WO2011046120A1 - Resin composition and adhesive agent - Google Patents
Resin composition and adhesive agent Download PDFInfo
- Publication number
- WO2011046120A1 WO2011046120A1 PCT/JP2010/067895 JP2010067895W WO2011046120A1 WO 2011046120 A1 WO2011046120 A1 WO 2011046120A1 JP 2010067895 W JP2010067895 W JP 2010067895W WO 2011046120 A1 WO2011046120 A1 WO 2011046120A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- component
- adhesive
- meth
- resin composition
- acrylate
- Prior art date
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- 239000000853 adhesive Substances 0.000 title claims abstract description 71
- 239000011342 resin composition Substances 0.000 title claims abstract description 33
- 230000001070 adhesive effect Effects 0.000 claims abstract description 69
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims abstract description 41
- 229920002451 polyvinyl alcohol Polymers 0.000 claims abstract description 18
- 239000004372 Polyvinyl alcohol Substances 0.000 claims abstract description 17
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 8
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 claims abstract description 8
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 8
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000003999 initiator Substances 0.000 claims abstract description 5
- 229920000089 Cyclic olefin copolymer Polymers 0.000 claims description 23
- 150000001993 dienes Chemical group 0.000 claims description 14
- 239000011521 glass Substances 0.000 claims description 10
- 238000003860 storage Methods 0.000 claims description 8
- 239000004417 polycarbonate Substances 0.000 claims description 6
- 229920000515 polycarbonate Polymers 0.000 claims description 6
- 229920002284 Cellulose triacetate Polymers 0.000 claims description 5
- NNLVGZFZQQXQNW-ADJNRHBOSA-N [(2r,3r,4s,5r,6s)-4,5-diacetyloxy-3-[(2s,3r,4s,5r,6r)-3,4,5-triacetyloxy-6-(acetyloxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6s)-4,5,6-triacetyloxy-2-(acetyloxymethyl)oxan-3-yl]oxyoxan-2-yl]methyl acetate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](OC(C)=O)[C@H]1OC(C)=O)O[C@H]1[C@@H]([C@@H](OC(C)=O)[C@H](OC(C)=O)[C@@H](COC(C)=O)O1)OC(C)=O)COC(=O)C)[C@@H]1[C@@H](COC(C)=O)O[C@@H](OC(C)=O)[C@H](OC(C)=O)[C@H]1OC(C)=O NNLVGZFZQQXQNW-ADJNRHBOSA-N 0.000 claims description 5
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical group C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 125000002897 diene group Chemical group 0.000 abstract 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 abstract 1
- 230000001747 exhibiting effect Effects 0.000 abstract 1
- 229910052739 hydrogen Inorganic materials 0.000 abstract 1
- 239000001257 hydrogen Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 description 12
- -1 2-hydroxypropyl Chemical group 0.000 description 11
- 239000004809 Teflon Substances 0.000 description 6
- 229920006362 Teflon® Polymers 0.000 description 6
- 239000003963 antioxidant agent Substances 0.000 description 6
- 238000011156 evaluation Methods 0.000 description 6
- 229920000642 polymer Polymers 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 230000003078 antioxidant effect Effects 0.000 description 5
- 150000001925 cycloalkenes Chemical class 0.000 description 5
- 229920001195 polyisoprene Polymers 0.000 description 5
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 4
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 4
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 4
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 4
- 239000003505 polymerization initiator Substances 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 125000006850 spacer group Chemical group 0.000 description 4
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 4
- IKEHOXWJQXIQAG-UHFFFAOYSA-N 2-tert-butyl-4-methylphenol Chemical compound CC1=CC=C(O)C(C(C)(C)C)=C1 IKEHOXWJQXIQAG-UHFFFAOYSA-N 0.000 description 3
- 239000004831 Hot glue Substances 0.000 description 3
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 3
- 239000005062 Polybutadiene Substances 0.000 description 3
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 229920002857 polybutadiene Polymers 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 238000007127 saponification reaction Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- SYYDEXILBJXXIA-UHFFFAOYSA-N trimethoxy(pent-4-enyl)silane Chemical compound CO[Si](OC)(OC)CCCC=C SYYDEXILBJXXIA-UHFFFAOYSA-N 0.000 description 3
- OBGBGHKYJAOXRR-UHFFFAOYSA-N 2-methoxy-1,4-naphthoquinone Chemical compound C1=CC=C2C(=O)C(OC)=CC(=O)C2=C1 OBGBGHKYJAOXRR-UHFFFAOYSA-N 0.000 description 2
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- 229910019142 PO4 Inorganic materials 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 244000028419 Styrax benzoin Species 0.000 description 2
- 235000000126 Styrax benzoin Nutrition 0.000 description 2
- 235000008411 Sumatra benzointree Nutrition 0.000 description 2
- RMKZLFMHXZAGTM-UHFFFAOYSA-N [dimethoxy(propyl)silyl]oxymethyl prop-2-enoate Chemical compound CCC[Si](OC)(OC)OCOC(=O)C=C RMKZLFMHXZAGTM-UHFFFAOYSA-N 0.000 description 2
- GUCYFKSBFREPBC-UHFFFAOYSA-N [phenyl-(2,4,6-trimethylbenzoyl)phosphoryl]-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C(=O)C1=C(C)C=C(C)C=C1C GUCYFKSBFREPBC-UHFFFAOYSA-N 0.000 description 2
