WO2009115955A1 - Modular oled device - Google Patents
Modular oled device Download PDFInfo
- Publication number
- WO2009115955A1 WO2009115955A1 PCT/IB2009/051033 IB2009051033W WO2009115955A1 WO 2009115955 A1 WO2009115955 A1 WO 2009115955A1 IB 2009051033 W IB2009051033 W IB 2009051033W WO 2009115955 A1 WO2009115955 A1 WO 2009115955A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- set according
- oled devices
- oled
- encapsulated
- transparent
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims description 19
- 239000011521 glass Substances 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 5
- 150000002739 metals Chemical class 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- 229910020923 Sn-O Inorganic materials 0.000 claims description 4
- -1 polyethylene terephthalate Polymers 0.000 claims description 4
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims description 4
- 239000004642 Polyimide Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 2
- 239000004695 Polyether sulfone Substances 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 claims description 2
- 229910052804 chromium Inorganic materials 0.000 claims description 2
- 239000011651 chromium Substances 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims description 2
- 229910052741 iridium Inorganic materials 0.000 claims description 2
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 claims description 2
- 229920006393 polyether sulfone Polymers 0.000 claims description 2
- 239000011112 polyethylene naphthalate Substances 0.000 claims description 2
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 13
- 238000003475 lamination Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000000608 laser ablation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000003086 colorant Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000010329 laser etching Methods 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000010561 standard procedure Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/302—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements characterised by the form or geometrical disposition of the individual elements
- G09F9/3026—Video wall, i.e. stackable semiconductor matrix display modules
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/18—Tiled displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/221—Static displays, e.g. displaying permanent logos
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/90—Assemblies of multiple devices comprising at least one organic light-emitting element
- H10K59/95—Assemblies of multiple devices comprising at least one organic light-emitting element wherein all light-emitting elements are organic, e.g. assembled OLED displays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/81—Anodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
Definitions
- the invention relates to the field of OLED devices, and especially to modular OLED devices.
- OLEDs Organic LEDs
- OLEDs have several attractive features, such as great visual appearance, diffuse distributed light source, extremely thin or even flexible, options for transparency, mirror-like or black when off and almost complete 2D freedom in form. These properties make them ideally suited for signage applications, where luminating letters and graphic symbols of different sizes and colors are used to attract customers.
- This object is achieved by a set of multiple OLED devices and an interface for electrically contacting the OLED devices, wherein each OLED device is separately encapsulated, and wherein the interface is adapted for contacting different types of encapsulated OLED devices.
- the invention allows for composed OLED devices in different sizes and forms by combining multiple smaller OLED devices which are encapsulated, i.e. sealed, by themselves.
- each OLED device of the set is a complete OLED on its own, making it possible to combine these single OLED devices in a customized fashion.
- the present invention is about a composite OLED device consisting of a plurality of OLED segment devices which can be laminated onto a transparent structured interconnect substrate.
- the OLED segment devices which can have the form of glyphs, constitute a set of building blocks.
- an individual substrate structuring e.g. by laser ablation, it is possible to create OLED devices of any desired size and shape.
- the composite OLED device is ready to be laminated on any target substrate, e.g. a glass plate.
- Lamination avoids an expensive standard OLED manufacturing process where only a fraction of the whole substrate area is deposited and new shadow masks are required for each design change.
- the lamination and structuring can be done easily with standard equipment.
- the OLED devices are laminated onto a transparent interconnect substrate, which acts as the interface.
- the transparent interconnect substrate is made from at least one of polyethylene terephthalate, polyethylene naphthalate, polyether sulfone, polyimides, glass, ceramics, metals, semiconductors, or a combination thereof.
- the interconnect substrate layer may serve as an additional protective layer to extend the lifetime of the OLED segment device.
- the transparent interconnect comprises a transparent electrode which is made of at least conductive polymeric materials, transparent conductive oxides and metals, especially indium-tin-oxide, zinc-indium-oxide, aluminum-doped ZnO, Ga- In-Sn-O, SnO2, Zn-In- Sn-O, Ga-ln-0, gold, silver, aluminum, iridium, nickel, chromium, or a combination thereof.
- the transparent interconnect substrate comprises a conductive layer.
- the conductive layer comprises at least two areas separated by a gap for electrically insulating the areas from each other. It is preferred that at least one encapsulated OLED device is placed across the gap. Preferably, multiple encapsulated OLED devices are placed across the gap and these multiple OLED devices are connected in parallel. This ensures the same brightness for all shapes in case a constant voltage is applied.
