WO2012108653A2

WO2012108653A2 - Led lighting device and streetlight device having same

Info

Publication number: WO2012108653A2
Application number: PCT/KR2012/000860
Authority: WO
Inventors: 이상철
Original assignee: 주식회사 자온지
Priority date: 2011-02-08
Filing date: 2012-02-07
Publication date: 2012-08-16
Also published as: WO2012108653A3; KR20120090690A

Abstract

Disclosed is an LED lighting device. The LED lighting device comprises: an LED module; a thermal base coupled to the LED module to absorb heat; a heat chamber having a sealed internal space into which a working fluid is injected; a heat absorption unit which is combined with the thermal base to absorb heat and is provided on the inside wall thereof with a wick; and a heat radiation unit in which the working fluid evaporated in the heat absorption unit is condensed to radiate heat. The LED lighting device is resistant to contamination and allows contamination to be easily removed therefrom, and thus the degradation of a heat radiation performance is minimized and maintenance becomes easy. In addition, the LED lighting device radiates heat from the LED module while preventing heat from the sun from being transferred thereto, and thus the LED lighting device is prevented from being heated by solar heat.

Description

LED lighting device and street light device having same

The present invention relates to an LED lighting device and a street lamp device having the same.

In the lighting device using the LED (LED) generates a large amount of heat due to the heat generated by the LED. In general, when the electronic device is overheated, an operation error may occur or be damaged. In the LED lighting device, a heat dissipation device is required to prevent overheating.

As an example of a heat dissipation device used for an LED lighting device, a heat dissipation device having a heat dissipation fin structure has been disclosed.

However, the heat dissipation device of the heat dissipation fin structure has a problem that it is difficult to keep the surface area of the heat dissipation fin wide in a situation in which the size of the heat sink is small due to the small size of the LED module. In addition, even if the surface area of the heat dissipation fin is widened, the distance between the heat absorbing part and the heat dissipating part is farther away, and thus the heat transfer speed is lowered.

In addition, since the heat radiation fins are vulnerable to contamination, there is also a problem that a decrease in heat radiation performance due to contamination.

On the other hand, when the lighting device is installed outdoors, there is a problem that the lighting device is heated by the solar heat and the heat remains to increase the overheating of the lighting device.

The present invention provides an LED lighting device having high heat transfer performance and high heat dissipation efficiency and a street light device having the same.

In addition, the present invention is to provide a LED lighting device that is resistant to contamination and easy to maintain and a street lamp device having the same.

In addition, to provide a lighting device and a street lamp device having the same to prevent the lighting device is heated by solar heat.

According to an aspect of the present invention, an LED (LED) module, a thermal base coupled to the LED module to absorb heat, a sealed inner space is formed is injected, the working fluid is injected, combined with the thermal base to absorb heat And a heat chamber including a heat absorbing part having a wick formed on an inner wall and a heat dissipating part condensing the working fluid vaporized in the heat absorbing part to release heat.

The thermal base may be formed in a flat plate shape, the LED module may be coupled to one surface of the thermal base, and the heat absorbing portion of the heat chamber may be coupled to the other surface of the thermal base.

The heat chamber may include a heat absorbing part covering the other surface of the thermal base, an extension part extending from the heat absorbing part to the outside of the thermal base, and the wick may be coupled to the heat absorbing part and the inner wall of the extension part.

The body of the heat chamber is formed in a ring shape or a cylindrical shape so that the central region of the thermal base is exposed, the body may be hollow to form the closed space.

The heat chamber is formed on an outer wall of the heat dissipation unit, and may include a protrusion for increasing a heat dissipation area.

The LED lighting apparatus, and a support for supporting the LED lighting apparatus, wherein the LED module is disposed to face the ground, the heat chamber may be arranged to cover the LED module and the thermal base from sunlight. .

1 is a perspective view of the LED lighting apparatus according to an embodiment of the present invention.

Figure 2 is a side view showing the LED lighting apparatus according to an embodiment of the present invention.

Figure 3 is a sectional view of the LED lighting apparatus according to an embodiment of the present invention.

Figure 4 is a perspective view of a street lamp device having an LED lighting device according to an embodiment of the present invention.

5 is a sectional view showing the LED lighting apparatus according to another embodiment of the present invention.

6 is a plan view showing the LED lighting apparatus according to another embodiment of the present invention.

10: LED module

20: thermal base

30, 30 ': heat chamber

31, 31 ': body

32, 32 ': internal space

32, 32 ': Week

50, 50 ': LED lighting

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a perspective view showing an LED lighting apparatus according to an embodiment of the present invention, Figure 2 is a side view showing the LED lighting apparatus according to an embodiment of the present invention, Figure 3 is an LED according to an embodiment of the present invention It is sectional drawing which shows lighting apparatus.