- 238000000862 absorption spectrum Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 229960002130 benzoin Drugs 0.000 description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 2
- 239000012965 benzophenone Substances 0.000 description 2
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 2
- MHCLJIVVJQQNKQ-UHFFFAOYSA-N ethyl carbamate;2-methylprop-2-enoic acid Chemical compound CCOC(N)=O.CC(=C)C(O)=O MHCLJIVVJQQNKQ-UHFFFAOYSA-N 0.000 description 2
- 235000019382 gum benzoic Nutrition 0.000 description 2
- NWVVVBRKAWDGAB-UHFFFAOYSA-N hydroquinone methyl ether Natural products COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- JFNLZVQOOSMTJK-KNVOCYPGSA-N norbornene Chemical compound C1[C@@H]2CC[C@H]1C=C2 JFNLZVQOOSMTJK-KNVOCYPGSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 2
- 239000010452 phosphate Substances 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229920002589 poly(vinylethylene) polymer Polymers 0.000 description 2
- 238000007142 ring opening reaction Methods 0.000 description 2
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 2
- CNHDIAIOKMXOLK-UHFFFAOYSA-N toluquinol Chemical compound CC1=CC(O)=CC=C1O CNHDIAIOKMXOLK-UHFFFAOYSA-N 0.000 description 2
- HHQAGBQXOWLTLL-UHFFFAOYSA-N (2-hydroxy-3-phenoxypropyl) prop-2-enoate Chemical compound C=CC(=O)OCC(O)COC1=CC=CC=C1 HHQAGBQXOWLTLL-UHFFFAOYSA-N 0.000 description 1
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- KETQAJRQOHHATG-UHFFFAOYSA-N 1,2-naphthoquinone Chemical compound C1=CC=C2C(=O)C(=O)C=CC2=C1 KETQAJRQOHHATG-UHFFFAOYSA-N 0.000 description 1
- VNQXSTWCDUXYEZ-UHFFFAOYSA-N 1,7,7-trimethylbicyclo[2.2.1]heptane-2,3-dione Chemical compound C1CC2(C)C(=O)C(=O)C1C2(C)C VNQXSTWCDUXYEZ-UHFFFAOYSA-N 0.000 description 1
- WKBPZYKAUNRMKP-UHFFFAOYSA-N 1-[2-(2,4-dichlorophenyl)pentyl]1,2,4-triazole Chemical compound C=1C=C(Cl)C=C(Cl)C=1C(CCC)CN1C=NC=N1 WKBPZYKAUNRMKP-UHFFFAOYSA-N 0.000 description 1
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- YIKSHDNOAYSSPX-UHFFFAOYSA-N 1-propan-2-ylthioxanthen-9-one Chemical compound S1C2=CC=CC=C2C(=O)C2=C1C=CC=C2C(C)C YIKSHDNOAYSSPX-UHFFFAOYSA-N 0.000 description 1
- WJFKNYWRSNBZNX-UHFFFAOYSA-N 10H-phenothiazine Chemical compound C1=CC=C2NC3=CC=CC=C3SC2=C1 WJFKNYWRSNBZNX-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- JMIZWXDKTUGEES-UHFFFAOYSA-N 2,2-di(cyclopenten-1-yloxy)ethyl 2-methylprop-2-enoate Chemical compound C=1CCCC=1OC(COC(=O)C(=C)C)OC1=CCCC1 JMIZWXDKTUGEES-UHFFFAOYSA-N 0.000 description 1
- PIZHFBODNLEQBL-UHFFFAOYSA-N 2,2-diethoxy-1-phenylethanone Chemical compound CCOC(OCC)C(=O)C1=CC=CC=C1 PIZHFBODNLEQBL-UHFFFAOYSA-N 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- BRKORVYTKKLNKX-UHFFFAOYSA-N 2,4-di(propan-2-yl)thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C(C)C)=CC(C(C)C)=C3SC2=C1 BRKORVYTKKLNKX-UHFFFAOYSA-N 0.000 description 1
- BTJPUDCSZVCXFQ-UHFFFAOYSA-N 2,4-diethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC(CC)=C3SC2=C1 BTJPUDCSZVCXFQ-UHFFFAOYSA-N 0.000 description 1
- LCHAFMWSFCONOO-UHFFFAOYSA-N 2,4-dimethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC(C)=C3SC2=C1 LCHAFMWSFCONOO-UHFFFAOYSA-N 0.000 description 1
- ZZYASVWWDLJXIM-UHFFFAOYSA-N 2,5-di-tert-Butyl-1,4-benzoquinone Chemical compound CC(C)(C)C1=CC(=O)C(C(C)(C)C)=CC1=O ZZYASVWWDLJXIM-UHFFFAOYSA-N 0.000 description 1
- JZODKRWQWUWGCD-UHFFFAOYSA-N 2,5-di-tert-butylbenzene-1,4-diol Chemical compound CC(C)(C)C1=CC(O)=C(C(C)(C)C)C=C1O JZODKRWQWUWGCD-UHFFFAOYSA-N 0.000 description 1
- QYXHDJJYVDLECA-UHFFFAOYSA-N 2,5-diphenylcyclohexa-2,5-diene-1,4-dione Chemical compound O=C1C=C(C=2C=CC=CC=2)C(=O)C=C1C1=CC=CC=C1 QYXHDJJYVDLECA-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- GJKGAPPUXSSCFI-UHFFFAOYSA-N 2-Hydroxy-4'-(2-hydroxyethoxy)-2-methylpropiophenone Chemical compound CC(C)(O)C(=O)C1=CC=C(OCCO)C=C1 GJKGAPPUXSSCFI-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- FGTYTUFKXYPTML-UHFFFAOYSA-N 2-benzoylbenzoic acid Chemical compound OC(=O)C1=CC=CC=C1C(=O)C1=CC=CC=C1 FGTYTUFKXYPTML-UHFFFAOYSA-N 0.000 description 1
- QPXVRLXJHPTCPW-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-(4-propan-2-ylphenyl)propan-1-one Chemical compound CC(C)C1=CC=C(C(=O)C(C)(C)O)C=C1 QPXVRLXJHPTCPW-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 description 1
- MYISVPVWAQRUTL-UHFFFAOYSA-N 2-methylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC=C3SC2=C1 MYISVPVWAQRUTL-UHFFFAOYSA-N 0.000 description 1
- BJEMXPVDXFSROA-UHFFFAOYSA-N 3-butylbenzene-1,2-diol Chemical compound CCCCC1=CC=CC(O)=C1O BJEMXPVDXFSROA-UHFFFAOYSA-N 0.000 description 1
- OXYZDRAJMHGSMW-UHFFFAOYSA-N 3-chloropropyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)CCCCl OXYZDRAJMHGSMW-UHFFFAOYSA-N 0.000 description 1
- MRBKEAMVRSLQPH-UHFFFAOYSA-N 3-tert-butyl-4-hydroxyanisole Chemical compound COC1=CC=C(O)C(C(C)(C)C)=C1 MRBKEAMVRSLQPH-UHFFFAOYSA-N 0.000 description 1
- LVNLBBGBASVLLI-UHFFFAOYSA-N 3-triethoxysilylpropylurea Chemical compound CCO[Si](OCC)(OCC)CCCNC(N)=O LVNLBBGBASVLLI-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- 125000006181 4-methyl benzyl group Chemical group [H]C1=C([H])C(=C([H])C([H])=C1C([H])([H])[H])C([H])([H])* 0.000 description 1
- 238000006677 Appel reaction Methods 0.000 description 1
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 1
