WO2011105025A1

WO2011105025A1 - Lightbulb-shaped lamp

Info

Publication number: WO2011105025A1
Application number: PCT/JP2011/000850
Authority: WO
Inventors: 龍海瀬戸本; 和繁杉田; 昭谷内; 田村　哲志; 高橋　健治
Original assignee: パナソニック株式会社
Priority date: 2010-02-25
Filing date: 2011-02-16
Publication date: 2011-09-01

Abstract

In the disclosed lightbulb-shaped lamp, one end of a tubular heat sink (10) is connected to a cylindrical connector (30) that is mounted to the socket of a lighting apparatus, and an LED module (42) is attached to the other end of the heat sink. Inside the heat sink (10) and the connector (30), a circuit board (51) to which a lighting circuit (55) has been mounted is disposed along the center axis of the connector (30), and the circuit board (51) and the connector (30) are connected in a thermally-conductive state. By means of this configuration, heat dissipation properties can be increased, and it is possible to easily handle greater compactness and higher output.

Description

Light bulb shaped lamp

The present invention relates to a light bulb shaped lamp, and more particularly to a light bulb shaped lamp using a semiconductor light emitting element such as an LED (light emitting diode) as a light source.

A light source device using a semiconductor light emitting element such as an LED as a light source has been put into practical use, and is compatible with a general E26 type base so that it can be directly mounted on a socket of a widely used incandescent light fixture. A bulb-type LED lamp using the above-mentioned base has also been developed.

In such a bulb-shaped LED lamp, an LED module on which a plurality of LED chips are mounted is usually mounted on a module support, and the module support is attached to one end of a cylindrical housing (heat sink) It has been. A base is attached to the other end of the heat sink. The heat sink is made of a metal having excellent heat dissipation such as aluminum, and the module support is also made of a metal having excellent heat dissipation.

Inside the heat sink, a lighting circuit for supplying power necessary for lighting the LED chip is provided. The lighting circuit is mounted on a circuit board, and the circuit board is attached to the side surface opposite to the LED module mounting surface on the module support base.

Each LED chip is turned on by the power supplied from the lighting circuit and emits light. Each LED chip generates heat when it is turned on, but the heat of each LED chip is dissipated by a heat sink.

It is preferable that the bulb-type LED lamp using the LED module on which a plurality of LED chips are mounted is smaller and has higher output in consideration of compatibility with existing lighting fixtures. However, by increasing the output of the bulb-type LED lamp, the amount of heat generated from the LED chip increases, and the amount of heat generated from the electronic components constituting the lighting circuit also increases. If the bulb-type LED lamp is reduced in size, the heat sink is reduced in size, so that the heat of the LED chip may not be efficiently radiated by the heat sink. Further, since the capacity of the internal space of the heat sink is also reduced, there is a possibility that the heat generated by the electronic components of the lighting circuit provided in the heat sink cannot be efficiently radiated.

In Patent Document 1, in a bulb-type fluorescent lamp using a fluorescent tube, a lighting device is arranged inside the base, and the inside of the base and the inside of the cover in which the fluorescent tube is accommodated are heated by a heat blocking member. The structure which interrupts | blocks automatically is disclosed.

WO2007 / 007653

When a fluorescent tube is used as in the light bulb-type fluorescent lamp disclosed in Patent Document 1, there is no need to dissipate heat because it is a discharge light emission. Therefore, there is no need to use a heat sink, and the lighting device is arranged inside the base. can do. However, a bulb-type LED lamp using an LED module requires a heat sink in order to use a semiconductor light-emitting element, and the electronic components used in the lighting device also require a control circuit and are relatively large. A lighting device cannot be arranged only inside.

In particular, in a light bulb shaped LED lamp corresponding to a small light bulb such as a mini-krypton light bulb, the heat sink and the base must be made small, and the configuration as in Patent Document 1 cannot be made.

