WO2007097356A1

WO2007097356A1 - Ultrafine coaxial line and ultrafine coaxial barrel and production method for them

Info

Publication number: WO2007097356A1
Application number: PCT/JP2007/053161
Authority: WO
Inventors: Kesao Kojima; Yutaka Ichikawa
Original assignee: Luzcom Inc.
Priority date: 2006-02-21
Filing date: 2007-02-21
Publication date: 2007-08-30

Abstract

[PROBLEMS] A ultrafine coaxial line which is very fine and is provided with stable conductivity and excellent high frequency characteristics and a production method therefore, and a ultrafine coaxial barrel which can be fined in diameter and is used as a barrel for an coaxial probe and a production method therefore. [MEANS OF SOLVING PROBLEMS] A ultrafine coaxial line which is a coaxial line having core material consisting of noble metal or its alloy as its center and having an outer diameter of up to 200 μm, and which has self-resiliency and a Vickers hardness of at least 450 HV. A ultrafine coaxial barrel containing an insulation layer on the inner peripheral side thereof and is used as a barrel for a coaxial probe, wherein the insulation layer is formed on the outer periphery of a tubular first nickel layer and the barrel’ outer diameter is at least 80 μm.

Description

Specification

Ultrafine coaxial wire, ultrafine coaxial barrel, and methods of manufacturing the same

Technical field

TECHNICAL FIELD [0001] The present invention relates to an ultrafine coaxial wire having an outer diameter of, for example, 200 m or less and a manufacturing method thereof, and an ultrafine coaxial barrel and a manufacturing method thereof.

Background art

[0002] As electronic devices, IC testers, medical devices, and other devices become more sophisticated and integrated circuits such as ICs and LSIs become smaller, higher density, larger capacity, and higher performance, they are used in these. There is also a demand for ultra-thin wires. In addition, along with higher performance of devices (for example, higher resolution of images, higher speed of communication speed, etc.), stable energization, higher transmission quality in signal transmission, and superior performance suitable for use in high frequency bands High frequency characteristics are also required.

[0003] For example, in the case of a probe pin of a contact probe (Patent Document 1) used in a printed circuit board inspection apparatus for inspecting a circuit pattern on a printed circuit board, the following is required.

[0004] Usually, a probe in which several tens or hundreds of probe pins are arranged on a printed wiring board is used for an energization inspection of an integrated circuit or a liquid crystal device of a semiconductor wafer constituting an integrated circuit such as an IC or LSI. A card is used. In conducting an electrical current inspection, the tip of the probe pin is brought into contact with a plurality of electrode pads such as an integrated circuit chip of a semiconductor wafer or a liquid crystal display device, and a predetermined inspection signal is input from the inspection device side to inspect the electrical characteristics. Speak.

[0005] Here, as described above, as the integrated circuits such as ICs and LSIs become smaller, higher density, larger capacity, and higher performance, the probe card also has a smaller diameter in the probe card. However, high-density mounting is required, but the probe pin can withstand an energization test that breaks the electrode pad oxide film and contacts the electrode pad hundreds of thousands of times and millions of times. It must also have high electrical conductivity, elasticity, strength, corrosion resistance, and good workability for placement on a probe card.

[0006] Therefore, the probe pin is required to satisfy the requirements for a reduction in diameter, and at the same time, have high conductivity, elasticity, strength, corrosion resistance, and good workability for placement in the probe card. Will be. In the past, proposals have been made regarding the small diameter of coaxial wires that should deal with this situation.

As described above, in the semiconductor device manufacturing process, after a large number of IC chips (semiconductor devices) are formed on a semiconductor wafer, the electrical connection state and input / output characteristics of each IC chip are examined. Therefore, an electrical measurement called a probe test is performed. In this way, the quality of these IC chips is determined in the state of the semiconductor wafer before each IC chip is divided. In this probe test, a probe card is used that has a plurality of probes arranged corresponding to the electrode pad arrangement of the IC chip formed on the semiconductor wafer.

[0008] The probe card is electrically connected to the tester, and a probe corresponding thereto is brought into contact with each electrode pad of the IC chip to be inspected, and a test signal is transmitted between the tester and the IC chip to be inspected. Used to transmit.

