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WO2013080441A1 - Power conversion device - Google Patents

Power conversion device Download PDF

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Publication number
WO2013080441A1
WO2013080441A1 PCT/JP2012/007067 JP2012007067W WO2013080441A1 WO 2013080441 A1 WO2013080441 A1 WO 2013080441A1 JP 2012007067 W JP2012007067 W JP 2012007067W WO 2013080441 A1 WO2013080441 A1 WO 2013080441A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat transfer
heat
cooling body
power conversion
circuit board
Prior art date
Application number
PCT/JP2012/007067
Other languages
French (fr)
Japanese (ja)
Inventor
泰仁 田中
美里 柴田
Original Assignee
富士電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士電機株式会社 filed Critical 富士電機株式会社
Priority to CN201280050109.5A priority Critical patent/CN103907184B/en
Publication of WO2013080441A1 publication Critical patent/WO2013080441A1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/162—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits the devices being mounted on two or more different substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a power conversion apparatus for supporting a mounting substrate on which a circuit component including a heat generating circuit component for driving a semiconductor switching element is mounted on a semiconductor power module incorporating a semiconductor switching element for power conversion.
  • the power conversion device described in Patent Document 1 As this type of power conversion device, the power conversion device described in Patent Document 1 is known.
  • a water cooling jacket is disposed in a casing, and a semiconductor power module including an IGBT as a semiconductor switching element for power conversion is disposed on the water cooling jacket to cool the power conversion apparatus.
  • a control circuit board and a drive circuit board are arranged in the casing at a predetermined distance on the side opposite to the water cooling jacket of the semiconductor power module, and heat generated by the control circuit board and the drive circuit board is radiated from the heat dissipation member. The heat is transmitted to the metal base plate supporting the control circuit board and the drive circuit board through the metal plate, and the heat transmitted to the metal base plate is transmitted to the water cooling jacket through the side wall of the housing supporting the metal base plate. I am doing so.
  • the housing is often required to be waterproof and dustproof, apply a liquid sealant or sandwich rubber packing between the metal base plate and the housing and between the housing and the water cooling jacket. Etc. are generally performed. Liquid sealants and rubber packings generally have a low thermal conductivity, and there is an unsolved problem that the thermal resistance increases and the cooling efficiency decreases due to the presence of these in the thermal cooling path. In order to solve this unsolved problem, it is also necessary to dissipate the heat generated by the substrate and mounted components by natural convection from the case and case cover, increasing the surface area of the case and case cover. For this reason, the outer shape of the housing and the housing lid is increased, and the power converter is increased in size.
  • the present invention has been made paying attention to the unsolved problems of the above-described conventional example, and can efficiently dissipate the heat of the heat generating circuit components mounted on the substrate to the cooling body, and can be downsized. It aims at providing a simple power converter.
  • a first aspect of a power conversion device includes a semiconductor power module in which one surface is joined to a cooling body and a circuit component including a heat generating circuit component that drives the semiconductor power module. And a heat conduction path for transferring heat of the mounting substrate to the cooling body. And as for the said mounting substrate, the heat-transfer member is arrange
  • the second aspect of the power conversion device is a semiconductor power module in which a semiconductor switching element for power conversion is built in a case body, a cooling body disposed on one surface of the semiconductor power module, And a plurality of mounting boards on which circuit components including a heat generating circuit component for driving the semiconductor switching element supported on the other surface of the semiconductor power module are mounted. And at least one mounting board among the plurality of mounting boards is provided with heat transfer members individually on both front and back surfaces, and heat generation of the heat generating circuit components is conducted via both heat transfer members, and further the semiconductor power module and Heat is radiated to the cooling body through a plurality of heat conduction paths independent of the casing surrounding each mounting substrate.
  • the heat of the heat generating circuit components mounted on the mounting board can be radiated to the cooling body via the heat transfer members on both the front and back surfaces.
  • the plurality of heat conduction paths between the mounting substrate and the cooling body are formed independently of the housing surrounding the semiconductor power module and each mounting substrate, the heat conductivity of the housing should be considered.
  • a housing can be formed without any problems, and the degree of freedom in design can be improved.
  • the power transmission is provided between a mounting board on which heat transfer members are arranged on both the front and back surfaces and a mounting board facing at least one surface of the mounting board.
  • the thermal member is disposed in a solid state. According to this configuration, since the heat transfer member is interposed between the two mounting boards in a solid state, an air layer is not formed between the two mounting boards, so that the heat dissipation effect can be improved.
  • the 4th aspect of the power converter device which concerns on this invention is a surface on the opposite side to the said mounting substrate of the said both heat-transfer members in the mounting substrate in which the said heat conduction path has arrange
  • the said heat-transfer support member is comprised with the metal material with high heat conductivity.
  • the mounting substrate is made of aluminum, aluminum alloy, copper, or the like having high thermal conductivity, heat dissipation to the cooling body can be performed more efficiently.
  • the said heat-transfer member is comprised with the insulator which has thermal conductivity. According to this 5th aspect, since the heat-transfer member is comprised with the insulator, the space
  • the 7th aspect of the power converter device which concerns on this invention is comprised with the elastic body in which the said heat-transfer member has heat conductivity and has a stretching property. According to this configuration, since the heat transfer member has elasticity, the heat transfer member can be brought into contact with the periphery of a heat-generating component or the like mounted on the mounting substrate, the contact area can be increased, and the heat dissipation effect can be improved.
  • the said heat-transfer member is being fixed in the state which compressed the said elastic body with the predetermined compression rate.
  • the elastic body is fixed in a compressed state, contact with the heat-generating component mounted on the mounting board can be performed more favorably, and the heat dissipation effect can be improved.
  • the 9th aspect of the power converter device which concerns on this invention is provided with the space
  • the heat transfer members are arranged on both the front and back surfaces of the mounting board on which the circuit components including the heat generating circuit components are mounted, and both the heat transfer members are connected to the cooling body through the heat conduction path. Therefore, the heat generation on the front and back sides of the mounting substrate can be efficiently radiated to the cooling body. For this reason, the combined use with the heat dissipation action from the housing and the housing lid can be reduced, and an inexpensive power conversion device that is reduced in size by suppressing the size of the housing and the housing lid can be provided. .
  • FIG. 1 is a cross-sectional view showing the overall configuration of a power converter according to the present invention.
  • reference numeral 1 denotes a power converter
  • the power converter 1 is housed in a housing 2.
  • the casing 2 is formed by molding a synthetic resin material, and includes a lower casing 2A and an upper casing 2B that are divided vertically with a cooling body 3 having a water-cooling jacket structure interposed therebetween.
  • the lower housing 2A is a bottomed rectangular tube.
  • the lower casing 2A has an open upper portion covered with a cooling body 3, and a smoothing film capacitor 4 is accommodated therein.
  • the upper housing 2B includes a rectangular tube 2a having an open upper end and a lower end, and a lid 2b that closes the upper end of the rectangular tube 2a.
  • the lower end of the rectangular tube 2a is closed by the cooling body 3.
  • a sealing material such as application of a liquid sealant or sandwiching rubber packing is interposed between the lower end of the rectangular tube 2a and the cooling body 3.
  • a cooling water supply port 3 a and a drainage port 3 b are opened to the outside of the housing 2, and a cooling water passage 3 c is formed between the water supply port 3 a and the drainage port 3 b.
  • the water supply port 3a and the drainage port 3b are connected to a cooling water supply source (not shown) via, for example, a flexible hose.
  • the cooling body 3 is formed, for example, by injection molding aluminum or aluminum alloy having high thermal conductivity (for example, 100 W ⁇ m ⁇ 1 ⁇ K ⁇ 1 or more).
  • the cooling body 3 has a flat bottom surface, and a concave portion 3d having a square shape when viewed from the plane is formed in the center on the top surface.
  • a rectangular protruding base 3e as viewed from above is formed, and a rectangular frame-shaped peripheral groove 3f is formed around the protruding base 3e.
  • the height of the protruding base 3e is lower than the upper surface of the cooling body 3, and is set substantially equal to the thickness of the bottom plates 39 of the heat transfer support side plates 35 and 37 described later.
  • the cooling body 3 is formed with an insertion hole 3g through which the positive and negative electrodes 4a covered with insulation of the film capacitor 4 held by the lower housing 2A are vertically inserted.
  • the power conversion apparatus 1 includes a semiconductor power module 11 that incorporates, for example, an insulated gate bipolar transistor (IGBT) as a semiconductor switching element that constitutes, for example, an inverter circuit for power conversion.
  • the semiconductor power module 11 includes an IGBT in a flat rectangular parallelepiped insulating case body 12, and a metal cooling member 13 is formed on the lower surface of the case body 12.
  • the case body 12 and the cooling member 13 are formed with insertion holes 15 through which the fixing screws 14 as the fixing members are inserted at the four corners when viewed from the plane.
  • the semiconductor power module 11 is mounted on the upper surface of the cooling body 3 by inserting the fixing screw 14 into the insertion holes 15 and screwing the tip of the male screw portion of the fixing screw into the cooling body 3.
  • substrate fixing portions 16 having a predetermined height are formed to protrude at four locations inside the insertion hole 15.
  • a driving circuit board 21 on which a driving circuit for driving an IGBT built in the semiconductor power module 11 is mounted is fixed to the upper end of the board fixing portion 16.
  • a control circuit including a heat generation circuit component having a relatively large heat generation amount or a high heat generation density for controlling the IGBT built in the semiconductor power module 11 with a predetermined interval above the drive circuit board 21 is mounted.
  • a control circuit board 22 as a mounting board is fixed.
  • the drive circuit board 21 is inserted into the insertion hole 21 a formed at a position facing the board fixing part 16, and the male screw part 24 a of the joint screw 24 is inserted, and the male screw part 24 a is formed on the upper surface of the board fixing part 16. It is fixed by screwing into the part 16a.
  • the control circuit board 22 inserts a fixing screw 25 into an insertion hole 22 a formed at a position facing the female screw portion 24 b formed at the upper end of the joint screw 24.
  • the joint screw 24 is fixed by being screwed to the female thread portion 24b.
  • the drive circuit board 21 is mounted with a circuit component that does not require cooling by the cooling body 3 and generates a small amount of heat
  • the control circuit board 22 has a heating circuit component that requires cooling by the cooling body.
  • the circuit component 26 to be included is mounted on both the front and back surfaces.
  • the control circuit board 22 has heat transfer members 27 and 28 arranged on the front and back sides. These heat transfer members 27 and 28 are elastic bodies having elasticity, and have the same outer dimensions as the control circuit board 22.
  • heat transfer members 27 and 28 for example, a member having improved heat transfer performance while exhibiting insulation performance by interposing a metal filler inside silicon rubber as an elastic body is applied.
  • These heat transfer members 27 and 28 are compressed to about 5 to 30% in the thickness direction, for example, so that the heat resistance is reduced and an efficient heat transfer effect can be exhibited.
  • plate-like heat transfer support plates 29 and 30 are arranged on the opposite sides of the heat transfer members 27 and 28 from the control circuit board 22.
  • These heat transfer support plates 29 and 30 are formed of a metal material such as aluminum, an aluminum alloy, or copper having high thermal conductivity (for example, 100 W ⁇ m ⁇ 1 ⁇ K ⁇ 1 or more) and rigidity.
  • the heat transfer support plates 29 and 30 are fixed to be screwed into the female screws 30a formed on the heat transfer support plate 30 from the upper surface side of the heat transfer support plate 29 through the heat transfer member 27, the control circuit board 22, and the heat transfer member 28. It is fixed by screws 31.
  • spacers 32 and 33 through which the fixing screws 31 are inserted are provided in the heat transfer members 27 and 28.
  • These spacers 32 and 33 are interval adjusting members having a heat transfer member management height H lower than the thickness T of the heat transfer members 27 and 28, and the heights of these spacers 32 and 33 are the heat transfer members 27 and 28. Is set to a height that compresses about 5 to 30% in the thickness direction.
  • the heat transfer members 27 and 28 are accurately compressed and fixed to about 5 to 30% in the thickness direction, and the heat transfer members 27 and 28 are fixed.
  • the heat resistance is reduced and an efficient heat transfer effect can be exhibited.
  • the compression rate of the heat transfer members 27 and 28 is managed by the height H of the spacers 32 and 33, appropriate tightening is performed without causing insufficient tightening or excessive tightening.
  • the heat transfer support plates 29 and 30 are laminated on the front and back of the control circuit board 22 in a solid state with the heat transfer members 27 and 28 interposed therebetween. For this reason, the heat transfer members 27 and 28 are brought into close contact with the circuit components including the heat generating circuit components mounted on the control circuit board 22, and the heat generation of the circuit components is transmitted through the heat transfer members 27 and 28. Heat is dissipated to 29 and 30.
  • the heat transfer support plate 29 has the left end at the same position as the left end of the control circuit board 22 and the heat transfer members 27 and 28, but the right end has the control circuit.
  • a connecting portion 29 a is formed to protrude rightward from the right ends of the substrate 22 and the heat transfer members 27 and 28.
  • a connecting hole 29b is formed through the connecting portion 29a.
  • the heat transfer support plate 30 has the right end portion at the same position as the right end of the control circuit board 22 and the heat transfer members 27 and 28, but the left end portion is controlled.
  • a connecting portion 30b is formed that protrudes to the left from the left ends of the circuit board 22 and the heat transfer members 27 and 28.
  • a connecting hole 30c is formed through the connecting portion 30a.
  • a heat transfer support side plate 35 that forms a heat conduction path independent of the upper housing 2 ⁇ / b> B is fixed and connected to the connecting portion 29 a of the heat transfer support plate 29 with a fixing screw 36.
  • the fixing screw 36 is screwed into a female screw (not shown) formed on the heat transfer support side plate 35 through the connection hole 29b from above the heat transfer support plate 29.
  • a heat transfer support side plate 37 that forms a heat conduction path independent of the upper housing 2 ⁇ / b> B is fixed to and connected to the connecting portion 30 b of the heat transfer support plate 30 by a fixing screw 38.