Moreover, in the light bulb-type LED lamp, it is desirable that there is no temperature difference between the heat dissipation characteristics due to the circuit efficiency and the heat dissipation characteristics due to the LED module. This is a problem peculiar to an LED lamp that needs to release heat generated from the lighting circuit and heat energy generated from the LED to the outside with high efficiency within a limited specification.

The present invention solves such problems, and its purpose is to efficiently dissipate heat generated in a semiconductor light emitting device or heat generated by electronic components of a lighting circuit by being excellent in heat dissipation. Another object of the present invention is to provide a light bulb shaped lamp that can be easily adapted to miniaturization and high output.

In order to achieve the above object, a light bulb shaped lamp according to the present invention comprises a cylindrical base attached to a socket of a lighting fixture, a cylindrical heat sink having one end connected to the base, a semiconductor A light emitting module having a light emitting element and attached to the other end of the heat sink so that light from the semiconductor light emitting element is irradiated to the outside of the heat sink along the axis of the base; and the light emitting module And a lighting circuit electrically connected to the base, and a circuit board on which the lighting circuit is mounted, and the base and the heat sink in a state along the axis of the base. It is arrange | positioned inside, and one end part is connected to the said nozzle | cap | die in the heat conduction state, It is characterized by the above-mentioned.

In the light bulb shaped lamp according to the present invention, the heat of the light emitting module is not only radiated by the heat sink, but is also radiated through the base because it is transmitted to the base through the circuit board in the lighting circuit unit. Thereby, the light emitting module can be efficiently radiated. Further, even when the electronic component mounted on the circuit board is in a heat generating state, the heat can be dissipated through the base connected to the circuit board. Thereby, it can respond easily to size reduction and high output of a light bulb shaped lamp.

It is sectional drawing of the lighting fixture for general incandescent lamps with which the lightbulb-shaped LED lamp which concerns on Embodiment 1 of this invention was mounted | worn. It is sectional drawing which shows schematic structure of the lightbulb-type LED lamp. It is a perspective view which shows an example of a structure of the connection part of the circuit board and module support stand in the light bulb-type LED lamp. It is a circuit diagram of the lighting circuit provided in the light bulb shaped LED lamp. It is sectional drawing which shows schematic structure of the lightbulb-type LED lamp which concerns on Embodiment 2 of this invention. It is a perspective view which shows the other example of a structure of the connection part of the circuit board and baseplate in the lightbulb-shaped LED lamp. (A) is a perspective view which shows an example of a structure of the connection part of the circuit board and circuit case in the lightbulb-shaped LED lamp, (b) is the sectional drawing.

Hereinafter, an embodiment of a light bulb shaped lamp according to the present invention will be described with respect to a light bulb shaped LED lamp having an LED chip which is a semiconductor light emitting element, with reference to the drawings.

<Embodiment 1>
FIG. 1 is a cross-sectional view of a lighting fixture for a general incandescent bulb equipped with a bulb-type LED lamp 1 according to this embodiment. The lighting fixture 70 includes a hemispherical (basket-like) fixture main body 71 attached to the ceiling, and a socket 72 attached to the fixture main body 71. The socket 72 is such that the insertion port into which the cap for a general incandescent bulb is inserted is opposed to the opening 71a formed on the peripheral surface of the instrument main body 71, and the insertion port side is positioned on the lower side. It is supported on the outside of the instrument main body 71 while being slightly inclined with respect to the horizontal line.

FIG. 2 is a cross-sectional view for explaining the configuration of the bulb-type LED lamp 1 of the present embodiment. The light bulb-shaped LED lamp 1 of the present embodiment includes a heat sink 10 configured in a hollow truncated cone shape, a module support base 41 attached to one end (base end) of the heat sink 10, and a module support base 41. And the base 30 connected to the other end (tip) of the heat sink 10.

The module support base 41 is covered with a globe 43 with the LED module 42 attached to one surface. The globe 43 is formed in a hemispherical shape with an open end surface made of a light-transmitting material such as glass or synthetic resin.

