WO2010140184A1

WO2010140184A1 - Probe and probe device

Info

Publication number: WO2010140184A1
Application number: PCT/JP2009/002431
Authority: WO
Inventors: 秋葉慎一郎
Original assignee: 有限会社電材マート; 株式会社宮下スプリング製作所
Priority date: 2009-06-01
Filing date: 2009-06-01
Publication date: 2010-12-09

Abstract

A probe having a simple structure and a small diameter. A probe is provided with a helical spring (20) formed by winding a conductive wire, and also with a bar-like conductor (10) inserted into the inside of the helical spring (20). The helical spring (20) has fastening sections (201, 202) for fastening and restraining the bar-like conductor (10), a closely wound section (21) formed by closely winding the conductive wire and having an end in contact with an electrode, and a spring section (23) stretching and contracting between the closely wound section (21) and the fastening sections (201, 202). When the spring section (23) is neither stretched nor contracted, the front end of the bar-like conductor (10) is located inside the closely wound section (21).

Description

Probe and probe device

The present invention relates to a probe and a probe device used for electrically connecting an inspection object (or an inspection intermediate jig) and an inspection apparatus in inspection of a semiconductor IC, a printed circuit board, etc., and more particularly, a vertical type. The present invention relates to a probe and a probe device such as a probe card provided with the probe.

In order to connect a semiconductor IC formed on a wafer to an inspection device, a jig called a probe card is generally used. The probe card includes a large number of probes connected to wiring from the inspection apparatus. By directly contacting each probe with the electrode pad of the semiconductor IC, a conductive path between the inspection apparatus and the semiconductor IC is formed, and the semiconductor IC can be inspected.

The probe includes a horizontal probe that extends horizontally from the periphery of the inspection object to the inside, and a vertical probe that extends vertically from the top to the bottom of the inspection object. The vertical probe has an advantage that the degree of freedom of arrangement of the inspection electrode pad is higher than that of the horizontal probe. The following Patent Document 1 describes an example of a vertical probe that expands and contracts by a spring structure.

Japanese Patent No. 4031007

FIG. 14 is a diagram showing a conventional vertical probe described in Patent Document 1. In FIG.
A conventional vertical probe disclosed in Patent Document 1 includes a cylindrical body (700) having openings (701, 702) at both ends, and a coil spring (710) compressed and accommodated inside the cylindrical body (700). And two probe pins (720, 730) arranged with a coil spring (710) interposed therebetween. The probe pins (720, 730) are biased by a coil spring (710), and their tips protrude from the openings (701, 702).

The vertical probe shown in FIG. 14 has the following problems.

(Problem 1)
The vertical probe shown in FIG. 14 requires four parts (cylinder, coil spring, and two probe pins), and there is a problem that the number of parts is large.

(Problem 2)
In recent years, the number of semiconductor ICs formed on wafers of the same size has increased, and the number of terminals of semiconductor ICs has also increased. Therefore, it is required to narrow the interval between probes (narrow pitch). In order to cope with this, it is necessary to make the diameter of the probe as thin as possible.
However, the vertical probe shown in FIG. 14 has a structure in which the compression coil spring (710) is accommodated in the cylindrical body (700). Due to such a structure, the diameter of the coil spring (710) is essentially smaller than the diameter of the probe in this vertical probe. Therefore, in order to reduce the outer diameter of the probe, the diameter of the coil spring (710) must be further reduced. When the diameter of the coil spring (710) is reduced, there arises a problem that the winding becomes thin and sufficient elastic force cannot be obtained, and that the manufacture becomes difficult.

On the other hand, FIG. 15 is a diagram showing an improved vertical probe described in Patent Document 1. In FIG.
The vertical probe shown in FIG. 15 includes a contact pin (100A) and a cylinder (200A). In the cylindrical body (200A), a coil-shaped spring portion (230A) is formed between the upper cylindrical portion (210A) and the lower cylindrical portion (220A). Moreover, the guide element (120A) extends on the contact pin (100A) on a straight line of the contact element (110A). A collar (130A) is formed between the contact (110A) and the guide (120A). The guide (120A) is inserted into the cylinder (200A), and the lower cylinder (220A) is connected to the flange (130A).

