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WO2008126817A1 - Metallic foil-clad laminate plate and printed wiring board - Google Patents

Metallic foil-clad laminate plate and printed wiring board Download PDF

Info

Publication number
WO2008126817A1
WO2008126817A1 PCT/JP2008/056852 JP2008056852W WO2008126817A1 WO 2008126817 A1 WO2008126817 A1 WO 2008126817A1 JP 2008056852 W JP2008056852 W JP 2008056852W WO 2008126817 A1 WO2008126817 A1 WO 2008126817A1
Authority
WO
WIPO (PCT)
Prior art keywords
metallic foil
clad laminate
laminate plate
wiring board
printed wiring
Prior art date
Application number
PCT/JP2008/056852
Other languages
French (fr)
Japanese (ja)
Inventor
Kazumasa Takeuchi
Masaki Yamaguchi
Original Assignee
Hitachi Chemical Company, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Company, Ltd. filed Critical Hitachi Chemical Company, Ltd.
Publication of WO2008126817A1 publication Critical patent/WO2008126817A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)

Abstract

This invention provides a metallic foil-clad laminate plate comprising a substrate and a metallic foil provided in contact with the substrate, the substrate comprising two or more composite resin layers, stacked on top of each other, each comprising a fibrous base material impregnated with a resin composition. In this metallic foil-clad laminate plate, at least two opposed composite resin layers have been bonded to each other with the aid of an adhesive layer formed of a resin composition, and the resin composition in the composition resin layer and the adhesive layer has been cured. The metallic foil-clad laminate plate can maintain a highh-temperature surface hardness on a level high enough to conduct wire bonding while maintaining a large amount of the resin in the metallic foil-clad laminate plate. There is also provided a printed wiring board having the above advantageous properties.
PCT/JP2008/056852 2007-04-11 2008-04-07 Metallic foil-clad laminate plate and printed wiring board WO2008126817A1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007103784 2007-04-11
JP2007-103784 2007-04-11
JP2008006101 2008-01-15
JP2008-006101 2008-01-15

Publications (1)

Publication Number Publication Date
WO2008126817A1 true WO2008126817A1 (en) 2008-10-23

Family

ID=39863914

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/056852 WO2008126817A1 (en) 2007-04-11 2008-04-07 Metallic foil-clad laminate plate and printed wiring board

Country Status (3)

Country Link
JP (1) JP5056553B2 (en)
TW (1) TW200908821A (en)
WO (1) WO2008126817A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018041800A (en) * 2016-09-06 2018-03-15 パナソニックＩｐマネジメント株式会社 Printed wiring board, printed circuit board, and prepreg
CN114845874A (en) * 2019-12-17 2022-08-02 三菱瓦斯化学株式会社 Resin sheet and printed wiring board
CN116080157A (en) * 2022-11-16 2023-05-09 广东威世新材料有限公司 Copper foil-coated epoxy glass fiber laminated board for printed circuit

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI568587B (en) * 2011-04-14 2017-02-01 住友電木股份有限公司 Laminated board, circuit board, semiconductor package, and method for manufacturing laminated board
JPWO2014087882A1 (en) * 2012-12-05 2017-01-05 住友ベークライト株式会社 Metal layer with resin layer, laminate, circuit board, and semiconductor device
JP6269506B2 (en) * 2012-12-18 2018-01-31 日立化成株式会社 LAMINATE, LAMINATE, PRINTED WIRING BOARD, LAMINATE MANUFACTURING METHOD, AND LAMINATE MANUFACTURING METHOD

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06507758A (en) * 1991-06-04 1994-09-01 アンプ―アクゾ　リンラム　ブイオーエフ Printed wiring board and its manufacturing method
JPH06344500A (en) * 1993-06-03 1994-12-20 Nippon Pillar Packing Co Ltd Production of laminated sheet and mixed film for laminated sheet
JP2003055486A (en) * 2001-05-24 2003-02-26 Hitachi Chem Co Ltd Prepreg and laminate
JP2005281661A (en) * 2004-03-05 2005-10-13 Hitachi Chem Co Ltd Prepreg and metal foil-clad laminate and printed circuit board using the same

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60190347A (en) * 1984-03-10 1985-09-27 松下電工株式会社 Laminated board for electricity
JP4517749B2 (en) * 2004-04-12 2010-08-04 日立化成工業株式会社 Prepreg and metal-clad laminate and printed circuit board using the same
JP4590982B2 (en) * 2004-04-21 2010-12-01 日立化成工業株式会社 Metal foil with resin

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06507758A (en) * 1991-06-04 1994-09-01 アンプ―アクゾ　リンラム　ブイオーエフ Printed wiring board and its manufacturing method
JPH06344500A (en) * 1993-06-03 1994-12-20 Nippon Pillar Packing Co Ltd Production of laminated sheet and mixed film for laminated sheet
JP2003055486A (en) * 2001-05-24 2003-02-26 Hitachi Chem Co Ltd Prepreg and laminate
JP2005281661A (en) * 2004-03-05 2005-10-13 Hitachi Chem Co Ltd Prepreg and metal foil-clad laminate and printed circuit board using the same

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018041800A (en) * 2016-09-06 2018-03-15 パナソニックＩｐマネジメント株式会社 Printed wiring board, printed circuit board, and prepreg
WO2018047613A1 (en) * 2016-09-06 2018-03-15 パナソニックＩｐマネジメント株式会社 Printed wiring board, printed circuit board, prepreg
US11114354B2 (en) 2016-09-06 2021-09-07 Panasonic Intellectual Property Management Co., Ltd. Printed wiring board, printed circuit board, prepreg
TWI770047B (en) * 2016-09-06 2022-07-11 日商松下知識產權經營股份有限公司 Printed wiring boards, printed circuit boards, prepregs
CN114845874A (en) * 2019-12-17 2022-08-02 三菱瓦斯化学株式会社 Resin sheet and printed wiring board
CN116080157A (en) * 2022-11-16 2023-05-09 广东威世新材料有限公司 Copper foil-coated epoxy glass fiber laminated board for printed circuit
CN116080157B (en) * 2022-11-16 2023-08-04 广东威世新材料有限公司 Copper foil-coated epoxy glass fiber laminated board for printed circuit

Also Published As

Publication number Publication date
JP5056553B2 (en) 2012-10-24
TW200908821A (en) 2009-02-16
JP2009190387A (en) 2009-08-27

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