The heat sink 10 is entirely formed in a cylindrical shape having a large diameter at the tip end and a diameter decreasing toward the base end side to which the base 30 is connected, by die-casting aluminum with excellent heat dissipation. . The heat sink 10 has a constant thickness of about 1.5 mm to 3 mm throughout.

The end surface of the base end portion of the heat sink 10 is a connection surface 11 having an opening 11a at the center. An insulating ring 13 that is concentric with the opening 11a is integrally attached to the connection surface 11 with, for example, an adhesive.

The end of the insulating ring 13 located on the side opposite to the heat sink 10 is an insertion portion 13 a that is inserted into the base 30, and the insertion portion 13 a is inserted into the base 30. Thereby, the base 30 is attached to the insulating ring 13.

The base 30 conforms to the standard of E17 base specified in JIS (Japanese Industrial Standard), for example, so as to be attached to the socket 71 of the lighting fixture 70.

In addition, the base 30 is not limited to the configuration conforming to the standard of the E17 base as described above, but conforms to other standards (E26 base etc.) defined by JIS so that it can be attached to the socket of other lighting fixtures. A suitable configuration may be used.

The base 30 has a shell 31 configured in a cylindrical shape. On the peripheral surface of the shell 31, a screw portion 31 a for mounting the shell 31 in the socket 72 of the lighting fixture 70 is provided. The threaded portion 31 a provided on the peripheral surface of the shell 31 forms a thread groove in which the valley portion and the mountain portion are reversed on the outer peripheral surface and the inner peripheral surface of the shell 31.

An insulating connector 32 is provided at the tip of the shell 31 on the insertion side into the socket 72. The insulating connecting body 32 has a hollow conical shape protruding toward the tip, and is attached to the shell 31 in a coaxial state. An eyelet 33 is attached to the tip of the insulating connecting body 32. The shell 31 and the eyelet 33 are integrally connected by an insulating connector 32.

A power supply pin 34 along the axial direction of the shell 31 is attached to the eyelet 33. The power supply pin 34 extends from the eyelet 33 toward the insulating connector 32, passes through the axial center of the insulating connector 32, and protrudes into the shell 31.

A module support base 41 attached to the tip of the heat sink 10 opposite to the base 30 has a disk shape having a diameter substantially equal to the diameter of the end face of the tip of the heat sink 10. Is partially fitted to the heat sink 10 so as to be in a heat conducting state. For example, the module support base 41 is entirely made of aluminum having excellent heat dissipation.

The LED module 42 is mounted on the surface of the module support base 41 located outside the heat sink 10. In the LED module 42, for example, a plurality of LED chips 42a (see FIG. 4), which are semiconductor light emitting elements, are mounted on a square printed board. These LED chips 42a are connected in series by a wiring pattern provided on the printed board. One end of each of the pair of lead wires 54 is electrically connected to the wiring pattern provided on the printed circuit board. Each lead wire 54 is electrically connected to the circuit board 51 of the lighting circuit unit 50 disposed inside the heat sink 10 through each of a pair of through holes 41 a provided in the module support base 41.

A lighting circuit unit 50 is provided inside the heat sink 10. The lighting circuit unit 50 converts electric power supplied from the base 30 into electric power corresponding to each LED chip 42 a of the LED module 42, and has a strip-like shape that is elongated along the axial direction of the heat sink 10. A circuit board 51 and a lighting circuit 55 mounted on the circuit board 51 are provided.

The circuit board 51 has a width-direction dimension that is substantially equal to the inner diameter of the shell 31 of the base 30 throughout, and the center line along the longitudinal direction of the circuit board 51 coincides with the axis of the heat sink 10. The heat sink 10 is arranged from the inside of the base 30 to the inside of the base 30.

As shown in FIGS. 2 and 3, the module support base 41 is provided with a groove 41b facing one end of the circuit board 51. The groove portion 41b is formed in a straight line shape along the diameter direction of the module support base 41, and one end portion of the circuit board 51 is fitted in the groove portion 41b. Thereby, the circuit board 51 is integrally attached to the module support base 41.