  • the fixing screw 38 is also screwed into a female screw (not shown) formed on the heat transfer support side plate 37 from above the heat transfer support plate 30 through the connection hole 30c.
  • the heat transfer support side plate 35 is formed in an inverted L shape by a vertical plate portion 35a and a connecting plate portion 35b extending leftward from the upper end of the vertical plate portion 35a.
  • the heat transfer support side plate 35 has a curved surface (R chamfer) 35c in which the connecting portion between the vertical plate portion 35a and the connecting plate portion 35b is a part of the cylindrical surface.
  • the heat transfer support side plate 37 is also formed in an inverted L shape by a vertical plate portion 37a and a connecting plate portion 37b extending rightward from the state of the vertical plate portion 37a.
  • the heat transfer support side plate 37 has a curved surface 37c (R chamfer) in which the connecting portion between the vertical plate portion 37a and the connecting plate portion 37b is a part of the cylindrical surface.
  • the heat transfer support side plates 35 and 37 are integrated by connecting the lower end sides of the vertical plate portions 35 a and 37 a with a common bottom plate 39.
  • the bottom plate 39 is formed in a square frame shape in which a square hole 39a is formed in the center portion to insert the protruding base portion 3e of the cooling body 3 and is accommodated in the circumferential groove 3f of the cooling body 3.
  • the curved plates (R chamfers) 35d and 37d in which the lower plates of the vertical plate portions 35a and 37a of the heat transfer support side plates 35 and 37 and the bottom plate 39 are connected to each other, are part of the cylindrical surface.
  • the upper and lower ends of the vertical plate portions 35a and 37a of the heat transfer support side plates 35 and 37 are formed as cylindrical curved surfaces 35c, 35d and 37c, 37d. For this reason, when vertical vibration or roll is transmitted to the power converter 1, stress concentration generated in the connecting portions of the vertical plate portions 35a and 37a, the connecting plate portions 35b and 37b, and the bottom plate 39 can be reduced. . Therefore, the heat resistance support side plates 35 and 37 can improve the vibration resistance against vertical vibration and roll when the control circuit board 22 is supported.
  • the vertical plate portions 35a and 37a are connected to the bottom plate 39, and the vertical plate portions 35a and 37a and the connection portions of the connection plate portions 35c and 37c are formed as cylindrical curved surfaces.
  • the heat conduction path can be shortened as compared with the case where the connecting portions between the connecting portions 37a and 37a and the bottom plate portion 34 and the connecting portions between the vertical plate portions 35a and 37a and the connecting plate portions 35b and 37b have a right-angled L shape. . For this reason, the heat conduction path from the heat transfer support plates 29 and 30 to the cooling body 3 can be shortened to enable efficient heat cooling.
  • An insulating sheet 40 is attached to the lower surface of the heat transfer support plate 30 facing the drive circuit board 21 in order to shorten the insulation distance.
  • the heat transfer support side plates 35 and 37 and the bottom plate 39 have black surfaces. In order to blacken the surfaces of the heat transfer support side plates 35 and 37 and the bottom plate 39, the surface may be coated with a black resin or painted with a black paint.
  • the heat transfer support side plates 35 and 37 and the bottom plate 39 black, the heat emissivity becomes larger than the metal material color, and the amount of radiant heat transfer can be increased. For this reason, the heat dissipation to the circumference
  • a bottom plate 39 common to the heat transfer support side plates 35 and 37 is disposed in the circumferential groove 3f of the cooling body 3, and the lower surface of the cooling member 13 formed on the semiconductor power module 11 is brought into contact with the upper surface of the bottom plate 39, and The semiconductor power module 11 and the bottom plate 39 are integrally fixed to the cooling body 3 with the fixing screw 14 in a state where the cooling member 13 is in contact with the protruding base portion 3 e of the cooling body 3.
  • the drive circuit board 21 is mounted on the board fixing part 16 formed on the upper surface of the semiconductor power module 11 before or after fixing to the cooling body 3. Then, the drive circuit board 21 is fixed to the board fixing portion 16 by four joint screws 24 from above.
  • At least three spacers that maintain an insulation distance between the drive circuit board 21 and the insulating sheet 40 are placed on a portion of the upper surface of the drive circuit board 21 where the circuit components at the peripheral edge are not mounted. Then, the heat transfer support plate 30, the heat transfer member 28, and the control circuit board 22 in which the insulating sheet 40 is bonded to the lower surface with the joint screw 24 as a reference are laminated in this order. At this time, the spacer 33 is inserted through the insertion portion of the fixing screw 31 of the heat transfer member 28.
  • the fixing screw 25 is inserted from the upper surface of the control circuit board 22 through the insertion hole 22 a and screwed into the female screw portion 24 b formed on the upper surface of the joint screw 24, so that the control circuit board 22 is connected to the upper end of the joint screw 24. Fix it.
  • the heat transfer member 27 having the spacer 32 inserted in the insertion portion of the fixing screw 31 is placed on the upper surface of the control circuit board 22, and the heat transfer support plate 29 is placed on the upper surface of the heat transfer member 27.
  • the fixing screw 31 is inserted from the upper surface of the heat transfer support plate 29, and is screwed into a female screw 30a formed on the heat transfer support plate 30 and tightened.
  • the heat transfer members 27 and 28 are compressed to a management height defined by the spacers 32 and 33. Therefore, the heat transfer members 27 and 28 are compressed by about 5 to 30%, the heat resistance of the heat transfer members 27 and 28 is reduced, and an efficient heat transfer effect can be exhibited.
  • a bus bar 50 is connected to the positive and negative DC input terminals of the semiconductor power module 11 to 11 a, and the positive and negative connection terminals of the film capacitor 4 penetrating the cooling body 3 at the other end of the bus bar 50.
  • 4a is connected with a fixing screw 51.
  • the upper housing 2B from which the lid 2b is removed is mounted on the upper surface of the cooling body 3 through a sealing material.
  • the rectangular tube 2a of the upper housing 2B is connected to a crimp terminal 53 fixed to the tip of a connection cord 52 connected to an external converter (not shown) and an external three-phase electric motor (not shown).
  • a crimp terminal 59 fixed to the tip of the connected motor cable 58 is inserted and supported in a liquid-tight manner.
  • the crimp terminal 53 fixed to the tip of the connection cord 52 is fixed to the DC input terminal 11 a of the semiconductor power module 11.
  • a bus bar 55 is connected to the three-phase AC output terminal 11 b of the semiconductor power module 11 with a fixing screw 56, and a current sensor 57 is disposed in the middle of the bus bar 55.
  • a crimp terminal 59 fixed to the tip of the motor cable 58 is fixed to the other end of the bus bar 55 with a fixing screw 60 and connected.
  • the upper open end of the rectangular tube 2a is sealed with a lid 2b via a sealing material.
  • the lower housing 2A is fixed to the lower surface of the cooling body 3 via a sealing material, and the assembly of the power converter 1 is completed.
  • the DC power is supplied to the semiconductor power module 11 from an external converter (not shown) via the connection cord 52, and the power supply circuit, the control circuit, and the like mounted on the control circuit board 22 are operated.
  • a gate signal composed of, for example, a pulse width modulation signal is supplied from the control circuit to the semiconductor power module 11 via the drive circuit mounted on the drive circuit board 21.
  • the IGBT built in the semiconductor power module 11 is controlled to convert DC power into AC power.
  • the converted AC power is supplied from the three-phase AC output terminal 11b to the external three-phase electric motor (not shown) via the bus bar 55 and further via the motor cable 58, and this three-phase electric motor (not shown) is supplied. Drive control.
  • heat is generated in the IGBT built in the semiconductor power module 11.
  • the generated heat is cooled by the cooling water supplied to the cooling body 3 because the cooling member 13 formed in the semiconductor power module 11 is in direct contact with the protruding base 3 e of the cooling body 3.
  • circuit components 26 such as a control circuit and a power supply circuit mounted on the control circuit board 22 include heat generating circuit components, and these heat generating circuit components generate heat.
  • the heat generating circuit components are mounted on the upper and lower surfaces of the control circuit board 22.
  • Heat transfer support plates 29 and 30 are provided on the upper and lower surfaces of the control circuit board 22 via heat transfer members 27 and 28 having high heat conductivity and elasticity.
  • the heat transfer members 27 and 28 are compressed by the fixing screw 31 at a compression rate of about 5 to 30% as described above, the heat resistance is reduced and an efficient heat transfer effect can be exhibited.
  • the contact area between the heat generating circuit component and the heat transfer members 27 and 28 is increased. Therefore, heat generated by the heat generating circuit components is efficiently transferred to the heat transfer members 27 and 28. Therefore, as shown in FIG. 4, the heat transferred to the heat transfer members 27 and 28 is efficiently transferred to the heat transfer support plates 29 and 30.
  • the heat transfer support plates 29 and 30 are connected to the heat transfer support plates 29 and 30, the heat transferred to the heat transfer support plates 29 and 30 passes through the heat transfer support plates 35 and 37. It is transmitted to the common bottom plate 39. Since the bottom plate 39 is in direct contact with the circumferential groove 3 f of the cooling body 3, the transmitted heat is radiated to the cooling body 3. Further, the heat transmitted to the bottom plate 39 is transmitted from the upper surface side to the cooling member 13 of the semiconductor power module 11, and is transmitted to the projecting base 3 e of the cooling body 3 through the cooling member 13 to be radiated.
  • the heat transfer members 27 and 28 are arranged on both the front and back surfaces of the control circuit board 22, and the heat transfer members 27 and 28 are transferred to the opposite side of the control circuit board 22. Since the support plates 29 and 30 are arranged, the heat generated by the heat generating circuit components mounted on the control circuit board 22 is not directly passed through the control circuit board 22 having a large thermal resistance, but directly through the heat transfer members 27 and 28. Thus, heat is transferred to the heat transfer support plates 29 and 30, so that efficient heat dissipation can be performed.
  • the heat transmitted to the heat transfer members 27 and 28 is transferred to the heat transfer support plates 29 and 30 and further transferred to the heat transfer support side plates 35 and 37.
  • the heat transfer support side plates 35 and 37 are provided along the long side of the semiconductor power module 11. For this reason, a wide heat transfer area can be taken, and a wide heat dissipation path can be secured.
  • the bent portions of the heat transfer support side plates 35 and 37 are cylindrical curved portions 35c, 35d and 37c, 37d, the heat transfer support side plates 35 and 37 are transferred to the cooling body 3 as compared with the case where the bent portions are L-shaped. The thermal distance can be shortened. For this reason, the heat dissipation efficiency can be further improved.
  • the heat transport amount Q can be expressed by the following equation (1).
  • Q ⁇ ⁇ (A / L) ⁇ T (1)
  • T is the temperature difference [° C.] substrate temperature T 1 -cooling body temperature T 2
  • A is the minimum heat transfer cross section [m 2 ]
  • L is the heat transfer length [m ].
  • the heat transfer support side plates 35 and 37 are integrated with a common bottom plate 39, there is no joint between the components between the heat transfer support side plates 35 and 37 and the bottom plate 39, thereby suppressing thermal resistance. it can.
  • the housing 2 is not included in the heat dissipation path from the control circuit board 22 on which the heat generating circuit components are mounted to the cooling body 3, it is not necessary to use a metal such as aluminum having high thermal conductivity for the housing 2. Since it can be made of a synthetic resin material, the weight can be reduced.
  • the heat dissipation path can be formed by the power converter 1 alone without the heat dissipation path depending on the housing 2, the semiconductor power module 11, the drive circuit board 21, and the control circuit board 22 are configured.
  • the power conversion device 1 can be applied to various types of housings 2 and cooling bodies 3.
  • the rigidity of the control circuit board 22 can be increased. For this reason, even when the power converter 1 is applied as a motor drive circuit for driving a vehicle driving motor, when the vertical vibration or roll shown in FIG. Since the heat transfer support plates 29 and 30 and the heat transfer support side plates 35 and 37 are integrated, the rigidity can be increased. Therefore, it is possible to provide the power conversion device 1 that is less affected by vertical vibrations and rolls.
  • the heat transfer members 27 and 28 are made of an insulator having heat transfer properties, insulation between the control circuit board 22 and the heat transfer support plates 29 and 30 can be performed. It can be shortened and the whole can be miniaturized.
  • the present invention is not limited to the above-described configuration, and the heat transfer members 27 and 28 may be provided only at locations where the heat generating circuit components exist. Further, by disposing the heat generating circuit components near the heat transfer support side plates 35 and 37 in the control circuit board 22, the distance of the heat radiation path to the cooling body 3 may be shortened. In this case, since the distance of the heat radiation path to the cooling body 3 of the heat generating circuit component is shortened, efficient heat radiation can be performed.
  • a circuit board is further mounted above the heat transfer support plate in the first embodiment described above. That is, in the second embodiment, as shown in FIGS. 6 and 7, for example, a power circuit component is provided on the upper surface side of the heat transfer support plate 29 on the upper surface side in the first embodiment via the heat transfer member 41.
  • the power supply circuit board 42 mounted with is mounted.
  • Other configurations have the same configurations as those in FIGS. 2 and 3 in the first embodiment described above, and corresponding parts to FIGS. 2 and 3 are denoted by the same reference numerals, and detailed description thereof is omitted. .
  • the fixing screw 31 of the first embodiment is omitted, and instead, a fixing screw 43 for fixing the control circuit board 22 and the heat transfer support plate 30 is provided.
  • the power supply circuit board 42 is fixed to the heat transfer support plate 29 via the heat transfer member 41 by the fixing screw 44 in the same manner as the control circuit board 22 described above.
  • a spacer 45 is disposed in the insertion portion of the fixing screw 44 of the heat transfer member 41. The height of the spacer 45 is such that the compression rate of the heat transfer member 41 is 5 to 30%. It is set to become.
  • the female screw portion 24 b at the upper end of the joint screw 24 is connected to the lower end of the joint screw 46 that is the same as the joint screw 24.
  • the control circuit board 22 is fixed on the joint screw 24 by screwing the formed male screw portion 46a.