- WMONOXOCMIPNNU-UHFFFAOYSA-N C=CC(=O)OCCCC(O)COC(=O)C1=CC=CC=C1C(O)=O Chemical compound C=CC(=O)OCCCC(O)COC(=O)C1=CC=CC=C1C(O)=O WMONOXOCMIPNNU-UHFFFAOYSA-N 0.000 description 1
- GAWIXWVDTYZWAW-UHFFFAOYSA-N C[CH]O Chemical group C[CH]O GAWIXWVDTYZWAW-UHFFFAOYSA-N 0.000 description 1
- IMROMDMJAWUWLK-UHFFFAOYSA-N Ethenol Chemical compound OC=C IMROMDMJAWUWLK-UHFFFAOYSA-N 0.000 description 1
- 239000004606 Fillers/Extenders Substances 0.000 description 1
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 1
- 229910001335 Galvanized steel Inorganic materials 0.000 description 1
- FEXQDZTYJVXMOS-UHFFFAOYSA-N Isopropyl benzoate Chemical compound CC(C)OC(=O)C1=CC=CC=C1 FEXQDZTYJVXMOS-UHFFFAOYSA-N 0.000 description 1
- 239000004419 Panlite Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229920000297 Rayon Polymers 0.000 description 1
- BGNXCDMCOKJUMV-UHFFFAOYSA-N Tert-Butylhydroquinone Chemical compound CC(C)(C)C1=CC(O)=CC=C1O BGNXCDMCOKJUMV-UHFFFAOYSA-N 0.000 description 1
- LFOXEOLGJPJZAA-UHFFFAOYSA-N [(2,6-dimethoxybenzoyl)-(2,4,4-trimethylpentyl)phosphoryl]-(2,6-dimethoxyphenyl)methanone Chemical compound COC1=CC=CC(OC)=C1C(=O)P(=O)(CC(C)CC(C)(C)C)C(=O)C1=C(OC)C=CC=C1OC LFOXEOLGJPJZAA-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 150000001491 aromatic compounds Chemical class 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- AOJOEFVRHOZDFN-UHFFFAOYSA-N benzyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC1=CC=CC=C1 AOJOEFVRHOZDFN-UHFFFAOYSA-N 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 1
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- 150000001875 compounds Chemical class 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 1
- GMSCBRSQMRDRCD-UHFFFAOYSA-N dodecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCOC(=O)C(C)=C GMSCBRSQMRDRCD-UHFFFAOYSA-N 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- WOXXJEVNDJOOLV-UHFFFAOYSA-N ethenyl-tris(2-methoxyethoxy)silane Chemical compound COCCO[Si](OCCOC)(OCCOC)C=C WOXXJEVNDJOOLV-UHFFFAOYSA-N 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000008397 galvanized steel Substances 0.000 description 1
- 229920000578 graft copolymer Polymers 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000012567 medical material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- LUCXVPAZUDVVBT-UHFFFAOYSA-N methyl-[3-(2-methylphenoxy)-3-phenylpropyl]azanium;chloride Chemical compound Cl.C=1C=CC=CC=1C(CCNC)OC1=CC=CC=C1C LUCXVPAZUDVVBT-UHFFFAOYSA-N 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229950000688 phenothiazine Drugs 0.000 description 1
- LYXOWKPVTCPORE-UHFFFAOYSA-N phenyl-(4-phenylphenyl)methanone Chemical compound C=1C=C(C=2C=CC=CC=2)C=CC=1C(=O)C1=CC=CC=C1 LYXOWKPVTCPORE-UHFFFAOYSA-N 0.000 description 1
- OXNIZHLAWKMVMX-UHFFFAOYSA-N picric acid Chemical compound OC1=C([N+]([O-])=O)C=C([N+]([O-])=O)C=C1[N+]([O-])=O OXNIZHLAWKMVMX-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 125000003367 polycyclic group Chemical group 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- GQIUQDDJKHLHTB-UHFFFAOYSA-N trichloro(ethenyl)silane Chemical compound Cl[Si](Cl)(Cl)C=C GQIUQDDJKHLHTB-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 239000005050 vinyl trichlorosilane Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
- C08F220/1807—C7-(meth)acrylate, e.g. heptyl (meth)acrylate or benzyl (meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
- C08F220/1811—C10or C11-(Meth)acrylate, e.g. isodecyl (meth)acrylate, isobornyl (meth)acrylate or 2-naphthyl (meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/04—Acids; Metal salts or ammonium salts thereof
- C08F220/06—Acrylic acid; Methacrylic acid; Metal salts or ammonium salts thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
- C08F222/04—Anhydrides, e.g. cyclic anhydrides
- C08F222/06—Maleic anhydride
Definitions
- the present invention relates to an adhesive.
- Cycloolefin polymers are used in applications such as electronic materials, optical lenses and medical materials. Cycloolefin polymers are known as difficult adherends because of their low polarity and lack of many functional groups on the surface. Examples of the adhesive for adhering such a cycloolefin-based resin include a solvent-type adhesive and a hot melt adhesive.
- Patent Document 1 As a method for adhering an olefin resin, there is a method of adhering with an instantaneous adhesive after performing a treatment with a primer as disclosed in Patent Document 1. Moreover, as disclosed in Patent Document 2, an energy ray-curable resin composition containing (meth) acrylate is disclosed.
- a solvent type adhesive uses a solvent. Solvent-type adhesives are harmful to the human body, and it takes time for the solvent to evaporate, so that sufficient adhesive strength itself cannot be obtained.
- the hot melt adhesive requires labor and equipment for melting the adhesive. Also, this adhesive cannot provide sufficient adhesive strength. In the case of using a hot melt adhesive, if the cycloolefin polymer is heated in advance, the adhesive strength is improved, but a new problem that the resin is deformed occurs.
- Patent Document 1 According to the adhesion method disclosed in Patent Document 1, there is a problem that it takes time and effort for primer treatment, and a sufficient adhesion strength cannot be obtained.
