WO2007145309A1 - 光学的立体造形用樹脂組成物 - Google Patents
光学的立体造形用樹脂組成物 Download PDFInfo
- Publication number
- WO2007145309A1 WO2007145309A1 PCT/JP2007/062085 JP2007062085W WO2007145309A1 WO 2007145309 A1 WO2007145309 A1 WO 2007145309A1 JP 2007062085 W JP2007062085 W JP 2007062085W WO 2007145309 A1 WO2007145309 A1 WO 2007145309A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- resin composition
- optical
- compound
- dimensional modeling
- oxetane
- Prior art date
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 145
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims abstract description 41
- 125000002947 alkylene group Chemical group 0.000 claims abstract description 21
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 21
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 17
- 239000000203 mixture Substances 0.000 claims abstract description 14
- -1 oxetane compound Chemical class 0.000 claims description 168
- 230000003287 optical effect Effects 0.000 claims description 117
- 150000001875 compounds Chemical class 0.000 claims description 59
- 150000002894 organic compounds Chemical class 0.000 claims description 45
- 239000004593 Epoxy Substances 0.000 claims description 39
- 239000003505 polymerization initiator Substances 0.000 claims description 26
- 238000010538 cationic polymerization reaction Methods 0.000 claims description 23
- 239000007870 radical polymerization initiator Substances 0.000 claims description 17
- 150000001768 cations Chemical class 0.000 claims description 10
- 239000003795 chemical substances by application Substances 0.000 claims description 5
- 238000010521 absorption reaction Methods 0.000 abstract description 27
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 22
- 230000035945 sensitivity Effects 0.000 abstract description 11
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 abstract description 7
- 238000001723 curing Methods 0.000 description 70
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 57
- 238000000034 method Methods 0.000 description 45
- 230000000704 physical effect Effects 0.000 description 33
- 238000006243 chemical reaction Methods 0.000 description 29
- 239000010410 layer Substances 0.000 description 29
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 26
- 239000007788 liquid Substances 0.000 description 26
- 238000003786 synthesis reaction Methods 0.000 description 26
- 230000015572 biosynthetic process Effects 0.000 description 25
- 238000012360 testing method Methods 0.000 description 25
- 229920005989 resin Polymers 0.000 description 22
- 239000011347 resin Substances 0.000 description 22
- 238000000465 moulding Methods 0.000 description 18
- 229920001281 polyalkylene Polymers 0.000 description 18
- 239000000047 product Substances 0.000 description 18
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 16
- 239000012044 organic layer Substances 0.000 description 15
- 125000003118 aryl group Chemical group 0.000 description 14
- 230000000052 comparative effect Effects 0.000 description 14
- ISAOCJYIOMOJEB-UHFFFAOYSA-N desyl alcohol Natural products C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 12
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 11
- RBMGGZPJAZDWNE-UHFFFAOYSA-N 4-[(3-ethyloxetan-3-yl)methoxy]butan-1-ol Chemical compound OCCCCOCC1(CC)COC1 RBMGGZPJAZDWNE-UHFFFAOYSA-N 0.000 description 10
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 10
- 150000003254 radicals Chemical class 0.000 description 10
- 239000004721 Polyphenylene oxide Substances 0.000 description 9
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 9
- 229920000570 polyether Polymers 0.000 description 9
- UNMJLQGKEDTEKJ-UHFFFAOYSA-N (3-ethyloxetan-3-yl)methanol Chemical compound CCC1(CO)COC1 UNMJLQGKEDTEKJ-UHFFFAOYSA-N 0.000 description 8
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 8
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 8
- 125000001931 aliphatic group Chemical group 0.000 description 8
- 238000005452 bending Methods 0.000 description 8
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 8
- 244000028419 Styrax benzoin Species 0.000 description 7
- 235000000126 Styrax benzoin Nutrition 0.000 description 7
- 235000008411 Sumatra benzointree Nutrition 0.000 description 7
- 125000002723 alicyclic group Chemical group 0.000 description 7
- 229960002130 benzoin Drugs 0.000 description 7
- 150000002170 ethers Chemical class 0.000 description 7
- 235000019382 gum benzoic Nutrition 0.000 description 7
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 6
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 6
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical group C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 6
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical group C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 6
- 238000004817 gas chromatography Methods 0.000 description 6
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 5
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 5
- 239000007795 chemical reaction product Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 5
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 5
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 5
- 150000002921 oxetanes Chemical class 0.000 description 5
- 238000006116 polymerization reaction Methods 0.000 description 5
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 5
- 238000003756 stirring Methods 0.000 description 5
- 150000005846 sugar alcohols Polymers 0.000 description 5
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 4
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 4
- XEUBDFWTYXHKJO-UHFFFAOYSA-N 5-[(3-ethyloxetan-3-yl)methoxy]pentan-1-ol Chemical compound OCCCCCOCC1(CC)COC1 XEUBDFWTYXHKJO-UHFFFAOYSA-N 0.000 description 4
- 238000005481 NMR spectroscopy Methods 0.000 description 4
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 4
- 150000001298 alcohols Chemical class 0.000 description 4
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 4
- 239000012965 benzophenone Substances 0.000 description 4
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 4
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 4
- 238000000262 chemical ionisation mass spectrometry Methods 0.000 description 4
- 239000012141 concentrate Substances 0.000 description 4
- ZWAJLVLEBYIOTI-UHFFFAOYSA-N cyclohexene oxide Chemical compound C1CCCC2OC21 ZWAJLVLEBYIOTI-UHFFFAOYSA-N 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 4
- 239000000284 extract Substances 0.000 description 4
- 230000001678 irradiating effect Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000003960 organic solvent Substances 0.000 description 4
- 125000004817 pentamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 229920000728 polyester Polymers 0.000 description 4
- 229920001451 polypropylene glycol Polymers 0.000 description 4
- 150000003839 salts Chemical class 0.000 description 4
- 238000005160 1H NMR spectroscopy Methods 0.000 description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 3
- DKBJETRCOHGWRJ-UHFFFAOYSA-N 3-[(3-ethyloxetan-3-yl)methoxy]propan-1-ol Chemical compound OCCCOCC1(CC)COC1 DKBJETRCOHGWRJ-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical class C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 3
- 239000005977 Ethylene Substances 0.000 description 3
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 3
- 239000002202 Polyethylene glycol Substances 0.000 description 3
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 3
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 3
- 125000003710 aryl alkyl group Chemical group 0.000 description 3
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 150000002009 diols Chemical class 0.000 description 3
- 229940052303 ethers for general anesthesia Drugs 0.000 description 3
- 238000002955 isolation Methods 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- OTLDLKLSNZMTTA-UHFFFAOYSA-N octahydro-1h-4,7-methanoindene-1,5-diyldimethanol Chemical group C1C2C3C(CO)CCC3C1C(CO)C2 OTLDLKLSNZMTTA-UHFFFAOYSA-N 0.000 description 3
- 229940059574 pentaerithrityl Drugs 0.000 description 3
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 3
- 238000000016 photochemical curing Methods 0.000 description 3
- 229920001223 polyethylene glycol Polymers 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 3
- 238000010992 reflux Methods 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 239000008096 xylene Substances 0.000 description 3
- FQERLIOIVXPZKH-UHFFFAOYSA-N 1,2,4-trioxane Chemical compound C1COOCO1 FQERLIOIVXPZKH-UHFFFAOYSA-N 0.000 description 2
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 2
- GJYCVCVHRSWLNY-UHFFFAOYSA-N 2-butylphenol Chemical compound CCCCC1=CC=CC=C1O GJYCVCVHRSWLNY-UHFFFAOYSA-N 0.000 description 2
- VVBLNCFGVYUYGU-UHFFFAOYSA-N 4,4'-Bis(dimethylamino)benzophenone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=C(N(C)C)C=C1 VVBLNCFGVYUYGU-UHFFFAOYSA-N 0.000 description 2
- SDDLEVPIDBLVHC-UHFFFAOYSA-N Bisphenol Z Chemical group C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)CCCCC1 SDDLEVPIDBLVHC-UHFFFAOYSA-N 0.000 description 2
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 2
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical group CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 2
- 150000008062 acetophenones Chemical class 0.000 description 2
- 125000002777 acetyl group Chemical group [H]C([H])([H])C(*)=O 0.000 description 2
