polymer may be used. For example, any one of an epoxy molding compound, an epoxy resin, and a putty may be used. Epoxy molding compound (EMC) may be a liquid epoxy molding compound (EMC). Epoxy molding compound (EMC) is harder than the PC series formed by the normal injection (hard) can prevent the tolerance in advance, it is possible to further improve the flatness. In addition, there is an effect of reducing the chip marks appearing in the general injection even after the high-temperature process. The molding member 350 may increase the reliability of the fingerprint sensor 200 by bringing the sensing unit 210 into close contact with the bottom surface of the groove 312.

In addition, the molding material may be a mechanism having a predetermined shape. The instrument can also increase the sensing reliability by fixing the fingerprint sensor 200 like the liquid polymer. The appliance may be designed to fit the size of the groove 312 may be pressed or fastened using a separate fastening means. An example in which the molding material is used as a mechanism having a predetermined shape will be described later.

FIG. 3D shows the bracket 310 of FIG. 3C upside down. As described above, the touch surface 314 corresponding to the shape of the groove 312 protrudes from the opposite side of the groove 312.

As shown in FIGS. 3E and 4E, the multi-coating layer 500 may be provided on the touch surface 314 of the bracket 310.

The multi-coating layer 500 may perform various functions such as implementing colors in the fingerprint sensor module 10 or reinforcing the upper surface side strength of the fingerprint sensor module 10.

The multicoat layer 500 may include a primer layer 502, a color paint layer 503, and a protective film layer 504, and the multicoat layer 500 may include a primer layer 502 and a color paint layer 503. The protective layer 504 may be formed in the order of the protection layer 504.

The primer layer 502 may be provided on the touch surface 314 to connect the color paint layer 503, and the color paint layer 503 may perform a color implementation function.

The primer layer 502 may have a thickness of 2 to 3 μm, and the color paint layer 503 may have a thickness of 3 to 5 μm.

In addition, the protective layer 504 may be a ceramic coating layer including a UV protective layer or ceramic. In addition, the above-described ferroelectric 400 may be further included in the passivation layer 504. The ferroelectric 400 may be configured to be included in both the cover layer 315 and the passivation layer 504, or may be configured to be included in the cover layer 315 or the passivation layer 504. The protective layer 504 may have a thickness of 20 to 22 μm.

The thickness D2 of the multi-coat layer 500 may be formed to 25 ~ 30㎛.

In addition, the sum of the thickness D1 of the cover layer 315 and the thickness D2 of the multi-coating layer 500 may be 40 to 60 μm.

FIG. 5 is a schematic diagram illustrating a process of preparing a ceramic paint by a sol-gel method in a fingerprint sensor module according to an embodiment of the present invention, which will be described below with reference to FIG. 5.

In order to make the protective film layer 504 a ceramic coating layer, a ceramic paint is prepared. Ceramic paints may be prepared, for example, by using a sol-gel method in which two or more solutions are stirred to prepare a ceramic.

That is, as shown in Fig. 5A, liquid A and liquid B are prepared. Then, the liquid A is shaken up, down, left, and right for a predetermined time (for example, 30 minutes) (FIG. 5B). Next, after mixing B liquid with A liquid, it stirs for predetermined time (for example, 5 hours) (FIG. 5 (c)). When the two-component ceramic paint is formed in this process, it can be used after sufficiently shaking before application (spray) (Fig. 5 (d)). The passivation layer 504 may be formed by spraying the previously prepared ceramic paint on the color paint layer 503.

The ceramic paint can be made, for example, by the sol-gel method as described above, and the ceramic coating layer is formed on the color paint layer using this ceramic paint.

Ceramics have a high dielectric constant, which reduces the loss of a signal that the fingerprint sensor accepts images in the active state. That is, since the ceramic coating layer acts as a dielectric layer, the electric signal lines directed to the fingerprint sensor 200 through the user's finger (not shown) may be more densely formed. That is, in the fingerprint sensor module 10 according to an embodiment of the present invention, the loss of the sensing signal is reduced. In addition, ceramics have high stain resistance such as anti-fingerprint and water repellency. Therefore, it is possible to obtain a clearer fingerprint image by reducing the blurring of the image due to surface contamination. In addition, through the combination of inorganic pigments excellent in heat resistance, hiding power, weather resistance in the ceramic paint, it is possible to implement a variety of colors.