In the vertical probe shown in FIG. 15, since the number of parts is reduced to two (contact pin, cylinder), (Problem 1) described above is improved.
In the vertical probe shown in FIG. 15, since the spring part (230A) is formed in the cylinder (200A), the diameter of the spring part (230A) is equal to the diameter of the probe. Thereby, since it becomes easy to make the diameter of a probe small, improvement about the above-mentioned (problem 2) is also achieved.

However, the vertical probe shown in FIG. 15 has the following problems.

(Problem 3)
In the vertical probe shown in FIG. 15, the contact pin (100A) and the cylindrical body (200A) are connected by fitting and fitting the collar portion (130A) to the lower cylindrical portion (220A). In this structure, it is required to process both with high accuracy. That is, if the processing accuracy is low, it becomes impossible to fit the two together, or loosening occurs and a sufficient coupling force cannot be obtained. If the diameter of the probe is reduced, accurate processing cannot be performed, and thus such a structure makes it difficult to manufacture.

(Problem 4)
In the vertical probe shown in FIG. 15, the spring portion (230A) is formed by subjecting a cylindrical material to laser processing or machining. Therefore, if the probe diameter is reduced, it becomes difficult to manufacture because the fine processing cannot be performed. Further, when the spring portion (230A) is cut out from the cylindrical material, the durability is deteriorated due to cracks associated with the cutting process.

The present invention has been made in view of such circumstances, and an object of the present invention is to provide a probe capable of reducing the diameter with a simple configuration and a probe apparatus configured using such a probe.

The probe according to the first aspect of the present invention includes a spiral spring formed by winding a conducting wire and a rod-shaped conductor inserted inside the spiral spring. The helical spring includes a tightening portion for tightening the rod-shaped conductor, a first densely wound portion in which the conductive wire is tightly wound and in contact with an electrode at an end, the tightening portion, and the first densely wound portion. And a spring portion that expands and contracts between the two. When the spring portion is not expanded and contracted, the tip end portion of the rod-shaped conductor is located inside the first densely wound portion.

Preferably, the rod-shaped conductor has a tapered slope that contacts the inner surface of the first densely wound portion at the tip portion.

Preferably, the first densely wound portion has a tapered portion whose winding diameter becomes narrower toward an end portion in contact with the electrode.

Preferably, the first densely wound portion has a straight portion having a constant winding diameter between the end portion in contact with the electrode and the tapered portion.

Preferably, the probe includes a second densely wound portion extending at an end of the spring portion opposite to the first densely wound portion, and at least a part of the second densely wound portion is wound. A wire is interposed between the tightening portion and the spring portion.

Preferably, the tightening part is formed at least one first tightening part formed in the middle of the second densely wound part and an end of the second densely wound part opposite to the spring part. A second fastening portion.

Preferably, the rod-shaped conductor has a groove that engages with the tightening portion.

Preferably, the rod-shaped conductor has a first groove engaged with the first tightening portion and / or a second groove engaged with the second tightening portion.

Preferably, the spiral spring has a pitch winding portion that is extended at an end of the second dense winding portion on the opposite side to the spring portion, and in which the conductive wire is wound at a constant interval. The conductor has a spiral protrusion that is screwed into the pitch winding portion.

Preferably, the rod-shaped conductor has a step that contacts the end of the spiral spring opposite to the end of the first densely wound portion that contacts the electrode.

Preferably, the rod-shaped conductor has a rod portion inserted into the spiral spring and a plated portion obtained by plating a predetermined metal on the rod portion, and the step is formed by an edge of the plated portion.
Preferably, at least a part of the second densely wound portion is welded to the rod-shaped conductor.