- Patent Document 2 discloses an energy ray curable resin composition containing (meth) acrylate. However, there is no description about (meth) acrylate having a dicyclopentenyl group.
- An object of this invention is to provide the adhesive agent for cycloolefin polymers which can express sufficient adhesive strength in a short time with respect to a cycloolefin polymer, for example, and is a solvent-free type and environmentally friendly.
- the present inventor has intensively studied to solve the above-described problems and has arrived at the present invention.
- a resin composition comprising the following components (A) to (E).
- (A) component is a (meth) acrylate having a dicyclopentenyl group
- (B) component is a (meth) acrylate having a hydroxyl group
- (C) component is having a (meth) acryloyl group and is a diene skeleton
- the (meth) acrylate (D) component having a hydrogenated diene-based skeleton is a silane coupling agent (E) component is a photopolymerization initiator.
- the resin composition according to the present invention further comprises (meth) acrylic acid as the component (F).
- the resin composition according to the present invention further contains polyvinyl alcohol as the component (G).
- the component (A) is dicyclopentenyl (meth) acrylate.
- the component (C) has a number average molecular weight of 500 to 50,000.
- the resin composition according to the present invention has a thickness of 0.03 mm, and when cured by irradiation for 15 seconds under conditions of a wavelength of 365 nm and an integrated light quantity of 2000 mJ / cm 2 , the storage elasticity of the cured product.
- the rate is in the range of 0.1 to 100,000 MPa (23 ° C.).
- the present invention is an adhesive comprising the resin composition according to the present invention.
- the adhesive according to the present invention is a cycloolefin polymer adhesive.
- the adhesive according to the present invention is an adhesive for a cycloolefin polymer having a dicyclopentadiene ring structure.
- the present invention is an adhesive body in which adherends are bonded to each other using the adhesive according to the present invention.
- the adherend according to the present invention is at least one member selected from the group consisting of cycloolefin polymer, polycarbonate, cellulose triacetate, polyvinyl alcohol and glass.
- the adhesive according to the present invention is applied to the surface of the adherend so as to have a thickness of 0.0001 to 5 mm, and the adherends are bonded to each other to obtain a wavelength of 200 to 500 nm.
- This is a method for producing an adhesive body comprising curing the adhesive under conditions of an integrated light quantity of 200 to 6000 J / cm 2 and an irradiation time of 1 to 60 seconds.
- the resin composition of the present invention is characterized by high adhesive strength and excellent moisture resistance.
- the component (A) in the present invention is a (meth) acrylate having a dicyclopentenyl group. More specifically, the component (A) is a (meth) acrylate containing one or more dicyclopentenyl groups at the terminal or side chain of the molecule.
- Examples of (A) component (meth) acrylate include dicyclopentenyloxyethyl (meth) acrylate, dicyclopentenyloxypropyl (meth) acrylate, and dicyclopentenyl (meth) acrylate. Of these, dicyclopentenyl (meth) acrylate is preferred.
- the component (B) is a (meth) acrylate containing a hydroxyl group. More specifically, the component (B) is a (meth) acrylate containing one or more hydroxyl groups at the end or side chain of the molecule.
- hydroxyl group-containing (meth) acrylates include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, and 2-hydroxy-3-phenoxypropyl (meth) acrylate.
- 2-hydroxy-3-phenoxypropyl (meth) acrylate is more preferable from the viewpoint of resin film adhesion.
- the component (C) is a (meth) acrylate having a (meth) acryloyl group and having a diene skeleton or a hydrogenated diene skeleton. More specifically, the component (C) has one or more (meth) acryloyl groups at the terminal or side chain of the molecule, and has a diene skeleton or a hydrogenated diene skeleton.
- (Meth) acrylates preferably (meth) acrylates having one or more (meth) acryloyl groups at the end of the molecule and having a diene skeleton or a hydrogenated diene skeleton. is there. This includes the following components from the viewpoint of imparting flexibility to the resin.
- the main chain skeleton of (meth) acrylate is a diene skeleton or a hydrogenated diene skeleton.
- the diene skeleton or the hydrogenated diene skeleton include one or more skeletons selected from the group consisting of polybutadiene, polyisoprene, a hydrogenated polybutadiene, and a hydrogenated polyisoprene.
- at least one selected from the group consisting of polyisoprene and a hydrogenated product of polyisoprene is preferable, and polyisoprene is more preferable.
- the (meth) acrylate of the component (C) has one or more (meth) acryloyl groups at the terminal or side chain of the main chain skeleton. Among these, those having (meth) acryloyl groups at both ends of the main chain skeleton are preferable.
- the number average molecular weight of the component (C) (meth) acrylate is preferably 500 to 50,000, and more preferably 8000 to 45,000. If the number average molecular weight is 500 or more, the cured product obtained by irradiating the adhesive of the present invention with energy rays has a high hardness, so that it is easy to form an adhesive layer. If the number average molecular weight is 50000 or less, the viscosity of the resulting adhesive is small, so that the workability in mixing during the production process and the workability when using the adhesive in practical applications are good.
- the component (C) (meth) acrylate includes “UC-203” manufactured by Kuraray Co., Ltd. (an esterified oligomer of maleic anhydride adduct of isoprene polymer and 2-hydroxyethyl methacrylate), “TEAI-” manufactured by Nippon Soda Co., Ltd. 1000 ”(hydrogenated 1,2-polybutadiene terminated urethane methacrylate),“ TE-2000 ”(1,2-polybutadiene terminated urethane methacrylate) manufactured by Nippon Soda Co., Ltd. and derivatives thereof,“ CN-301 ”“ CN-303 ”manufactured by Sartomer "CN-307" (polybutadiene acrylate oligomer).
- Silane coupling agents include ⁇ -chloropropyltrimethoxysilane, vinyltrimethoxysilane, vinyltrichlorosilane, vinyltriethoxysilane, vinylpropyltrimethoxysilane, vinyl-tris ( ⁇ -methoxyethoxy) silane, ⁇ - (meta ) Acryloxypropyltrimethoxysilane, ⁇ - (3,4-epoxycyclohexyl) ethyltrimethoxysilane, ⁇ -glycidoxypropyltrimethoxysilane, ⁇ -mercaptopropyltrimethoxysilane, ⁇ -aminopropyltriethoxysilane, N - ⁇ - (aminoethyl) - ⁇ -aminopropyltrimethoxysilane, N- ⁇ - (aminoethyl) - ⁇ -aminopropylmethyldime
- one of the group consisting of ⁇ -glycidoxypropyltrimethoxysilane, ⁇ - (meth) acryloxypropyltrimethoxysilane and vinylpropyltrimethoxysilane is preferable.
