WO2013121815A1

WO2013121815A1 - Electronic component

Info

Publication number: WO2013121815A1
Application number: PCT/JP2013/050629
Authority: WO
Inventors: 博志増田
Original assignee: 株式会社村田製作所
Priority date: 2012-02-14
Filing date: 2013-01-16
Publication date: 2013-08-22
Also published as: CN204013427U

Abstract

Provided is an electronic component wherein generation of an unneeded inductance component can be suppressed. A laminated body (12) is configured by laminating a plurality of insulating material layers (16), and has a mounting surface that is configured by having the outer ends of the insulating material layers (16) continuously. Resonators (A1-A3) are provided in the laminated body (12), and are respectively configured of coils (C1-C3) and capacitors (L1-L3). External electrodes (15a-15c) are provided on a laminated body (12) surface positioned on the positive direction side in the y axis direction. The capacitors (C1-C3) are configured of external electrodes (15a-15c) and capacitor conductor bodies (18a-18c) facing the external electrodes (15a-15c) with an insulating material layer (16f) therebetween.

Description

Electronic components

The present invention relates to an electronic component, and more specifically to an electronic component including a resonator including a coil and a capacitor.

As a conventional electronic component, for example, an electronic component described in Patent Document 1 is known. FIG. 9 is an external perspective view of the electronic component 500 described in Patent Document 1. FIG. FIG. 10 is a perspective view of the electronic component 500 described in Patent Document 1. FIG. 9 and 10, the stacking direction of the stacked body 502 is defined as the y-axis direction, and when viewed in plan from the y-axis direction, the direction in which the long side extends is defined as the x-axis direction, and the short side extends. The existing direction is defined as the z-axis direction.

As shown in FIGS. 9 and 10, the electronic component 500 includes a multilayer body 502, external electrodes 504a to 504c,

coil conductors

506, 512,

capacitor conductors

508, 510, 514, connection conductors 516a, 516b, and a via-hole conductor v500. ing.

The stacked body 502 is configured by stacking a plurality of insulator layers so as to be aligned in the y-axis direction, and has a rectangular parallelepiped shape. The external electrodes 504a and 504b are provided on the negative side surface of the multilayer body 502 in the y-axis direction. The external electrode 504c is provided on the surface of the multilayer body 502 on the positive direction side in the y-axis direction.

The connection conductor 516a is provided on the surface on the positive side in the z-axis direction of the multilayer body 502, and connects the external electrodes 504b and 504c. The connection conductor 516b is provided on the negative side surface in the z-axis direction of the multilayer body 502, and connects the external electrodes 504b and 504c.

The

coil conductors

506 and 512 are linear conductors having the same shape and extending in the x-axis direction. The coil conductor 506 is provided on the negative direction side in the y-axis direction with respect to the coil conductor 512 in the multilayer body 502.

The via-hole conductor v500 extends in the y-axis direction and is connected to the external electrode 504a and the

coil conductors

506 and 512. Thus, the

coil conductors

506 and 512 are connected to the external electrode 504a via the via-hole conductor v500.

The

capacitor conductors

508 and 514 have the same shape and are rectangular conductors. The

capacitor conductors

508 and 514 face each other. Further, the

capacitor conductors

508 and 514 are respectively connected to the end portions of the

coil conductors

506 and 512 on the negative side in the x-axis direction. Further, the

capacitor conductors

508 and 514 are connected to the connection conductor 516a. Thereby, the

capacitor conductors

508 and 514 are connected to the external electrodes 504b and 504c through the connection conductor 516a.

The capacitor conductor 510 is provided between the

capacitor conductors

508 and 514 and faces the

capacitor conductors

508 and 514. Further, the capacitor conductor 510 is connected to the connection conductor 516b. Thus, the capacitor conductor 510 is connected to the external electrodes 504b and 504c via the connection conductor 516b.

In the electronic component 500 configured as described above, the external electrode 504a is used as an input terminal, and the external electrodes 504b and 504c are used as ground terminals. Thereby, a parallel resonator in which a coil and a capacitor are connected in parallel is formed between the external electrode 504a and the external electrodes 504b and 504c.