- 125000003236 benzoyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C(*)=O 0.000 description 2
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 2
- GGBJHURWWWLEQH-UHFFFAOYSA-N butylcyclohexane Chemical compound CCCCC1CCCCC1 GGBJHURWWWLEQH-UHFFFAOYSA-N 0.000 description 2
- 238000012790 confirmation Methods 0.000 description 2
- 150000001923 cyclic compounds Chemical class 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- KZTYYGOKRVBIMI-UHFFFAOYSA-N diphenyl sulfone Chemical compound C=1C=CC=CC=1S(=O)(=O)C1=CC=CC=C1 KZTYYGOKRVBIMI-UHFFFAOYSA-N 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 230000006355 external stress Effects 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- AMXOYNBUYSYVKV-UHFFFAOYSA-M lithium bromide Chemical compound [Li+].[Br-] AMXOYNBUYSYVKV-UHFFFAOYSA-M 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 125000003566 oxetanyl group Chemical group 0.000 description 2
- 125000005702 oxyalkylene group Chemical group 0.000 description 2
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- 229920000193 polymethacrylate Polymers 0.000 description 2
- 229920005862 polyol Polymers 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000010526 radical polymerization reaction Methods 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000005482 strain hardening Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- DZLFLBLQUQXARW-UHFFFAOYSA-N tetrabutylammonium Chemical compound CCCC[N+](CCCC)(CCCC)CCCC DZLFLBLQUQXARW-UHFFFAOYSA-N 0.000 description 2
- HWCKGOZZJDHMNC-UHFFFAOYSA-M tetraethylammonium bromide Chemical compound [Br-].CC[N+](CC)(CC)CC HWCKGOZZJDHMNC-UHFFFAOYSA-M 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 125000003258 trimethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])[*:1] 0.000 description 2
- 229960000834 vinyl ether Drugs 0.000 description 2
- DNIAPMSPPWPWGF-VKHMYHEASA-N (+)-propylene glycol Chemical compound C[C@H](O)CO DNIAPMSPPWPWGF-VKHMYHEASA-N 0.000 description 1
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 1
- BQLMBJZSRQPNSM-UHFFFAOYSA-N (2-ethyloxetan-3-yl)methanol Chemical compound CCC1OCC1CO BQLMBJZSRQPNSM-UHFFFAOYSA-N 0.000 description 1
- BJYGGFGTOTUNJA-UHFFFAOYSA-N (3-butyloxetan-3-yl)methanol Chemical compound CCCCC1(CO)COC1 BJYGGFGTOTUNJA-UHFFFAOYSA-N 0.000 description 1
- NIGCZVPTJTUCPG-UHFFFAOYSA-N (3-ethyloxetan-3-yl)methyl methanesulfonate Chemical compound CS(=O)(=O)OCC1(CC)COC1 NIGCZVPTJTUCPG-UHFFFAOYSA-N 0.000 description 1
- NLQMSBJFLQPLIJ-UHFFFAOYSA-N (3-methyloxetan-3-yl)methanol Chemical compound OCC1(C)COC1 NLQMSBJFLQPLIJ-UHFFFAOYSA-N 0.000 description 1
- CUBVDBSVGQEYCB-UHFFFAOYSA-N (3-propyloxetan-3-yl)methanol Chemical compound CCCC1(CO)COC1 CUBVDBSVGQEYCB-UHFFFAOYSA-N 0.000 description 1
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 description 1
- DNIAPMSPPWPWGF-GSVOUGTGSA-N (R)-(-)-Propylene glycol Chemical compound C[C@@H](O)CO DNIAPMSPPWPWGF-GSVOUGTGSA-N 0.000 description 1
- ZXHDVRATSGZISC-UHFFFAOYSA-N 1,2-bis(ethenoxy)ethane Chemical compound C=COCCOC=C ZXHDVRATSGZISC-UHFFFAOYSA-N 0.000 description 1
- VDFVNEFVBPFDSB-UHFFFAOYSA-N 1,3-dioxane Chemical compound C1COCOC1 VDFVNEFVBPFDSB-UHFFFAOYSA-N 0.000 description 1
- WNXJIVFYUVYPPR-UHFFFAOYSA-N 1,3-dioxolane Chemical compound C1COCO1 WNXJIVFYUVYPPR-UHFFFAOYSA-N 0.000 description 1
- YPFDHNVEDLHUCE-UHFFFAOYSA-N 1,3-propanediol Substances OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 1
- 229940035437 1,3-propanediol Drugs 0.000 description 1
- 229940043375 1,5-pentanediol Drugs 0.000 description 1
- OQZQDGSYKKFLTE-UHFFFAOYSA-N 1-(4-azidophenyl)-3-phenylprop-2-en-1-one Chemical compound C1=CC(N=[N+]=[N-])=CC=C1C(=O)C=CC1=CC=CC=C1 OQZQDGSYKKFLTE-UHFFFAOYSA-N 0.000 description 1
- IMDHDEPPVWETOI-UHFFFAOYSA-N 1-(4-tert-butylphenyl)-2,2,2-trichloroethanone Chemical compound CC(C)(C)C1=CC=C(C(=O)C(Cl)(Cl)Cl)C=C1 IMDHDEPPVWETOI-UHFFFAOYSA-N 0.000 description 1
- VMCRQYHCDSXNLW-UHFFFAOYSA-N 1-(4-tert-butylphenyl)-2,2-dichloroethanone Chemical compound CC(C)(C)C1=CC=C(C(=O)C(Cl)Cl)C=C1 VMCRQYHCDSXNLW-UHFFFAOYSA-N 0.000 description 1
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical group CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 1
- KTSVVTQTKRGWGU-UHFFFAOYSA-N 1-[2-[2-(2-butoxyethoxy)ethoxy]ethoxy]butane Chemical compound CCCCOCCOCCOCCOCCCC KTSVVTQTKRGWGU-UHFFFAOYSA-N 0.000 description 1
- DURPTKYDGMDSBL-UHFFFAOYSA-N 1-butoxybutane Chemical class CCCCOCCCC DURPTKYDGMDSBL-UHFFFAOYSA-N 0.000 description 1
- STFXXRRQKFUYEU-UHFFFAOYSA-N 16-methylheptadecyl prop-2-enoate Chemical compound CC(C)CCCCCCCCCCCCCCCOC(=O)C=C STFXXRRQKFUYEU-UHFFFAOYSA-N 0.000 description 1
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- PIZHFBODNLEQBL-UHFFFAOYSA-N 2,2-diethoxy-1-phenylethanone Chemical compound CCOC(OCC)C(=O)C1=CC=CC=C1 PIZHFBODNLEQBL-UHFFFAOYSA-N 0.000 description 1
- HIPLXTICEUKKIT-UHFFFAOYSA-N 2,3-dimethyloxolane Chemical compound CC1CCOC1C HIPLXTICEUKKIT-UHFFFAOYSA-N 0.000 description 1
- GHTVHGGJFHMYBA-UHFFFAOYSA-N 2-(7-oxabicyclo[4.1.0]heptane-4-carbonyloxy)ethyl 7-oxabicyclo[4.1.0]heptane-4-carboxylate Chemical compound C1CC2OC2CC1C(=O)OCCOC(=O)C1CC2OC2CC1 GHTVHGGJFHMYBA-UHFFFAOYSA-N 0.000 description 1
- JPEGUDKOYOIOOP-UHFFFAOYSA-N 2-(hexoxymethyl)oxirane Chemical compound CCCCCCOCC1CO1 JPEGUDKOYOIOOP-UHFFFAOYSA-N 0.000 description 1
- SYEWHONLFGZGLK-UHFFFAOYSA-N 2-[1,3-bis(oxiran-2-ylmethoxy)propan-2-yloxymethyl]oxirane Chemical compound C1OC1COCC(OCC1OC1)COCC1CO1 SYEWHONLFGZGLK-UHFFFAOYSA-N 0.000 description 1
- SHKUUQIDMUMQQK-UHFFFAOYSA-N 2-[4-(oxiran-2-ylmethoxy)butoxymethyl]oxirane Chemical compound C1OC1COCCCCOCC1CO1 SHKUUQIDMUMQQK-UHFFFAOYSA-N 0.000 description 1
- WTYYGFLRBWMFRY-UHFFFAOYSA-N 2-[6-(oxiran-2-ylmethoxy)hexoxymethyl]oxirane Chemical compound C1OC1COCCCCCCOCC1CO1 WTYYGFLRBWMFRY-UHFFFAOYSA-N 0.000 description 1
- HIGURUTWFKYJCH-UHFFFAOYSA-N 2-[[1-(oxiran-2-ylmethoxymethyl)cyclohexyl]methoxymethyl]oxirane Chemical compound C1OC1COCC1(COCC2OC2)CCCCC1 HIGURUTWFKYJCH-UHFFFAOYSA-N 0.000 description 1
- FDSUVTROAWLVJA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol;prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OCC(CO)(CO)COCC(CO)(CO)CO FDSUVTROAWLVJA-UHFFFAOYSA-N 0.000 description 1
- HEQOJEGTZCTHCF-UHFFFAOYSA-N 2-amino-1-phenylethanone Chemical compound NCC(=O)C1=CC=CC=C1 HEQOJEGTZCTHCF-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- YJQMXVDKXSQCDI-UHFFFAOYSA-N 2-ethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC=C3SC2=C1 YJQMXVDKXSQCDI-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- MYISVPVWAQRUTL-UHFFFAOYSA-N 2-methylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC=C3SC2=C1 MYISVPVWAQRUTL-UHFFFAOYSA-N 0.000 description 1
- GWYOXQRLQXNWLI-UHFFFAOYSA-N 2-pentyloxetane Chemical compound CCCCCC1CCO1 GWYOXQRLQXNWLI-UHFFFAOYSA-N 0.000 description 1
- 125000000094 2-phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 1
- CXURGFRDGROIKG-UHFFFAOYSA-N 3,3-bis(chloromethyl)oxetane Chemical compound ClCC1(CCl)COC1 CXURGFRDGROIKG-UHFFFAOYSA-N 0.000 description 1
- RVGLUKRYMXEQAH-UHFFFAOYSA-N 3,3-dimethyloxetane Chemical compound CC1(C)COC1 RVGLUKRYMXEQAH-UHFFFAOYSA-N 0.000 description 1
- GRWFFFOEIHGUBG-UHFFFAOYSA-N 3,4-Epoxy-6-methylcyclohexylmethyl-3,4-epoxy-6-methylcyclo-hexanecarboxylate Chemical compound C1C2OC2CC(C)C1C(=O)OCC1CC2OC2CC1C GRWFFFOEIHGUBG-UHFFFAOYSA-N 0.000 description 1
- OTLWUWJIIXAOEO-UHFFFAOYSA-N 3,4-dihydro-2h-pyran-2-carboxylic acid Chemical class OC(=O)C1CCC=CO1 OTLWUWJIIXAOEO-UHFFFAOYSA-N 0.000 description 1
- DSQSDRJHXNPUTG-UHFFFAOYSA-N 3-(phenoxymethyl)oxetane Chemical compound C1OCC1COC1=CC=CC=C1 DSQSDRJHXNPUTG-UHFFFAOYSA-N 0.000 description 1
- BIDWUUDRRVHZLQ-UHFFFAOYSA-N 3-ethyl-3-(2-ethylhexoxymethyl)oxetane Chemical compound CCCCC(CC)COCC1(CC)COC1 BIDWUUDRRVHZLQ-UHFFFAOYSA-N 0.000 description 1
- FNYWFRSQRHGKJT-UHFFFAOYSA-N 3-ethyl-3-[(3-ethyloxetan-3-yl)methoxymethyl]oxetane Chemical compound C1OCC1(CC)COCC1(CC)COC1 FNYWFRSQRHGKJT-UHFFFAOYSA-N 0.000 description 1
- YHHKOCQFUSUCCG-UHFFFAOYSA-N 3-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound OCC(C)C(=O)C1=CC=CC=C1 YHHKOCQFUSUCCG-UHFFFAOYSA-N 0.000 description 1
- MECNWXGGNCJFQJ-UHFFFAOYSA-N 3-piperidin-1-ylpropane-1,2-diol Chemical compound OCC(O)CN1CCCCC1 MECNWXGGNCJFQJ-UHFFFAOYSA-N 0.000 description 1
- IIGKGANTKQPZMY-UHFFFAOYSA-N 3-propyl-3-[(3-propyloxetan-3-yl)methoxymethyl]oxetane Chemical compound C1OCC1(CCC)COCC1(CCC)COC1 IIGKGANTKQPZMY-UHFFFAOYSA-N 0.000 description 1
- HYYPKCMPDGCDHE-UHFFFAOYSA-N 4-(7-oxabicyclo[4.1.0]heptan-4-ylmethyl)-7-oxabicyclo[4.1.0]heptane Chemical compound C1CC2OC2CC1CC1CC2OC2CC1 HYYPKCMPDGCDHE-UHFFFAOYSA-N 0.000 description 1
- MWWXPRYWXMPCMK-UHFFFAOYSA-N 4-(oxetan-2-ylmethoxy)butan-1-ol Chemical compound OCCCCOCC1OCC1 MWWXPRYWXMPCMK-UHFFFAOYSA-N 0.000 description 1
- YFLRTUOBKDGQDO-UHFFFAOYSA-N 4-[2-(7-oxabicyclo[4.1.0]heptan-4-ylmethoxy)ethoxymethyl]-7-oxabicyclo[4.1.0]heptane Chemical compound C1CC2OC2CC1COCCOCC1CC2OC2CC1 YFLRTUOBKDGQDO-UHFFFAOYSA-N 0.000 description 1
- UZFMOKQJFYMBGY-UHFFFAOYSA-N 4-hydroxy-TEMPO Chemical group CC1(C)CC(O)CC(C)(C)N1[O] UZFMOKQJFYMBGY-UHFFFAOYSA-N 0.000 description 1
- SXIFAEWFOJETOA-UHFFFAOYSA-N 4-hydroxy-butyl Chemical group [CH2]CCCO SXIFAEWFOJETOA-UHFFFAOYSA-N 0.000 description 1
- GJEZBVHHZQAEDB-UHFFFAOYSA-N 6-oxabicyclo[3.1.0]hexane Chemical compound C1CCC2OC21 GJEZBVHHZQAEDB-UHFFFAOYSA-N 0.000 description 1
