WO2007091609A1 - Ultrasonic sensor - Google Patents
Ultrasonic sensor Download PDFInfo
- Publication number
- WO2007091609A1 WO2007091609A1 PCT/JP2007/052145 JP2007052145W WO2007091609A1 WO 2007091609 A1 WO2007091609 A1 WO 2007091609A1 JP 2007052145 W JP2007052145 W JP 2007052145W WO 2007091609 A1 WO2007091609 A1 WO 2007091609A1
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- WO
- WIPO (PCT)
- Prior art keywords
- case
- thickness
- ultrasonic sensor
- surface portion
- piezoelectric element
- Prior art date
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- 239000003990 capacitor Substances 0.000 abstract description 13
- 239000011347 resin Substances 0.000 abstract description 6
- 229920005989 resin Polymers 0.000 abstract description 6
- 238000006073 displacement reaction Methods 0.000 description 15
- 238000004088 simulation Methods 0.000 description 9
- 239000011358 absorbing material Substances 0.000 description 7
- 230000002093 peripheral effect Effects 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229920002379 silicone rubber Polymers 0.000 description 4
- 229920006311 Urethane elastomer Polymers 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G10—MUSICAL INSTRUMENTS; ACOUSTICS
- G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
- G10K9/00—Devices in which sound is produced by vibrating a diaphragm or analogous element, e.g. fog horns, vehicle hooters or buzzers
- G10K9/12—Devices in which sound is produced by vibrating a diaphragm or analogous element, e.g. fog horns, vehicle hooters or buzzers electrically operated
- G10K9/122—Devices in which sound is produced by vibrating a diaphragm or analogous element, e.g. fog horns, vehicle hooters or buzzers electrically operated using piezoelectric driving means
Definitions
- the present invention relates to an ultrasonic sensor, and more particularly to an ultrasonic sensor used in, for example, a back sonar for an automobile.
- FIG. 10 is a front schematic view showing an example of a conventional ultrasonic sensor
- FIG. 11 is a side schematic view of the ultrasonic sensor.
- the ultrasonic sensor 1 includes a bottomed substantially quadrangular cylindrical case 2 made of aluminum or the like. Case 2 has a rectangular or oval opening.
- One surface of the piezoelectric element 3 is bonded to the bottom surface inside the case 2.
- one signal line 4a of the cable 4 is soldered to one electrode of the temperature compensating capacitor 5 and also to the inner surface of the case 2.
- the other signal line 4 b of the cable 4 is soldered to the other electrode of the capacitor 5 and is also soldered to the electrode on the other surface of the piezoelectric element 3.
- the piezoelectric element 3 and the temperature compensation capacitor 5 are connected in parallel between the signal lines 4a and 4b of the cable 4.
- a sound absorbing material 6 made of felt is disposed on the other surface of the piezoelectric element 3.
- the case 2 is filled with an insulating resin 7 having a strong force such as silicon rubber or urethane rubber. The insulating resin 7 seals the piezoelectric element 3 and the sound absorbing material 6 in a sealed state, and also insulates the signal lines 4a and 4b from the capacitor 5.
- the piezoelectric element 3 When measuring the distance to the object to be detected using the ultrasonic sensor 1, the piezoelectric element 3 is excited by applying a drive voltage to the signal lines 4 a and 4 b of the cable 4. Due to the vibration of the piezoelectric element 3, the bottom surface of the case 2 also vibrates, and ultrasonic waves are emitted in a direction perpendicular to the bottom surface. When the ultrasonic wave emitted from the ultrasonic sensor 1 is reflected by the object to be detected and reaches the ultrasonic sensor 1, the piezoelectric element 3 vibrates and is converted into an electric signal, and the electric signal is transmitted from the signal lines 4a and 4b of the cable 4. A signal is output.
- the distance from the ultrasonic sensor 1 to the object to be detected can be determined by measuring the time from when the drive voltage is applied until the electrical signal is output.
- a reverberation characteristic with a small reverberation for detecting an obstacle at a short distance for example, when it is attached to a bumper of an automobile and used as a back sonar for detecting an obstacle, a reverberation characteristic with a small reverberation for detecting an obstacle at a short distance, Furthermore, in order not to detect the ground or curb, vertical and narrow horizontal directions are required, and wide directivity is required.
- the thickness T1 of the side surface of the case 2 is made larger than the thickness T2 of the bottom surface of the case 2 in order to suppress the vibration of the side surface of the case 2 and reduce reverberation ( (See Patent Document 1).
- Patent Document 1 Japanese Patent Laid-Open No. 9 284896
- FIG. 12 shows a graph of the reverberation waveform in the case of using the case 2 made of aluminum, the sound absorbing material 6 made of felt, and the insulating resin 7 also having a silicon rubber force in the rectangular ultrasonic sensor 1.
- a main object of the present invention is to provide a rectangular ultrasonic sensor excellent in reverberation characteristics and directivity.
- An ultrasonic sensor includes a bottomed substantially quadrangular cylindrical case having a bottom surface portion and a side surface portion, and a piezoelectric element formed on the inner surface of the bottom surface portion of the case.
- the case is formed thicker than the thickness of the bottom surface portion of the case, and the opening of the case is formed longer in the thickness direction of the opposite one side portion of the case side portion, and on the side portion of the case perpendicular to that direction. It is formed shorter in the thickness direction of the opposite other side portion, and the thickness of one side portion in the direction in which the opening is formed longer than the thickness of the other side portion in the direction in which the opening is formed shorter in the side surface portion of the case.
- the thickness of the case is at least one side of the side of the case. It is an ultrasonic sensor that is formed to change in a slanting manner!
- the thickness of the other side portion of the side surface portion of the case is also configured to change in an inclined manner in a direction parallel to the main surface of the bottom surface portion of the case. /! I like to do it! /
- the thickness of the side surface portion of the case is made larger than the thickness of the bottom surface portion of the case in order to suppress the vibration of the side surface portion of the case and reduce reverberation.
- the thickness of at least one thin side portion of the side surface portion of the case is formed so as to change in an inclined manner instead of being uniform, so that vibration of the side surface portion of the case is suppressed and reverberation is reduced.
- Reverberation characteristics are improved.
- the reverberation characteristics are improved in the ultrasonic sensor according to the present invention, it is possible to arbitrarily set the thickness of the one side portion having a small thickness on the side surface portion of the case, and the necessary directivity. It becomes easy to obtain.
- the reason why reverberation is suppressed when the thickness of the one side portion of the case is formed so as to change in a slanting manner on the side surface portion of the case as in the case of an ultrasonic sensor that is powerful in the present invention is as follows. .
- the case resonates at the natural vibration frequency determined by the thickness and width.
- this resonance increases the reverberation.
- the present inventors have found that the reverberation can be suppressed because it does not resonate by changing the thickness of the side surface of the case in an inclined manner like the ultrasonic sensor according to the present invention. It is.
- the one side portion having a small thickness on the side surface portion of the case is on both sides in the longitudinal direction of the opening portion of the case, and the thickness V on the side surface portion of the case is increased.
- the ultrasonic sensor according to the present invention if the thickness of the side surface portion of the case is formed so that the thickness of the other side portion is not uniform and changes in an inclined manner. The vibration of the side surface of the slab is further suppressed, and reverberation is further reduced. The invention's effect
- a rectangular ultrasonic sensor having excellent reverberation characteristics and directivity can be obtained.
- FIG. 1 is an illustrative front view showing an example of an ultrasonic sensor according to the present invention.
- FIG. 2 is an illustrative side view of the ultrasonic sensor shown in FIG.
- FIG. 3 Position of the side surface of the case in the ultrasonic sensor shown in Fig. 1 with a non-uniform thickness on the side of the case and the ultrasonic sensor shown in Fig. 10 with a uniform thickness ( It is a graph which shows the simulation result of the displacement amount with respect to (height).
- FIG. 4 is a graph showing a reverberation waveform of the ultrasonic sensor shown in FIG.