[0009] In recent years, the operating speed of semiconductor devices has increased, and in connection with this, it has become necessary to inspect IC chips using test signals with a high frequency of several hundred MHz in probe tests. . In the probe test using such a high frequency signal, a coaxial probe for a probe card is used.

[0010] The coaxial probe has the same coaxial line structure as that of the coaxial cable, and has a lower transmission loss at high frequencies, less noise entering the transmission signal, and stable characteristic impedance compared to the parallel two-wire line. It has the advantage of being

[0011] A conventional coaxial probe is formed by slidably inserting a conductive needle (center conductor) for signal transmission made of a conductive member into a cylindrical barrel. The tip of the conductive needle also exposes the opening force of the cylindrical barrel tip so that it contacts the electrode pad of the IC chip. On the other hand, the rear end portion of the conductive needle is electrically connected to a conductive needle electrode pad provided on the probe card substrate, and this conductive needle pad is electrically connected to the tester. The cylindrical barrel is made of a conductive member including an insulating layer on the inner peripheral side, and the rear end of the barrel is electrically connected to an external conductor electrode pad provided on the probe card substrate, This external conductor electrode pad is electrically connected to the ground of the tester. [0012] Conventionally, a cylindrical barrel made of a conductive member including an insulating layer on the inner peripheral side is generally formed of a conductive metal, for example, a copper alloy or an aluminum alloy, and is included in the inner peripheral side. The insulating layer is formed of an insulator having a low relative dielectric constant, for example, Teflon (registered trademark) in order to reduce transmission loss.

In such a conventional coaxial probe, if the insulating layer is made of Teflon (registered trademark) and the characteristic impedance is 50 Ω, the outer diameter of the cylindrical barrel has reached about 1.1 mm.

[0014] As described above, the operating speed of the semiconductor device is increased and the integration density of the semiconductor device is rapidly increased. Therefore, the distance between the electrode pads of the IC chip is reduced (narrow pitch). In order to cope with this, a coaxial probe is required which can mount a large number of probes on a probe card at a narrow pitch by reducing the outer diameter.

[0015] A coaxial probe having a small diameter is proposed by using an aerodynamic insulator that can cope with such circumstances (Patent Document 2).

Patent Document 1: JP 2001-296314

Patent Document 2: JP 2002-257849

Disclosure of the invention

Problems to be solved by the invention

[0016] As described above, the conventionally proposed coaxial cable has a diameter of a unit of millimeter, so that the performance of devices such as electronic devices, IC testers, and medical devices is improved, ICs, LSIs, etc. It was not possible to meet the demands for ultra-thin wires due to miniaturization, high density, large capacity, high performance, etc.

[0017] Therefore, the present invention is an ultrafine coaxial wire that is extremely fine and has stable current carrying properties, excellent high frequency characteristics, and the like, for example, a fine wire that is mainly provided with a core material having high current carrying properties.

For example, for the purpose of proposing a micro coaxial cable having a diameter of 200 m or less, a manufacturing method thereof, and this new application.

[0018] Further, the present invention has an object to propose a coaxial barrel that can be miniaturized in diameter and can be used in a coaxial probe, and a method of manufacturing the same. Means for solving the problem

[0019] In order to achieve the above-mentioned object, the ultra-fine coaxial wire proposed by the present invention is a coaxial wire having an outer diameter of 200 m or less centering on a noble metal or a core material having its alloying force, and has self-elasticity. Thus, it is characterized by having a Vickers hardness of 450 HV or more, more preferably a Vickers hardness of 500 to 600 HV.

Here, in the present invention, the term “having self-elasticity” means that the micro coaxial wire of the present invention is used as a probe pin, and the probe pin having the micro coaxial wire force of the present invention is printed with several hundreds of thousands of forces. A probe card is arranged on a wiring board, and a plurality of electrode pads such as an integrated circuit chip on a semiconductor wafer and a liquid crystal display device are inspected at the tip force conduction test of the probe pin (the micro coaxial cable of the present invention) in the probe card. Each probe pin (extra fine coaxial line of the present invention) can be elastically deformed in the abutting direction to such an extent that the difference in protrusion amount of each probe pin (extra fine coaxial line of the present invention) can be absorbed. Say. Specifically, in the energization inspection as described above, the pressure applied to the surface of the electrode pad as described above is, for example, 4-5 g or more required to break the acid film. Having elasticity that can be withstood by elastic deformation.

