WO2008062812A1 - Light emitting device and surface light emitting device - Google Patents

Abstract

It is an object to make a light emitting device provided with a solid state light emitting element thin in thickness. A plurality of LED chips are directly linearly mounted on a wiring board (30) on which a wiring pattern is formed to supply each LED chip (31) with electric power. The wiring board (30) is comprised of a base member (30a) on which each LED chip (31) is mounted and first and second side walls (30b) and (30c) formed in a curve with respect to the base member (30a). Each LED chip (31) is set at the inside of a recess portion formed in the wiring board (30). In the inside of the recess portion formed in the wiring board (30), a resist layer (34) to reflect light projected from each LED chip (31) is coated on the first and second side walls (30b) and (30c). Further, the inside of the recess portion of the wiring board (30) is sealed by a sealing member (33a) on which a half-cylindrical lens (33b) is set.

Description

 Specification

 Light emitting device and surface light emitting device

 Technical field

 TECHNICAL FIELD [0001] The present invention relates to a light emitting device and a surface light emitting device, and more particularly to a light emitting device including a solid light emitting element.

 Background art

 In recent years, for example, in a display device such as a liquid crystal display device typified by a liquid crystal television or a liquid crystal monitor, a backlight device has been adopted as a light emitting device in order to irradiate light from the back surface or the side surface of the display panel. . As this backlight device, a light source is installed on two sides or one side of a transparent resin light guide plate, and the light incident on the light guide plate is reflected by a reflecting portion provided on the back surface of the light guide plate, so that the liquid crystal panel surface is reflected. There is a so-called edge light (side light) type to be irradiated.

 As such a backlight device, it is common to use a fluorescent tube of a hot cathode type or a cold cathode type. On the other hand, as an alternative to a backlight device using such a fluorescent tube, a backlight device that uses a light emitting diode (LED), which is one of solid-state light emitting elements, as a light source in recent years. Technology development is underway.

 As a sidelight type backlight device using light emitting diodes, a light source in which a plurality of light emitting diodes are mounted on a substrate is arranged on one side of a light guide plate is known (for example, a patent). Reference 1). In addition, a light emitting element array module in which a plurality of light emitting elements are mounted on a substrate is disposed on the bottom wall of the metal plate on which the first side wall, the second side wall, and the bottom wall are formed by bending. One in which a reflecting plate is formed on a first side wall and a second side wall is known (for example, see Patent Document 2).

 [0004] Patent Document 1: Japanese Patent Laid-Open No. 6-3527

 Patent Document 2: JP-A-2006-310221

 Disclosure of the invention

 Problems to be solved by the invention

By the way, in the backlight device described above, each light emitting diode and a power source are connected to the substrate. Wiring for doing this is formed. In particular, recently, the number of light-emitting diodes mounted on the substrate has been increasing in order to meet the demand for larger display panels and higher image quality, and the number of wirings formed on the substrate has increased accordingly. ing. As the number of wirings formed on the substrate increases in this way, the area required for routing the wirings increases. Here, as a technique for increasing the area necessary for routing the wiring, for example, the area of the substrate itself may be increased, or the number of wiring layers on the substrate may be increased.

 However, for example, when the former method is adopted, the width of the substrate, that is, the thickness in the direction perpendicular to the surface of the display panel of the backlight device increases, and as a result, the thickness of the display device also increases. Will end up. On the other hand, when the latter method is adopted, for example, the problem like the former will surely occur, but the number of wiring layers increases, leading to an increase in the manufacturing cost of the substrate.

 [0007] The present invention has been made against the background of the above-described technique, and an object thereof is to reduce the thickness of a light-emitting device including a solid-state light-emitting element.

 Means for solving the problem

[0008] For this purpose, a light emitting device to which the present invention is applied has a concave cross-section, and a wiring board on which wiring is formed, and is mounted directly inside the concave part of the wiring board and connected to the wiring. And a reflecting member that is formed inside the concave portion of the wiring board and reflects light emitted from the solid light emitting element.

