WO2007026944A1 - 回路装置およびその製造方法 - Google Patents
回路装置およびその製造方法 Download PDFInfo
- Publication number
- WO2007026944A1 WO2007026944A1 PCT/JP2006/317604 JP2006317604W WO2007026944A1 WO 2007026944 A1 WO2007026944 A1 WO 2007026944A1 JP 2006317604 W JP2006317604 W JP 2006317604W WO 2007026944 A1 WO2007026944 A1 WO 2007026944A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- circuit
- circuit board
- lead
- land portion
- insulating layer
- Prior art date
Links
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- 238000000034 method Methods 0.000 title claims description 31
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Classifications
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- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49861—Lead-frames fixed on or encapsulated in insulating substrates
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- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
Definitions
- the present invention relates to a circuit device and a method for manufacturing the circuit device, and more particularly to a circuit device and a method for manufacturing the circuit device in which a single semiconductor element is mounted on the surface of a circuit board.
- a conductive pattern 10 3 is formed on the surface of the rectangular substrate 10 1 through an insulating layer 10 2.
- a circuit element is fixed to a desired portion of the conductive pattern 103 to form a predetermined electric circuit.
- the semiconductor element 10 5 A and the chip element 10 5 B are connected to the conductive pattern 10 3 as circuit elements.
- the lead 104 is connected to a pad 1009 made of a conductive pattern 103 formed on the periphery of the substrate 1001 and functions as an external terminal.
- the sealing resin 10 8 has a function of sealing an electric circuit formed on the surface of the substrate 10 1.
- the semiconductor element 10 5 A is a power element through which a large current of, for example, 1 ampere or more passes, and generates a large amount of heat. For this reason, the semiconductor element 10 5 A has been placed on top of the heat sink 1 10 placed on the conductive pattern 10 3.
- the hybrid integrated circuit device 100 described above employs the heat sink 110, there is a problem in that the overall configuration becomes complicated and the cost increases.
- a wide conductive pattern 1 0 3 is supplied to the circuit board 1 in order to supply current to the semiconductor element 1 0 5 A.
- 0 Must be formed on 1.
- the conductive pattern 103 is thinly formed to about 50 ⁇ m, for example, in order to increase the current capacity of the conductive pattern 103, its width is set to about several mm. It needs to be wide. This had the problem of increasing the overall size of the device.
- the heat sink 1 1 0 must be formed and placed on the circuit board 1 0 1, which increases man-hours and increases manufacturing costs.
- the present invention has been made in view of the above-described problems, and a main object of the present invention is to provide a circuit device capable of simplifying a structure in which a power semiconductor element is incorporated and a method for manufacturing the same.
- the circuit device of the present invention includes a circuit board, a conductive pattern formed on an upper surface of the circuit board, a circuit element electrically connected to the conductive pattern, and an external connection electrically connected to the circuit element.
- the circuit element is mounted on an upper surface of a land portion formed of a part of the lead, and the lower surface of the land portion is fixed to the circuit board.
- the method of manufacturing a circuit device includes a step of forming a conductive pattern on an upper surface of an insulating layer formed so as to cover a circuit board, a step of electrically connecting a circuit element to the conductive pattern, Adhering a lead to the surface of the circuit board, and adhering the circuit element to a land portion provided in a part of the lead. It is characterized by that.
- the method for manufacturing a circuit device includes a step of attaching a conductive foil to an upper surface of a circuit board via a B-stage insulating layer, and a step of patterning the conductive foil to form a conductive pattern. And a step of adhering a circuit element to a land portion formed of a part of the lead, and a step of attaching a lower surface of the land portion of the lead to the surface of the insulating layer.
- FIG. 1 (A) is a perspective view of the circuit device of the present invention
- FIG. 1 (B) is a perspective view of the circuit device of the present invention
- FIG. 2 (A) is a circuit of the present invention
- FIG. 2 (B) is a sectional view of the circuit device of the present invention
- FIG. 3 (A) is a perspective view of the circuit device of the present invention
- FIG. 3 (B). Is a perspective view of the circuit device of the present invention
- FIG. 4 (A) is a cross-sectional view for explaining a method of manufacturing the circuit device of the present invention
- FIG. 4 (B) is a circuit device of the present invention.