- WVDDGKGOMKODPV-UHFFFAOYSA-N Benzyl alcohol Chemical compound OCC1=CC=CC=C1 WVDDGKGOMKODPV-UHFFFAOYSA-N 0.000 description 1
- BSFQERFETNPOAM-UHFFFAOYSA-N C1(=CC=CC=C1)C=1C(=C(C=CC1SC1=CC=CC=C1)O)C1=CC=CC=C1 Chemical compound C1(=CC=CC=C1)C=1C(=C(C=CC1SC1=CC=CC=C1)O)C1=CC=CC=C1 BSFQERFETNPOAM-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 229940126062 Compound A Drugs 0.000 description 1
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 1
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 description 1
- BUDQDWGNQVEFAC-UHFFFAOYSA-N Dihydropyran Chemical compound C1COC=CC1 BUDQDWGNQVEFAC-UHFFFAOYSA-N 0.000 description 1
- 239000004386 Erythritol Substances 0.000 description 1
- UNXHWFMMPAWVPI-UHFFFAOYSA-N Erythritol Natural products OCC(O)C(O)CO UNXHWFMMPAWVPI-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- NLDMNSXOCDLTTB-UHFFFAOYSA-N Heterophylliin A Natural products O1C2COC(=O)C3=CC(O)=C(O)C(O)=C3C3=C(O)C(O)=C(O)C=C3C(=O)OC2C(OC(=O)C=2C=C(O)C(O)=C(O)C=2)C(O)C1OC(=O)C1=CC(O)=C(O)C(O)=C1 NLDMNSXOCDLTTB-UHFFFAOYSA-N 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- NQSMEZJWJJVYOI-UHFFFAOYSA-N Methyl 2-benzoylbenzoate Chemical compound COC(=O)C1=CC=CC=C1C(=O)C1=CC=CC=C1 NQSMEZJWJJVYOI-UHFFFAOYSA-N 0.000 description 1
- ALQSHHUCVQOPAS-UHFFFAOYSA-N Pentane-1,5-diol Chemical compound OCCCCCO ALQSHHUCVQOPAS-UHFFFAOYSA-N 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical compound ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- WNLRTRBMVRJNCN-UHFFFAOYSA-L adipate(2-) Chemical compound [O-]C(=O)CCCCC([O-])=O WNLRTRBMVRJNCN-UHFFFAOYSA-L 0.000 description 1
- 239000004844 aliphatic epoxy resin Substances 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 150000008366 benzophenones Chemical class 0.000 description 1
- LMMDJMWIHPEQSJ-UHFFFAOYSA-N bis[(3-methyl-7-oxabicyclo[4.1.0]heptan-4-yl)methyl] hexanedioate Chemical compound C1C2OC2CC(C)C1COC(=O)CCCCC(=O)OCC1CC2OC2CC1C LMMDJMWIHPEQSJ-UHFFFAOYSA-N 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- 238000012662 bulk polymerization Methods 0.000 description 1
- 244000309464 bull Species 0.000 description 1
- PVEOYINWKBTPIZ-UHFFFAOYSA-N but-3-enoic acid Chemical compound OC(=O)CC=C PVEOYINWKBTPIZ-UHFFFAOYSA-N 0.000 description 1
- 239000001273 butane Substances 0.000 description 1
- 150000007942 carboxylates Chemical class 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229940125898 compound 5 Drugs 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 229920006037 cross link polymer Polymers 0.000 description 1
- 150000004292 cyclic ethers Chemical class 0.000 description 1
- 150000004294 cyclic thioethers Chemical class 0.000 description 1
- VEIOBOXBGYWJIT-UHFFFAOYSA-N cyclohexane;methanol Chemical group OC.OC.C1CCCCC1 VEIOBOXBGYWJIT-UHFFFAOYSA-N 0.000 description 1
- FWFSEYBSWVRWGL-UHFFFAOYSA-N cyclohexene oxide Natural products O=C1CCCC=C1 FWFSEYBSWVRWGL-UHFFFAOYSA-N 0.000 description 1
- 125000000596 cyclohexenyl group Chemical group C1(=CCCCC1)* 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 125000002433 cyclopentenyl group Chemical group C1(=CCCC1)* 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- XGZRAKBCYZIBKP-UHFFFAOYSA-L disodium;dihydroxide Chemical compound [OH-].[OH-].[Na+].[Na+] XGZRAKBCYZIBKP-UHFFFAOYSA-L 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000006735 epoxidation reaction Methods 0.000 description 1
- 150000002118 epoxides Chemical class 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- UNXHWFMMPAWVPI-ZXZARUISSA-N erythritol Chemical compound OC[C@H](O)[C@H](O)CO UNXHWFMMPAWVPI-ZXZARUISSA-N 0.000 description 1
- 235000019414 erythritol Nutrition 0.000 description 1
- 229940009714 erythritol Drugs 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical group 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000011990 functional testing Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 125000004836 hexamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- PBOSTUDLECTMNL-UHFFFAOYSA-N lauryl acrylate Chemical compound CCCCCCCCCCCCOC(=O)C=C PBOSTUDLECTMNL-UHFFFAOYSA-N 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- QARBMVPHQWIHKH-UHFFFAOYSA-N methanesulfonyl chloride Chemical compound CS(Cl)(=O)=O QARBMVPHQWIHKH-UHFFFAOYSA-N 0.000 description 1
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 1
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 235000019198 oils Nutrition 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 150000004965 peroxy acids Chemical class 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 239000003504 photosensitizing agent Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920005906 polyester polyol Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 150000007519 polyprotic acids Polymers 0.000 description 1
- 229920000166 polytrimethylene carbonate Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000036632 reaction speed Effects 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000030 sodium bicarbonate Inorganic materials 0.000 description 1
- 235000017557 sodium bicarbonate Nutrition 0.000 description 1
- APSBXTVYXVQYAB-UHFFFAOYSA-M sodium docusate Chemical group [Na+].CCCCC(CC)COC(=O)CC(S([O-])(=O)=O)C(=O)OCC(CC)CCCC APSBXTVYXVQYAB-UHFFFAOYSA-M 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 235000012424 soybean oil Nutrition 0.000 description 1
- 239000003549 soybean oil Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- JRMUNVKIHCOMHV-UHFFFAOYSA-M tetrabutylammonium bromide Chemical compound [Br-].CCCC[N+](CCCC)(CCCC)CCCC JRMUNVKIHCOMHV-UHFFFAOYSA-M 0.000 description 1
- YFZDLRVCXDBOPH-UHFFFAOYSA-N tetraheptylazanium Chemical compound CCCCCCC[N+](CCCCCCC)(CCCCCCC)CCCCCCC YFZDLRVCXDBOPH-UHFFFAOYSA-N 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 150000007984 tetrahydrofuranes Chemical class 0.000 description 1
- VOVUARRWDCVURC-UHFFFAOYSA-N thiirane Chemical compound C1CS1 VOVUARRWDCVURC-UHFFFAOYSA-N 0.000 description 1
- 150000003553 thiiranes Chemical class 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 229940113165 trimethylolpropane Drugs 0.000 description 1
- 229920006305 unsaturated polyester Chemical class 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
- C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y70/00—Materials specially adapted for additive manufacturing
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0037—Production of three-dimensional images
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
Definitions
- the present invention relates to a resin composition for optical three-dimensional modeling. More specifically, the present invention has stable physical properties with small moisture and moisture absorption over time before curing, and can easily and smoothly control the curing reaction during stereolithography. High-sensitivity curing with active energy rays and shortened modeling time, optically shaped objects with excellent modeling accuracy, dimensional accuracy, water resistance, moisture resistance, and mechanical properties (particularly toughness) can be produced smoothly and with high productivity.
- the present invention relates to a resin composition for optical three-dimensional modeling that can be manufactured.
- a typical example of the optical three-dimensional modeling method is to selectively irradiate an ultraviolet laser controlled by a computer so that a desired pattern can be obtained on the liquid surface of the liquid photocurable resin in a container. The thickness is cured, and then one layer of liquid resin is supplied onto the cured layer, and similarly cured by irradiation with an ultraviolet laser in the same manner as described above, and finally the lamination operation to obtain a continuous cured layer is repeated.
- a method for obtaining a three-dimensional model can be mentioned. With this optical three-dimensional modeling method, it is possible to easily obtain a model with a fairly complicated shape in a relatively short time.
- the optical three-dimensional modeling technique using a drawing mask is a structure comprising a photocurable resin composition. Since the cross-sectional pattern that is photocured by irradiating the surface with light at once can be formed into a surface shape at once, the optical modeling speed is greatly increased compared to the spotting method using a spot-like ultraviolet laser. It is possible to improve it.
- the resin composition used for optical modeling has a low viscosity and good handling and properties at the time of modeling, and the resin composition before being cured has moisture and moisture over time. It has a low physical absorption and stable physical properties and curing characteristics, high curing sensitivity by active energy rays, good curing characteristics in an oxygen atmosphere, good resolution of the modeled object, and excellent modeling accuracy.
- the volume shrinkage during curing is small, the mechanical properties of the cured product are excellent, and the cured product has excellent water resistance and moisture resistance. Various characteristics such as being excellent are required.
- an acrylated photocurable resin composition an urethane acrylated photocurable resin composition, an epoxy photocurable resin composition, an epoxy resin are conventionally used.
- Atallate-based photocurable resin compositions and vinyl ether-based photocurable resin compositions have been proposed and used.
