WO2010082300A1

WO2010082300A1 - Transfer device

Info

Publication number: WO2010082300A1
Application number: PCT/JP2009/050315
Authority: WO
Inventors: 哲也今井; 藤原睦巳; 圭亮太田
Original assignee: パイオニア株式会社
Priority date: 2009-01-13
Filing date: 2009-01-13
Publication date: 2010-07-22
Also published as: JPWO2010082300A1

Abstract

A transfer device is provided with a support mechanism driving means for moving a support mechanism for supporting a transferred body and an irradiation means for irradiating an energy beam toward the surface of the transferred body. In the device, one of the light irradiation means or the support mechanism driving means is made movable toward a use position according to the progress of a pattern transfer process.

Description

Transfer device

The present invention relates to a transfer device for transferring a concavo-convex pattern to a transfer target.

Currently, for example, an apparatus as shown in FIG. 1 of Patent Document 1 has been proposed as a transfer apparatus that transfers a fine concavo-convex pattern onto a disk-shaped recording medium substrate using an optical imprint method. In the conventional transfer apparatus as described above, for each process, for example, an auxiliary apparatus for alignment of the mold and the substrate, an auxiliary apparatus for light irradiation must be provided, and the apparatus configuration is increased in size. There arises a problem of increasing complexity. As a result, the cost of the transfer device is increased, and workability and maintenance are deteriorated.
JP 2008-155522 A

SUMMARY An advantage of some aspects of the invention is that it provides a transfer apparatus that does not increase the size of the apparatus and complicate the apparatus configuration.

A transfer device according to a first feature of the present invention is a transfer device that performs a series of transfer processes for transferring a pattern formed on a mold to a transfer target, a support mechanism for supporting the transfer target, and the support A support mechanism driving unit that drives the mechanism in a first direction; an irradiation unit that irradiates an energy beam toward the transfer target; and a moving unit that moves the irradiation unit and / or the support mechanism driving unit. .

A transfer device according to a second aspect of the present invention is a transfer device that performs a series of transfer processes for transferring a pattern formed on a mold to a transfer target, a support mechanism for supporting the transfer target, and the support Support mechanism driving means for driving the mechanism in the first direction, photographing means for alignment of the transferred object and the mold, and moving means for moving the photographing means and / or the supporting mechanism driving means.

A transfer device according to a third aspect of the present invention is a transfer device for transferring a pattern formed on a mold to a transfer target, an irradiation means for irradiating an energy ray toward the transfer target, and the transfer target An imaging unit for alignment of the body and the mold, a moving unit for moving the imaging unit or the irradiation unit, and one of the imaging unit and the irradiation unit is set to a use position according to the progress of the pattern transfer process. Control means for controlling the moving means to be arranged.

The transfer device according to the fourth aspect of the present invention transfers the pattern formed on the first mold to the first surface of the transfer object, and transfers the pattern formed on the second mold to the second surface of the transfer object. A transfer device that performs a series of transfer processes to be transferred to a first support mechanism, a first support mechanism that supports the transfer object, a first support mechanism driving unit that drives the first support mechanism in a first direction, and an energy beam First irradiating means for irradiating the first surface of the transferred body, second irradiating means for irradiating energy rays toward the second surface of the transferred body, the transferred body and the Imaging means for alignment of the first and second molds, a second support mechanism for supporting the transferred object, a second support mechanism driving means for moving the second support mechanism, the imaging means, and the first Transfer the support mechanism driving means or the first irradiation means. A first moving means for moving the second supporting mechanism driving means, a second moving means for moving the second irradiating means, and the photographing means and the first supporting mechanism driving means according to the progress of the pattern transfer process. And controlling one of the first irradiation means to selectively move one of the first irradiation means to the first use position, and moving one of the second support mechanism driving means and the second irradiation means to one of the first irradiation means. Control means for controlling the second moving means so as to selectively move to the second use position.

A transfer device according to a fifth aspect of the present invention is a transfer device that performs a series of transfer processes for transferring a pattern formed on a mold to a transfer target, and has a support mechanism that supports the transfer target in a first direction. One of the support mechanism driving means and the irradiating means is set to the use position. And a movement control means for moving the slide table to be arranged.

A transfer device according to a sixth aspect of the present invention is a transfer device that performs a series of transfer processes for transferring a pattern formed on a mold to a transfer target, and has a support mechanism that supports the transfer target in a first direction. A support mechanism driving means to be driven, a slide table on which an imaging means for alignment of the transferred object and the mold is respectively installed, and one of the support mechanism driving means and the imaging means is arranged at a use position And a movement control means for moving the slide table to allow the device station to be provided.

A transfer device according to a seventh aspect of the present invention is a transfer device for performing a series of transfer processes for transferring a pattern formed on a mold to a transfer target, and an imaging unit for alignment of the transfer target and the mold , And a slide table on which irradiation means for irradiating an energy beam toward the transfer object is installed, and the slide table is moved so that one of the photographing means and the irradiation means is placed at a use position. And a device station comprising movement control means.