A probe device according to a second aspect of the present invention includes a plurality of probes whose both ends are in contact with electrodes, a first insulating plate having a hole through which a tip of one end of the probe passes, and the probe And a spacer that supports the first insulating plate and the second insulating plate. The second insulating plate includes a hole through which the tip of the other end passes.

According to the present invention, it is possible to provide a probe whose diameter can be reduced with a simple configuration.

It is a figure which shows an example of the probe which concerns on 1st Embodiment. It is the figure which cut | disconnected the spiral spring in FIG. 1, and illustrated the inside. It is the figure which expanded and showed a part of spiral spring in FIG. It is a figure which shows an example of the manufacturing method of a rod-shaped conductor. It is a figure which shows an example of the probe apparatus incorporating the probe shown in FIG. It is the figure which illustrated the principal part of the probe which concerns on 2nd Embodiment. It is a figure which shows the modification of the probe which concerns on 2nd Embodiment. It is a figure which shows an example of the probe which concerns on 3rd Embodiment. It is the figure which cut | disconnected the spiral spring in FIG. 8, and illustrated the inside. It is the figure which expanded and showed a part of spiral spring in FIG. It is a figure which shows the modification of the probe which concerns on 3rd Embodiment. It is a figure for demonstrating the example which provides a straight part ahead of a taper part. It is a figure which shows the example of the probe apparatus with which the probe which has a straight part shown in FIG. 12 was integrated. It is a figure which shows the 1st prior art example of a vertical type probe. It is a figure which shows the 2nd prior art example of a vertical type probe.

<First Embodiment>
First, the structure of the probe 1 according to the first embodiment of the present invention will be described with reference to FIGS.
FIG. 1 is a diagram illustrating an example of a probe 1 according to the first embodiment.
FIG. 2 is a diagram illustrating the inside of the spiral spring 20 in FIG. 1 cut in the axial direction.
FIG. 3 is an enlarged view of a part of the spiral spring 20 in FIG.

The probe 1 shown in FIGS. 1 to 3 includes a spiral spring 20 formed by winding a conducting wire, and a rod-shaped conductor 10 inserted inside the spiral spring 20.

The spiral spring 20 has closely wound

portions

21 and 22 formed at both ends, and a spring portion 23 formed between the two closely wound portions (21, 22). In the densely wound

portions

21 and 22, the conductive wires are tightly wound at close intervals. For this reason, the tightly wound portions 21 and 2 are poor in elasticity and are not easily deformed in shape. On the other hand, in the spring part 23, the conducting wire is wound at a certain interval. Therefore, the spring part 23 is rich in elasticity and can be expanded and contracted in the axial direction.

The rod-shaped conductor 10 has small-

diameter portions

11 and 12 formed at both ends, and a large-diameter portion 13 formed between the two small-diameter portions (11 and 12).

Tapers

101 and 102 are formed at the tips of the

small diameter portions

11 and 12, respectively. Almost the entire small diameter portion 11 is inserted into the spiral spring 20.

In the probe 1 shown in FIGS. 1 to 3, the tip of the taper 101 of the small diameter portion 11 contacts the electrode of the inspection object, and the end of the closely wound portion 21 contacts the electrode of the inspection jig substrate. The densely wound portion 21 has a tapered portion 203 wound so that the winding diameter becomes narrower toward the end portion in contact with the electrode (FIG. 1).

Step 14 exists at the boundary between the small diameter portion 12 and the large diameter portion 13 (FIG. 3). The end portion of the spiral spring 20 (the end portion on the opposite side to the end portion of the closely wound portion 21 that contacts the electrode) abuts on the step 14.

