WO2014063394A1

WO2014063394A1 - Drive structure, and device having same

Info

Publication number: WO2014063394A1
Application number: PCT/CN2012/084630
Authority: WO
Inventors: 陈洁欣; 杨克文
Original assignee: 深圳市劲拓自动化设备股份有限公司
Priority date: 2012-10-25
Filing date: 2012-11-15
Publication date: 2014-05-01

Abstract

A drive structure, and device having same, the drive structure being used in the drive system of an electronic plug-in packaging apparatus, and comprising: a titanium claw (1) for bearing a printed circuit board, a pin shaft (2) connected with the titanium claw (1), and a rotatable roller (3) sleeved on the first end of the pin shaft. The roller (3) contacts a primary guide rail (4) for forming rolling friction with the primary guide rail (4) during the driving process, thus effectively reducing titanium claw jitter, and improving transport system stability.

Description

Transmission structure and device having the same

The present application claims priority to the following Chinese patent application, the entire contents of

1) Chinese patent application filed on October 25, 2012, Chinese Patent Office, application number 201210413031.0, entitled "A transmission structure and equipment with the transmission structure".

2) Chinese patent application filed on October 25, 2012, Chinese Patent Office, application number 201220551370.0, entitled "A transmission structure and equipment with the transmission structure".

Technical field

Field of the Invention This invention relates to the field of electronic specialized equipment, and more particularly to a transmission structure and related apparatus for use in an electronic card package process apparatus.

Background technique

At present, the more commonly used electronic plug-in packaging process equipment, such as wave soldering, the chain in the heavy-duty transmission system drives the titanium of the link pin; 3⁄4 turns, thereby driving the printed circuit board on the titanium claw (PCB, Pr inted Ci rcui t Board ) Perform the welding process. Among them, the main guide of the wave soldering heavy-duty transmission system functions to support the titanium claws. Most of the existing pins are guided by round steel. During the transmission process, the titanium claws bear the pressure of the PCB board, and the pin shaft connected with the titanium claws will be At the same time, the force is inclined toward the titanium claw. At this time, the pin will contact the main guide rail and the round steel. Since the chain is continuously moved forward with the pin and the titanium claw, the main guide rail and the round steel are fixed, so this time Friction is generated between the pin and the main guide rail and the round steel. Referring to FIG. 1a and FIG. 1b, FIG. 1a is a schematic diagram of a transmission structure in a conventional wave soldering device transmission system, and FIG. 1b is a side view showing the positional relationship between the transmission structure and the main rail, wherein the slot on the pin shaft and The main guide rail is in contact with the corresponding convex part (ie round steel), and sliding friction occurs when moving. If the weight of the PCB board carried on the titanium claw is large, the sliding friction will also increase, during the chain operation. It is prone to jitter, which causes the board to be lost, affects normal production, reduces the stability of the transportation system, and is inefficient.

Summary of the invention

Embodiments of the present invention provide a transmission structure and a device having the transmission structure, which are used for Effectively reduce the problem of titanium claw jitter and increase the stability of the transportation system.

In view of this, the present invention provides:

A transmission structure, applied to a transmission system in an electronic card packaging process equipment, comprising: a titanium claw for carrying a printed circuit board, and a pin shaft connected to the titanium claw;

The first end of the pin sleeve is provided with a rotatable roller;

The roller is in contact with the main rail for forming a rolling friction with the main rail during the driving process. Preferably, the pin is connected to the titanium claw by riveting.

Preferably, the first end of the pin is coupled to the titanium claw.

Preferably, the pin shaft further includes a second end, wherein the first end and the second end are both disposed in a cylindrical shape; the diameter of the first end is larger than the diameter of the second end.

Embodiments of the present invention also provide an apparatus having a transmission structure, the apparatus including a plurality of transmission structures as described above.

Preferably, the transmission structure is coupled to the transmission chain and secured by a lock cap.

Preferably, the device is a device for an electronic card packaging process.

Preferably, the device is wave soldering.