LED lighting device 50 according to an embodiment of the present invention includes an LED module 10, the thermal base 20 and the heat chamber (30).

The LED module 10 is a part that generates the light necessary for lighting by having an LED (LED) 12 that can emit light using electrical energy.

As shown in FIG. 3, the LED module 10 of the present embodiment includes an LED 12 and a substrate 14 on which the LED 12 is mounted.

The thermal base 20 receives heat generated by the LED module 10 and transmits the heat generated by the LED module 10 to the heat chamber 30 to be described later. The thermal base 20 also supports the LED module 10 and the heat chamber 30. At this time, the thermal base 20 of the present embodiment is made of a high thermal conductivity material for fast heat transfer. Specifically, the thermal base 20 of the present embodiment is made of a metal having high thermal conductivity, such as copper and aluminum.

As shown in Figure 2 and 3, the thermal base 20 of the present embodiment may be formed in a flat plate for fast heat dissipation and thinning of the LED lighting device (50). Specifically, the LED module 10 is coupled to one surface of the thermal base 20 formed in a flat plate shape, and the heat absorbing portion 34 of the heat chamber 30 is coupled to the other surface.

The heat chamber 30 is a heat dissipation portion coupled to the thermal base 20 to dissipate the heat transferred through the thermal base 20. In order to quickly dissipate a large amount of heat, the heat chamber 30 is sealed in which a working fluid as a heat transfer medium is injected. Internal space 31a is formed.

Specifically, the heat chamber 30 is formed in a closed container shape containing the working fluid, the working fluid is injected into the internal space (31a). In addition, a portion of the heat chamber 30 coupled with the thermal base 20 becomes an endothermic portion 34 that absorbs heat from the thermal base 20, and a wick 32 is formed on an inner wall of the endothermic portion 34. . In this case, the wick 32 may be made of a wire mesh having a porous structure, sintered metal particles, or the like, to collect a working fluid by using a capillary phenomenon.

Accordingly, the working fluid collected in the wick 32 is vaporized by the heat transferred from the thermal base 20, and the vaporized working fluid reaches the heat radiating part 36 spaced apart from the heat absorbing part 34 and condenses. Transfer to the heat dissipation unit (36). The heat radiating unit 36 radiates heat transferred by the working fluid from the heat absorbing unit 34 by transferring heat to the outside air. Therefore, it is possible to quickly dissipate a large amount of heat by forming a heat transfer cycle using the vaporization and condensation of the working fluid.

In addition, the heat chamber 30 having an entire container shape has an advantage that contaminants such as dust do not adhere well. In addition, even if contaminants are attached, it is easy to clean, thereby minimizing deterioration of heat dissipation performance due to contamination.

As shown in Figures 2 and 3, the heat chamber 30 of the present embodiment has a ring-shaped body 31, the center of which is drilled. In addition, the ring-shaped body 31 is formed in a hollow hollow form a sealed inner space 31a into which the working fluid is injected.

As a result, the central region of the thermal base 20 is exposed through the center portion of the heat chamber 30, that is, the through hole of the ring, so that the support 60, the wiring 65, and the like are easily accessible to the thermal base 20. .

In addition, the heat chamber 30 of the present embodiment may have a structure that protrudes outward of the thermal base 20.

As shown in FIG. 2 and FIG. 3, in the heat chamber 30 of the present embodiment, an extension portion 38 extending outwardly of the thermal base 20 from the heat absorbing portion 34 covering the other surface of the thermal base 20. Can be formed. At this time, since the wick 32 is formed not only on the heat absorbing portion 34 but also on the inner wall of the extension portion 38, the amount of the working fluid vaporized can be increased to increase the heat dissipation performance. In other words, the heat transferred to the heat absorbing portion 34 evenly spreads to the extension portion 38, and thus the working fluid is vaporized in the wick 32 of the extension portion 38, thereby increasing the amount of heat transfer.

In addition, by forming a projection 36a to increase the heat dissipation area on the outer wall of the heat dissipation portion 36, heat transfer with external air can be promoted to further increase heat dissipation efficiency.

In addition, the heat chamber 30 ′ of the present embodiment may be extended to the opposite side of the thermal base 20 to secure a sufficient heat dissipation area.

5 is a cross-sectional view showing the LED lighting apparatus according to another embodiment of the present invention, Figure 6 is a plan view showing the LED lighting apparatus according to another embodiment of the present invention.

As shown in FIGS. 5 and 6, the body 31 ′ of the heat chamber 30 ′ of the present embodiment may be formed in a cylindrical shape with a central portion thereof. Accordingly, the side surface of the heat chamber 30 'also becomes a heat dissipation part 36' that performs heat dissipation, thereby increasing the heat dissipation area.