In the tightly wound portion 22,

fastening portions

201 and 202 that fasten and restrain the small diameter portion 12 are provided. The tightening

portions

201 and 202 have a smaller winding diameter than the diameter of the small diameter portion 12. Therefore, when the small diameter portion 12 is inserted into the tightening

portions

201 and 202, the tightening

portions

201 and 202 generate an elastic force so as to narrow the diameter, and tighten the small diameter portion 12.
The tightening portion 201 is formed in the middle of the densely wound portion 22 that is separated from the spring portion 23. The tightening portion 202 is formed at the end of the closely wound portion 22 on the side in contact with the step 14.

In the probe 1 shown in FIGS. 1 to 3, when the spring portion 23 is not expanded or contracted, that is, when the elastic energy is not stored in the spring portion 23, the tip of the small diameter portion 12 is closely wound portion 21. Located inside. That is, the small diameter part 12 penetrates the whole spring part 23, and it supports so that the spring part 23 may not deform | transform in a horizontal direction.

Next, with reference to FIG. 4, the manufacturing method of the rod-shaped conductor 10 is demonstrated.
When the rod-shaped conductor 10 is formed of a material having high hardness (such as tungsten), it becomes very difficult to form the step 14 by cutting when the diameter is reduced. In this case, for example, as shown in FIG. 4, the step 14 can be formed by a method of removing the plating by etching.

Step 1 (FIG. 4A):
First, a rod 2 made of tungsten or the like having a predetermined diameter and length as a core of the rod-shaped conductor 10 is formed.

Step 2 (FIG. 4B):
Next, tapers 101 and 102 are formed at both ends of the rod 2. When the rod 2 is formed of a material having high hardness such as tungsten, the

tapers

101 and 102 are formed by etching, for example. Specifically, for example, by repeatedly immersing the tip of the rod 2 in the etching solution from a direction perpendicular to the liquid surface of the etching solution (such as aqua regia), a taper 101 symmetrical to the central axis of the rod 2 is provided. 102 is formed.

Step 3 (FIG. 4C):
After the

tapers

101 and 102 are formed in the step 2, a plating 3 such as nickel having a predetermined thickness is formed on the surface of the rod 2.

Step 4 (FIG. 4D):
After the plating 3 is formed in step 3, a resist 4 is applied to the plating surface area corresponding to the large diameter portion 13.

Step 5 (FIG. 4E):
After the resist 4 is applied in step 4, the whole is immersed in an etching solution. Thereby, the plating 3 is removed leaving a region covered with the resist 4.

Through the above steps, the portion covered with the plating 3 becomes the large diameter portion 13, and the portions from which the plating 3 is removed become the

small diameter portions

11 and 12. The resist 4 applied to the plating surface may be removed with another resist etching solution.

Next, a probe apparatus in which the above-described probe 1 is incorporated will be described with reference to FIG.
The probe device shown in FIG. 5 includes a plurality of pins 1, an upper plate 33 and a lower plate 35, a spacer 34, and a multilayer substrate 30.

The upper plate 33 has a plurality of guide holes 36 through which the tightly wound portion 21 of the pin 1 is inserted, and the lower plate 35 has a plurality of guide holes 37 through which the small diameter portion 11 of the pin 1 is inserted. The upper plate 33 and the lower plate 35 are formed of an insulating material such as ceramic.

The spacer 34 supports the upper plate 33 and the lower plate 35 by separating them. The guide holes 36 and 37 are aligned on a straight line while being supported by the spacer 34. Further, both ends of the pin 1 protrude from the guide holes 36 and 37 by a predetermined length.

The multilayer substrate 30 has a plurality of electrodes 31 in contact with the tip of the densely wound portion 21 on one surface, and a plurality of electrodes 32 connected to the electrodes 31 by internal wiring on the other surface. The electrode 32 is connected to another jig (for example, an interposer) of the inspection apparatus. Since the electrode 32 is arranged with a space compared to the electrode 31, the wiring density of the electrode 32 is relaxed compared to the electrode 31.