- the epoxy-based photocurable resin composition has recently attracted particular attention because of the good dimensional accuracy of the molded article obtained therefrom.
- the epoxy-based photocurable resin composition undergoes reaction with cations generated by light irradiation, so that it takes too much time for modeling with a slow reaction rate. Therefore, in order to increase the reaction rate, it has been proposed to add a low molecular weight polyol compound such as ethylene glycol or propylene glycol to the epoxy photocurable resin composition.
- a polyester-polyol compound is added to a photocurable resin composition containing a cationically polymerizable organic compound such as an epoxy compound and a radically polymerizable organic compound.
- Patent Document 1 A resin composition for optical three-dimensional modeling to which is added has been proposed (Patent Document 1).
- Patent Document 1 A resin composition for optical three-dimensional modeling to which is added has been proposed.
- the curing speed at the time of photocuring is slow, it takes a long time for optical modeling, and the resulting model is not sufficiently cured and the mechanical properties are not sufficient.
- the dimensional accuracy of the resulting molded article is low, and there are problems in terms of water resistance and moisture resistance.
- the present inventors have high curing sensitivity with active energy rays, and can produce a molded article with high productivity in a reduced active energy ray irradiation time. It has excellent resolution and modeling accuracy, and can obtain a modeled product with the desired dimensions. In addition, the volumetric shrinkage power when cured, and the cured product with high dimensional accuracy is excellent in water resistance and moisture resistance. Therefore, research has been conducted with the aim of providing a resin composition for optical three-dimensional modeling that can produce a molded article that has little absorption of moisture and moisture over time and has excellent dimensional stability and excellent mechanical properties. Continued. In the resin composition for optical three-dimensional modeling, the following general formula (II);
- R 3 represents an alkyl group, an aryl group or an aralkyl group, and ⁇ represents an integer of 1 to 6)
- the inventors of the present invention have further studied the physical properties of the resin composition for optical three-dimensional modeling of Patent Document 2 and the three-dimensional molded article obtained therefrom. As a result, in order to smoothly control the molding time during stereolithography and produce a stereolithography in a short period of time, moisture and moisture over time before curing of the resin composition for optical body modeling are cured. It has been found that the absorption of water needs to be further reduced.
- Patent Document 1 Japanese Patent Publication No. 7-103218
- Patent Document 2 Japanese Patent Laid-Open No. 11-199647
- Non-Patent Document 1 Paul F. Jacobs, “Rapid Prototyping & Manufacturing, Fundamentals of stereo—LithographyJ, Society of Manufacturing Engineers”, 1992, p28-39
- An object of the present invention is that the absorption of moisture and moisture with time is small in the state of the resin composition before curing, and a low moisture absorption rate can be maintained even under high humidity.
- the solid resin for optical three-dimensional modeling that has a stable physical property and curing characteristics, has excellent handleability, has high curing sensitivity, and can produce a molded article with high productivity in a reduced activation energy irradiation time. It is to provide a composition.
- the object of the present invention can produce a three-dimensional structure having the desired dimensions with high resolution and precision when formed by irradiation with active energy rays.
- a three-dimensional mold for optical three-dimensional modeling that can produce a three-dimensional model that has a small volumetric shrinkage during curing, less moisture and moisture absorption after curing, excellent dimensional stability, and excellent mechanical properties. It is to provide a fat composition.
- R 1 represents an alkyl group having 1 to 5 carbon atoms, and R or an alkylene group having 2 to 10 carbon atoms which may have an ether bond.
- the oxetane compound represented by the formula When the oxetane compound represented by the formula is contained at a ratio of 3 to 60% by mass, the absorption of moisture and moisture over time of the resin composition before curing is extremely small, and it is placed under high humidity. Furthermore, the present inventors have found that a resin composition for optical three-dimensional modeling that can maintain a low moisture absorption rate, has stable physical properties and curing properties, and is excellent in handleability can be obtained.
- the optical three-dimensional modeling resin composition containing the oxetane compound represented by the above general formula (I) has high curing sensitivity by active energy rays and shortened active energy rays. It is possible to produce a modeled object with high productivity in irradiation time, to obtain a modeled object that has excellent resolution and modeling accuracy and has the desired dimensions, and at the time of curing. Low volumetric shrinkage and high dimensional accuracy, low hygroscopicity after curing and good dimensional stability of the cured product, and the cured product has excellent mechanical properties, especially toughness, bending and impact It has been found that even when external stress such as is applied, it is difficult to break.
- the present inventors have used other cationic polymerization together with the oxetane compound.
- the resin composition can further contain a radically polymerizable organic compound, and by doing so, the curing sensitivity, resolution, modeling accuracy, dimensional accuracy, cured product of the optical three-dimensional modeling resin composition
- the present inventors have found that the mechanical properties of the resin can be further improved, and that the volume shrinkage upon curing and the moisture absorption rate can be further reduced, and the present invention has been completed based on these various findings.
- R 1 represents an alkyl group having 1 to 5 carbon atoms and R 2 represents an alkylene group having 2 to 10 carbon atoms which may have an ether bond.
- the content of the oxetane compound represented by the general formula (I) is 3 to 60% by mass, and the general formula (I)
- the content of the cationically polymerizable organic compound other than the oxetane compound represented is 20 to 70% by mass
- the content of the radical polymerizable organic compound is 5 to 50% by mass
- the content power of the active energy ray sensitive cationic polymerization initiator The resin composition for optical three-dimensional modeling as described above (3), wherein the content of ⁇ ⁇ 10 mass% and active energy ray-sensitive radical polymerization initiator is 1-10 mass%.
- the present invention provides:
- the resin composition for optical three-dimensional modeling of the present invention absorbs moisture and moisture over time in an uncured state, and maintains a low moisture absorption rate even under high humidity. It has stable physical properties and curing characteristics, and is easy to handle.
- the resin composition for optical three-dimensional modeling of the present invention has a high curing sensitivity by active energy rays, and can produce a molded article with high productivity in a shortened active energy ray irradiation time, and with high resolution and modeling accuracy. Get a molded object that is excellent and has the desired dimensions be able to.
- the optically shaped article obtained from the optical three-dimensional shaped resin composition of the present invention has a low volumetric shrinkage at the time of curing, a high dimensional accuracy, a low hygroscopic property, and a good dimensional stability.
- the force is also excellent in mechanical properties, particularly toughness, and is not easily damaged even when external stress such as impact or bending is applied.
- a resin composition for optical three-dimensional modeling containing an energy ray-sensitive cationic polymerization initiator and an active energy ray-sensitive radical polymerization initiator and an optical modeling object obtained therefrom have low hygroscopicity, curing sensitivity, resolution, modeling accuracy, Excellent characteristics such as dimensional accuracy and mechanical properties of cured products.
- under high humidity means the relative humidity obtained by dividing the amount of water vapor (weight absolute humidity) contained in the atmosphere at a certain temperature by the amount of water vapor saturated at that temperature (weight absolute humidity). (Unit:%) This is an environment where the temperature of the environment is 20 ° C or higher and the relative humidity is 80% or higher.
- the resin composition for optical three-dimensional modeling of the present invention has the following general formula (I):
- R 1 represents an alkyl group having 1 to 5 carbon atoms, and R or an alkylene group having 2 to 10 carbon atoms which may have an ether bond.
- oxetane compound (I) The oxetane compound represented by the formula [hereinafter referred to as “oxetane compound (I)”] is contained at a ratio of 3 to 60% by mass based on the total mass of the optical three-dimensional resin composition. To do.
- the resin composition for optical three-dimensional modeling of the present invention contains the oxetane compound (I) at a ratio of 3 to 60% by mass as described above, so that the resin composition before curing is in a state.
- the moisture and moisture absorption is very low over time, even when placed under high humidity Maintains high curing sensitivity with low content (water absorption).
- the resin composition for optical three-dimensional modeling of the present invention having such a low moisture content (moisture absorption rate) the volume shrinkage during curing is small and the dimensional accuracy is high with high resolution and modeling accuracy. It can be manufactured with good productivity in the molding time which shortens the optical modeling thing which is excellent in, low hygroscopicity, good dimensional stability and excellent mechanical properties.
- the content of the oxetane compound (I) is more than the above range, the absorption of moisture and moisture with time of the resin composition for optical three-dimensional modeling is increased, while when the content is less than the above range, The reactivity at the time of light irradiation becomes low, and the modeling speed decreases.
- the content of the oxetane compound (I) is preferably 5 to 40% by mass based on the total mass of the resin composition for optical three-dimensional modeling.
- R 1 is a chain alkyl group or branched if it is an alkyl group having 1 to 5 carbon atoms.
- the alkyl group may be off.
- Specific examples of R 1 include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, a t-butyl group, a sec-butyl group, an n-pentyl group, and an isopentyl group.
- R 1 is preferably a methyl group or an ethyl group from the viewpoint of easy availability of synthetic raw materials.
- R 2 is an alkylene group having 2 to 10 carbon atoms, it may be a chain alkylene group or a branched alkylene group, or an alkylene group (alkylene group)
- alkylene group A chain or branched alkylene group having 2 to C carbon atoms having an ether bond (ether oxygen atom) in the middle of the chain may be used.
- R 2 examples include an ethylene group, a trimethylene group, a tetramethylene group, a pentamethylene group, a hexamethylene group, and a 3-oxypentylene group.
- R 2 is a trimethylene group, a tetramethylene group, a pentamethylene group or a heptamethylene group because of ease of synthesis and ease of handling because the compound is liquid at normal temperature.
- the method for producing the oxetane compound (I) used in the present invention is not particularly limited.
- the oxetane compound (I) can be produced by, for example, synthesis route A and synthesis route B shown below. [0026] ⁇ Synthetic Route A >>
- oxetane compound represented by the general formula (ii) In order to produce an oxetane compound represented by the general formula (ii) by reacting H 2 SO C1), triethylamine is added to 1 mol of the oxetane compound represented by the general formula (i). To 0.9 It is preferable to use ⁇ 1.5 mol of methanesulfur chloride at a ratio of 1.0 to 2.0 mol and keep the liquid temperature at 5 to 10 ° C. At that time, the synthesis reaction of the oxetane compound represented by the general formula (ii) is preferably performed in an organic solvent (for example, an aromatic hydrocarbon such as toluene or xylene).
- an organic solvent for example, an aromatic hydrocarbon such as toluene or xylene.
- a diol represented by the general formula: HO—R 2 —OH is used in a proportion of 1.5 to 8.0 mole, and reacted at a temperature of 50 to 150 ° C. to form an oxetane compound. It is preferable to synthesize the product (I). This reaction is preferably performed in an organic solvent such as toluene.
- lithium bromide is used in a ratio of 1.0 to 1.5 mol with respect to 1 mol of the oxetane compound represented by the general formula (ii) generated above, and 50 to It is preferable to produce an oxetane compound represented by the general formula (m) by reacting at 100 ° C.