- Preferred structuring methods are laser ablation and etching. Further preferred methods include printing or lamination of additional electrically conductive layers such as aluminum which can be used for interconnect of individual segments.
- the contacting between carrier substrate and OLED segment device is preferably done via electrical conductive adhesive, ultrasonic welding etc.
- an additional layer of an electrically conducting material is provided as a bus bar.
- a bus bar is an additional layer of a high conducting material, such as aluminum, copper, silver etc.
- the intransparency of the bus bar structure can preferably be used as a decorative feature utilizing the high reflectance and mirror like appearance of small aluminum, copper or silver stripes. Moreover it can be used to hide the segment/carrier substrate contacting.
- the segment devices and optional bus bar elements are preferably laminated onto the structured carrier substrate.
- An additional option is a bus bar patterned onto the target substrate. This can be done using standard techniques. For lamination, preferably a pressure/heat/uv activated adhesive is used.
- the resulting bi- layer device can be directly laminated onto the target substrate, e.g. a glass plate.
- another overlay foil can be used to encapsulate the OLED segments.
- Fig. 1 shows a set of multiple OLED devices and an interface for electrically contacting the OLED devices according to a preferred embodiment of the invention
- Fig. 2 shows an OLED device with its segment stack in more detail in a cross sectional view
- Fig. 3 shows a set comprising multiple OLED devices laminated on a glass plate in a first way
- Fig. 4 shows a set comprising multiple OLED devices laminated on a glass plate in a second way;
- Fig. 5 shows a set with OLED devices in glyph shape
- Fig. 6 shows an embodiment which is modified such that low ohmic metals bars as bus bars are provided
- Fig. 7 shows a cross sectional view of such an arrangement with laminated bus bars
- Fig. 8 shows a further modified embodiment of the invention according to which the anode is structured.
- a set of multiple OLED devices 1 and an interface 2 for electrically contacting the OLED devices 1 according to a preferred embodiment of the invention can be seen.
- the OLED devices 1 are each encapsulated for themselves and then laminated onto the interface 2 which is a made of a structured carrier substrate 3 with a conductive ITO layer 4.
- An OLED device 1 with its segment stack is shown in more detail in Fig.
- this OLED segment stack comprises an upper barrier layer 5, a cathode layer 6, an organic layer 7, an anode layer 8, a lower barrier layer 9 and a transparent, flexible substrate 10, for example polyimide.
- the set comprising the OLED devices 1 can be laminated on a glass plate 11 in different ways: While according to the embodiment shown in Fig. 3, the set is directly laminated onto the glass plate 11 and covered with a PVB foil 12, according to the embodiment shown in Fig. 4, for laminating the set onto the glass plate 11, an interlay er PVB foil 13 is used.
- a set with OLED devices 1 in glyph shape can be seen.
- an anode 14 and a cathode 15 are provided with a gap 16 in between.
- the OLED devices 1 in glyph shape are placed across the gap 16 and electrically connected with the anode 14 and the cathode 15, respectively, with the aid of a contact point 17 contacting the anode 14 and a contact point 18 contacting the cathode 15.
- this embodiment can be modified such that low ohmic metal bars 19 as bus bars are provided for contacting the single OLED devices 1.
- These low ohmic bus bars 19 provide for improved brightness uniformity among the OLED devices 1.
- the bus bars 19 are made of an additional layer of a high conducting material, such as aluminum, copper or silver.
- the intransparency of the bus bars 19 is used as a decorative feature utilizing the high reflectance and mirror like appearance of the small metal stripes. Moreover, it is used to hide the segment/carrier substrate contacting, i.e. contact points 17, 18 which are now invisible. From Fig. 7, a cross sectional view of such an arrangement with laminated bus bars 19 can be seen.
- anode 14 is structured.
- anode 14 is comprised of multiple parallel stripes 20, wherein adjacent stripes 20 are separated and electrically insulated from each other by a gap 21, respectively.
- connecting brackets 22 are used which are clipped onto the structured anode 14. This way, a customized set of OLED devices 1 can be achieved in an easy manner. While the invention has been illustrated and described in detail in the drawings and foregoing description, such illustration and description are to be considered illustrative or exemplary and not restrictive; the invention is not limited to the disclosed embodiments.
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- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The invention relates toa set ofmultiple OLED devices(1)and an interface (2) for electrically contacting the OLED devices (1), wherein each OLED (1) device is separately encapsulated, and wherein the interface(2)is adaptedfor contacting different types of encapsulated OLED devices (1).This way, a possibility for customized OLEDs, also in bigger sizes, in aneasy, convenient and inexpensive way is provided.