- a component is a photoinitiator.
- the photopolymerization initiator include an ultraviolet polymerization initiator and a visible light polymerization initiator, both of which are used without limitation.
- examples of the ultraviolet polymerization initiator include benzoin, benzophenone, and acetophenone.
- examples of visible light polymerization initiators include acylphosphine oxide, thioxanthone, metallocene, quinone, and ⁇ -aminoalkylphenone.
- Photopolymerization initiators include benzophenone, 4-phenylbenzophenone, benzoylbenzoic acid, 2,2-diethoxyacetophenone, bisdiethylaminobenzophenone, benzyl, benzoin, benzoyl isopropyl ether, benzyldimethyl ketal, 1-hydroxycyclohexyl phenyl ketone, thioxanthone 2-methylthioxanthone, 2,4-dimethylthioxanthone, isopropylthioxanthone, 2,4-diethylthioxanthone, 2,4-diisopropylthioxanthone, 1- (4-isopropylphenyl) 2-hydroxy-2-methylpropan-1-one 1- (4- (2-hydroxyethoxy) -phenyl) -2-hydroxy-2-methyl-1-propan-1-one, 2-hydroxy-2-methyl-1-phenyl Rupropan-1-one, camphorquinone, 2,4,6-tri
- the resin composition of the present invention contains the components (A) to (E) as essential components.
- the resin composition containing the components (A) to (E) is cured when irradiated with light.
- the cured product has good adhesiveness to the cycloolefin polymer and has a high surface curability during the curing.
- the resin composition of the present invention exhibits high adhesive strength even for general-purpose plastic resins such as polycarbonate, cellulose triacetate, and polyvinyl alcohol, and glass adherends.
- the resin composition in the present invention can contain (meth) acrylic acid as the component (F). This is particularly used from the viewpoint of durability such as moisture resistance.
- the resin composition in the present invention can contain polyvinyl alcohol as the component (G). This includes the following components from the viewpoint of adhesiveness to the polyvinyl alcohol resin.
- the polyvinyl alcohol is not particularly limited as long as it is a polyvinyl alcohol derivative obtained by saponifying polyvinyl acetate.
- the average degree of polymerization of polyvinyl alcohol is preferably from 100 to 5,000, more preferably from 1,000 to 4,000.
- the average degree of saponification of polyvinyl alcohol is preferably 85 to 100 mol%, more preferably 90 to 100 mol%.
- the use amount of the resin composition of the present invention is as follows, from the viewpoint that the adhesiveness of the adhesive to the cycloolefin polymer is particularly high and also has high adhesive strength to other adherends. It is as follows.
- Component (D) is used in an amount of 0.01 to 10 masses per 100 parts by mass of the total amount of component (A), component (B), component (C) and component (F) used as necessary. Part is preferable, 0.1 to 5 parts by weight is more preferable, and typically 0.5 to 1.0 part by weight.
- Component (E) is used in an amount of 0.01 to 30 masses per 100 parts by mass of the total amount of component (A), component (B), component (C) and component (F) used as necessary. Part is preferable, 0.1 to 20 parts by weight is more preferable, and typically 5 to 10 parts by weight.
- Component (F) is used in an amount of 0.1 to 30 parts by mass in 100 parts by mass of the total amount of component (A), component (B), component (C) and component (F) used as necessary.
- the amount is preferably 1 to 20 parts by mass, and typically 10 to 15 parts by mass.
- Component (G) is used in an amount of 0.01 to 50 masses per 100 parts by mass of the total amount of component (A), component (B), component (C) and component (F) used as necessary. Part is preferable, 0.1 to 30 parts by weight is more preferable, and typically 0.5 to 1.0 part by weight.
- the resin composition of the present invention is within the range that does not impair the object of the present invention, and is a graft copolymer, solvent, extender, reinforcing material, plasticizer, thickener, dye, pigment, flame retardant, antioxidant. , And additives such as surfactants can be used.
- the cured product of the resin composition of the present invention preferably has a storage elastic modulus of 0.1 to 100000 MPa (23 ° C.), more preferably has a storage elastic modulus of 10 to 10000 MPa, typically 500 to 5000 MPa. It is.
- the storage elastic modulus of the cured product of the resin composition is 0.1 MPa or more, the cured product is cured and no unreacted component remains.
- the storage elastic modulus is 100000 MPa or less, the cured product does not become too rigid and the adhesive force does not decrease.
- the resin composition of the present invention can be used as an adhesive.
- the adhesive of the present invention exhibits high adhesive strength with respect to one or more selected from the group consisting of, for example, cycloolefin polymer, polycarbonate, cellulose triacetate, polyvinyl alcohol, and glass. In particular, it exhibits high adhesive strength for cycloolefin polymers.
- the cycloolefin polymer of the present invention is a thermoplastic resin having a structural unit derived from a cyclic olefin (cycloolefin) monomer such as norbornene or a polycyclic norbornene monomer.
- cycloolefin polymers include cycloolefin ring-opening polymers, hydrogenated ring-opening copolymers using two or more cycloolefins, chain olefins, aromatic compounds having a vinyl group, and cycloolefins.
- the adhesive according to the present invention is particularly effective for cycloolefin polymers having a dicyclopentadiene ring structure. Moreover, you may introduce
- cycloolefin polymers examples include “Topas” manufactured by Ticona®, Germany, “Arton” manufactured by JSR, “ZEONOR” and “ZEONEX” manufactured by Zeon Japan, Mitsui Chemicals, Inc. “Appel” made by the manufacturer can be mentioned.
- the adhesive bonding method of the present invention is as follows, for example.
- An adhesive is applied to the surface of at least one of the two adherends so as to have a thickness of 0.0001 to 5 mm, typically 0.01 to 0.50 mm.
- irradiation time 1 to 60 seconds, typically 2 to
- a method in which the adhesive is cured under a condition of 30 seconds to adhere the adherend is preferable.