- FIG. 5 shows the vibration of an ultrasonic sensor in which the thickness of the other side portion in the direction in which the opening is formed shorter than the thickness of the one side portion in the direction in which the opening is formed longer on the side surface portion of the case. It is a figure of the simulation which shows a state.
- FIG. 6 Ultrasound in which the thickness of the one side portion in the direction in which the opening is formed long and the thickness of the other side portion in the direction in which the opening is formed short have the same dimensions on the side surface of the case It is a figure of the simulation which shows the vibration state of a sensor.
- FIG. 7 Vibration of an ultrasonic sensor in which the thickness of the other side portion in the direction in which the opening is formed shorter than the thickness of the one side portion in the direction in which the opening is formed longer on the side surface portion of the case It is a figure of the simulation which shows a state.
- FIG. 8 is an illustrative front view showing another example of the ultrasonic sensor according to the present invention.
- FIG. 9 is a side view of the ultrasonic sensor shown in FIG.
- FIG. 10 is an illustration of a front view showing an example of a conventional ultrasonic sensor.
- FIG. 11 is a side view of the ultrasonic sensor shown in FIG.
- FIG. 12 is a graph showing a reverberation waveform of the ultrasonic sensor shown in FIG.
- FIG. 1 is a front schematic view showing an example of an ultrasonic sensor that is useful in the present invention
- FIG. 2 is a side schematic view of the ultrasonic sensor.
- the ultrasonic sensor 10 includes a case 12 having a substantially quadrangular cylindrical shape with a bottom made of a metal such as aluminum. Case 12 is abbreviated
- the opening 18 inside the case 12 is formed, for example, in a substantially oval cross section.
- the outer shape of the bottom surface portion 14 is formed in a substantially quadrangular shape with four rounded corners of the square, and the outer shape of the side surface portion 16 is also substantially corresponding to the outer shape of the bottom surface portion 14. Formed into a quadrangular shape.
- the thickness T1 of the thinnest portion of the side surface portion 16 is formed to be thicker than the thickness T2 of the bottom surface portion 14. That is, in the case 12, the side surface portion 16 is formed to have a thickness greater than that of the bottom surface portion 14.
- the thickness of the one side portions 16a, 16a facing each other at the side surface portion 16 is made thinner than the thickness T3 of the other side portions 16b, 16b facing each other at the side surface portion 16. Therefore, in the side surface portion 16 of the case 12, the opposing one side portions 16a, 16a The thinnest part exists.
- the inner peripheral surfaces of the thin one side portions 16a, 16a are formed to be recessed in a circular arc shape, and the one side portions 16a, 16a
- the outer peripheral surface is formed in a flat shape. Accordingly, the thickness of the one side portions 16a, 16a is formed so as to gradually increase from the center which is not uniform toward the other side portions 16b, 16b on both sides, that is, the bottom surface of the case 12. It is formed so as to change in an inclined manner in a direction parallel to the main surface of the portion 14.
- the inner peripheral surface and the outer peripheral surface of the thicker other side portion 16b, 16b are formed in a flat shape, respectively, and accordingly, the other side portion 16b, The thickness T3 of 16b is formed uniformly.
- the opening 18 is formed long in the thickness direction of the one side portion 16a of the side surface portion 16, and the thickness direction of the other side portion 16b of the side surface portion 16 orthogonal to that direction is short. It is formed.
- the piezoelectric element 20 is attached to the inner surface of the bottom surface portion 14.
- the piezoelectric element 20 is formed by, for example, forming electrodes on both main surfaces of a disk-shaped piezoelectric substrate.
- the piezoelectric element 20 is bonded to the bottom surface portion 14 with an electrode force conductive adhesive or the like on one main surface side.
- an intermediate portion of one signal line 22a of the cable 22 is soldered to one electrode of a capacitor 24 for temperature compensation, and a tip portion of the signal line 22a is an inner surface of the side surface portion 16 of the case 12. Soldered to. Further, the intermediate force S of the other signal line 22b of the cable 22 is soldered to the other electrode of the capacitor 24, and the tip of the signal line 22b is soldered to the electrode on the other main surface side of the piezoelectric element 20. The Accordingly, the piezoelectric element 20 and the temperature compensation capacitor 24 are connected in parallel between the signal lines 22a and 22b of the cable 22.
- the capacitor 24 is insulated.
- the piezoelectric element 20 is excited by applying a drive voltage to the signal lines 22 a and 22 b of the cable 22. Due to the vibration of the piezoelectric element 20, the bottom surface portion 14 of the case 12 also vibrates, and ultrasonic waves are emitted in a direction orthogonal to the bottom surface portion 14.
- the piezoelectric element 20 vibrates and is converted into an electric signal, and is transmitted from the signal lines 22a and 22b of the cable 22. An electrical signal is output. Therefore, the distance from the ultrasonic sensor 10 to the object to be detected can be measured by measuring the time from when the drive voltage is applied until the electrical signal is output.
- the opening 18 of the case 12 is formed long in the thickness direction of the one side portion 16a of the side surface portion 16 of the case 12, and the other of the side surface portions 16 orthogonal to the direction. Since it is formed short in the thickness direction of the side portion 16b, it is narrow in the thickness direction of the one side portion 16a and wide in the thickness direction of the other side portion 16b, and has directivity. Therefore, when this ultrasonic sensor 10 is used, for example, as a back sonar for an automobile, the thickness direction of the one side portion 16a becomes the vertical direction on the side surface portion 16 of the case 12, and the thickness direction of the other side portion 16b. Are arranged in a horizontal direction.
- the thickness of the side surface portion 16 of the case 12 is made larger than the thickness of the bottom surface portion 14 of the case 12 in order to suppress the vibration of the side surface portion 16 of the case 12 and reduce reverberation. ing.
- the ultrasonic sensor 10 is formed such that the thickness of the one side portion 16a, 16a having a small thickness is not uniform in the side surface portion 16 of the case 12, but is changed in an inclined manner. Vibration of part 16 is suppressed, reverberation is reduced, and reverberation characteristics are improved.
- FIG. 3 shows an ultrasonic sensor 10 shown in FIG. 1 in which the thickness of the thin side of the side surface of the case is made uneven in this way, and the ultrasonic sensor 1 shown in FIG. 10 in which the thickness is made uniform.
- 6 is a graph showing a simulation result of a displacement amount with respect to a position (height) of a side surface portion of a case.
- Fig. 3 shows the outline of the ultrasonic sensor 10, 1 using a case made of aluminum with a height of 10mm, a sound absorbing material made of felt, and an insulating grease made of silicon rubber. As is apparent from the graph of FIG. 3, in the ultrasonic sensor 10 shown in FIG.
- the displacement amount is very small over the entire side surface portion 16 of the case 12.
- the amount of displacement in the portion opposite to the piezoelectric element 3 in the side surface portion of the case 2 is very large.
- FIG. 4 is a graph showing the reverberation waveform of the ultrasonic sensor 10 of FIG. 1, in which the graph of FIG. 3 shows the result of the displacement.
- FIG. 12 is the graph of FIG. 11 is a graph showing a reverberation waveform of the ultrasonic sensor 1 of FIG.
- the thickness T1 of the thinnest portion of the side surface portion 16 of the case 12 can be set to an arbitrary thickness, so that necessary directivity is obtained. This is easy.
- the one side portion 16 a having a small thickness on the side surface portion 16 of the case 12 is on both sides in the longitudinal direction of the opening portion 18 of the case 12, and the side surface portion 16 of the case 12 has
- the thickness of the other side portion 16b is on both sides in the short direction of the opening 18 of the case 12
- the temperature compensating capacitor 24 is connected in parallel to the piezoelectric element 20, so that the temperature tracking is good and the temperature drift can be reduced.
- the maximum length in the longitudinal direction of the opening 18 of the case 12 is set to 12 mm
- the length in the short direction is set to 6 mm
- the simulation of the vibration state when the thickness of the side surface portions 16 facing each other is changed. Went.
