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WO2008096714A1 - 樹脂封止発光素子、平面状光源及びそれらの製造方法、並びに液晶表示装置 - Google Patents

樹脂封止発光素子、平面状光源及びそれらの製造方法、並びに液晶表示装置 Download PDF

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Publication number
WO2008096714A1
WO2008096714A1 PCT/JP2008/051781 JP2008051781W WO2008096714A1 WO 2008096714 A1 WO2008096714 A1 WO 2008096714A1 JP 2008051781 W JP2008051781 W JP 2008051781W WO 2008096714 A1 WO2008096714 A1 WO 2008096714A1
Authority
WO
WIPO (PCT)
Prior art keywords
emitting element
light emitting
resin
light source
sealed
Prior art date
Application number
PCT/JP2008/051781
Other languages
English (en)
French (fr)
Inventor
Shunji Watanabe
Masayuki Shijo
Kaori Ezura
Yoshinobu Ezura
Original Assignee
Nikon Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corporation filed Critical Nikon Corporation
Priority to JP2008557105A priority Critical patent/JPWO2008096714A1/ja
Publication of WO2008096714A1 publication Critical patent/WO2008096714A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Planar Illumination Modules (AREA)

Abstract

　発光素子と、該発光素子から発される光束を制御可能な形状に成形された、熱可塑性樹脂からなる光束制御部材とを、前記発光素子の光出射面と前記光束制御部材の光入射面の間に硬化性樹脂を介在させた状態で、前記硬化性樹脂を硬化させて接合する、樹脂封止発光素子の製造方法。
PCT/JP2008/051781 2007-02-05 2008-02-04 樹脂封止発光素子、平面状光源及びそれらの製造方法、並びに液晶表示装置 WO2008096714A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008557105A JPWO2008096714A1 (ja) 2007-02-05 2008-02-04 樹脂封止発光素子、平面状光源及びそれらの製造方法、並びに液晶表示装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007024972 2007-02-05
JP2007-024972 2007-02-05

Publications (1)

Publication Number Publication Date
WO2008096714A1 true WO2008096714A1 (ja) 2008-08-14

Family

ID=39681623

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/051781 WO2008096714A1 (ja) 2007-02-05 2008-02-04 樹脂封止発光素子、平面状光源及びそれらの製造方法、並びに液晶表示装置

Country Status (2)

Country Link
JP (1) JPWO2008096714A1 (ja)
WO (1) WO2008096714A1 (ja)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011016269A1 (ja) * 2009-08-07 2011-02-10 シャープ株式会社 レンズ、発光モジュール、発光素子パッケージ、照明装置、表示装置、およびテレビ受像装置
WO2012033180A1 (ja) * 2010-09-08 2012-03-15 三菱化学株式会社 発光装置、照明装置、及びレンズ
JP2012234947A (ja) * 2011-04-28 2012-11-29 Mitsubishi Chemicals Corp 半導体発光装置用樹脂パッケージ及び該樹脂パッケージを有してなる半導体発光装置並びにそれらの製造方法
KR20150092598A (ko) * 2014-02-05 2015-08-13 엘지이노텍 주식회사 발광 소자 패키지 및 이를 포함하는 조명 장치
KR20150092596A (ko) * 2014-02-05 2015-08-13 엘지이노텍 주식회사 발광 소자 패키지 및 이를 포함하는 조명 장치
KR20150092597A (ko) * 2014-02-05 2015-08-13 엘지이노텍 주식회사 발광 소자 패키지 및 이를 포함하는 조명 장치
JP2015195407A (ja) * 2009-07-22 2015-11-05 フィリップス ルミレッズ ライティング カンパニー リミテッド ライアビリティ カンパニー 発光ダイオードパッケージ及びその製造方法
JP2016206633A (ja) * 2015-04-21 2016-12-08 隆達電子股▲ふん▼有限公司 発光装置及びそのレンズ構造