The dielectric constant of the ceramic coating layer may be predetermined according to the driving frequency of the fingerprint sensor 200, for example, the dielectric constant may be 5 or more. In detail, when the user's finger touches the fingerprint sensor module 10 or when the user's finger approaches the fingerprint sensor module 10 sufficiently to enable fingerprint recognition, the driving signal sent toward the user's finger Is received by the sensing unit 210 via the user. When using a ceramic coating layer having a dielectric constant suitable for the driving frequency of the sensing unit 210 (ie, the protective layer 504), the signal is concentrated on the ceramic coating layer and is received in the image sensing region. Therefore, the loss of the signal is reduced and the operability of the fingerprint sensor 200 is improved.

In the embodiment of the present invention by forming the protective film layer 504 of the multi-coating layer 500 with a ceramic coating layer, the loss of signal of the fingerprint sensor as well as the effect of low film thickness, wear resistance and heat resistance, improve the operation of the fingerprint sensor. By reducing the operation can be improved.

In addition, before the multi-coating layer 500 is provided on the touch surface 314 of the bracket 310, a polishing process for increasing thickness and flatness of the cover layer 315 of the bracket 310 may be further performed. At this time, the polishing process is made up to a thickness that can be sensed by the fingerprint sensor 200, for this purpose, the thickness of the cover layer 315 of the bracket 310 may be 15 to 30㎛. For example, when the cover layer 315 has a thickness of 100 μm, the cover layer 315 is polished so that the cover layer 315 has a thickness of 15 to 30 μm.

6 is a cross-sectional view illustrating a fingerprint sensor module according to an embodiment of the present invention. As shown in FIG. 6, a metal plate 360 may be further provided on the molding member 350. The metal plate 360 may be provided on the molding member 350 to seal and seal the portion where the molding member 350 is exposed, and to support the fingerprint sensor module 10 to reinforce the strength of the fingerprint sensor module 10. The metal plate 360 may be made of stainless steel.

On the other hand, Figure 7 is an exemplary view showing a fingerprint sensor according to an embodiment of the present invention, Figure 8 is a schematic diagram showing the structure of the fingerprint sensor according to an embodiment of the present invention, Figure 9 is a view of the present invention Exemplary diagrams illustrating operations of a fingerprint sensor provided in a fingerprint sensor module according to an exemplary embodiment.

First, as shown in FIG. 7, the fingerprint sensor 200 may include a substrate 201, a sensing unit 210, a sensor circuit unit 220, and an external interface connection unit 221 of a flexible material.

The sensing unit 210 may include a driving electrode and a receiving electrode made of a conductor, and may be installed in the substrate 201. The sensing unit 210 may receive a difference between an electrical signal of a valley and a ridge of a fingerprint of a finger located on the substrate 201.

The substrate 201 is formed of a flexible printed circuit board (FPCB) made of a flexible material, and also serves as a substrate of the sensor circuit unit 220 while protecting the driving electrode and the receiving electrode.

The sensor circuit unit 220 is an integrated circuit (IC) in which an electronic circuit for sensing a fingerprint image and processing a fingerprint image is integrated, and is electrically connected to a driving electrode and a receiving electrode of the sensing unit 210. Since the substrate 201 is made of a flexible printed circuit board (FPCB), the sensor circuit unit 220 may be mounted on the bottom surface of the substrate 201.

The external interface connector 221 is formed by extending the flexible printed circuit board FPCB of the substrate 201 described above. A wire is formed inside the external interface connector 221, and a connector 223 is formed at one end thereof so as to be connected to the external interface. The external interface connector 221 may be connected to, for example, a portable device such as a smartphone. The fingerprint sensor according to an embodiment of the present invention may have an “I” shaped structure in which the sensing unit 210 and the external interface connection unit 221 are coupled in the same direction as shown in FIG. 7.