Description
Modular OLED device
FIELD OF THE INVENTION
The invention relates to the field of OLED devices, and especially to modular OLED devices.
BACKGROUND OF THE INVENTION
Organic LEDs (OLEDs) have several attractive features, such as great visual appearance, diffuse distributed light source, extremely thin or even flexible, options for transparency, mirror-like or black when off and almost complete 2D freedom in form. These properties make them ideally suited for signage applications, where luminating letters and graphic symbols of different sizes and colors are used to attract customers.
In this application area OLED devices of different size and shapes are required depending on customer requests. However, especially for bigger sizes, manufacturing of such OLED devices is difficult and costly.
SUMMARY OF THE INVENTION
It is an object of the invention to provide a possibility for customized OLEDs, also in bigger sizes, in an easy, convenient and inexpensive way.
This object is achieved by a set of multiple OLED devices and an interface for electrically contacting the OLED devices, wherein each OLED device is separately encapsulated, and wherein the interface is adapted for contacting different types of encapsulated OLED devices.
Accordingly, the invention allows for composed OLED devices in different sizes and forms by combining multiple smaller OLED devices which are encapsulated, i.e. sealed, by themselves. This means that in contrast to prior art devices,
according to the invention, each OLED device of the set is a complete OLED on its own, making it possible to combine these single OLED devices in a customized fashion. This means that the present invention is about a composite OLED device consisting of a plurality of OLED segment devices which can be laminated onto a transparent structured interconnect substrate. The OLED segment devices, which can have the form of glyphs, constitute a set of building blocks. In combination with an individual substrate structuring, e.g. by laser ablation, it is possible to create OLED devices of any desired size and shape. The composite OLED device is ready to be laminated on any target substrate, e.g. a glass plate. Lamination avoids an expensive standard OLED manufacturing process where only a fraction of the whole substrate area is deposited and new shadow masks are required for each design change. The lamination and structuring can be done easily with standard equipment.
According to a preferred embodiment of the invention, the OLED devices are laminated onto a transparent interconnect substrate, which acts as the interface. With respect to this, it is especially preferred that the transparent interconnect substrate is made from at least one of polyethylene terephthalate, polyethylene naphthalate, polyether sulfone, polyimides, glass, ceramics, metals, semiconductors, or a combination thereof. The interconnect substrate layer may serve as an additional protective layer to extend the lifetime of the OLED segment device.
Further, according to a preferred embodiment of the invention, the transparent interconnect comprises a transparent electrode which is made of at least conductive polymeric materials, transparent conductive oxides and metals, especially indium-tin-oxide, zinc-indium-oxide, aluminum-doped ZnO, Ga- In-Sn-O, SnO2, Zn-In- Sn-O, Ga-ln-0, gold, silver, aluminum, iridium, nickel, chromium, or a combination thereof.
Furthermore, according to a preferred embodiment of the invention, the transparent interconnect substrate comprises a conductive layer. With respect to this, it is especially preferred that the conductive layer comprises at least two areas separated by a gap for electrically insulating the areas from each other. It is preferred that at least one encapsulated OLED device is placed across the gap. Preferably, multiple encapsulated
OLED devices are placed across the gap and these multiple OLED devices are connected in parallel. This ensures the same brightness for all shapes in case a constant voltage is applied.
Preferred structuring methods are laser ablation and etching. Further preferred methods include printing or lamination of additional electrically conductive layers such as aluminum which can be used for interconnect of individual segments. The contacting between carrier substrate and OLED segment device is preferably done via electrical conductive adhesive, ultrasonic welding etc.
According to a further preferred embodiment of the invention, an additional layer of an electrically conducting material is provided as a bus bar. Thus, optionally a low ohmic bus bar is used for improved brightness uniformity among the various OLED segments. The bus bar is an additional layer of a high conducting material, such as aluminum, copper, silver etc. The intransparency of the bus bar structure can preferably be used as a decorative feature utilizing the high reflectance and mirror like appearance of small aluminum, copper or silver stripes. Moreover it can be used to hide the segment/carrier substrate contacting.
The segment devices and optional bus bar elements are preferably laminated onto the structured carrier substrate. An additional option is a bus bar patterned onto the target substrate. This can be done using standard techniques. For lamination, preferably a pressure/heat/uv activated adhesive is used. The resulting bi- layer device can be directly laminated onto the target substrate, e.g. a glass plate. Optionally, according to a preferred embodiment of the invention, another overlay foil can be used to encapsulate the OLED segments.