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5092665U (ja) * 1973-12-27 1975-08-05
JPH05291627A (ja) * 1992-04-10 1993-11-05 Iwasaki Electric Co Ltd 発光ダイオード
JPH0653554A (ja) * 1992-07-28 1994-02-25 Rohm Co Ltd 光半導体デバイス
JPH098357A (ja) * 1995-06-16 1997-01-10 Rohm Co Ltd 発光装置およびその製造方法
JP2001279585A (ja) * 2000-03-29 2001-10-10 Asahi Lite Optical Co Ltd 着色高屈折率プラスチックレンズの製造方法
JP3101037U (ja) * 2002-11-26 2004-06-03 玄基光電半導體股▲ふん▼有限公司 表面実装型発光ダイオード
WO2005025831A1 (en) * 2003-09-09 2005-03-24 Cree, Inc. Transmissive optical elements including transparent plastic shell having a phosphor dispersed therein, and methods of fabricating same
JP2006310710A (ja) * 2005-05-02 2006-11-09 Sony Corp 半導体発光素子
JP2006525682A (ja) * 2003-04-30 2006-11-09 クリー　インコーポレイテッド 高出力固体発光素子パッケージ
JP2006319149A (ja) * 2005-05-13 2006-11-24 Sony Corp 光源装置およびその製造方法並びに光源装置を用いた表示装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0563343A (ja) * 1991-08-30 1993-03-12 Techno Sunstar Kk 電子部品実装方法
JP2000282442A (ja) * 1999-03-30 2000-10-10 Ube Nitto Kasei Co Ltd 繊維強化樹脂製仕切板

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5092665U (ja) * 1973-12-27 1975-08-05
JPH05291627A (ja) * 1992-04-10 1993-11-05 Iwasaki Electric Co Ltd 発光ダイオード
JPH0653554A (ja) * 1992-07-28 1994-02-25 Rohm Co Ltd 光半導体デバイス
JPH098357A (ja) * 1995-06-16 1997-01-10 Rohm Co Ltd 発光装置およびその製造方法
JP2001279585A (ja) * 2000-03-29 2001-10-10 Asahi Lite Optical Co Ltd 着色高屈折率プラスチックレンズの製造方法
JP3101037U (ja) * 2002-11-26 2004-06-03 玄基光電半導體股▲ふん▼有限公司 表面実装型発光ダイオード
JP2006525682A (ja) * 2003-04-30 2006-11-09 クリー　インコーポレイテッド 高出力固体発光素子パッケージ
WO2005025831A1 (en) * 2003-09-09 2005-03-24 Cree, Inc. Transmissive optical elements including transparent plastic shell having a phosphor dispersed therein, and methods of fabricating same
JP2006310710A (ja) * 2005-05-02 2006-11-09 Sony Corp 半導体発光素子
JP2006319149A (ja) * 2005-05-13 2006-11-24 Sony Corp 光源装置およびその製造方法並びに光源装置を用いた表示装置

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015195407A (ja) * 2009-07-22 2015-11-05 フィリップス ルミレッズ ライティング カンパニー リミテッド ライアビリティ カンパニー 発光ダイオードパッケージ及びその製造方法
WO2011016269A1 (ja) * 2009-08-07 2011-02-10 シャープ株式会社 レンズ、発光モジュール、発光素子パッケージ、照明装置、表示装置、およびテレビ受像装置
WO2012033180A1 (ja) * 2010-09-08 2012-03-15 三菱化学株式会社 発光装置、照明装置、及びレンズ
JP2012109532A (ja) * 2010-09-08 2012-06-07 Mitsubishi Chemicals Corp 発光装置、照明装置、及びレンズ
US8814385B2 (en) 2010-09-08 2014-08-26 Mitsubishi Chemical Corporation Light-emitting apparatus, lighting apparatus and lens
JP2012234947A (ja) * 2011-04-28 2012-11-29 Mitsubishi Chemicals Corp 半導体発光装置用樹脂パッケージ及び該樹脂パッケージを有してなる半導体発光装置並びにそれらの製造方法
KR20150092596A (ko) * 2014-02-05 2015-08-13 엘지이노텍 주식회사 발광 소자 패키지 및 이를 포함하는 조명 장치
KR20150092597A (ko) * 2014-02-05 2015-08-13 엘지이노텍 주식회사 발광 소자 패키지 및 이를 포함하는 조명 장치
KR20150092598A (ko) * 2014-02-05 2015-08-13 엘지이노텍 주식회사 발광 소자 패키지 및 이를 포함하는 조명 장치
KR102131771B1 (ko) * 2014-02-05 2020-07-08 엘지이노텍 주식회사 발광 소자 패키지 및 이를 포함하는 조명 장치
KR102140226B1 (ko) * 2014-02-05 2020-07-31 엘지이노텍 주식회사 발광 소자 패키지 및 이를 포함하는 조명 장치
KR102154061B1 (ko) * 2014-02-05 2020-09-09 엘지이노텍 주식회사 발광 소자 패키지 및 이를 포함하는 조명 장치
JP2016206633A (ja) * 2015-04-21 2016-12-08 隆達電子股▲ふん▼有限公司 発光装置及びそのレンズ構造
US9903559B2 (en) 2015-04-21 2018-02-27 Lextar Electronics Corporation Lighting apparatus and lens structure thereof

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