- FIG. 4 (A) is a cross-sectional view for explaining a method of manufacturing the circuit device of the present invention
- FIG. 4 (B) is a circuit device of the present invention.
- FIG. 4 (C) is a cross-sectional view illustrating a method for manufacturing the circuit device of the present invention
- FIG. 4 (D) is a circuit diagram of the present invention
- FIG. 4 (E) is a cross-sectional view illustrating a method for manufacturing the circuit device of the present invention
- FIG. 5 (A) is a cross-sectional view illustrating the method for manufacturing the circuit device of the present invention.
- Manufacturing method FIG. 5 (B) is a plan view for explaining the method for manufacturing the circuit device of the present invention
- FIG. 5 (C) is for explaining the method for manufacturing the circuit device of the present invention. Is a sectional view of the first
- FIG. 6 (A) is a plan view for explaining the method for manufacturing the circuit device of the present invention
- FIG. 6 (B) is a sectional view for explaining the method for manufacturing the circuit device of the present invention.
- FIG. 9 is a cross-sectional view for explaining a manufacturing method of a clear circuit device
- FIG. 9 is a cross-sectional view for explaining a conventional hybrid integrated circuit device.
- FIG. 1 the structure of a hybrid integrated circuit device 10 will be described as an example of a circuit device with reference to FIGS. 1 to 3.
- FIG. 1 the structure of a hybrid integrated circuit device 10 will be described as an example of a circuit device with reference to FIGS. 1 to 3.
- FIG. 1 the structure of a hybrid integrated circuit device 10 will be described as an example of a circuit device with reference to FIGS. 1 to 3.
- FIG. 1 the structure of a hybrid integrated circuit device 10 will be described as an example of a circuit device with reference to FIGS. 1 to 3.
- FIG. 1 (A) is a perspective view of the hybrid integrated circuit device 10 as viewed obliquely from above.
- FIG. 1 (B) is a perspective view of the hybrid integrated circuit device 10 from which the sealing resin 14 for sealing the whole is omitted.
- an insulating layer 12 is formed on the surface of the rectangular circuit board 11.
- circuit elements such as an LSI control element 15 A and a chip element 15 C are electrically connected to predetermined portions of the conductive pattern 13 formed on the surface of the insulating layer 12. Yes.
- the conductive pattern 13 and the circuit element formed on the surface of the circuit board 11 are covered with a sealing resin 14.
- the lead 25 is led out from the sealing resin 14 to the outside.
- the circuit board 11 is a metal board whose main material is a metal such as aluminum (A 1) or copper (Cu).
- a board made of aluminum is used as the circuit board 1 1, both main surfaces of the circuit board 1 1 are subjected to an aluminum treatment.
- the insulating layer 12 is formed so as to cover the entire upper surface of the circuit board 1.1.
- Insulation layer 1 2 filler such as AL 2 ⁇ 3 consists of highly filled epoxy resin.
- the specific thickness of the insulating layer 1 2 is For example, it is about 50 ⁇ m.
- the back surface of the circuit board 11 may be covered with the insulating layer 12. In this way, even if the back surface of the circuit board 11 is exposed to the outside from the sealing resin 14, the back surface of the circuit board 11 can be insulated from the outside.
- the conductive pattern 13 is made of a metal such as copper, and is formed on the surface of the insulating layer 12 so that a predetermined electric circuit is formed.
- a pad 13 3 made of the conductive pattern 13 is formed on the side from which the lead 25 is led out.
- a large number of pads 13 A are formed around the control element 15 A, and the pad 13 A and the control element 15 A are connected by a thin metal wire 17.
- a single-layer conductive pattern 13 is shown here, a multi-layer conductive pattern 13 laminated via an insulating layer may be formed on the upper surface of the circuit board 11.