It is a figure which shows schematic structure of the imprint apparatus which concerns on this invention. It is a figure which shows schematic structure of the upper device station 90a seen from the upper surface. It is a figure which shows schematic structure of the upper device station 90a seen from the side surface. It is a figure which shows schematic structure of the lower device station 90b seen from the upper surface. It is a figure which shows schematic structure of the lower device station 90b seen from the side surface. It is a top view which shows the other structure of the upper device station 90a. It is a side view which shows the other structure of the upper device station 90a. It is a figure which shows an example of the manufacturing process of a double-sided magnetic disc.

On a stage on which a support mechanism driving means for moving a support mechanism for supporting the transfer object and the mold at the same reference position and a light irradiation means for irradiating light for curing the surface of the substrate are placed on the stage. The installation position of the light irradiating means and the support mechanism driving means with respect to can be moved.

Embodiments according to the present invention will be described below with reference to the drawings. In addition, the illustration in the following description does not limit this invention.

FIG. 1 is a view showing a schematic cross-sectional structure of a UV (Ultraviolet) type imprint apparatus according to the present invention.

This imprint apparatus uses the upper mold 503a and the lower mold 503b on which the concavo-convex pattern to be transferred is formed to perform pattern transfer on both sides of the substrate 6 as a transfer target to be transferred. Is. In this specification, the transfer target is referred to as a substrate. Here, the substrate refers to a configuration including a layer to be transferred. The support mechanism refers to a center pin. On both surfaces of the substrate 6, an upper transfer layer 604a and a lower transfer layer 604b made of a transfer material that is cured when irradiated with ultraviolet rays are formed. In FIG. 1, the configuration of the imprint apparatus is shown in a state in which the substrate 6, the upper mold 503a, and the lower mold 503b are installed.

The imprint apparatus shown in FIG. 1 includes an upper mechanism unit, a lower mechanism unit, a controller 200 that controls the upper mechanism unit and the lower mechanism unit, and an operation unit 201.

The upper mechanism unit includes an upper center pin 30a, a camera unit 40, an upper device station 90a, an upper mold XY stage 500a, an upper mold holding unit 501a, an upper stage 505a, an upper center pin driving unit 507a, and an upper UV irradiation unit 508a. . In the present embodiment, the upper center pin 30a and the upper center pin drive unit 507a are integrally formed in order to photograph a tip portion of a lower center pin 30b described later. That is, the upper center pin 30a is also moved by the movement of the upper center pin driving unit 507a.

The board-like upper stage 505a has a screw hole portion in which a screw groove into which a ball screw 512 (to be described later) is screwed is formed, along with an opening portion 100a as shown in FIG.

An upper mold XY stage 500a having an opening continuous with the opening 100a is installed on the lower surface of the upper stage 505a. On the upper mold XY stage 500a, an upper mold holding part 501a made of a transparent material is installed so as to cover the opening. Upper mold XY stage 500a is according to the supplied upper XY stage movement signal XY _U from the controller 200, the upper mold holding portion 501a, it is moved in the direction of the two-dimensional with respect to the lower surface of the upper stage 505a. The upper mold holding part 501a includes a mold holding surface (a surface with which the upper mold 503a is in contact in FIG. 1) for holding the upper mold 503a. A through hole is provided in the center of the upper mold holding part 501a so that the upper center pin 30a can be moved up and down in a direction perpendicular to the mold holding surface of the upper mold holding part 501a.

The upper mold holding unit 501a, in accordance with the upper mold holding signal MH _U supplied from the controller 200, for example, by vacuum suction, and holds the upper mold 503a on the mold holding surface. The method of holding the upper mold 503a on the mold holding surface is not limited to vacuum suction and may be held by a mechanical method.

An upper device station 90a is installed on the upper surface of the upper stage 505a. The upper device station 90a, the camera unit 40, among the upper center pin drive unit 507a and the upper UV irradiation unit 508a, the center position of the opening 100a of one of the units by the supplied unit designation signal US _U from the controller 200 Move to. The upper device station 90a moves the installation position of the unit selected above by the distance of the unit position adjustment signal UP _U supplied from the controller 200.

FIG. 2A is a diagram illustrating a schematic configuration of the upper device station 90a viewed from the top surface, and FIG. 2B is a diagram illustrating a schematic configuration of the upper device station 90a viewed from the side surface.

As shown in FIGS. 2A and 2B, the upper device station 90a moves the slide table 901a and the slide table 901a on which the camera unit 40, the upper center pin driving unit 507a, and the upper UV irradiation unit 508a are installed. And a guide rail 902a. As shown in FIG. 2A, the guide rail 902a includes two rails arranged in parallel with each other across the region of the opening 100a of the upper stage 505a. As shown in FIG. 2B, the slide table 901a is provided with an opening at a position where each unit is to be arranged. Slide table 901a in response to the supplied unit designation signal US _U from the controller 200, only the specified unit (camera unit 40, the upper center pin drive unit 507a or the upper UV irradiation unit 508a) is in the center of the opening 100a It moves along the guide rail 902a so as to be arranged.