- FIG. 5 shows the direction in which the opening 18 is formed shorter than the thickness of the one side portion 16a in the direction in which the opening 18 is formed long in the side surface 16 of the case 12 (the minimum thickness is 0.5 mm, for example).
- FIG. 6 is a simulation diagram showing a vibration state of the ultrasonic sensor 10 in which the thickness of the other side portion 16b is increased to 4 mm, for example.
- FIG. 6 shows the minimum thickness of the one side portion 16a in the direction in which the opening 18 is formed long in the side surface portion 16 of the case 12, and the thickness of the other side portion 16b in the direction in which the opening 18 is formed short.
- the vibration state of the ultrasonic sensor 10 with the same dimensions, for example, 0.5 mm It is a figure of the simulation shown.
- FIG. 7 shows the minimum thickness of one side portion 16a in the direction in which the opening 18 is formed longer in the side surface portion 16 of the case 12, for example, the other side in the direction in which the opening 18 is formed shorter than 0.5 mm.
- FIG. 6 is a simulation diagram showing the vibration state of the ultrasonic sensor 10 in which the thickness of the portion 16b is formed to be thin, for example, 0.25 mm.
- the state in which the case 12 is most deformed by vibration is indicated by a solid line, and the state in which the case 12 is not deformed is indicated by a two-dot chain line.
- the thickness of the other side portion 16b in the direction in which the opening 18 is formed short in the side surface portion 16 of the case 12 is made larger than the thickness of the one side portion 16a, vibration is generated at the end portion of the case 12. 6 and 7, as shown in FIGS. 6 and 7, the thickness of the other side portion 16b in the direction in which the opening 18 is formed short in the side surface portion 16 of the case 12 is equal to or less than the thickness of the one side portion 16a. If it is formed to have a thickness of 5 mm, vibration will increase at the end of the case 12, and the reverberation will increase due to the vibration.
- the amount of displacement in the vicinity of the opening of the side surface portion 16 of the case 12 relative to the amount of displacement of the bottom surface portion 14 was compared.
- the amount of displacement is a combination of the amount of displacement in the vertical direction and the amount of displacement in the parallel direction with respect to the bottom surface portion 14 of the case 12.
- the displacement near the opening of the side surface portion 16 with respect to the bottom surface portion 14 of the case 12 is as large as 0.8.
- the amount of displacement near the opening of the side surface portion 16 with respect to the bottom surface portion 14 of 12 is as large as 1.0, and the vibration of the side surface portion 16 of the case 12 generates the same vibration as the side surface portion 14 of the case 12, respectively. I was strong.
- FIG. 8 is a front view solution view showing another example of the ultrasonic sensor according to the present invention
- FIG. 9 is a side view solution view of the ultrasonic sensor. In the ultrasonic sensor 10 shown in FIG. 8, compared to the ultrasonic sensor 10 shown in FIG.
- the intermediate portion of the inner peripheral surface of the other side portions 16 b and 16 b is recessed in a circular arc shape. It is formed as follows. Accordingly, in the side surface portion 16 of the case 12, the thickness of the intermediate portion of the other side portions 16b, 16b is formed so as to gradually increase from the center toward the one side portions 16a, 16a on both sides, that is, The case 12 is formed so as to change in an inclined manner in a direction parallel to the main surface of the bottom surface portion 14.
- the central portion where the piezoelectric element 20 is provided and the thin side portions 16a and 16a of the side surface portion 16 of the case 12 are provided.
- the thickness of the substantially oval plate-like end portions 14a, 14a between the two is less than the thickness T2 of the central portion of the bottom surface portion 14 of the case 12.
- the thicknesses of the other side portions 16b and 16b having a large thickness in the side surface portion 16 of the case 12 are not uniform as compared with the ultrasonic sensor 10 shown in FIG. Since it is formed so as to change in an inclined manner, vibration of the side surface portion 16 of the case 12 is further suppressed, and reverberation is further reduced.
- the side surface portion 16 of the case 12 has a thinner one side portion in the bottom surface portion 14 of the case 12. Since the end portions 14a and 14a, which are the portions on the 16a and 16a sides, are formed thin, it is possible to improve characteristics such as directivity and reverberation characteristics.
- each part is defined by a specific size, shape, arrangement, material, and number, but in the present invention, these may be arbitrarily changed. By changing in this way, characteristics such as directivity and reverberation characteristics may be further improved.
- the signal lines 22a and 22b are used for electrical connection with the outside.
- Pin terminals are used for electrical connection with the outside. It's good. Industrial applicability
- the ultrasonic sensor according to the present invention is used in, for example, a pack sonar for an automobile.
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- Engineering & Computer Science (AREA)
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- Transducers For Ultrasonic Waves (AREA)
- Measurement Of Velocity Or Position Using Acoustic Or Ultrasonic Waves (AREA)
Abstract
A rectangular ultrasonic sensor excellent in reverberation characteristics and directivity. The ultrasonic sensor (10) comprises case (12) having a bottomed generally-rectangular tube shape composed of a bottom portion (14) having a generally rectangular plate shape and a side surface portion (16) of generally-rectangular tube shape. The thickness of the side surface portion (16) is greater than that of the bottom portion (14). The thickness of the opposed side parts (16a, 16a) of the side surface portion (16) is less than that of the other opposed side parts (16b, 16b) thereof. The inner surface of the parts (16a, 16a) is concave and having a circular-arc cross-section. Therefore, the thickness of the parts (16a, 16a) changes gradually. A piezoelectric element (20) is provided on the bottom portion (14) of the case (12). Signal wires (22a, 22b) of a cable (22) are electrically connected to the piezoelectric element (20), and a capacitor (24) for temperature compensation is parallel connected to the piezoelectric element (20). A sound-absorbing member (26) is disposed on the piezoelectric element (20), and an insulating resin (28) is placed inside the case (12).
Description
明 細 書 Specification
超音波センサ Ultrasonic sensor
技術分野 Technical field
[0001] この発明は、超音波センサに関し、特にたとえば、自動車のバックソナ一などに用 いられる超音波センサに関する。 TECHNICAL FIELD [0001] The present invention relates to an ultrasonic sensor, and more particularly to an ultrasonic sensor used in, for example, a back sonar for an automobile.
背景技術 Background art
[0002] 図 10は、従来の超音波センサの一例を示す正面図解図であり、図 11は、その超音 波センサの側面図解図である。超音波センサ 1は、アルミニウムなどで形成された有 底略 4角筒状のケース 2を含む。ケース 2は、矩形状もしくは長円状の開口部を有す る。ケース 2内部の底面には、圧電素子 3の一方面が接合される。また、ケーブル 4の 一方の信号線 4aが、温度補償用のコンデンサ 5の一方の電極に半田付けされるとと もに、ケース 2の内側面に半田付けされる。さらに、ケーブル 4の他方の信号線 4bが 、コンデンサ 5の他方の電極に半田付けされるとともに、圧電素子 3の他方面の電極 に半田付けされる。それによつて、ケーブル 4の信号線 4a, 4b間には、圧電素子 3と 温度補償用のコンデンサ 5とが並列に接続される。また、圧電素子 3の他方面上には 、たとえばフェルトからなる吸音材 6が配置される。さらに、ケース 2内部には、シリコン ゴムやウレタンゴムなど力もなる絶縁性榭脂 7が充填される。この絶縁性榭脂 7によつ て、圧電素子 3および吸音材 6が密閉状態に封止されるとともに、信号線 4a, 4bゃコ ンデンサ 5が絶縁される。 FIG. 10 is a front schematic view showing an example of a conventional ultrasonic sensor, and FIG. 11 is a side schematic view of the ultrasonic sensor. The ultrasonic sensor 1 includes a bottomed substantially quadrangular cylindrical case 2 made of aluminum or the like. Case 2 has a rectangular or oval opening. One surface of the piezoelectric element 3 is bonded to the bottom surface inside the case 2. In addition, one signal line 4a of the cable 4 is soldered to one electrode of the temperature compensating capacitor 5 and also to the inner surface of the case 2. Further, the other signal line 4 b of the cable 4 is soldered to the other electrode of the capacitor 5 and is also soldered to the electrode on the other surface of the piezoelectric element 3. Accordingly, the piezoelectric element 3 and the temperature compensation capacitor 5 are connected in parallel between the signal lines 4a and 4b of the cable 4. On the other surface of the piezoelectric element 3, for example, a sound absorbing material 6 made of felt is disposed. In addition, the case 2 is filled with an insulating resin 7 having a strong force such as silicon rubber or urethane rubber. The insulating resin 7 seals the piezoelectric element 3 and the sound absorbing material 6 in a sealed state, and also insulates the signal lines 4a and 4b from the capacitor 5.
