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WO2008093463A1 - 撮像装置及び携帯端末 - Google Patents

撮像装置及び携帯端末 Download PDF

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Publication number
WO2008093463A1
WO2008093463A1 PCT/JP2007/073046 JP2007073046W WO2008093463A1 WO 2008093463 A1 WO2008093463 A1 WO 2008093463A1 JP 2007073046 W JP2007073046 W JP 2007073046W WO 2008093463 A1 WO2008093463 A1 WO 2008093463A1
Authority
WO
WIPO (PCT)
Prior art keywords
barrel
lens
imaging apparatus
optical member
vent
Prior art date
Application number
PCT/JP2007/073046
Other languages
English (en)
French (fr)
Inventor
Shigenori Kiyosue
Yoshito Katagiri
Original Assignee
Konica Minolta Opto, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Konica Minolta Opto, Inc. filed Critical Konica Minolta Opto, Inc.
Priority to JP2008517668A priority Critical patent/JP4162038B2/ja
Publication of WO2008093463A1 publication Critical patent/WO2008093463A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B9/00—Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or -
    • G02B9/02—Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or - having one + component only
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B9/00—Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or -
    • G02B9/04—Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or - having two components only
    • G02B9/06—Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or - having two components only two + components
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B9/00—Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or -
    • G02B9/12—Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or - having three components only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Studio Devices (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Lens Barrels (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)

Abstract

　本発明は、鏡胴内に形成された空間内の空気が高温に上昇して膨張し光学性能に悪影響を及ぼすことを簡単な構成で防止した撮像装置を提供する。この撮像装置は、光学部材を直接的若しくは間接的に保持する鏡胴と、撮像素子を内包するパッケージセンサと、金属から形成され前記鏡胴を被覆するシールドケースと、を有し、前記光学部材と前記鏡胴、及び前記鏡胴と前記パッケージセンサを接着剤にて接合し互いの間隙を封止することにより、前記光学部材、前記鏡胴及び前記パッケージセンサによって囲まれた気密空間を形成し、該気密空間と前記鏡胴の外部とが通気可能な通気孔を前記鏡胴に穿設し、該通気孔の開口部を前記シールドケースによって被覆したことを特徴とする。
PCT/JP2007/073046 2007-02-01 2007-11-29 撮像装置及び携帯端末 WO2008093463A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008517668A JP4162038B2 (ja) 2007-02-01 2007-11-29 撮像装置及び携帯端末

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007022785 2007-02-01
JP2007-022785 2007-02-01

Publications (1)

Publication Number Publication Date
WO2008093463A1 true WO2008093463A1 (ja) 2008-08-07

Family

ID=39673779

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/073046 WO2008093463A1 (ja) 2007-02-01 2007-11-29 撮像装置及び携帯端末

Country Status (2)

Country Link
JP (1) JP4162038B2 (ja)
WO (1) WO2008093463A1 (ja)

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011101091A (ja) * 2009-11-04 2011-05-19 Konica Minolta Opto Inc 撮像装置
EP2372427A1 (en) * 2010-03-31 2011-10-05 Ricoh Company, Ltd. Imaging Apparatus
JP2011205221A (ja) * 2010-03-24 2011-10-13 Toshiba Corp カメラモジュール
JP2011209417A (ja) * 2010-03-29 2011-10-20 Ricoh Co Ltd 撮像装置
JPWO2012008268A1 (ja) * 2010-07-14 2013-09-09 コニカミノルタ株式会社 撮像装置及びその製造方法
CN105093461A (zh) * 2015-07-13 2015-11-25 南昌欧菲光电技术有限公司 摄像头模组
WO2016084394A1 (ja) * 2014-11-27 2016-06-02 パナソニックＩｐマネジメント株式会社 撮像装置
CN107210307A (zh) * 2015-02-16 2017-09-26 索尼公司 相机模块和电子设备
CN107920194A (zh) * 2017-12-19 2018-04-17 广东欧珀移动通信有限公司 摄像头的镜头组件、摄像头及电子设备
CN108174064A (zh) * 2017-12-19 2018-06-15 广东欧珀移动通信有限公司 摄像头的镜头组件、摄像头及电子设备
JP2018194573A (ja) * 2017-05-12 2018-12-06 マクセル株式会社 レンズユニット
FR3078855A1 (fr) * 2018-03-08 2019-09-13 St Microelectronics Grenoble 2 Sas Capot d'encapsulation pour boitier electronique et procede de fabrication
FR3086459A1 (fr) * 2018-09-25 2020-03-27 Stmicroelectronics (Grenoble 2) Sas Dispositif electronique comprenant une puce optique et procede de fabrication
US10923638B2 (en) 2018-09-25 2021-02-16 Stmicroelectronics (Grenoble 2) Sas Electronic device comprising an optical chip and method of fabrication
JP2021043354A (ja) * 2019-09-11 2021-03-18 株式会社デンソー カメラモジュール
FR3118294A1 (fr) * 2020-12-18 2022-06-24 Stmicroelectronics (Grenoble 2) Sas Dispositif optoélectronique
US11493831B2 (en) * 2019-09-18 2022-11-08 Gopro, Inc. Breathable membrane for lens assembly having a second lens barrel positioned within and removeable from a first lens barrel