[0009] Such a light emitting device may further include a protective member that is provided inside the concave portion of the wiring board and protects the solid light emitting element. Also, it is necessary to use the force S to make the wiring board bend! /.

[0010] From another viewpoint, the present invention provides a surface light emitting device that includes a light guide plate that emits light incident from the side surface to the upper surface side, and a light source that irradiates light to the light guide plate from the side surface of the light guide plate. Therefore, the light source has a plurality of solid-state light emitting elements arranged along the side surface of the light guide plate, and a concave portion that is bent so that a facing portion between the side surface of the light guide plate becomes a valley, and inside the concave portion. A plurality of solid state light emitting devices are mounted directly and provided with a wiring for supplying power to the plurality of solid state light emitting devices, and inside a recess formed in the substrate, and are output from the plurality of solid state light emitting devices. And a reflective layer that reflects the emitted light toward the light guide plate.

In such a surface light emitting device, the substrate includes a base portion on which a plurality of solid state light emitting elements are directly mounted, a first side wall projecting from one end portion side of the base portion toward the side surface of the light guide plate, and other base portions. And a second side wall projecting from the end side to the side surface of the light guide plate, and the reflective layer may be formed on the first side wall and the second side wall. The substrate includes a base on which a plurality of solid state light emitting devices are directly mounted, a first side wall projecting from one end of the base toward the side of the light guide plate, and a side of the light guide plate from the other end of the base. The second side wall protrudes from the first side wall, and the protrusion length of the second side wall is set larger than that of the first side wall, and wiring is formed on the base and the second side wall, but wiring is not formed on the first side wall. Can be characterized. Further, the plurality of solid state light emitting elements are composed of a red light emitting element that emits red light, a green light emitting element that emits green light, and a blue light emitting element that emits blue light in order. I can do it. Furthermore, the wiring can be characterized by feeding two or more solid state light emitting devices per system. Further, it may be characterized in that two or more solid-state light emitting elements fed by one line of wiring are not adjacent to each other. Furthermore, the wiring can be performed with a special force S to supply power to a plurality of solid state light emitting devices by combining series connection and parallel connection.

 The invention's effect

 [0012] According to the present invention, it is possible to reduce the thickness of a light emitting device including a solid light emitting element.

 BEST MODE FOR CARRYING OUT THE INVENTION

 Hereinafter, the best mode for carrying out the present invention (hereinafter referred to as an embodiment) will be described in detail with reference to the accompanying drawings.

 FIG. 1 is a diagram showing an overall configuration of a liquid crystal display device to which the present embodiment is applied. The liquid crystal display device to which the present embodiment is applied includes a liquid crystal display module 50 and a backlight device 10 provided on the back side (lower side in FIG. 1) of the liquid crystal display module 50. In this embodiment, a side-edge type backlight device 10 is used.

The backlight device 10 as a surface light emitting device includes a light emitting module 11, a light guide plate 12, a reflection plate 13, a diffusion plate 14, prism sheets 15 and 16, and a brightness enhancement film 17. A light emitting module 11 as a light emitting device or a light source is disposed to face a side surface of one side (long side) of the light guide plate 12. In the present embodiment, the light emitting module 11 is configured by arranging a plurality of LED chips that emit light of each color of red (R), green (G), and blue (B). The configuration of the light emitting module 11 will be described later in detail.

 The light guide plate 12 has a rectangular shape corresponding to the liquid crystal panel 51, and is made of, for example, an acrylic resin having excellent light transmittance. On the surface opposite to the surface of the light guide plate 12 facing the liquid crystal display module 50, reflective dots (both not shown) made of unevenness or white ink are formed.

 The reflection plate 13 is disposed in close contact with the dot formation surface side of the light guide plate 12. The reflecting plate 13 is composed of a white plate or a plate having a metallic luster.

