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WO2008139857A1 - 異方導電性接着剤フィルム及び異方導電性接着剤フィルムの製造方法 - Google Patents

異方導電性接着剤フィルム及び異方導電性接着剤フィルムの製造方法 Download PDF

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Publication number
WO2008139857A1
WO2008139857A1 PCT/JP2008/057779 JP2008057779W WO2008139857A1 WO 2008139857 A1 WO2008139857 A1 WO 2008139857A1 JP 2008057779 W JP2008057779 W JP 2008057779W WO 2008139857 A1 WO2008139857 A1 WO 2008139857A1
Authority
WO
WIPO (PCT)
Prior art keywords
releasing
anisotropic conductive
conductive adhesive
film
adhesive film
Prior art date
Application number
PCT/JP2008/057779
Other languages
English (en)
French (fr)
Inventor
Minoru Nagashima
Tadasu Kawashima
Original Assignee
Sony Chemical & Information Device Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chemical & Information Device Corporation filed Critical Sony Chemical & Information Device Corporation
Priority to US12/598,622 priority Critical patent/US20100129582A1/en
Priority to CN200880023611A priority patent/CN101687388A/zh
Publication of WO2008139857A1 publication Critical patent/WO2008139857A1/ja
Priority to US13/491,130 priority patent/US20120305178A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/40—Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/26—Polymeric coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/716—Degradable
    • B32B2307/7163—Biodegradable
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/108—Flash, trim or excess removal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/14—Layer or component removable to expose adhesive

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Non-Insulated Conductors (AREA)
  • Biological Depolymerization Polymers (AREA)

Abstract

　本発明は、電子部品間等の導電接続を行うための異方導電性接着剤フィルムであり、一方の面に第１の剥離層（５）が設けられた第１の剥離フィルム（２）と、第１の剥離フィルム（２）上に第１の剥離層（５）を介して設けられ、異方導電性接着材料により形成された接着剤層（３）と、第２の剥離層（６）が一方の面に設けられ、接着剤層（３）の第１の剥離フィルム（２）側の面と反対側の面に、第２の剥離層（６）を介して設けられた第２の剥離フィルム（４）とを備え、第１及び第２の剥離フィルム（２），（４）は、脂肪酸ポリエステル成分からなる非収縮性の生分解性フィルムを基材とし、それぞれの基材上に１００°C以上で硬化する熱硬化性のシリコーン樹脂からなる第１の剥離層（５）、第２の剥離層（６）が設けられている。
PCT/JP2008/057779 2007-05-07 2008-04-22 異方導電性接着剤フィルム及び異方導電性接着剤フィルムの製造方法 WO2008139857A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US12/598,622 US20100129582A1 (en) 2007-05-07 2008-04-22 Anisotropic electrically conductive adhesive film and method for manufacturing same
CN200880023611A CN101687388A (zh) 2007-05-07 2008-04-22 各向异性导电性粘合剂薄膜和各向异性导电性粘合剂薄膜的制备方法
US13/491,130 US20120305178A1 (en) 2007-05-07 2012-06-07 Anisotropic electrically conductive adhesive film and method for manufacturing same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-122783 2007-05-07
JP2007122783A JP5154834B2 (ja) 2007-05-07 2007-05-07 異方導電性接着剤フィルム及び異方導電性接着剤フィルムの製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US13/491,130 Division US20120305178A1 (en) 2007-05-07 2012-06-07 Anisotropic electrically conductive adhesive film and method for manufacturing same

Publications (1)

Publication Number Publication Date
WO2008139857A1 true WO2008139857A1 (ja) 2008-11-20

Family

ID=40002074

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/057779 WO2008139857A1 (ja) 2007-05-07 2008-04-22 異方導電性接着剤フィルム及び異方導電性接着剤フィルムの製造方法

Country Status (5)

Country Link
US (2) US20100129582A1 (ja)
JP (1) JP5154834B2 (ja)
CN (1) CN101687388A (ja)
TW (1) TW200904936A (ja)
WO (1) WO2008139857A1 (ja)

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EP2644643B1 (en) * 2010-11-26 2019-01-30 Nitto Denko Corporation Polylactic acid-based film or sheet
JP5777913B2 (ja) * 2011-03-24 2015-09-09 日東電工株式会社 剥離ライナーの製造方法
US10118999B2 (en) 2012-02-10 2018-11-06 Nitto Denko Corporation Polylactic acid film or sheet, and pressure-sensitive adhesive tape or sheet
JP5864352B2 (ja) * 2012-05-10 2016-02-17 帝人デュポンフィルム株式会社 異方導電性フィルム用離型フィルム
JP5874561B2 (ja) * 2012-07-25 2016-03-02 デクセリアルズ株式会社 帯電防止性剥離フィルム
WO2014097575A1 (ja) * 2012-12-17 2014-06-26 パナソニック株式会社 熱伝導シート
JP6331776B2 (ja) * 2014-06-30 2018-05-30 デクセリアルズ株式会社 異方導電性フィルム及び接続構造体
CN105295760A (zh) * 2015-10-23 2016-02-03 浙江欧仁新材料有限公司 一种各向异性导电双面胶
CN108340670B (zh) * 2018-03-27 2023-09-12 深圳市三上高分子环保新材料股份有限公司 双拉伸聚乳酸薄膜即涂膜及其加工设备
CN110193982B (zh) * 2019-05-29 2021-03-30 珠海市一心材料科技有限公司 高温阻胶膜及其制造方法
KR102675134B1 (ko) * 2020-03-31 2024-06-12 동우 화인켐 주식회사 도전성 필름 적층체 및 이의 제조 방법

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JP2000135769A (ja) * 1998-11-04 2000-05-16 Lintec Corp 紙葉片の積層装置及び積層方法
JP2002370315A (ja) * 2001-06-14 2002-12-24 Sony Chem Corp 剥離フィルム及び剥離フィルムを用いた接着フィルム
JP2004322624A (ja) * 2003-03-04 2004-11-18 Office Media Co Ltd 生分解性剥離フィルム状物
JP2006281670A (ja) * 2005-04-01 2006-10-19 Shin Etsu Chem Co Ltd 熱圧着用シート

Also Published As

Publication number Publication date
US20100129582A1 (en) 2010-05-27
TW200904936A (en) 2009-02-01
JP5154834B2 (ja) 2013-02-27
US20120305178A1 (en) 2012-12-06
JP2008274196A (ja) 2008-11-13
CN101687388A (zh) 2010-03-31

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