It can be seen from the above technical solution that the transmission structure and the device having the transmission structure provided by the embodiment of the present invention, the rotatable roller on the pin shaft is in contact with the main guide rail, and rolling friction is generated during the transmission process, compared with the existing one. The transmission structure generates sliding friction during the transmission process. When the titanium claws carry the same weight of the PCB board, the rolling friction generates less pressure on the pin shaft, which can effectively reduce the titanium claw jitter problem, increase the stability of the transportation system, and improve the stability. effectiveness.

DRAWINGS

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings to be used in the following description of the embodiments will be briefly described. It is obvious that the drawings in the following description are only some embodiments of the present invention. Those skilled in the art can also obtain other drawings based on these drawings without paying any creative work.

Figure la is a schematic diagram of a transmission structure in a conventional wave soldering equipment transmission system; Figure lb is a transmission structure of the existing wave soldering equipment transmission system and the main rail position Side view

2a and 2b are schematic exploded views of a transmission structure according to an embodiment of the present invention; and FIG. 2c is a schematic diagram of assembly of a transmission structure according to an embodiment of the present invention;

3 is a side view showing a positional relationship between a transmission structure and a main guide rail according to an embodiment of the present invention; and FIG. 4 is a schematic diagram of connection between a transmission structure and a transmission chain according to an embodiment of the present invention.

detailed description

Embodiments of the present invention provide a transmission structure and an apparatus having the same, which are used for effectively reducing the jitter of the titanium claw and increasing the stability of the transportation system.

The technical solutions in the embodiments of the present invention are clearly and completely described in the following with reference to the accompanying drawings in the embodiments of the present invention. It is obvious that the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments of the present invention without creative efforts are within the scope of the present invention.

The details are described below separately.

Referring to FIG. 2a, FIG. 2b and FIG. 2c, FIG. 2a and FIG. 2b are schematic exploded views of a transmission structure according to an embodiment of the present invention, and FIG. 2c is a schematic diagram of assembly of a transmission structure according to an embodiment of the present invention; The transmission structure is applied to a transmission system in an electronic card packaging process equipment, the transmission structure comprising: a titanium claw 1 for carrying a printed circuit board, a pin 2 connected to the titanium claw 1; The first end 21 is sleeved with a rotatable roller 3; the roller 3 is in contact with the main rail 4, and the roller 3 is used to form rolling friction with the main rail 4 during the transmission process; Yes, in comparison with the pin in the prior art electronic card packaging process equipment (such as wave soldering) (in conjunction with FIGS. 1a and 1b), in the embodiment, the pin 2 is sleeved with a rotatable roller 3, that is, a pin. The outer shape of the main guide rail 4 which is in direct contact with the roller 3 to form rolling friction will also change correspondingly when driving, and reference may be made to FIG. 3, which is the roller 3 and the main guide rail in the transmission structure. 4 positional relationship side view Figure.

It can be seen from the above that the transmission structure provided by the embodiment of the present invention has the rotatable roller 3 on the pin shaft 2 in contact with the main guide rail 4, which generates rolling friction during the transmission process, which is generated in the transmission process with respect to the existing transmission structure. Sliding friction, rolling when the titanium claw 1 carries the same weight of the PCB The friction generates less pressure on the pin 2, which can effectively reduce the jitter of the titanium claw 1, increase the stability of the transportation system, and improve the efficiency.

Preferably, in some embodiments, the pin 2 is connected to the titanium claw 1 by riveting. In this embodiment, the pin 2 is connected to the titanium claw 1 and the transmission chain 5 by a static fixed connection. Referring to FIG. 4, FIG. 4 is a schematic diagram of the connection between the transmission structure and the transmission chain 5 according to an embodiment of the present invention.