On the other hand, the fingerprint sensor according to an embodiment of the present invention may have a “T” shaped structure in which the sensing unit and the external interface connection unit are perpendicular to each other. That is, as shown in FIG. 8, the fingerprint sensor 200 may include a sensing unit 210 provided on the upper surface of the substrate 201 and a sensor circuit unit 220 provided on the lower surface of the substrate 201. FIG. 8A illustrates a top surface of the substrate 201 and FIG. 8B illustrates a bottom surface of the substrate 201, and FIG. 8C illustrates a sensing unit 210 and a sensor circuit unit. 220 is a diagram schematically showing the electrical connection relationship.

The substrate 201 may be a flexible substrate, and may be made of, for example, a polymide film, but is not limited thereto.

The sensing unit 210 may include a plurality of driving electrodes 211 and image receiving electrodes 212 formed on the substrate 201. The driving electrode 211 and the image receiving electrode 212 may be composed of conductor lines.

The driving electrode 211 receives a driving signal from the sensor circuit unit 220 and transmits a signal to the image receiving electrode 212. The image receiving electrode 212 receives a signal transmitted from the driving electrode 211 through a user (preferably a user's finger).

One end portion of the image receiving electrode 212 positioned on the upper surface of the substrate 201 is formed to extend in the horizontal direction. The plurality of driving electrodes 211 are formed to be spaced apart from each other so as to be perpendicular to the direction in which the image receiving electrode 212 extends (see FIG. 8A). The image receiving electrode 212 is electrically connected to the sensor circuit 220 on the bottom surface of the substrate 201.

One end of the plurality of driving electrodes 211 is spaced apart from the image receiving electrode 212 by a predetermined distance. In addition, the other ends of the plurality of driving electrodes 211 are electrically connected to the sensor circuit 220 on the bottom surface of the substrate 201.

As shown in FIG. 9, the driving electrode 211 and the image receiving electrode 212 are spaced apart from each other, and the driving signal transmitted from the driving electrode 211 is received by the image receiving electrode 212 via the user U. do. At this time, it is possible to recognize the fingerprint by measuring a change in the electric field according to the presence or absence of the fingerprint bone or the fingerprint acid located on the user's finger as a signal.

Referring back to FIGS. 8B and 8C, the sensor circuit unit 220 may have an external interface connection unit 221 electrically connected to the outside.

The fingerprint sensor 200 may be implemented by a chip-on-film (COF) or ball grid array (BGA) method. In particular, only the sensing unit 210, that is, the driving electrode 211 and the image receiving electrode 212 is formed on the upper surface of the substrate 201, and the sensor circuit unit 220 connected to the sensing unit 210 on the lower surface of the substrate 201. ), The IC size of the sensor circuit unit 220 can be made small. Through this, the spatial constraints in which the sensing unit 210 is installed can be eliminated, and the overall appearance can be made compact.

In addition, by not providing a sensor circuit on the upper surface of the substrate 201, it is easier to install the glass on the fingerprint sensor module, which is a particularly useful effect in a portable electronic device such as a smartphone.

Meanwhile, FIG. 10 is an exemplary view schematically showing a fingerprint sensor provided in a fingerprint sensor module according to another embodiment of the present invention. As shown in FIG. 10, the sensor circuit unit 1220 of the fingerprint sensor 1200 is a sensing unit. It may be installed at a considerable distance from 1210. That is, the above-described sensor circuit unit 220 (see FIGS. 7 and 8) is located inside the bracket 310 (see FIG. 1), while the sensor circuit unit 1220 illustrated in FIG. 10 may be installed outside the bracket. Can be. Through this, impact and heat that may be generated in the coupling process between the bracket and the fingerprint sensor 1200 and in the process of fixing the fingerprint sensor 1200 may be prevented from being applied directly to the sensor circuit unit 1220. In addition, since the sensor circuit unit 1220 can be installed on any portion of the substrate 1201, it may be flexibly installed and applied according to the structural characteristics of the portable electronic device to be assembled.

As described above, the fingerprint sensor may be formed not only in a separate type in which the sensor circuit part and the sensing part are separately installed, but also in an integral type in which the sensor circuit part and the sensing part are integrally formed.