[0003] この超音波センサ 1を用いて被検出物までの距離を測定する場合、ケーブル 4の信 号線 4a, 4bに駆動電圧を印加することにより、圧電素子 3が励振される。圧電素子 3 の振動により、ケース 2の底面も振動し、その底面に直交する向きに超音波が発せら れる。超音波センサ 1から発せられた超音波が被検出物で反射し、超音波センサ 1に 到達すると、圧電素子 3が振動して電気信号に変換され、ケーブル 4の信号線 4a, 4 bから電気信号が出力される。したがって、駆動電圧を印加してから電気信号が出力 されるまでの時間を測定することにより、超音波センサ 1から被検出物までの距離を 柳』定することができる。
[0004] この超音波センサ 1では、それをたとえば自動車のバンパーに取り付けて障害物検 知のためのバックソナ一などとして用いる場合、近距離の障害物を検知するために残 響が小さい残響特性、さらに、地面や縁石を検知しないようにするために、垂直方向 にお 、て狭く水平方向にぉ 、て広 、指向性が要求される。この超音波センサ 1では 、特に、ケース 2の側面部の振動を抑えて残響を小さくするために、ケース 2の側面部 の厚み T1がケース 2の底面部の厚み T2より厚く形成されている(特許文献 1参照)。 When measuring the distance to the object to be detected using the ultrasonic sensor 1, the piezoelectric element 3 is excited by applying a drive voltage to the signal lines 4 a and 4 b of the cable 4. Due to the vibration of the piezoelectric element 3, the bottom surface of the case 2 also vibrates, and ultrasonic waves are emitted in a direction perpendicular to the bottom surface. When the ultrasonic wave emitted from the ultrasonic sensor 1 is reflected by the object to be detected and reaches the ultrasonic sensor 1, the piezoelectric element 3 vibrates and is converted into an electric signal, and the electric signal is transmitted from the signal lines 4a and 4b of the cable 4. A signal is output. Therefore, the distance from the ultrasonic sensor 1 to the object to be detected can be determined by measuring the time from when the drive voltage is applied until the electrical signal is output. [0004] In this ultrasonic sensor 1, for example, when it is attached to a bumper of an automobile and used as a back sonar for detecting an obstacle, a reverberation characteristic with a small reverberation for detecting an obstacle at a short distance, Furthermore, in order not to detect the ground or curb, vertical and narrow horizontal directions are required, and wide directivity is required. In this ultrasonic sensor 1, in particular, the thickness T1 of the side surface of the case 2 is made larger than the thickness T2 of the bottom surface of the case 2 in order to suppress the vibration of the side surface of the case 2 and reduce reverberation ( (See Patent Document 1).
[0005] 特許文献 1 :特開平 9 284896号公報 Patent Document 1: Japanese Patent Laid-Open No. 9 284896
発明の開示 Disclosure of the invention
発明が解決しょうとする課題 Problems to be solved by the invention
[0006] しかしながら、図 10に示す角型の超音波センサ 1では、ケース 2の側面部において 厚みの薄い部分の内周面と外周面とが平行であるので、ケース 2の側面部の振動が 大きくなり、残響特性が悪化するという問題を有する。なお、この角型の超音波センサ 1においてアルミニウムからなるケース 2、フェルトからなる吸音材 6およびシリコンゴム 力もなる絶縁性榭脂 7を用いた場合の残響波形のグラフを図 12に示す。 However, in the rectangular ultrasonic sensor 1 shown in FIG. 10, the inner peripheral surface and the outer peripheral surface of the thin portion of the side surface of the case 2 are parallel to each other. There is a problem that the reverberation characteristic is deteriorated. FIG. 12 shows a graph of the reverberation waveform in the case of using the case 2 made of aluminum, the sound absorbing material 6 made of felt, and the insulating resin 7 also having a silicon rubber force in the rectangular ultrasonic sensor 1.
[0007] そこで、図 10に示す角型の超音波センサ 1において、残響を小さくするために、ケ ース 2の側面部の厚みをさらに厚く形成した場合、ケース 2の振動面積が小さくなり、 垂直方向における指向性が広くなつてしまうという問題を有する。 Therefore, in the rectangular ultrasonic sensor 1 shown in FIG. 10, in order to reduce reverberation, when the thickness of the side surface portion of the case 2 is further increased, the vibration area of the case 2 is reduced, There is a problem that the directivity in the vertical direction becomes wide.
[0008] それゆえに、この発明の主たる目的は、残響特性および指向性に優れた角型の超 音波センサを提供することである。 [0008] Therefore, a main object of the present invention is to provide a rectangular ultrasonic sensor excellent in reverberation characteristics and directivity.
課題を解決するための手段 Means for solving the problem
[0009] この発明にかかる超音波センサは、底面部および側面部を有する有底略 4角筒状 のケースと、ケースの底面部の内面に形成される圧電素子とを備え、ケースの側面部 の厚みが、ケースの底面部の厚みより厚く形成され、ケースの開口部が、ケースの側 面部における対向する一方側部分の厚み方向において長く形成され、その方向と直 交するケースの側面部における対向する他方側部分の厚み方向において短く形成 され、ケースの側面部において、開口部が長く形成される方向における一方側部分 の厚みが、開口部が短く形成される方向における他方側部分の厚みより薄く形成さ れ、ケースの側面部において少なくとも一方側部分の厚み力 ケースの底面部の主
ヽて傾斜的に変化するように形成されて!ヽる、超音波センサ である。 [0009] An ultrasonic sensor according to the present invention includes a bottomed substantially quadrangular cylindrical case having a bottom surface portion and a side surface portion, and a piezoelectric element formed on the inner surface of the bottom surface portion of the case. Of the case is formed thicker than the thickness of the bottom surface portion of the case, and the opening of the case is formed longer in the thickness direction of the opposite one side portion of the case side portion, and on the side portion of the case perpendicular to that direction. It is formed shorter in the thickness direction of the opposite other side portion, and the thickness of one side portion in the direction in which the opening is formed longer than the thickness of the other side portion in the direction in which the opening is formed shorter in the side surface portion of the case. The thickness of the case is at least one side of the side of the case. It is an ultrasonic sensor that is formed to change in a slanting manner!
[0010] この発明に力かる超音波センサにおいて、ケースの側面部において他方側部分の 厚みも、ケースの底面部の主面に平行する方向にぉ 、て傾斜的に変化するように形 成されて!/、ることが好まし!/、。 [0010] In the ultrasonic sensor according to the present invention, the thickness of the other side portion of the side surface portion of the case is also configured to change in an inclined manner in a direction parallel to the main surface of the bottom surface portion of the case. /! I like to do it! /
[0011] この発明にかかる超音波センサでは、ケースの側面部の振動を抑えて残響を小さく するために、ケースの側面部の厚みがケースの底面部の厚みより厚く形成されている 。この場合、ケースの側面部において少なくとも厚みの薄い一方側部分の厚みが均 一ではなく傾斜的に変化するように形成されて 、るので、ケースの側面部の振動が 抑えられ、残響が低減され、残響特性が改善される。このように、この発明にかかる超 音波センサでは、残響特性が改善されるため、ケースの側面部において厚みの薄い 一方側部分の厚みを任意に設定することができるようになり、必要な指向性を得るこ とが容易となる。 In the ultrasonic sensor according to the present invention, the thickness of the side surface portion of the case is made larger than the thickness of the bottom surface portion of the case in order to suppress the vibration of the side surface portion of the case and reduce reverberation. In this case, the thickness of at least one thin side portion of the side surface portion of the case is formed so as to change in an inclined manner instead of being uniform, so that vibration of the side surface portion of the case is suppressed and reverberation is reduced. , Reverberation characteristics are improved. As described above, since the reverberation characteristics are improved in the ultrasonic sensor according to the present invention, it is possible to arbitrarily set the thickness of the one side portion having a small thickness on the side surface portion of the case, and the necessary directivity. It becomes easy to obtain.