That is, the upper device station 90a selectively uses one of the camera unit 40, the upper center pin driving unit 507a, and the upper UV irradiation unit 508a at the use position, that is, the center position of the substrate 6 arrangement position on the upper stage 505a. It is transferred to the upper part. Here, the use position refers to a position where the camera unit 40, the upper center pin drive unit 507a, and the upper UV irradiation unit 508a are used by performing their functions in the imprint process. Therefore, the use positions of the camera unit 40, the upper center pin driving unit 507a, and the upper UV irradiation unit 508a may be the same or different.

The camera unit 40 has

cameras

40 ₁ , 40 ₂ and 40 ₃ for photographing the alignment marks formed on the molds (503a, 503b), and a camera 40 ₄ for photographing the tip of the lower center pin 30b. Is provided. Each of the

cameras

40 ₁ , 40 _2, and 40 ₃ is installed with its photographing lens oriented perpendicularly to the surface of the upper mold holding unit 501a through the opening of the slide table 901a. Further, the camera 40 _4, the photographing lens through the opening in the slide table 901a, are disposed in a state directed perpendicularly to the distal end portion of the lower center pin 30b. Each of the

cameras

40 ₁ , 40 ₂ , and 40 ₃ controls the imaging signals PD ₁ , PD ₂ , and PD ₃ obtained by imaging the upper mold 503a and the lower mold 503b from the respective positions. 200. The camera 40 ₄ supplies the controller 200 with a photographing signal PD ₄ obtained by photographing the tip of the lower center pin 30b.

The upper UV irradiation unit 508a applies ultraviolet rays to cure the transfer material in accordance with the ultraviolet irradiation signal UV supplied from the controller 200, the opening of the slide table 901a, the opening 100a of the upper stage 505a, and the upper mold holding unit 501a. Then, the light is irradiated toward the upper transfer layer 604a of the substrate 6.

Upper center pin drive unit 507a in accordance with the upper center pin movement signal CG _U supplied from the controller 200, the upper center pin 30a, is moved to the upper or lower side in the direction of its central axis. The upper center pin 30a supports the vicinity of the center hole of the substrate 6 through the center hole of the upper mold 503a by moving downward. Furthermore, the board | substrate 6 is hold | maintained by supporting the center hole vicinity of the board | substrate 6 with the lower side center pin 30b mentioned later. The upper center pin drive unit 507a may be provided with a mechanism for rotating the upper center pin 30a.

The lower mechanism part of the imprint apparatus includes a lower center pin 30b, a lower device station 90b, a lower mold XY stage 500b, a lower mold holding part 501b, a lower stage 505b, a lower center pin drive unit 507b, a lower part A side UV irradiation unit 508b, a stage vertical drive unit 511, and a ball screw 512 are provided.

The board-like lower stage 505b has a through hole through which the ball screw 512 passes, together with the opening 100b as shown in FIG. One end of the ball screw 512 passes through the through hole of the lower stage 505b so that the lower stage 505b and the upper stage 505a are maintained in a parallel state, and the other end is threaded in the upper stage 505a. It is screwed into the part.

A lower mold XY stage 500b having an opening larger than the opening 100b is installed on the upper surface of the lower stage 505b. On the lower mold XY stage 500b, a lower mold holding part 501b made of a transparent material is installed so as to cover the opening. The lower mold XY stage 500b moves the lower mold holding portion 501b in each of two-dimensional directions with respect to the lower surface of the lower stage 505b in accordance with the lower XY stage movement signal XY _L supplied from the controller 200. The lower mold holding part 501b includes a mold holding surface (a surface with which the lower mold 503b is in contact in FIG. 1) for holding the lower mold 503b. In addition, a through-hole for supporting the lower center pin 30b in a vertically movable state in a direction perpendicular to the mold holding surface of the lower mold holding portion 501b is formed at the center of the lower mold holding portion 501b. Is provided.

Lower mold holding portion 501b in accordance with the lower mold holding signal MH _L supplied from the controller 200, for example, to hold the lower mold 503b to the mold holding surface by vacuum suction. The method of holding the lower mold 503b on the mold holding surface is not limited to vacuum suction and may be held by a mechanical method.

The lower UV irradiation unit 508b transmits ultraviolet light to be cured on the transfer material in accordance with the ultraviolet irradiation signal UV supplied from the controller 200 via the opening 100a and the upper mold holding unit 501b. Irradiation is performed toward the transfer layer 604b.

Lower center pin drive unit 507b in accordance with the lower center pin moving signal CG _L supplied from the controller 200, a lower center pin 30b, a direction perpendicular to the mold holding surface of the lower mold holding portion 501b That is, the upper center pin 30b is moved upward or downward in the central axis direction. The lower center pin drive unit 507b may be provided with a mechanism for rotating the lower center pin 30b.

A stage vertical drive unit 511 and a lower device station 90b are provided on the lower surface of the lower stage 505b.

The stage vertical drive unit 511 maintains the upper stage 505a parallel to the lower stage 505b by rotating the ball screw 512 clockwise or counterclockwise according to the stage drive signal SG supplied from the controller 200. Move it up or down. That is, the upward movement of the upper stage 505a causes the upper mold holding part 501a to move away from the lower mold holding part 501b in a direction perpendicular to the mold holding surface of the lower mold holding part 501b. . On the other hand, the upper mold holding part 501a moves toward the lower mold holding part 501b by the downward movement of the upper stage 505a.