FIG. 11 is a schematic view showing a fingerprint sensor provided in a fingerprint sensor module according to another embodiment of the present invention. As shown in FIG. 11, the fingerprint sensor 2200 may include a ball grid array (BGA). ) Type.

That is, the terminals 2250 may be arranged in a two-dimensional array on the substrate 2201, and the bumps 2221 formed on the bottom surface of the sensor circuit unit 2220 may be connected to the terminals 2250. The terminal 2250 and the bumps 2221 may be connected by soldering.

The substrate 2201 may be, for example, a printed circuit board (PCB) to be electrically connected to the sensor circuit unit 2220 to transmit electrical signal information. Although not shown, a lead frame may be attached to the lower portion of the substrate 2201 by resin injection or surface mounting technology (SMT).

In the above, the fingerprint sensor has been described mainly as a separate type, but when the sensor circuit unit and the sensing unit are integrated, the case of the AREA type having a plurality of image receivers is also included in the scope of the present invention.

12 is a perspective view showing a fingerprint sensor module according to another embodiment of the present invention, Figure 13 is a cross-sectional view showing a fingerprint sensor module according to another embodiment of the present invention, Figure 14 is another embodiment of the present invention Cross-sectional view showing the manufacturing process of the fingerprint sensor module according to. In the present embodiment, the fingerprint sensor may be fixed by the additional bracket, and the other configuration is the same as the embodiment, so description thereof is omitted.

As shown in FIGS. 12 to 14, the bracket 3310 accommodates the sensor circuit unit 220 of the fingerprint sensor 200 in the first groove 3311 formed therein, and at the edge of the first groove 3311. The sensing unit 210 of the fingerprint sensor 200 faces the upper surface by supporting the flexible substrate 201 on the formed step 3319.

In this case, the fingerprint sensor 200 and the bracket 3310 may be bonded to each other by an epoxy resin or an adhesive tape, and the external interface connection part 221 is exposed to the outside of the bracket 3310 and disposed to extend.

In addition, the bracket 3310 may be configured with a flange 3312 including a through portion 3318 to support the bracket 3310 and to penetrate the external interface connection portion 221. The flange 3312 may be configured integrally or detachably with the bracket 3310. In this case, a coupling hole (not shown) to which an external decorative member (not shown) may be coupled may be formed in the flange 3312. In this case, the penetrating portion 3318 may be configured at a portion of the flange 3312 that contacts the bottom edge of the bracket 3310.

In addition, the outer shape of the flange 3312 may be configured to be wider than the edge of the bracket 3310, through which, the flange 3312 may serve as a position fixing to facilitate the subsequent process.

Subsequently, an additional bracket 3320 may be configured to cover the bracket 3310 in a state in which the fingerprint sensor 200 is provided at the bracket 3310 and the external interface connection part 221 is configured at the through part 3318.

The additional bracket 3320 may be designed to fix the external interface connection 221 and to facilitate attaching the fingerprint sensor module to the mobile device. On the other hand, the additional bracket 3320 may be integrally formed with the bracket 3310 in the process.

A cover layer 3315 may be formed on the additional bracket 3320 to cover the sensing unit 210 of the fingerprint sensor 200.

In addition, after the additional bracket 3320 is configured, a separate polishing process may be further included in the touch surface 3314 of the additional bracket 3320. At this time, the polishing process may be made up to a thickness (15 ~ 30㎛) that the fingerprint sensor 200 can sense.

Next, after finishing the polishing process, the multi-coating layer 500 may be formed on the touch surface 3314. The multi-coating layer 500 may be formed to a thickness of 25 ~ 30㎛.

Brackets 3310, flanges 3312, and additional brackets 3320 may be made of any one of nylon or polyamide materials, including epoxy molding compound, fluorine resin, and 20-40% glass. Can be done.

In addition, the cover layer 3315 of the additional bracket 3320 may include a ferroelectric 400, the ferroelectric 400 may be further included in the additional bracket 3320 as a whole.

In addition, the additional brackets 3320 may be combined with the brackets 3310 in a physical manner, or by molding such as insert molding.