BRIEF DESCRIPTION OF THE DRAWINGS
These and other aspects of the invention will be apparent from and elucidated with reference to the embodiments described hereinafter.
In the drawings:
Fig. 1 shows a set of multiple OLED devices and an interface for
electrically contacting the OLED devices according to a preferred embodiment of the invention; Fig. 2 shows an OLED device with its segment stack in more detail in a cross sectional view; Fig. 3 shows a set comprising multiple OLED devices laminated on a glass plate in a first way; Fig. 4 shows a set comprising multiple OLED devices laminated on a glass plate in a second way;
Fig. 5 shows a set with OLED devices in glyph shape; Fig. 6 shows an embodiment which is modified such that low ohmic metals bars as bus bars are provided; Fig. 7 shows a cross sectional view of such an arrangement with laminated bus bars; and
Fig. 8 shows a further modified embodiment of the invention according to which the anode is structured.
DETAILED DESCRIPTION OF EMBODIMENTS
From Fig. 1 a set of multiple OLED devices 1 and an interface 2 for electrically contacting the OLED devices 1 according to a preferred embodiment of the invention can be seen. According to this preferred embodiment of the invention, the OLED devices 1 are each encapsulated for themselves and then laminated onto the interface 2 which is a made of a structured carrier substrate 3 with a conductive ITO layer 4. An OLED device 1 with its segment stack is shown in more detail in Fig.
2. From top to bottom this OLED segment stack comprises an upper barrier layer 5, a cathode layer 6, an organic layer 7, an anode layer 8, a lower barrier layer 9 and a transparent, flexible substrate 10, for example polyimide.
As can further be seen from Figs. 3 and 4, the set comprising the OLED devices 1 can be laminated on a glass plate 11 in different ways: While according to the embodiment shown in Fig. 3, the set is directly laminated onto the glass plate 11 and
covered with a PVB foil 12, according to the embodiment shown in Fig. 4, for laminating the set onto the glass plate 11, an interlay er PVB foil 13 is used.
Further, from Fig. 5 a set with OLED devices 1 in glyph shape can be seen. According to this preferred embodiment of the invention, an anode 14 and a cathode 15 are provided with a gap 16 in between. The OLED devices 1 in glyph shape are placed across the gap 16 and electrically connected with the anode 14 and the cathode 15, respectively, with the aid of a contact point 17 contacting the anode 14 and a contact point 18 contacting the cathode 15.
As can be seen from Fig. 6, this embodiment can be modified such that low ohmic metal bars 19 as bus bars are provided for contacting the single OLED devices 1. These low ohmic bus bars 19 provide for improved brightness uniformity among the OLED devices 1. The bus bars 19 are made of an additional layer of a high conducting material, such as aluminum, copper or silver. The intransparency of the bus bars 19 is used as a decorative feature utilizing the high reflectance and mirror like appearance of the small metal stripes. Moreover, it is used to hide the segment/carrier substrate contacting, i.e. contact points 17, 18 which are now invisible. From Fig. 7, a cross sectional view of such an arrangement with laminated bus bars 19 can be seen.
Finally, from Fig. 8 a further modified embodiment of the invention can be seen according to which the anode 14 is structured. This means that anode 14 is comprised of multiple parallel stripes 20, wherein adjacent stripes 20 are separated and electrically insulated from each other by a gap 21, respectively. In order to individually connect the respective OLED devices 1 , connecting brackets 22 are used which are clipped onto the structured anode 14. This way, a customized set of OLED devices 1 can be achieved in an easy manner. While the invention has been illustrated and described in detail in the drawings and foregoing description, such illustration and description are to be considered illustrative or exemplary and not restrictive; the invention is not limited to the disclosed embodiments.
Other variations to the disclosed embodiments can be understood and effected by those skilled in the art in practicing the claimed invention, from a study of the drawings, the disclosure, and the appended claims. In the claims, the word "comprising"
does not exclude other elements or steps, and the indefinite article "a" or "an" does not exclude a plurality. The mere fact that certain measures are recited in mutually different dependent claims does not indicate that a combination of these measured cannot be used to advantage. Any reference signs in the claims should not be construed as limiting the scope.
Claims
1. A set of multiple OLED devices (1) and an interface (2) for electrically contacting the OLED devices (1), wherein each OLED device (1) is separately encapsulated, and wherein the interface (2) is adapted for contacting different types of encapsulated OLED devices (1).