As shown in FIG. 2, the circuit board 51 includes an opening 11 a and an insulating ring 13 provided on the connection surface 11 of the heat sink 10 such that an end opposite to the module support base 41 is located in the base 30. Of each passing through. On each side surface outside the side edge portions on both sides of the end portion of the circuit board 51 located in the base 30, the uneven portions corresponding to the crests and troughs in the screw portion 31 a provided on the shell 31 of the base 30. 51b are respectively provided along the longitudinal direction.

Side conductive patterns 51a having electrical conductivity and thermal conductivity are formed on the respective side edges of the circuit board 51 on which the uneven portions 51b are formed. Each of the side conductive patterns 51a is made of a metal such as copper or aluminum having excellent conductivity and thermal conductivity. Each side conductive pattern 51 a has an uneven shape along the uneven portion 51 b of the circuit board 51.

The circuit board 51 is rotated around the central axis along the longitudinal direction in a state where the end portion provided with each side conductive pattern 51 a is abutted in the shell 31 of the base 30, thereby forming each uneven portion 51 b. However, it will be in the state which engaged with the screw part 31a and was screw-coupled. The circuit board 51 is inserted along the longitudinal direction with respect to the base 30 by continuing to rotate around the central axis in a state where each uneven portion 51b is screwed to the screw portion 31a, and is inserted into the base 30. The end portion is abutted against an insulating connector 32 provided on the base 30.

The central portion of the end portion of the circuit board 51 inserted into the shell 31 is a tip conductive portion 51d having conductivity and thermal conductivity. This leading end conductive portion 51d is also made of a metal such as copper or aluminum having excellent conductivity and thermal conductivity. The tip conductive portion 51d is provided with a pin hole 51c into which the power supply pin 34 protruding from the insulating connector 32 is inserted. The power supply pin 34 inserted into the pin hole 51c is connected to the tip conductive portion 51d. It is in an electrically connected state.

The lighting circuit 55 provided on the circuit board 51 converts commercial AC power (for example, 100 V) supplied via the base 30 into predetermined DC power. FIG. 4 is a circuit diagram of the lighting circuit 55. The bulb-shaped LED lamp 1 of the present embodiment is mounted on the socket 72 of the lighting fixture 70, so that the AC power supplied to the socket 72 is adjusted by the dimmer 74 provided on the socket 72. , And supplied through an eyelet 33 and a shell 31 provided in the base 30.

The eyelet 33 is electrically connected to the tip conductive portion 51 d of the circuit board 51 via the power supply pin 34, and the shell 31 is directly and electrically connected to each side conductive pattern 51 a of the circuit board 51. It is connected. The circuit board 51 is provided with a wiring pattern connected to the tip conductive portion 51d and the side conductive patterns 51a, and each electronic component constituting the lighting circuit 55 is electrically connected to the wiring pattern. Has been.

The lighting circuit 55 is provided with a rectifier circuit 55a that rectifies the supplied alternating current. The lighting circuit 55 amplifies the current rectified by the rectifier circuit 55a by the current mirror circuit 55b, and then filters the current to a predetermined frequency by the filter circuit 55c. Further, the lighting circuit 55 controls the current filtered by the filter circuit 55c as a stable voltage by the power factor correction circuit 55d and controls it to a predetermined voltage by the control circuit 55e.

The control circuit 55e controls the voltage based on the ambient temperature detected by the PCT thermistor 55f and outputs it to the buck-boost converter 55g. The buck-boost converter 55g adjusts the voltage output from the control circuit 55e to a predetermined voltage.

A pair of lead wires 54 are connected to the buck-boost converter 55g via a wiring pattern. As described above, each lead wire 54 is electrically connected to the LED module 42, and each LED chip 42 a provided in the LED module 42 is turned on by a current flowing through each lead wire 54.