- the thickness of the conductive pattern 1 3 provided on the upper surface of the insulating layer 1 2 is 50 ⁇ ⁇ ! It is formed by patterning a thin conductive film of about ⁇ 100 ⁇ m. Therefore, the width of the conductive pattern 1 3 is 50 ⁇ ! It can be formed as narrow as ⁇ ⁇ ⁇ ⁇ ⁇ m. In addition, the distance between the conductive patterns 1 3 is 5 0 n! It can also be narrowed to ⁇ ⁇ ⁇ ⁇ ⁇ m. Therefore, even if the control element 15 A is an element having several hundred electrodes, the pad 13 A corresponding to the number of electrodes can be formed around the control element 15 A. In addition, a complicated electrical circuit can be formed on the surface of the circuit board 11 by the finely formed conductive pattern 13.
- an active element or a receiving element can be generally adopted. Specifically, transistors, LSI chips, diodes, chip resistors, chip capacitors, inductances, thermistors, antennas, oscillators, etc. can be used as circuit elements. Furthermore, a resin-sealed package or the like can be fixed to the conductive pattern 13 as a circuit element.
- the upper surface of the circuit board 11 is controlled as a circuit element.
- a control element 15 A, a power element 15 B, and a chip element 15 C are arranged.
- the control electrode 15 A is an LSI having a predetermined electric circuit formed on the surface, and supplies an electric signal to the control electrode of the power element 15 B.
- the power element 15 B is an element through which, for example, a current of 1 ampere or more passes through the main electrode, and its operation is controlled by the control element 15 A.
- MOSFETs Metal-Oxide Semiconductor Field Effect Transistors
- IGBTs Insulated Gate Bipolar Transistors
- ICs Integrated Circuits
- bipolar transistors can be used as the power elements 15 B.
- the power element 15 B is placed on the upper surface of the land portion 18 consisting of a part of the lead 25 A. Details of this matter are described below.
- the sealing resin 14 is formed by a transfer mold using a thermosetting resin or an injection mold using a thermoplastic resin.
- the conductive pattern 13, the circuit element, the chip element 15 B, and the metal thin wire 17 are sealed with the sealing resin 14.
- the entire circuit board 1 1 including the back surface of the circuit board 1 1 may be covered with the sealing resin 1 4, or the back surface of the circuit board 1 1 may be exposed from the sealing resin 1 4. .
- the lead 25 is made of a metal whose main component is copper (C u), aluminum (A 1), an Fe—N i alloy, or the like.
- the lead 2 5 is connected to the pad 1 3 A provided along two opposing sides of the circuit board 1 1.
- pad 1 3 A may be provided along one side or four sides of circuit board 1 1, and lead 2 5 may be connected to pad 1 3 A.
- the lead 25 has a bent gull wing shape.
- the area inside the outer peripheral edge of the circuit board 11 is inside. In the area, a portion inclined upward is provided. Accordingly, since the side surface of the circuit board 11 is separated from the lead 25, short-circuit between them is prevented.
- a land portion 18 is provided in a part of the lead 25 A, and the back surface of the land portion 18 is attached to the upper surface of the insulating layer 12.
- the power element 15 B described above is mounted on the upper surface of the land portion 18.
- the land portion 18 functions as a heat sink, so the heat generated from the power element 15 B is good via the land portion 18, the insulating layer 12, and the circuit board 11. To the outside.
- the land portion 18 is composed of a part of the lead 25 A, and the back surface of the land portion 18 is adhered to the front surface of the circuit board 11 1, so that the lead 25 A is fixed to the circuit board 11.
- a land portion 18 is formed by widening a part of the lead 25 A.
- the planar size of the land portion 18 is formed larger than that of the power element 15 B mounted on the upper surface.
- the lead 25 A is formed by etching or pressing a metal plate having a thickness of about 0.5 mm. Therefore, the lead 25 A is formed thicker than the conductive pattern 13 formed on the upper surface of the circuit board 11. For this reason, the land portion 18 consisting of a part of the lead 25 A is also formed thick, functions as a heat sink, and contributes to heat dissipation from the power element 15 B.
- the electrode formed on the upper surface of the power element 15 B is connected to the pad 13 A on the circuit board 11 via the fine metal wire 17.
