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WO2009057600A1 - 塩化合物、カチオン重合開始剤およびカチオン重合性組成物 - Google Patents

塩化合物、カチオン重合開始剤およびカチオン重合性組成物 Download PDF

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Publication number
WO2009057600A1
WO2009057600A1 PCT/JP2008/069562 JP2008069562W WO2009057600A1 WO 2009057600 A1 WO2009057600 A1 WO 2009057600A1 JP 2008069562 W JP2008069562 W JP 2008069562W WO 2009057600 A1 WO2009057600 A1 WO 2009057600A1
Authority
WO
WIPO (PCT)
Prior art keywords
salt compound
polymerization initiator
polymerizable composition
cationic polymerization
cationically polymerizable
Prior art date
Application number
PCT/JP2008/069562
Other languages
English (en)
French (fr)
Inventor
Kentaro Kimura
Shohei Fujita
Tomoya Tamachi
Original Assignee
Adeka Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Adeka Corporation filed Critical Adeka Corporation
Priority to EP08844544A priority Critical patent/EP2223948B1/en
Priority to US12/740,984 priority patent/US8383862B2/en
Priority to CN2008801136181A priority patent/CN101842409B/zh
Priority to JP2009539072A priority patent/JP5558103B2/ja
Publication of WO2009057600A1 publication Critical patent/WO2009057600A1/ja

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/687—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing sulfur
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Materials For Photolithography (AREA)
  • Polymerisation Methods In General (AREA)
  • Epoxy Resins (AREA)
  • Polyethers (AREA)
  • Polymerization Catalysts (AREA)

Abstract

　酸発生能が高く、高感度で着色のない塩化合物、カチオン重合開始剤およびカチオン重合性組成物を提供する。 　下記一般式（１）、 （式中、Ｒ０１～Ｒ０５は、各々独立に、水素原子、フッ素原子および－ＹＲ基から選ばれる基であり、Ｒ０１～Ｒ０５のうち１つは－ＹＲ基であり、少なくとも２つはフッ素原子であり、Ｙは、酸素原子又は硫黄原子を表し、Ｒは、炭素数１～４のアルキル基を表し、Ｃｔｐ＋はｐ価のカチオンを表し、ｐは１又は２であり、ｎは電価を中性に保つ係数を表す）で表される塩化合物である。
PCT/JP2008/069562 2007-11-01 2008-10-28 塩化合物、カチオン重合開始剤およびカチオン重合性組成物 WO2009057600A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP08844544A EP2223948B1 (en) 2007-11-01 2008-10-28 Salt compound, cationic polymerization initiator and cationically polymerizable composition
US12/740,984 US8383862B2 (en) 2007-11-01 2008-10-28 Salt compound, cationic polymerization initiator and cationically polymerizable composition
CN2008801136181A CN101842409B (zh) 2007-11-01 2008-10-28 盐化合物、阳离子聚合引发剂及阳离子聚合性组合物
JP2009539072A JP5558103B2 (ja) 2007-11-01 2008-10-28 塩化合物、カチオン重合開始剤およびカチオン重合性組成物

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007-285538 2007-11-01
JP2007285538 2007-11-01
JP2008147587 2008-06-05
JP2008-147587 2008-06-05

Publications (1)

Publication Number Publication Date
WO2009057600A1 true WO2009057600A1 (ja) 2009-05-07

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Application Number Title Priority Date Filing Date
PCT/JP2008/069562 WO2009057600A1 (ja) 2007-11-01 2008-10-28 塩化合物、カチオン重合開始剤およびカチオン重合性組成物

Country Status (7)

Country Link
US (1) US8383862B2 (ja)
EP (1) EP2223948B1 (ja)
JP (1) JP5558103B2 (ja)
KR (1) KR101602756B1 (ja)
CN (1) CN101842409B (ja)
TW (1) TWI429675B (ja)
WO (1) WO2009057600A1 (ja)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011075555A1 (en) 2009-12-17 2011-06-23 Dsm Ip Assets, B.V. Led curable liquid resin compositions for additive fabrication
WO2011091228A1 (en) 2010-01-22 2011-07-28 Dsm Ip Assets B.V. Liquid radiation curable resins capable of curing into layers with selective visual effects and methods for the use thereof
EP2502728A1 (en) 2011-03-23 2012-09-26 DSM IP Assets B.V. Lightweight and High Strength Three-Dimensional Articles Producible by Additive Fabrication Processes
WO2014061062A1 (ja) * 2012-10-18 2014-04-24 サンアプロ株式会社 スルホニウム塩、光酸発生剤、硬化性組成物およびレジスト組成物
WO2014192839A1 (ja) * 2013-05-28 2014-12-04 株式会社ダイセル 光半導体封止用硬化性組成物
JP2015521160A (ja) * 2012-04-19 2015-07-27 ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ スルホニウム化合物、それらの製造および使用
WO2015118986A1 (ja) 2014-02-06 2015-08-13 株式会社Adeka 担持体及び光電変換素子
JP2016080940A (ja) * 2014-10-20 2016-05-16 信越化学工業株式会社 パターン形成方法及び化学増幅ネガ型レジスト組成物
JP2016172813A (ja) * 2015-03-17 2016-09-29 デクセリアルズ株式会社 化合物、熱硬化性樹脂組成物、及び熱硬化性シート
JP2017179090A (ja) * 2016-03-29 2017-10-05 株式会社Adeka 硬化性組成物
JP2019533721A (ja) * 2016-11-25 2019-11-21 エルジー・ケム・リミテッド イオン性化合物、これを含むコーティング組成物及び有機発光素子
JP2020037621A (ja) * 2018-09-03 2020-03-12 Jnc株式会社 熱硬化性組成物