[0021] It should be noted that for the Vickers hardness of 450 HV or more possessed by the microcoaxial wire of the present invention, the microcoaxial wire of the present invention is adopted as the probe pin as described above, and the probe pin that also has the microcoaxial line force of the present invention is used. When a probe card is configured and an energization inspection is performed, it is required because it is required to break a film, for example, an oxide film, formed on the surface of the electrode pad as described above.

[0022] As described above, by having self-elasticity and having a Vickers hardness of 45 OHV or more while having an outer diameter of 200 m or less, for example, the micro-coaxial wire of the present invention is employed in the probe pin as described above. Even if it is used, there is a need for probe pins while meeting the small diameter required for integrated circuits such as ICs and LSIs that are becoming smaller, higher density, larger capacity, and higher performance. It is possible to have elasticity and strength.

[0023] From this point of view, it is more preferable that the micro coaxial wire of the present invention has self-elasticity and has a picker hardness of 500 to 600 HV!

[0024] In the ultrafine coaxial wire of the present invention, from the viewpoint of ensuring necessary electrical conductivity, the core It is desirable that the outer diameter of the material is 20 μm or more.

Here, the core material can be any of gold, silver, platinum group, and alloys thereof. Examples of the alloy include an alloy of a platinum group (for example, platinum, rhodium, iridium) and gold, silver, or copper.

[0026] As described above, when the ultrafine coaxial wire of the present invention is used for, for example, a probe pin, the probe pin has an outer diameter of 200 μm or less (for example, 50 to 60 μm). In order to ensure the required energization characteristics, the core material is required to have a certain size. Therefore, as described above, the outer diameter of the core material is desirably 20 m or more.

On the other hand, in the micro coaxial line of the present invention, as the outer layer formed on the outer periphery of the core material, for example, the micro coaxial line of the present invention is adopted as a probe pin, and the probe pin also has the micro coaxial line force of the present invention. When a probe card is configured using a power supply and an energization test is performed, it has elasticity and rigidity that can withstand the required pressure while having the necessary conductivity, and the adjacent ultra-thin coaxial lines come into contact with each other It is also formed to prevent the resistance value from fluctuating.

[0028] When insulation is further required, a film having an insulator strength such as fluorine resin or polyimide or acrylic melamine resin can be formed on the outermost periphery.

[0029] The outer layer formed on the outer periphery of the core material may be a thin film that can achieve the purpose of insulation, for example, but from the viewpoint of securing the current-carrying characteristics as described above, It is desirable to have an outer diameter of 20 m or more. Furthermore, it is conductive, such as platinum, platinum group alloys (for example, platinum, rhodium, iridium, etc.), gold, silver or any of those alloys. It is desirable that the core material is made of a material having a high height.

[0030] The ultrafine coaxial line of the present invention described above can be an ultrafine coaxial line in which a plurality of layers are concentrically laminated on the outer periphery of the core material, that is, an ultrafine multiple coaxial line.

[0031] In this case, for example, a metal film having good conductivity such as gold or noradium is applied to the outer periphery of the fine coaxial wire coated with the insulator, and a film made of an insulator is formed on the outer periphery of the plating layer. Then, an ultrafine multiple coaxial wire coated with nickel can be obtained by electroplating.

[0032] In consideration of the required elastic diameter reduction, economic efficiency, and electrical characteristics, it is desirable to keep the core material as thin as possible even if the outer diameter is 20 μm or more. [0033] Next, in order to achieve the above object, the micro coaxial barrel proposed by the present invention includes an insulating layer on the inner peripheral side, and the insulating layer is formed on the outer periphery of the tubular first nickel layer. In addition, the inner diameter is 50 m or more and the outer diameter is 80 m or more.

[0034] The ultra-fine coaxial barrel of the present invention can be used as a barrel for a coaxial probe.

[0035] In the above, the first gold film may be formed on the inner periphery of the tubular first nickel layer.