A plurality of fingerprint sensor modules 3010 in which the bracket 3310, the fingerprint sensor 200, and the additional bracket 3320 are combined may be processed on a substrate and separated into individual modules through a sawing process.

The foregoing description of the present invention is intended for illustration, and it will be understood by those skilled in the art that the present invention may be easily modified in other specific forms without changing the technical spirit or essential features of the present invention. will be. Therefore, it should be understood that the embodiments described above are exemplary in all respects and not restrictive. For example, each component described as a single type may be implemented in a distributed manner, and similarly, components described as distributed may be implemented in a combined form.

The scope of the present invention is represented by the following claims, and it should be construed that all changes or modifications derived from the meaning and scope of the claims and their equivalents are included in the scope of the present invention.

Claims (14)

1. A fingerprint sensor module comprising a fingerprint sensor and a bracket for mounting the fingerprint sensor,

   The fingerprint sensor includes a sensing unit formed on the substrate to receive a difference between an electric signal of a peak and a valley of a fingerprint of a finger located above the substrate, and a sensor circuit unit for sensing and processing a fingerprint image.

   The bracket has a cover layer formed to cover the upper surface of the sensing unit, and a touch surface formed on the upper surface of the cover layer,

   The multi-coating layer is provided on the touch surface to face the upper surface of the sensing unit accommodated in the bracket, the sum of the thickness of the cover layer and the multi-coating layer is 40 ~ 60㎛.
2. The method of claim 1,

   The multi-coating layer is a fingerprint sensor module comprising a primer layer, a color paint layer and a protective film layer.
3. The method of claim 2,

   Fingerprint sensor module that the ferroelectric is included in the cover layer or the protective film layer.
4. The method of claim 2,

   The thickness of the primer layer is 2 ~ 3㎛, the thickness of the color paint layer is 3 ~ 5㎛, the thickness of the protective film layer is 20 ~ 22㎛ fingerprint sensor module.
5. The method of claim 1,

   The cover layer has a thickness of 15 ~ 30㎛ fingerprint sensor module.
6. The method of claim 1,

   Wherein the fingerprint sensor is fixed by a molding material filled in the bracket or an additional bracket coupled to the bracket.
7. Portable electronic device comprising a fingerprint sensor module according to any one of claims 1 to 6.
8. a) a fingerprint sensor having a sensing unit formed on the substrate so as to receive a difference between an electric signal of a peak and a finger of a fingerprint located on an upper side of the substrate, and a sensor circuit unit for sensing and processing a fingerprint image; Allowing a sensing unit to be received in the bracket; And

   b) providing a multi-coating layer on the touch surface formed on the upper surface of the cover layer formed on the bracket to cover the upper surface of the sensing unit so as to face the upper surface of the sensing unit,

   The sum of the thickness of the cover layer and the multi-coating layer is a manufacturing method of the fingerprint sensor module is formed to 40 ~ 60㎛.
9. The method of claim 8,

   In the preparing of the multi-coating layer (step b), the multi-coating layer is a method of manufacturing a fingerprint sensor module is formed in the order of a primer layer, a color paint layer and a protective film layer.
10. The method of claim 9,

    Ferroelectric is included in the cover layer or the protective film layer manufacturing method of a fingerprint sensor module.
11. The method of claim 9,

    The primer layer is formed of a thickness of 2 ~ 3㎛, the color coating layer is formed of a thickness of 3 ~ 5㎛, the protective film layer is a manufacturing method of the fingerprint sensor module is formed with a thickness of 20 ~ 22㎛. .
12. The method of claim 8,

    The cover layer is a manufacturing method of the fingerprint sensor module is formed with a thickness of 15 ~ 30㎛.
13. The method of claim 8,

    Before the step (b) of preparing the multi-coating layer, further comprising the step of polishing the touch surface.
14. The method of claim 8,

    Mounting the fingerprint sensor on the bracket, and after the sensing unit is received in the bracket (step a), filling the molding material on the bracket or combining the additional bracket to fix the fingerprint sensor. Method of manufacturing a fingerprint sensor module.

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