Preferably, the first end 21 of the pin 2 is connected to the titanium claw 1, that is, the pin 2 is provided with one end of the roller 3 connected to the titanium claw 1;

Preferably, referring to FIG. 2a, FIG. 2b and FIG. 2c, the pin 2 further includes a second end 22, wherein the first end 21 and the second end 22 are both cylindrically arranged; The diameter of one end 21 is larger than the diameter of the second end 22, and the second end 22 is connected to the transmission chain 5. Referring to FIG. 4, it can be understood that the diameter of the cylinder of the pin 2 is different from The size of the diameter of the cylinder is not specifically limited in the embodiment of the present invention.

It can be seen from the above that the transmission structure provided by the embodiment of the invention is applied to the transmission system in the electronic plug-in packaging process equipment (such as wave soldering). During the transmission process, the titanium claw 1 bears the pressure of the PCB board and is connected with the titanium claw 1 . The pin 2 is simultaneously biased toward the titanium claw 1 at this time. At this time, the pin 2 sleeved with the roller 3 will be in contact with the main rail 4, since the transmission chain 5 carries the pin 2 and the titanium claw 1 continuously. Moving forward, the main rail 4 is fixed, so that frictional force is generated between the pin 2 and the main rail 4 at this time; and since the roller 3 is freely rotatable, friction between the pin 2 and the main rail 4 is generated. For rolling friction, sliding friction is generated in the transmission process compared with the existing transmission structure. When the weight of the titanium claw 1 carrying the PCB is the same, the rolling friction generates less pressure on the pin 2, thereby effectively reducing the jitter of the titanium claw 1. The problem is that the stability of the transportation system is increased and the efficiency is improved.

In order to better understand the technical solution of the present invention, an embodiment of the present invention further provides an apparatus having a transmission structure, the apparatus comprising a plurality of transmission structures as described in the above embodiments.

Preferably, as shown in Figure 4, the transmission structure is coupled to the conveyor chain 5 and secured by a lock cap 6.

In some embodiments, the device is a device for an electronic card packaging process, preferably the device is wave soldering.

It can be understood that the shape of the transmission structure in the device with the transmission structure is set and The process can be specifically implemented by referring to the embodiment of the above transmission structure, and details are not described herein again.

It can be seen from the above that, in the device with the transmission structure provided by the embodiment of the present invention, the rotatable roller 3 on the transmission structure pin 2 is in contact with the main guide rail 4, and rolling friction is generated during the transmission process, compared with the existing transmission structure. Sliding friction is generated during the transmission process. When the titanium claw 1 carries the same weight of the PCB, the rolling friction generates less pressure on the pin 2, which can effectively reduce the jitter of the titanium claw 1 and increase the stability of the transportation system. The efficiency.

The transmission structure and the device having the transmission structure provided by the present invention are described in detail above. For those skilled in the art, according to the idea of the embodiment of the present invention, the specific implementation manner and the application range may be changed. In the above, the contents of the specification are not to be construed as limiting the invention.

Claims

Rights request

1. A transmission structure applied to the transmission system in electronic plug-in packaging process equipment, which is characterized by including:

Titanium claws for carrying printed circuit boards, and pins connected to the titanium claws;

The first end of the pin is equipped with a rotatable roller;

The rollers are in contact with the main rail and are used to form rolling friction with the main rail during the transmission process.

2. The transmission structure according to claim 1, characterized in that:

The pin is connected to the titanium claw by riveting.

3. The transmission structure according to claim 1 or 2, characterized in that:

The first end of the pin is connected to the titanium claw.

4. The transmission structure according to claim 1 or 2, characterized in that:

The pin further includes a second end, and both the first end and the second end are cylindrical; the diameter of the first end is larger than the diameter of the second end.

5. An equipment with a transmission structure, characterized in that the equipment includes several transmission structures as described in any one of claims 1 to 4.

6. The equipment according to claim 5, characterized in that the transmission structure is connected to the transmission chain and fixed by a lock cap.

7. The equipment according to claim 5 or 6, characterized in that the equipment is equipment used for electronic plug-in packaging process.

8. The equipment according to claim 5 or 6, characterized in that the equipment is wave soldering.