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WO2008099663A1 - Method of working workpiece of highly brittle nonmetallic material and apparatus therefor - Google Patents

Method of working workpiece of highly brittle nonmetallic material and apparatus therefor Download PDF

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Publication number
WO2008099663A1
WO2008099663A1 PCT/JP2008/051193 JP2008051193W WO2008099663A1 WO 2008099663 A1 WO2008099663 A1 WO 2008099663A1 JP 2008051193 W JP2008051193 W JP 2008051193W WO 2008099663 A1 WO2008099663 A1 WO 2008099663A1
Authority
WO
WIPO (PCT)
Prior art keywords
region
scribe
heating
line
irradiating
Prior art date
Application number
PCT/JP2008/051193
Other languages
French (fr)
Japanese (ja)
Inventor
Hiroshi Fujimura
Toshifumi Yonai
Kenichi Ohmori
Masahiro Kozawa
Yasuhito Mochizuki
Original Assignee
The Japan Steel Works, Ltd.
Joyo Engineering Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by The Japan Steel Works, Ltd., Joyo Engineering Co., Ltd. filed Critical The Japan Steel Works, Ltd.
Publication of WO2008099663A1 publication Critical patent/WO2008099663A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • C03B33/093—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam using two or more focussed radiation beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)

Abstract

Scribe crack resulting from growth of scribe line cannot be formed to a desirable depth through sequentially forming of a heating region, cooling region and reheating region. Accordingly, there is provided a method comprising, sequentially performed, the first step of irradiating heating region (3) with a heating energy with its intensity controlled and conducting scanning along predetermined working line (2b); the second step of irradiating cooling region (4a) positioned posteriorly in the direction of relative movement of the heating region (3) of the first step with cold energy and conducting scanning along the predetermined working line (2b) to thereby form a scribe line; and the third step of irradiating reheating region (5a) positioned posteriorly in the direction of relative movement of the cooling region (4a) of the second step with a heating energy with its intensity controlled and conducting scanning along the predetermined working line (2b) to thereby form a scribe line, wherein in order to form scribe crack (5b) resulting from growth of the scribe line to a desirable depth, the heating energy quantity (P) per area of the reheating region (5a) of the third step is regulated in accordance with a depth characteristic formula for the scribe crack (5b).
PCT/JP2008/051193 2007-01-31 2008-01-28 Method of working workpiece of highly brittle nonmetallic material and apparatus therefor WO2008099663A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-020864 2007-01-31
JP2007020864A JP2008183599A (en) 2007-01-31 2007-01-31 Method for working workpiece made of highly brittle and non-metallic material, and device therefor

Publications (1)

Publication Number Publication Date
WO2008099663A1 true WO2008099663A1 (en) 2008-08-21

Family

ID=39689909

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/051193 WO2008099663A1 (en) 2007-01-31 2008-01-28 Method of working workpiece of highly brittle nonmetallic material and apparatus therefor

Country Status (3)

Country Link
JP (1) JP2008183599A (en)
TW (1) TW200914190A (en)
WO (1) WO2008099663A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014218428A (en) * 2007-11-15 2014-11-20 フライベルガー・コンパウンド・マテリアルズ・ゲゼルシャフト・ミット・ベシュレンクテル・ハフツングＦｒｅｉｂｅｒｇｅｒ Ｃｏｍｐｏｕｎｄ Ｍａｔｅｒｉａｌｓ Ｇｍｂｈ Single crystal

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009530222A (en) * 2006-03-24 2009-08-27 ケー−エング カンパニー リミテッド Glass cutting device having bending section and glass cutting method using the same
JP2008246808A (en) * 2007-03-30 2008-10-16 Japan Steel Works Ltd:The Processing method for workpiece made of high brittle non-metal material and device thereof
JP2010089143A (en) * 2008-10-10 2010-04-22 Mitsuboshi Diamond Industrial Co Ltd Method and device for cutting brittle material substrate
JP2010090010A (en) * 2008-10-10 2010-04-22 Mitsuboshi Diamond Industrial Co Ltd Method for cutting brittle material substrate and cutting device
JP5416386B2 (en) * 2008-10-24 2014-02-12 三星ダイヤモンド工業株式会社 Scribing method for thin glass substrate
WO2010135614A1 (en) 2009-05-21 2010-11-25 Corning Incorporated Thin substrates having mechanically durable edges
JP5627201B2 (en) * 2009-06-17 2014-11-19 三星ダイヤモンド工業株式会社 Cleaving method of brittle material substrate

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001179473A (en) * 1999-12-24 2001-07-03 Semiconductor Energy Lab Co Ltd Laser beam device, method of cutting substrate by using laser beam, and method of manufacturing semiconductor device
WO2003013816A1 (en) * 2001-08-10 2003-02-20 Mitsuboshi Diamond Industrial Co., Ltd. Method and device for scribing brittle material substrate
WO2003026861A1 (en) * 2001-09-21 2003-04-03 Mitsuboshi Diamond Industrial Co., Ltd. Method for scribing substrate of brittle material and scriber
JP2003321234A (en) * 2000-12-01 2003-11-11 Lg Electronics Inc Method and device for cutting glass

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000247671A (en) * 1999-03-04 2000-09-12 Takatori Corp Method for cutting glass
US6489588B1 (en) * 1999-11-24 2002-12-03 Applied Photonics, Inc. Method and apparatus for separating non-metallic materials
KR100673073B1 (en) * 2000-10-21 2007-01-22 삼성전자주식회사 Method and Apparatus for cutting non-metal substrate using a laser beam
JP3792639B2 (en) * 2002-11-08 2006-07-05 株式会社日本エミック Cutting device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001179473A (en) * 1999-12-24 2001-07-03 Semiconductor Energy Lab Co Ltd Laser beam device, method of cutting substrate by using laser beam, and method of manufacturing semiconductor device
JP2003321234A (en) * 2000-12-01 2003-11-11 Lg Electronics Inc Method and device for cutting glass
WO2003013816A1 (en) * 2001-08-10 2003-02-20 Mitsuboshi Diamond Industrial Co., Ltd. Method and device for scribing brittle material substrate
WO2003026861A1 (en) * 2001-09-21 2003-04-03 Mitsuboshi Diamond Industrial Co., Ltd. Method for scribing substrate of brittle material and scriber

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014218428A (en) * 2007-11-15 2014-11-20 フライベルガー・コンパウンド・マテリアルズ・ゲゼルシャフト・ミット・ベシュレンクテル・ハフツングＦｒｅｉｂｅｒｇｅｒ Ｃｏｍｐｏｕｎｄ Ｍａｔｅｒｉａｌｓ Ｇｍｂｈ Single crystal

Also Published As

Publication number Publication date
TW200914190A (en) 2009-04-01
JP2008183599A (en) 2008-08-14

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