When the electronic component 500 described in Patent Document 1 is mounted on a circuit board, the surface on the negative side in the z-axis direction of the multilayer body 502 is used as a mounting surface. Since the

capacitor conductors

508, 510, and 514 are perpendicular to the mounting surface, they are also perpendicular to the main surface of the circuit board. Therefore, the

capacitor conductors

508, 510, and 514 are also perpendicular to the land electrode provided on the circuit board. As a result, the capacitance formed between the

capacitor conductors

508, 510, and 514 and the land electrode is reduced, and the characteristics of the parallel resonator of the electronic component 500 are suppressed from deviating from desired characteristics.

Incidentally, in the electronic component 500, the

capacitor conductors

508, 510, and 514 are connected to the external electrodes 504b and 504c through the connection conductors 516a and 516b. The connection conductors 516a and 516b have an inductance component. For this reason, the electronic component 500 described in Patent Document 1 has a problem that an unnecessary inductance component is generated between the capacitor and the external electrodes 504b and 504c in the parallel resonator.

JP 2007-325046 A

Therefore, an object of the present invention is to provide an electronic component that can suppress the generation of unnecessary inductance components.

An electronic component according to an aspect of the present invention is a stacked body configured by stacking a plurality of insulator layers, and has a mounting surface configured by connecting outer edges of the plurality of insulator layers. A laminated body, a resonator including a coil and a capacitor provided in the laminated body, and a first external electrode provided on a first surface located on one side of the laminated body in a stacking direction; And the capacitor is composed of the first external electrode and a capacitor conductor facing the first external electrode with the insulator layer interposed therebetween. To do.

According to the present invention, generation of unnecessary inductance components can be suppressed.

1 is an external perspective view of an electronic component according to a first embodiment. It is a disassembled perspective view of the electronic component which concerns on 1st Embodiment. 1 is a cross-sectional structure diagram of an electronic component according to a first embodiment. It is an equivalent circuit schematic of the electronic component which concerns on 1st Embodiment. It is an external appearance perspective view of the electronic component which concerns on 2nd Embodiment. It is a disassembled perspective view of the electronic component which concerns on 2nd Embodiment. It is sectional structure drawing of the electronic component which concerns on 2nd Embodiment. It is an equivalent circuit schematic of the electronic component which concerns on 2nd Embodiment. 2 is an external perspective view of an electronic component described in Patent Document 1. FIG. 2 is a perspective view of an electronic component described in Patent Document 1. FIG.

Hereinafter, an electronic component according to an embodiment of the present invention will be described.

(First embodiment)
(Structure of electronic parts)
The structure of the electronic component according to the first embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is an external perspective view of an electronic component 10 according to the first embodiment. FIG. 2 is an exploded perspective view of the electronic component 10 according to the first embodiment. FIG. 3 is a cross-sectional structure diagram of the electronic component 10 according to the first embodiment. FIG. 4 is an equivalent circuit diagram of the electronic component 10 according to the first embodiment. Hereinafter, the stacking direction of the electronic components 10 is defined as the y-axis direction. Further, when viewed in plan from the y-axis direction, the direction along the long side of the electronic component 10 is defined as the x-axis direction, and the direction along the short side of the electronic component 1 is defined as the z-axis direction.

As shown in FIGS. 1 and 2, the electronic component 10 includes a laminate 12, external electrodes 14 (14a to 14c) and 15 (15a to 15c), resonators A1 to A3, and capacitors C4 and C5.

The laminated body 12 has a rectangular parallelepiped shape, and a plurality of rectangular insulating layers 16 (16a to 16g) are laminated so as to be arranged in this order from the negative direction side to the positive direction side in the y-axis direction. It is comprised by. The main surface S1 on the negative side in the z-axis direction of the multilayer body 12 is a mounting surface that faces the circuit board when the electronic component 10 is mounted on the circuit board. The main surface S1 is configured by the long sides (outer edges) on the negative direction side in the z-axis direction of the insulating layers 16a to 16g being continuous. A surface on the negative direction side in the y-axis direction of the insulator layer 16 is referred to as a front surface, and a surface on the positive direction side in the y-axis direction of the insulator layer 16 is referred to as a back surface.