- FIGS. 2 (A) and 2 (B) are cross-sectional views showing the structure to which the power element 15 B is fixed.
- the land portion 18 of the lead 25 A is directly fixed to the insulating layer 12 covering the upper surface of the circuit board 11.
- the insulating layer 12 is heated and cured, so that the back surface of the land portion 18 becomes the circuit board 1. Fixed to 1. With such a structure, since only the insulating layer 12 is interposed between the land portion 18 and the circuit board 11, the heat generated from the power element 15 B can be efficiently transferred to the outside. Can be released.
- the back surface of the land portion 18 is fixed to the land-like conductive pattern 13 formed on the upper surface of the insulating layer 12 via a fixing material 16 B such as solder. ing.
- the bonding material 1 6 A used for mounting the power element 15 B and the bonding material 1 6 B used for mounting the land portion 1 8 should have different melting points. It is preferable.
- the bonding material 16 A melts. It is preferable that the temperature of the adhesive is higher than that of the bonding material 16 B. As a result, the land portion 18 to which the power element 15 B is fixed via the bonding material 16 A is mounted on the circuit board 11 1 using the molten bonding material 16 B. In this case, the bonding material 16 A can be prevented from melting. Also, when the power element 15 B is mounted on the land 18 after the land 18 is fixed to the circuit board 11 1, the temperature at which the bonding material 16 B melts is set to the bonding material 16 A It is preferable to make it higher. As a result, in the process of melting the bonding material 16 A and mounting the power element 15 B on the upper surface of the land portion 18, the fixing material 18 B used for fixing the land portion 18. It is possible to prevent the material from melting.
- one power element 15 B is fixed to the land portion 18 provided on the lead 25 A.
- plurality (two in this case) of power elements 15 B can be mounted on the top surface of 8.
- a plurality of leads 25 A can be provided for one land portion 18.
- conductive foil 20 is attached to the entire upper surface of circuit board 11 via insulating layer 12.
- the circuit board 11 is made of a metal whose main material is copper or aluminum.
- a metal whose main material is copper or aluminum.
- an aluminum board having a thickness of about 1.5 mm in which both main surfaces are anodized can be used.
- the conductive foil 20 has a thickness of 50 ⁇ ! It is possible to search for a conductive foil whose main material is copper of about ⁇ 100 m.
- the insulating layer 12 is made of an epoxy resin or the like highly filled with a filler such as AL 2 0 3 and functions as an adhesive material for bonding the circuit board 1 1 and the conductive foil 2 0. Furthermore, the insulating layer 12 has a function of insulating the circuit board 11 and the conductive foil 20. In this process, the insulating layer 12 may be in a fully cured C stage state or in a semi-cured B stage state. Set insulation layer 1 2 to C stage When heated to about 200 degrees, it is heated to about 100 degrees when setting to the B stage state. The insulating layer 12 in the B stage state has an adhesive force.
- the back surface of the land portion 18 of the lead 25 A can be attached to the upper surface of the insulating layer 12 in a later step. Further, as shown in FIG. 2 (B) later, when the land portion 18 of lead 25 A is fixed to the conductive pattern 13 as shown in FIG. The state is good.
- conductive pattern 13 is formed by patterning conductive foil 20.
- the conductive pattern 13 is formed by wet etching using an unillustrated etching resist.
- the conductive foil 20 is etched so that the insulating layer 12 in the region where the lead 25A is fixed is exposed in a later step.
- the back surface of land portion 18 of lead 25A is adhered to the upper surface of insulating layer 12 in the B stage state.
- the surface of the insulating layer 12 in the B-stage state (semi-cured state) has adhesive strength. Therefore, by sticking the land portion 18 provided on a part of the lead 25 A to the upper surface of the insulating layer 12 2, the lead 25 A is fixed to the circuit board 11. be able to.
- the insulating layer 12 is heated to about 200 ° C., so that the insulating layer 12 is brought into the C stage state (fully cured state).
- the power element 15 B may be mounted on the upper surface of the land portion 18 in advance.
- the circuit element is electrically connected to the conductive pattern 13 of the circuit board 11.