  • the power supply circuit board 42 is fixed by screwing the fixing screw 47 into the female screw portion 46 b formed at the upper end of the joint screw 46.
  • the compression rate of the heat transfer member 27 interposed between the control circuit board 22 and the heat transfer support plate 29 is defined by the height of the joint screw 46. That is, the space between the heat transfer support plate 29 and the power supply circuit board 42 is fixed so that the spacer 45 is screwed into the female screw portion 29c formed on the heat transfer support plate 29 through the spacer 45 from above the power supply circuit board 42. And a screw 44.
  • the height H2 between the upper surface and the lower surface of the joint screw 46 is about 5 to 30% of the height of the spacer 45, the thickness of the heat transfer support plate 29 and the heat transfer member 27 as shown in FIG. It is set to the height obtained by adding the height when compressed.
  • the mounting height position of the control circuit board 22 is defined by screwing the male screw portion 46 a formed on the lower surface of the joint screw 46 with the female screw portion 24 b formed on the upper end of the joint screw 24.
  • the heat transfer support plate 29 and the power supply circuit board 42 integrated with the fixing screw 44 are disposed on the upper surface of the heat transfer member 27 through the insertion holes 27a formed in the heat transfer member 27.
  • the heat transfer member 27 can be compressed and fixed at a compression rate of about 5 to 30% by fixing the power supply circuit board 42 to the upper surface of the joint screw 46 with the fixing screw 47.
  • the heat generation of the heat generating circuit components mounted on the control circuit board 22 is performed by the heat transfer members 27 and 28 arranged on the front and back surfaces, as in the first embodiment. Heat is transferred to the heat transfer support plates 29 and 30, transferred to the heat transfer support side plates 35 and 37, and radiated to the cooling body 3. At the same time, the heat generating circuit components mounted on the power supply circuit board 42 also transfer heat to the heat transfer support plate 29 via the heat transfer member 41 and further transfer heat to the heat transfer support side plate 35 to dissipate heat to the cooling body 3. it can.
  • the cooling member 61 formed in the semiconductor power module 11 includes cooling fins 61 that directly contact the cooling water flowing through the cooling body 3. You may make it set it as the structure provided. In this case, an immersion part 62 for immersing the cooling fin 61 in the cooling water passage is formed in the central part of the cooling body 3.
  • a sealing member 66 such as an O-ring is disposed between the peripheral wall 63 surrounding the immersion part 62 and the cooling member 13. According to this configuration, the cooling fins 61 are formed on the cooling member 13 of the semiconductor power module 11, and the cooling fins 61 are immersed in the cooling water in the cooling water at the immersion part 62, so that the semiconductor power module 11 is more efficiently used. Can be cooled.
  • the present invention is not limited to the above configuration, and the heat transfer support plates 29 and 30 and the heat transfer support side plates 35 and 37 may be configured integrally. In this case, since no seam is formed between the heat transfer support plates 29 and 30 and the heat transfer support side plates 35 and 37, more efficient heat dissipation can be achieved by reducing the thermal resistance. it can.
  • the case where the heat transfer members 27 and 28 inserted between the control circuit board 22 and the heat transfer support plates 29 and 30 have elasticity has been described.
  • the heat-transfer member which does not have elasticity such as an insulating-coated metal plate, can also be applied.
  • the heat transfer support side plates 35 and 37 are disposed separately from the upper housing 2B surrounding the semiconductor power module 11, the cooling body 3, the drive circuit board 21, and the control circuit board 22.
  • the present invention is not limited to the above configuration.
  • the heat transfer support side plates 35 and 37 are omitted and the heat transfer support plate 29 is omitted.
  • And 30 may be directly supported by the upper casing 2B.
  • the drive circuit board 21 can be omitted.
  • the film capacitor 4 is applied as a smoothing capacitor.
  • the present invention is not limited to this, and a cylindrical electrolytic capacitor is applied. Also good.
  • the present invention is not limited to this, and the present invention is also applied to a rail vehicle traveling on a rail.
  • the invention can be applied and can be applied to any electric drive vehicle.
  • the power conversion device is not limited to an electrically driven vehicle, and the power conversion device of the present invention can be applied when driving an actuator such as an electric motor in other industrial equipment.
  • a heat transfer member is arranged on both front and back surfaces of a mounting board on which circuit components including a heat generating circuit part are mounted, and both the heat transfer members have a semiconductor switching element built in a case body and a mounting board.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Thermal Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Dc-Dc Converters (AREA)

Abstract

Provided is a power conversion device which is capable of miniaturization and of efficiently radiating, into a cooling body, heat from a heat-generating circuit component mounted on a substrate. This power conversion device (1) is provided with a semiconductor power module (11) with one surface bonded to the cooling body (3), a mounting substrate (22) on which circuit components are mounted that include a heat-generating circuit component which drives the semiconductor power module (11), and heat conduction paths (35, 37) which transfer the heat from the mounting substrate into the cooling body (3). Heat conducting members (27, 28) are arranged on both the front and back surfaces of the mounting substrate (22).

Description

電力変換装置Power converter
　本発明は、電力変換用の半導体スイッチング素子を内蔵した半導体パワーモジュール上に、半導体スイッチング素子を駆動する発熱回路部品を含む回路部品を実装した実装基板を支持する電力変換装置に関する。 The present invention relates to a power conversion apparatus for supporting a mounting substrate on which a circuit component including a heat generating circuit component for driving a semiconductor switching element is mounted on a semiconductor power module incorporating a semiconductor switching element for power conversion.
　この種の電力変換装置としては、特許文献１に記載された電力変換装置が知られている。この電力変換装置は、筐体内に、水冷ジャケットを配置し、この水冷ジャケット上に電力変換用の半導体スイッチング素子としてのＩＧＢＴを内蔵した半導体パワーモジュールを配置して冷却するようにしている。また、筐体内には、半導体パワーモジュールの水冷ジャケットとは反対側に所定距離を保って制御回路基板及び駆動回路基板を配置し、この制御回路基板及び駆動回路基板で発生する熱を、放熱部材を介して制御回路基板及び駆動回路基板を支持する金属ベース板に伝達し、さらに金属ベース板に伝達された熱を、この金属ベース板を支持する筐体の側壁を介して水冷ジャケットに伝達するようにしている。 As this type of power conversion device, the power conversion device described in Patent Document 1 is known. In this power conversion device, a water cooling jacket is disposed in a casing, and a semiconductor power module including an IGBT as a semiconductor switching element for power conversion is disposed on the water cooling jacket to cool the power conversion apparatus. In addition, a control circuit board and a drive circuit board are arranged in the casing at a predetermined distance on the side opposite to the water cooling jacket of the semiconductor power module, and heat generated by the control circuit board and the drive circuit board is radiated from the heat dissipation member. The heat is transmitted to the metal base plate supporting the control circuit board and the drive circuit board through the metal plate, and the heat transmitted to the metal base plate is transmitted to the water cooling jacket through the side wall of the housing supporting the metal base plate. I am doing so.
特許第４６５７３２９号公報Japanese Patent No. 4657329
　ところで、上記特許文献１に記載された従来例にあっては、制御回路基板で発生する熱を、制御回路基板→放熱部材→金属ベース板→筐体→水冷ジャケットという経路で放熱するようにしている。このため、筐体が伝熱経路の一部として利用されることにより、筐体にも良好な伝熱性が要求されることになり、筐体形成材料が熱伝導率の高い金属に限定され、小型軽量化の要求される電力変換装置おいて、樹脂等の軽量な材料の選択が不可能となり軽量化が困難となるという未解決の課題がある。 By the way, in the conventional example described in Patent Document 1, the heat generated in the control circuit board is radiated through the path of the control circuit board → the heat radiating member → the metal base plate → the housing → the water cooling jacket. Yes. For this reason, since the casing is used as a part of the heat transfer path, the casing is required to have good heat transfer properties, and the casing forming material is limited to a metal having high thermal conductivity, In a power conversion device that is required to be small and light, there is an unsolved problem that it is difficult to select a light material such as a resin and it is difficult to reduce the weight.
　また、筐体には、防水・防塵が要求されることが多いため、金属ベース板と筐体との間、筐体と水冷ジャケットとの間には液状シール剤の塗布やゴム製パッキンの挟み込みなどが一般的に行われている。液状シール剤やゴム製パッキンは熱伝導率が一般的に低く、これらが熱冷却経路に介在することで熱抵抗が増え冷却効率が低下するという未解決の課題もある。この未解決の課題を解決するためには、基板や実装部品の除去しきれない発熱を筐体や筐体蓋からの自然対流による放熱も必要となり、筐体や筐体蓋の表面積を大きくするために、筐体や筐体蓋の外形が大きくなり電力変換装置が大型化することになる。 Also, since the housing is often required to be waterproof and dustproof, apply a liquid sealant or sandwich rubber packing between the metal base plate and the housing and between the housing and the water cooling jacket. Etc. are generally performed. Liquid sealants and rubber packings generally have a low thermal conductivity, and there is an unsolved problem that the thermal resistance increases and the cooling efficiency decreases due to the presence of these in the thermal cooling path. In order to solve this unsolved problem, it is also necessary to dissipate the heat generated by the substrate and mounted components by natural convection from the case and case cover, increasing the surface area of the case and case cover. For this reason, the outer shape of the housing and the housing lid is increased, and the power converter is increased in size.
　そこで、本発明は、上記従来例の未解決の課題に着目してなされたものであり、基板に実装された発熱回路部品の熱を効率よく冷却体に放熱することができ、小型化が可能な電力変換装置を提供することを目的としている。 Therefore, the present invention has been made paying attention to the unsolved problems of the above-described conventional example, and can efficiently dissipate the heat of the heat generating circuit components mounted on the substrate to the cooling body, and can be downsized. It aims at providing a simple power converter.
　上記目的を達成するために、本発明に係る電力変換装置の第１の態様は、一面を冷却体に接合する半導体パワーモジュールと、前記半導体パワーモジュールを駆動する発熱回路部品を含む回路部品を実装した実装基板と、前記実装基板の熱を前記冷却体に伝熱させる熱伝導路とを備えている。そして、前記実装基板は、表裏両面に伝熱部材が配置されている。
　この構成によると、実装基板に実装されている発熱回路部品の熱を表裏両面の伝熱部材を介して冷却体に放熱することができる。 In order to achieve the above object, a first aspect of a power conversion device according to the present invention includes a semiconductor power module in which one surface is joined to a cooling body and a circuit component including a heat generating circuit component that drives the semiconductor power module. And a heat conduction path for transferring heat of the mounting substrate to the cooling body. And as for the said mounting substrate, the heat-transfer member is arrange | positioned on both front and back.
According to this configuration, the heat of the heat generating circuit component mounted on the mounting board can be radiated to the cooling body via the heat transfer members on both the front and back surfaces.
　また、本発明に係る電力変換装置の第２の態様は、電力変換用の半導体スイッチング素子をケース体に内蔵する半導体パワーモジュールと、該半導体パワーモジュールの一方の面に配置された冷却体と、該半導体パワーモジュールの他方の面上に支持される前記半導体スイッチング素子を駆動する発熱回路部品を含む回路部品を実装した複数の実装基板とを備えている。そして、前記複数の実装基板のうち少なくとも１枚の実装基板は、表裏両面に個別に伝熱部材が配置され、前記発熱回路部品の発熱を、両伝熱部材を介し、さらに前記半導体パワーモジュール及び前記各実装基板を囲む筐体とは独立した複数の熱伝導路を通って前記冷却体に放熱するようにしている。 Moreover, the second aspect of the power conversion device according to the present invention is a semiconductor power module in which a semiconductor switching element for power conversion is built in a case body, a cooling body disposed on one surface of the semiconductor power module, And a plurality of mounting boards on which circuit components including a heat generating circuit component for driving the semiconductor switching element supported on the other surface of the semiconductor power module are mounted. And at least one mounting board among the plurality of mounting boards is provided with heat transfer members individually on both front and back surfaces, and heat generation of the heat generating circuit components is conducted via both heat transfer members, and further the semiconductor power module and Heat is radiated to the cooling body through a plurality of heat conduction paths independent of the casing surrounding each mounting substrate.
　この構成によると、実装基板に実装されている発熱回路部品の熱を表裏両面の伝熱部材を介して冷却体に放熱することができる。この場合、実装基板と冷却体との間の複数の熱伝導路が半導体パワーモジュール及び各実装基板を囲む筐体とは独立して形成されているので、筐体の熱伝導率を考慮することなく筐体を形成することができ、設計の自由度を向上できる。 According to this configuration, the heat of the heat generating circuit components mounted on the mounting board can be radiated to the cooling body via the heat transfer members on both the front and back surfaces. In this case, since the plurality of heat conduction paths between the mounting substrate and the cooling body are formed independently of the housing surrounding the semiconductor power module and each mounting substrate, the heat conductivity of the housing should be considered. A housing can be formed without any problems, and the degree of freedom in design can be improved.
　また、本発明に係る電力変換装置の第３の態様は、前記表裏両面に伝熱部材を配置した実装基板と、当該実装基板の少なくとも一方の面に対向する実装基板との間に、前記伝熱部材が中実状態で配置されている。
　この構成によると、２枚の実装基板間に伝熱部材が中実状態で介在されているので、両実装基板間に空気層が形成されることないので、放熱効果を向上させることができる。 In a third aspect of the power conversion device according to the present invention, the power transmission is provided between a mounting board on which heat transfer members are arranged on both the front and back surfaces and a mounting board facing at least one surface of the mounting board. The thermal member is disposed in a solid state.
According to this configuration, since the heat transfer member is interposed between the two mounting boards in a solid state, an air layer is not formed between the two mounting boards, so that the heat dissipation effect can be improved.