The external electrodes 14a to 14c are provided on the side surface S2 on the negative side in the y-axis direction of the multilayer body 12, as shown in FIGS. Therefore, the external electrodes 14a to 14c are provided on the surface of the insulator layer 16a. The external electrodes 14a to 14c are arranged in this order from the negative direction side to the positive direction side in the x-axis direction.

The external electrodes 15a to 15c are provided on the side surface S3 (the surface facing the side surface S2) on the positive side in the y-axis direction of the multilayer body 12 as shown in FIGS. Therefore, the external electrodes 15a to 15c are provided on the back surface of the insulating layer 16g. The external electrodes 15a to 15c are arranged in this order from the negative direction side to the positive direction side in the x-axis direction. Thereby, the external electrode 14a and the external electrode 15a face each other, the external electrode 14b and the external electrode 15b face each other, and the external electrode 14c and the external electrode 15c face each other.

The resonator A1 is provided in the laminate 12 and includes a coil L1 and a capacitor C1. The coil L1 is composed of via-hole conductors v1 to v5. The via-hole conductors v1 to v5 penetrate the insulator layers 16a to 16e in the y-axis direction as shown in FIG. 2, and extend in the y-axis direction by being connected to each other as shown in FIG. One via-hole conductor is configured. The end of the via-hole conductor v1 on the negative direction side in the y-axis direction is connected to the external electrode 14a.

As shown in FIGS. 2 and 3, the capacitor C1 is composed of a capacitor conductor 18a and an external electrode 15a. The capacitor conductor 18a is provided in the multilayer body 12, and more specifically, is a rectangular conductor provided on the surface of the insulator layer 16f. The capacitor conductor 18a is opposed to the external electrode 15a via the insulator layers 16f and 16g. Thereby, an electrostatic capacity is formed between the external electrode 15a and the capacitor conductor 18a. Further, the coil L1 is connected to the capacitor conductor 18a, and more specifically, the end of the via-hole conductor v5 on the positive direction side in the y-axis direction is connected. Thereby, the coil L1 and the capacitor | condenser C1 are connected in series.

The resonator A2 is provided on the positive side in the x-axis direction from the resonator A1 in the multilayer body 12, and is electromagnetically coupled to the resonator A1. The resonator A2 includes a coil L2 and a capacitor C2. The coil L2 is composed of via-hole conductors v11 to v15. The via-hole conductors v11 to v15 pass through the insulator layers 16a to 16e in the y-axis direction as shown in FIG. 2, and extend in the y-axis direction by being connected to each other as shown in FIG. One via-hole conductor is configured. The end of the via hole conductor v11 on the negative side in the y-axis direction is connected to the external electrode 14b.

As shown in FIGS. 2 and 3, the capacitor C2 is composed of a capacitor conductor 18b and an external electrode 15b. The capacitor conductor 18b is provided in the multilayer body 12, and more specifically, is a rectangular conductor provided on the surface of the insulator layer 16f. The capacitor conductor 18b is opposed to the external electrode 15b via the insulator layers 16f and 16g. Thereby, a capacitance is formed between the external electrode 15b and the capacitor conductor 18b. Further, the coil L2 is connected to the capacitor conductor 18b, and more specifically, the positive end of the via-hole conductor v15 in the y-axis direction is connected. Thereby, the coil L2 and the capacitor C2 are connected in series.

The resonator A3 is provided on the positive side in the x-axis direction from the resonator A2 in the multilayer body 12, and is electromagnetically coupled to the resonator A2. The resonator A3 includes a coil L3 and a capacitor C3. The coil L3 is composed of via-hole conductors v21 to v25. The via-hole conductors v21 to v25 respectively penetrate the insulator layers 16a to 16e in the y-axis direction as shown in FIG. 2, and extend in the y-axis direction by being connected to each other as shown in FIG. One via-hole conductor is configured. The end of the via hole conductor v21 on the negative side in the y-axis direction is connected to the external electrode 14c.