Lower device station 90b is within the lower center pin drive unit 507b and the lower UV irradiation unit 508b, any one of the units by the supplied unit designation signal US _L from the controller 200 to the center position of the opening 100b Move. The lower device station 90b moves the installation position of the unit selected above by the distance of the unit position adjustment signal UP _L supplied from the controller 200.

FIG. 3A is a diagram showing a schematic configuration of the lower device station 90b viewed from the top surface, and FIG. 3B is a diagram showing a schematic configuration of the lower device station 90b viewed from the side surface.

As shown in FIGS. 3A and 3B, the lower device station 90b moves the slide table 901b on which the lower center pin driving unit 507b and the lower UV irradiation unit 508b are installed, and the slide table 901b. Guide rail 902b. As shown in FIG. 3A, the guide rail 902b is composed of two rails arranged in parallel with each other across the region of the opening 100b of the lower stage 505b. Further, as shown in FIG. 3B, the slide table 901b is provided with an opening at a position where each unit is to be arranged. Slide table 901b, in response to the supplied units specified signal US _L from the controller 200, located only specified unit (lower center pin drive unit 507b or the lower UV irradiation unit 508b) is in the center position of the opening 100b As shown, it moves along the guide rail 902b.

That is, the lower device station 90b selectively uses one of the lower center pin drive unit 507b and the lower UV irradiation unit 508b at the use position, that is, the center position of the substrate 6 arrangement position on the lower stage 505b. It is transported.

The lower UV irradiation unit 508b generates ultraviolet rays for curing the transfer material in accordance with the ultraviolet irradiation signal UV supplied from the controller 200, the opening of the slide table 901b, the opening 100b of the lower stage 505b, and the lower mold. Irradiation is performed toward the lower transfer layer 604b of the substrate 6 through the holding portion 501b.

Lower center pin drive unit 507b in accordance with the lower center pin moving signal CG _L supplied from the controller 200, a lower center pin 30b, is moved to the upper or lower side in the direction of its central axis. The lower center pin 30b is formed with a first support portion TB1 that supports the upper mold 503a or the lower mold 503b and a second support portion TB2 that supports the substrate 6, respectively.

The operation unit 201 accepts various operation commands instructed by the user to operate the imprint apparatus, and supplies an operation command signal indicating the operation command to the controller 200. The controller 200 generates various control signals for controlling the imprint apparatus by executing a processing program corresponding to the operation indicated by the operation command signal supplied from the operation unit 201.

Here, when the operation unit 201 receives an imprint execution command from the user, the controller 200 executes an imprint processing program.

The pattern transfer operation performed by executing the nanoimprint processing program will be described below.

As shown in FIG. 1, when the substrate 6, the upper mold 503a, and the lower mold 503b are mounted on the imprint apparatus, the controller 200 first aligns each of the substrate 6, the upper mold 503a, and the lower mold 503b. (Hereinafter referred to as alignment). The controller 200 first supplies a unit designation signal US _U that specifies the camera unit 40 to the upper device station 90a. Thereby, the slide table 901a of the upper device station 90a moves along the guide rail 902a so as to arrange the camera unit 40 at the center position of the opening 100a. Here, the controller 200 determines the relative positions of the substrate 6, the upper mold 503a, and the lower mold 503b based on the imaging signals PD ₁ to PD ₄ obtained by imaging with the cameras 40 ₁ to 40 ₄ of the camera unit 40. The relationship is detected, and the upper mold XY stage 500a and / or the lower mold XY stage 500b is controlled so that this becomes a predetermined relative positional relationship.

After the alignment, the controller 200 supplies a stage drive signal SG for moving the upper stage 505a downward to the stage vertical drive unit 511 so as to press the upper mold 503a and the lower mold 503b against the substrate 6. Thereby, both surfaces of the substrate 6 are pressed by the upper mold 503a and the lower mold 503b, and the state is maintained. That is, the concavo-convex pattern formed on the upper mold 503a is pressed against the upper transfer layer 604a, and the concavo-convex pattern formed on the lower mold 503b is pressed against the lower transfer layer 604b. Since the upper transfer layer 604a and the lower transfer layer 604b are in a liquid state (flowable state), the upper transfer layer 604a is deformed along the uneven pattern shape formed on the upper mold 503a, and the lower transfer layer 604b is Each deforms along the uneven pattern shape formed in the lower mold 503b.

Thereafter, the controller 200, in order to cure the upper transfer layer 604a and a lower transfer layer 604b each substrate 6, firstly, to supply the unit designation signal US _U that specifies the upper UV irradiation unit 508a on the upper device station 90a, supplying unit designation signal US _L specifying the lower UV irradiation unit 508b to the lower device station 90b. Thereby, the slide table 901a of the upper device station 90a moves along the guide rail 902a so as to place the upper UV irradiation unit 508a at the center position of the opening 100a instead of the camera unit 40. Further, the slide table 901b of the lower device station 90b moves along the guide rail 902b in order to place the lower UV irradiation unit 508b at the center position of the opening 100b instead of the lower center pin driving unit 507b. Then, the controller 200 supplies the ultraviolet irradiation signal UV to the upper UV irradiation unit 508a and the lower UV irradiation unit 508b. Then, the upper UV irradiation unit 508a irradiates the upper transfer layer 604a of the substrate 6 with ultraviolet rays that should cure the transfer layer material, and the lower UV irradiation unit 508b transfers lower ultraviolet rays that should cure the transfer layer material. Irradiation is performed toward the layer 604b. Thereby, the transfer layers of the upper transfer layer 604a and the lower transfer layer 604b are cured, and the uneven pattern on the surfaces of the upper transfer layer 604a and the lower transfer layer 604b is determined.

