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WO2008102695A1 - Resin film forming device, resin film forming method, display, manufacturing device for display, and manufacturing method for display - Google Patents

Resin film forming device, resin film forming method, display, manufacturing device for display, and manufacturing method for display Download PDF

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Publication number
WO2008102695A1
WO2008102695A1 PCT/JP2008/052502 JP2008052502W WO2008102695A1 WO 2008102695 A1 WO2008102695 A1 WO 2008102695A1 JP 2008052502 W JP2008052502 W JP 2008052502W WO 2008102695 A1 WO2008102695 A1 WO 2008102695A1
Authority
WO
WIPO (PCT)
Prior art keywords
display
resin film
film forming
manufacturing
air
Prior art date
Application number
PCT/JP2008/052502
Other languages
French (fr)
Japanese (ja)
Inventor
Toshio Negishi
Original Assignee
Ulvac, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac, Inc. filed Critical Ulvac, Inc.
Publication of WO2008102695A1 publication Critical patent/WO2008102695A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J1/00—Details of electrodes, of magnetic control means, of screens, or of the mounting or spacing thereof, common to two or more basic types of discharge tubes or lamps
    • H01J1/54—Screens on or from which an image or pattern is formed, picked-up, converted, or stored; Luminescent coatings on vessels
    • H01J1/62—Luminescent screens; Selection of materials for luminescent coatings on vessels
    • H01J1/70—Luminescent screens; Selection of materials for luminescent coatings on vessels with protective, conductive, or reflective layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/302—Details of OLEDs of OLED structures
    • H10K2102/3023—Direction of light emission
    • H10K2102/3026—Top emission
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/123—Connection of the pixel electrodes to the thin film transistors [TFT]

Landscapes

  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

A display with no reduction in light emitting efficiency. In the display (1), a space surrounded by first and second panels (10, 20) and a sealing member (22) is filled with a resin film (29), so that air is less likely to enter inside the display. In forming of the resin film (29), resin liquid is spread over a screen (74) by a pressure lower than the atmospheric pressure, and this removes air bubbles mixed in the resin liquid. Air does not enter inside the display (1) both in and after manufacturing steps, and as a result, no damage is inflicted on an organic film (14). The display (1) with a long service life can be obtained.
PCT/JP2008/052502 2007-02-21 2008-02-15 Resin film forming device, resin film forming method, display, manufacturing device for display, and manufacturing method for display WO2008102695A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-040868 2007-02-21
JP2007040868 2007-02-21

Publications (1)

Publication Number Publication Date
WO2008102695A1 true WO2008102695A1 (en) 2008-08-28

Family

ID=39709972

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/052502 WO2008102695A1 (en) 2007-02-21 2008-02-15 Resin film forming device, resin film forming method, display, manufacturing device for display, and manufacturing method for display

Country Status (2)

Country Link
TW (1) TW200845805A (en)
WO (1) WO2008102695A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111128018A (en) * 2019-12-13 2020-05-08 Oppo广东移动通信有限公司 Display screen assembly attaching method and sealing plug

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5326098B2 (en) * 2009-02-05 2013-10-30 シャープ株式会社 Substrate surface sealing device and organic EL panel manufacturing method

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0945985A (en) * 1995-07-27 1997-02-14 Matsushita Electric Ind Co Ltd Semiconductor laser and fabrication thereof
JP2001203076A (en) * 1999-11-09 2001-07-27 Semiconductor Energy Lab Co Ltd Luminescent device and its manufacturing method
JP2005320583A (en) * 2004-05-10 2005-11-17 Konica Minolta Holdings Inc Gas-barrier transparent plastic film, manufacturing method therefor and organic electroluminescence element using the gas-barrier transparent plastic film
JP2006095783A (en) * 2004-09-29 2006-04-13 Dainippon Printing Co Ltd Transparent gas barrier film and substrate for display using it
JP2006147528A (en) * 2004-10-22 2006-06-08 Seiko Epson Corp Manufacturing method of organic electroluminescent device, and organic electroluminescent device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0945985A (en) * 1995-07-27 1997-02-14 Matsushita Electric Ind Co Ltd Semiconductor laser and fabrication thereof
JP2001203076A (en) * 1999-11-09 2001-07-27 Semiconductor Energy Lab Co Ltd Luminescent device and its manufacturing method
JP2005320583A (en) * 2004-05-10 2005-11-17 Konica Minolta Holdings Inc Gas-barrier transparent plastic film, manufacturing method therefor and organic electroluminescence element using the gas-barrier transparent plastic film
JP2006095783A (en) * 2004-09-29 2006-04-13 Dainippon Printing Co Ltd Transparent gas barrier film and substrate for display using it
JP2006147528A (en) * 2004-10-22 2006-06-08 Seiko Epson Corp Manufacturing method of organic electroluminescent device, and organic electroluminescent device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111128018A (en) * 2019-12-13 2020-05-08 Oppo广东移动通信有限公司 Display screen assembly attaching method and sealing plug

Also Published As

Publication number Publication date
TW200845805A (en) 2008-11-16

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