The diameter of the guide hole 37 is larger than the small diameter portion 11 and smaller than the large diameter portion 13. Therefore, the small diameter portion 11 passes through the guide hole 37, but the large diameter portion 13 does not pass through the guide hole 37. As a result, when the small diameter portion 11 is arranged downward as shown in FIG. 5, the large diameter portion 13 is in contact with the edge of the guide hole 37, and the pin 1 is prevented from falling down. Yes.

As shown in FIG. 5, when the electrode 31 of the multilayer substrate 30 is pressed against the densely wound portion 21 of the pin 1, the densely wound portion 21 is pushed downward. At this time, since the lower side of the pin 1 is in contact with the guide hole 37 as described above, and the small diameter portion 12 is fastened by the

fastening portions

201 and 202, the tightly wound portion 21 and the

fastening portions

201 and 202 are interposed. The sandwiched coil portion 23 is compressed. When the coil part 23 is compressed, the closely wound part 21 is urged by the elastic force of the coil part 23 and is in close contact with the electrode 31.

In this state, when the electrode 39 of the wafer 38 is pressed against the tip of the small-diameter portion 11 from below, the rod-shaped conductor 10 is pressed upward. At this time, since the tightly wound portion 21 is in close contact with the electrode 31, the upward movement is restricted, and since the small diameter portion 12 is fastened by the

fastening portions

201 and 202, The coil part 23 sandwiched between the

fastening parts

201 and 202 is further compressed. When the coil portion 23 is compressed, the tip of the small diameter portion 11 is urged by the elastic force of the coil portion 23 and is in close contact with the electrode 39.

When the wafer 38 is repeatedly attached and detached, the bar-shaped conductor 10 moves up and down. At this time, the tip of the small diameter portion 12 moves up and down inside the densely wound portion 21. That is, the rod-shaped conductor 10 moves up and down with the small diameter portion 11 penetrating the entire coil portion 23. Therefore, the coil portion 23 is supported by the small diameter portion 11 so as not to be deformed in the lateral direction while the wafer 38 is repeatedly attached and detached.

The probe according to the present embodiment described above has the following excellent features.

(Feature 1)
The probe 1 according to the present embodiment has a simple configuration in which the rod-shaped conductor 10 is inserted into the spiral spring 20, and the number of parts can be reduced as compared with the conventional one. Thereby, significant cost reduction can be realized (improvement of Problem 1).

(Feature 2)
In the probe 1 according to this embodiment, the outer diameter of the probe and the outer diameter of the spiral spring 20 are substantially equal. Therefore, the outer diameter of the probe can be made thinner than the conventional structure in which a thin spring is accommodated in the cylinder (improvement of Problem 2).

(Feature 3)
In the probe 1 according to the present embodiment, the rod-shaped conductor 10 is tightened at the tightening

portions

201 and 202. That is, a part of the spiral spring 20 is fixed to the rod-shaped conductor 10 using the elastic force of the spring. Even if a slight error occurs in the winding diameters in the tightening

portions

201 and 202 during manufacturing, the elastic force of the winding does not change remarkably, so that the coupling between the spiral spring 20 and the rod-shaped conductor 10 can be kept good. . Therefore, as in the conventional probe shown in FIG. 15, the problem that the processing becomes difficult as the diameter becomes smaller is reduced (improvement of Problem 3).

(Feature 4)
Since the probe 1 according to this embodiment uses a spiral spring 20 formed by winding a conducting wire, the probe shown in FIG. 15 that forms a spring by applying laser processing or machining to a cylindrical material is formed. In comparison, the manufacturing is simple, and it is excellent in terms of easy diameter reduction and durability (improvement of Problem 4).

(Feature 5)
In the probe 1 according to this embodiment, a taper 102 is formed at the tip of the rod-shaped conductor 10 that reciprocates inside the densely wound portion 21. If the tip of the rod-shaped conductor 10 is angular, the inner side of the densely wound portion 21 is slid by the angular tip, so that the winding (conductor) is scraped off. In this case, there arises a problem that a large amount of shavings is generated and a problem that the strength of the winding is lowered. By providing the taper 102, the sliding inside the densely wound portion 21 becomes smooth, and thus the above problem is reduced.