　また、本発明に係る電力変換装置の第４の態様は、前記熱伝導路が、前記表裏両面に伝熱部材を配置した実装基板における前記両伝熱部材の前記実装基板とは反対側の面にそれぞれ固定された一対の伝熱支持部材を備え、該一対の伝熱支持部材が前記冷却体に連結されている。
　この構成によると、両面に伝熱部材を配置した実装基板が伝熱支持部材でサンドイッチ構造となるので、これら伝熱支持部材を通じての冷却体への放熱を効率よく行うことができる。 Moreover, the 4th aspect of the power converter device which concerns on this invention is a surface on the opposite side to the said mounting substrate of the said both heat-transfer members in the mounting substrate in which the said heat conduction path has arrange | positioned the heat-transfer member on the said front and back both surfaces And a pair of heat transfer support members fixed to each other, and the pair of heat transfer support members are connected to the cooling body.
According to this configuration, since the mounting substrate having the heat transfer members arranged on both sides has a sandwich structure with the heat transfer support members, heat can be efficiently radiated to the cooling body through these heat transfer support members.
　また、本発明に係る電力変換装置の第５の態様は、前記伝熱支持部材が、熱伝導率の高い金属材料で構成されている。
　この構成によると、実装基板を熱伝導率の高いアルミニウム、アルミニウム合金、銅等で構成するので、冷却体への放熱をより効率よく行うことができる。
　また、本発明に係る電力変換装置の第６の態様は、前記伝熱部材が、熱伝導性を有する絶縁体で構成されている。
　この第５の態様によると、伝熱部材が絶縁体で構成されているので、対向する実装基板同士の間隔を狭く設定することができ、電力変換装置を小型化することができる。 Moreover, as for the 5th aspect of the power converter device which concerns on this invention, the said heat-transfer support member is comprised with the metal material with high heat conductivity.
According to this configuration, since the mounting substrate is made of aluminum, aluminum alloy, copper, or the like having high thermal conductivity, heat dissipation to the cooling body can be performed more efficiently.
Moreover, as for the 6th aspect of the power converter device which concerns on this invention, the said heat-transfer member is comprised with the insulator which has thermal conductivity.
According to this 5th aspect, since the heat-transfer member is comprised with the insulator, the space | interval of the mounting substrates which oppose can be set narrow, and a power converter device can be reduced in size.
　また、本発明に係る電力変換装置の第７の態様は、前記伝熱部材が、熱伝導性を有し且つ伸縮性を有する弾性体で構成されている。
　この構成によると、伝熱部材が伸縮性を有するので、実装基板に実装された発熱部品等の周囲に接触させることができ、接触面積を増加させて、放熱効果を向上させることができる。 Moreover, the 7th aspect of the power converter device which concerns on this invention is comprised with the elastic body in which the said heat-transfer member has heat conductivity and has a stretching property.
According to this configuration, since the heat transfer member has elasticity, the heat transfer member can be brought into contact with the periphery of a heat-generating component or the like mounted on the mounting substrate, the contact area can be increased, and the heat dissipation effect can be improved.
　また、本発明に係る電力変換装置の第８の態様は、前記伝熱部材が、前記弾性体を所定圧縮率で圧縮した状態で固定されている。
　この構成によると、弾性体を圧縮した状態で固定するので、実装基板に実装された発熱部品との接触をより良好に行うことができ、放熱効果を向上させることができる。
　また、本発明に係る電力変換装置の第９の態様は、前記伝熱部材には、前記弾性体の圧縮率を決定する間隔調整部材が設けられている。
　この構成によると、弾性体の圧縮率を間隔調整部材によって決定することができ、弾性体の圧縮率を一定値に容易に調整することができる。 Moreover, as for the 8th aspect of the power converter device which concerns on this invention, the said heat-transfer member is being fixed in the state which compressed the said elastic body with the predetermined compression rate.
According to this configuration, since the elastic body is fixed in a compressed state, contact with the heat-generating component mounted on the mounting board can be performed more favorably, and the heat dissipation effect can be improved.
Moreover, the 9th aspect of the power converter device which concerns on this invention is provided with the space | interval adjustment member which determines the compression rate of the said elastic body in the said heat-transfer member.
According to this configuration, the compression rate of the elastic body can be determined by the interval adjusting member, and the compression rate of the elastic body can be easily adjusted to a constant value.
　本発明によれば、発熱回路部品を含む回路部品を実装した実装基板の表裏両面に伝熱部材を配置し、これら両伝熱部材が熱伝導路を通って冷却体に連結されるようにしたので、実装基板の表裏の発熱を効率よく冷却体に放熱することができる。このため、筐体や筐体蓋からの放熱作用との併用を減少させることができ、筐体や筐体蓋の大きさを抑えて小型化された安価な電力変換装置を提供することができる。 According to the present invention, the heat transfer members are arranged on both the front and back surfaces of the mounting board on which the circuit components including the heat generating circuit components are mounted, and both the heat transfer members are connected to the cooling body through the heat conduction path. Therefore, the heat generation on the front and back sides of the mounting substrate can be efficiently radiated to the cooling body. For this reason, the combined use with the heat dissipation action from the housing and the housing lid can be reduced, and an inexpensive power conversion device that is reduced in size by suppressing the size of the housing and the housing lid can be provided. .
本発明に係る電力変換装置の第１の実施形態の全体構成を示す断面図である。It is sectional drawing which shows the whole structure of 1st Embodiment of the power converter device which concerns on this invention. 第１の実施形態の要部を示す拡大断面図である。It is an expanded sectional view showing the important section of a 1st embodiment. 実装基板、伝熱部材、伝熱支持板の積層状態を示す拡大断面図である。It is an expanded sectional view which shows the lamination | stacking state of a mounting substrate, a heat-transfer member, and a heat-transfer support plate. 発熱回路部品の放熱経路を説明する図である。It is a figure explaining the heat dissipation path | route of a heat generating circuit component. 電力変換装置に対して上下振動や横揺れが作用した状態を示す図である。It is a figure which shows the state which the vertical vibration and the roll acted with respect to the power converter device. 本発明の第２の実施形態を示す図２と同様の断面図である。It is sectional drawing similar to FIG. 2 which shows the 2nd Embodiment of this invention. 本発明の第２の実施形態を示す図３と同様の拡大断面図である。It is an expanded sectional view similar to FIG. 3 which shows the 2nd Embodiment of this invention. 半導体パワーモジュールの冷却部材の変形例を示す断面図である。It is sectional drawing which shows the modification of the cooling member of a semiconductor power module.
　以下、本発明の実施の形態を図面について説明する。
　図１は本発明に係る電力変換装置の全体構成を示す断面図である。
　図中、１は電力変換装置であって、この電力変換装置１は筐体２内に収納されている。筐体２は、合成樹脂材を成形したものであり、水冷ジャケットの構成を有する冷却体３を挟んで上下に分割された下部筐体２Ａ及び上部筐体２Ｂで構成されている。 Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a cross-sectional view showing the overall configuration of a power converter according to the present invention.
In the figure, reference numeral 1 denotes a power converter, and the power converter 1 is housed in a housing 2. The casing 2 is formed by molding a synthetic resin material, and includes a lower casing 2A and an upper casing 2B that are divided vertically with a cooling body 3 having a water-cooling jacket structure interposed therebetween.
　下部筐体２Ａは有底角筒体で構成されている。この下部筐体２Ａは開放上部が冷却体３で覆われ、内部に平滑用のフィルムコンデンサ４が収納されている。
　上部筐体２Ｂは、上端及び下端を開放した角筒体２ａと、この角筒体２ａの上端を閉塞する蓋体２ｂとを備えている。そして、角筒体２ａの下端が冷却体３で閉塞されている。この角筒体２ａの下端と冷却体３との間には、図示しないが、液状シール剤の塗布やゴム製パッキンの挟み込みなどのシール材が介在されている。 The lower housing 2A is a bottomed rectangular tube. The lower casing 2A has an open upper portion covered with a cooling body 3, and a smoothing film capacitor 4 is accommodated therein.
The upper housing 2B includes a rectangular tube 2a having an open upper end and a lower end, and a lid 2b that closes the upper end of the rectangular tube 2a. The lower end of the rectangular tube 2a is closed by the cooling body 3. Although not shown, a sealing material such as application of a liquid sealant or sandwiching rubber packing is interposed between the lower end of the rectangular tube 2a and the cooling body 3.
　冷却体３は、冷却水の給水口３ａ及び排水口３ｂが筐体２の外方に開口され、給水口３ａ及び排水口３ｂ間に冷却水通路３ｃが形成されている。これら給水口３ａ及び排水口３ｂは例えばフレキシブルホースを介して図示しない冷却水供給源に接続されている。この冷却体３は例えば熱伝導率の高い（例えば１００Ｗ・ｍ-1・Ｋ-1以上）アルミニウム、アルミニウム合金を射出成形して形成されている。 In the cooling body 3, a cooling water supply port 3 a and a drainage port 3 b are opened to the outside of the housing 2, and a cooling water passage 3 c is formed between the water supply port 3 a and the drainage port 3 b. The water supply port 3a and the drainage port 3b are connected to a cooling water supply source (not shown) via, for example, a flexible hose. The cooling body 3 is formed, for example, by injection molding aluminum or aluminum alloy having high thermal conductivity (for example, 100 W · m −1 · K −1 or more).
　そして、冷却体３は、下面が平坦面とされ、上面には中央部に平面から見て方形の凹部３ｄが形成されている。この凹部３ｄの中央部には、平面から見て方形の突出台部３ｅが形成され、この突出台部３ｅの周囲に角枠状の周溝３ｆが形成されている。この突出台部３ｅの高さは冷却体３の上面より低く、後述する伝熱支持側板３５及び３７の底板３９の厚みと略等しく設定されている。また、冷却体３には、下部筐体２Ａに保持されたフィルムコンデンサ４の絶縁被覆された正負の電極４ａを上下に挿通する挿通孔３ｇが形成されている。 The cooling body 3 has a flat bottom surface, and a concave portion 3d having a square shape when viewed from the plane is formed in the center on the top surface. At the center of the recess 3d, a rectangular protruding base 3e as viewed from above is formed, and a rectangular frame-shaped peripheral groove 3f is formed around the protruding base 3e. The height of the protruding base 3e is lower than the upper surface of the cooling body 3, and is set substantially equal to the thickness of the bottom plates 39 of the heat transfer support side plates 35 and 37 described later. The cooling body 3 is formed with an insertion hole 3g through which the positive and negative electrodes 4a covered with insulation of the film capacitor 4 held by the lower housing 2A are vertically inserted.
　電力変換装置１は、図２とともに参照して明らかなように、電力変換用の例えばインバータ回路を構成する半導体スイッチング素子として例えば絶縁ゲートバイポーラトランジスタ（ＩＧＢＴ）を内蔵した半導体パワーモジュール１１を備えている。
　この半導体パワーモジュール１１は、扁平な直方体状の絶縁性のケース体１２内にＩＧＢＴを内蔵しており、ケース体１２の下面に金属製の冷却部材１３が形成されている。 As is apparent from FIG. 2, the power conversion apparatus 1 includes a semiconductor power module 11 that incorporates, for example, an insulated gate bipolar transistor (IGBT) as a semiconductor switching element that constitutes, for example, an inverter circuit for power conversion. .
The semiconductor power module 11 includes an IGBT in a flat rectangular parallelepiped insulating case body 12, and a metal cooling member 13 is formed on the lower surface of the case body 12.
　ケース体１２及び冷却部材１３には平面からみて四隅に固定部材としての固定ねじ１４を挿通する挿通孔１５が形成されている。これら挿通孔１５内に固定ねじ１４を挿通し，固定ねじの雄ねじ部の先端を冷却体３に螺合させることにより、半導体パワーモジュール１１が冷却体３の上面に装着される。
　また、ケース体１２の上面には、挿通孔１５の内側における４箇所に所定高さの基板固定部１６が突出形成されている。 The case body 12 and the cooling member 13 are formed with insertion holes 15 through which the fixing screws 14 as the fixing members are inserted at the four corners when viewed from the plane. The semiconductor power module 11 is mounted on the upper surface of the cooling body 3 by inserting the fixing screw 14 into the insertion holes 15 and screwing the tip of the male screw portion of the fixing screw into the cooling body 3.
In addition, on the upper surface of the case body 12, substrate fixing portions 16 having a predetermined height are formed to protrude at four locations inside the insertion hole 15.
　この基板固定部１６の上端には、半導体パワーモジュール１１に内蔵されたＩＧＢＴを駆動する駆動回路等が実装された駆動回路基板２１が固定されている。また、駆動回路基板２１の上方に所定間隔を保って半導体パワーモジュール１１に内蔵されたＩＧＢＴを制御する相対的に発熱量の大きい、又は発熱密度の大きい発熱回路部品を含む制御回路等を実装した実装基板としての制御回路基板２２が固定されている。 A driving circuit board 21 on which a driving circuit for driving an IGBT built in the semiconductor power module 11 is mounted is fixed to the upper end of the board fixing portion 16. In addition, a control circuit including a heat generation circuit component having a relatively large heat generation amount or a high heat generation density for controlling the IGBT built in the semiconductor power module 11 with a predetermined interval above the drive circuit board 21 is mounted. A control circuit board 22 as a mounting board is fixed.
　そして、駆動回路基板２１は、基板固定部１６に対向する位置に形成した挿通孔２１ａ内に継ぎねじ２４の雄ねじ部２４ａを挿通し、この雄ねじ部２４ａを基板固定部１６の上面に形成した雌ねじ部１６ａに螺合することにより固定されている。
　また、制御回路基板２２は、図３に示すように、継ぎねじ２４の上端に形成した雌ねじ部２４ｂに対向する位置に形成した挿通孔２２ａ内に固定ねじ２５を挿通し、この固定ねじ２５を継ぎねじ２４の雌ねじ部２４ｂに螺合することにより固定されている。 Then, the drive circuit board 21 is inserted into the insertion hole 21 a formed at a position facing the board fixing part 16, and the male screw part 24 a of the joint screw 24 is inserted, and the male screw part 24 a is formed on the upper surface of the board fixing part 16. It is fixed by screwing into the part 16a.