 The diffusion plate 14 is disposed in close contact with the surface of the light guide plate 12 opposite to the reflection plate 13. The diffusing plate 14 is, for example, a plate or a film made of a laminate of optical films. The prism sheets 15 and 16 are provided on the upper part of the reflection plate 13 (side closer to the liquid crystal display module 50). The prism sheets 15 and 16 are composed of diffraction grating films in directions orthogonal to each other.

 The brightness enhancement film 17 is composed of, for example, a PCF (Polarization Conversi on Film) having a polarization separation function.

 On the other hand, the liquid crystal display module 50 is laminated on a liquid crystal panel 51 as a kind of display panel formed by sandwiching liquid crystal between two glass substrates, and on each glass substrate of the liquid crystal panel 51, Polarizing plates 52 and 53 for limiting the vibration of the light wave to a certain direction are provided. Further, peripheral members such as a driving LSI (not shown) are mounted on the liquid crystal display device.

 The liquid crystal panel 51 is configured to include various components not shown. For example, two glass substrates with display electrodes (not shown), active elements such as thin film transistors (TFTs), liquid crystals, spacers, sealing agents, alignment films, common electrodes, protective films, color filters, etc. Get ready.

Note that the structural unit of the backlight device 10 is arbitrarily selected. For example, the unit consisting of only the light emitting module 11 and the light guide plate 12 is referred to as a “backlight device (backlight)” and includes optical compensation systems such as the reflector 13, the diffuser plate 14, the prism sheets 15 and 16, and the brightness enhancement film 17. There may be a distribution form that does not include a single laminate.

 [0017] Next, the operation of the backlight device 10 will be described.

 When the LED chip of each RGB color is turned on to the light emitting module 11, the light of each RGB color emitted from each LED chip force enters from one side of the light guide plate 12. Then, in the light guide plate 12, the light guided from the light emitting module 11 into the light guide plate 12 is guided to the entire surface of the light guide plate 12 using total reflection of a material (for example, acrylic resin) constituting the light guide plate 12. At this time, the light hitting the reflective dots provided on the back side of the light guide plate 12 changes its path, and the light having an angle smaller than the total reflection angle is the surface of the light guide plate 12 (surface on the diffuser plate 14 side). Come out from. In addition, light that does not hit the reflecting dots of the light guide plate 12 is reflected by the reflector 13 and further reflected by the surface of the light guide plate 12. By repeating this, light is emitted from the surface of the light guide plate 12 almost uniformly over the entire surface. During this time, the RGB colors are mixed and emitted as white light.

 The light emitted from the surface of the light guide plate 12 in this way is scattered and diffused by the diffusion plate 14 and is emitted in a more uniform state. Next, the light emitted from the diffusion plate 14 is condensed by the prism sheets 15 and 16 toward the front, that is, the brightness enhancement film 17 (the liquid crystal display module 50). The light emitted from the prism sheet 16 is polarized and separated by the brightness enhancement film 17, and is emitted toward the liquid crystal display module 50 in a state where the brightness is improved. Therefore, the liquid crystal display module 50 is irradiated with light that is whitened by a sufficient color mixture and has a uniform intensity over the entire surface, and further has improved luminance over the entire surface.

 Next, the light emitting module 11 used in the above-described backlight device 10 will be described in detail.

 FIG. 2A is a perspective view showing the configuration of the light emitting module 11. The light emitting module 11 includes a light emitting device 21 on which an LED chip is mounted and a support member 22 that supports the light emitting device 21. FIG. 2B shows a state in which the light emitting module 11 is disassembled into the light emitting device 21 and the support member 22.

The light emitting device 21 includes a wiring board 30. In the present embodiment, the wiring board 30 has a structure bent in a concave shape. For this reason, the wiring board 30 is formed of the formed recess. A base 30a serving as a bottom, a first side wall 30b projecting from one end of the base 30a at a substantially right angle, and a second side wall 30c projecting from the other end of the base 30a in the same direction as the first side wall 30b are provided. Here, the protruding length of the second side wall 30c is set larger than the protruding length of the first side wall 30b. In addition, a large number of LED chips (not shown) are arranged along the longitudinal direction on the base 30a inside the recess formed in the wiring board 30 and a lens 33 for protecting these LED chips is provided in the recess 30 of the wiring board 30. It is formed so as to be filled. These detailed structures will be described later.