The capacitor C3 includes a capacitor conductor 18c and an external electrode 15c as shown in FIGS. The capacitor conductor 18c is provided in the multilayer body 12, and more specifically, is a rectangular conductor provided on the surface of the insulator layer 16f. The capacitor conductor 18c is opposed to the external electrode 15c via the insulator layers 16f and 16g. As a result, a capacitance is formed between the external electrode 15c and the capacitor conductor 18c. In addition, the coil L3 is connected to the capacitor conductor 18c, and more specifically, the positive end of the via-hole conductor v25 in the y-axis direction is connected. As a result, the coil L3 and the capacitor C3 are connected in series.

The capacitor C4 is composed of capacitor conductors 18a, 18b, and 20a. The capacitor conductor 20a is a rectangular conductor provided on the surface of the insulator layer 16e, and faces the capacitor conductors 18a and 18b via the insulator layer 16e when viewed in plan from the y-axis direction. . Thereby, the electrostatic capacitance is formed between the capacitor conductors 18a and 18b and the capacitor conductor 20a. That is, the capacitor C4 is formed between the capacitor conductors 18a and 18b.

The capacitor C5 is composed of

capacitor conductors

18b, 18c, and 20b. The capacitor conductor 20b is a rectangular conductor provided on the surface of the insulator layer 16e, and faces the capacitor conductors 18b and 18c via the insulator layer 16e when viewed in plan from the y-axis direction. . As a result, a capacitance is formed between the capacitor conductors 18b and 18c and the capacitor conductor 20b. That is, the capacitor C5 is formed between the capacitor conductors 18b and 18c.

The electronic component 10 configured as described above has a circuit configuration shown in FIG. More specifically, the coil L1 and the capacitor C1 are connected in series between the

external electrodes

14a and 15a, and constitute a resonator A1. The coil L2 and the capacitor C2 are connected in series between the

external electrodes

14b and 15b, and constitute a resonator A2. The coil L3 and the capacitor C3 are connected in series between the

external electrodes

14c and 15c, and constitute a resonator A3.

Further, the capacitor C4 is connected between the coil L1 and the capacitor C1 and between the coil L2 and the capacitor C2. The capacitor C5 is connected between the coil L2 and the capacitor C2 and between the coil L3 and the capacitor C3.

Further, the resonators A1 and A2 are electromagnetically coupled, and the resonators A2 and A3 are electromagnetically coupled. Thus, the resonators A1 to A3 constitute a band elimination filter circuit.

In the electronic component 10 configured as described above, the external electrode 14a is used as an input terminal, and the external electrode 14c is used as an output terminal. The external electrodes 15a to 15c are used as ground terminals. The external electrode 14b is kept at a floating potential.

When a high frequency signal is input from the external electrode 14a, the high frequency signal flows through the coil L1 and the capacitor C1. And a high frequency signal flows into the coil L2 and the capacitor | condenser C2 by electromagnetic induction. Furthermore, a high frequency signal flows through the coil L3 and the capacitor C3 due to electromagnetic induction.

Here, the resonator A1 is configured by connecting the coil L1 and the capacitor C1 in series. Therefore, the impedance of the resonator A1 is minimized at the resonance frequency of the resonator A1. Therefore, the signal of the resonance frequency of the resonator A1 in the high frequency signal flows to the ground through the external electrode 15a.

The resonator A2 is configured by connecting the coil L2 and the capacitor C2 in series. Therefore, the impedance of the resonator A2 is minimized at the resonance frequency of the resonator A2. Therefore, the signal of the resonance frequency of the resonator A2 in the high frequency signal flows to the ground via the external electrode 15b.

The resonator A3 is configured by connecting a coil L3 and a capacitor C3 in series. Therefore, the impedance of the resonator A3 is minimized at the resonance frequency of the resonator A3. Therefore, the signal of the resonance frequency of the resonator A3 in the high frequency signal flows to the ground via the external electrode 15c.

As described above, the resonance frequency signals of the resonators A1 to A3 are removed while the high frequency signal is transmitted through the resonators A1 to A3. The external electrode 14c outputs a high-frequency signal from which the resonance frequency signals of the resonators A1 to A3 are removed.