この発明に力かる超音波センサのように、ケースの側面部にぉ 、て一方側部分の 厚みが傾斜的に変化するように形成されていると残響が抑制されるのは、次の理由 による。すなわち、ケースの開口部の長手方向における両側にあるケースの側面部 の厚みが均一な厚みでその対向する両主面が平行であると、厚みと幅で決まる固有 振動周波数でケースが共振してしま 、、この共振によって残響が大きくなつてしまう。 それに対して、本発明者らは、この発明にかかる超音波センサのように敢えてケース の側面部の厚みを傾斜的に変化させることによって共振しな 、ので、残響を抑制で きることを見出したからである。 The reason why reverberation is suppressed when the thickness of the one side portion of the case is formed so as to change in a slanting manner on the side surface portion of the case as in the case of an ultrasonic sensor that is powerful in the present invention is as follows. . In other words, if the thickness of the side surface of the case on both sides in the longitudinal direction of the case opening is uniform and the opposing main surfaces are parallel, the case resonates at the natural vibration frequency determined by the thickness and width. However, this resonance increases the reverberation. On the other hand, the present inventors have found that the reverberation can be suppressed because it does not resonate by changing the thickness of the side surface of the case in an inclined manner like the ultrasonic sensor according to the present invention. It is.
さらに、この発明に力かる超音波センサでは、ケースの側面部において厚みの薄い 一方側部分がケースの開口部の長手方向における両側にあり、ケースの側面部にお V、て厚みの厚 、他方側部分がケースの開口部の短手方向における両側にあること によって、指向性をより絞り、残響をより防ぐことができる。 Further, in the ultrasonic sensor that is effective in the present invention, the one side portion having a small thickness on the side surface portion of the case is on both sides in the longitudinal direction of the opening portion of the case, and the thickness V on the side surface portion of the case is increased. By having the side portions on both sides in the short direction of the opening of the case, directivity can be further reduced and reverberation can be further prevented.
[0012] また、この発明に力かる超音波センサにおいて、ケースの側面部において厚みの 厚 ヽ他方側部分の厚みも均一ではなく傾斜的に変化するように形成されて 、ると、ケ ースの側面部の振動がさらに抑えられ、残響がさらに低減される。
発明の効果 [0012] In the ultrasonic sensor according to the present invention, if the thickness of the side surface portion of the case is formed so that the thickness of the other side portion is not uniform and changes in an inclined manner. The vibration of the side surface of the slab is further suppressed, and reverberation is further reduced. The invention's effect
[0013] この発明によれば、残響特性および指向性に優れた角型の超音波センサが得られ る。 [0013] According to the present invention, a rectangular ultrasonic sensor having excellent reverberation characteristics and directivity can be obtained.
[0014] この発明の上述の目的、その他の目的、特徴および利点は、図面を参照して行う 以下の発明を実施するための最良の形態の説明から一層明ら力となろう。 The above-described object, other objects, features, and advantages of the present invention will become more apparent from the following description of the best mode for carrying out the invention with reference to the drawings.
図面の簡単な説明 Brief Description of Drawings
[0015] [図 1]この発明にかかる超音波センサの一例を示す正面図解図である。 [0015] FIG. 1 is an illustrative front view showing an example of an ultrasonic sensor according to the present invention.
[図 2]図 1に示す超音波センサの側面図解図である。 FIG. 2 is an illustrative side view of the ultrasonic sensor shown in FIG.
[図 3]ケースの側面部において薄い側の厚みを不均一にした図 1に示す超音波セン サとその厚みを均一にした図 10に示す超音波センサとにおけるケースの側面部の位 置(高さ)に対する変位量のシミュレーション結果を示すグラフである。 [Fig. 3] Position of the side surface of the case in the ultrasonic sensor shown in Fig. 1 with a non-uniform thickness on the side of the case and the ultrasonic sensor shown in Fig. 10 with a uniform thickness ( It is a graph which shows the simulation result of the displacement amount with respect to (height).
[図 4]図 1に示す超音波センサの残響波形を示すグラフである。 FIG. 4 is a graph showing a reverberation waveform of the ultrasonic sensor shown in FIG.
[図 5]ケースの側面部にお 、て開口部が長く形成される方向における一方側部分の 厚みより開口部が短く形成される方向における他方側部分の厚みを厚く形成した超 音波センサの振動状態を示すシミュレーションの図である。 FIG. 5 shows the vibration of an ultrasonic sensor in which the thickness of the other side portion in the direction in which the opening is formed shorter than the thickness of the one side portion in the direction in which the opening is formed longer on the side surface portion of the case. It is a figure of the simulation which shows a state.
[図 6]ケースの側面部にお 、て開口部が長く形成される方向における一方側部分の 厚みと開口部が短く形成される方向における他方側部分の厚みとを同じ寸法に形成 した超音波センサの振動状態を示すシミュレーションの図である。 [FIG. 6] Ultrasound in which the thickness of the one side portion in the direction in which the opening is formed long and the thickness of the other side portion in the direction in which the opening is formed short have the same dimensions on the side surface of the case It is a figure of the simulation which shows the vibration state of a sensor.
[図 7]ケースの側面部にぉ 、て開口部が長く形成される方向における一方側部分の 厚みより開口部が短く形成される方向における他方側部分の厚みを薄く形成した超 音波センサの振動状態を示すシミュレーションの図である。 [FIG. 7] Vibration of an ultrasonic sensor in which the thickness of the other side portion in the direction in which the opening is formed shorter than the thickness of the one side portion in the direction in which the opening is formed longer on the side surface portion of the case It is a figure of the simulation which shows a state.
[図 8]この発明にかかる超音波センサの他の例を示す正面図解図である。 FIG. 8 is an illustrative front view showing another example of the ultrasonic sensor according to the present invention.
[図 9]図 8に示す超音波センサの側面図解図である。 FIG. 9 is a side view of the ultrasonic sensor shown in FIG.
[図 10]従来の超音波センサの一例を示す正面図解図である。 FIG. 10 is an illustration of a front view showing an example of a conventional ultrasonic sensor.
[図 11]図 10に示す超音波センサの側面図解図である。 FIG. 11 is a side view of the ultrasonic sensor shown in FIG.
[図 12]図 10に示す超音波センサの残響波形を示すグラフである。 FIG. 12 is a graph showing a reverberation waveform of the ultrasonic sensor shown in FIG.