[0036] The micro coaxial barrel includes a second gold film formed on the outer periphery of the insulating layer.

And a tubular second nickel layer formed on the outer periphery thereof.

[0037] As described above, the micro coaxial barrel of the present invention described above can be used as a barrel for a coaxial probe. In this case, a coaxial probe can be configured by slidably inserting a signal transmission conductive needle made of a conductive member into the micro coaxial barrel of the present invention described above.

[0038] Since this coaxial probe utilizes the ultra-fine coaxial barrel of the present invention, a tubular first nickel layer and a first gold film formed on the inside thereof are formed on the inner peripheral side of the insulating layer, The outer peripheral side of the insulating layer may be configured to include a micro coaxial barrel in which a second gold film and a tubular second nickel layer formed on the outer periphery thereof are laminated concentrically.

[0039] The tubular insulating layer, the first and second gold skin films, and the first and second nickel layers in the micro coaxial barrel of the present invention have an inner diameter of 50 m or more, although they are fine. It is a tubular body, and can be formed to have the desired wall thickness with an outer diameter of 80 m or more so that it has the electrical characteristics, strength and elasticity required for the coaxial probe. .

[0040] Next, in order to achieve the above object, the method of manufacturing the micro coaxial wire proposed by the present invention is to form a film on the outer periphery of the core material by electroplating after cleaning the outer periphery of the core material. An ultrafine coaxial wire having an outer diameter of 200 m or less and having self-elasticity and having a Vickers hardness of 450 HV or more, more preferably a Vickers hardness of 500 to 600 HV is produced. [0041] Here, as described above, the core material may be made of a noble metal having an outer diameter of 20 μm or more or an alloy thereof. As described above, the noble metal or its alloy can be any of gold, silver, platinum group, and alloys thereof. This alloy includes, for example, an alloy of platinum group (eg, platinum, rhodium, iridium) and gold, silver, or copper.

[0042] The film formed on the outer periphery of the core material by electroplating can be a base metal such as nickel.

[0043] With regard to nickel, due to the manufacturing method of the microtube developed by the present inventors and its implementation, due to the relationship between the residual stress and the additive, very high elasticity is exhibited when formed into a tube by electroplating. The present inventors knew that it would be possible to achieve this.

[0044] In the present invention, as described above, nickel is formed in a tubular shape on the outer periphery of the core member by using an electric wire to obtain an ultrafine coaxial line having self-elasticity while having an outer diameter of 200 m or less. be able to.

[0045] Further, it is possible to adjust the Vickers hardness of the manufactured micro coaxial cable by adjusting the curing agent and the brightening agent added to the electrolyte used for the electroplating. While having a diameter of 200 μm or less, it is possible to produce a micro coaxial cable having self-elasticity and having a Vickers hardness of 450 HV or more, preferably 500 to 600 HV.

[0046] For example, when the electrolytic solution is a nickel sulfonate solution, it is possible to adjust the Vickers hardness of the manufactured fine coaxial line by adding an appropriate amount of a curing agent or a brightening agent.

[0047] In the method for producing the micro coaxial wire of the present invention described above, the coating formed on the outer periphery of the core material by electroplating may have a form in which a plurality of layers are concentrically stacked on the outer periphery of the core material. it can.

[0048] An insulator film may be formed on the outermost periphery.

[0049] For example, when the method for manufacturing the micro coaxial cable of the present invention described above requires excellent insulation by the manufactured micro coaxial cable, the micro coaxial cable manufactured as described above is used. An insulator such as fluorine resin, Teflon (registered trademark) resin, polyimide, and acrylic melamine resin can be covered with a thickness of 20 μm or less on the outer periphery of the axis.

[0050] In this case, the process of the method for producing the micro coaxial cable of the present invention was performed by cleaning the outer periphery of the core material. Thereafter, a film is formed on the outer periphery of the core material by electroplating, and then the above-described insulating film is formed on the outermost periphery by vapor deposition, baking, smashing, or the like.