(Method for manufacturing electronic parts)
Below, the manufacturing method of the electronic component 10 is demonstrated, referring FIG.1 and FIG.2.

First, a ceramic green sheet to be the insulator layer 16 is prepared. Next, via-hole conductors v1 to v5, v11 to v15, and v21 to v25 are formed on the ceramic green sheets to be the insulator layers 16a to 16e, respectively. Specifically, via holes are formed by irradiating the ceramic green sheets to be the insulator layers 16a to 16e with a laser beam. Next, the via hole is filled with a conductive paste such as Ag, Pd, Cu, Au or an alloy thereof by a method such as printing.

Next, a conductive paste mainly composed of Ag, Pd, Cu, Au, or an alloy thereof is screen-printed or photolithography-processed on the surface of the ceramic green sheet to be the insulator layers 16a, 16e, 16f. The base electrode and the capacitor conductors 18a to 18c, 20a, and 20b to be the external electrodes 14a to 14c are formed by application by a method such as the above. The via hole may be filled with a conductive paste when the base electrode to be the external electrodes 14a to 14c and the capacitor conductors 18a to 18c, 20a and 20b are formed.

Next, a conductive paste mainly composed of Ag, Pd, Cu, Au, or an alloy thereof is applied on the back surface of the ceramic green sheet to be the insulator layer 16g by a method such as a screen printing method or a photolithography method. By applying, base electrodes to be the external electrodes 15a to 15c are formed.

Next, the ceramic green sheets to be the insulator layers 16a to 16g are laminated and pressure-bonded so as to be arranged in this order from the negative direction side to the positive direction side in the y-axis direction. A mother laminated body is formed by the above process. The mother laminate is subjected to main pressure bonding by a hydrostatic pressure press or the like.

Next, the mother laminated body is cut into a laminated body 12 having a predetermined size with a cutting blade. The unfired laminate 12 is subjected to binder removal processing and firing.

The fired laminated body 12 is obtained through the above steps. The laminated body 12 is subjected to barrel processing to be chamfered.

Finally, Ni plating / Sn plating is performed on the surface of the base electrode to be the external electrodes 14a to 14c and 15a to 15c. Through the above steps, the electronic component 10 as shown in FIG. 1 is completed.

(effect)
The electronic component 10 configured as described above can suppress generation of unnecessary inductance components. More specifically, in the electronic component 500 described in Patent Document 1, the

capacitor conductors

508, 510, and 514 are connected to the external electrodes 504b and 504c via the connection conductors 516a and 516b. The connection conductors 516a and 516b have an inductance component. For this reason, the electronic component 500 described in Patent Document 1 has a problem that an unnecessary inductance component is generated between the capacitor and the external electrodes 504b and 504c in the parallel resonator.

On the other hand, in the electronic component 10, the capacitors C1 to C3 are constituted by capacitor conductors 18a to 18c and external electrodes 15a to 15c, respectively. Therefore, wiring for connecting the capacitors C1 to C3 to the external electrodes 15a to 15c is unnecessary. As a result, generation of unnecessary inductance components between the capacitors C1 to C3 and the external electrodes 15a to 15c is suppressed.

Further, when the electronic component 10 is mounted on the circuit board, the main surface S1 on the negative side in the z-axis direction of the multilayer body 12 is used as a mounting surface. Since the capacitor conductors 18a to 18c are perpendicular to the main surface S1, they are also perpendicular to the main surface of the circuit board. Therefore, the capacitor conductors 18a to 18c are also perpendicular to the land electrodes provided on the circuit board. Therefore, the capacitor conductors 18a to 18c do not face the land electrode. As a result, unnecessary capacitance formed between the capacitor conductors 18a to 18c and the land electrode is reduced, and the characteristics of the resonators A1 to A3 of the electronic component 10 are prevented from deviating from desired characteristics.