符号の説明 Explanation of symbols
[0016] 10 超音波センサ
12 ケース [0016] 10 Ultrasonic sensor 12 cases
14 底面部 14 Bottom
14a 端側部分 14a End part
16 側面部 16 Side
16a 一方側部分 16a One side part
16b 他方側部分 16b The other side
18 開口部 18 opening
20 圧電素子 20 Piezoelectric element
22 ケーブル 22 Cable
22a, 22b 信号線 22a, 22b Signal line
24 コンデンサ 24 capacitors
26 吸音材 26 Sound absorbing material
28 絶縁性榭脂 28 Insulating grease
発明を実施するための最良の形態 BEST MODE FOR CARRYING OUT THE INVENTION
[0017] 図 1は、この発明に力かる超音波センサの一例を示す正面図解図であり、図 2は、 その超音波センサの側面図解図である。この超音波センサ 10は、たとえばアルミ-ゥ ムなどの金属で形成された有底略 4角筒状のケース 12を含む。このケース 12は、略[0017] FIG. 1 is a front schematic view showing an example of an ultrasonic sensor that is useful in the present invention, and FIG. 2 is a side schematic view of the ultrasonic sensor. The ultrasonic sensor 10 includes a case 12 having a substantially quadrangular cylindrical shape with a bottom made of a metal such as aluminum. Case 12 is abbreviated
4角板状の底面部 14と略 4角筒状の側面部 16とで構成される。ケース 12の内部の 開口部 18は、たとえば断面略長円形状に形成される。 It is composed of a quadrangular plate-like bottom portion 14 and a substantially quadrangular cylindrical side portion 16. The opening 18 inside the case 12 is formed, for example, in a substantially oval cross section.
[0018] すなわち、このケース 12では、底面部 14の外形が、正方形の 4隅を丸くした略 4角 形状に形成されるとともに、側面部 16の外形も、底面部 14の外形に対応した略 4角 形状に形成される。 That is, in this case 12, the outer shape of the bottom surface portion 14 is formed in a substantially quadrangular shape with four rounded corners of the square, and the outer shape of the side surface portion 16 is also substantially corresponding to the outer shape of the bottom surface portion 14. Formed into a quadrangular shape.
[0019] また、このケース 12では、側面部 16において厚みの一番薄い部分の厚み T1が、 底面部 14の厚み T2より厚く形成される。すなわち、このケース 12では、側面部 16の 厚みが底面部 14の厚みより厚く形成される。 [0019] In this case 12, the thickness T1 of the thinnest portion of the side surface portion 16 is formed to be thicker than the thickness T2 of the bottom surface portion 14. That is, in the case 12, the side surface portion 16 is formed to have a thickness greater than that of the bottom surface portion 14.
[0020] さらに、このケース 12では、側面部 16において対向する一方側部分 16a, 16aの 厚みが、側面部 16において対向する他方側部分 16b, 16bの厚み T3より薄く形成さ れる。そのため、ケース 12の側面部 16において、対向する一方側部分 16a, 16aに
厚みの一番薄 、部分が存在する。 Furthermore, in this case 12, the thickness of the one side portions 16a, 16a facing each other at the side surface portion 16 is made thinner than the thickness T3 of the other side portions 16b, 16b facing each other at the side surface portion 16. Therefore, in the side surface portion 16 of the case 12, the opposing one side portions 16a, 16a The thinnest part exists.
[0021] また、このケース 12では、側面部 16において、厚みの薄い一方側部分 16a, 16a の内周面が断面円弧状に凹むように形成されるとともに、これらの一方側部分 16a, 16aの外周面が平面状に形成される。それによつて、それらの一方側部分 16a, 16a の厚みは、均一ではなぐ中央から両側の他方側部分 16b, 16bに接近するに従つ て徐々に厚くなるように形成され、すなわちケース 12の底面部 14の主面に平行する 方向にお ヽて傾斜的に変化するように形成される。 [0021] Further, in this case 12, in the side surface portion 16, the inner peripheral surfaces of the thin one side portions 16a, 16a are formed to be recessed in a circular arc shape, and the one side portions 16a, 16a The outer peripheral surface is formed in a flat shape. Accordingly, the thickness of the one side portions 16a, 16a is formed so as to gradually increase from the center which is not uniform toward the other side portions 16b, 16b on both sides, that is, the bottom surface of the case 12. It is formed so as to change in an inclined manner in a direction parallel to the main surface of the portion 14.
[0022] さらに、このケース 12では、側面部 16において、厚みの厚い他方側部分 16b, 16b の内周面および外周面がそれぞれ平面状に形成され、それによつて、これらの他方 側部分 16b, 16bの厚み T3は均一に形成される。 [0022] Further, in this case 12, in the side surface portion 16, the inner peripheral surface and the outer peripheral surface of the thicker other side portion 16b, 16b are formed in a flat shape, respectively, and accordingly, the other side portion 16b, The thickness T3 of 16b is formed uniformly.
[0023] また、このケース 12では、開口部 18は、側面部 16の一方側部分 16aの厚み方向 において長く形成され、その方向と直交する側面部 16の他方側部分 16bの厚み方 ヽて短く形成される。 [0023] Further, in this case 12, the opening 18 is formed long in the thickness direction of the one side portion 16a of the side surface portion 16, and the thickness direction of the other side portion 16b of the side surface portion 16 orthogonal to that direction is short. It is formed.
[0024] このケース 12の内部において、底面部 14の内面には、圧電素子 20が取り付けら れる。圧電素子 20は、たとえば円板状の圧電体基板の両主面に電極を形成したもの である。そして、圧電素子 20の一方主面側の電極力 導電性接着剤などによって底 面部 14に接着される。 In the case 12, the piezoelectric element 20 is attached to the inner surface of the bottom surface portion 14. The piezoelectric element 20 is formed by, for example, forming electrodes on both main surfaces of a disk-shaped piezoelectric substrate. The piezoelectric element 20 is bonded to the bottom surface portion 14 with an electrode force conductive adhesive or the like on one main surface side.
[0025] また、ケーブル 22の一方の信号線 22aの中間部が温度補償用のコンデンサ 24の 一方の電極に半田付けされるとともに、その信号線 22aの先端部がケース 12の側面 部 16の内面に半田付けされる。さらに、ケーブル 22の他方の信号線 22bの中間部 力 Sコンデンサ 24の他方の電極に半田付けされるとともに、その信号線 22bの先端部 が圧電素子 20の他方主面側の電極に半田付けされる。それによつて、ケーブル 22 の信号線 22a, 22b間には、圧電素子 20と温度補償用のコンデンサ 24とが並列に 接続される。 [0025] In addition, an intermediate portion of one signal line 22a of the cable 22 is soldered to one electrode of a capacitor 24 for temperature compensation, and a tip portion of the signal line 22a is an inner surface of the side surface portion 16 of the case 12. Soldered to. Further, the intermediate force S of the other signal line 22b of the cable 22 is soldered to the other electrode of the capacitor 24, and the tip of the signal line 22b is soldered to the electrode on the other main surface side of the piezoelectric element 20. The Accordingly, the piezoelectric element 20 and the temperature compensation capacitor 24 are connected in parallel between the signal lines 22a and 22b of the cable 22.
[0026] また、圧電素子 20の他方主面上には、たとえばフェルトからなる吸音材 26が配置さ れる。さらに、ケース 12内部には、たとえばシリコンゴムやウレタンゴムなど力もなる絶 縁性榭脂 28が充填される。この絶縁性榭脂 28によって、圧電素子 20および吸音材 26が密閉状態に封止されるとともに、ケーブル 22の信号線 22a, 22bや温度補償用
のコンデンサ 24が絶縁される。 [0026] On the other main surface of the piezoelectric element 20, a sound absorbing material 26 made of felt, for example, is disposed. Further, the inside of the case 12 is filled with an insulating resin 28 having a force such as silicon rubber or urethane rubber. The insulating resin 28 seals the piezoelectric element 20 and the sound absorbing material 26 in a hermetically sealed state, as well as for signal lines 22a and 22b of the cable 22 and for temperature compensation. The capacitor 24 is insulated.