[0051] In any of the above-described methods for producing a micro coaxial cable according to the present invention, the outer diameter is 200 µm or less, and it has self-elasticity and has a Vickers hardness of 450 HV or more, preferably 500 to 600 HV. It is possible to manufacture a very fine coaxial line. That is, it is possible to manufacture ultra-fine coaxial wires and ultra-fine multi-coaxial wires having a smaller diameter by the method for producing ultra-fine coaxial wires of the present invention, thereby reducing the size and density of integrated circuits such as ICs and LSIs. It is possible to provide an extra-fine coaxial wire having the elasticity and strength required for a probe pin while meeting the demand for finer diameters required for the increase in size, capacity, and performance.

[0052] However, when flowing a large amount of electricity, a thick one may be required. In such a case, the outer diameter is required to be about 200 m. In any of the above-described methods of manufacturing the ultra-thin coaxial line of the present invention, the outer diameter is 200 / zm or less while having a self-elasticity, and a Vickers hardness of 450 HV or more, preferably 500, so as to meet the demands for the production. It is possible to produce very fine coaxial lines with ~ 600HV.

[0053] It should be noted that the ultrafine pin probe of the present invention manufactured as described above is cut into a predetermined length, and one end is tapered to cue the core material, thereby locating the ultrafine pin probe. Can be manufactured.

[0054] That is, as described above, the ultrafine coaxial wire of the present invention is such that a coating such as a nickel is formed on the outer periphery of the core material by the electric cable. It is a coaxial line or a multi-coaxial line in which a film is formed with the same thickness on the outer periphery of the wire. Therefore, it is suitable for processing the tip to taper the core material to make an ultra-fine pin probe.

[0055] Next, in order to solve the above-mentioned problem, the method of manufacturing an ultra-fine coaxial barrel proposed by the present invention includes a first gold film formed on the outer periphery of a metal core wire having a small diameter by an electric forging method, and then The first nickel layer is formed on the outer periphery of one gold film by an electric forging method, the insulating film is formed on the outer periphery of the first nickel layer, the second gold film is formed on the outer periphery of the insulating film, and the outer periphery of the second gold film is formed. A second nickel layer is sequentially formed by an electric forging method, and an ultrafine coaxial barrel including an insulating layer on the inner peripheral side is manufactured by pulling out the fine metal core wire. [0056] The micro coaxial barrel manufactured in this way can be used as a barrel for a coaxial probe as described above, and the method for manufacturing the micro coaxial barrel of the present invention described above uses a barrel for a coaxial probe. It can also be implemented as a manufacturing method.

Here, the inner diameter of the first gold film can be 50 m or more, and the outer diameter of the second nickel layer can be 80 μm or more.

The invention's effect

[0058] According to the present invention, even though the outer diameter is 200 μm or less, it has self-elasticity and has a Vickers hardness of 450 HV or more. Ultra-fine coaxial with the elasticity and strength required for probe pins while meeting the small diameter required for integrated circuits such as LSI, miniaturization, high density, large capacity, and high performance Lines can be provided.

[0059] Further, according to the present invention, a tubular body having an inner diameter of 50 μm or more, an outer diameter of 80 μm or more, including an insulating layer on the inner peripheral side, and usable as a barrel for a coaxial probe. A coaxial barrel can be provided.

[0060] Further, by using the ultra-fine coaxial barrel of the present invention that can be used as a barrel for a coaxial probe in this way, a conductive needle for signal transmission made of a conductive member is mounted on the inside of the barrel. It is possible to provide a coaxial probe having a small diameter.

[0061] This supports the miniaturization of integrated circuits such as ICs and LSIs, the increase in density, the increase in capacity, and the reduction in the diameter of coaxial probes with the progress of higher performance, and the implementation of high-density mounting on probe cards. be able to.

[0062] According to the method of the present invention for producing the ultra-fine coaxial barrel of the present invention that can be used as a barrel for a coaxial probe, the outer circumference of a fine-diameter metal core wire (for example, SUS wire) is formed on the outer periphery by the electric forging method. A gold film is formed, and a first nickel layer, an insulating layer, a second gold film, and a second nickel layer are sequentially stacked concentrically around the outer periphery of the first gold film. By pulling out the core wire, a hollow cylindrical ultrafine coaxial barrel can be manufactured. Therefore, it is possible to arbitrarily adjust the inner diameter of the barrel for the coaxial probe by changing the diameter of the fine metal core wire (for example, SUS wire).