Further, in the electronic component 10, capacitor conductors 20a and 20b constituting the capacitors C4 and C5 are arranged between via-hole conductors serving as coils. For this reason, by changing the shape of the capacitor conductors 20a and 20b and the layer in which the capacitor conductors 20a and 20b are formed, the capacitance values of the capacitors C4 and C5 can be set appropriately, and the electromagnetic coupling between the via-hole conductors serving as coils can be improved. The desired filter characteristics can be obtained by adjusting the degree. Furthermore, one or more floating electrodes may be provided in the negative y-axis direction with respect to the capacitor conductors 20a and 20b in order to increase the degree of freedom of coupling adjustment. At this time, the floating electrode is arranged by setting the area of the floating electrode smaller than the capacitor electrodes 20a and 20b and overlapping the capacitor conductors 18a, 18b and 18c only through the capacitor electrodes 20a and 20b. It is possible to prevent the capacitance values of the capacitors C4 and C5 from changing due to the above.

Further, in the electronic component 10, wiring for connecting the capacitors C1 to C3 to the external electrodes 15a to 15c is unnecessary, so that a space for forming wiring in the stacked body 12 is unnecessary. Therefore, the electronic component 10 can be downsized.

In addition, the electronic component 10 can reduce the manufacturing cost. More specifically, in the electronic component 500 described in Patent Document 1, the connection conductors 516a and 516b are provided on the positive and negative surfaces of the multilayer body 502 in the z-axis direction. The main surface on the positive side and the negative side in the z-axis direction of the stacked body 502 is formed by connecting the outer edges of the insulator layer. Therefore, the connection conductors 516a and 516b need to be formed by printing or the like after the multilayer body 502 is formed.

On the other hand, in the electronic component 10, the external electrodes 14a to 14c and 15a to 15c provided on the surface of the multilayer body 12 are formed on the surface of the insulating layer 16a and the back surface of the insulating layer 16g. Therefore, the external electrodes 14a to 14c and 15a to 15c can be formed by screen printing on the ceramic green sheet. That is, the external electrodes 14a to 14c and 15a to 15c can be formed by the same process as the capacitor conductors 18a to 18c, 20a, and 20c. As a result, the manufacturing cost of the electronic component 10 can be reduced more than the manufacturing cost of the electronic component 500.

(Second Embodiment)
The structure of an electronic component according to the second embodiment of the present invention will be described below with reference to the drawings. FIG. 5 is an external perspective view of the electronic component 10a according to the second embodiment. FIG. 6 is an exploded perspective view of the electronic component 10a according to the second embodiment. FIG. 7 is a cross-sectional structure diagram of an electronic component 10a according to the second embodiment. FIG. 8 is an equivalent circuit diagram of the electronic component 10a according to the second embodiment.

In the electronic component 10, the resonators A1 to A3 constitute a band elimination filter circuit. On the other hand, in the electronic component 10a, the resonators A1 to A3 constitute a band pass filter. Below, the structure of the electronic component 10a is demonstrated centering on this difference.

The electronic component 10a further includes external electrodes 30 (30a, 30b) as shown in FIGS. The external electrode 30a is provided on the end surface S5 on the negative side in the x-axis direction of the multilayer body 12. The external electrode 30b is provided on the end surface S6 on the positive side in the x-axis direction of the multilayer body 12.

In the electronic component 10a, capacitor conductors 18'a and 18'c are provided instead of the capacitor conductors 18a and 18c. As shown in FIGS. 6 and 7, the capacitor conductor 18'a is provided on the surface of the insulator layer 16f, and is drawn out to the short side of the insulator layer 16f on the negative direction side in the x-axis direction. Thereby, the capacitor conductor 18'a is connected to the external electrode 30a. As shown in FIGS. 6 and 7, the capacitor conductor 18 ′ c is provided on the surface of the insulator layer 16 f and is drawn out to the short side of the insulator layer 16 f on the positive side in the x-axis direction. Thereby, the capacitor conductor 18'c is connected to the external electrode 30b. Since the other structure of the electronic component 10a is the same as that of the electronic component 10, description is abbreviate | omitted.

In the electronic component 10a configured as described above, as shown in FIG. 8, the coil L1 is connected between the

external electrodes

14a and 30a. The capacitor C1 is connected between the

external electrodes

15a and 30a. The coil L2 and the capacitor C2 are connected in series between the

external electrodes

14b and 15b. The coil L3 is connected between the external electrodes 14c and 30b. The capacitor C3 is connected between the external electrodes 15c and 30b.