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10604659B2 (en) 2015-06-08 2020-03-31 Dsm Ip Assets B.V. Liquid, hybrid UV/VIS radiation curable resin compositions for additive fabrication
AT517626B1 (de) * 2015-09-02 2017-06-15 Univ Wien Tech Verwendung neuer Aryliodonium- und Sulfoniumsalze als Photoinitiatoren
EP3341793B1 (en) 2015-10-01 2021-05-26 DSM IP Assets B.V. Liquid, hybrid uv/vis radiation curable resin compositions for additive fabrication
EP3184569B1 (de) 2015-12-23 2018-09-26 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Härtungsinitiatoren für die kationische polymerisation
CN110049989A (zh) * 2016-12-08 2019-07-23 株式会社日本触媒 光产路易斯酸剂

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Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011084578A1 (en) 2009-12-17 2011-07-14 Dsm Ip Assets, B.V. Substrate-based additive fabrication process
US20120259031A1 (en) * 2009-12-17 2012-10-11 Dsm Ip Assets, B.V. Led curable liquid resin compositions for additive fabrication
WO2011075555A1 (en) 2009-12-17 2011-06-23 Dsm Ip Assets, B.V. Led curable liquid resin compositions for additive fabrication
WO2011091228A1 (en) 2010-01-22 2011-07-28 Dsm Ip Assets B.V. Liquid radiation curable resins capable of curing into layers with selective visual effects and methods for the use thereof
EP2502728A1 (en) 2011-03-23 2012-09-26 DSM IP Assets B.V. Lightweight and High Strength Three-Dimensional Articles Producible by Additive Fabrication Processes
JP2015521160A (ja) * 2012-04-19 2015-07-27 ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ スルホニウム化合物、それらの製造および使用
WO2014061062A1 (ja) * 2012-10-18 2014-04-24 サンアプロ株式会社 スルホニウム塩、光酸発生剤、硬化性組成物およびレジスト組成物
KR101763058B1 (ko) * 2013-05-28 2017-07-28 주식회사 다이셀 광반도체 밀봉용 경화성 조성물
US9685597B2 (en) 2013-05-28 2017-06-20 Daicel Corporation Curable composition for sealing optical semiconductor
WO2014192839A1 (ja) * 2013-05-28 2014-12-04 株式会社ダイセル 光半導体封止用硬化性組成物
WO2015118986A1 (ja) 2014-02-06 2015-08-13 株式会社Adeka 担持体及び光電変換素子
JP2016080940A (ja) * 2014-10-20 2016-05-16 信越化学工業株式会社 パターン形成方法及び化学増幅ネガ型レジスト組成物
JP2016172813A (ja) * 2015-03-17 2016-09-29 デクセリアルズ株式会社 化合物、熱硬化性樹脂組成物、及び熱硬化性シート
JP2017179090A (ja) * 2016-03-29 2017-10-05 株式会社Adeka 硬化性組成物
JP2019533721A (ja) * 2016-11-25 2019-11-21 エルジー・ケム・リミテッド イオン性化合物、これを含むコーティング組成物及び有機発光素子
JP2020037621A (ja) * 2018-09-03 2020-03-12 Jnc株式会社 熱硬化性組成物
JP7151286B2 (ja) 2018-09-03 2022-10-12 Jnc株式会社 熱硬化性組成物

Also Published As

Publication number Publication date
TWI429675B (zh) 2014-03-11
EP2223948A1 (en) 2010-09-01
EP2223948B1 (en) 2013-01-23
KR101602756B1 (ko) 2016-03-11
CN101842409B (zh) 2013-05-01
EP2223948A4 (en) 2012-05-23
KR20100092947A (ko) 2010-08-23
US20100267857A1 (en) 2010-10-21
TW200940591A (en) 2009-10-01
US8383862B2 (en) 2013-02-26
CN101842409A (zh) 2010-09-22
JPWO2009057600A1 (ja) 2011-03-10
JP5558103B2 (ja) 2014-07-23

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