[0063] In addition, each concentric layer or film is formed by an electric forging method, vapor deposition, baking, immersion treatment, or the like. Therefore, the thickness of each layer and film can be arbitrarily adjusted.

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

[0065] FIG. 1 outlines an example of the arrangement of a continuous processing apparatus in which the method for producing a micro coaxial cable of the present invention is implemented.

[0066] The supply unit 1 includes a core material 10 made of platinum, such as platinum, rhodium, iridium, or the like, or gold, silver, copper, or an alloy thereof having a high conductivity as if they are shifted. Rotated and equipped with reel 7.

[0067] The core material 10 is unwound from the reel 7 of the supply unit 1 by the transport roller 6 in the storage unit 5 having a cutting unit (not shown), passes through the cleaning unit 2 and the energization 'transport unit 3, and then the nickel electric power unit. It is conveyed to 4.

[0068] The cleaning unit 2 is charged with a predetermined weak alkaline solution or weak acid solution, and the outer periphery of the core member 10 is cleaned here.

[0069] A nickel electrolyte unit 4 is filled with a predetermined electrolyte, for example, a nickel sulfonate solution. The nickel electrolyte unit 4 is electrically connected to the outer periphery of the core 10 that is transported through the nickel electrode unit 4. Therefore, the nickel film 11 having a predetermined thickness is formed.

[0070] It should be noted that the Vickers hardness of the manufactured micro coaxial cable 20 can be adjusted by adding an appropriate amount of a curing agent or a brightening agent to the electrolyte solution (nickel sulfonate solution) in the nickel battery unit 4. .

The conveyance speed by the conveyance roller 6 in the storage unit 5 is adjusted according to how thick the nickel film is formed on the outer periphery of the core material 10.

[0072] In the embodiment shown in FIG. 1, a nickel film 11 having a predetermined thickness is formed on the outer periphery of the core member 10 by means of electric iron to manufacture the micro coaxial cable 20 (FIG. 2 (b)) of the present invention. Speak.

In addition to this, although not shown, a plurality of units between the supply unit 1 and the storage unit 5 can be used.

, Deploying different electronic units, in a series of processes from supply unit 1 to storage unit 5

It is possible to produce an ultra-fine multiple coaxial line in which a plurality of layers are laminated concentrically

[0074] In addition, as required, fluorine resin, Teflon (registered trademark) resin, polyimide, Atari An insulating film 12 such as lumelamine can be used as the ultrafine coaxial line 2 Oa (FIG. 2 (c)) formed on the outer peripheral surface of the nickel film 11.

[0075] Further, the micro coaxial cable 20a (Fig. 2 (c)) whose outermost periphery is coated with the insulator 12 is transferred from the reel 7 of the supply unit 1 shown in Fig. 1 to the cleaning unit 2, and then shown in the drawing. Although not provided, it passes through the gold plating unit, the palladium plating unit, or the iridium plating unit arranged in front of the nickel electric power unit 4, and on the outermost insulating film 12 of the micro coaxial wire 20a, A gold film, a noradium film, or an iridium film indicated by reference numeral 13 is formed, and further, the nickel layer 14 is formed by being conveyed to the nickel electric unit 4 and heated to form a multiple coaxial line 20b (Fig. 2 (d)) can also be produced.

In this way, the ultrathin multiplex of the present invention in which the conductive film 13 such as gold, palladium, iridium or the like is formed on the outside of the microcoaxial wire 20a and the nickel film 14 is formed on the outside thereof. Coaxial wire 20b will be manufactured.

[0077] Furthermore, by connecting the above units as necessary, it is possible to manufacture a multi-layered coaxial cable having many layers of electrical conductivity and electrical properties.

[0078] Fig. 2 is an enlarged view of the outline of the cross-sectional structure of the ultrafine coaxial line manufactured by the manufacturing method of the present invention. For example, a nickel coating 11 is formed on the outer periphery of the core material 10 shown in FIG. 2 (a) (for example, an iridium platinum alloy wire having a diameter of 25 m), and the ultrafine coaxial wire of the present invention having an outer diameter of 39 / zm 20 (Fig. 2 (b)) is manufactured.