- This reaction is preferably carried out in a two-phase system of an organic solvent (aromatic hydrocarbons such as toluene and xylene) and water. Then, with respect to 1 mol of the oxetane compound represented by the general formula (m) obtained thereby, tetraethylammonium bromide (Et NBr) or tetraptylammonium
- a diol represented by HO—R 2 — OH is used in a proportion of 1.5 to 8.0 moles, and reacted at a temperature of 30 to 150 ° C. to give an oxetane compound (I) It is preferable to manufacture. This reaction is preferably carried out in an organic solvent (for example, aromatic hydrocarbons such as toluene and xylene).
- Oxetane compound (I) undergoes a polymerization reaction and a reaction when irradiated with active energy rays in the presence of an active energy ray-sensitive cationic polymerization initiator (hereinafter sometimes simply referred to as “cationic polymerization initiator”). Since Z or a crosslinking reaction occurs, the resin composition for optical three-dimensional modeling of the present invention contains a cationic polymerization initiator together with the oxetane compound (I).
- active energy rays refers to energy rays that can cure the resin composition for optical three-dimensional modeling, such as ultraviolet rays, electron beams, X-rays, radiation, and high frequencies.
- the resin composition for optical three-dimensional modeling of the present invention contains the oxetane compound (I) in a proportion of 3 to 60% by mass and contains a cationic polymerization initiator.
- oxetane compound (I) in a proportion of 3 to 60% by mass and contains a cationic polymerization initiator.
- the resin composition for optical three-dimensional modeling of the present invention contains a cationically polymerizable organic compound other than the oxetane compound (1), the oxetane compound (I), and a cationic polymerization initiator.
- the oxetane compound (1), a cationic polymerizable organic compound other than the oxetane compound (I), a radical polymerizable organic compound, a cationic polymerization initiator, and an active energy ray sensitive radical polymerization initiator (Hereinafter sometimes referred to simply as “radical polymerization initiator”), it is preferable to contain such a composition so that the moisture content of the resin composition for optical three-dimensional modeling before curing can be increased over time.
- the absorption of moisture and moisture can be kept low, the curing sensitivity, resolution, modeling accuracy, etc. are improved, and the dimensional stability and mechanical properties of the optical modeled object that can be obtained are improved. It becomes good.
- examples of the cationically polymerizable organic compound include
- Epoxy compounds such as alicyclic epoxy resin, aliphatic epoxy resin, aromatic epoxy resin;
- thiirane compounds such as ethylene sulfide and thioepoxyhydrin
- an epoxy compound is preferably used as the cationically polymerizable organic compound other than the oxetane compound (I), and in particular, two or more epoxy groups in one molecule.
- a polyepoxy compound having the following is more preferably used.
- Examples of the epoxy compound preferably used as the cationically polymerizable organic compound include an alicyclic epoxy compound, an aliphatic epoxy compound, and an aromatic epoxy compound.
- alicyclic epoxy compound examples include the following general formula ( m ):
- R 4 represents a hydrogenated bisphenol A residue, a hydrogenated bisphenol F residue, a hydrogenated bisphenol Z residue, a cyclohexane dimethanol residue, or a tricyclodecane dimethanol residue.
- cyclohexene oxide or cyclopentene oxide-containing compound obtained by epoxidation with an oxidizing agent More specifically, examples of the alicyclic diglycidyl ether compound represented by the above general formula (III) include hydrogenated bisphenol A diglycidyl ether, hydrogenated bisphenol F.
- Examples thereof include diglycidyl ether, hydrogenated bisphenol Z diglycidyl ether, cyclohexane dimethanol diglycidyl ether, and tricyclodecane dimethanol diglycidyl ether.
- Other alicyclic epoxy resins include, for example, 3, 4-epoxycyclohexylenomethineley 3 ', 4'-epoxycyclohexyl carboxylate, 2- (3,4 epoxycyclohexyl 5 , 5-spiro-1,4 epoxy) cyclohexane metadioxane, bis (3,4-epoxycyclohexenolemethinole) adipate, butylcyclohexenedioxide, 4 bisepoxycyclohexane, bis (3, 4— Epoxy-6-methylcyclohexylmethyl) adipate, 3, 4 epoxy 6-methylcyclohexyl, 3, 4-epoxy 6-methylcyclohexanecarboxylate, methylene bis (3
- Examples of the aliphatic epoxy compound include polyglycidyl ethers of aliphatic polyhydric alcohols or alkylene oxide adducts thereof, and polyglycidyl esters of aliphatic long-chain polybasic acids. Can do.
- 1,4 butanediol diglycidyl ether, 1,6 hexanediol diglycidyl ether, glycerin triglycidyl ether, trimethylolpropane triglycidyl ether, sorbitol tetraglycidyl ether, dipentayl Add one or more alkylene oxides to aliphatic polyhydric alcohols such as hexyl glycidyl ether of erythritol, diglycidyl ether of polyethylene glycol, diglycidyl ether of polypropylene glycol, ethylene glycol or propylene glycol, glycerin.
- Examples thereof include polyglycidyl ethers of polyether polyols obtained and diglycidyl esters of aliphatic long-chain dibasic acids.
- the epoxy compound for example, monoglycidyl ether of higher aliphatic alcohol, Glycidyl esters of secondary fatty acids, epoxidized soybean oil, propyl epoxide stearate, octinole epoxide stearate, epoxy dihydro oil, epoxi polypolybutadiene and the like.
- examples of the aromatic epoxy compound include mono- or polyglycidyl ethers of monovalent or polyvalent phenols having at least one aromatic nucleus or alkylene oxide adducts thereof.
- examples thereof include monoglycidyl ethers of polyether alcohols obtained by adding alkylene oxide to these.
- the cationically polymerizable organic compound other than the oxetane compound (I) one or more of the above-described alicyclic epoxy compounds, aliphatic epoxy compounds, and aromatic epoxy compounds are used. Can be used.
- the resin composition for optical three-dimensional modeling of the present invention as another cationically polymerizable organic compound used together with the oxetane compound (I), another oxetane compound (I) other than oxetane compound (I) can be used. It is also preferable to use a cetane compound, in which case the absorption of moisture and moisture over time before curing of the resin composition for optical three-dimensional modeling can be further reduced.
- the other oxetane compound may be a shift between a monooxetane compound having one oxetane ring and a polyoxetane compound having two or more oxetane rings.
- Examples of the monooxetane compound that can be used in the optical three-dimensional resin composition of the present invention include trimethylene oxide, 3,3-dimethyloxetane, 3,3-dichloromethyloxetane, and 3-methyl. 3-phenoxymethyloxetane, 3-ethyl 3- (2-ethylhexyloxymethyl) oxetane, the following general formula (II):
- R 3 represents an alkyl group having 1 to 5 carbon atoms, an aryl group or an aralkyl group, and n represents an integer of 1 to 6.
- examples of R 3 include alkyl groups such as a methyl group, an ethyl group, a propyl group, a butyl group and a pentyl group; an aryl group such as a full group and a naphthyl group. And aralkyl groups such as a benzyl group and a phenethyl group.
- oxentane monoalcohol represented by the general formula (II) include 3-hydroxymethyl-3-methyloxetane, 3-hydroxymethyl-3-ethyloxetane, 3-hydroxymethyl-3-n-propylo Xetane, 3-hydroxymethyl-3-n-butyloxetane, 3-hydroxymethyl 3-n pentyloxetane, and the like.
- the polyoxetane compound that can be used in the resin composition for optical three-dimensional modeling of the present invention includes the following general formula (IV):
- R 5 are the same or different alkyl groups having 15 carbon atoms
- R 6 is a divalent organic group having or not having the ability to have an aromatic ring
- p is 0 or 1
- the dioxetane compound etc. which are represented by these can be mentioned.
- examples of! / And R 5 include a methyl group, an ethyl group, a propyl group, a butyl group, and a pentyl group.
- examples of R 6 include linear or branched alkylene groups having 1 to 12 carbon atoms (eg, ethylene group, propylene group, butylene group, neopentylene group, n-pentamethylene group, n xamethylene group, etc.); : CH—P
- Examples include a tanol residue; a tricyclodecane dimethanol residue.
- dioxetane compound represented by the general formula (IV) include 1,4-bis [(3-ethyl-1-oxeta-l-methoxy) methyl] benzene, 1,4-bis (3-ethyl 3 —Oxeta-lmethoxy) butane, 1,4 bis [(3-methyl-3-oxeta-lmethoxy) methyl] cyclohexane, bis (3-methyl-3-oxeta-lmethyl) ether, bis (3-ethyl 3— Oxeta-methyl) ether, bis (3-propyl-3-oxetanylmethyl) ether, bis (3-butyl-3-oxetamethyl) ether, 2,2bis [ 4 (3-Ethyl-3-oxeta-methoxy) cyclohexyl] propane.
- the resin composition for optical three-dimensional modeling of the present invention can contain one or more of the aforementioned monooxetane compound and polyoxetane compound together with the oxetane compound (I).
- the radical polymerizable organic compound contained in the optical three-dimensional modeling resin composition of the present invention includes a polymerization reaction and Z or crosslinking when irradiated with active energy rays in the presence of a radical polymerization initiator.
- a radical polymerization initiator Any compound that causes a reaction can be used, and typical examples include (meth) acrylate compounds, unsaturated polyester compounds, and the like. One or two of these ethylenically unsaturated compounds can be used.
- a compound having at least one (meth) acryl group in one molecule is preferably used, and specific examples include an epoxy compound and (meta ) Reaction products with acrylic acid, (meth) acrylic esters of alcohols, polyester (meth) acrylate, polyether (meta , And the like Atari rate.
- the reaction product of the above-mentioned epoxy compound that can be used as a radical polymerizable organic compound and (meth) allylic acid includes aromatic epoxy compounds, alicyclic epoxy compounds, and Z or aliphatic epoxy compounds.
- An epoxy (meth) acrylate reaction product obtained by reacting the compound with (meth) acrylic acid can be mentioned.
- an epoxy (meth) acrylate reaction product obtained by reaction of an aromatic epoxy compound with (meth) acrylic acid is preferably used. Specific examples thereof include bisphenol A and bisphenol F.
- Epoxy (meth) atalylate, epoxy novolac ⁇ ⁇ ⁇ obtained by reacting glycidyl ether obtained by reaction of phenol compound or its alkylene oxide adduct with epoxidizing agent such as epichlorohydrin with (meth) acrylic acid An epoxy (meth) acrylate reaction product obtained by reacting fat with (meth) acrylic acid can be mentioned.