- an antioxidant may be used as the other component.
- a phenol type or a hydroquinone type can be used, and a phenol type is preferably used.
- Antioxidants include ⁇ -naphthoquinone, 2-methoxy-1,4-naphthoquinone, methylhydroquinone, hydroquinone, 2,2-methylene-bis (4-methyl-6-tertiarybutylphenol), catechol, hydroquinone monomethyl ether, mono Tertiary butyl hydroquinone, 2,5-ditertiary butyl hydroquinone, p-benzoquinone, 2,5-diphenyl-p-benzoquinone, 2,5-ditertiary butyl-p-benzoquinone, picric acid, citric acid, phenothiazine, tertiary Examples thereof include butyl catechol, 2-butyl-4-hydroxyanisole and 2,6-ditertiary butyl-p-
- the amount of the antioxidant used is 0.01 to 10 parts by mass with respect to 100 parts by mass of the total amount of component (A), component (B), component (C) and component (F) used as necessary. Is preferable, 0.1 to 8 parts by mass is more preferable, and 2.0 to 8.0 parts by mass is more preferable.
- component (A) a (meth) acrylate containing a dicyclopentenyl group, dicyclopentenyl acrylate (“FA-511AS” manufactured by Hitachi Chemical Co., Ltd.)
- component (A) a (meth) acrylate containing a dicyclopentenyl group, dicyclopentenyloxyethyl methacrylate (“FA-512MT” manufactured by Hitachi Chemical Co., Ltd.)
- component (B) Component, 2-hydroxy-3-phenoxypropyl acrylate (“M-5700” manufactured by Toagosei Co., Ltd.) as a (meth) acrylate containing a hydroxyl group
- B) Component, 2-hydroxyethyl methacrylate (“light ester HO” manufactured by Kyoeisha Chemical Co., Ltd.) as a (meth) acrylate containing a hydroxyl group
- C Component, oligomer, “UC-203” (esterified oligomer of maleic anhydride
- Light Ester BZ Lauryl methacrylate (Kyoeisha Chemical Co., Ltd. “Light Ester L”) Antioxidant, (D-1) 2,2-methylene-bis (4-methyl-6-tertiary butylphenol) (“Sumilyzer MDP-S” manufactured by Sumitomo Chemical Co., Ltd.)
- Test piece 12a width 25 mm ⁇ length 100 mm ⁇ thickness 2.0 mm
- a Teflon (registered trademark) tape 10 thickness 80 ⁇ m ⁇ width 25 mm ⁇ length 25 mm having a hole 11 having a size of 0.5 cm 2 in the center was attached to control the adhesive thickness.
- Test pieces 25 mm ⁇ 25 mm ⁇ 0.03 mm are 80 ⁇ m thick ⁇ 11.5 mm wide ⁇ length
- An adhesive was adhered using a 25 mm Teflon (registered trademark) tape as a spacer (adhesion area: 3.125 cm 2 ). After curing, the tensile bond strength was measured using the test piece bonded with an adhesive. Curing conditions followed the method described in [Photocurability].
- a galvanized steel sheet 100 mm ⁇ 25 mm ⁇ 2.0 mm, engineering test service
- the tensile bond strength was measured using the test piece adhered with an adhesive.
- the tensile shear bond strength (unit: MPa) was measured at a tensile rate of 10 mm / min in an environment of a temperature of 23 ° C. and a humidity of 50%.
- Adhesives were prepared by mixing raw materials of the types shown in Table 1 with the compositions shown in Table 1. Various physical properties of the obtained adhesive were measured. The results are shown in Table 1.
- This invention can express sufficient adhesive strength with respect to a cycloolefin polymer, a polycarbonate, polyvinyl alcohol, and glass.
- the present invention has moisture resistance.
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- Life Sciences & Earth Sciences (AREA)
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Abstract
Description
下記(A)~(E)成分を含有してなる樹脂組成物である。
(A)成分は、ジシクロペンテニル基を有する(メタ)アクリレート
(B)成分は、水酸基を有する(メタ)アクリレート
(C)成分は、(メタ)アクリロイル基を有し、かつ、ジエン系の骨格又は水素添加されたジエン系の骨格を有する(メタ)アクリレート
(D)成分は、シランカップリング剤
(E)成分は、光重合開始剤 That is, the present invention in one aspect,
A resin composition comprising the following components (A) to (E).
(A) component is a (meth) acrylate having a dicyclopentenyl group (B) component is a (meth) acrylate having a hydroxyl group (C) component is having a (meth) acryloyl group and is a diene skeleton Alternatively, the (meth) acrylate (D) component having a hydrogenated diene-based skeleton is a silane coupling agent (E) component is a photopolymerization initiator.
(A)成分、ジシクロペンテニル基を含有する(メタ)アクリレートとして、ジシクロペンテニルオキシエチルメタクリレート(日立化成社製社製「FA-512MT」)
(B)成分、水酸基を含有する(メタ)アクリレートとして、2-ヒドロキシ-3-フェノキシプロピルアクリレート(東亞合成社製「M-5700」)
(B)成分、水酸基を含有する(メタ)アクリレートとして、2-ヒドロキシエチルメタクリレート(共栄社化学社製社製「ライトエステルHO」)
(C)成分、オリゴマー、クラレ社製「UC-203」(イソプレン重合物の無水マレイン酸付加物と2-ヒドロキシエチルメタクリレートとのエステル化物オリゴマー))(GPCによるポリスチレン換算の数平均分子量36000)
(D)成分、シランカップリング剤、γ-グリシドキシプロピルトリメトキシシラン(信越化学社製「KBM-403」)
(D)成分、シランカップリング剤、ビニルプロピルトリメトキシシラン(信越化学社製「KBM-1003」)
(D)成分、シランカップリング剤、γ-メタクリロキシプロピルトリメトキシシラン(信越化学社製社製「KBM-503」)
(E)成分、光開始剤として、ベンジルジメチルケタール(チバ・スペシャルティー・ケミカルズ社製「IRGACURE651」)
(E)成分、光開始剤として、ビス(2,4,6-トリメチルベンゾイル)-フェニルホスフィンオキサイド(チバ・スペシャルティー・ケミカルズ社製「IRGACURE819」)
(F)成分、メタクリル酸(三菱レイヨン社製「AM」)
(F)成分、アクリル酸(日本触媒社製社製「アクリル酸メチルAM」)
(G)成分、ポリビニルアルコール(電気化学工業社製「デンカポバール H-17」)(平均重合度1200、平均けん化度97モル%)
(G)成分、ポリビニルアルコール(電気化学工業社製「デンカポバール F-12」)(平均重合度1200、平均けん化度99モル%)
ベンジルメタクリレート(共栄社化学社製「ライトエステルBZ」)
ラウリルメタクリレート(共栄社化学社製「ライトエステルL」)
酸化防止剤、(D-1)2,2-メチレン-ビス(4-メチル-6-ターシャリーブチルフェノール)(住友化学社製「スミライザーMDP-S」) As component (A), a (meth) acrylate containing a dicyclopentenyl group, dicyclopentenyl acrylate (“FA-511AS” manufactured by Hitachi Chemical Co., Ltd.)