- the control element 15 A and the chip element 15 C which are semiconductor elements are fixed to the conductive pattern 13.
- the lead 25 is also fixed to the pad 13 A composed of the land-like conductive pattern 13.
- the electrode on the surface of the control element 15 A is connected to the conductive pattern 1 3 through the metal thin wire 17.
- the power element 15 B fixed to the upper surface of the land portion 1 8 is also connected to the conductive pattern 1 3 on the circuit board 1 1 through the metal thin wire 17. It is.
- sealing resin 14 is formed so that at least the upper surface of circuit board 11 is sealed.
- the entire surface of the circuit board 11 is sealed by transfer molding using a thermosetting resin.
- the structure for sealing the circuit board 11 1 may be injection molding, potting, sealing with a case material, or the like.
- FIG. 5 (A) is a plan view showing one unit 46 provided in the lead frame 40
- FIG. 5 (B) is a plan view showing the entire lead frame 40
- FIG. 5 (C) is a cross-sectional view showing the land portion 18 provided on the lead 25A.
- a region where the circuit board 11 is placed in a later process is indicated by a dotted line.
- the unit 46 is composed of a large number of leads 25 having one end positioned in an area where the circuit board 11 is placed.
- the lead 25 extends from the left and right directions toward the area on which the circuit board 11 is placed on the paper.
- the plurality of leads 25 are connected to each other by a tieper 44 extending from the outer frame 41 1, thereby preventing deformation.
- a land portion 18 that is partially widened is provided at the tip of the lead 25 A.
- a plurality of units 46 having the above-described configuration are arranged apart from each other in strip-shaped lead frame 40.
- a hybrid integrated circuit device is manufactured by providing a plurality of units 46 on the lead frame 40, thereby improving the productivity by performing wire bonding and molding processes all at once. I am letting.
- power element 15 B is fixed to land portion 18 of lead 25A. ing.
- the back surface of the power element 15 B is fixed to the upper surface of the land portion 18 via a fixing material 16 A made of solder or a conductive paste.
- FIG. 6 (A) is a plan view showing the unit 46 of the lead frame 40.
- FIGS. 6 (B) and 6 (C) show that the power element 15 B is connected to the land portion 18. It is sectional drawing which shows the location fixed.
- the circuit board 11 is secured to the pad frame 1 by attaching the lead 2 5 to the pad 1 3 A formed on the periphery of the circuit board 1 1. Secure to.
- the leading end of the lead 25 is fixed to the pad 13 A on the circuit board 11 1 through a fixing material such as solder.
- the land portion 18 of the lead 25 A is fixed to the upper left end portion of the circuit board 11 in the drawing.
- the back surface of the land portion 1 8 may be fixed to the conductive pattern 13 formed on the upper surface of the circuit board 1 1, or attached to the insulating layer 1 2 covering the upper surface of the circuit board 1 1. 0
- a circuit element such as a semiconductor element is mounted on the circuit board 11.
- the circuit board 1 1 on which the circuit elements are mounted in advance may be fixed to the lead frame 40, or after the circuit board 1 1 is fixed to the lead frame 40, the circuit elements are connected to the circuit board 1 1. May be implemented.
- the mounted circuit element is connected to the conductive pattern 1 3 through the metal thin wire 1 7.
- the back surface of the land portion 18 formed at the leading end of the lead 25 A is shaped like a land through a bonding material 16 B such as solder.
- the conductive pattern 1 is fixed to 3.
- a power element 15 B such as a power MOS is fixed to the upper surface of the land portion 18 via a bonding material 16 A.
- the electrode formed on the upper surface of the power element 1 5 B is connected to the conductive pattern 1 through the fine metal wire 1 7. Connected with 3.
- the bonding material 16 A used for mounting the power element 15 B and the bonding material 16 B used for mounting the land portion 18 may be different in melting point. Are preferred.
- the bonding material 16 A melts. It is preferable that the temperature of the adhesive is higher than that of the bonding material 16 B. Also, when the power element 15 B is mounted on the land portion 1 8 after the land portion 1 8 is fixed to the circuit board 11, the melting temperature of the bonding material 1 6 B is set to the bonding material 1 6 Higher than A is preferable.