A rectifier circuit 55a, a current mirror circuit 55b, a filter circuit 55c, a power factor correction circuit 55d, a control circuit 55e, a PCT thermistor 55f, an electronic component such as a resistor and a capacitor included in the buck-boost converter 55g, and other components constituting the lighting circuit 55 The electronic components are mounted in a state of being distributed on the front surface and the back surface of the circuit board 51. In this case, electronic components are also mounted on the circuit board 51 located inside the base 30.

The light bulb shaped LED lamp 1 having such a configuration is assembled as follows. First, the lighting circuit 55 is formed by mounting electronic components on the circuit board 51, and the circuit board 51 on which the lighting circuit 55 is formed is attached to the module support base 41 on which the LED module 42 is mounted. In this case, one end of the circuit board 51 is fitted into a groove 41b provided on the back surface of the module support base 41 so that the circuit board 51 and the LED module 42 are connected to each through hole 41a in the module support base 41. Are electrically connected by lead wires 54 that have passed through each of them.

Thereafter, the circuit board 51 is inserted into the heat sink 10 while being attached to the module support base 41. In this case, an insulating ring 13 is attached in advance to the connection surface 11 of the heat sink 10. Next, the end portions of the circuit board 51 where the side conductive patterns 51 a are provided are protruded from the openings 11 a of the connection surface 11 of the heat sink 10, so that the module support base 41 is opposite to the connection surface 11 of the heat sink 10. Attach to the side edge.

At this time, the globe 43 may be attached to the module support base 41, but the globe 43 may be attached to the module support base 41 after the base 30 is attached.

In such a state, the shell 31 of the base 30 is fitted to the end protruding from the insulating ring 13 attached to the heat sink 10, and the base 30 is rotated relative to the heat sink 10. Thereby, each concavo-convex part 51b in the circuit board 51 is screwed to the screw part 31a on the inner peripheral surface of the shell 31 via the side conductive pattern 51a, and the circuit board 51 is screwed into the shell 31. .

When the circuit board 51 is screwed into the shell 31 in this way, the power supply pin 34 provided on the base 30 is inserted into the pin hole 51c provided on the leading end conductive portion 51d of the circuit board 51. The As a result, the power supply pin 34 and the tip conductive portion 51d are electrically connected to each other. In this case, each side conductive pattern 51a in the circuit board 51 is screwed to the screw portion 31a of the shell 31, so that each side conductive pattern 51a and the shell 31 are electrically connected to each other. Become.

By continuing the rotation operation of the base 30 with respect to the heat sink 10, the leading end conductive portion 51d of the circuit board 51 comes into contact with the insulating connecting body 32. As a result, the insertion portion 13 a of the insulating ring 13 attached to the connection surface 11 of the heat sink 10 is inserted into the shell 31, and the insertion portion 13 a is pressed against the circuit board 51 in the shell 31. It becomes a state. Accordingly, the base 30 is integrally attached to the heat sink 10 via the insulating ring 13.

When the assembled bulb-type LED lamp 1 is mounted on the lighting fixture 70 for a general incandescent bulb shown in FIG. 1, the fixture main body attached to the ceiling with the user holding the heat sink 10 The light bulb shaped LED lamp 1 is inserted from the lower opening of the portion 71. In this case, depending on the size of the opening, the bulb-shaped LED lamp 1 is inclined so as to approach a vertical state with respect to the axial direction of the socket 72, and the base 30 of the bulb-shaped LED lamp 1 is inserted into the socket 72. .

Thereafter, the heat sink 10 is rotated in a predetermined direction with respect to the socket 72. As a result, the base 30 rotates integrally with the heat sink 10, and the screw portion 31 a provided on the shell 31 of the base 30 is screw-coupled with the screw portion provided on the inner peripheral surface of the socket 72. Is screwed into the socket 72. Thereafter, when the rotation operation of the heat sink 10 in a predetermined direction is continued, the base 30 is not screwed to the socket 72. Thereby, the light bulb shaped LED lamp 1 is mounted on the socket 72.