As component (A), a (meth) acrylate containing a dicyclopentenyl group, dicyclopentenyloxyethyl methacrylate ("FA-512MT" manufactured by Hitachi Chemical Co., Ltd.)
(B) Component, 2-hydroxy-3-phenoxypropyl acrylate (“M-5700” manufactured by Toagosei Co., Ltd.) as a (meth) acrylate containing a hydroxyl group
(B) Component, 2-hydroxyethyl methacrylate (“light ester HO” manufactured by Kyoeisha Chemical Co., Ltd.) as a (meth) acrylate containing a hydroxyl group
(C) Component, oligomer, “UC-203” (esterified oligomer of maleic anhydride adduct of isoprene polymer and 2-hydroxyethyl methacrylate) produced by Kuraray Co., Ltd.) (Number average molecular weight 36,000 in terms of polystyrene by GPC)
Component (D), silane coupling agent, γ-glycidoxypropyltrimethoxysilane (“KBM-403” manufactured by Shin-Etsu Chemical Co., Ltd.)
Component (D), silane coupling agent, vinylpropyltrimethoxysilane (“KBM-1003” manufactured by Shin-Etsu Chemical Co., Ltd.)
Component (D), silane coupling agent, γ-methacryloxypropyltrimethoxysilane (“KBM-503” manufactured by Shin-Etsu Chemical Co., Ltd.)
As component (E) and photoinitiator, benzyldimethyl ketal (“IRGACURE651” manufactured by Ciba Specialty Chemicals)
As component (E) and photoinitiator, bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide (“IRGACURE819” manufactured by Ciba Specialty Chemicals)
Component (F), methacrylic acid (“AM” manufactured by Mitsubishi Rayon Co., Ltd.)
Component (F), acrylic acid (“Methyl acrylate AM” manufactured by Nippon Shokubai Co., Ltd.)
Component (G), polyvinyl alcohol (“DENKA POVAL H-17” manufactured by Denki Kagaku Kogyo Co., Ltd.) (average polymerization degree 1200, average saponification degree 97 mol%)
Component (G), polyvinyl alcohol (“Denkapoval F-12” manufactured by Denki Kagaku Kogyo Co., Ltd.) (average polymerization degree 1200, average saponification degree 99 mol%)
Benzyl methacrylate (Kyoeisha Chemical Co., Ltd. “Light Ester BZ”)
Lauryl methacrylate (Kyoeisha Chemical Co., Ltd. “Light Ester L”)
Antioxidant, (D-1) 2,2-methylene-bis (4-methyl-6-tertiary butylphenol) (“Sumilyzer MDP-S” manufactured by Sumitomo Chemical Co., Ltd.)
〔光硬化性〕温度23℃で測定した。光硬化性に関しては、ZEONEX480R(日本ゼオン社製)試験片(25mm×25mm×2.0mm)表面に接着剤を厚み0.03mmになるように塗布した。厚みは0.03mmガラスビーズによって制御した。その後、無電極放電ランプを使用したフュージョン社製硬化装置を用い、波長365nm、積算光量2000mJ/cm2の条件にて15秒間照射し、硬化させた。光硬化性として、硬化率を記載した。硬化率は、FT-IRを使用し、以下の式により算出した。
(硬化率)=[100-((硬化後の、炭素と炭素の二重結合の吸収スペクトルの強度)/(硬化前の、炭素と炭素の二重結合の吸収スペクトルの強度))]×100(%) Various physical properties were measured as follows.
[Photocurability] Measured at a temperature of 23 ° C. Regarding photocurability, an adhesive was applied to the surface of a ZEONEX 480R (manufactured by Nippon Zeon) test piece (25 mm × 25 mm × 2.0 mm) to a thickness of 0.03 mm. The thickness was controlled by 0.03 mm glass beads. Thereafter, using a curing device manufactured by Fusion Corporation using an electrodeless discharge lamp, irradiation was carried out for 15 seconds under conditions of a wavelength of 365 nm and an integrated light amount of 2000 mJ / cm 2 , and cured. Curing rate was described as photocurability. The curing rate was calculated by the following formula using FT-IR.
(Curing rate) = [100-((Intensity of absorption spectrum of carbon-carbon double bond after curing) / (Intensity of absorption spectrum of carbon-carbon double bond before curing))] × 100 (%)
パンライト(帝人社製)試験片(25mm×25mm×2.0mm)同士を、厚み80μm×幅11.5mm×長さ25mmのテフロン(登録商標)テープをスペーサーとして用い、接着剤を接着させた(接着面積3.125cm2)。硬化後、接着剤で接着した該試験片を用いて引張接着強さを測定した。硬化条件は〔光硬化性〕に記載の方法に従った。 [General-purpose polymer adhesion evaluation (polycarbonate (manufactured by Teijin Limited) tensile strength between test pieces)]
Panlite (made by Teijin Limited) test pieces (25 mm × 25 mm × 2.0 mm) were bonded to each other using a Teflon (registered trademark) tape having a thickness of 80 μm × width of 11.5 mm × length of 25 mm as a spacer. (Adhesion area 3.125 cm 2 ). After curing, the tensile bond strength was measured using the test piece bonded with an adhesive. Curing conditions followed the method described in [Photocurability].