Further, as shown in FIG. 3, the control circuit board 22 inserts a fixing screw 25 into an insertion hole 22 a formed at a position facing the female screw portion 24 b formed at the upper end of the joint screw 24. The joint screw 24 is fixed by being screwed to the female thread portion 24b.
　ここで、駆動回路基板２１には、冷却体３による冷却を必要としない発熱量が小さい回路部品が実装されており、制御回路基板２２には、冷却体による冷却を必要とする発熱回路部品を含む回路部品２６が表裏両面に実装されている。
　そして、制御回路基板２２は、表裏に伝熱部材２７及び２８が配置されている。これら伝熱部材２７及び２８は、伸縮性を有する弾性体で制御回路基板２２と同じ外形寸法に構成されている。 Here, the drive circuit board 21 is mounted with a circuit component that does not require cooling by the cooling body 3 and generates a small amount of heat, and the control circuit board 22 has a heating circuit component that requires cooling by the cooling body. The circuit component 26 to be included is mounted on both the front and back surfaces.
The control circuit board 22 has heat transfer members 27 and 28 arranged on the front and back sides. These heat transfer members 27 and 28 are elastic bodies having elasticity, and have the same outer dimensions as the control circuit board 22.
　これら伝熱部材２７及び２８としては、例えば弾性体としてのシリコンゴムの内部に金属フィラーを介在させることにより絶縁性能を発揮しながら伝熱性を高めたものが適用されている。これら伝熱部材２７及び２８は、例えば厚み方向に５～３０％程度に圧縮することにより、熱抵抗が減り効率良い伝熱効果を発揮することができる。
　このため、各伝熱部材２７及び２８の制御回路基板２２とは反対側には、板状の伝熱支持板２９及び３０が配置されている。これら伝熱支持板２９及び３０は熱伝導率が高く（例えば１００Ｗ・ｍ-1・Ｋ-1以上）剛性があるアルミニウム、アルミニウム合金、銅等の金属材料で形成されている。 As these heat transfer members 27 and 28, for example, a member having improved heat transfer performance while exhibiting insulation performance by interposing a metal filler inside silicon rubber as an elastic body is applied. These heat transfer members 27 and 28 are compressed to about 5 to 30% in the thickness direction, for example, so that the heat resistance is reduced and an efficient heat transfer effect can be exhibited.
For this reason, plate-like heat transfer support plates 29 and 30 are arranged on the opposite sides of the heat transfer members 27 and 28 from the control circuit board 22. These heat transfer support plates 29 and 30 are formed of a metal material such as aluminum, an aluminum alloy, or copper having high thermal conductivity (for example, 100 W · m −1 · K −1 or more) and rigidity.
　そして、伝熱支持板２９及び３０は伝熱支持板２９の上面側から伝熱部材２７、制御回路基板２２、伝熱部材２８を通じて伝熱支持板３０に形成された雌ねじ３０ａに螺合する固定ねじ３１によって固定されている。この伝熱支持板２９及び３０を固定する際に、伝熱部材２７及び２８に固定ねじ３１を挿通する間座３２及び３３を設けている。
　これら間座３２及び３３は、伝熱部材２７及び２８の厚みＴより低い伝熱部材管理高さＨを有する間隔調整部材とされ、これら間座３２及び３３の高さが伝熱部材２７及び２８を厚み方向に５～３０％程度圧縮する高さに設定されている。 The heat transfer support plates 29 and 30 are fixed to be screwed into the female screws 30a formed on the heat transfer support plate 30 from the upper surface side of the heat transfer support plate 29 through the heat transfer member 27, the control circuit board 22, and the heat transfer member 28. It is fixed by screws 31. When the heat transfer support plates 29 and 30 are fixed, spacers 32 and 33 through which the fixing screws 31 are inserted are provided in the heat transfer members 27 and 28.
These spacers 32 and 33 are interval adjusting members having a heat transfer member management height H lower than the thickness T of the heat transfer members 27 and 28, and the heights of these spacers 32 and 33 are the heat transfer members 27 and 28. Is set to a height that compresses about 5 to 30% in the thickness direction.
　したがって、伝熱支持板２９及び３０を固定ねじ３１で固定したときに、伝熱部材２７及び２８が厚み方向に５～３０％程度に正確に圧縮されて固定され、伝熱部材２７及び２８の熱抵抗が減って効率の良い伝熱効果を発揮することができる。このとき、伝熱部材２７及び２８の圧縮率は間座３２及び３３の高さＨによって管理されるので、締め付け不足や締め付け過剰が生じることなく、適切な締め付けが行われる。 Therefore, when the heat transfer support plates 29 and 30 are fixed with the fixing screws 31, the heat transfer members 27 and 28 are accurately compressed and fixed to about 5 to 30% in the thickness direction, and the heat transfer members 27 and 28 are fixed. The heat resistance is reduced and an efficient heat transfer effect can be exhibited. At this time, since the compression rate of the heat transfer members 27 and 28 is managed by the height H of the spacers 32 and 33, appropriate tightening is performed without causing insufficient tightening or excessive tightening.
　このようにして、制御回路基板２２の表裏に伝熱支持板２９及び３０が伝熱部材２７及び２８を介在させた中実状態で積層される。このため、伝熱部材２７及び２８が制御回路基板２２に実装された発熱回路部品を含む回路部品に密着することになり、回路部品の発熱を伝熱部材２７及び２８を介して伝熱支持板２９及び３０に放熱する。 In this way, the heat transfer support plates 29 and 30 are laminated on the front and back of the control circuit board 22 in a solid state with the heat transfer members 27 and 28 interposed therebetween. For this reason, the heat transfer members 27 and 28 are brought into close contact with the circuit components including the heat generating circuit components mounted on the control circuit board 22, and the heat generation of the circuit components is transmitted through the heat transfer members 27 and 28. Heat is dissipated to 29 and 30.
　そして、伝熱支持板２９は、図２及び図３に示すように、左端部は制御回路基板２２、伝熱部材２７及び２８の左端と同じ位置とされているが、右端部は、制御回路基板２２、伝熱部材２７及び２８の右端より右方に突出する連結部２９ａが形成されている。この連結部２９ａには、図３に拡大して示すように、連結孔２９ｂが貫通して形成されている。 As shown in FIGS. 2 and 3, the heat transfer support plate 29 has the left end at the same position as the left end of the control circuit board 22 and the heat transfer members 27 and 28, but the right end has the control circuit. A connecting portion 29 a is formed to protrude rightward from the right ends of the substrate 22 and the heat transfer members 27 and 28. As shown in an enlarged view in FIG. 3, a connecting hole 29b is formed through the connecting portion 29a.
　同様に、伝熱支持板３０は、図２及び図３に示すように、右端部は制御回路基板２２、伝熱部材２７及び２８の右端と同じ位置とされているが、左端部は、制御回路基板２２、伝熱部材２７及び２８の左端より左方に突出する連結部３０ｂが形成されている。この連結部３０ａには、図３に拡大して示すように、連結孔３０ｃが貫通して形成されている。 Similarly, as shown in FIGS. 2 and 3, the heat transfer support plate 30 has the right end portion at the same position as the right end of the control circuit board 22 and the heat transfer members 27 and 28, but the left end portion is controlled. A connecting portion 30b is formed that protrudes to the left from the left ends of the circuit board 22 and the heat transfer members 27 and 28. As shown in an enlarged view in FIG. 3, a connecting hole 30c is formed through the connecting portion 30a.
　そして、伝熱支持板２９の連結部２９ａに上部筐体２Ｂとは独立した熱伝導路を形成する伝熱支持側板３５が固定ねじ３６で固定されて連結されている。この固定ねじ３６は伝熱支持板２９の上方から連結孔２９ｂを通じて伝熱支持側板３５に形成された雌ねじ（図示せず）に螺合されている。
　また、伝熱支持板３０の連結部３０ｂに上部筐体２Ｂとは独立した熱伝導路を形成する伝熱支持側板３７が固定ねじ３８で固定されて連結されている。この固定ねじ３８も伝熱支持板３０の上方から連結孔３０ｃを通じて伝熱支持側板３７に形成された雌ねじ（図示せず）に螺合されている。 A heat transfer support side plate 35 that forms a heat conduction path independent of the upper housing 2 </ b> B is fixed and connected to the connecting portion 29 a of the heat transfer support plate 29 with a fixing screw 36. The fixing screw 36 is screwed into a female screw (not shown) formed on the heat transfer support side plate 35 through the connection hole 29b from above the heat transfer support plate 29.
Further, a heat transfer support side plate 37 that forms a heat conduction path independent of the upper housing 2 </ b> B is fixed to and connected to the connecting portion 30 b of the heat transfer support plate 30 by a fixing screw 38. The fixing screw 38 is also screwed into a female screw (not shown) formed on the heat transfer support side plate 37 from above the heat transfer support plate 30 through the connection hole 30c.
　ここで、伝熱支持側板３５は、垂直板部３５ａと、この垂直板部３５ａの上端から左方に延長する連結板部３５ｂとで逆Ｌ字状に形成されている。そして、伝熱支持側板３５は、垂直板部３５ａと連結板部３５ｂとの連結部が円筒面の一部となる湾曲面（Ｒ面取り）３５ｃとされている。同様に、伝熱支持側板３７も、垂直板部３７ａと、この垂直板部３７ａの状態から右方に延長する連結板部３７ｂとで逆Ｌ字状に形成されている。そして、伝熱支持側板３７は、垂直板部３７ａと連結板部３７ｂとの連結部が円筒面の一部となる湾曲面３７ｃ（Ｒ面取り）とされている。 Here, the heat transfer support side plate 35 is formed in an inverted L shape by a vertical plate portion 35a and a connecting plate portion 35b extending leftward from the upper end of the vertical plate portion 35a. The heat transfer support side plate 35 has a curved surface (R chamfer) 35c in which the connecting portion between the vertical plate portion 35a and the connecting plate portion 35b is a part of the cylindrical surface. Similarly, the heat transfer support side plate 37 is also formed in an inverted L shape by a vertical plate portion 37a and a connecting plate portion 37b extending rightward from the state of the vertical plate portion 37a. The heat transfer support side plate 37 has a curved surface 37c (R chamfer) in which the connecting portion between the vertical plate portion 37a and the connecting plate portion 37b is a part of the cylindrical surface.
　これら伝熱支持側板３５及び３７は、それらの垂直板部３５ａ及び３７ａの下端側が共通の底板３９で連結されて一体化されている。この底板３９は、中央部に冷却体３の突出台部３ｅを挿通する方形孔３９ａが形成されて、冷却体３の周溝３ｆに収納される角枠状に形成されている。
　そして、伝熱支持側板３５及び３７の垂直板部３５ａ及び３７ａの下端と底板３９との連結が円筒面の一部となる湾曲面（Ｒ面取り）３５ｄ及び３７ｄとされている。 The heat transfer support side plates 35 and 37 are integrated by connecting the lower end sides of the vertical plate portions 35 a and 37 a with a common bottom plate 39. The bottom plate 39 is formed in a square frame shape in which a square hole 39a is formed in the center portion to insert the protruding base portion 3e of the cooling body 3 and is accommodated in the circumferential groove 3f of the cooling body 3.
Then, the curved plates (R chamfers) 35d and 37d, in which the lower plates of the vertical plate portions 35a and 37a of the heat transfer support side plates 35 and 37 and the bottom plate 39 are connected to each other, are part of the cylindrical surface.
　このように伝熱支持側板３５及び３７の垂直板部３５ａ及び３７ａの上下端部を円筒状の湾曲面３５ｃ，３５ｄ及び３７ｃ，３７ｄとされている。このため、電力変換装置１に上下振動や横揺れが伝達されたときに、垂直板部３５ａ及び３７ａと連結板部３５ｂ及び３７ｂ及び底板３９との連結部に生じる応力集中を緩和することができる。したがって、伝熱支持側板３５及び３７で、制御回路基板２２を支持する場合の上下振動や横揺れ等に対する耐振動性を向上することができる。 Thus, the upper and lower ends of the vertical plate portions 35a and 37a of the heat transfer support side plates 35 and 37 are formed as cylindrical curved surfaces 35c, 35d and 37c, 37d. For this reason, when vertical vibration or roll is transmitted to the power converter 1, stress concentration generated in the connecting portions of the vertical plate portions 35a and 37a, the connecting plate portions 35b and 37b, and the bottom plate 39 can be reduced. . Therefore, the heat resistance support side plates 35 and 37 can improve the vibration resistance against vertical vibration and roll when the control circuit board 22 is supported.
　さらに、垂直板部３５ａ及び３７ａと底板３９との連結部と、垂直板部３５ａ及び３７ａと連結板部３５ｃ及び３７ｃとの連結部とを円筒状の湾曲面とすることにより、垂直板部３５ａ及び３７ａと底板部３４との連結部及び垂直板部３５ａ及び３７ａと連結板部３５ｂ及び３７ｂとの連結部を直角のＬ字形状とする場合に比較して熱伝導経路を短くすることができる。このため、伝熱支持板２９及び３０から冷却体３までの熱伝導経路を短くして、効率的な熱冷却が可能となる。 Further, the vertical plate portions 35a and 37a are connected to the bottom plate 39, and the vertical plate portions 35a and 37a and the connection portions of the connection plate portions 35c and 37c are formed as cylindrical curved surfaces. In addition, the heat conduction path can be shortened as compared with the case where the connecting portions between the connecting portions 37a and 37a and the bottom plate portion 34 and the connecting portions between the vertical plate portions 35a and 37a and the connecting plate portions 35b and 37b have a right-angled L shape. . For this reason, the heat conduction path from the heat transfer support plates 29 and 30 to the cooling body 3 can be shortened to enable efficient heat cooling.
　なお、伝熱支持板３０の駆動回路基板２１と対向する下面には、絶縁距離を短くするために絶縁シート４０が貼着されている。
　また、伝熱支持側板３５及び３７と底板３９とは黒色の表面を有する。これら伝熱支持側板３５及び３７と底板３９との表面を黒色化にするには、表面に黒色樹脂をコーティングしたり、黒色塗料で塗装したりすればよい。 An insulating sheet 40 is attached to the lower surface of the heat transfer support plate 30 facing the drive circuit board 21 in order to shorten the insulation distance.