[0027] この超音波センサ 10では、ケーブル 22の信号線 22a, 22bに駆動電圧を印加する ことにより、圧電素子 20が励振される。圧電素子 20の振動により、ケース 12の底面 部 14も振動し、底面部 14に直交する向きに超音波が発せられる。超音波センサ 10 から発せられた超音波が被検出物で反射し、超音波センサ 10に到達すると、圧電素 子 20が振動して電気信号に変換されて、ケーブル 22の信号線 22a, 22bから電気 信号が出力される。したがって、駆動電圧を印加してから電気信号が出力されるまで の時間を測定することにより、超音波センサ 10から被検出物までの距離を測定するこ とがでさる。 In the ultrasonic sensor 10, the piezoelectric element 20 is excited by applying a drive voltage to the signal lines 22 a and 22 b of the cable 22. Due to the vibration of the piezoelectric element 20, the bottom surface portion 14 of the case 12 also vibrates, and ultrasonic waves are emitted in a direction orthogonal to the bottom surface portion 14. When the ultrasonic wave emitted from the ultrasonic sensor 10 is reflected by the object to be detected and reaches the ultrasonic sensor 10, the piezoelectric element 20 vibrates and is converted into an electric signal, and is transmitted from the signal lines 22a and 22b of the cable 22. An electrical signal is output. Therefore, the distance from the ultrasonic sensor 10 to the object to be detected can be measured by measuring the time from when the drive voltage is applied until the electrical signal is output.
[0028] また、この超音波センサ 10では、ケース 12の開口部 18が、ケース 12の側面部 16 の一方側部分 16aの厚み方向において長く形成され、その方向と直交する側面部 1 6の他方側部分 16bの厚み方向において短く形成されているので、一方側部分 16a の厚み方向にぉ 、て狭く他方側部分 16bの厚み方向にぉ 、て広 、指向性を有する 。そのため、この超音波センサ 10は、たとえば自動車のバックソナ一などとして用いら れる場合、ケース 12の側面部 16にお 、て一方側部分 16aの厚み方向が垂直方向と なり他方側部分 16bの厚み方向が水平方向となるように配置される。 [0028] In the ultrasonic sensor 10, the opening 18 of the case 12 is formed long in the thickness direction of the one side portion 16a of the side surface portion 16 of the case 12, and the other of the side surface portions 16 orthogonal to the direction. Since it is formed short in the thickness direction of the side portion 16b, it is narrow in the thickness direction of the one side portion 16a and wide in the thickness direction of the other side portion 16b, and has directivity. Therefore, when this ultrasonic sensor 10 is used, for example, as a back sonar for an automobile, the thickness direction of the one side portion 16a becomes the vertical direction on the side surface portion 16 of the case 12, and the thickness direction of the other side portion 16b. Are arranged in a horizontal direction.
[0029] この超音波センサ 10では、ケース 12の側面部 16の振動を抑えて残響を小さくする ために、ケース 12の側面部 16の厚みがケース 12の底面部 14の厚みより厚く形成さ れている。この場合、この超音波センサ 10では、ケース 12の側面部 16において厚み の薄い一方側部分 16a, 16aの厚みが均一ではなく傾斜的に変化するように形成さ れているので、ケース 12の側面部 16の振動が抑えられ、残響が低減され、残響特性 が改善される。 In this ultrasonic sensor 10, the thickness of the side surface portion 16 of the case 12 is made larger than the thickness of the bottom surface portion 14 of the case 12 in order to suppress the vibration of the side surface portion 16 of the case 12 and reduce reverberation. ing. In this case, the ultrasonic sensor 10 is formed such that the thickness of the one side portion 16a, 16a having a small thickness is not uniform in the side surface portion 16 of the case 12, but is changed in an inclined manner. Vibration of part 16 is suppressed, reverberation is reduced, and reverberation characteristics are improved.
[0030] 図 3は、このようにケースの側面部において薄い側の厚みを不均一にした図 1に示 す超音波センサ 10とその厚みを均一にした図 10に示す超音波センサ 1とにおけるケ ースの側面部の位置(高さ)に対する変位量のシミュレーション結果を示すグラフであ る。なお、図 3は、アルミニウムからなる高さ 10mmのケース、フェルトからなる吸音材 およびシリコンゴム力 なる絶縁性榭脂を用いた超音波センサ 10, 1につ 、てのダラ フである。
[0031] 図 3のグラフから明らかなように、その厚みを不均一にした図 1に示す超音波センサ 10では、ケース 12の側面部 16全体にわたって変位量が非常に小さい。それに対し て、その厚みを均一にした図 10に示す超音波センサ 1では、ケース 2の側面部にお いて圧電素子 3とは反対側の部分での変位量が非常に大きい。 [0030] FIG. 3 shows an ultrasonic sensor 10 shown in FIG. 1 in which the thickness of the thin side of the side surface of the case is made uneven in this way, and the ultrasonic sensor 1 shown in FIG. 10 in which the thickness is made uniform. 6 is a graph showing a simulation result of a displacement amount with respect to a position (height) of a side surface portion of a case. Fig. 3 shows the outline of the ultrasonic sensor 10, 1 using a case made of aluminum with a height of 10mm, a sound absorbing material made of felt, and an insulating grease made of silicon rubber. As is apparent from the graph of FIG. 3, in the ultrasonic sensor 10 shown in FIG. 1 having a non-uniform thickness, the displacement amount is very small over the entire side surface portion 16 of the case 12. On the other hand, in the ultrasonic sensor 1 shown in FIG. 10 in which the thickness is uniform, the amount of displacement in the portion opposite to the piezoelectric element 3 in the side surface portion of the case 2 is very large.
[0032] また、図 4は、図 3のグラフに変位量の結果を示した図 1の超音波センサ 10の残響 波形を示すグラフであり、図 12は、図 3のグラフに変位量の結果を示した図 10の超 音波センサ 1の残響波形を示すグラフである。 FIG. 4 is a graph showing the reverberation waveform of the ultrasonic sensor 10 of FIG. 1, in which the graph of FIG. 3 shows the result of the displacement. FIG. 12 is the graph of FIG. 11 is a graph showing a reverberation waveform of the ultrasonic sensor 1 of FIG.
[0033] 図 4のグラフおよび図 12のグラフから、図 1に示す超音波センサ 10では、図 10に示 す超音波センサ 1と比べて、残響の振幅が短時間で小さくなることがわかる。 From the graph of FIG. 4 and the graph of FIG. 12, it can be seen that, in the ultrasonic sensor 10 shown in FIG. 1, the amplitude of reverberation is reduced in a short time compared to the ultrasonic sensor 1 shown in FIG.
[0034] また、この超音波センサ 10では、上述の結果から、ケース 12の側面部 16の一番薄 い部分の厚み T1を任意の厚みに設定することができるため、必要な指向性を得るこ とが容易である。 [0034] Further, in this ultrasonic sensor 10, from the above results, the thickness T1 of the thinnest portion of the side surface portion 16 of the case 12 can be set to an arbitrary thickness, so that necessary directivity is obtained. This is easy.
[0035] さらに、この超音波センサ 10では、ケース 12の側面部 16において厚みの薄い一方 側部分 16aがケース 12の開口部 18の長手方向における両側にあり、ケース 12の側 面部 16にお 、て厚みの厚 、他方側部分 16bがケース 12の開口部 18の短手方向に おける両側にあることによって、指向性をより絞り、残響をより防ぐことができる。 Furthermore, in this ultrasonic sensor 10, the one side portion 16 a having a small thickness on the side surface portion 16 of the case 12 is on both sides in the longitudinal direction of the opening portion 18 of the case 12, and the side surface portion 16 of the case 12 has In addition, since the thickness of the other side portion 16b is on both sides in the short direction of the opening 18 of the case 12, directivity can be further reduced and reverberation can be further prevented.
[0036] さらに、この超音波センサ 10では、圧電素子 20に温度補償用のコンデンサ 24が並 列に接続されているので、温度追随性が良好となり、温度ドリフトを低減することがで きる。 Furthermore, in this ultrasonic sensor 10, the temperature compensating capacitor 24 is connected in parallel to the piezoelectric element 20, so that the temperature tracking is good and the temperature drift can be reduced.