In the light bulb-type LED lamp 1 mounted in the socket 72, each LED chip 42a of the LED module 42 is turned on by power feeding from the socket 72. Each LED chip 42 a generates heat when it is turned on, but heat generated from each LED chip 42 a is radiated to the outside by the module support base 41 and the heat sink 10 made of aluminum.

As a result, each LED chip 42a is suppressed from being in a high temperature state even when it generates heat by being lit. Thereby, each LED chip 42a can maintain a stable light output state.

Further, the electronic components constituting the lighting circuit 55 provided on the circuit board 51 are in a heat generating state when electric power is supplied. However, also in this case, since the end portion of the circuit board 51 located inside the base 30 is in a heat conduction state with the shell 31 of the base 30, the heat of the circuit board 51 passes through the shell 31. The heat is radiated to the outside. Thereby, it is suppressed that it becomes a high temperature state by heat_generation | fever of an electronic component.

As described above, the bulb-type LED lamp 1 of the present embodiment can be used stably over a long period of time because each LED chip 42a and electronic components can be prevented from becoming high temperature.

<Embodiment 2>
FIG. 5 is a cross-sectional view showing a schematic configuration of the light bulb shaped LED lamp 1 according to the second embodiment. In the light bulb shaped LED lamp 1 of the present embodiment, a circuit case 21 is accommodated in a heat sink 10 configured in a cylindrical shape having a circular cross section, and a lighting circuit is provided in each of the circuit case 21 and the base 30. A unit 50 is provided. The base 30 has the same configuration as the base 30 of the bulb-type LED lamp 1 of the first embodiment shown in FIG.

The heat sink 10 has the same configuration as the heat sink 10 of the bulb-type LED lamp 1 of Embodiment 1 except that the heat sink 10 is sized to accommodate the circuit case 21. An insulating ring 13 is provided between them. The insulating ring 13 has substantially the same configuration as the insulating ring 13 of the first embodiment, and is bonded to the connection surface 11 of the heat sink 10 with an adhesive.

The circuit case 21 has a truncated cone shape in which the end on the connection surface 11 side of the heat sink 10 has a small diameter, and the base plate 23 is integrally attached to the end on the large diameter side of the circuit case 21. . The circuit case 21 is arranged coaxially with the heat sink 10. The end surface 21 a at the end of the circuit case 21 on the connection surface 11 side is located in the opening 11 a provided on the connection surface 11 of the heat sink 10 and is in contact with the insulating ring 13. An opening 21b is also provided in the end surface 21a of the circuit case 21, and the circuit board 51 passes through the opening 21b.

The circuit case 21 has insulation and heat dissipation. For example, the circuit case 21 is a molded body made of a material in which a heat dissipation material (for example, carbon fiber) is added to an insulating synthetic resin, whereby the circuit case 21 is insulative and has a heat dissipation property. Have. The circuit case 21 is not limited to such a configuration, and an insulating synthetic resin is molded into a truncated cone shape, and a heat conductive sheet having heat dissipation properties such as carbon fiber is formed on the inner peripheral surface of the molded body. The heat dissipation may be imparted by pasting.

The base plate 23 is formed in a disc shape by an insulating resin. The base plate 23 is integrally attached to the circuit case 21 by fitting the outer peripheral edge portion into the end portion on the large diameter side of the circuit case 21. A groove 23b is formed along the diameter direction at the center of the back surface of the base plate 23 facing the inside of the circuit case 21, and the end of the circuit board 51 is inserted into the groove 23b.

The circuit board 51 has the same configuration as the circuit board 51 of the first embodiment except that the circuit board 51 is integrally attached to the base plate 23. Therefore, also in this embodiment, as shown in FIG. 5, each side part conductive pattern 51a and the tip conductive part 51d are provided at one end part.