The heat transfer support side plates 35 and 37 and the bottom plate 39 have black surfaces. In order to blacken the surfaces of the heat transfer support side plates 35 and 37 and the bottom plate 39, the surface may be coated with a black resin or painted with a black paint.
　このように、伝熱支持側板３５及び３７と底板３９との表面を黒色とすることにより、金属の素材色と比較し熱放射率が大きくなり、放射伝熱量を増やすことができる。このため、伝熱支持側板３５及び３７と底板３９との周囲への放熱が活発化され、制御回路基板２２の熱冷却を効率良く行うことができる。なお、底板３９を除いて伝熱支持側板３５及び３７のみの表面を黒色にするようにしてもよい。 Thus, by making the surfaces of the heat transfer support side plates 35 and 37 and the bottom plate 39 black, the heat emissivity becomes larger than the metal material color, and the amount of radiant heat transfer can be increased. For this reason, the heat dissipation to the circumference | surroundings of the heat-transfer support side plates 35 and 37 and the bottom plate 39 is activated, and the heat cooling of the control circuit board 22 can be performed efficiently. In addition, you may make it make the surface of only the heat-transfer support side plates 35 and 37 black except for the bottom plate 39.
　次に、上記第１の実施形態の電力変換装置１の組立方法を説明する。
　先ず、冷却体３の周溝３ｆ内に、伝熱支持側板３５及び３７に共通の底板３９を配置し、この底板３９の上面に半導体パワーモジュール１１に形成した冷却部材１３の下面を接触させ且つ冷却部材１３を冷却体３の突出台部３ｅに接触させた状態で、固定ねじ１４で半導体パワーモジュール１１と底板３９とを冷却体３に一体に固定する。
　また、半導体パワーモジュール１１には、冷却体３に固定する前又は固定した後に、その上面に形成された基板固定部１６に駆動回路基板２１を載置する。そして、この駆動回路基板２１をその上方から４本の継ぎねじ２４によって基板固定部１６に固定する。 Next, a method for assembling the power conversion device 1 according to the first embodiment will be described.
First, a bottom plate 39 common to the heat transfer support side plates 35 and 37 is disposed in the circumferential groove 3f of the cooling body 3, and the lower surface of the cooling member 13 formed on the semiconductor power module 11 is brought into contact with the upper surface of the bottom plate 39, and The semiconductor power module 11 and the bottom plate 39 are integrally fixed to the cooling body 3 with the fixing screw 14 in a state where the cooling member 13 is in contact with the protruding base portion 3 e of the cooling body 3.
In the semiconductor power module 11, the drive circuit board 21 is mounted on the board fixing part 16 formed on the upper surface of the semiconductor power module 11 before or after fixing to the cooling body 3. Then, the drive circuit board 21 is fixed to the board fixing portion 16 by four joint screws 24 from above.
　次いで、駆動回路基板２１の上面における周縁部の回路部品が搭載されていない部分に例えば駆動回路基板２１と絶縁シート４０との間の絶縁距離を保つスペーサを少なくとも３つ載置し、この状態で、継ぎねじ２４を基準として下面に絶縁シート４０を貼着した伝熱支持板３０、伝熱部材２８及び制御回路基板２２の順で積層する。このとき、伝熱部材２８の固定ねじ３１の挿通部に間座３３を挿通しておく。
　この状態で、制御回路基板２２の上面から固定ねじ２５を挿通孔２２ａを通じて挿通し、継ぎねじ２４の上面に形成された雌ねじ部２４ｂに螺合させて制御回路基板２２を継ぎねじ２４の上端に固定する。 Next, for example, at least three spacers that maintain an insulation distance between the drive circuit board 21 and the insulating sheet 40 are placed on a portion of the upper surface of the drive circuit board 21 where the circuit components at the peripheral edge are not mounted. Then, the heat transfer support plate 30, the heat transfer member 28, and the control circuit board 22 in which the insulating sheet 40 is bonded to the lower surface with the joint screw 24 as a reference are laminated in this order. At this time, the spacer 33 is inserted through the insertion portion of the fixing screw 31 of the heat transfer member 28.
In this state, the fixing screw 25 is inserted from the upper surface of the control circuit board 22 through the insertion hole 22 a and screwed into the female screw portion 24 b formed on the upper surface of the joint screw 24, so that the control circuit board 22 is connected to the upper end of the joint screw 24. Fix it.
　次いで、制御回路基板２２の上面に固定ねじ３１の挿通部に間座３２を挿通した伝熱部材２７を載置し、この伝熱部材２７の上面に伝熱支持板２９を載置し、この伝熱支持板２９の上面から固定ねじ３１を挿通し、伝熱支持板３０に形成された雌ねじ３０ａに螺合させて締付ける。このように固定ねじ３１を締付けることにより、伝熱部材２７及び２８が間座３２及び３３によって規定される管理高さまで圧縮される。このため、伝熱部材２７及び２８が５～３０％程度圧縮された状態となり、伝熱部材２７及び２８の熱抵抗が減り効率のよい伝熱効果を発揮することができる。 Next, the heat transfer member 27 having the spacer 32 inserted in the insertion portion of the fixing screw 31 is placed on the upper surface of the control circuit board 22, and the heat transfer support plate 29 is placed on the upper surface of the heat transfer member 27. The fixing screw 31 is inserted from the upper surface of the heat transfer support plate 29, and is screwed into a female screw 30a formed on the heat transfer support plate 30 and tightened. By tightening the fixing screw 31 in this manner, the heat transfer members 27 and 28 are compressed to a management height defined by the spacers 32 and 33. Therefore, the heat transfer members 27 and 28 are compressed by about 5 to 30%, the heat resistance of the heat transfer members 27 and 28 is reduced, and an efficient heat transfer effect can be exhibited.
　その後、図１に示すように、半導体パワーモジュール１１の正負の直流入力端子に１１ａに、ブスバー５０を接続し、このブスバー５０の他端に冷却体３を貫通するフィルムコンデンサ４の正負の接続端子４ａを固定ねじ５１で連結する。
　次いで、冷却体３の上面に蓋体２ｂを取り外した上部筐体２Ｂをシール材を介して装着する。この上部筐体２Ｂの角筒体２ａには、外部のコンバータ（図示せず）に接続する接続コード５２の先端に固定された圧着端子５３と、外部の３相電動モータ（図示せず）に接続したモータケーブル５８の先端に固定した圧着端子５９とが液密に挿通支持されている。 Thereafter, as shown in FIG. 1, a bus bar 50 is connected to the positive and negative DC input terminals of the semiconductor power module 11 to 11 a, and the positive and negative connection terminals of the film capacitor 4 penetrating the cooling body 3 at the other end of the bus bar 50. 4a is connected with a fixing screw 51.
Next, the upper housing 2B from which the lid 2b is removed is mounted on the upper surface of the cooling body 3 through a sealing material. The rectangular tube 2a of the upper housing 2B is connected to a crimp terminal 53 fixed to the tip of a connection cord 52 connected to an external converter (not shown) and an external three-phase electric motor (not shown). A crimp terminal 59 fixed to the tip of the connected motor cable 58 is inserted and supported in a liquid-tight manner.
　次いで、半導体パワーモジュール１１の直流入力端子１１ａに接続コード５２の先端に固定された圧着端子５３を固定する。
　次いで、半導体パワーモジュール１１の３相交流出力端子１１ｂにブスバー５５を固定ねじ５６で接続し、このブスバー５５の途中に電流センサ５７を配置する。そして、ブスバー５５の他端にモータケーブル５８の先端に固定した圧着端子５９を固定ねじ６０で固定して接続する。 Next, the crimp terminal 53 fixed to the tip of the connection cord 52 is fixed to the DC input terminal 11 a of the semiconductor power module 11.
Next, a bus bar 55 is connected to the three-phase AC output terminal 11 b of the semiconductor power module 11 with a fixing screw 56, and a current sensor 57 is disposed in the middle of the bus bar 55. Then, a crimp terminal 59 fixed to the tip of the motor cable 58 is fixed to the other end of the bus bar 55 with a fixing screw 60 and connected.
　そして、角筒体２ａの上部開放端を蓋体２ｂでシール材を介して封鎖する。
　その後、又はその前に、冷却体３の下面に、下部筐体２Ａをシール材を介して固定して電力変換装置１の組立を完了する。
　この組立完了状態で、半導体パワーモジュール１１に接続コード５２を介して外部のコンバータ（図示せず）から直流電力を供給するとともに、制御回路基板２２に実装された電源回路、制御回路等を動作状態とし、制御回路から例えばパルス幅変調信号でなるゲート信号を駆動回路基板２１に実装された駆動回路を介して半導体パワーモジュール１１に供給する。 Then, the upper open end of the rectangular tube 2a is sealed with a lid 2b via a sealing material.
After or before that, the lower housing 2A is fixed to the lower surface of the cooling body 3 via a sealing material, and the assembly of the power converter 1 is completed.
In this assembled state, the DC power is supplied to the semiconductor power module 11 from an external converter (not shown) via the connection cord 52, and the power supply circuit, the control circuit, and the like mounted on the control circuit board 22 are operated. Then, a gate signal composed of, for example, a pulse width modulation signal is supplied from the control circuit to the semiconductor power module 11 via the drive circuit mounted on the drive circuit board 21.
　これによって、半導体パワーモジュール１１に内蔵されたＩＧＢＴが制御されて、直流電力を交流電力に変換する。変換した交流電力は３相交流出力端子１１ｂからブスバー５５を介し、さらにモータケーブル５８を介して外部の３相電動モータ（図示せず）に供給され、この３相電動モータ（図示せず）を駆動制御する。
　このとき、半導体パワーモジュール１１に内蔵されたＩＧＢＴで発熱が生じる。この発熱は半導体パワーモジュール１１に形成された冷却部材１３が冷却体３の突出台部３ｅに直接接触されているので、冷却体３に供給されている冷却水によって冷却される。 As a result, the IGBT built in the semiconductor power module 11 is controlled to convert DC power into AC power. The converted AC power is supplied from the three-phase AC output terminal 11b to the external three-phase electric motor (not shown) via the bus bar 55 and further via the motor cable 58, and this three-phase electric motor (not shown) is supplied. Drive control.
At this time, heat is generated in the IGBT built in the semiconductor power module 11. The generated heat is cooled by the cooling water supplied to the cooling body 3 because the cooling member 13 formed in the semiconductor power module 11 is in direct contact with the protruding base 3 e of the cooling body 3.
　一方、制御回路基板２２に実装されている制御回路及び電源回路等の回路部品２６には発熱回路部品が含まれており、これら発熱回路部品で発熱を生じる。このとき、発熱回路部品は制御回路基板２２の上面及び下面側に実装されている。
　そして、制御回路基板２２の上面及び下面側には熱伝導率が高く弾性を有する伝熱部材２７及び２８を介して伝熱支持板２９及び３０が設けられている。 On the other hand, circuit components 26 such as a control circuit and a power supply circuit mounted on the control circuit board 22 include heat generating circuit components, and these heat generating circuit components generate heat. At this time, the heat generating circuit components are mounted on the upper and lower surfaces of the control circuit board 22.
Heat transfer support plates 29 and 30 are provided on the upper and lower surfaces of the control circuit board 22 via heat transfer members 27 and 28 having high heat conductivity and elasticity.
　ここで、伝熱部材２７及び２８は、前述したように固定ねじ３１によって、５～３０％程度の圧縮率で圧縮されているので、熱抵抗が減り効率の良い伝熱効果を発揮することができるとともに、発熱回路部品と伝熱部材２７及び２８との接触面積が大きくなる。したがって、発熱回路部品の発熱が伝熱部材２７及び２８に効率よく伝熱される。このため、図４に示すように、伝熱部材２７及び２８に伝熱された熱が効率良く伝熱支持板２９及び３０に伝達される。 Here, since the heat transfer members 27 and 28 are compressed by the fixing screw 31 at a compression rate of about 5 to 30% as described above, the heat resistance is reduced and an efficient heat transfer effect can be exhibited. In addition, the contact area between the heat generating circuit component and the heat transfer members 27 and 28 is increased. Therefore, heat generated by the heat generating circuit components is efficiently transferred to the heat transfer members 27 and 28. Therefore, as shown in FIG. 4, the heat transferred to the heat transfer members 27 and 28 is efficiently transferred to the heat transfer support plates 29 and 30.
　そして、伝熱支持板２９及び３０には、伝熱支持側板３５及び３７が連結されているので、伝熱支持板２９及び３０に伝達された熱は、伝熱支持側板３５及び３７を通って共通の底板３９に伝達される。この底板３９は、冷却体３の周溝３ｆ内に直接接触されているので、伝達された熱は冷却体３に放熱される。
　さらに、底板３９に伝達された熱は、その上面側から半導体パワーモジュール１１の冷却部材１３に伝達され、この冷却部材１３を介して冷却体３の突出台部３ｅに伝達されて放熱される。 Since the heat transfer support plates 29 and 30 are connected to the heat transfer support plates 29 and 30, the heat transferred to the heat transfer support plates 29 and 30 passes through the heat transfer support plates 35 and 37. It is transmitted to the common bottom plate 39. Since the bottom plate 39 is in direct contact with the circumferential groove 3 f of the cooling body 3, the transmitted heat is radiated to the cooling body 3.
Further, the heat transmitted to the bottom plate 39 is transmitted from the upper surface side to the cooling member 13 of the semiconductor power module 11, and is transmitted to the projecting base 3 e of the cooling body 3 through the cooling member 13 to be radiated.