In the electronic component 10 configured as described above, the external electrode 30a is used as an input terminal, and the external electrode 30b is used as an output terminal. The external electrodes 14a to 14c and 15a to 15c are used as ground terminals. As a result, the coil L1 and the capacitor C1 constitute a parallel resonator A1. The coil L2 and the capacitor C2 constitute a parallel resonator A2. The coil L3 and the capacitor C3 constitute a parallel resonator A3.

When a high frequency signal is input from the external electrode 30a, the high frequency signal flows through the coil L1 and the capacitor C1. And a high frequency signal flows into the coil L2 and the capacitor | condenser C2 by electromagnetic induction. Furthermore, a high frequency signal flows through the coil L3 and the capacitor C3 due to electromagnetic induction.

Here, the resonator A1 is configured by connecting the coil L1 and the capacitor C1 in parallel. Therefore, the impedance of the resonator A1 is maximized at the resonance frequency of the resonator A1. Therefore, the signal of the resonance frequency of the resonator A1 among the high-frequency signals is transmitted to the resonator A2 without flowing to the ground via the

external electrodes

14a and 15a.

The resonator A2 is configured by connecting the coil L2 and the capacitor C2 in parallel. Therefore, the impedance of the resonator A2 is maximized at the resonance frequency of the resonator A2. Therefore, the signal of the resonance frequency of the resonator A2 in the high frequency signal is transmitted to the resonator A3 without flowing to the ground via the

external electrodes

14b and 15b.

The resonator A3 is configured by connecting the coil L3 and the capacitor C3 in parallel. Therefore, the impedance of the resonator A3 is maximized at the resonance frequency of the resonator A3. Therefore, the signal of the resonance frequency of the resonator A3 in the high frequency signal is output from the external electrode 14c without flowing to the ground via the

external electrodes

14c and 15c.

As described above, the resonance frequency signals of the resonators A1 to A3 pass through the resonators A1 to A3. The external electrode 14c outputs a high frequency signal that is a resonance frequency signal of the resonators A1 to A3.

As with the electronic component 10, the electronic component 10a configured as described above can suppress the generation of unnecessary inductance components. Further, according to the electronic component 10a, as in the electronic component 10, unnecessary capacitance formed between the capacitor conductors 18a to 18c and the land electrodes is reduced, and the resonators A1 to A3 of the electronic component 10a are reduced. The characteristic is prevented from deviating from a desired characteristic. Further, in the electronic component 10a, similarly to the electronic component 10, the electronic component 10a can be downsized.

As described above, the present invention is useful for electronic components, and is particularly excellent in that generation of unnecessary inductance components can be suppressed.

A1 to A3 Resonators C1 to C5 Capacitors L1 to L3 Coils v1 to v5, v11 to v15, v21 to v25 Via-hole conductors 10, 10a Electronic components 12 Laminated bodies 14a to 14c, 15a to 15c, 30a, 30b External electrodes 16a to 16g Insulator layers 18a-18c, 18'a, 18'c Capacitor conductor

Claims

A laminated body constituted by laminating a plurality of insulator layers, and a laminated body having a mounting surface constituted by connecting outer edges of the plurality of insulator layers;
A resonator provided in the laminate and comprising a coil and a capacitor;
A first external electrode provided on a first surface located on one side in the stacking direction of the stacked body;
With
The capacitor is composed of the first external electrode and a capacitor conductor facing the first external electrode through the insulator layer;
Electronic parts characterized by
The capacitor conductor is connected to the coil;
The electronic component according to claim 1.
The coil is configured by a via-hole conductor extending in the stacking direction in the stacked body and connected to the capacitor conductor;
The electronic component according to claim 2.
A second external electrode provided on a second surface facing the first surface;
In addition,
The via-hole conductor is connected to the second external electrode;
The electronic component according to claim 3.
A plurality of the resonators are provided in the laminate so as to constitute a filter circuit by electromagnetically coupling with each other;
The electronic component according to claim 1, wherein: