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WO2008023666A1 - Procédé de fabrication d'une carte de connexion et carte de connexion correspondante - Google Patents

Procédé de fabrication d'une carte de connexion et carte de connexion correspondante Download PDF

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Publication number
WO2008023666A1
WO2008023666A1 PCT/JP2007/066125 JP2007066125W WO2008023666A1 WO 2008023666 A1 WO2008023666 A1 WO 2008023666A1 JP 2007066125 W JP2007066125 W JP 2007066125W WO 2008023666 A1 WO2008023666 A1 WO 2008023666A1
Authority
WO
WIPO (PCT)
Prior art keywords
groove
wiring board
substrate
manufacturing
protective film
Prior art date
Application number
PCT/JP2007/066125
Other languages
English (en)
Japanese (ja)
Inventor
Kenji Kitaoka
Original Assignee
Cluster Technology Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cluster Technology Co., Ltd. filed Critical Cluster Technology Co., Ltd.
Publication of WO2008023666A1 publication Critical patent/WO2008023666A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0108—Male die used for patterning, punching or transferring

Definitions

  • the present invention relates to a wiring board and a manufacturing method thereof. More specifically, a wiring board that forms a conductive pattern on a substrate by supplying a surface modifying solution to the groove, filling the groove inner surface with the surface modifying solution, and depositing a conductive substance on the opening of the groove.
  • the present invention relates to a manufacturing method and a wiring board using the same.
  • Patent Document 1 a method for manufacturing a wiring board. According to this document, a fine groove is formed on a substrate with a mold, and a conductive ink, which is a conductive material, is dropped into the groove to form a wiring pattern. As other manufacturing methods, those described in Patent Documents 2 and 3 are known.
  • Patent Document 1 Japanese Patent Application Laid-Open No. 2004-356255
  • Patent Document 2 JP 2005-50969
  • Patent Document 3 JP 2006-210891
  • the width of the wiring is a very narrow width of 50 Hm or less, and conductive ink, which is a kind of conductor forming liquid, is injected using an inkjet head having a fine-structure nozzle. This is described (paragraph number 0022, 0047). However, when conductive ink is poured into a narrow groove, the conductive ink oozes out of the groove and diffuses, resulting in a non-uniform conductive pattern.
  • Patent Document 3 describes that an alkali-resistant protective film is formed on the surface of a polyimide resin, and the protective film and the surface layer portion of the polyimide resin are removed to form a recess.
  • the thickness of the protective film is as thin as 0.;! ⁇ ⁇ , the edge of the protective film may peel off from the recess, and the inorganic thin film is formed even outside the recess, forming a precise circuit pattern. It was sometimes difficult.
  • the recess is formed by removing the protective film and the polyimide resin substrate. Therefore, the protective film protects parts other than the pattern formation part with alkaline aqueous solution force and The thickness of the substrate is as thin as 0.;! To 10 m, preferably 0.03 to 4 111 so that the recess can be formed on the substrate.
  • the protective film does not form a concave portion that becomes a pattern forming portion in the protective film as long as the portion other than the pattern forming portion can be protected with an alkaline solution force.
  • an object of the present invention is to provide a wiring board capable of preventing the deposition of a conductive substance outside the groove and increasing the density of the wiring, and a method for manufacturing the same.
  • a method of manufacturing a wiring board according to the present invention is characterized in that a surface modification solution is supplied to a groove, the surface of the groove is filled with the surface modification solution, and a groove opening is formed.
  • a protective film for protecting the substrate from the surface modification solution is formed in an adhesive state on the surface of the substrate, Providing this protective film on the substrate and forming a groove in the protective film to expose a part of the substrate, filling the groove with the surface modifying solution to modify the surface of the groove inner surface, The metal element is fixed on the inner surface of the groove by an ion exchange reaction, and the metal is deposited, and further, a conductive substance is deposited at the opening of the groove by using an electroless plating method and / or an electrolytic plating method. .
  • the surface modification solution supplied to the groove is prevented from penetrating between the protective film and the substrate from the edge of the groove.
  • a conductive pattern along the groove can be formed accurately.
  • the protective film has a function of protecting the substrate from the surface modification solution.
  • the groove formed in the protective film is filled with the surface modification solution, the exposed substrate surface is modified, and a conductive material is deposited to form a conductive pattern. It also has the function of forming.
  • a photocurable resin is used as the material of the protective film, the molding die and / or the base plate is formed so as to transmit light, and the photocurable resin film is provided on the substrate.
  • the above The film is pressed with a mold, and the protective film is formed by curing the photocurable resin of the film by irradiation with light that passes through the mold and / or the substrate, and the groove is formed by transfer from the mold. You may make it.
  • After forming the groove it is preferable that at least the surface of the substrate is exposed at the bottom of the groove by etching the groove and at least its vicinity.
  • the protective film is preferably formed with a film thickness exceeding 10 m.
  • the protective film may be formed by thermally bonding a thermoplastic resin.
  • the protective film may be formed by bonding a photocurable resin by photocuring.
  • the protective film is preferably formed of a thin sheet.
  • the sheet may be a film wound in a mold shape.
  • the groove may be formed in the sheet in advance.
  • the groove may be formed while the protective film is adhered to the surface of the substrate using a heated mold.
  • the substrate is made of polyimide
  • the protective film includes at least one selected from the group consisting of polyetherimide, polyether ether ketone, polyethylene terephthalate, polyethylene naphthalate, polycarbonate, and acrylic resin. May be.
  • the substrate may be made of polyimide
  • the protective film may include at least one selected from the group consisting of block copolymerized polyimide, heat processable polyimide, epoxy resin, and fluorinated polyimide. It's okay!
  • the photocurable resin may include at least one selected from the group consisting of an acrylic resin, an epoxy resin, a polyester resin, and a silicone resin.
  • the substrate may be laminated on another substrate by the protective film, and the two substrates may be bonded.
  • the groove may be formed by material removal processing or transfer processing using a mold. In addition to a mold, a glass mold, a resin mold, and a ceramic mold are used as the mold.
  • the protective film may be adhered to the surface of the substrate via an adhesive layer. Further, the surface modification of the inner surface of the groove may be performed by steam instead of the surface modification solution.
  • the groove may be formed on the surface of the substrate with a rough surface in which at least a part of the inner surface is continuous in the longitudinal direction.
  • each of the above methods includes a first groove in which the groove forms a main part of a conductive pattern, and a second groove surrounding a supply part for supplying the conductor forming liquid.
  • the second The groove may be communicated.
  • the groove includes a first groove forming a main part of the conductive pattern, and a second groove surrounding the supply portion for supplying the conductor forming liquid, and the first and second grooves are communicated with each other.
  • a third groove that communicates with the first groove may be provided within a range surrounded by the second groove.
  • the groove has a first groove that forms a main part of the conductive pattern, and a plurality of groove portions that communicate with the first groove and are adjacent to each other are formed in the supply portion that supplies the conductor forming liquid.
  • the surface modification solution may be supplied to the supply unit by ink jet or dispenser.
  • the surface modification solution may be supplied to the groove by capillary action.
  • the characteristics of the wiring board using the method for manufacturing a wiring board as described in the above! /, Misalignment feature include: an element for mounting the conductor forming liquid and / or a connection part to another substrate and the supply This is because the department and at least partly overlap.
  • the substrate includes a first substrate and a second substrate that are bonded to each other, a protrusion is formed on the first substrate, and a second substrate has a through portion that is penetrated by the protrusion, and the protrusion and the substrate
  • the penetrating portions may have electrodes joined by the penetrating in the first and second substrates, respectively, and either of the electrodes of the first and second substrates may be the supply portion.
  • substrate joined mutually, a 1st board
  • Each of the first and second substrates are joined by penetration, and the electrodes of the first and second substrates are the supply section, and both the electrodes of the first and second substrates are May have grooves oriented in different directions intersecting each other during the joining.
  • a feature of the wiring board using the method of manufacturing a wiring board described in the above! /, Misalignment feature is that a receiving part for positioning the connecting part is formed in the supply part or in the vicinity thereof. Further, a receiving portion for positioning the connecting portion may be formed at or near the supply portion, and the receiving portion may be formed at the time of processing the first groove. Furthermore, the receiving part for positioning of the connecting part may be formed at or near the supply part, and the receiving part may be formed by printing.
  • the present invention is also provided as a wiring board manufactured using the method for manufacturing a wiring board according to any one of the above features.
  • the invention's effect is also provided as a wiring board manufactured using the method for manufacturing a wiring board according to any one of the above features. The invention's effect
  • the characteristics of the wiring board and the method for manufacturing the same according to the present invention it is possible to prevent the conductive material from being deposited outside the groove and to increase the density of the wiring.
  • FIG. 1 is a cross-sectional view of a substrate according to the manufacturing flow of the present invention.
  • FIG. 2 (a) is an enlarged plan view of the first to third grooves on the surface of the wiring board according to the present invention, and (b) is (a)
  • a sectional view, (c) is an AA sectional view of (a) according to another embodiment, (d) is a schematic front view of the substrate explaining the action occurring in the groove, (e) is It is a top view of (d).
  • FIG. 3 (a) is an enlarged plan view showing the relationship between the BGA solder balls and the first to third grooves on the surface of the wiring board according to the present invention, and (b) is a cross-sectional view taken along the line BB in (a). (C) is CC sectional drawing of (a), (d) is sectional drawing which shows the state which the solder ball of (c) melt
  • FIG. 4 is a view corresponding to FIG. 1 according to another embodiment of the present invention.
  • FIG. 5 is a view corresponding to FIG. 1 according to still another embodiment of the present invention.
  • FIG. 6 (a) to (d) are views corresponding to FIG. 2 (b) showing still another embodiment, and (e) is a view corresponding to FIG. 2 (b) showing a state in which a rough surface is formed. .
  • FIG. 7] (a) to (d) are equivalent views of FIG. 3 showing still another embodiment.
  • FIG. 8 (a) is a view corresponding to FIG. 3 (a) showing still another embodiment
  • FIG. 8 (b) shows the relationship between the solder balls and the first to third grooves on the surface of the wiring board according to the present invention.
  • (C) is a cross-sectional view of (b)
  • (d) is a plan view showing a state in which the solder ball of (a) is melted
  • (e) is a cross-sectional view of DD in (d).
  • FIG. 9 (a) is a perspective view of a connection bump on the lower substrate, (b) is a plan view of (a), (c) is a terminal located above (b), and (d) is (a) (E) is a top view of the terminal connected with the bump of (d).
  • FIG. 10 (a) is a cross-sectional view of the upper and lower substrates connected by connection bumps, (b) is a cross-sectional view of a ⁇ of (a), and (c) is a bump intruded from the state of ⁇ . The state, (d) is the contact state, and (e) is the FF cross-sectional view of (d).
  • FIG. 11 (a) is a perspective view of a supply unit showing still another embodiment, and (b) is a longitudinal sectional view of (a).
  • FIG. 12] (a) to (d) are views corresponding to FIG. 8 (a) showing still another embodiment.
  • FIG. 13 (a) to (d) are equivalent diagrams of FIG. 3 showing a reference embodiment.
  • FIG. 14 (a) is a plan view of a wiring board showing a state in which another liquid conductor is applied
  • FIG. 14 (b) is a cross-sectional view taken along line JJ in (a).
  • FIG. 1 is a cross-sectional view of each process of a substrate according to the wiring substrate manufacturing method flow of the first embodiment of the present invention.
  • the manufacturing method of the wiring board according to the present embodiment includes a protective film formation step S1 / groove formation step S2 / substrate exposure step S3 / surface modification step S4 / ion exchange reaction step S5 / conductive material deposition step S6 / metal thickening step. Includes S7.
  • the material of the wiring board 1 of the present invention is not particularly limited as long as it is a material capable of fixing a metal element by surface modification with a surface modification solution described later and an ion exchange reaction after the surface modification.
  • a non-conductive material is used. If a conductive material is used, the surface of the substrate should be coated with a non-conductive material! /.
  • Non-conductive materials that can be used for the substrate include polyimide, glass, epoxy resin, polyurethane resin, silicone resin, Examples include diallyl phthalate resin, formaldehyde resin, phenol resin, amino resin, and ceramic status. A mold release agent may be included as necessary.
  • the polyimide substrate shown in Chemical Formula 1 is used!
  • a protective film 21 is formed on the surface of the wiring board 1.
  • the groove 10 can be formed by a transfer process using a mold, a glass mold, a resin mold, a ceramic mold or the like, or a material removal process using a laser or the like.
  • polyetherimide, block copolymerized polyimide, heat-processable polyimide, epoxy resin, and the like can be used as long as the material is superior and can protect the substrate 1 from the surface-modified solution and desirably has low affinity with the surface-modified solution.
  • Examples include fluorinated polyimide, polyether ether ketone, polyethylene terephthalate, polyethylene naphthalate, polycarbonate, and acrylic resin.
  • a method of forming the protective film 21 made of these materials on the substrate a method of laminating the varnish on the substrate 1 by spin coating or spray coating, coating with micro droplets by inkjet, etc., or thin film sheet by heat or the like. Is used.
  • the protective film 21 may be formed using a composite material or a plurality of materials as long as at least one of the above materials is included.
  • a metal mold formed of a metal material will be described as an example, but the same applies to a glass mold, a resin mold, a ceramic mold, and the like as described above.
  • Temporary grooves 22 are formed in the protective film 21 by the steps described below, and then the substrate surface 20 is exposed. Groove 10 is formed.
  • the protective film 21 needs to have a thickness that is more than a certain value so that grooves can be formed. By having a thickness equal to or greater than a certain value, groove formation is facilitated, and the force can also be prevented from peeling off the end portion of the protective film 21 serving as the groove side surface 10a from the substrate surface 20 due to this thickness.
  • the thickness of the protective film 21 may be set to a thickness exceeding 10 m with the protective film 21 attached to the substrate 1.
  • a film wound into a roll made of polyetherimide shown in Chemical Formula 2 is used.
  • This film is attached to the polyimide substrate 1 by heat lamination to form a protective film 21 on the substrate 1.
  • the protective film 21 is formed on the substrate by thermal lamination using a film wound in a roll shape as in the present embodiment. Power S can be.
  • the surface modification solution R supplied to the groove 10 does not enter the gap between the substrate 1 and the protective film 21. Furthermore, since the protective film 21 has a low affinity for the surface modification solution R, it does not react by repelling the surface modification solution R, and the portion other than the groove formed on the substrate 1 also has the surface modification solution R force. Protected. Therefore, it is possible to modify the surface of only the groove inner surface in the process described later, and it is possible to precisely form a fine conductive pattern that prevents the deposited conductive material from seeping out of the groove. Also, thermoplastic resins such as polyetherimide In this case, the groove structure can be formed by thermal transfer using a mold in the groove forming process described later, and a material removing process by laser processing or the like can be applied.
  • a temporary groove 22 is formed in the protective film 21 by a transfer process using a mold K on the wiring substrate 1 on which the protective film 21 is formed.
  • the temporary groove 22 is used to form the groove 10 in which the substrate surface 20 is exposed and filled with the surface modification solution R by a step described later.
  • the force K for forming the groove 10 can be obtained by pattern transfer of the mold K, which has been formed by finely processing the mold material Ka in advance to the protective film 21 on the wiring board 1.
  • the mold material Ka in addition to a metal material, a material such as glass, resin, or ceramic may be used. It is possible to improve productivity by coating the mold surface with a release agent or release film.
  • Examples of the release material such as a release agent and a release film include a vacuum deposition film of a fluorine resin, a coating film of a silicone resin, and a coating film of a fluorine resin.
  • the cross-sectional shape of the temporary groove 22 may be, for example, a trapezoidal shape as shown in FIG.
  • step S3 after forming the temporary groove 22 in the protective film 21 by forming a groove by transfer processing using a mold, the substrate material is used to perform surface selective surface modification of the substrate. Etching is performed to form the groove 10 exposed in the groove. This etching removes the protective film 21 until the surface 20 of the substrate is exposed to the groove bottom 10b with respect to the entire protective film 21. For example, it is performed by reactive anisotropic etching. This allows the force S to form the groove surface smoothly.
  • the groove side surface 10a ′ is within the groove 10 ′. It is formed by the surface of the polyimide substrate 1 exposed to the surface. Therefore, the surface of the groove side surface 10a ′ and the vicinity of the surface become fragile by the surface modification, and the stress ST1, 2 described above is generated on the groove side surface 10a ′. Due to this surface modification and stress ST1, 2 the groove side surface 10a 'is deformed and collapsed, and as shown in Fig.
  • Patterns may not be formed. Further, in the case of the wiring board 1 designed with a narrow pitch between adjacent grooves 10 'and designed to have a fine pitch, there is a possibility that the groove side face 10a' may be joined to other adjacent grooves and short-circuited.
  • the groove 10 is formed.
  • the surface 20 is only the groove bottom portion 10b, and the groove side surface 10a is formed by the protective film 21. Since the protective film 21 protects the substrate 1 without repelling and reacting with the surface modification solution R as described above, the surface modification is performed only on the groove bottom 10b, and the groove side surface 10a is modified on the surface. There is no quality. Therefore, on the groove side surface 10a, the subsequent ion exchange reaction and stress ST1, 2 force S due to the thickening of the film do not occur, and the collapse of the groove side surface 10a 'is suppressed.
  • the provisional groove 22 is formed in the protective film 21 and the substrate surface 20 is exposed to the groove bottom 10b, so that the groove 10 can be prevented from collapsing, and the distance between adjacent grooves 10 can be reduced. Even narrow and fine conductive patterns can be precisely formed.
  • this etching is not limited to the case where the substrate surface 20 is exposed, and the above-mentioned groove collapse does not occur! / If the depth is too deep, the substrate surface 20 is removed and a part of the substrate is removed.
  • a groove may be formed in the substrate 1 by exposing the substrate. Etching should be performed at least on the temporary groove 22 and its vicinity.
  • a rectangular shape as shown in Fig. 2 (c) may be used.
  • the wiring board 1 of the present invention is a high-density wiring board, and the width of the wiring circuit 8 is 50 to 111 or less, more preferably 40 to m or less, and further preferably 30 to m or less.
  • the aspect ratio of the groove is preferably 0.5 or more, more preferably 1.0 or more. If it has a large aspect ratio, it is sufficient even if the wiring width is narrow. Ability to obtain cross-sectional area. If necessary, a part of the groove 10 may penetrate the substrate 1. In this case, the wiring formed in the through portion plays a role of connecting the upper and lower wirings of the substrate 1.
  • the depth and shape of the groove 10 are not particularly limited.
  • the droplets 31 of the surface modification solution R dropped on the supply unit S are permeated into the grooves 10.
  • An inkjet or dispenser can be used for this supply.
  • the surface modification solution R is filled into the groove 10 using capillary action, and the inner surface of the groove is chemically altered.
  • the surface modification of the groove inner surface is performed by bringing a potassium hydroxide aqueous solution into contact with an ultrasonically cleaned polyimide substrate. This opens the imide group on the inner surface of the groove and introduces potassium ions. The reaction can also be promoted by heat treatment.
  • the composition of the groove inner surface is as follows. This surface modification is stopped by removing the surface modification solution R by washing with water after a lapse of time as appropriate.
  • an aqueous potassium hydroxide solution is used as the surface modification solution R.
  • a solution obtained by dissolving potassium hydroxide in ethylene glycol or tetradecane may be used.
  • all the substrate 1 is immersed in the surface modification solution R without dropping the droplets of the surface modification solution R on the supply portion at the end of the groove, and the protective film 21 The surface may be modified except for the part covered by! /.
  • the surface-modified substrate 1 is brought into contact with a copper sulfate aqueous solution (CuSO) by, for example, immersion.
  • CuSO copper sulfate aqueous solution
  • the substrate 1 on which the copper ions are fixed is immersed in an anatase type Ti colloid solution so that the photocatalyst is adsorbed in the groove 10, and further irradiated with ultraviolet rays for reduction reaction.
  • the copper thin film 30 ′ may be deposited in the groove 10 by dipping in a sodium borohydride aqueous solution or a dimethylamine borane (DMAB) aqueous solution.
  • DMAB dimethylamine borane
  • a conductive pattern is formed by performing electroless copper plating or electrolytic copper plating to increase the film thickness.
  • Electroless copper plating increases the thickness of copper by staking in areas where copper has been deposited by reduction treatment by immersing it in a copper electroless plating bath.
  • the power to do S Combined with electrical plating, it can shorten the film growth time and improve the flatness of the plating deposit surface.
  • the electroless plating method or the electrolysis plating method following the electroless plating method described above deposits the conductive material in the opening of the groove structure at the position where the metal is deposited, there are few steps. Thus, the electroless plating method is preferable.
  • copper was deposited as a conductive substance
  • metals such as silver, gold, platinum, and nickel are not limited to copper.
  • the plating method is carried out under the conditions normally performed by those skilled in the art. Typically, the entire substrate 1 is immersed in a plating solution containing these metals, and the metal is deposited in the groove 10 from the bottom to the opening.
  • an electric circuit made of a conductive material is formed on the substrate, and an electric circuit component is obtained.
  • the groove 10 is provided with a first groove 11 that is routed around the wiring board 1 and forms most of the wiring circuit, and an end portion or an intermediate portion of the first groove 11 to supply the supply portion S.
  • a surrounding second groove 12 and a third groove 13 located inside the second groove 12 are provided.
  • the first groove 11, the second groove 12, and the third groove 13 communicate with each other, and the ink droplet 31 that has been dropped onto the supply section S passes through the second groove 12 and the third groove 13, and the second groove 12.
  • the wiring circuit 8 is formed by supplying the first groove 11 without waste without diffusing outside. 2 to 11, the display of the protective film 21 may be omitted.
  • the wiring board 1 in the present invention is finally bonded to a plurality of solder balls 41 provided on the mounting element 40.
  • the supply unit S has a receiving unit 50 for receiving the solder ball 41 in the vicinity thereof.
  • the receiving part 50 is a ball hole 51 formed in the vicinity of the supply part S, and the positional relationship between the supply part S and the solder ball 41 is fixed by receiving the solder ball 41 in the ball hole 51.
  • a plurality of solder balls 41 are formed on one surface of the element body 42 to realize electrical bonding to the element body 42. When heat is applied to the solder balls 41 in this state, the solder balls 41 are melted to become the molten solder 43, and are slightly diffused and joined to the conductive material 30 in the terminal groove 19.
  • step S1 of FIG. Form protective film 21.
  • steps S2 and S3 in FIG. 1 ball holes 51 are simultaneously formed on the substrate surface when the grooves 10 as the first groove 11 to the third groove 13 are formed.
  • the dimensional position between them does not get out of order, and it is possible to improve the dimensional accuracy.
  • the above-described transfer or a material removal process described later is used for the molding.
  • a droplet 31 of the surface modification solution R is dropped on the supply unit S, and the surface modification solution R is supplied to the groove 10.
  • Supply can be done using an inkjet or dispenser.
  • the terminal T is formed by the second groove 12 and the third groove 13.
  • the second groove 12 and the third groove 13 correspond to “a plurality of groove portions” adjacent to each other.
  • step S4 even if the surface modification solution R flows out to the upper surface of the protective film 21, the surface modification solution R does not cause a chemical reaction with the protective film 21 due to its low affinity.
  • the substrate surface 20 is protected from the surface modification solution R. That is, the protective film 21 has chemical resistance against the surface modification solution R.
  • the inner surface of the groove 10 is reformed, a metal is deposited through an ion exchange reaction, and the conductive material 30 is deposited by plating thickening. Therefore, according to this manufacturing method, it is possible to prevent the conductive material from being deposited outside the groove and to increase the density of the wiring. Then, the solder balls 41 of the mounting element 40 are melted by the above-described method and bonded to the wiring circuit.
  • a protective film is formed by photocuring a photocurable resin, and at the same time, a groove is formed by transfer processing using a mold.
  • a film 21 is formed on the surface 20 of the wiring board 1 using a liquid photocurable resin Pc.
  • a method of forming the film 21 spin coating, spray coating, dropping by a dispenser, coating by micro droplets by inkjet, etc. The method is used.
  • the photocurable resin Pc include acrylic resins, epoxy resins, polyester resins, and silicone resins. For example, acrylic resin is cured by light of 365 nm or less, and epoxy resin is cured by light of 200 nm to 400 nm.
  • the photocurable resin Pc is photocured to form the protective film 21 on the surface of the wiring board 1 in an adhesive state and to form the temporary grooves 22.
  • the film 21 ′ formed of the photocurable resin Pc is pressed with a mold K, and light (ultraviolet rays) U in a predetermined wavelength region that acts on curing of the photocurable resin Pc is used as a light source. Irradiate from SL. When pressing with a mold, it is better to press in a vacuum to prevent air from being caught between the photocurable resin Pc and the mold K.
  • the light source SL for example, a high-pressure mercury lamp having a strong line spectrum in the range of 365 nm and 250 nm to 320 nm is used.
  • This high-pressure mercury lamp irradiates ultraviolet rays U from above a type K as shown in FIG.
  • a material such as glass, resin, or ceramic that transmits ultraviolet light U is used as the mold material Ka. That is, in this embodiment, at least the mold K is formed so that light can be transmitted by using a light transmissive material such as glass, resin, or ceramic as the mold material Ka.
  • the irradiation conditions of the ultraviolet rays are appropriately set according to the curing conditions of the photocurable resin.
  • the photo-curable resin is an acrylic resin
  • UV light with a wavelength of 365 nm is irradiated for 10 seconds at an ultraviolet light intensity of 100 mW / cm 2 .
  • ultraviolet light with a wavelength of 365 nm is irradiated for 40 seconds at an ultraviolet illuminance of 50 mW / cm 2 .
  • the photocurable resin Pc is photocured, and the protective film 21 is formed in an adhesive state on the surface 20 of the wiring substrate 1, and the temporary groove 22 is formed by transfer using the mold K.
  • a mold release material should be formed on mold K to improve mold release. Thereby, mold release workability improves.
  • the light U is irradiated from above the mold K
  • the light U may be irradiated from the back side of the wiring board 1.
  • the wiring substrate 1 is formed thin so that the light U can be transmitted, so that at least the wiring substrate 1 is formed so that light can be transmitted.
  • the irradiation of the light U is not limited to either one of the upper side of the mold K or the rear side of the wiring board, and may be from both sides!
  • a high-pressure mercury lamp was used as the light source SL.
  • it is not limited to a high-pressure mercury lamp, and an LED that emits light in a predetermined wavelength range according to the curing conditions of the photocurable resin, such as an LED that irradiates ultraviolet rays, may be appropriately selected.
  • the photo-curable resin is not limited to those that are cured with respect to ultraviolet rays.
  • a film 21 ′ was formed using a liquid photocurable resin Pc.
  • the photocurable resin Pc is not limited to a liquid one, and the film 21 ′ may be formed by adhering a sheet-like photocurable resin Pc to the substrate surface 20.
  • a sticking process is required. Therefore, the liquid photo-curing resin Pc is dropped and applied as described above in terms of workability and productivity. Yes.
  • the temporary groove 22 is formed on the wiring board 1 on which the protective film 21 is formed by transfer processing using a mold.
  • this groove forming process is not limited to the transfer process using a mold.
  • This groove forming processing may be performed by at least one processing means selected from the group consisting of laser processing, focused ion beam (FIB) processing, and cutting processing force. Therefore, it is preferable to perform the combination appropriately.
  • laser processing include excimer laser processing, femtosecond laser processing, a combination of photolithography processing and etching processing using an Ar laser or He—Cd laser, and anisotropic etching of Si and the like.
  • the groove forming process may be a cutting process. Cutting includes milling and shearing.
  • FIB processing is suitable for processing the portion that will be the mold of the groove in which the wiring is to be formed because a pattern with a finer and sharper shape can be obtained compared to cutting and laser processing.
  • the temporary groove 22 is formed in the protective film 21 and the substrate surface 20 is exposed to form the groove 10.
  • the groove forming process is performed by laser processing to remove the protective film 21 and the substrate material on the surface of the substrate 1 to directly form the groove 10. You may make it form. In such a case, the substrate exposure step S3 can be omitted.
  • the groove 10 may collapse due to the weakening of the groove side surface 10a due to the surface modification and the stress ST1,2. Therefore, the first embodiment in which the substrate surface 20 is exposed without removing the substrate material is preferable in that the groove collapse can be prevented.
  • the substrate exposure step S3 is performed after forming the groove in the protective film 21 even in laser processing.
  • the protective film 21 may be removed at an appropriate timing after the completion of the surface modification step S5, or may be left without being removed.
  • the groove formation is not limited to laser processing, and may be performed by the above-described groove forming processing means. Further, the shape of the groove can be appropriately selected from, for example, a rectangular shape and a wedge shape shown in FIGS.
  • the groove forming step S2 at least a part of the inner surface of the groove 10 formed on the surface of the wiring substrate 1, for example, the side surfaces of FIGS. 2 (b) (c) and 6 (c) (d) 10a or the bottom surface 10b or a rough surface continuous in the longitudinal direction is formed on both the side surface 10a and the bottom surface 1 Ob.
  • the rough surface is formed on the inner surface of the groove 10 by a fault through laser processing or transfer processing.
  • a rough surface By forming a rough surface on the inner surface of the groove 10, fixing of the surface modifying solution along the longitudinal direction of the groove 10 is promoted.
  • the diffusion of the surface modification solution 30 is prevented when the surface modification solution 30 is supplied to the groove 10 in step S4, and the conductivity after the surface modification is improved.
  • the protective film forming step S1 and the groove forming step S2 may be performed integrally.
  • the protective film 21 is made of a thermoplastic resin
  • thermoplastic resin was used for the protective film 21, and a protective film was formed on the substrate 1 by heat bonding.
  • the protective film 21 is not limited to the thermoplastic resin, and the protective film 21 is formed by using a photocurable resin and bonding it to the substrate 1 by photocuring. It doesn't matter.
  • the formation of the protective film 21 is not limited to the case where the protective film 21 is directly bonded to the substrate, and an adhesive layer G is formed between the protective film 21 and the substrate 1 as shown in FIG.
  • the protective film 21 may be bonded to the substrate 1 with the adhesive layer G provided.
  • the material of the adhesive layer G is an electrically insulating material having sufficient adhesion strength with the substrate 1 and the protective film 21, and preferably has a low affinity with the surface modification solution R and is not easily eroded. Good.
  • an adhesive layer G may be either thermoplastic or thermosetting.
  • epoxy resin is used for thermosetting
  • polyether ether ketone is used as a film for thermoplastic.
  • the conductive pattern was formed in the thick film increasing step S7, in which a conductive material was deposited on the opening of the groove of the protective film 21.
  • this film increase can be adjusted as appropriate. For example, even when a part of the substrate is removed to form the groove 10, as shown in FIG. 6 (b), it reaches the surface of the protective film 21. A conductive substance may be deposited.
  • the groove is formed up to a part of the substrate! /, It is desirable that the groove does not collapse as described above, and it is desirable to keep it at a certain depth.
  • the protective film 21 is bonded to the substrate surface 20 and then the temporary groove 22 is formed.
  • the temporary groove 22 may be formed in the sheet in advance before the protective film forming step S1. As a result, the handling of the sheet is improved, and the productivity can be further improved.
  • the surface modification was performed using a solution such as an aqueous potassium hydroxide solution as the surface modification solution R.
  • the surface modification can be performed using not only a solution but also a gas, for example, alkali vapor.
  • the terminal T is located directly below the solder ball 41, and an annular ball cup 52 that protrudes from the surface 20 of the wiring board 1 around the terminal is received. Part 50 is formed.
  • the ball cup 52 has a notch 52a that passes through the first groove 11, and the surface modifying solution supplied to the supply unit S reaches the first groove 11 through the notch 52a.
  • the molten solder 43 is joined to the terminal T by melting the solder ball 41 as in the first embodiment.
  • a plurality of third grooves 13 are radiated in the second groove 12.
  • the diameter of the terminal T is almost the same as the diameter of the solder ball 41 (melted solder 43), and the molten solder 43 is connected to the second groove 12 when the solder ball 41 melts. Prevents significant spread out of T.
  • connection bump 60 which is a protrusion provided as the terminal T with respect to the first substrate lx, is connected to the second substrate ly as the terminal T. Both terminals are joined by reaching the terminal 70 through the second substrate ly.
  • the connection bump 60 of the first substrate lx has a force S for supplying the surface modification solution to the entire surface, and the connection terminal 70 of the second substrate ly is disposed in a spoke shape in the second groove 12.
  • the third groove 13 is prepared as a terminal block and joined to the connection bump 60. As shown in FIG.
  • an arcuate annular groove 14 and a linear third groove 13 are provided as terminals T on the first substrate lx, and the connection terminal 70 of the second substrate ly is shown in FIG.
  • the third groove 13 of the second substrate ly and the annular groove 14 of the first substrate lx are They will cross and join each other.
  • connection bump 60 can take various shapes that can penetrate through the portion corresponding to the terminal T, which is a through portion of the second substrate ly, and can be formed in a spoon shape, for example, as shown in FIG.
  • a mortar-shaped flow recess 60a and an upright portion 60b communicating from the substrate surface 20 of the first substrate lx to the first groove 11 are provided, and the conductive ink 30 is dropped into the flow recess 60a.
  • the first groove 11 is supplied.
  • the protective film 21 formed on the first substrate lx is left without being removed, and the first and second substrates are made to face each other and heat bonded. Therefore, both substrates can be bonded more firmly.
  • the shape of the terminal T can be variously modified.
  • the second groove 12 has a triangular shape with rounded corners.
  • the second groove 12 is triangular.
  • Various shapes can be adopted depending on the situation of the supply section S, such as square or square.