 On the other hand, the support member 22 has a structure bent into a concave shape like the wiring board 30 in order to fit and hold the wiring board 30. Therefore, the support member 22 protrudes in the same direction as the first side portion 22b from the other end of the bottom portion 22a of the formed recess, the first side portion 22b protruding from the one end of the bottom portion 22a at a right angle, and the other end of the bottom portion 22a. A second side 22c is provided. Here, the protruding length of the second side portion 22c is set larger than the protruding length of the first side portion 22b. The support member 22 can be made of a metal plate such as stainless steel.

 Here, the protruding length of the first side wall 30b provided on the wiring substrate 30 of the light emitting device 21 is set to be smaller than the protruding length of the first side portion 22b provided on the support member 22. On the other hand, the protruding length of the second side wall 30c provided on the wiring board 30 of the light emitting device 21 is set to be larger than the protruding length of the second side portion 22c provided on the support member 22.

 Therefore, in a state where the light emitting device 21 is supported by the support member 22, the first side portion 22b protrudes from the first side wall 30b, while the second side wall 30c protrudes from the second side portion 22c. A connector pad for supplying power to the wiring board 30 is provided below (outside) the protruding portion of the second side wall 30c, as will be described later.

 FIG. 3 is a diagram showing the configuration of the light emitting device 21. Here, Fig. 3 (a) is a front view of the light emitting device 21 as viewed from the light guide plate 12 side shown in Fig. 1, Fig. 3 (b) is an enlarged view of the main part of Fig. 3 (a), and Fig. 3 (c) is a diagram. 3 (b) is a cross-sectional view of nic-IIIC.

 [0024] The light emitting device 21 includes a wiring board 30, a plurality of LED chips 31, a lens 33, and a resist layer.

 The main part is composed of 34.

The wiring board 30 is constituted by a so-called glass epoxy substrate based on, for example, a glass cloth base epoxy resin. In addition to the glass-epoxy substrate, for example, it has flexibility and is bent. It is also possible to use flexible printed circuit (FPC). The wiring board 30 includes wiring (not shown) for supplying power to each LED chip 31. In the present embodiment, a so-called two-layer substrate in which wiring is formed on both surfaces of the wiring substrate 30 is used. The details of the wiring formed on the wiring board 30 will be described later.

Yes

 The plurality of LED chips 31 functioning as solid state light emitting elements are directly mounted in a straight line on the base 30 a inside the recess of the wiring board 30. In the present embodiment, a total of 42 LED chips 31 are attached to the base 30a. The 42 LED chips 31 are red LED chips R1 to R14 as red light emitting elements that emit red light, green LED chips G1 to G14 as green light emitting elements that emit green light, and blue light emitting elements that emit blue light. As a blue LED chip B1 ~ B14. The LED chips 31 are arranged in the order of red, green, and blue, and in specific white tiles, Rl, Gl, Bl, R2, G2, B2,... R14, G14, B14.

 In addition, a total of 84 electrode pads 32 are formed on the base 30a inside the recess of the wiring board 30 so as to sandwich each LED chip 31. Each LED chip 31 is electrically connected to the electrode pads 32 at both ends via bonding wires. Each electrode pad 32 is supplied with power through the wiring formed on the wiring board 30.

[0026] The lens 33 that functions as a protective member includes a sealing portion 33a and a lens portion 33b. The lens 33 functions to protect each LED chip 31 and to guide light emitted from the corresponding LED chip 31 efficiently and substantially uniformly to the light guide plate 12 shown in FIG.