- the (meth) acrylic acid ester of the above-mentioned alcohols that can be used as a radical polymerizable organic compound includes an aromatic alcohol having at least one hydroxyl group in the molecule.
- (meth) acrylates obtained by reacting aliphatic alcohols, alicyclic alcohols and Z or their alkylene oxide adducts with (meth) acrylic acid.
- (meth) acrylates of alcohols are (meth) acrylates having two or more (meth) acryl groups in one molecule obtained by reaction of polyhydric alcohols with (meth) acrylic acid.
- pentaerythritol tetra (meth) acrylate ethylene oxide modified pentaerythritol tetra (meth) acrylate
- propylene oxide modified penta erythritol tetra (meth) acrylate dipentaerythritol poly (meth) acrylate, etc.
- an attalylate compound is preferably used from the viewpoint of polymerization rate rather than a methacrylate compound.
- examples of the polyester (meth) acrylate that can be used as the radical polymerizable organic compound include polyester (meth) acrylate which is obtained by reaction of a hydroxyl group-containing polyester with (meth) acrylic acid. it can.
- examples of the polyether (meth) acrylate include the polyether acrylate obtained by the reaction of a hydroxyl group-containing polyether and acrylic acid.
- epoxy acrylate eg, “VR-” manufactured by Showa Polymer Co., Ltd.
- acrylic acid eg., “VR-” manufactured by Showa Polymer Co., Ltd.
- the cationic polymerization initiator cations of the oxetane compound (I) and other cationically polymerizable organic compounds other than the oxetane compound (I) when irradiated with active energy rays.
- Any polymerization initiator that can initiate polymerization can be used.
- an onium salt that releases a Lewis acid when irradiated with active energy rays is preferably used as the cationic polymerization initiator.
- such salts include the aromatic sulfo-um salt of the Group Vila element, the aromatic salt of the Via group element, and the aromatic group of the Group Va element.
- a salt etc. can be mentioned.
- triphenylsulfo-hexafluoroantimonate trifluorophenacylphosphonium tetrafluoroborate, diphenyl [4- (phenylthio) phenol] Sulfo-hexafluoroantimonate, bis- [4- (diphenylsulfo) phenol] sulfide bisdihexafluoro-oral antimonate, bis- [4- (di-1,4-hydroxyethoxyphenol) Rusulfo) phenol] sulfide bisdihexafluoroantimonate, bis [4 (diphenylsulfone) phenol] sulfide bisdihexafluorophosphate, tetrafluoroborate diphenol be able to.
- one or more of the above cationic polymerization initiators can be used.
- the aromatic sulfo salt is more preferably used in the present invention.
- a cationic polymerization initiator for the purpose of improving the reaction rate.
- a photosensitizer for example, benzophenone, benzoin alkyl ether, thioxanthone and the like may be used.
- radical polymerization initiator any polymerization initiator capable of initiating radical polymerization of a radically polymerizable organic compound when irradiated with active energy rays can be used.
- examples thereof include dialkyl acetal compounds, ferroketone compounds, acetophenone compounds, benzoin or its alkyl ether compounds, benzophenone compounds, thixanthone compounds, and the like.
- benzyl or a dialkyl acetal compound that can be used as a radical polymerization initiator include benzyl dimethyl ketal, benzyl- ⁇ -methoxyethyl acetal, and the like.
- phenol ketone compounds include 1-hydroxymonocyclohexyl phenol ketone.
- acetophenone compounds include diethoxyacetophenone, 2-hydroxymethyl-1-phenylpropane 1-on, 4 'isopropyl-2 hydroxy-2-methyl group piophenone, 2-hydroxy 2-methyl group piophenone, and ⁇ -dimethyl. Aminoacetophenone, p-tert-butyldichloroacetophenone, p-tert-butyltrichloroacetophenone, p azidobenzalacetophenone, etc.
- benzoin or an alkyl ether compound thereof examples include benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl etherol, benzoin nonolemanol butinoreethenole, benzoin isobutinoreethenore and the like. Can be mentioned.
- benzophenone-based compound examples include benzophenone, o methyl benzoylbenzoate, Michler's ketone, 4,4′-bisjetylaminobenzophenone, 4,4′-diclonal benzophenone, and the like.
- thixanthone compound examples include thixanthone, 2-methylthioxanthone, 2-ethylthioxanthone, 2-clothioxanthone, and 2-isopropyl thixanthone.
- radical polymerization initiators can be used.
- 1-hydroxycyclohexyl phenyl ketone is preferably used as the radical polymerization initiator because the resulting cured product has a good hue (eg, low yellowness).
- the resin composition for optical three-dimensional modeling of the present invention contains an oxetane compound (I), a cationically polymerizable organic compound other than the oxetane compound (I), and a cationic polymerization initiator.
- the content of each component may vary depending on the type of component, the use of the optical modeling object, etc., but in general, based on the total mass of the resin composition for optical three-dimensional modeling, oxetane
- the content of the compound (I) is 3 to 60% by mass, especially 5 to 40% by mass
- the content of the cationically polymerizable organic compound other than the oxetane hydrate compound (I) is 10 to 90% by mass, particularly 20 to 80% by mass. %
- the content of the cationic polymerization initiator is 1 to 15% by mass, particularly 2 to LO mass%, and the point power at which the effect of the present invention can be obtained smoothly is also preferable.
- the resin composition for optical three-dimensional modeling of the present invention comprises an oxetane compound (1), a cation polymerizable organic compound other than the oxetane compound (I), a radical polymerizable organic compound, a cationic polymerization initiator, and a radical polymerization.
- the content of each component may vary depending on the type of component, the use of the optical modeling object, etc., but in general, the resin composition for optical three-dimensional modeling Based on the total mass, the content of the oxetane compound (I) is 3 to 60% by mass, particularly 5 to 40% by mass, and the content of the cationically polymerizable organic compound other than the oxetane compound (I) is 20 to 70%.
- the photocurable resin composition of the present invention is not only oxetane compound (I), but also other oxetane compound (I) as a cationically polymerizable organic compound other than oxetane compound (I).
- the content of the other oxetane compound is 1 to 4 based on the total mass of the optical three-dimensional resin yarn and the composition. 60% by mass, particularly 2 to 40% by mass, is preferable for the point strength such as the mechanical strength of the cured product.
- the resin composition for optical three-dimensional modeling of the present invention can optionally contain a polyalkylene ether compound, and if it contains a polyalkylene ether compound, the resulting three-dimensional compound can be obtained.
- the physical properties such as the impact resistance of the molded article are further improved.
- R 7 and R 8 are linear or branched alkylene groups having 2 to 5 carbon atoms
- a and A ′ are each independently a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, A phenyl group, a acetyl group or a benzoyl group
- q and r each independently represent 0 or an integer of 1 or more (provided that both q and r cannot be 0 at the same time).
- a polyalkylene ether compound represented by the formula is preferably used.
- both q and r are If it is an integer of 1 or more and the sum of q and r is 3 or more, oxyalkylene units (alkylene ether units): —R 7 — 0— and oxyalkyne units (alkylene ether units): -R 8 — O may be bonded in a random manner, in a block shape, or a mixture of random and block bonds.
- R 7 and R 8 in the above polyalkylene ether compound (V) include ethylene group, n- propylene group, isopropylene group, n -butylene group (tetramethylene group). ), Isobutylene group, tert-butylene group, linear or branched pentylene group [for example, CH CH CH CH CH-, —CH CH CH (CH) CH—, etc.], etc.
- R 7 and R 8 are ethylene group, n-propylene group, isopropylene group, n-butylene group (tetramethylene group), n-pentylene group, formula: CH CH CH (
- CH 2 It is preferably any one of branched pentylene groups represented by CH 1.
- a / A in the polyalkylene ether compound (V) include hydrogen atoms, methyl groups, ethyl groups, propyl groups, butyl groups, and phenols.
- a and A ′ is a hydrogen atom
- the resin composition is cured by irradiation with active energy rays, the hydroxyl groups at both ends of the polyalkylene ether compound react with an epoxy compound or a radical polymerization initiator to cure the polyalkylene ether compound. It becomes in a state of being bonded in the reinforced resin, and properties such as impact resistance are further improved.
- polyalkylene ether-based compound (V) examples include polyethylene glycol, polypropylene glycol, polytetramethylene glycol, polyethylene oxide polypropylene oxide block copolymer, and random oxide of ethylene oxide and propylene oxide.
- a polyether having an oxytetramethylene unit (tetramethylene ether unit having an alkyl substituent) having an alkyl substituent represented by an alkyl group, preferably a methyl or ethyl group, Units and above formula: -CH CH
- polyether in which oxytetramethylene units having a hydrogen atom are bonded at random.
- polyalkylene ether compounds can be used. Among them, polytetramethylene glycol and Z or tetramethylene ether units with the number average molecular weight in the range of 500 to 10,000 mentioned above and the formula: CH
- a polyether in which tetramethylene ether units having a substituent are randomly bonded is preferably used.
- an optically shaped article having low hygroscopicity and excellent dimensional stability and physical property stability can be obtained. .
- the content of the polyalkylene ether compound (V) is the same as that of the resin composition for optical three-dimensional modeling. It is more preferably 2 to 20% by mass, preferably 1 to 30% by mass with respect to the total mass. In addition, two or more types of polyalkylene ether compounds may be contained at the same time as long as the above content is not exceeded! /.
- the resin composition for optical three-dimensional modeling of the present invention can be applied with a colorant such as a pigment and a dye, an antifoaming agent, a leveling agent, and an increase agent as long as the effects of the present invention are not impaired. Contains an appropriate amount of one or more of a sticky agent, flame retardant, antioxidant, filler (cross-linked polymer particles, silica, glass powder, ceramic powder, metal powder, etc.), refining resin, etc. Moyo.
- any of the conventionally known optical three-dimensional modeling methods and apparatuses can be used for optical three-dimensional modeling using the optical three-dimensional modeling grease yarn and composite of the present invention.
- an active energy line is selected so that a cured layer having a desired pattern can be obtained in the liquid resin composition for optical three-dimensional modeling of the present invention.
- the uncured liquid optical three-dimensional modeling resin composition is supplied to this cured layer, and the active layer is irradiated in the same manner.
- a method of finally obtaining a desired three-dimensional shaped object by repeating a laminating operation for newly forming a continuous cured layer.
- Examples of active energy rays at that time include ultraviolet rays, electron beams, X-rays, radiation, and high frequencies as described above.
- an ultraviolet ray having a wavelength of 300 to 400 nm is preferably used from an economical viewpoint, and as a light source at that time, an ultraviolet laser (for example, a semiconductor excited solid laser, an Ar laser, a He—Cd laser, etc.), high-pressure water Silver lamps, ultra-high pressure mercury lamps, low-pressure mercury lamps, xenon lamps, halogen lamps, metal halide lamps, UV LEDs (light emitting diodes), UV fluorescent lamps, etc. can be used.