Note that the circuit board 51 is not limited to be attached to the base plate 23 by the groove 23b provided in the base plate 23. For example, as shown in FIG. 6, without providing the groove 23 b in the base plate 23, one end of the circuit board 51 is abutted against the back surface of the base plate 23, and the circuit board is attached to the base plate 23 by a pair of mounting members 24. 51 may be attached. Each attachment member 24 is formed in an L shape, for example, by aluminum, and one side portion is attached to the end portion of the circuit board 51 by solder 25, and the other side portion is attached to the base plate 23 by screws 26. It has been.

As shown in FIG. 5, a module support base 41 on which the LED module 42 is mounted is attached to the surface of the base plate 23 opposite to the inner side of the circuit case 21 so as to face the base plate 23. It has been. The module support base 41 has substantially the same configuration as the module support base 41 in the first embodiment, and is made of heat conductive aluminum or the like.

At the center of the surface of the base plate 23, a protrusion 23c that protrudes toward the module support base 41 is provided, and the head of the screw 27 is embedded in the protrusion 23c. The distal end portion of the screw 27 protrudes from the protruding portion 23 c and is screwed to a female screw portion provided at the center portion of the module support base 41. Thereby, the module support base 41 is integrally attached to the base plate 23.

The LED module 42 mounted on the module support base 41 has the same configuration as the LED module 42 in the first embodiment. As shown in FIG. 5, the LED module 42 is provided on the module support base 41. The electric power of the lighting circuit 55 provided in the circuit board 51 is supplied through each of the pair of through holes 41a and each lead wire 54 passing through each of the pair of through holes 23a provided in the base plate 23. The

FIG. 7A is a perspective view of the end surface 21a and its peripheral portion in the circuit case 21, and FIG. 7B is a cross-sectional view thereof. On the front surface and the back surface of the circuit board 51, heat conduction patterns 51m made of, for example, a copper pattern are provided in portions passing through the opening 21b in the end surface 21 of the circuit case 21. One side portion of the attachment plate 56 configured in an L shape with a heat conductive metal (for example, aluminum) is integrally attached to the heat conduction pattern 51m by, for example, solder 58. The other side portion of the attachment plate 56 is attached to the end surface 21 a of the circuit case 21 with, for example, a screw 57.

Thus, the circuit case 21 having heat dissipation is in a heat conductive state with the circuit board 51 by the heat conductive mounting plate 56 with respect to the heat conductive pattern 51m of the circuit board 51. Therefore, even when the electronic component mounted on the circuit board 51 is in a heat generating state, the heat is conducted from the circuit board 51 to the circuit case 21 and is radiated by the circuit case 21.

The light bulb shaped LED lamp 1 having such a configuration is assembled as follows. First, the module support base 41 on which the LED module 42 is mounted is integrally connected to the base plate 23 with screws 27. Further, one end of the circuit board 51 is attached to the base plate 23, and the circuit board 51 and the LED module 42 are connected by a pair of lead wires 54.

Next, the base plate 23 is integrally attached to one end portion of the circuit case 21, and the other end portion of the circuit board 51 is attached to the end surface 21 a of the circuit case 21 with a pair of attachment plates 56. In such a state, the circuit case 21 is accommodated in the heat sink 10, the module support base 41 attached to the base plate 23 is fitted to the end of the heat sink 10, and the globe 43 is attached to the module support base 41. Install.

As a result, the circuit case 21 is housed inside the heat sink 10, and the end of the circuit board 51 attached to the circuit case 21 in a thermally conductive state protrudes from the circuit case 21 and the heat sink 10. Become.

In such a state, similarly to the above-described embodiment, by operating the heat sink 10, the end portions provided with the respective side conductive patterns 51 a on the circuit board 51 are inserted into the shell 31 of the base 30, The uneven portion 51 b provided on the side surface of the partial conductive pattern 51 a is screwed to the screw portion 31 a on the inner peripheral surface of the shell 31. Then, the circuit board 51 is screwed into the shell 31 by rotating the heat sink 10 in a predetermined direction.