Here, the sealing portion 33a is formed so as to fill the concave portion of the wiring substrate 30 that has been bent, that is, in contact with the inner surface of the concave portion of the wiring substrate 30. The lens part 33b is formed in a semicircular shape on the sealing part 33a. In the present embodiment, since the plurality of LED chips 31 are linearly arranged, the sealing portion 33a has a quadrangular prism shape as a whole, and the entire lens portion 33b has a semi-cylindrical shape. is doing. The sealing portion 33a and the lens portion 33b have light transmission performance that is substantially transparent to red, green, and blue light. The resist layer 34 is formed on both surfaces of the wiring board 30. However, the resist layer 34 is not formed at the position where the LED chip 31 is mounted or the position where the electrode pad 32 is provided on the base portion 30a of the wiring board 30. The resist layer 34 protects the wiring formed on both sides of the wiring board 30 and the board itself. In addition, the resist layer 34 formed inside the concave portion of the wiring board 30 also functions as a reflective member or a reflective layer that reflects light emitted from the LED chip 31.

 FIG. 4 is a diagram showing a wiring pattern formed on the wiring board 30. Here, FIG. 4A shows a wiring pattern on the surface of the wiring board 30 on which the LED chip 31 is mounted. FIG. 4B shows a wiring pattern on the back surface of the wiring board 30 on the side opposite to the front surface. FIG. 4 shows a state before the wiring substrate 30 is bent or the resist layer 34 is formed.

 As shown in FIG. 4A, the surface wiring 35 is formed on the surface side of the wiring board 30. In the present embodiment, the surface wiring 35 is formed on the base 30 a and the second side wall 30 c excluding the first side wall 30 b on the surface of the wiring board 30. In the wiring board 30 shown in FIG. 4 (a), the alternate long and short dash line indicates a part that is to be bent (valley folded) later!

 On the other hand, as shown in FIG. 4B, the back surface wiring 36 is formed on the back surface side of the wiring substrate 30. In the present embodiment, the back surface wiring 36 is formed on the second side wall 30c excluding the base 30a and the first side wall 30b on the back surface of the wiring board 30. Therefore, the first side wall 30b of the wiring board 30 is also formed with! / And misalignment of the front surface wiring 35 and the back surface wiring 36! /, N! /. In the wiring board 30 shown in FIG. 4 (b), the broken line indicates a part to be bent later (mountain fold).

 The front surface wiring 35 and the back surface wiring 36 are electrically connected through a through hole formed through the wiring substrate 30.

[0030] Further, the first connector pad 37 and the second connector pad 38 for supplying power to each LED chip 31 through the front surface wiring 35 and the back surface wiring 36 are provided on the back surface of the wiring board 30. It is Here, the first connector pad 37 is connected to a power source. On the other hand, the second connector pad 38 is grounded. Each of the first connector pad 37 and the second connector pad 38 has 21 electrode pads, and each electrode pad penetrates the wiring board 30. It is electrically connected to the surface wiring 35 through the formed through hole.

 Note that the first connector pad 37 and the second connector pad 38 are located more than the second side portion 22c when the light emitting device 21 including the wiring board 30 shown in FIG. It is arranged at the protruding position. This facilitates power feeding to the wiring board 30.

 FIG. 5 is a diagram for explaining a power feeding system based on a wiring pattern formed on the wiring board 30. The first connector pad 37 includes 21 electrode pads 37a to 37u. The second connector pad 38 includes 21 electrode pads 38a to 38u.

 In the present embodiment, a total of 42 LED chips 31 are connected using 21 power supply lines. Therefore, one power supply line is connected to two LED chips 31 each. That is, in this power supply system, 21 LED chips 31 connected in series two by two are connected in parallel. For example, the electrode node 37a provided on the first connector pad 37 is connected to the electrode pad 38a provided on the second connector pad 38 via the red LED chips R1 and R8. Further, for example, the electrode pad 37b provided on the first connector pad 37 is connected to the electrode pad 38b provided on the second connector pad 38 via the green LED chips G1 and G8. Further, for example, the electrode pad 37c provided on the first connector pad 37 is connected to the electrode pad 38c provided on the second connector pad 38 via the blue LED chips B1 and B8. In other words, in the present embodiment, power is supplied to two LED chips 31 of the same color through a single power supply line. One power line connects two LED chips 31 of the same color while straddling six LED chips 31 of the same color. In other words, one power supply line supplies power to the adjacent LED chip 31 of the same color! / ,!