　このように、上記第１の実施形態によると、制御回路基板２２の表裏両面に伝熱部材２７及び２８が配置され、これら伝熱部材２７及び２８の制御回路基板２２とは反対側に伝熱支持板２９及び３０が配置されているので、制御回路基板２２に搭載された発熱回路部品で発生される発熱がそれぞれ熱抵抗の大きな制御回路基板２２介することなく直接伝熱部材２７及び２８を介して伝熱支持板２９及び３０に伝熱されるので、効率の良い放熱を行うことができる。 As described above, according to the first embodiment, the heat transfer members 27 and 28 are arranged on both the front and back surfaces of the control circuit board 22, and the heat transfer members 27 and 28 are transferred to the opposite side of the control circuit board 22. Since the support plates 29 and 30 are arranged, the heat generated by the heat generating circuit components mounted on the control circuit board 22 is not directly passed through the control circuit board 22 having a large thermal resistance, but directly through the heat transfer members 27 and 28. Thus, heat is transferred to the heat transfer support plates 29 and 30, so that efficient heat dissipation can be performed.
　そして、伝熱部材２７及び２８に伝達された熱は伝熱支持板２９及び３０に伝熱され、さらに伝熱支持側板３５及び３７に伝達される。このとき、伝熱支持側板３５及び３７が半導体パワーモジュール１１の長辺に沿って設けられている。
　このため、伝熱面積を広くとることができ、広い放熱経路を確保することができる。しかも、伝熱支持側板３５及び３７は折れ曲がり部が円筒状の湾曲部３５ｃ，３５ｄ及び３７ｃ，３７ｄとされているので、折れ曲がり部をＬ字状にする場合に比較して冷却体３までの伝熱距離を短くすることができる。このため、放熱効率をより向上させることができる。ここで、熱輸送量Ｑは、下記（１）式で表すことができる。
　Ｑ＝λ×（Ａ／Ｌ）×Ｔ　　　…………（１） The heat transmitted to the heat transfer members 27 and 28 is transferred to the heat transfer support plates 29 and 30 and further transferred to the heat transfer support side plates 35 and 37. At this time, the heat transfer support side plates 35 and 37 are provided along the long side of the semiconductor power module 11.
For this reason, a wide heat transfer area can be taken, and a wide heat dissipation path can be secured. In addition, since the bent portions of the heat transfer support side plates 35 and 37 are cylindrical curved portions 35c, 35d and 37c, 37d, the heat transfer support side plates 35 and 37 are transferred to the cooling body 3 as compared with the case where the bent portions are L-shaped. The thermal distance can be shortened. For this reason, the heat dissipation efficiency can be further improved. Here, the heat transport amount Q can be expressed by the following equation (1).
Q = λ × (A / L) × T (1)
　ただし、λは熱伝導率［Ｗ／ｍ℃］、Ｔは温度差［℃］基板温度Ｔ１－冷却体温度Ｔ２、Ａは伝熱最小断面積［ｍ2］、Ｌは伝熱長さ［ｍ］である。
　この（１）式から明らかなように、伝熱長さＬが短くなると、熱輸送量Ｑは増加することになり、良好な冷却効果を発揮することができる。 Where λ is the thermal conductivity [W / m ° C.], T is the temperature difference [° C.] substrate temperature T 1 -cooling body temperature T 2, A is the minimum heat transfer cross section [m 2 ], and L is the heat transfer length [m ].
As is clear from the equation (1), when the heat transfer length L is shortened, the heat transport amount Q is increased, and a good cooling effect can be exhibited.
　また、伝熱支持側板３５及び３７が共通の底板３９で一体化されているので、伝熱支持側板３５及び３７と底板３９との間に部品同士の継ぎ目がなく、熱抵抗を抑制することができる。
　さらに、発熱回路部品が実装された制御回路基板２２から冷却体３までの放熱経路に筐体２が含まれていないので、筐体２を高熱伝導率のアルミニウム等の金属を使用する必要がなく、合成樹脂材で構成することができるので、軽量化を図ることができる。
　さらに、放熱経路が筐体２に依存することなく、電力変換装置１単独で放熱経路を形成することができるので、半導体パワーモジュール１１と、駆動回路基板２１、制御回路基板２２とで構成される電力変換装置１を種々の異なる形態の筐体２や冷却体３に適用することができる。 In addition, since the heat transfer support side plates 35 and 37 are integrated with a common bottom plate 39, there is no joint between the components between the heat transfer support side plates 35 and 37 and the bottom plate 39, thereby suppressing thermal resistance. it can.
Further, since the housing 2 is not included in the heat dissipation path from the control circuit board 22 on which the heat generating circuit components are mounted to the cooling body 3, it is not necessary to use a metal such as aluminum having high thermal conductivity for the housing 2. Since it can be made of a synthetic resin material, the weight can be reduced.
Furthermore, since the heat dissipation path can be formed by the power converter 1 alone without the heat dissipation path depending on the housing 2, the semiconductor power module 11, the drive circuit board 21, and the control circuit board 22 are configured. The power conversion device 1 can be applied to various types of housings 2 and cooling bodies 3.
　また、制御回路基板２２に圧縮された伝熱部材２７及び２８を介して伝熱支持板２９及び３０が固定されているので、制御回路基板２２の剛性を高めることができる。このため、電力変換装置１を車両の走行用モータを駆動するモータ駆動回路として適用する場合のように、電力変換装置１に図５に示す上下振動や横揺れが作用する場合でも、伝熱部材２７及び２８と、伝熱支持板２９及び３０と、伝熱支持側板３５及び３７とが一体化されているので、剛性を高めることができる。したがって、上下振動や横揺れ等の影響が少ない電力変換装置１を提供することができる。 Further, since the heat transfer support plates 29 and 30 are fixed via the heat transfer members 27 and 28 compressed on the control circuit board 22, the rigidity of the control circuit board 22 can be increased. For this reason, even when the power converter 1 is applied as a motor drive circuit for driving a vehicle driving motor, when the vertical vibration or roll shown in FIG. Since the heat transfer support plates 29 and 30 and the heat transfer support side plates 35 and 37 are integrated, the rigidity can be increased. Therefore, it is possible to provide the power conversion device 1 that is less affected by vertical vibrations and rolls.
　さらに、伝熱部材２７及び２８を伝熱性を有する絶縁体で構成することにより、制御回路基板２２と伝熱支持板２９及び３０との間の絶縁を行うことができるので、両者間の距離を短くすることができ、全体を小型化することができる。
　なお、上記第１の実施形態においては、制御回路基板２２と伝熱部材２７及び２８とを同じ外形とした場合について説明した。しかしながら、本発明は上記構成に限定されるものではなく、伝熱部材２７及び２８を発熱回路部品が存在する箇所にのみ設けるようにしてもよい。
　さらには、制御回路基板２２において、発熱回路部品を伝熱支持側板３５及び３７に近い部分に配置することにより、冷却体３迄の放熱経路の距離を短くするようにしてもよい。この場合には、発熱回路部品の冷却体３までの放熱経路の距離が短くなるので、効率良い放熱を行うことができる。 Furthermore, since the heat transfer members 27 and 28 are made of an insulator having heat transfer properties, insulation between the control circuit board 22 and the heat transfer support plates 29 and 30 can be performed. It can be shortened and the whole can be miniaturized.
In the first embodiment, the case where the control circuit board 22 and the heat transfer members 27 and 28 have the same outer shape has been described. However, the present invention is not limited to the above-described configuration, and the heat transfer members 27 and 28 may be provided only at locations where the heat generating circuit components exist.
Further, by disposing the heat generating circuit components near the heat transfer support side plates 35 and 37 in the control circuit board 22, the distance of the heat radiation path to the cooling body 3 may be shortened. In this case, since the distance of the heat radiation path to the cooling body 3 of the heat generating circuit component is shortened, efficient heat radiation can be performed.
　次に、本発明の第２の実施形態を図６及び図７について説明する。
　この第２の実施形態は、前述した第１の実施形態における伝熱支持板の上方にさらに回路基板を装着するようにしたものである。
　すなわち、第２の実施形態では、図６及び図７に示すように、前述した第１の実施形態における上面側の伝熱支持板２９の上面側に伝熱部材４１を介して例えば電源回路部品を実装した電源回路基板４２を載置するようにしている。その他の構成について前述した第１の実施形態における図２及び図３と同様の構成を有し、図２及び図３との対応部分には同一符号を付し、その詳細説明はこれを省略する。 Next, a second embodiment of the present invention will be described with reference to FIGS.
In the second embodiment, a circuit board is further mounted above the heat transfer support plate in the first embodiment described above.
That is, in the second embodiment, as shown in FIGS. 6 and 7, for example, a power circuit component is provided on the upper surface side of the heat transfer support plate 29 on the upper surface side in the first embodiment via the heat transfer member 41. The power supply circuit board 42 mounted with is mounted. Other configurations have the same configurations as those in FIGS. 2 and 3 in the first embodiment described above, and corresponding parts to FIGS. 2 and 3 are denoted by the same reference numerals, and detailed description thereof is omitted. .
　この第２の実施形態では、第１の実施形態の固定ねじ３１が省略され、これに代えて、制御回路基板２２と伝熱支持板３０とを固定する固定ねじ４３が設けられている。また、電源回路基板４２が、前述した制御回路基板２２と同様に、伝熱部材４１を介して伝熱支持板２９に固定ねじ４４によって固定されている。ここで、伝熱部材４１の固定ねじ４４の挿通部には、図７に示すように、間座４５が配置され、この間座４５の高さが伝熱部材４１の圧縮率が５～３０％となるように設定されている。 In the second embodiment, the fixing screw 31 of the first embodiment is omitted, and instead, a fixing screw 43 for fixing the control circuit board 22 and the heat transfer support plate 30 is provided. Further, the power supply circuit board 42 is fixed to the heat transfer support plate 29 via the heat transfer member 41 by the fixing screw 44 in the same manner as the control circuit board 22 described above. Here, as shown in FIG. 7, a spacer 45 is disposed in the insertion portion of the fixing screw 44 of the heat transfer member 41. The height of the spacer 45 is such that the compression rate of the heat transfer member 41 is 5 to 30%. It is set to become.
　また、第２の実施形態では、制御回路基板２２を継ぎねじ２４に固定ねじ２５で固定する場合に代えて、継ぎねじ２４の上端の雌ねじ部２４ｂに継ぎねじ２４と同じ継ぎねじ４６の下端に形成された雄ねじ部４６ａを螺合させることにより、制御回路基板２２を継ぎねじ２４上に固定されている。そして、この継ぎねじ４６の上端に形成された雌ねじ部４６ｂに固定ねじ４７を螺合させることにより、電源回路基板４２が固定されている。 In the second embodiment, instead of the case where the control circuit board 22 is fixed to the joint screw 24 with the fixing screw 25, the female screw portion 24 b at the upper end of the joint screw 24 is connected to the lower end of the joint screw 46 that is the same as the joint screw 24. The control circuit board 22 is fixed on the joint screw 24 by screwing the formed male screw portion 46a. The power supply circuit board 42 is fixed by screwing the fixing screw 47 into the female screw portion 46 b formed at the upper end of the joint screw 46.
　この第２の実施形態では、制御回路基板２２と伝熱支持板２９との間に介在される伝熱部材２７の圧縮率は、継ぎねじ４６の高さによって規定されている。すなわち、伝熱支持板２９と電源回路基板４２との間隔が間座４５と、電源回路基板４２の上方から間座４５を通って伝熱支持板２９に形成した雌ねじ部２９ｃに螺合する固定ねじ４４とによって規定されている。このため、継ぎねじ４６の上面及び下面間の高さＨ２は、間座４５の高さ、図７に示すように、伝熱支持板２９の厚み及び伝熱部材２７の５～３０％程度に圧縮したときの高さを加算した高さに設定されている。 In the second embodiment, the compression rate of the heat transfer member 27 interposed between the control circuit board 22 and the heat transfer support plate 29 is defined by the height of the joint screw 46. That is, the space between the heat transfer support plate 29 and the power supply circuit board 42 is fixed so that the spacer 45 is screwed into the female screw portion 29c formed on the heat transfer support plate 29 through the spacer 45 from above the power supply circuit board 42. And a screw 44. For this reason, the height H2 between the upper surface and the lower surface of the joint screw 46 is about 5 to 30% of the height of the spacer 45, the thickness of the heat transfer support plate 29 and the heat transfer member 27 as shown in FIG. It is set to the height obtained by adding the height when compressed.
　したがって、制御回路基板２２の取付け高さ位置を継ぎねじ４６の下面に形成した雄ねじ部４６ａを継ぎねじ２４の上端に形成した雌ねじ部２４ｂに螺合させることにより規定する。この状態で、継ぎねじ４６に伝熱部材２７に形成した挿通孔２７ａを通して配置し、伝熱部材２７の上面に固定ねじ４４によって一体化された伝熱支持板２９及び電源回路基板４２を配置する。そして、電源回路基板４２を固定ねじ４７で継ぎねじ４６の上面に締付け固定することにより、伝熱部材２７を５～３０％程度の圧縮率で圧縮して固定することができる。 Therefore, the mounting height position of the control circuit board 22 is defined by screwing the male screw portion 46 a formed on the lower surface of the joint screw 46 with the female screw portion 24 b formed on the upper end of the joint screw 24. In this state, the heat transfer support plate 29 and the power supply circuit board 42 integrated with the fixing screw 44 are disposed on the upper surface of the heat transfer member 27 through the insertion holes 27a formed in the heat transfer member 27. . The heat transfer member 27 can be compressed and fixed at a compression rate of about 5 to 30% by fixing the power supply circuit board 42 to the upper surface of the joint screw 46 with the fixing screw 47.
　このように、上記第２の実施形態によると、前述した第１の実施形態と同様に制御回路基板２２に実装された発熱回路部品の発熱を表裏両面に配置された伝熱部材２７及び２８によって伝熱支持板２９及び３０に伝熱し、伝熱支持側板３５及び３７を伝熱して冷却体３に放熱される。
　これと同時に電源回路基板４２に実装された発熱回路部品についても伝熱部材４１を介して伝熱支持板２９に伝熱し、さらに伝熱支持側板３５を伝熱して冷却体３に放熱することができる。 As described above, according to the second embodiment, the heat generation of the heat generating circuit components mounted on the control circuit board 22 is performed by the heat transfer members 27 and 28 arranged on the front and back surfaces, as in the first embodiment. Heat is transferred to the heat transfer support plates 29 and 30, transferred to the heat transfer support side plates 35 and 37, and radiated to the cooling body 3.