(Feature 6)
In the probe 1 according to this embodiment, a tapered portion 203 is provided at the end of the closely wound portion 21. Thereby, since the area of the edge part which contacts an electrode becomes small and contact pressure becomes high, electrical contact resistance can be made low.

(Feature 7)
In the probe 1 according to the present embodiment, the end of the spiral spring 10 (the end opposite to the end in contact with the electrode) abuts on the step 14 (FIG. 3) formed in the rod-shaped conductor 10. . When the helical spring 10 is compressed by contact with the electrode, a force acts in the lateral direction (longitudinal direction of the rod-shaped conductor 10) on the tightening

portions

201 and 202. Since the end of the spiral spring 10 abuts against the step 14, this force is received by the step 14, so that the displacement of the tightening positions of the tightening

portions

201 and 202 is suppressed. If the displacement of the tightening position is suppressed, for example, in the probe device shown in FIG. 5, the problem that the position of the spiral spring 10 is shifted downward and the elastic force of the spring portion 23 is reduced can be reduced.

(Feature 8)
In the probe 1 according to the present embodiment, the tightening

portions

201 and 202 are separated from the spring portion 23 by the winding of the densely wound portion 22. Thereby, the change of the winding space | interval of the clamping

parts

201 and 202 accompanying the expansion / contraction of the spring part 23 can be relieved, and it becomes difficult to produce the displacement of a clamping position.

(Feature 9)
Since the step 14 of the rod-shaped conductor 10 can be realized by, for example, a plating edge formed by a manufacturing method as shown in FIG. 4, a very thin rod-shaped conductor 10 can be manufactured using a material having high hardness such as tungsten.

<Second Embodiment>
Next, a second embodiment of the present invention will be described.
FIG. 6 is a diagram illustrating the main part of the probe 1A according to the second embodiment, and illustrates the inside by cutting the spiral spring 20 in the axial direction in the same manner as in FIG.

In the probe 1 </ b> A shown in FIG. 6, a groove 15 that engages with the tightening portion 202 is formed in the small diameter portion 12. The groove 15 is formed by laser processing, for example. The tightening portion 201 tightens the small diameter portion 12 in a state where the tightening portion 201 falls into the bottom of the groove 15. Even if a force in the lateral direction (longitudinal direction of the rod-shaped conductor 10) is applied to the spiral spring 20, the winding of the tightening portion 201 comes into contact with the side surface or edge of the groove 15, so that the tightening position of the tightening portion 201 is displaced. Is less likely to occur.

Thus, according to the probe 1A according to the present embodiment, by engaging the groove 15 formed in the rod-shaped conductor 10 and the tightening portion 201, it is difficult to cause displacement of the tightening position of the tightening portion 201. it can. If the tightening position of the tightening portion 201 is difficult to be displaced, for example, in the probe device shown in FIG. 5, the variation in the length of the closely wound portion 21 protruding from the guide hole 36 can be suppressed. Pressure can be stabilized.

FIG. 7 is a view showing a modification of the probe 1A according to the second embodiment.
In the probe 1 </ b> A shown in FIG. 7, the groove 16 that engages with the tightening portion 202 at the end of the spiral spring 10 is formed in the small diameter portion 11. Also in this case, the displacement of the tightening position of the tightening portion 202 can be suppressed as described above.
Further, in the probe 1A shown in FIG. 7, the tightening portion 202 closest to the insertion side of the small diameter portion 11 engages with the groove 16, so that in the process of inserting the small diameter portion 11 into the spiral spring 20, another tightening portion is a groove. 16 can be prevented from engaging. This facilitates assembly.