 Next, a method for manufacturing the light emitting device 21 will be described with reference to FIGS. FIG. 6 is a flowchart showing a manufacturing process of the light emitting device 21 according to the present embodiment, and FIG. 7 is a diagram for explaining a specific process of each step in the flowchart shown in FIG.

First, the wiring board 30 is created (step 101). For the production of the wiring board 30, for example, a glass epoxy board or a polyimide film with copper foil attached on both front and back surfaces is used as a starting material. Use the through-hole method to form the front wiring 35, back wiring 36, through-hole, electrode pad 32, first connector pad 37, second connector pad 38, etc. by drilling, plating, etching, etc. Can do. Also, for example, using a substrate or insulating substrate created by the plated through-hole method as a starting material, forming an insulating layer on top of it, creating a conductor pattern, stacking the conductor layers by making interlayer connections It is also possible to use a build-up method that realizes multiple layers. FIG. 7 (a) shows the wiring board 30 produced in this way. In FIG. 7 (a), wiring and the like are omitted.

 Next, a resist process is performed on the created wiring board 30 (step 102). Specifically, as shown in FIG. 7B, a resist layer 34 made of resin is formed on both surfaces of the wiring board 30. However, at this time, the resist layer 34 is not formed in a portion of the base portion 30a where the LED chip 31 is mounted later or a portion where the electrode pad 32 is formed. Similarly, the resist layer 34 is not formed on the second side wall 30c where the electrode pads 37a to 37u and 38a to 38u are formed later. In the present embodiment, the resist layer 34 can be selectively formed on the wiring board 30 by using, for example, a screen printing technique. The resist layer 34 can be formed of, for example, a thermosetting resist or an ultraviolet ray curing (UV cure) type resist. The resist layer 34 is made of a material having a high light reflectance in the visible region, such as white.

 For example, the electrode pad 32 exposed on the surface side of the base 30a and the electrode pads 37a to 37u and electrode pads 38a to 38a exposed on the back side of the second side wall 30c with respect to the wiring substrate 30 subjected to the resist treatment. 38u can be surface treated by electroless silver plating. Further, it is possible to insert a process of forming, for example, a part symbol, a part address, or a name of the completed wiring board 30 on the resist layer 34 by silk printing.

Next, the required number (42 in this example) of LED chips 31 is attached on the base 30a of the wiring board 30 on which the resist layer 34 is formed (step 103). Specifically, as shown in FIG. 7 (c), each LED chip 31 has a corresponding position on the base 30a (see FIG. 7) by adhesion using, for example, epoxy resin, silicone resin, acrylic resin, or the like. 3 Installed between electrode pads 32 shown in (b). Thereafter, each LED chip 31 and the corresponding two electrode nodes 32 are electrically connected by wire bonding (step 104). [0036] Then, the wiring substrate 30 to which the LED chip 31 is attached and wire-bonded is bent (step 105). Specifically, as shown in FIG. 7 (d), a formwork or the like is formed on the boundary between the base 30a and the first side wall 30b and the boundary between the base 30a and the second side wall 30c in the wiring board 30. Use to bend. As a result, the wiring board 30 is deformed into a concave shape, and a recess is formed by the base 30a, the first side wall 30b, and the second side wall 30c. Then, 42 LED chips 31 are arranged in a straight line on the base portion 30 a inside the recess formed in the wiring board 30.

 Next, the concave portion of the wiring board 30 on which the LED chip 31 is mounted and subjected to the bending process is sealed with a resin (step 106). More specifically, as shown in FIG. 7 (e), a liquid resin is injected up to the height of the first side wall 30b so that each LED chip 31 is covered, and then solidified to thereby seal the sealing portion 33a. Let it form. As the resin constituting the sealing portion 33a, for example, an epoxy resin, a polycarbonate resin, a silicone resin, an acrylic resin, or the like that is highly visible and highly transparent in the visible region should be used. Can do.