Next, the controller 200, in order to release the substrate 6 from the upper mold 503a and the lower mold 503b, first, supplies the unit designation signal US _U that specifies the upper center pin drive unit 507a to the upper device station 90a, supplying unit designation signal US _L specifying the lower center pin drive unit 507b to the lower device station 90b. Thereby, the slide table 901a of the upper device station 90a moves along the guide rail 902a so as to place the upper center pin driving unit 507a at the center position of the opening 100a instead of the upper UV irradiation unit 508a. Further, the slide table 901b of the lower device station 90b moves along the guide rail 902b so as to place the lower center pin driving unit 507b at the center of the opening 100b instead of the lower UV irradiation unit 508b. Next, the controller 200, the lower should supplies upper center pin moving signal CG _U to move the upper center pin 30a in a downward direction to the upper center pin drive unit 507a, move the lower center pin 30b upward supplying side center pin movement signal CG _L below the center pin drive unit 507b. Then, the substrate 6 moves upward together with the lower center pin 30b, and the upper end portions of the upper center pin 30a and the lower center pin 30b are joined to each other. Thereby, the upper mold 503a is released from the upper transfer layer 604a of the substrate 6, and the substrate 6 is released from the lower mold 503b.

As described above, the imprint apparatus shown in FIG. 1 includes the above-described various mechanical components (501a, 501b, 505a, 505b, 511, 512) responsible for the operation for pressing the mold (503a, 503b) against the substrate 6. Various auxiliary devices for mounting the alignment, curing the transfer layer, and releasing the substrate / mold are mounted. That is, the camera unit 40 used for performing the alignment as described above, the upper center pin driving unit 507a used for releasing the mold (503a, 503b) from the substrate 6, and the upper transfer layer 604a are cured. An upper UV irradiation unit 508a that emits power ultraviolet light is provided on the upper stage 505a. Further, a lower center pin driving unit 507b that drives the lower center pin 30b that supports the substrate 6 and the lower mold 503b, and a lower UV irradiation unit 508b that emits ultraviolet light to cure the lower transfer layer 604b. Are provided on the lower stage 505b. At this time, the camera unit 40, the upper center pin driving unit 507a, and the upper UV irradiation unit 508a as the auxiliary devices as described above are placed on a slide table 901a that moves along the guide rail 902a as shown in FIGS. 2A and 2B. Each is arranged. Slide table 901a, the center of one unit (camera unit 40, the upper center pin drive unit 507a or the upper UV irradiation unit 508a) only the upper stage 505a opening 100a indicated by the supplied unit designation signal US _U from the controller 200 It moves along the guide rail 902a so that it may be located in. Further, as shown in FIGS. 3A and 3B, the lower center pin drive unit 507b and the lower UV irradiation unit 508b as auxiliary devices are respectively arranged on a slide table 901b that moves along the guide rail 902b. Slide table 901b, in response to the supplied units specified signal US _L from the controller 200, only one unit represented by the unit designation signal US _L (lower center pin drive unit 507b or the lower UV irradiation unit 508b) is It moves along the guide rail 902b so as to be arranged at the center of the opening 100b.

Therefore, according to such a configuration, the irradiation units (508a, 508b) that emit light for curing the transfer layer and various adjustment auxiliary devices (camera unit 40, upper center pin drive unit 507a, lower center pin drive unit 507b), respectively. It is possible to install one of the two at the optimum position (the center position of the

openings

100a and 100b) during use.

As a result, when the transfer layer is cured, the irradiation units (508a, 508b) can be moved to a position where the light for curing the transfer layer can be uniformly irradiated over the entire surface of the substrate 6. . Therefore, even if various auxiliary devices (40, 507a, 507b) are mounted on the stage (505a, 505b) together with the irradiation units (508a, 508b), the irradiation units (508a, 508b) are disposed on the entire surface of the substrate 6. It is possible to irradiate light for curing the transfer layer uniformly.

In the upper device station 90a shown in FIGS. 2A and 2B, the camera unit 40, the upper UV irradiation unit 508a, and the upper center pin drive unit 507a are all installed on one slide table 901a. Each unit (40, 507a, 508a) may be installed on the slide table.

4A and 4B are diagrams showing another configuration of the upper device station 90a made in view of such points. 4A is a diagram showing another configuration of the upper device station 90a viewed from the upper surface side, and FIG. 4B is a diagram viewed from the side surface side.