11 穴
12a、12b 試験片
13 接着剤 10
Claims (13)
- 下記(A)~(E)成分を含有してなる樹脂組成物。
(A)成分は、ジシクロペンテニル基を有する(メタ)アクリレート
(B)成分は、水酸基を有する(メタ)アクリレート
(C)成分は、(メタ)アクリロイル基を有し、かつ、ジエン系の骨格又は水素添加されたジエン系の骨格を有する(メタ)アクリレート
(D)成分は、シランカップリング剤
(E)成分は、光重合開始剤 A resin composition comprising the following components (A) to (E):
(A) component is a (meth) acrylate having a dicyclopentenyl group (B) component is a (meth) acrylate having a hydroxyl group (C) component is having a (meth) acryloyl group and is a diene skeleton Alternatively, the (meth) acrylate (D) component having a hydrogenated diene-based skeleton is a silane coupling agent (E) component is a photopolymerization initiator. - 更に(F)成分として、(メタ)アクリル酸を含有してなる請求項1に記載の樹脂組成物。 Furthermore, the resin composition of Claim 1 formed by containing (meth) acrylic acid as (F) component.
- 更に(G)成分として、ポリビニルアルコールを含有してなる請求項1乃至2に記載の樹脂組成物。 Furthermore, the resin composition of Claim 1 thru | or 2 formed by containing polyvinyl alcohol as (G) component.
- (A)成分、(B)成分及び(C)成分の使用量は、(A)成分、(B)成分及び(C)成分の合計100質量部中、(A)成分:(B)成分:(C)成分=40~90:1~20:5~45(質量比)であり、
(D)成分の使用量は、(A)成分、(B)成分、及び(C)成分の合計量100質量部、又は、(F)成分が使用されるときは(A)成分、(B)成分、(C)成分、及び(F)成分の合計量100質量部に対して、0.01~10質量部であり、
(E)成分の使用量は、(A)成分、(B)成分、及び(C)成分の合計量100質量部、又は、(F)成分が使用されるときは(A)成分、(B)成分、(C)成分、及び(F)成分の合計量100質量部に対して、0.01~30質量部である、
請求項1~3のいずれか1項に記載の樹脂組成物。 Component (A), component (B) and component (C) are used in a total of 100 parts by weight of component (A), component (B) and component (C), component (A): component (B): (C) component = 40-90: 1-20: 5-45 (mass ratio),
The amount of component (D) used is 100 parts by weight of the total amount of component (A), component (B), and component (C), or component (A) when component (F) is used, ) Component, (C) component, and (F) component is 0.01 to 10 parts by mass with respect to 100 parts by mass in total,
The amount of component (E) used is 100 parts by weight of the total amount of component (A), component (B), and component (C), or component (A) when component (F) is used, ) Component, (C) component, and (F) component is 0.01 to 30 parts by mass with respect to 100 parts by mass in total.
The resin composition according to any one of claims 1 to 3. - (A)成分がジシクロペンテニル(メタ)アクリレートである請求項1~4のいずれか1項に記載の樹脂組成物。 The resin composition according to any one of claims 1 to 4, wherein the component (A) is dicyclopentenyl (meth) acrylate.
- (C)成分の数平均分子量が500~50000である請求項1~5のいずれか1項に記載の樹脂組成物。 6. The resin composition according to claim 1, wherein the number average molecular weight of the component (C) is 500 to 50,000.
- 厚み0.03mmとして、波長365nm、積算光量2000mJ/cm2の条件にて15秒間照射することによって、硬化させたときに、硬化物の貯蔵弾性率が0.1~100000MPa(23℃)の範囲内となる請求項1~6のいずれか1項に記載の樹脂組成物。 When cured by irradiation for 15 seconds under conditions of a thickness of 0.03 mm, a wavelength of 365 nm and an integrated light quantity of 2000 mJ / cm 2 , the storage elastic modulus of the cured product is in the range of 0.1 to 100,000 MPa (23 ° C.). The resin composition according to any one of claims 1 to 6, wherein the resin composition is inside.
- 請求項1~7のいずれか1項に記載の樹脂組成物からなる接着剤。 An adhesive comprising the resin composition according to any one of claims 1 to 7.
- シクロオレフィンポリマー用接着剤である請求項8に記載の接着剤。 The adhesive according to claim 8, which is an adhesive for cycloolefin polymer.
- ジシクロペンタジエン環構造を有するシクロオレフィンポリマー用接着剤である請求項8乃至9に記載の接着剤。 The adhesive according to claim 8, which is an adhesive for a cycloolefin polymer having a dicyclopentadiene ring structure.
- 請求項8~10のいずれか1項に記載の接着剤を用いて被着体同士が接着されている接着体。 An adhesive body in which adherends are bonded together using the adhesive according to any one of claims 8 to 10.
- 被着体が、シクロオレフィンポリマー、ポリカーボネート、セルローストリアセテート、ポリビニルアルコール及びガラスからなる群から選ばれる1種以上である請求項10に記載の接着体。 The adherend according to claim 10, wherein the adherend is one or more selected from the group consisting of cycloolefin polymer, polycarbonate, cellulose triacetate, polyvinyl alcohol and glass.
- 被着体表面に、請求項8~10のいずれか1項に記載の接着剤を厚み0.0001~5mmになるように塗布し、被着体同士を貼り合わせ、波長200~500nm、積算光量200~6000J/cm2、照射時間1~60秒の条件下で接着剤を硬化することを含む、接着体の製造方法。 The adhesive according to any one of claims 8 to 10 is applied to the surface of the adherend so as to have a thickness of 0.0001 to 5 mm, and the adherends are bonded to each other, with a wavelength of 200 to 500 nm and an integrated light quantity. A method for producing an adhesive comprising curing an adhesive under conditions of 200 to 6000 J / cm 2 and an irradiation time of 1 to 60 seconds.
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JP2011173975A (en) * | 2010-02-24 | 2011-09-08 | Kuraray Co Ltd | Adhesive for polyvinyl alcohol-based polymer film |
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JP2015108044A (en) * | 2013-12-03 | 2015-06-11 | 電気化学工業株式会社 | Adhesive composition for tentatively fixing, tentative fixing method of structure and member using the same |
WO2016039277A1 (en) * | 2014-09-08 | 2016-03-17 | 電気化学工業株式会社 | Composition and disassembling method |
EP2927295A4 (en) * | 2012-11-30 | 2016-08-03 | Lintec Corp | Adhesive agent composition, adhesive sheet, and electronic device |
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