 Then, the lens portion 33b is attached on the sealing portion 33a (step 107). Specifically, as shown in FIG. 7 (f), a semi-cylindrical lens portion 33b made of resin is attached to the upper surface of the sealing portion 33a using a transparent adhesive resin or the like. As the resin constituting the lens part 33b, a resin having high light transmittance in the visible region, such as an epoxy resin, a polycarbonate resin, a silicone resin, or an acrylic resin, should be used as in the sealing part 33a. I can do it. Thus, the light emitting device 21 is completed.

 The light emitting device 21 thus produced is then fitted into the support member 22 as shown in FIG. 7 (g), and the light emitting module 11 is obtained.

 FIG. 8 is a diagram for explaining the path of light emitted from the light emitting device 21 manufactured in this way.

 When a predetermined current flows through the LED chip 31 via the first connector pad 37 and the second connector pad 38 (see FIG. 4), the LED chip 31 emits light. LED chip 31 force The emitted light spreads in each direction.

Of the emitted light, the light emitted upward in the drawing proceeds directly toward the light guide plate 12 shown in FIG. 1 via the lens 33. On the other hand, of the emitted light, for example, light emitted obliquely upward in the figure enters the resist layer 34 provided on the first side wall 30b and the second side wall 30c of the wiring board 30. At this time, the resist layer has a high reflection characteristic with respect to visible light, and the light incident on the resist layer 34 is reflected upward by the resist layer 34 functioning as a reflection layer, and proceeds upward in the figure. Go.

[0040] As described above, in the present embodiment, the wiring board 30 on which the plurality of LED chips 31 are mounted is bent. Then, the wiring is formed on the wiring board 30 across the bent portion. For this reason, even when the number of LED chips 31 is increased or complex wiring patterns are formed by series-parallel connection! /, Even when the area required for wiring increases, the wiring layer on the wiring board 30 While suppressing the increase in the number, the increase in the thickness of the light emitting module 11 in the thickness direction of the backlight device 10 can be suppressed. As a result, the knocklight device 10 can be reduced in thickness. Here, in the present embodiment, no wiring is formed on the first side wall 30b having a short protruding length in the wiring board 30. This can reduce the risk of disconnection in the wiring when the wiring board 30 is bent.

In the present embodiment, the resist layer 34 is formed inside the recess formed in the wiring board 30 so that the light emitted from each LED chip 31 is guided to the light guide plate 12 side by reflection. I did it. This makes it possible to increase the light emission efficiency of the backlight device 10.

Furthermore, in the present embodiment, the sealing portion 33a is formed inside the recess formed in the wiring board 30, and the lens portion 33b is formed thereon. Here, the sealing portion 33a can be formed easily because the resin can be poured using the wiring substrate 30 as a mold.

 In the present embodiment, the force that caused the resist layer 34 provided inside the recess of the wiring board 30 to function as a reflective member or a reflective layer is not limited to this. For example, a metal reflective film such as an aluminum film may be formed inside the recess of the wiring board 30 and function as a reflective member or a reflective layer.

In the present embodiment, the number of LED chips 31 mounted on the power wiring board 30 is such that 42 LED chips 31 of each RGB color are arranged to form the light emitting device 21. For example, the design may be changed as appropriate according to the size of the liquid crystal panel 51 and the required optical characteristics.

Furthermore, in the present embodiment, the force S described for the example in which the light emitting module 11 is applied to the backlight device 10 of the liquid crystal display module 50, and the application target of the light emitting module 11 is not limited to this. . The light emitting module 11 can be used as an indoor / outdoor lighting device or the like instead of a lighting device such as a fluorescent lamp.

 Brief Description of Drawings

 FIG. 1 is a diagram showing an overall configuration of a liquid crystal display device to which the present embodiment is applied.

 FIG. 2 (a) is a diagram for explaining a light emitting module, and (b) is a diagram for explaining a light emitting device and a supporting member constituting the light emitting module.