At the same time, the heat generating circuit components mounted on the power supply circuit board 42 also transfer heat to the heat transfer support plate 29 via the heat transfer member 41 and further transfer heat to the heat transfer support side plate 35 to dissipate heat to the cooling body 3. it can.
　そして、制御回路基板２２と電源回路基板４２の双方に発熱回路部品が実装されている場合に、制御回路基板２２と電源回路基板４２との間が伝熱部材４１によって中実状態で連結されている。このため、制御回路基板２２と電源回路基板４２との間に空気が存在する場合のように、発熱回路部品の発熱が空気層に留まることを確実に防止することができ、より良好な放熱効果を発揮することができる。 When the heat generating circuit components are mounted on both the control circuit board 22 and the power circuit board 42, the control circuit board 22 and the power circuit board 42 are connected in a solid state by the heat transfer member 41. Yes. For this reason, it is possible to reliably prevent the heat generated by the heat generating circuit components from staying in the air layer as in the case where air is present between the control circuit board 22 and the power supply circuit board 42, and a better heat dissipation effect. Can be demonstrated.
　なお、上記第１及び第２の実施形態においては、半導体パワーモジュール１１の冷却部材１３及び伝熱支持側板３５及び３７に共通の底板３９を冷却体３に接触させる場合について説明した。しかしながら、本発明では上記構成に限定されるものではなく、図８に示すように、半導体パワーモジュール１１に形成されている冷却部材１３が冷却体３に流れる冷却水に直接接触する冷却フィン６１を備えた構成とするようにしてもよい。この場合には、冷却体３の中央部に冷却フィン６１を冷却水の通路に浸漬させる浸漬部６２を形成する。 In the first and second embodiments, the case where the bottom plate 39 common to the cooling member 13 and the heat transfer support side plates 35 and 37 of the semiconductor power module 11 is brought into contact with the cooling body 3 has been described. However, the present invention is not limited to the above-described configuration. As shown in FIG. 8, the cooling member 61 formed in the semiconductor power module 11 includes cooling fins 61 that directly contact the cooling water flowing through the cooling body 3. You may make it set it as the structure provided. In this case, an immersion part 62 for immersing the cooling fin 61 in the cooling water passage is formed in the central part of the cooling body 3.
　そして、浸漬部６２を囲む周壁６３と冷却部材１３との間にＯリング等のシール部材６６が配設されている。
　この構成によると、半導体パワーモジュール１１の冷却部材１３に冷却フィン６１が形成され、この冷却フィン６１が冷却水に浸漬部６２で冷却水に浸漬されているので、半導体パワーモジュール１１をより効率良く冷却することができる。 A sealing member 66 such as an O-ring is disposed between the peripheral wall 63 surrounding the immersion part 62 and the cooling member 13.
According to this configuration, the cooling fins 61 are formed on the cooling member 13 of the semiconductor power module 11, and the cooling fins 61 are immersed in the cooling water in the cooling water at the immersion part 62, so that the semiconductor power module 11 is more efficiently used. Can be cooled.
　また、上記第１及び第２の実施形態においては、伝熱支持板２９及び３０と伝熱支持側板３５及び３７とを別体で構成する場合について説明した。しかしながら、本発明は、上記構成に限定されるものでなく、伝熱支持板２９及び３０と伝熱支持側板３５及び３７とを一体に構成するようにしてもよい。この場合には、伝熱支持板２９及び３０と伝熱支持側板３５及び３７との間に継ぎ目が形成されることがなくなるので、熱抵抗をより小さくしてより効率の良い放熱を行うことができる。 In the first and second embodiments, the case where the heat transfer support plates 29 and 30 and the heat transfer support side plates 35 and 37 are configured separately has been described. However, the present invention is not limited to the above configuration, and the heat transfer support plates 29 and 30 and the heat transfer support side plates 35 and 37 may be configured integrally. In this case, since no seam is formed between the heat transfer support plates 29 and 30 and the heat transfer support side plates 35 and 37, more efficient heat dissipation can be achieved by reducing the thermal resistance. it can.
　また、上記第１及び第２の実施形態では、制御回路基板２２と伝熱支持板２９及び３０との間に介挿した伝熱部材２７及び２８が弾性を有する場合について説明した。しかしながら、本発明では上記構成に限定されるものではなく、絶縁被覆した金属板等の弾性を有さない伝熱部材を適用することもできる。
　さらに、上記第１及び第２の実施形態では、伝熱支持側板３５及び３７が半導体パワーモジュール１１、冷却体３、駆動回路基板２１、制御回路基板２２を囲む上部筐体２Ｂとは別個に配置されている場合について説明した。しかしながら、本発明は上記構成に限定されるものではなく、上部筐体２Ｂを熱伝導率の高い材料で形成する場合には、伝熱支持側板３５及び３７を省略して、伝熱支持板２９及び３０を直接上部筐体２Ｂに支持するようにしてもよい。 In the first and second embodiments, the case where the heat transfer members 27 and 28 inserted between the control circuit board 22 and the heat transfer support plates 29 and 30 have elasticity has been described. However, in this invention, it is not limited to the said structure, The heat-transfer member which does not have elasticity, such as an insulating-coated metal plate, can also be applied.
Further, in the first and second embodiments, the heat transfer support side plates 35 and 37 are disposed separately from the upper housing 2B surrounding the semiconductor power module 11, the cooling body 3, the drive circuit board 21, and the control circuit board 22. Explained the case. However, the present invention is not limited to the above configuration. When the upper housing 2B is formed of a material having high thermal conductivity, the heat transfer support side plates 35 and 37 are omitted and the heat transfer support plate 29 is omitted. And 30 may be directly supported by the upper casing 2B.
　さらにまた、制御回路基板２２の表面積を大きくして駆動回路基板２１に実装する回路部品を実装可能に構成した場合には、駆動回路基板２１を省略することができる。
　また、上記第１及び第２の実施形態では、平滑用のコンデンサとしてフィルムコンデンサ４を適用した場合について説明したが、これに限定されるものではなく、円柱状の電解コンデンサを適用するようにしてもよい。 Furthermore, when the surface area of the control circuit board 22 is increased so that circuit components to be mounted on the drive circuit board 21 can be mounted, the drive circuit board 21 can be omitted.
In the first and second embodiments, the case where the film capacitor 4 is applied as a smoothing capacitor has been described. However, the present invention is not limited to this, and a cylindrical electrolytic capacitor is applied. Also good.
　さらに、上記第１及び第２の実施形態においては、本発明による電力変換装置を電気自動車に適用する場合について説明したが、これに限定されるものではなく、軌条を走行する鉄道車両にも本発明を適用することができ、任意の電気駆動車両に適用することができる。さらに電力変換装置としては電気駆動車両に限らず、他の産業機器における電動モータ等のアクチュエータを駆動する場合に本発明の電力変換装置を適用することができる。 Furthermore, in the first and second embodiments, the case where the power conversion device according to the present invention is applied to an electric vehicle has been described. However, the present invention is not limited to this, and the present invention is also applied to a rail vehicle traveling on a rail. The invention can be applied and can be applied to any electric drive vehicle. Furthermore, the power conversion device is not limited to an electrically driven vehicle, and the power conversion device of the present invention can be applied when driving an actuator such as an electric motor in other industrial equipment.
産業上の利用分野Industrial application fields
　本発明によれば、発熱回路部品を含む回路部品を実装した実装基板の表裏両面に伝熱部材を配置し、これら両伝熱部材が半導体スイッチング素子をケース体に内蔵した半導体パワーモジュール及び実装基板を囲む筐体とは独立した複数の熱伝導路を通って冷却体に連結することにより、基板に実装された発熱回路部品の熱を効率よく冷却体に放熱することができ、小型化が可能な電力変換装置を提供することができる。 According to the present invention, a heat transfer member is arranged on both front and back surfaces of a mounting board on which circuit components including a heat generating circuit part are mounted, and both the heat transfer members have a semiconductor switching element built in a case body and a mounting board. By connecting to the cooling body through a plurality of heat conduction paths independent of the enclosure surrounding the heat, the heat of the heat generating circuit components mounted on the board can be efficiently dissipated to the cooling body, enabling downsizing It is possible to provide a simple power conversion device.
　１…電力変換装置、２…筐体、３…冷却体、４…フィルムコンデンサ、５…蓄電池収納部、１１…半導体パワーモジュール、１２…ケース体、１３…冷却部材、２１…駆動回路基板、２２…制御回路基板、２４…継ぎねじ、２７，２８…伝熱部材、２９，３０…伝熱支持板、４１…伝熱部材、４２…電源回路基板、４５…継ぎねじ、４４…間座（間隔調整部材）、６１…冷却フィン DESCRIPTION OF SYMBOLS 1 ... Power converter device, 2 ... Housing | casing, 3 ... Cooling body, 4 ... Film capacitor, 5 ... Storage battery accommodating part, 11 ... Semiconductor power module, 12 ... Case body, 13 ... Cooling member, 21 ... Drive circuit board, 22 ... Control circuit board, 24 ... Joint screw, 27, 28 ... Heat transfer member, 29, 30 ... Heat transfer support plate, 41 ... Heat transfer member, 42 ... Power supply circuit board, 45 ... Joint screw, 44 ... Spacer (space) Adjusting member), 61 ... cooling fin

Claims (9)

  1. 　一面を冷却体に接合する半導体パワーモジュールと、
    　前記半導体パワーモジュールを駆動する発熱回路部品を含む回路部品を実装した実装基板と、
    　前記実装基板の熱を前記冷却体に伝熱させる熱伝導路とを備え、
    　前記実装基板は、表裏両面に伝熱部材が配置された
    　ことを特徴とする電力変換装置。     A semiconductor power module that joins one surface to a cooling body;
    A mounting board on which circuit components including a heat generating circuit component for driving the semiconductor power module are mounted;
    A heat conduction path for transferring heat of the mounting substrate to the cooling body,
    The power conversion device, wherein the mounting substrate has heat transfer members disposed on both front and back surfaces.
  2. 　電力変換用の半導体スイッチング素子をケース体に内蔵する半導体パワーモジュールと、
    　該半導体パワーモジュールの一方の面に配置された冷却体と、
    　該半導体パワーモジュールの他方の面上に支持される前記半導体スイッチング素子を駆動する発熱回路部品を含む回路部品を実装した実装基板とを備え、
    　前記実装基板は、表裏両面に個別に伝熱部材が配置され、前記発熱回路部品の発熱を、両伝熱部材を介し、さらに前記半導体パワーモジュール及び前記各実装基板を囲む筐体とは独立した複数の熱伝導路を通って前記冷却体に放熱する
    　ことを特徴とする電力変換装置。     A semiconductor power module in which a semiconductor switching element for power conversion is built in the case body;
    A cooling body disposed on one surface of the semiconductor power module;
    A mounting substrate on which circuit components including a heat generating circuit component for driving the semiconductor switching element supported on the other surface of the semiconductor power module are mounted;
    The mounting board is provided with heat transfer members individually on both the front and back surfaces, and the heat generation of the heat generating circuit components is independent of the housing surrounding the semiconductor power module and each mounting board via both heat transfer members. Dissipating heat to the cooling body through a plurality of heat conduction paths.
  3. 　前記表裏両面に伝熱部材を配置した実装基板と、当該実装基板の少なくとも一方の面に対向する実装基板との間に、前記伝熱部材が中実状態で配置されていることを特徴とする請求項１又は２に記載の電力変換装置。 The heat transfer member is disposed in a solid state between a mounting substrate on which heat transfer members are arranged on both the front and back surfaces and a mounting substrate facing at least one surface of the mounting substrate. The power converter according to claim 1 or 2.
  4. 　前記熱伝導路は、前記表裏両面に伝熱部材を配置した実装基板における前記両伝熱部材の前記実装基板とは反対側の面にそれぞれ固定された一対の伝熱支持部材を備え、該一対の伝熱支持部材が前記冷却体に連結されていることを特徴とする請求項１又は２に記載の電力変換装置。 The heat conduction path includes a pair of heat transfer support members respectively fixed to surfaces opposite to the mounting substrate of the heat transfer members in the mounting substrate on which heat transfer members are arranged on both the front and back surfaces. The power conversion device according to claim 1, wherein the heat transfer support member is connected to the cooling body.
  5. 　前記伝熱支持部材は、熱伝導率の高い金属材料で構成されていることを特徴とする請求項４に記載の電力変換装置。 The power conversion device according to claim 4, wherein the heat transfer support member is made of a metal material having high thermal conductivity.
  6. 　前記伝熱部材は、熱伝導性を有する絶縁体で構成されていることを特徴とする請求項１又は２に記載の電力変換装置。 The power conversion device according to claim 1 or 2, wherein the heat transfer member is made of an insulator having thermal conductivity.
  7. 　前記伝熱部材は、熱伝導性を有し且つ伸縮性を有する弾性体で構成されていることを特徴とする請求項１又は２に記載の電力変換装置。 The power conversion device according to claim 1 or 2, wherein the heat transfer member is formed of an elastic body having thermal conductivity and elasticity.
  8. 　前記伝熱部材は、前記弾性体を所定圧縮率で圧縮した状態で固定されていることを特徴とする請求項７に記載の電力変換装置。 The power conversion device according to claim 7, wherein the heat transfer member is fixed in a state where the elastic body is compressed at a predetermined compression rate.
  9. 　前記伝熱部材には、前記弾性体の圧縮率を決定する間隔調整部材が設けられていることを特徴とする請求項８に記載の電力変換装置。 The power conversion device according to claim 8, wherein the heat transfer member is provided with an interval adjusting member for determining a compressibility of the elastic body.
PCT/JP2012/007067 2011-11-30 2012-11-05 Power conversion device WO2013080441A1 (en)

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CN103907184B (en) 2016-08-31
CN103907184A (en) 2014-07-02

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