- an ultraviolet laser for example, a semiconductor excited solid laser, an Ar laser, a He—Cd laser, etc.
- high-pressure water Silver lamps for example, a semiconductor excited solid laser, an Ar laser, a He—Cd laser, etc.
- high-pressure water Silver lamps for example, ultra-high pressure mercury lamps, low-pressure mercury lamps, xenon lamps, halogen lamps,
- each cured resin layer having a predetermined shape pattern by irradiating an active energy ray on a modeling surface made of a resin composition for optical three-dimensional modeling a dot shape such as a laser beam is used.
- a hardened resin layer may be formed by a stippling or drawing method using active energy rays focused on, or a micro light shutter such as a liquid crystal shutter or a digital micromirror shirt tailor (DMD).
- a modeling method may be employed in which a hardened resin layer is formed by irradiating the modeling surface with active energy rays in a planar manner through a planar drawing mask formed by arranging a plurality.
- the optical three-dimensional molding resin composition of the present invention can be widely used in the field of optical three-dimensional modeling, and is not limited in any way. Way Among them, a shape confirmation model for verifying the appearance design, a functional test model for checking the functionality of parts, a master model for producing a mold, a master model for producing a mold, and a prototype mold Direct molds can be mentioned.
- the resin composition for optical three-dimensional modeling according to the present invention is effective for producing a shape confirmation model or a function test model of a precision part or the like. More specifically, for example, it is effectively used for applications such as precision parts, electrical and electronic parts, furniture, building structures, automotive parts, various containers, and models, master molds, and processing. be able to.
- the resin composition for stereolithography manufactured in the following examples or comparative examples was placed in a desiccator (capacity 5000 ml) adjusted to 60% humidity in a beaker (capacity 100 ml) and heated at a temperature of 25 ° C. After leaving still for 14 days, the desiccator force was also taken out, and moisture (moisture) (mass%) contained in the resin composition for stereolithography was converted into a volumetric titration-type moisture measuring device ("Model KF- 06 ”)) and measured.
- Non-Patent Document 1 For stereolithography Laser light from a semiconductor-excited solid-state laser (ultraviolet light with a wavelength of 355 nm, liquid surface laser intensity lOOmW) is applied to the modeling surface (liquid surface) made of a resin composition, and the irradiation speed is changed in six steps (the amount of irradiation energy is 6). A photocured film was formed by irradiation. The produced photocured film was taken out from the photocurable resin composition liquid, uncured resin was removed, and the thickness of the cured film corresponding to six levels of energy was measured with a caliper at a constant pressure.
- a semiconductor-excited solid-state laser ultraviolet light with a wavelength of 355 nm, liquid surface laser intensity lOOmW
- the yield strength was defined as the strength at which the stereolithography object moved to plasticity.
- the bending strength and the bending elastic modulus of the specimen were measured according to JIS K-7171 using the optically shaped article CFIS K-7171 manufactured in the following examples or comparative examples. .
- the shrinkage rate was determined by the following formula.
- CFIS K-7113 Using the optically shaped object CFIS K-7113 produced in the following examples and comparative examples, a dumbbell-shaped test piece conforming to CFIS K-7113) was used, and JIS was used by using “ASKER D-type hardness meter” manufactured by Kobunshi Keiki Co., Ltd.
- JIS was used by using “ASKER D-type hardness meter” manufactured by Kobunshi Keiki Co., Ltd.
- the test piece stereolithic product is manufactured by the durometer method 4 The surface hardness of (after) was measured.
- the mixture was reacted at the same temperature for 3 hours. After completion of the reaction, the reaction solution was washed with 200 ml of heptane, 583 ml of water was added, and the mixture was separated into an aqueous layer and an organic layer. To the obtained organic layer, 1166 ml of water and 500 ml of toluene were added and separated into an aqueous layer and an organic layer. Next, 500 ml of toluene was added to the aqueous layer and extracted. The extract (toluene solution) and the previous organic layer were combined, washed with 300 ml of water, and then separated into an aqueous layer and an organic layer.
- NK Ester A—9530 10 parts, Copolymerized Tetramethylene Ether Glycol (Asahi Kasei Co., Ltd. “PTXG 1800”) 5 parts, Triarylsulfoium Hexa Saffroantimonate-based cationic polymerization initiator (“CPI-10 1A” manufactured by Sanpro Co., Ltd.) 3 parts and radical polymerization initiator (1-hydroxy-cyclohexyl phenol ketone; “Irgacure manufactured by Ciba Specialty Chemicals Co., Ltd.) 184 ”) 2 parts were mixed well at room temperature to prepare a resin composition for stereolithography.
- Example 1 (1) instead of 10 parts of 3-ethyl-3- (4-hydroxybutyl) oxymethyloxetane obtained in Synthesis Example 1 as an oxetane compound, Synthesis Example A resin composition for stereolithography was prepared in the same manner as in Example 1 (1) except that 10 parts of 3-ethyl 3- (5 hydroxypentyl) oxymethyl oxetane obtained in 2 was used.
- the viscosity and hygroscopicity of the resin composition for stereolithography were measured by the methods described above, they were as shown in Table 1 below.
- Example 1 instead of 10 parts of 3-ethyl-3- (4-hydroxybutyl) oxymethyloxetane obtained in Synthesis Example 1 as an oxetane compound, Synthesis Example A resin composition for stereolithography was prepared in the same manner as (1) of Example 1 except that 10 parts of 3 ethyl 3- (3 hydroxypropyl) oxymethyl-oxetane obtained in 3 was used. .
- the viscosity and hygroscopicity of this resin molding resin composition were measured by the methods described above and as shown in Table 1 below.
- Example 1 instead of 10 parts of 3-ethyl-3- (4-hydroxybutyl) oxymethyloxetane obtained in Synthesis Example 1 as an oxetane compound, Synthesis Example Except for using 5 parts of 3 ethyl 3- (4 hydroxybutyl) oxymethyl oxetane obtained in 1 and 5 parts of bis (3-ethyl-3-oxeta-lmethyl) ether (“OXT-221” manufactured by Toagosei Co., Ltd.) In the same manner as (1) of Example 1, a resin composition for stereolithography was prepared. The viscosity and hygroscopicity of this resin molding resin composition were measured by the methods described above, and as shown in Table 1 below.
- Viscosity (mPa-s) 380 390 370 365 360 Moisture absorption (mass%) 0.76 0.78 0.81 0.74 1.20 Hardening depth (Dp) (mm) 0.15 0.16 0.15 0.14 0.15 Critical hardening ⁇ KI '-(EcKmJ / cm 15 15 16 18 15 Work hardening ⁇ ⁇ '-(Eio) (mJ / cm2) 77 75 76 76 74
- the resin composition for stereolithography of Examples 1 to 4 containing an oxetane compound included in the category of the oxetane compound (I) is other than the oxetane compound (I).
- the moisture absorption rate is significantly smaller than before curing. Very little moisture and moisture absorption.
- the optically molded article obtained from the optical molding resin composition of Examples 1 to 4 has an elongation ratio when left standing for 14 days under the condition of 80% humidity, and the optical molding resin composition of Comparative Example 1 Physical strength It is much smaller than the obtained stereolithography and has excellent dimensional stability over time.
- Example 5 instead of 30 parts of 3-ethyl 3- (4-hydroxybutyl) oxymethyl-oxetane as an oxetane compound, 3-ethyl 3-hydroxymethyloxetane (manufactured by Toagosei Co., Ltd.) “OXT-101”) A resin composition for stereolithography was prepared in the same manner as in Example 5, (1) except that 30 parts were used. The viscosity and hygroscopicity of this resin molding resin composition were measured by the methods described above and as shown in Table 2 below.
- Example 6 (1) instead of 80 parts of 3-ethyl 3- (4-hydroxybutyl) oxymethyl-oxetane as an oxetane compound, 3-ethyl 3-hydroxymethyloxetane (manufactured by Toagosei Co., Ltd.) “OXT-101”) Except for using 80 copies A resin composition for stereolithography was prepared in the same manner as in Example 6, (1). The viscosity and hygroscopicity of this resin molding resin composition were measured by the methods described above and as shown in Table 2 below.
- the optically molded article obtained from the resin composition for optical modeling of Examples 5 and 6 has an elongation rate when left for 14 days under the condition of 80% humidity, as compared with Comparative Examples 2 and 3. Compared with the optical modeling thing obtained from the resin composition for optical modeling, it is excellent in dimensional stability over time.
- the resin composition for optical three-dimensional modeling of the present invention absorbs moisture and moisture over time in an uncured state, and can maintain a low moisture absorption rate even when placed under high humidity. , With stable physical properties and curing characteristics, excellent handleability, high strength and high curing sensitivity due to the active energy line, shortened active energy ray irradiation time, high resolution and modeling accuracy, dimensions A photomolded product excellent in stability, mechanical properties, water resistance and other properties can be produced smoothly and with good productivity.