 [FIG. 3] (a) is a front view of the light emitting device, (b) is an enlarged view of the main part of ω, and (c) is a mc-mc cross-sectional view of (b).

 [FIG. 4] (a) is a diagram showing a wiring pattern formed on the front surface of the wiring substrate (LED chip mounting surface), and (b) is a diagram showing a wiring pattern formed on the back surface of the wiring substrate.

 FIG. 5 is a diagram for explaining a power feeding path for each LED chip.

 FIG. 6 is a flowchart for explaining a manufacturing process of the light emitting device.

 FIG. 7 is a diagram for explaining a manufacturing process for the light-emitting device.

 FIG. 8 is a diagram for explaining a path of light emitted from the light emitting module.

 Explanation of symbols

 [0047] 10 ··· Backlight device 11 ··· Light emitting module 12 ··· Light guide plate 13 ··· Reflector plate 14 ··· Diffuser plate 21 ··· Light emitting device 22 ··· · Support member, 30 ··· Wiring board, 30a ... Base, 30b ... First side wall, 30c ... Second side wall, 31 --- LED chip, 32 ... Electrode node, 33 ... Lens, 34 ... Resist layer 35 ... Front wiring, 36 ... Back wiring, 37 ... First connector pad, 38 ... Second connector node, 50 ... LCD module, R1-R14 'red LED chip, G1 ~ G14 'green LED chip, Β1 ~ Β14 ... blue LED chip

Claims

The scope of the claims  [1] a wiring board having a concave cross section and on which wiring is formed;  A solid-state light emitting device that is directly mounted inside the recess of the wiring board and connected to the wiring;  A reflective member that is formed inside the recess of the wiring board and reflects light emitted from the solid state light emitting device;  A light emitting device comprising:  2. The light emitting device according to claim 1, further comprising a protective member provided inside the concave portion of the wiring board and protecting the solid light emitting element. 3. The light emitting device according to claim 1, wherein the wiring board is bent. [4] A surface light emitting device including a light guide plate that emits light incident from a side surface to the upper surface side, and a light source that irradiates light to the light guide plate from the side surface of the light guide plate,  The light source is  A plurality of solid state light emitting devices arranged along the side surface of the light guide plate;  The light guide plate has a concave portion that is bent so that a portion facing the side surface of the light guide plate is a valley, and the plurality of solid state light emitting devices are directly mounted inside the concave portion, and power is supplied to the plurality of solid state light emitting devices. A board with wiring to do,  A reflective layer provided inside the recess formed in the substrate and reflecting light emitted from the plurality of solid state light emitting elements toward the light guide plate;  A surface light emitting device comprising: [5] The substrate includes a base portion on which the plurality of solid state light emitting elements are directly mounted, a first side wall projecting from one end side of the base portion toward the side surface of the light guide plate, and the other end portion of the base portion. A second side wall projecting on the side of the light guide plate,  5. The surface emitting device according to claim 4, wherein the reflective layer is formed on the first side wall and the second side wall. [6] The substrate includes a base portion on which the plurality of solid state light emitting elements are directly mounted, a first side wall projecting from one end side of the base portion toward the side surface of the light guide plate, and the other end portion of the base portion. A second side wall projecting from the side of the light guide plate, The protrusion length of the second side wall is set larger than the first side wall;  5. The surface emitting device according to claim 4, wherein the wiring is formed on the base and the second side wall, but the wiring is not formed on the first side wall. [7] The plurality of solid state light emitting devices are composed of a red light emitting device that emits red light, a green light emitting device that emits green light, and a blue light emitting device that emits blue light in order. The surface emitting device according to claim 4. 8. The surface light-emitting device according to claim 4, wherein the wiring supplies power to two or more solid-state light emitting elements per system. [9] The surface light-emitting device according to [8], wherein two or more of the solid-state light-emitting elements fed by one line of the wiring are not adjacent to each other! 10. The surface light emitting device according to claim 4, wherein the wiring supplies power to the plurality of solid state light emitting elements by combining series connection and parallel connection.