At this time, in order to easily install the thermal base 20 for supporting the LED module 10 and the heat chamber 30 ', the installation ring 62 is coupled to the central region of the thermal base 20 40 may be formed.

On the other hand, the heat chamber 30 of the LED lighting device 50 of the present embodiment also serves to protect the LED lighting device 50 from sunlight when used as a streetlight device.

4 is a perspective view showing a streetlight device having an LED lighting device 50 according to an embodiment of the present invention.

As shown in FIG. 4, when the LED lighting device 50 of the present embodiment is used as a street light device, the LED lighting device 50 is mounted on a support 60 such as a column such that the LED module 10 is disposed toward the ground. Supported. In this case, the heat chamber 30 may serve to protect the LED lighting device 50 by being disposed to cover the LED module 10 and the thermal base 20 from sunlight.

In general, during the summer day, the LED lighting device 50 is heated by sunlight. When heat energy is accumulated in this way, the LED lighting device 50 may be easily overheated. Accordingly, it is preferable to have a structure that protects the LED lighting device 50 from sunlight during the day time that does not use the LED lighting device 50.

The heat chamber 30 of the present embodiment has a structure in which heat is well transmitted in one direction but not well in the opposite direction, and may serve as a heat shield as well as a heat dissipation device.

Specifically, the heat chamber 30 is a structure in which the working fluid vaporized in the heat absorbing portion 34 in the lower portion condenses in the heat dissipating portion 36 in the upper portion to transfer heat. Accordingly, the heat generated in the LED module 10 of the street light device can be quickly released upward.

On the other hand, since the working fluid condensed on the upper part flows directly to the lower part by gravity, almost no working fluid remains in the heat radiating part 36 at the upper part, so that the working fluid is hardly vaporized, Light gas is again condensed in the upper heat dissipation section 36. That is, even if the heat dissipation part 36 of the upper part is heated by solar heat, heat transfer through the working fluid is not performed to the heat absorbing part 34 of the lower part. Rather, the sealed inner space 31a of the heat chamber 30 interferes with heat transfer.

Therefore, the heat chamber 30 of the present embodiment has a structure that promotes only one-way heat transfer from the LED module 10 to the heat dissipation unit 36 and blocks heat transfer in the opposite direction, thereby preventing the LED lighting device 50 from sunlight. It can also play a role in protection.

Although the above has been described with reference to embodiments of the present invention, those skilled in the art may variously modify the present invention without departing from the spirit and scope of the present invention as set forth in the claims below. And can be changed.

Many embodiments other than the above-described embodiments are within the scope of the claims of the present invention.

According to the present invention, it is possible to effectively dissipate heat generated in the LED lighting device by using a heat dissipation device having a high heat transfer performance and heat dissipation efficiency.

In addition, since the LED lighting device is resistant to contamination and easy to remove the contamination from the lighting device, the degradation of heat dissipation performance can be minimized and maintenance can be facilitated.

In addition, since the heat chamber emits heat of the LED module and blocks heat transfer from the sun, it is possible to prevent the LED lighting apparatus from being heated by solar heat.

Claims

LED module;

A thermal base coupled to the LED module to absorb heat; And

A closed inner space into which a working fluid is injected is formed, and the heat absorbing part which is combined with the thermal base to absorb heat and the wick formed on the inner wall, and the working fluid vaporized in the heat absorbing part condenses to release heat. LED lighting device comprising a heat chamber having a heat dissipation unit.
The method of claim 1,

The thermal base is formed in a flat plate shape,

The LED module is coupled to one surface of the thermal base,

LED lighting apparatus, characterized in that the heat absorbing portion of the heat chamber is coupled to the other surface of the thermal base.
The method of claim 2,

The heat chamber,

An endothermic portion covering the other surface of the thermal base; And

An extension part extending from the endothermic part to the outside of the thermal base;

The wick is LED lighting device, characterized in that coupled to the inner wall of the heat absorbing portion and the extension.
The method of claim 1,

The body of the heat chamber is formed in a ring shape or a cylindrical shape so that the center region of the thermal base is exposed, the body is an LED lighting device, characterized in that the hollow to form the closed space.
The method of claim 1,

The heat chamber,

The LED lighting device is formed on the outer wall of the heat dissipation unit, and includes a protrusion to increase the heat dissipation area.
The LED lighting device according to any one of claims 1 to 5; And

It includes a support for supporting the LED lighting device,

And the LED module is disposed to face the ground, and the heat chamber is arranged to cover the LED module and the thermal base from sunlight.