2. Set according to claim 1, wherein the OLED devices (1) are laminated onto a transparent interconnect substrate which acts as the interface (2).
3. Set according to claim 2, wherein the transparent interconnect substrate is made from at least one of polyethylene terephthalate, polyethylene naphthalate, polyether sulfone, polyimides, glass, ceramics, metals, semiconductors, and a combination thereof.
4. Set according to claim 2 or 3, wherein the transparent interconnect comprises a transparent electrode which is made of at least conductive polymeric materials, transparent conductive oxides and metals, especially indium-tin-oxide, zinc-indium- oxide, aluminum-doped ZnO, Ga- In-Sn-O, SnO2, Zn-In-Sn-O, Ga-ln-0, gold, silver, aluminum, iridium, nickel, chromium, and a combination thereof.
5. Set according to any of claims 2 to 4, wherein the transparent interconnect substrate comprises a conductive layer (4).
6. Set according to claim 5, wherein the conductive layer (4) comprises at least two areas (14, 15) separated by a gap (16) for electrically insulating the areas (14, 15) from each other.
7. Set according to claim 6, wherein at least one encapsulated OLED device (1) is placed across the gap (16).
8. Set according to claim 7, wherein multiple encapsulated OLED devices (1) are placed across the gap (16) which are connected in parallel.
9. Set according to any of claims 5 to 8, wherein an additional layer of a low ohmic material is provided as a bus bar (19).
10. Set according to any of claims 6 to 8, wherein at least one of the areas (14, 15) is structured.
11. Set according to claim 10, wherein at least one connecting bracket (22) is used for electrically connecting an OLED device (1).
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP08102747.6 | 2008-03-19 | ||
EP08102747 | 2008-03-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009115955A1 true WO2009115955A1 (en) | 2009-09-24 |
Family
ID=40800435
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/IB2009/051033 WO2009115955A1 (en) | 2008-03-19 | 2009-03-12 | Modular oled device |
Country Status (2)
Country | Link |
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TW (1) | TW201002140A (en) |
WO (1) | WO2009115955A1 (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010022102A2 (en) * | 2008-08-19 | 2010-02-25 | Plextronics, Inc. | User configurable mosaic light emitting apparatus |
WO2013017372A1 (en) * | 2011-08-04 | 2013-02-07 | Agc Glass Europe | Structure comprising a plurality of optoelectronic modules |
DE102012219712A1 (en) * | 2012-10-29 | 2014-04-30 | Tridonic Dresden Gmbh & Co. Kg | Light module with optimized contacting |
US8836221B2 (en) | 2008-08-19 | 2014-09-16 | Solvay Usa, Inc. | Organic light emitting diode lighting systems |
EP2924759A1 (en) * | 2014-03-27 | 2015-09-30 | Tridonic Dresden GmbH & Co. KG | Lighting module and manufacturing method for a lighting module |
EP2782418A4 (en) * | 2011-11-14 | 2015-11-04 | Konica Minolta Inc | Organic electroluminescent element and planar light-emitting unit |
US9379349B2 (en) | 2010-03-22 | 2016-06-28 | Koninklijke Philips N.V. | OLED device with spatially isolated light-emitting areas |
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- 2009-03-17 TW TW098108645A patent/TW201002140A/en unknown
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US20040021425A1 (en) * | 2002-08-05 | 2004-02-05 | Foust Donald Franklin | Series connected OLED structure and fabrication method |
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US8836221B2 (en) | 2008-08-19 | 2014-09-16 | Solvay Usa, Inc. | Organic light emitting diode lighting systems |
US9379349B2 (en) | 2010-03-22 | 2016-06-28 | Koninklijke Philips N.V. | OLED device with spatially isolated light-emitting areas |
WO2013017372A1 (en) * | 2011-08-04 | 2013-02-07 | Agc Glass Europe | Structure comprising a plurality of optoelectronic modules |
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EP2782418A4 (en) * | 2011-11-14 | 2015-11-04 | Konica Minolta Inc | Organic electroluminescent element and planar light-emitting unit |
US9236583B2 (en) | 2011-11-14 | 2016-01-12 | Konica Minolta, Inc. | Organic electroluminescent element and planar light-emitting unit |
DE102012219712A1 (en) * | 2012-10-29 | 2014-04-30 | Tridonic Dresden Gmbh & Co. Kg | Light module with optimized contacting |
US9349973B2 (en) | 2012-10-29 | 2016-05-24 | Tridonic Gmbh & Co. Kg | Lighting module with optimized contacting |
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