- the back surface of land portion 18 is adhered to the upper surface of insulating layer 12 in the B stage state.
- the insulating layer 12 in the B-stage state is in a semi-solid state and has strong adhesiveness, so that the back surface of the land portion 18 is fixed to the circuit board 11 1 by using the insulating layer 12 as an adhesive. Can do.
- heat treatment for curing the insulating layer 12 is performed.
- FIG. 7 (A) is a cross-sectional view showing the process of molding the circuit board 11 using a mold
- FIG. 7 (B) is a plan view showing the lead frame 40 after molding.
- circuit board 11 is housed in a cavity 2 3 formed from upper mold 2 2 A and lower mold 2 2 B.
- the position of the circuit board 11 inside the cavity 23 is fixed by bringing the upper mold 2 2 A and the lower mold 2 2 B into contact with the lead 25.
- resin is injected into the cavity 23 from a gate (not shown) provided in the mold, and the circuit board 11 is sealed.
- transfer molding or thermosetting resin is used. The injection molding using a thermoplastic resin is performed.
- lead 25 is separated from lead frame 40. Specifically, the leads 25 are individually separated at the locations where the typers 44 are provided, and the hybrid integrated circuit device as shown in FIG. 1 is separated from the lead frame 40.
- FIG. 8 (A) is a plan view of the unit 46 of the lead frame 40
- FIG. 8 (B) is a cross-sectional view of the place where the land portion 18 is provided.
- leads 25 A having land portions 18 formed at the tips are arranged corresponding to the four corners of circuit board 11. Yes.
- the back surface of the land portion 18 is attached to the insulating layer 12 in the B stage state. Accordingly, here, the circuit board 11 is fixed to the lead frame 40 by the lead 25 A provided with the land portion 18.
- four leads 25 A for supporting the circuit board 11 are not necessarily required, and the circuit board 11 can be supported by arranging at least two leads 25 A.
- the circuit board 1 1 As described above, by supporting the circuit board 1 1 with the leads 2 5 A arranged at the four corners of the circuit board 1 1, the circuit board 1 1 is mechanically attached to the other leads 2 5. There is no need to have a supporting function. Therefore, the pad 13 A formed on the periphery of the circuit board 11 and the lead 25 can be connected via the thin metal wire 17. In this way, the connection using the thin metal wire 17 makes it possible to connect the lead 25 to the pad 13 A as shown in Fig. 1. More pads 13 A can be provided along the side. This is because the size of each pad 13 A can be reduced to the extent that wire bonding is possible.
- the circuit is formed on the upper surface of the land portion formed of a part of the lead. Since the element is mounted and the back surface of the land portion is fixed to the circuit board, this land portion functions like the above-described heat sink. Therefore, the circuit device can be configured without the heat sink. Furthermore, since the circuit element is directly fixed to the land which is a part of the lead, the conductive pattern from the circuit element to the lead is partially unnecessary. As a result, the configuration of the circuit device can be simplified and the cost can be reduced.
- the back surface of the land to which the circuit element is fixed can be fixed to the circuit board by using the adhesive force of the insulating layer in the B stage state. Therefore, since only the insulating layer is interposed between the land and the circuit board, the heat generated from the circuit elements mounted on the upper surface of the land is well released to the outside.
- the process of placing the heat sink on the circuit board is not required, so the number of processes is reduced and the manufacturing cost is reduced.
- a land composed of a part of the lead is attached to the surface of the B-stage insulating layer formed on the upper surface of the circuit board, and the insulating layer is thermally cured, so that the lead is attached to the circuit board. It is stuck to. Therefore, the lead can be fixed to the circuit board without using a fixing material such as solder.
- the back surface of the land consisting of a part of the lead is attached to an insulating layer covering the surface of the circuit board.
- the circuit board can be fixed to the lead frame.