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005020229A (ja) * 2003-06-25 2005-01-20 Konica Minolta Opto Inc 撮像ユニット
JP2005039152A (ja) * 2003-07-18 2005-02-10 Shinko Electric Ind Co Ltd 半導体装置の製造方法
JP3123662U (ja) * 2006-03-28 2006-07-27 勝開科技股▲ふん▼有限公司 通気孔を備えた画像センサーモジュール

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005020229A (ja) * 2003-06-25 2005-01-20 Konica Minolta Opto Inc 撮像ユニット
JP2005039152A (ja) * 2003-07-18 2005-02-10 Shinko Electric Ind Co Ltd 半導体装置の製造方法
JP3123662U (ja) * 2006-03-28 2006-07-27 勝開科技股▲ふん▼有限公司 通気孔を備えた画像センサーモジュール

Cited By (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011101091A (ja) * 2009-11-04 2011-05-19 Konica Minolta Opto Inc 撮像装置
JP2011205221A (ja) * 2010-03-24 2011-10-13 Toshiba Corp カメラモジュール
JP2011209417A (ja) * 2010-03-29 2011-10-20 Ricoh Co Ltd 撮像装置
EP2372427A1 (en) * 2010-03-31 2011-10-05 Ricoh Company, Ltd. Imaging Apparatus
US9019378B2 (en) 2010-03-31 2015-04-28 Ricoh Company, Ltd. Imaging apparatus including a lens barrel holding an optical element
JPWO2012008268A1 (ja) * 2010-07-14 2013-09-09 コニカミノルタ株式会社 撮像装置及びその製造方法
JPWO2016084394A1 (ja) * 2014-11-27 2017-08-24 パナソニックＩｐマネジメント株式会社 撮像装置
WO2016084394A1 (ja) * 2014-11-27 2016-06-02 パナソニックＩｐマネジメント株式会社 撮像装置
CN107003495A (zh) * 2014-11-27 2017-08-01 松下知识产权经营株式会社 成像设备
CN107210307B (zh) * 2015-02-16 2021-05-14 索尼公司 相机模块和电子设备
CN107210307A (zh) * 2015-02-16 2017-09-26 索尼公司 相机模块和电子设备
CN105093461A (zh) * 2015-07-13 2015-11-25 南昌欧菲光电技术有限公司 摄像头模组
EP3623855A4 (en) * 2017-05-12 2021-02-24 Maxell, Ltd. LENS UNIT
JP2018194573A (ja) * 2017-05-12 2018-12-06 マクセル株式会社 レンズユニット
CN110603470A (zh) * 2017-05-12 2019-12-20 麦克赛尔株式会社 透镜单元
US11169355B2 (en) 2017-05-12 2021-11-09 Maxell, Ltd. Lens unit
CN110603470B (zh) * 2017-05-12 2022-01-04 麦克赛尔株式会社 透镜单元
CN107920194B (zh) * 2017-12-19 2020-03-20 Oppo广东移动通信有限公司 摄像头的镜头组件、摄像头及电子设备
CN108174064A (zh) * 2017-12-19 2018-06-15 广东欧珀移动通信有限公司 摄像头的镜头组件、摄像头及电子设备
CN107920194A (zh) * 2017-12-19 2018-04-17 广东欧珀移动通信有限公司 摄像头的镜头组件、摄像头及电子设备
FR3078855A1 (fr) * 2018-03-08 2019-09-13 St Microelectronics Grenoble 2 Sas Capot d'encapsulation pour boitier electronique et procede de fabrication
FR3086459A1 (fr) * 2018-09-25 2020-03-27 Stmicroelectronics (Grenoble 2) Sas Dispositif electronique comprenant une puce optique et procede de fabrication
US10923638B2 (en) 2018-09-25 2021-02-16 Stmicroelectronics (Grenoble 2) Sas Electronic device comprising an optical chip and method of fabrication
US11609402B2 (en) 2018-09-25 2023-03-21 Stmicroelectronics (Grenoble 2) Sas Electronic device comprising an optical chip and method of fabrication
US12066678B2 (en) 2018-09-25 2024-08-20 Stmicroelectronics (Grenoble 2) Sas Method of fabricating an electronic device comprising an optical chip
JP2021043354A (ja) * 2019-09-11 2021-03-18 株式会社デンソー カメラモジュール
JP7294014B2 (ja) 2019-09-11 2023-06-20 株式会社デンソー カメラモジュール
US11493831B2 (en) * 2019-09-18 2022-11-08 Gopro, Inc. Breathable membrane for lens assembly having a second lens barrel positioned within and removeable from a first lens barrel
US11740416B2 (en) 2020-12-18 2023-08-29 Stmicroelectronics (Grenoble 2) Sas Optoelectronic device
FR3118294A1 (fr) * 2020-12-18 2022-06-24 Stmicroelectronics (Grenoble 2) Sas Dispositif optoélectronique

Also Published As

Publication number Publication date
JPWO2008093463A1 (ja) 2010-05-20
JP4162038B2 (ja) 2008-10-08

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