The upper device station 90a shown in FIGS. 4A and 4B, the slide table 901 ₁ camera unit 40 is mounted, the slide table 901 ₂ the upper center pin drive unit 507a is installed, and the upper UV irradiation unit 508a is installed comprising a slide table 901 ₃ individually. At this time, the slide tables 901 ₁ and 901 ₃ have two guide rails 902 ₁ arranged in parallel with each other across the region of the opening 100a of the upper stage 505a (the region surrounded by the wavy line). Move individually along the line. On the other hand, the slide table 901 ₂ is arranged in parallel with each other across the region of the opening 100a and moves along the _two guide rails 902 ₂ orthogonal to the guide rail 902 ₁ . Moving Here, the unit designation signal US _U that specifies the upper center pin drive unit 507a from the controller 200 is supplied, only the slide table 901 ₂ of the slide table ₉₀₁ 1-901 ₃ along the guide rail 902 ₂ Then, the upper center pin drive unit 507a is disposed at the center of the opening 100a. Further, the unit designation signal US _U that specifies the camera unit 40 from the controller 200 is supplied, only the slide table 901 _one of the slide table ₉₀₁ 1-901 ₃ is moved along the guide rails 902 _1, the camera unit 40 is arranged at the center of the opening 100a. When the unit designation signal US _U for designating the upper UV irradiation unit 508a is supplied from the controller 200, only the slide table 901 ₃ among the slide tables 901 ₁ to 901 ₃ moves along the guide rail 902 ₁ , The upper UV irradiation unit 508a is disposed at the center of the opening 100a.

Here, the imprint operation by the imprint apparatus shown in FIG. 1 can be applied to a manufacturing process of a magnetic recording medium such as a discrete track medium or a bit patterned medium. Hereinafter, a method of manufacturing a magnetic disk including the above-described imprint operation will be described with reference to FIG.

First, an upper mold 503a and a lower mold 503b having a desired concavo-convex pattern on the surface of a base material made of a material such as glass that transmits ultraviolet rays are prepared. The concavo-convex pattern is formed by forming a resist pattern on a substrate using, for example, an electron beam drawing apparatus, and then performing a dry etching process or the like using the resist pattern as a mask.

The finished upper mold 503a and lower mold 503b are subjected to a surface treatment with a silane coupling agent or the like in order to improve releasability. Note that a substrate made of a material that transmits ultraviolet rays, such as glass replicated by an imprint method or the like, may be used as a transfer mold using the upper mold 503a and the lower mold 503b as masters. Furthermore, a substrate made of a material that transmits ultraviolet rays, such as glass duplicated by an imprint method or the like from the duplication disk produced by the above method, may be used as a transfer mold. If a duplicate transfer mold is used, the master and / or the base material of the duplicate disk is, for example, ultraviolet rays such as nickel (including alloys) duplicated by a method such as silicon or electroforming. A material that does not transmit can be used.

Next, a magnetic disk media substrate (hereinafter referred to as a media substrate) 600 is manufactured. The media substrate 600 has, for example, an upper side on one side (upper side) and the other side (lower side) of a disc-shaped support substrate 601 made of specially processed chemically strengthened glass, silicon wafer, aluminum substrate, or the like. A plurality of layers including the transfer layer 604a and the lower transfer layer 604b are laminated as follows. That is, as shown in FIG. 5A, on the upper surface of the support substrate 601, there is an upper nonmagnetic layer 602a made of a nonmagnetic material, an upper metal layer 603a made of a metal material such as Ta or Ti, and an upper transfer. A layer 604a is stacked. A lower nonmagnetic layer 602b made of a nonmagnetic material, a lower metal layer 603b made of a metal material such as Ta or Ti, and a lower transfer layer 604b are laminated on the lower surface of the support substrate 601. The upper nonmagnetic layer 602a, the upper metal layer 603a, the lower nonmagnetic layer 602b, and the lower metal layer 603b are formed by a sputtering method or the like.

Next, the concavo-convex pattern formed on the upper mold 503a and the lower mold 503b is transferred to the upper transfer layer 604a and the lower transfer layer 604b formed on the media substrate 600 by the imprint method described above. That is, the upper transfer layer 604a and the lower transfer layer 604b are formed on the media substrate 600 prepared in the above process by spin coating or the like, and the reference positions of the upper mold 503a and the lower mold 503b are aligned with the central axis of the center pin 30b. Then, the media substrate 600 is mounted on the center pin 30b, and the upper mold 503a is placed on the lower mold in the direction of the center axis of the center pin 30b with the reference position aligned with the center axis of the center pin 30b. By moving it toward 503 b, the upper mold 503 a is pressed against one surface of the media substrate 600 and the lower mold 503 b is pressed against the other surface of the media substrate 600. Thereafter, the upper UV irradiation unit 508a irradiates the upper transfer layer 604a of the media substrate 600 with ultraviolet rays to cure the transfer layer, and the lower UV irradiation unit 508b emits ultraviolet rays to cure the transfer layer. When the upper transfer layer 604a and the lower transfer layer 604b are cured by irradiating toward the 604b, the upper mold 503a and the lower mold 503b are released from the media substrate 600, and the media substrate 600 is taken out. Through the above steps, the media substrate 600 is formed with a cross-sectional structure as shown in FIG.