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Engineering & Computer Science (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Polymerisation Methods In General (AREA)
- Epoxy Resins (AREA)
- Polyethers (AREA)
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2007800221727A CN101466767B (zh) | 2006-06-16 | 2007-06-15 | 立体光刻造型用树脂组合物 |
US12/304,962 US8293448B2 (en) | 2006-06-16 | 2007-06-15 | Resin composition for stereolithography |
EP07745340.5A EP2033982B1 (en) | 2006-06-16 | 2007-06-15 | Resin composition for stereolithography |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006166853A JP5280615B2 (ja) | 2006-06-16 | 2006-06-16 | 光学的立体造形用樹脂組成物 |
JP2006-166853 | 2006-06-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2007145309A1 true WO2007145309A1 (ja) | 2007-12-21 |
Family
ID=38831822
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2007/062085 WO2007145309A1 (ja) | 2006-06-16 | 2007-06-15 | 光学的立体造形用樹脂組成物 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8293448B2 (ja) |
EP (1) | EP2033982B1 (ja) |
JP (1) | JP5280615B2 (ja) |
CN (1) | CN101466767B (ja) |
WO (1) | WO2007145309A1 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011062070A1 (ja) | 2009-11-17 | 2011-05-26 | ダイセル化学工業株式会社 | オキセタン環含有(メタ)アクリル酸エステル化合物 |
US20120010320A1 (en) * | 2010-07-12 | 2012-01-12 | Nitto Denko Corporation | Photocurable resin composition and optical component using the same |
JP2012021043A (ja) * | 2010-07-12 | 2012-02-02 | Nitto Denko Corp | 光硬化型樹脂組成物およびそれを用いた光学部品 |
US20200276752A1 (en) * | 2017-09-22 | 2020-09-03 | Konica Minolta, Inc. | Resin composition, method for manufacturing three-dimensional object using resin composition, three-dimensional object, and object-gripping attachment, and industrial robot using object-gripping attachment |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5302022B2 (ja) * | 2009-01-28 | 2013-10-02 | シーメット株式会社 | 光学的立体造形用樹脂組成物 |
US8991211B1 (en) | 2009-11-01 | 2015-03-31 | The Exone Company | Three-dimensional printing glass articles |
DE102012224005B4 (de) * | 2012-12-20 | 2015-07-23 | Heraeus Kulzer Gmbh | Verfahren zur Herstellung einer homogenen Lichtverteilung |
EP3274155B1 (en) * | 2015-03-23 | 2021-06-02 | Dow Global Technologies LLC | Photocurable compositions for three-dimensional printing |
JP6967336B2 (ja) * | 2016-03-30 | 2021-11-17 | 株式会社Adeka | 硬化性組成物、その硬化物、および硬化物の製造方法 |
CN115368550B (zh) * | 2021-05-20 | 2024-01-26 | 常州强力先端电子材料有限公司 | 一种氧杂环丁烷类含氟聚合物及其制备方法 |
EP4206820A1 (en) * | 2021-12-30 | 2023-07-05 | Arkema France | Hybrid photocurable composition |
CN114957168A (zh) * | 2022-05-17 | 2022-08-30 | 大连天源基化学有限公司 | 一种3,3′-(氧基双亚甲基)双(3-乙基)氧杂环丁烷及其制备方法 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07103218B2 (ja) | 1988-09-13 | 1995-11-08 | 旭電化工業株式会社 | 光学的造形用樹脂組成物 |
JPH11199647A (ja) | 1998-01-13 | 1999-07-27 | Teijin Seiki Co Ltd | 光学的造形用樹脂組成物 |
JP2000302774A (ja) * | 1999-04-26 | 2000-10-31 | Ube Ind Ltd | ビスオキセタンエーテル化合物類の製造方法 |
WO2001022165A1 (fr) * | 1999-09-17 | 2001-03-29 | Hitachi Chemical Co., Ltd. | Compositions a base de resine photosensibles, element photosensible contenant ces compositions, procede de production d'un motif de reserve et procede de production de carte a circuit imprime |
JP2001181385A (ja) * | 1999-12-24 | 2001-07-03 | Kansai Paint Co Ltd | カチオン重合性着色組成物 |
JP2004051556A (ja) * | 2002-07-19 | 2004-02-19 | Mitsubishi Chemicals Corp | オキセタン誘導体の製造方法 |
WO2004113396A1 (ja) * | 2003-06-25 | 2004-12-29 | Cmet Inc. | 安定性の向上した活性エネルギー線硬化性の光学的立体造形用樹脂組成物 |
JP2005015739A (ja) * | 2003-06-24 | 2005-01-20 | Cmet Inc | 靱性に優れた光学的立体造形用樹脂組成物 |
WO2007037434A1 (ja) * | 2005-09-29 | 2007-04-05 | Cmet Inc. | 光学的立体造形用樹脂組成物 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11152441A (ja) * | 1997-11-21 | 1999-06-08 | Kansai Paint Co Ltd | 紫外線硬化型缶用塗料組成物 |
JP2005529200A (ja) * | 2002-05-03 | 2005-09-29 | ディーエスエム アイピー アセッツ ビー.ブイ. | 照射硬化可能な樹脂組成物及びそれを用いるラピッドプロトタイピング法 |
US7354643B2 (en) * | 2003-06-24 | 2008-04-08 | Cmet Inc. | Three-dimensional object and method of producing the same |
JP4744200B2 (ja) * | 2005-06-20 | 2011-08-10 | シーメット株式会社 | 平滑化した造形端面を有する立体造形物 |
-
2006
- 2006-06-16 JP JP2006166853A patent/JP5280615B2/ja active Active
-
2007
- 2007-06-15 EP EP07745340.5A patent/EP2033982B1/en active Active
- 2007-06-15 US US12/304,962 patent/US8293448B2/en active Active
- 2007-06-15 WO PCT/JP2007/062085 patent/WO2007145309A1/ja active Application Filing
- 2007-06-15 CN CN2007800221727A patent/CN101466767B/zh active Active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07103218B2 (ja) | 1988-09-13 | 1995-11-08 | 旭電化工業株式会社 | 光学的造形用樹脂組成物 |
JPH11199647A (ja) | 1998-01-13 | 1999-07-27 | Teijin Seiki Co Ltd | 光学的造形用樹脂組成物 |
JP2000302774A (ja) * | 1999-04-26 | 2000-10-31 | Ube Ind Ltd | ビスオキセタンエーテル化合物類の製造方法 |
WO2001022165A1 (fr) * | 1999-09-17 | 2001-03-29 | Hitachi Chemical Co., Ltd. | Compositions a base de resine photosensibles, element photosensible contenant ces compositions, procede de production d'un motif de reserve et procede de production de carte a circuit imprime |
JP2001181385A (ja) * | 1999-12-24 | 2001-07-03 | Kansai Paint Co Ltd | カチオン重合性着色組成物 |
JP2004051556A (ja) * | 2002-07-19 | 2004-02-19 | Mitsubishi Chemicals Corp | オキセタン誘導体の製造方法 |
JP2005015739A (ja) * | 2003-06-24 | 2005-01-20 | Cmet Inc | 靱性に優れた光学的立体造形用樹脂組成物 |
WO2004113396A1 (ja) * | 2003-06-25 | 2004-12-29 | Cmet Inc. | 安定性の向上した活性エネルギー線硬化性の光学的立体造形用樹脂組成物 |
WO2007037434A1 (ja) * | 2005-09-29 | 2007-04-05 | Cmet Inc. | 光学的立体造形用樹脂組成物 |
Non-Patent Citations (2)
Title |
---|
PAUL F. JACOBS: "Rapid Prototyping & Manufacturing, Fundamentals of StereoLithography", SOCIETY OF MANUFACTURING ENGINEERS, 1992, pages 28 - 39 |
See also references of EP2033982A4 |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011062070A1 (ja) | 2009-11-17 | 2011-05-26 | ダイセル化学工業株式会社 | オキセタン環含有(メタ)アクリル酸エステル化合物 |
EP2502922A4 (en) * | 2009-11-17 | 2013-04-17 | Daicel Chem | OXETANEOUS (METH) ACRYLIC ACID ESTER COMPOUND |
US8993790B2 (en) | 2009-11-17 | 2015-03-31 | Daicel Corporation | Oxetane-ring-containing (meth)acrylic acid ester compound |
JP5792070B2 (ja) * | 2009-11-17 | 2015-10-07 | 株式会社ダイセル | オキセタン環含有(メタ)アクリル酸エステル化合物 |
US20120010320A1 (en) * | 2010-07-12 | 2012-01-12 | Nitto Denko Corporation | Photocurable resin composition and optical component using the same |
JP2012021043A (ja) * | 2010-07-12 | 2012-02-02 | Nitto Denko Corp | 光硬化型樹脂組成物およびそれを用いた光学部品 |
JP2012021044A (ja) * | 2010-07-12 | 2012-02-02 | Nitto Denko Corp | 光硬化型樹脂組成物およびそれを用いた光学部品 |
US8557891B2 (en) | 2010-07-12 | 2013-10-15 | Nitto Denko Corporation | Photocurable resin composition and optical component using the same |
US8575227B2 (en) | 2010-07-12 | 2013-11-05 | Nitto Denko Corporation | Photocurable resin composition and optical component using the same |
TWI504626B (zh) * | 2010-07-12 | 2015-10-21 | Nitto Denko Corp | 光硬化樹脂組合物及使用其之光學元件 |
TWI506083B (zh) * | 2010-07-12 | 2015-11-01 | Nitto Denko Corp | 光硬化樹脂組合物及使用其之光學元件 |
US20200276752A1 (en) * | 2017-09-22 | 2020-09-03 | Konica Minolta, Inc. | Resin composition, method for manufacturing three-dimensional object using resin composition, three-dimensional object, and object-gripping attachment, and industrial robot using object-gripping attachment |
Also Published As
Publication number | Publication date |
---|---|
EP2033982A4 (en) | 2012-02-29 |
CN101466767B (zh) | 2011-12-07 |
EP2033982A1 (en) | 2009-03-11 |
CN101466767A (zh) | 2009-06-24 |
EP2033982B1 (en) | 2017-10-04 |
US20090209674A1 (en) | 2009-08-20 |
JP2007332294A (ja) | 2007-12-27 |
JP5280615B2 (ja) | 2013-09-04 |
US8293448B2 (en) | 2012-10-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2007145309A1 (ja) | 光学的立体造形用樹脂組成物 | |
KR101341081B1 (ko) | 광학적 입체 조형용 수지 조성물 | |
JP4969137B2 (ja) | 光学的立体造形用樹脂組成物 | |
JP4925900B2 (ja) | 光学的立体造形用樹脂組成物 | |
JP5280610B2 (ja) | 安定性の向上した活性エネルギー線硬化性の光学的立体造形用樹脂組成物 | |
JP5266131B2 (ja) | 光学的立体造形用樹脂組成物 | |
JP5111774B2 (ja) | 光学的立体造形用樹脂組成物 | |
JP6457860B2 (ja) | 光学的立体造形用樹脂組成物 | |
WO2009145167A1 (ja) | 光学的立体造形用樹脂組成物 | |
JP3974336B2 (ja) | 光学的立体造形用の活性エネルギー線硬化性樹脂組成物 | |
JP6348702B2 (ja) | 光学的立体造形用樹脂組成物 | |
JP2013151703A (ja) | 光学的立体造形用樹脂組成物 | |
JP6865460B2 (ja) | 光学的立体造形用樹脂組成物 | |
JP5205018B2 (ja) | 光学的立体造形用樹脂組成物 | |
JP5302022B2 (ja) | 光学的立体造形用樹脂組成物 | |
JP4795630B2 (ja) | 靱性に優れた光学的立体造形用樹脂組成物 | |
JP2009203306A (ja) | 光学的立体造形用樹脂組成物 | |
JP2007238828A (ja) | 光学的立体造形用樹脂組成物 | |
JP2008063514A (ja) | 光学的立体造形用樹脂組成物 | |
JP4993535B2 (ja) | 立体造形物の製造法 | |
JP6570011B2 (ja) | 光学的立体造形用樹脂組成物 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 200780022172.7 Country of ref document: CN |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 07745340 Country of ref document: EP Kind code of ref document: A1 |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
REEP | Request for entry into the european phase |
Ref document number: 2007745340 Country of ref document: EP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2007745340 Country of ref document: EP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 12304962 Country of ref document: US |