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WO2009075217A1 - Flame-resistant photo-sensitive resin composition, and circuit board comprising the same - Google Patents

Flame-resistant photo-sensitive resin composition, and circuit board comprising the same Download PDF

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Publication number
WO2009075217A1
WO2009075217A1 PCT/JP2008/072022 JP2008072022W WO2009075217A1 WO 2009075217 A1 WO2009075217 A1 WO 2009075217A1 JP 2008072022 W JP2008072022 W JP 2008072022W WO 2009075217 A1 WO2009075217 A1 WO 2009075217A1
Authority
WO
WIPO (PCT)
Prior art keywords
flame
photo
component
resin composition
acid
Prior art date
Application number
PCT/JP2008/072022
Other languages
French (fr)
Japanese (ja)
Inventor
Hideaki Yoshino
Kiwamu Tokuhisa
Koji Nakamura
Original Assignee
Nippon Steel Chemical Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Chemical Co., Ltd. filed Critical Nippon Steel Chemical Co., Ltd.
Priority to JP2009545393A priority Critical patent/JP5087638B2/en
Publication of WO2009075217A1 publication Critical patent/WO2009075217A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/12—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C08F290/068—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/14—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/14—Polymers provided for in subclass C08G
    • C08F290/148—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
    • C08K5/5313—Phosphinic compounds, e.g. R2=P(:O)OR'
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/10—Block or graft copolymers containing polysiloxane sequences
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0387—Polyamides or polyimides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Materials For Photolithography (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

Disclosed is a photo-sensitive resin composition which can be cured into a material having flexibility. Also disclosed is a flame-resistant insulating coating film which has excellent storage stability at room temperature, and which can be cured or processed without the need of employing any high-temperature treatment. Specifically disclosed is a flame-resistant photo-sensitive resin composition essentially comprising: (A) a siloxane-containing polyamic acid resin having an ethylenically unsaturated bond; (B) a metal salt of an organic phosphinic acid; (C) at least one ester compound which has a solid form at ambient temperature and which is selected from an aromatic phosphoric acid condensate ester, a phthalic acid ester and an aliphatic ester; and (D) a photo-polymerization initiator, wherein the component (A) is a siloxane-containing polyamic acid resin produced by reacting an acid anhydride component comprising an aromatic tetracarboxylic acid dianhydride and a diamine component comprising a siloxane diamine and an aromatic diamine having an ethylenically unsaturated bond, and wherein the components (B) and (C) are contained in amounts of 20 to 35 parts by weight and 5 to 20 parts by weight, respectively, relative to 100 parts by weight of the component (A).
PCT/JP2008/072022 2007-12-10 2008-12-04 Flame-resistant photo-sensitive resin composition, and circuit board comprising the same WO2009075217A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009545393A JP5087638B2 (en) 2007-12-10 2008-12-04 Flame-retardant photosensitive resin composition and circuit board using the same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007317915 2007-12-10
JP2007-317915 2007-12-10

Publications (1)

Publication Number Publication Date
WO2009075217A1 true WO2009075217A1 (en) 2009-06-18

Family

ID=40755461

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/072022 WO2009075217A1 (en) 2007-12-10 2008-12-04 Flame-resistant photo-sensitive resin composition, and circuit board comprising the same

Country Status (3)

Country Link
JP (1) JP5087638B2 (en)
TW (1) TW200938955A (en)
WO (1) WO2009075217A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011197286A (en) * 2010-03-18 2011-10-06 Taiyo Holdings Co Ltd Photo-curable resin composition, dry film, cured object and printed wiring board
JP2011247996A (en) * 2010-05-25 2011-12-08 Kaneka Corp Novel photosensitive resin composition and utilization thereof
JP2017090515A (en) * 2015-11-02 2017-05-25 株式会社カネカ Negative type curable composition, cured article and laminate

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1192660A (en) * 1997-09-24 1999-04-06 Shin Etsu Chem Co Ltd Photosensitive resin composition
JP2002284963A (en) * 2001-03-26 2002-10-03 Nippon Kayaku Co Ltd Flame-retardant epoxy resin composition and use thereof
JP2006193584A (en) * 2005-01-12 2006-07-27 Hitachi Chem Co Ltd Thermosetting resin composition and prepreg using the same
WO2006109514A1 (en) * 2005-03-30 2006-10-19 Nippon Steel Chemical Co., Ltd. Photosensitive resin composition and circuit substrate employing the same
JP2007270137A (en) * 2006-03-09 2007-10-18 Showa Denko Kk Thermosetting resin composition and uses thereof
JP2007284605A (en) * 2006-04-19 2007-11-01 Nippon Steel Chem Co Ltd Non-halogen flame-retardant adhesive and cover lay for flexible printed circuit board using the same

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1192660A (en) * 1997-09-24 1999-04-06 Shin Etsu Chem Co Ltd Photosensitive resin composition
JP2002284963A (en) * 2001-03-26 2002-10-03 Nippon Kayaku Co Ltd Flame-retardant epoxy resin composition and use thereof
JP2006193584A (en) * 2005-01-12 2006-07-27 Hitachi Chem Co Ltd Thermosetting resin composition and prepreg using the same
WO2006109514A1 (en) * 2005-03-30 2006-10-19 Nippon Steel Chemical Co., Ltd. Photosensitive resin composition and circuit substrate employing the same
JP2007270137A (en) * 2006-03-09 2007-10-18 Showa Denko Kk Thermosetting resin composition and uses thereof
JP2007284605A (en) * 2006-04-19 2007-11-01 Nippon Steel Chem Co Ltd Non-halogen flame-retardant adhesive and cover lay for flexible printed circuit board using the same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011197286A (en) * 2010-03-18 2011-10-06 Taiyo Holdings Co Ltd Photo-curable resin composition, dry film, cured object and printed wiring board
JP2011247996A (en) * 2010-05-25 2011-12-08 Kaneka Corp Novel photosensitive resin composition and utilization thereof
JP2017090515A (en) * 2015-11-02 2017-05-25 株式会社カネカ Negative type curable composition, cured article and laminate

Also Published As

Publication number Publication date
TW200938955A (en) 2009-09-16
JPWO2009075217A1 (en) 2011-04-28
JP5087638B2 (en) 2012-12-05

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