[0079] The ultra-fine coaxial wires 20, 20a, 20b of the present invention manufactured as described above are cut to a desired length by a cutting unit (not shown), and one end thereof is tapered to be cored. Material 10 can be cued to produce an ultra-fine pin probe.

Next, with reference to FIGS. 3 and 4, the micro coaxial barrel of the present invention that can be used as a barrel for a coaxial probe and a method for manufacturing the same will be described.

FIG. 3 illustrates the structure of the micro coaxial barrel 31 of the present invention. The micro coaxial barrel 31 is made of a conductive member including an insulating layer on the inner peripheral side, and has a cylindrical shape as illustrated. As shown in FIG. 4, a signal transmitting conductive needle 30 made of a conductive member is slidably inserted into the ultrafine coaxial barrel 31 and used as a coaxial probe.

The cylindrical fine coaxial barrel 31 made of a conductive member has an inner peripheral force directed toward the outer peripheral side, There is also a structural force in which the first gold film 32, the first nickel layer 33, the insulating layer 34, the second gold film 35, and the second nickel layer 36 are laminated concentrically.

[0083] The outer diameter of the tubular second nickel layer 36, that is, the outer diameter of the barrel 31 is 80 μm or more.

On the other hand, the inner diameter of the tubular first gold film 32, that is, the inner diameter of the barrel 31 is 50 μm or more.

[0085] The micro coaxial barrel 31 used as the coaxial probe of the present invention is manufactured as follows.

[0086] The first gold film 32 is applied to the outer periphery of a metal core wire (for example, SUS wire) having a total length of 400 mm and an outer diameter of 50 μm or more by an electric forging method to a thickness of about 0.5 to 1 μm. Form.

Next, a first nickel layer 33 is formed on the outer periphery of the first gold film 32 with a thickness of about 2 to 3 μm by electroforming.

Next, the insulating layer 34 is formed with a thickness of about 2 to 5 m in order to form the ultra-thin coaxial barrel 31 including the insulating layer on the inner peripheral side. The insulating layer 34 is formed, for example, by depositing and baking Teflon (registered trademark) resin or melamine resin, or by dipping treatment.

[0089] Next, a second gold film 5 is formed on the outer periphery of the insulating layer 34 with a thickness of about 0.5 to 1 m.

[0090] Then, the second nickel layer 36 is formed on the outer periphery of the second gold film 35 by an electric forging method with a thickness of about 5 to L0 μm.

[0091] The second gold film 35 is prepared in order to form the second nickel layer 36 on the outer periphery of the insulating layer 34 by electroforming.

[0092] Here, the innermost metal core wire is pulled out, and as shown in FIGS. 3 (a) and 3 (b), the total length is 400 mm.

An ultrafine coaxial barrel 31 made of a conductive member having an outer diameter of 80 m or more and an inner diameter of 50 m or more and including an insulating layer on the inner peripheral side can be manufactured.

[0093] It should be noted that, after a long product is manufactured as described above, it can be cut to a desired length to obtain the ultra-fine coaxial barrel 31 of the present invention, which is a coaxial probe core. Can be used for 禾 IJ.

[0094] Further, the outer periphery of the second nickel layer 36 is not subjected to an electric forging method, vapor deposition, baking, or immersion treatment. It is also possible to stack a plurality of members concentrically with each other.

In the method of the present invention, as described above, the first gold film 32 is formed on the outer periphery of a metal core wire (for example, SUS wire) having a small diameter by an electric forging method. The first nickel layer ₃₃ , the insulating layer 34, the second gold film 35, and the second nickel layer 36 are sequentially laminated concentrically on the outer periphery of the metal, while the metal core wire having a small diameter is drawn out to form a hollow A cylindrical ultra-thin coaxial barrel 31 is used. Therefore, it is possible to arbitrarily adjust the inner diameter of the micro coaxial barrel 31 by changing the diameter of a fine metal core wire (for example, SUS wire).

[0096] Further, since each concentric layer and film can be formed by an electro forging method, vapor deposition, baking, immersion treatment, etc., the thickness of each layer and film can be arbitrarily adjusted.