As a result, the power supply pin 34 provided on the base 30 is inserted into the pin hole 51c provided on the tip conductive portion 51d of the circuit board 51, and the side conductive patterns 51a and the shell 31 are electrically connected. Is done. Further, the insertion portion 13 a of the insulating ring 13 attached to the connection surface 11 of the heat sink 10 is inserted into the shell 31, and the insertion portion 13 a is in pressure contact with the inner surface of the shell 31 by the circuit board 51. . Accordingly, the base 30 is integrally attached to the heat sink 10 via the insulating ring 13.

The light bulb shaped LED lamp 1 assembled in this way is attached to the lighting device 70 for a general incandescent light bulb shown in FIG. 1 in the same manner as in the first embodiment.

In the light bulb-type LED lamp 1 mounted in the socket 72, each LED chip 42a of the LED module 42 is turned on by power feeding from the socket 72. Each LED chip 42 a is in a heat generating state when it is turned on, but heat generated from each LED chip is transmitted to the heat sink 10 via the module support base 41 made of aluminum, and is radiated to the outside by the heat sink 10. Is done.

Further, when electric power is supplied to the lighting circuit 55 provided on the circuit board 51 in order to light each LED chip, the electronic components constituting the lighting circuit are also heated. In this case, heat generated from each electronic component passes through the circuit board 51, is transmitted from each side conductive pattern 51 a to the socket 72, and is radiated to the outside through the socket 72.

Moreover, since the circuit board 51 is in a heat conductive state with the circuit case 21 having heat dissipation properties by the heat conductive pattern 51m at one end and the heat conductive mounting plate 56, the heat of the electronic component is reduced. Heat is efficiently radiated by the circuit case 21. Therefore, it is possible to prevent the electronic components of the lighting circuit, the LED chip 42a, and the like from becoming hot and being damaged or shortening the life. Thereby, the lightbulb-type LED lamp 1 of this embodiment can be used stably over a long period of time.

The light bulb shaped lamp according to the present invention is useful as a technique for improving heat radiation efficiency in a light bulb shaped LED lamp using a semiconductor light emitting element as a light source.

DESCRIPTION OF SYMBOLS 10 Heat sink 11 Connection surface 21 Circuit case 23 Base plate 30 Base 31 Shell 32 Connection insulator 33 Eyelet 34 Power supply pin 41 Module support base 41
42 LED module 50 lighting circuit unit 51 circuit board 51a side conductive pattern 51b uneven portion 51d tip conductive portion 55 lighting circuit

Claims

A cylindrical base attached to the socket of the lighting fixture;
A cylindrical heat sink having one end connected to the base, and
A light emitting module attached to the other end of the heat sink so that the light from the semiconductor light emitting element is irradiated to the outside of the heat sink along the axis of the base;
A lighting circuit electrically connected to the light emitting module and the base;
A circuit board on which the lighting circuit is mounted,
An electric bulb characterized in that the circuit board is disposed inside the base and the heat sink in a state along the axis of the base, and one end of the circuit board is connected to the base in a thermally conductive state. Shaped lamp.
2. The light bulb shaped lamp according to claim 1, wherein one end of the circuit board and the base are screwed together.
A support base is integrally attached to the other end of the heat sink, and the light emitting module is attached to the support base with the light irradiation direction facing the outside of the heat sink,
3. The light bulb shaped lamp according to claim 1, wherein the other end of the circuit board is attached in a thermally conductive state to a surface of the support base that faces the inside of the heat sink.
A circuit case that houses the circuit board and the lighting circuit is housed inside the heat sink,
The light bulb shaped lamp according to claim 1 or 2, wherein the circuit case has insulating properties and heat dissipation properties, and the circuit case and the circuit board are in a heat conducting state.
The circuit case has a configuration in which a heat dissipation material is added to an insulating synthetic resin, or a heat conductive sheet having a heat dissipation property is attached to an inner peripheral surface of a molded body of an insulating synthetic resin. The light bulb shaped lamp according to claim 4, wherein the light bulb shaped lamp has a configuration.