<Third Embodiment>
Next, a probe according to a third embodiment of the present invention will be described.
FIG. 8 is a diagram illustrating an example of a probe 1B according to the third embodiment.
FIG. 9 is a diagram illustrating the inside of the spiral spring 20 cut in the axial direction in FIG. 8.
FIG. 10 is an enlarged view of a part of the spiral spring 20 in FIG.

The probe 1B shown in FIGS. 8 to 10 is different from the probe 1 shown in FIGS. 1 to 3 in the following points.

First, the spiral spring 20 of the probe 1B shown in FIG. 8 to FIG. 10 has a pitch winding portion 24 extending at the end of the close winding portion 22 (the end opposite to the spring portion 23). In the pitch winding part 24, the conducting wire is wound at a constant interval.

Further, in the rod-shaped conductor 10 of the probe 1B shown in FIGS. 8 to 10, a spiral protrusion 17 that is screwed with the pitch winding portion 24 is formed in the small diameter portion 12.

In addition, in the probe 1B shown in FIGS. 8 to 10, the tightening portion 201 in the middle of the closely wound portion 22 is omitted.

When assembling the probe 1B shown in FIGS. 8 to 10, first, the small diameter portion 12 is inserted from the end of the pitch winding portion 24 of the spiral spring 20. Once the pitch winding portion 24 is inserted until the end of the pitch winding portion 24 comes into contact with the ridge 17, the spiral spring 20 is then rotated. When the spiral spring 20 is rotated, the winding of the pitch winding portion 24 advances along the protrusion 17 while rotating around the small diameter portion 12.

Even if the winding of the pitch winding portion 24 reaches the step 14, if the spiral spring 20 is further rotated, the end portion of the pitch winding portion 24 is compressed and an elastic force is generated in the direction of pushing back the spiral spring 20. Due to this elastic force, the winding of the pitch winding portion 24 is strongly meshed with the ridge 17 and is firmly fixed to the small diameter portion 12.

Thus, in this embodiment, the end of the spiral spring 20 can be stably fixed at a predetermined position of the small diameter portion 12 by the structure in which the pitch winding portion 24 and the protrusion 17 are screwed together.
In addition, since the step 14 is provided so as to stop the progress of the winding by coming into contact with the winding of the pitch winding portion 24 proceeding along the ridge 17, the engagement between the winding and the ridge 17 becomes strong, The above fixation can be further stabilized.

Furthermore, as shown in FIG. 11, the fixing can be further stabilized by providing the groove 16 that engages with the tightening portion 202.

As mentioned above, although several embodiment of this invention was described, this invention is not limited only to embodiment mentioned above, Various modifications are included.

In the above-described embodiment, the taper portion 203 is provided at the tip of the densely wound portion 21 to increase the contact pressure with the electrode. With regard to this portion, for example, as shown in FIG. 12, a straight portion 204 having a constant winding diameter may be provided between the end portion in contact with the electrode and the tapered portion 203. Thereby, the front-end | tip of the closely wound part 21 can be supported now by the small diameter hole which penetrates only the straight part 204. FIG.
For example, in the probe device shown in FIG. 13, the diameter of the guide hole 36 into which the tip of the densely wound portion 21 is inserted is larger than the diameter of the straight portion 204 and smaller than the diameter of the tapered portion 203. Thereby, the guide hole 36 penetrates only the straight portion 204, and the entire probe 1 can be prevented from jumping out of the guide hole 36.

In the above-described embodiment, the tightening

portions

201 and 202 provided in the densely wound portion 22 fasten the rod-shaped conductor 10 to fix the spiral spring 20 to the rod-shaped conductor 10. May be welded to the rod-shaped conductor 10. Thereby, said fixation can be further strengthened.

In the above-described embodiment, the tightening

portions

201 and 202 are provided in the tightly wound portion 22, but the tightly wound portion 22 may be omitted and a tightening portion may be provided at the end of the spring portion 23.