Brief Description of Drawings

[0097] FIG. 1 outlines an example of an arrangement configuration of a continuous processing apparatus in which the method for producing a micro coaxial cable of the present invention is implemented, (a) is a plan view and (b) is a side view.

FIG. 2 is an enlarged view of an example of a cross-sectional structure of a micro coaxial cable manufactured by the manufacturing method of the present invention. (A) is a cross-sectional view of a core material, and (b) is a micro coaxial cable. Cross-sectional view, (c) is a cross-sectional view of a micro coaxial line on which an insulating film is further formed, and (d) is a cross-sectional view of a multi-coaxial line

FIG. 3 is a view for explaining the structure of a micro coaxial barrel for a coaxial probe according to the present invention, wherein (a) is a longitudinal sectional view, and (b) is a lateral sectional view with a part omitted.

FIG. 4 is a lateral cross-sectional view showing a part of a coaxial probe using the ultrafine coaxial barrel of the present invention.

Explanation of symbols

[0098] 1 Supply unit

2 Cleaning unit

3 Energizing and conveying unit

4 Nickel electric unit

5 Storage unit

6 Transport roller

7 reel Core material

Electrical nickel layer

Insulation layer

Conductive film

Electrical nickel layer

Extra fine coaxial wire

a Ultra-fine coaxial cable covered with an insulator b Ultra-fine multi-coaxial cable

Conductive needle for signal transmission

Extra-fine coaxial barrel

First gold film

First nickel layer

Insulation layer

Second gold film

Second nickel layer

Claims

The scope of the claims

[I] An ultra-fine coaxial wire having a self-elasticity and a Vickers hardness of 450 HV or more, which is a coaxial wire having an outer diameter of 200 m or less centering on a noble metal or a core material that also has an alloy strength thereof.

[2] The ultrafine coaxial wire according to [1], wherein the core has an outer diameter of 20 μm or more.

[3] The ultrafine coaxial wire according to claim 1 or 2, wherein the core material is made of any of gold, silver, platinum group, and alloys thereof.

[4] The structure according to any one of claims 1 to 3, wherein a plurality of layers are concentrically laminated on the outer periphery of the core material! The ultra-fine coaxial wire according to claim 1.

[5] The micro coaxial cable according to any one of claims 1 to 4, wherein an insulating film is formed on the outermost periphery.

[6] A coaxial barrel including an insulating layer on the inner peripheral side, wherein the insulating layer is formed on the outer periphery of the tubular first nickel layer, and has an inner diameter of 50 m or more and an outer diameter of 80 m or more. An ultra-fine coaxial barrel characterized by

7. The micro coaxial barrel according to claim 6, wherein a first gold film is formed on the inner periphery of the tubular first nickel layer.

8. The microcoaxial according to claim 6 or 7, comprising a second gold film formed on the outer periphery of the insulating layer and a tubular second nickel layer formed on the outer periphery thereof. Barrel

[9] A coaxial wire with an outer diameter of 200 m or less that forms a coating on the outer periphery of the core material after washing the outer periphery of the core material, and has self-elasticity and a Vickers hardness of 450 HV or higher A method of manufacturing a micro coaxial cable having

10. The method for producing an ultrafine coaxial wire according to claim 9, wherein the coating formed on the outer periphery of the core material by electroplating is a method in which a plurality of layers are concentrically laminated on the outer periphery of the core material. .

[II] The method for producing an ultrafine coaxial wire according to claim 9 or 10, wherein an insulating film is formed on the outermost periphery.

[12] The first gold film is formed on the outer periphery of the fine metal core wire by an electric forging method, and then the first nickel layer is formed on the outer periphery of the first gold film by the electric forging method. Insulating film on the periphery, second gold film on the outer periphery of the insulating film, outer periphery of the second gold film A method of manufacturing an ultrafine coaxial barrel including an insulating layer on the inner peripheral side by sequentially forming a second nickel layer by electroforming and drawing the fine metal core wire. 13. The method for producing an ultrafine coaxial barrel according to claim 12, wherein the inner diameter of the first gold film is 50 μm or more and the outer diameter of the second nickel layer is 80 μm or more.