Next, etching is performed on both surfaces of the media substrate 600 having a structure as shown in FIG. As the etching process, first, the remaining film of the upper transfer layer 604a remains in the portion corresponding to the convex portion of the upper mold 503a, and the residual film of the lower transfer layer 604b remains in the portion corresponding to the convex portion of the lower mold 503b. The remaining film is removed by oxygen reactive ion etching (RIE) or the like. Next, the upper metal layer 603a and the lower metal layer 603b are etched and patterned by dry etching using the upper transfer layer 604a and the lower transfer layer 604b patterned by the imprint process as a mask. By this etching process, as shown in FIG. 5B, the recesses in the concavo-convex patterns of the upper resist layer 604a and the lower resist layer 604b and the recesses in the upper metal layer 603a and the lower metal layer 603b are formed. Corresponding portions are removed, and a pattern is formed on each of the upper metal layer 603a and the lower metal layer 603b (metal mask patterning step).

Next, as shown in FIG. 5C, a transfer layer removal process is performed on both surfaces of the media substrate 600 in the state shown in FIG. 5B by a method such as wet etching or dry ashing. Then, the transfer layer remaining on each of the upper metal layer 603a and the lower metal layer 603b is removed (transfer layer removing process).

Next, the non-magnetic material is etched and patterned by dry etching using the upper metal layer 603a and the lower metal layer 603b as a mask with respect to the media substrate 600 in a state as shown in FIG. Thereby, as shown in FIG. 5D, a pattern is formed on the nonmagnetic material by a predetermined depth with respect to the exposed regions of the upper nonmagnetic layer 602a and the lower nonmagnetic layer 602b (nonmagnetic). Layer patterning process).

Next, the remaining upper metal layer 603a and lower metal layer 603b are removed from both surfaces of the media substrate 600 in a state as shown in FIG. 5D by a method such as a wet etching process or a dry etching process. As a result, as shown in FIG. 5E, the metal layer remaining in each of the upper nonmagnetic layer 602a and the lower nonmagnetic layer 602b is removed (metal mask removing process).

Next, as shown in FIG. 5E, the concave portions of the upper nonmagnetic layer 602a and the lower nonmagnetic layer 602b are filled with a magnetic material (shown in black), and the upper protective layer 605a and the upper lubricating layer are further filled. A layer 606a, a lower protective layer 605b, and a lower lubricating layer 606b are stacked as shown in FIG.

As shown in FIG. 5 (A) to FIG. 5 (F), the imprint apparatus shown in FIG. 1 performs the processes shown in FIGS. A double-sided magnetic disk having a cross-sectional structure as shown in F) is manufactured.

5A to 5F, a method of manufacturing a magnetic disk from a media substrate 600 provided with an upper nonmagnetic layer 602a and a lower nonmagnetic layer 602b as shown in FIG. 5A. As described above, the magnetic disk may be manufactured from the media substrate 600 employing the upper magnetic layer and the lower magnetic layer made of a magnetic material instead of the upper nonmagnetic layer 602a and the lower nonmagnetic layer 602b. At this time, the magnetic material is etched by dry etching using the upper metal layer 603a and the lower metal layer 603b as a mask with respect to the media substrate 600 in the state as shown in FIG. A pattern is formed on the magnetic material by a predetermined depth for each exposed region of the side nonmagnetic layer (magnetic layer patterning step). Then, the magnetic disk is obtained by filling the concave portions of the upper magnetic layer and the lower magnetic layer with a nonmagnetic material.

In this embodiment, the UV imprint method and the imprint apparatus are described. However, the present invention is not limited to this, and thermal imprint, light energy (light other than UV) curing imprint, etc. The present invention can be applied to other types of imprint apparatuses.

Also, it can be used not only for transferring magnetic disks but also for manufacturing various recording media such as optical disks.