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Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
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CN2006800318272A CN101253627B (zh) | 2005-08-31 | 2006-08-30 | 电路装置及其制造方法 |
JP2007533378A JPWO2007026944A1 (ja) | 2005-08-31 | 2006-08-30 | 回路装置およびその製造方法 |
US12/065,001 US8203848B2 (en) | 2005-08-31 | 2006-08-30 | Circuit device and method of manufacturing the same |
Applications Claiming Priority (2)
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JP2005252188 | 2005-08-31 | ||
JP2005-252188 | 2005-08-31 |
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PCT/JP2006/317604 WO2007026944A1 (ja) | 2005-08-31 | 2006-08-30 | 回路装置およびその製造方法 |
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US (1) | US8203848B2 (ja) |
JP (1) | JPWO2007026944A1 (ja) |
KR (1) | KR20080031446A (ja) |
CN (1) | CN101253627B (ja) |
TW (1) | TWI322646B (ja) |
WO (1) | WO2007026944A1 (ja) |
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- 2006-08-30 TW TW95131934A patent/TWI322646B/zh not_active IP Right Cessation
- 2006-08-30 CN CN2006800318272A patent/CN101253627B/zh not_active Expired - Fee Related
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JP2011096996A (ja) * | 2009-10-29 | 2011-05-12 | Samsung Electro-Mechanics Co Ltd | 放熱構造物及びその製造方法 |
TWI422078B (zh) * | 2009-10-29 | 2014-01-01 | Samsung Electro Mech | 熱輻射結構以及製造其之方法 |
JP2013016769A (ja) * | 2011-07-04 | 2013-01-24 | Samsung Electro-Mechanics Co Ltd | パワーモジュールパッケージ及びその製造方法 |
JP2013201325A (ja) * | 2012-03-26 | 2013-10-03 | Semiconductor Components Industries Llc | 回路装置 |
JP2013243323A (ja) * | 2012-05-23 | 2013-12-05 | Mitsubishi Electric Corp | 半導体装置および半導体装置の製造方法 |
JP2014090104A (ja) * | 2012-10-31 | 2014-05-15 | Denso Corp | 半導体装置およびその製造方法 |
JP2017139406A (ja) * | 2016-02-05 | 2017-08-10 | 富士電機株式会社 | 半導体装置 |
JP7071499B2 (ja) | 2018-06-20 | 2022-05-19 | ローム株式会社 | 半導体装置 |
JPWO2019244372A1 (ja) * | 2018-06-20 | 2021-03-25 | ローム株式会社 | 半導体装置 |
WO2019244372A1 (ja) * | 2018-06-20 | 2019-12-26 | ローム株式会社 | 半導体装置 |
JP2022105164A (ja) * | 2018-06-20 | 2022-07-12 | ローム株式会社 | 半導体装置 |
US11437354B2 (en) | 2018-06-20 | 2022-09-06 | Rohm Co, Ltd. | Semiconductor device |
JP7357719B2 (ja) | 2018-06-20 | 2023-10-06 | ローム株式会社 | 半導体装置 |
US11804478B2 (en) | 2018-06-20 | 2023-10-31 | Rohm Co., Ltd. | Semiconductor device |
WO2020162389A1 (ja) * | 2019-02-07 | 2020-08-13 | ローム株式会社 | スイッチ駆動装置 |
JPWO2020162389A1 (ja) * | 2019-02-07 | 2021-12-09 | ローム株式会社 | スイッチ駆動装置 |
US11502675B2 (en) | 2019-02-07 | 2022-11-15 | Rohm Co., Ltd. | Switch driving device |
JP7343533B2 (ja) | 2019-02-07 | 2023-09-12 | ローム株式会社 | スイッチ駆動装置 |
WO2021251126A1 (ja) * | 2020-06-08 | 2021-12-16 | ローム株式会社 | 半導体装置 |
Also Published As
Publication number | Publication date |
---|---|
TW200726340A (en) | 2007-07-01 |
KR20080031446A (ko) | 2008-04-08 |
US20090129038A1 (en) | 2009-05-21 |
CN101253627B (zh) | 2011-09-14 |
TWI322646B (en) | 2010-03-21 |
US8203848B2 (en) | 2012-06-19 |
CN101253627A (zh) | 2008-08-27 |
JPWO2007026944A1 (ja) | 2009-03-12 |
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