In the above-described embodiment, one or two fastening portions are provided, but more fastening portions may be provided.

DESCRIPTION OF

SYMBOLS

1,1A, 1B ... Probe, 10 ... Rod-shaped conductor, 11, 12 ... Small diameter part, 13 ... Large diameter part, 14 ... Level difference, 15, 16 ... Groove, 17 ... Projection, 101, 102 ... Taper, 20 ... Spiral Shape springs, 21, 22 ... closely wound portions, 23 ... spring portions, 24 ... pitch winding portions, 201, 202 ... tightening portions, 203 ... taper portions, 204 ... straight portions, 30 ... multilayer substrates, 31, 32, 39 ... Electrode 33 ... Upper plate 34 ... Spacer 35 ...

Lower plate

36, 37 ... Guide hole 38 ... Wafer 3 ... Plating 4 ... Resist

Claims

A spiral spring formed by winding a conducting wire;
A rod-shaped conductor inserted inside the spiral spring;
Have
The spiral spring is
A tightening portion for tightening the rod-shaped conductor;
The conductive wire is densely wound, and a first densely wound portion that contacts the electrode at the end;
A spring portion that expands and contracts between the tightening portion and the first closely wound portion;
Have
When the spring portion is not expanded or contracted, a tip end portion of the rod-shaped conductor is located inside the first densely wound portion.
probe.
The rod-shaped conductor has a tapered slope that contacts the inner surface of the first densely wound portion at the tip.
The probe according to claim 1.
The first densely wound portion has a tapered portion whose winding diameter becomes narrower toward an end portion in contact with the electrode.
The probe according to claim 2.
The first densely wound portion has a straight portion having a constant winding diameter between an end portion in contact with the electrode and the tapered portion.
The probe according to claim 3.
A second densely wound portion extending at an end of the spring portion opposite to the first densely wound portion;
The winding of at least a part of the second densely wound portion is interposed between the tightening portion and the spring portion,
The probe according to claim 3 or 4.
The tightening part is
At least one first tightening portion formed in the middle of the second densely wound portion;
A second tightening portion formed at an end of the second densely wound portion opposite to the spring portion;
Having
The probe according to claim 5.
The rod-shaped conductor has a groove that engages with the tightening portion.
The probe according to claim 5.
The rod-shaped conductor is
A first groove engaged with the first clamping part, and / or
Having a second groove engaging with the second tightening portion;
The probe according to claim 6.
The spiral spring has a pitch winding portion that extends to an end of the second dense winding portion on the opposite side to the spring portion, and the conductive wire is wound at a constant interval.
The rod-shaped conductor has a spiral protrusion that is screwed with the pitch winding portion.
The probe according to claim 5.
The rod-shaped conductor has a step that abuts against the end of the spiral spring opposite to the end of the first densely wound portion that contacts the electrode.
The probe according to claim 5.
The rod-shaped conductor is
A rod portion inserted into the helical spring;
A plating part in which a predetermined metal is plated on the bar part,
The step is formed by an edge of the plated portion;
The probe according to claim 10.
At least a portion of the second densely wound portion is welded to the rod-shaped conductor;
The probe according to claim 5.
A plurality of probes whose ends are in contact with the electrodes,
A first insulating plate having a hole through which the tip of one end of the probe passes;
A second insulating plate having a hole through which the tip of the other end of the probe passes;
A spacer for supporting the first insulating plate and the second insulating plate;
Have
The probe is
A spiral spring formed by winding a conducting wire;
A rod-shaped conductor inserted inside the spiral spring;
Have
The spiral spring is
A tightening portion for tightening the rod-shaped conductor;
The conductive wire is densely wound, and a first densely wound portion that contacts the electrode at the end;
A spring portion that expands and contracts between the tightening portion and the first closely wound portion;
Have
When the spring portion is not expanded or contracted, a tip end portion of the rod-shaped conductor is located inside the first densely wound portion.
Probe device.