Claims

A transfer device that performs a series of transfer processes for transferring a pattern formed on a mold to a transfer target,
A support mechanism for supporting the transfer object;
Support mechanism driving means for driving the support mechanism in the first direction;
Irradiating means for irradiating an energy beam toward the transfer object;
And a moving means for moving the irradiation means and / or the support mechanism driving means.
The apparatus further includes control means for controlling the moving means to selectively place one of the light irradiation means and the support mechanism driving means at a use position in accordance with the progress of the series of transfer processes. The transfer device according to claim 1.
The moving means includes a first stage on which the irradiation means is installed, and a second stage on which the support mechanism driving means is installed,
3. The transfer apparatus according to claim 2, wherein the control unit moves one of the first stage and the second stage to the use position in accordance with the progress of the series of transfer processes.
The irradiation means and the support mechanism driving means are installed on a stage,
The transfer apparatus according to claim 2, wherein the control unit further includes a control unit that moves the stage so that one of the irradiation unit and the support mechanism driving unit is arranged at the use position.
The control means controls the moving means to place the support mechanism driving means at the use position during an alignment operation between the mold and the transferred body, and during a pressing operation that presses the mold against the transferred body. The transfer apparatus according to claim 2, wherein the moving unit is controlled so that the irradiating unit is arranged at the use position.
The transfer apparatus according to claim 2, wherein the use position is a position directly above or directly below the transfer target supported by the support mechanism.
When the support mechanism is driven in the first direction, the control means controls the moving means to place the support mechanism drive means at the use position, and irradiates the energy transfer body with the energy beam. 7. The transfer apparatus according to claim 2, wherein the moving unit is controlled so that the irradiation unit is arranged at the use position.
A transfer device that performs a series of transfer processes for transferring a pattern formed on a mold to a transfer target,
A support mechanism for supporting the transfer object;
Support mechanism driving means for driving the support mechanism in the first direction;
An imaging means for alignment of the transfer object and the mold;
And a moving means for moving the photographing means and / or the support mechanism driving means.
The apparatus further includes control means for controlling the moving means so as to selectively place one of the photographing means and the support mechanism driving means at a use position in accordance with the progress of the series of transfer processes. The transfer device according to claim 8.
The moving means includes a stage on which the photographing means and the support mechanism driving means are installed,
The transfer device according to claim 9, wherein the control unit performs control to move the stage so that one of the photographing unit and the support mechanism driving unit is arranged at the use position.
The control unit controls the moving unit to place the photographing unit at the use position during an alignment operation between the mold and the transfer target, and the support mechanism during a mold release operation of the mold and the transfer target. The transfer device according to claim 9, wherein the moving unit is controlled so that a driving unit is arranged at the use position.
The transfer device according to claim 9, wherein the use position is a position directly above or directly below the transfer target supported by the support mechanism.
The control means controls the moving means to dispose the support mechanism driving means at the use position when the support mechanism is driven in the first direction, and controls the surface of the transfer object and / or the mold. 13. The transfer apparatus according to claim 9 or 12, wherein when the image is photographed, the moving means is controlled so that the photographing means is arranged at the use position.
A transfer device for transferring a pattern formed on a mold to a transfer target,
Irradiating means for irradiating an energy beam toward the transfer object;
An imaging means for alignment of the transfer object and the mold;
Moving means for moving the imaging means or the irradiation means;
And a control unit that controls the moving unit to place one of the photographing unit and the irradiation unit at a use position in accordance with the progress of the pattern transfer process.
The moving means includes a stage on which the photographing means and the irradiation means are installed,
15. The transfer apparatus according to claim 14, wherein the control unit performs control to move the stage so that one of the photographing unit and the irradiation unit is arranged at the use position.
The control means controls the moving means to place the photographing means at the use position during an alignment operation between the mold and the transferred body, and performs the irradiation during a pressing operation for pressing the mold against the transferred body. 15. The transfer apparatus according to claim 14, wherein the moving means is controlled so as to place the means at the use position.
The transfer device according to claim 14, wherein the use position is a position directly above or directly below the transfer target.
The control means controls the moving means to place the irradiation means at the use position when irradiating the transferred body with the energy rays, and images the surface of the transferred body and / or the mold. 18. The transfer device according to claim 14, wherein the moving unit is controlled so that the photographing unit is arranged at the use position.
A transfer device that performs a series of transfer processes for transferring a pattern formed on a first mold to a first surface of a transfer target and transferring a pattern formed on a second mold to a second surface of the transfer target. There,
A first support mechanism for supporting the transfer object from a first direction;
First support mechanism driving means for driving the first support mechanism in a first direction;
First irradiation means for irradiating energy rays toward the first surface of the transfer object;
Second irradiation means for irradiating energy rays toward the second surface of the transfer target;
Photographing means for alignment of the transferred body and the first and second molds;
A second support mechanism for supporting the transfer object from a second direction;
Second support mechanism driving means for moving the second support mechanism;
First moving means for moving the photographing means, the first support mechanism driving means, or the first irradiation means;
The second support mechanism driving means, or the second moving means for moving the second irradiation means,
According to the progress of the pattern transfer process, the first moving unit is controlled to selectively move one of the photographing unit, the first support mechanism driving unit, and the first irradiation unit to the first use position. And a control means for controlling the second moving means so as to selectively move one of the second support mechanism driving means and the second irradiation means to the second use position. apparatus.
A transfer device that performs a series of transfer processes for transferring a pattern formed on a mold to a transfer target,
A slide mechanism on which a support mechanism driving means for driving a support mechanism for supporting the transfer object in a first direction and an irradiation means for irradiating an energy ray toward the transfer object;
A transfer apparatus comprising: a device station including a movement control unit that moves the slide table so that one of the support mechanism driving unit and the irradiation unit is arranged at a use position.
A transfer device that performs a series of transfer processes for transferring a pattern formed on a mold to a transfer target,
A support mechanism driving means for driving a support mechanism for supporting the transfer object in a first direction, and a slide table on which the image pickup means for alignment of the transfer object and the mold are respectively installed;
A transfer apparatus comprising: a device station comprising: a movement control unit that moves the slide table so that one of the support mechanism driving unit and the photographing unit is arranged at a use position.
A transfer device that performs a series of transfer processes for transferring a pattern formed on a mold to a transfer target,
An imaging unit for alignment of the transferred object and the mold, and a slide table on which irradiation means for irradiating energy transferred toward the transferred object are respectively installed;
A transfer apparatus comprising: a device station comprising: a movement control unit that moves the slide table so that one of the photographing unit and the irradiation unit is disposed at a use position.