  • the multiple grooves S of the third groove 13 communicating with the first groove 11 are provided in the supply section S as “adjacent groove portions”, and the terminal grooves are absorbed by absorbing the droplets 31. Configure terminal T as 19.
  • FIG. 13 shows a modified example of the terminal T.
  • the surface modifying solution is supplied from the supply unit S provided on the right side (not shown) to the end portion ie.
  • the end portion l ie Around the end portion l ie, three projections 53 for receiving the solder balls 41 protrude from the substrate surface 20 to constitute a receiving portion 50.
  • the protrusion 53 can be formed by ink printing such as silk printing in addition to being compressed by the above-described mold.
  • FIG. 14 is also a reference example similar to FIG. 13.
  • the conductive ink 30 is printed on the end portion lie and the vicinity thereof, and the printed electrode 16 as the terminal T is formed.
  • the present invention can be used as a method for manufacturing a wiring substrate such as a high-density wiring substrate and a wiring substrate manufactured by the method.
  • a wiring substrate such as a high-density wiring substrate and a wiring substrate manufactured by the method.
  • the supply portion ink substrate may be flat or three-dimensional, and the groove may be formed in a curved surface.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

L'invention concerne une carte de connexion offrant une forte densité de connexions grâce à l'empêchement du dépôt de substances conductrices en dehors des rainures. Une solution modifiant la surface est placée dans les rainures. Une substance conductrice est déposée sur les ouvertures des rainures afin de former un dessin conducteur sur la carte. Un film protecteur (21) destiné à protéger la carte (1) contre la solution (R) modifiant la surface est appliqué sur ladite carte, par adhérence sur la surface (20) de ladite carte (1). Simultanément à l'application du film protecteur (21) sur la carte (1), des rainures sont formées dans ledit film (21) afin de mettre à nu une partie de ladite carte (1). La solution (R) modifiant la surface est placée dans les rainures (10) afin de modifier leurs surfaces intérieures. Une réaction d'échange ionique [s5] a alors lieu, ladite réaction ayant pour effet de fixer un élément métallique sur les surfaces intérieures des rainures (10), et un métal (30') est déposé [s6]. Une substance conductrice (30) est en outre déposée dans les ouvertures des rainures par placage électrolytique ou anélectrolytique [s7].
PCT/JP2007/066125 2006-08-23 2007-08-20 Procédé de fabrication d'une carte de connexion et carte de connexion correspondante WO2008023666A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2006-226218 2006-08-23
JP2006226218 2006-08-23
JP2006343419 2006-12-20
JP2006-343419 2006-12-20

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Publication Number Publication Date
WO2008023666A1 true WO2008023666A1 (fr) 2008-02-28

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WO (1) WO2008023666A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012190858A (ja) * 2011-03-08 2012-10-04 Ngk Spark Plug Co Ltd 配線基板の製造方法

Citations (6)

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Publication number Priority date Publication date Assignee Title
JP2002094218A (ja) * 2000-09-18 2002-03-29 Sankyo Kasei Co Ltd 成形回路部品の製造方法
JP2003129247A (ja) * 2001-10-22 2003-05-08 Sekisui Chem Co Ltd 樹脂表面への導電性被膜及び導電性回路パターンの形成方法
JP2003519442A (ja) * 2000-01-04 2003-06-17 エルミクロン・アクチェンゲゼルシャフト 電気接続素子を製造するための方法、設備および装置、電気接続素子ならびに半完成品
JP2005050969A (ja) * 2003-07-31 2005-02-24 Cluster Technology Co Ltd 電気回路部品およびその製造方法
JP2005079276A (ja) * 2003-08-29 2005-03-24 Matsushita Electric Ind Co Ltd 回路基板及びその製造方法
JP2006210891A (ja) * 2004-12-27 2006-08-10 Mitsuboshi Belting Ltd ポリイミド樹脂の無機薄膜パターン形成方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003519442A (ja) * 2000-01-04 2003-06-17 エルミクロン・アクチェンゲゼルシャフト 電気接続素子を製造するための方法、設備および装置、電気接続素子ならびに半完成品
JP2002094218A (ja) * 2000-09-18 2002-03-29 Sankyo Kasei Co Ltd 成形回路部品の製造方法
JP2003129247A (ja) * 2001-10-22 2003-05-08 Sekisui Chem Co Ltd 樹脂表面への導電性被膜及び導電性回路パターンの形成方法
JP2005050969A (ja) * 2003-07-31 2005-02-24 Cluster Technology Co Ltd 電気回路部品およびその製造方法
JP2005079276A (ja) * 2003-08-29 2005-03-24 Matsushita Electric Ind Co Ltd 回路基板及びその製造方法
JP2006210891A (ja) * 2004-12-27 2006-08-10 Mitsuboshi Belting Ltd ポリイミド樹脂の無機薄膜パターン形成方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012190858A (ja) * 2011-03-08 2012-10-04 Ngk Spark Plug Co Ltd 配線基板の製造方法

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