[0037] また、ケース 12の開口部 18の長手方向の最大長さを 12mmとし、短手方向の長さ を 6mmとし、それぞれ対向する側面部 16の厚みを変更した際の振動状態のシミュレ ーシヨンを行った。図 5は、ケース 12の側面部 16において開口部 18が長く形成され る方向における一方側部分 16aの厚み(その最小の厚みはたとえば 0. 5mmである) より開口部 18が短く形成される方向における他方側部分 16bの厚みをたとえば 4mm に厚く形成した超音波センサ 10の振動状態を示すシミュレーションの図である。また 、図 6は、ケース 12の側面部 16において開口部 18が長く形成される方向における一 方側部分 16aの最小の厚みと開口部 18が短く形成される方向における他方側部分 16bの厚みとを同じ寸法たとえば 0. 5mmに形成した超音波センサ 10の振動状態を
示すシミュレーションの図である。さらに、図 7は、ケース 12の側面部 16において開 口部 18が長く形成される方向における一方側部分 16aの最小の厚みたとえば 0. 5 mmより開口部 18が短く形成される方向における他方側部分 16bの厚みをたとえば 0 . 25mmに薄く形成した超音波センサ 10の振動状態を示すシミュレーションの図で ある。なお、図 5、図 6および図 7において、ケース 12が振動によって最も変形してい る状態を実線で示し、ケース 12が変形していない状態を 2点鎖線で示す。 [0037] In addition, the maximum length in the longitudinal direction of the opening 18 of the case 12 is set to 12 mm, the length in the short direction is set to 6 mm, and the simulation of the vibration state when the thickness of the side surface portions 16 facing each other is changed. Went. FIG. 5 shows the direction in which the opening 18 is formed shorter than the thickness of the one side portion 16a in the direction in which the opening 18 is formed long in the side surface 16 of the case 12 (the minimum thickness is 0.5 mm, for example). FIG. 6 is a simulation diagram showing a vibration state of the ultrasonic sensor 10 in which the thickness of the other side portion 16b is increased to 4 mm, for example. 6 shows the minimum thickness of the one side portion 16a in the direction in which the opening 18 is formed long in the side surface portion 16 of the case 12, and the thickness of the other side portion 16b in the direction in which the opening 18 is formed short. The vibration state of the ultrasonic sensor 10 with the same dimensions, for example, 0.5 mm It is a figure of the simulation shown. Further, FIG. 7 shows the minimum thickness of one side portion 16a in the direction in which the opening 18 is formed longer in the side surface portion 16 of the case 12, for example, the other side in the direction in which the opening 18 is formed shorter than 0.5 mm. FIG. 6 is a simulation diagram showing the vibration state of the ultrasonic sensor 10 in which the thickness of the portion 16b is formed to be thin, for example, 0.25 mm. In FIGS. 5, 6, and 7, the state in which the case 12 is most deformed by vibration is indicated by a solid line, and the state in which the case 12 is not deformed is indicated by a two-dot chain line.
図 5に示すように、ケース 12の側面部 16において開口部 18が短く形成される方向 における他方側部分 16bの厚みを一方側部分 16aの厚みより厚く形成すると、ケース 12の端部において振動がほとんどみられないのに対して、図 6および図 7に示すよう に、ケース 12の側面部 16において開口部 18が短く形成される方向における他方側 部分 16bの厚みを一方側部分 16aの厚み以下の厚みに形成すると、ケース 12の端 部において振動が大きくなり、その振動により残響が大きくなることがわ力る。 As shown in FIG. 5, when the thickness of the other side portion 16b in the direction in which the opening 18 is formed short in the side surface portion 16 of the case 12 is made larger than the thickness of the one side portion 16a, vibration is generated at the end portion of the case 12. 6 and 7, as shown in FIGS. 6 and 7, the thickness of the other side portion 16b in the direction in which the opening 18 is formed short in the side surface portion 16 of the case 12 is equal to or less than the thickness of the one side portion 16a. If it is formed to have a thickness of 5 mm, vibration will increase at the end of the case 12, and the reverberation will increase due to the vibration.
また、図 5、図 6および図 7に示す各超音波センサ 10のケース 12の底面部 14の変 位量およびケース 12の側面部 16の開口部付近の変位量をシミュレーションで測定し 、ケース 12の底面部 14の変位量に対するケース 12の側面部 16の開口部付近の変 位量を相対的に比較した。なお、ここでの変位量は、ケース 12の底面部 14に対して 垂直方向への変位と平行方向への変位とのそれぞれの変位量を合成したものを示 す。その結果、図 5に示す超音波センサ 10では、ケース 12の底面部 14に対する側 面部 16の開口部付近の変位量は 0. 067と小さく、ケース 12の側面部 16の振動はケ ース 12の底面部 14の振動に対し無視できる程度の振動しか生じて 、な 、ことがわか つた。これに対して、図 6に示す超音波センサ 10ではケース 12の底面部 14に対する 側面部 16の開口部付近の変位量は 0. 8と大きぐまた、図 7に示す超音波センサ 10 でもケース 12の底面部 14に対する側面部 16の開口部付近の変位量は 1. 0と大きく 、それぞれ、ケース 12の側面部 16の振動はケース 12の側面部 14と同程度の振動を 生じていることがわ力つた。これより、開口部 18が長く形成される方向における一方 側部分 16aの厚みが、開口部 18が短く形成される方向における他方側部分 16bの 厚みよりも薄い構造にすることによって、ケース 12の側面部 16の振動が抑制でき、残 響が低減できることがわかる。
[0039] 図 8は、この発明にかかる超音波センサの他の例を示す正面図解図であり、図 9は 、その超音波センサの側面図解図である。図 8に示す超音波センサ 10では、図 1に 示す超音波センサ 10と比べて、ケース 12の側面部 16において、他方側部分 16b, 1 6bの内周面の中間部分が断面円弧状に凹むように形成されている。それによつて、 ケース 12の側面部 16において、他方側部分 16b, 16bの中間部分の厚みも中央か ら両側の一方側部分 16a, 16aに接近するに従って徐々に厚くなるように形成され、 すなわち、ケース 12の底面部 14の主面に平行する方向において傾斜的に変化する ように形成されている。 Further, the displacement amount of the bottom surface portion 14 of the case 12 and the displacement amount near the opening of the side surface portion 16 of the case 12 of each ultrasonic sensor 10 shown in FIGS. The amount of displacement in the vicinity of the opening of the side surface portion 16 of the case 12 relative to the amount of displacement of the bottom surface portion 14 was compared. Here, the amount of displacement is a combination of the amount of displacement in the vertical direction and the amount of displacement in the parallel direction with respect to the bottom surface portion 14 of the case 12. As a result, in the ultrasonic sensor 10 shown in FIG. 5, the displacement near the opening of the side surface portion 16 with respect to the bottom surface portion 14 of the case 12 is as small as 0.067, and the vibration of the side surface portion 16 of the case 12 is the case 12. It was found that there was only a negligible vibration with respect to the vibration of the bottom surface portion 14 of the. On the other hand, in the ultrasonic sensor 10 shown in FIG. 6, the displacement near the opening of the side surface portion 16 with respect to the bottom surface portion 14 of the case 12 is as large as 0.8. Also in the ultrasonic sensor 10 shown in FIG. The amount of displacement near the opening of the side surface portion 16 with respect to the bottom surface portion 14 of 12 is as large as 1.0, and the vibration of the side surface portion 16 of the case 12 generates the same vibration as the side surface portion 14 of the case 12, respectively. I was strong. Thus, the side surface of the case 12 is formed by making the structure in which the thickness of the one side portion 16a in the direction in which the opening 18 is formed long is thinner than the thickness of the other side portion 16b in the direction in which the opening 18 is formed short. It can be seen that the vibration of part 16 can be suppressed and the reverberation can be reduced. FIG. 8 is a front view solution view showing another example of the ultrasonic sensor according to the present invention, and FIG. 9 is a side view solution view of the ultrasonic sensor. In the ultrasonic sensor 10 shown in FIG. 8, compared to the ultrasonic sensor 10 shown in FIG. 1, in the side surface portion 16 of the case 12, the intermediate portion of the inner peripheral surface of the other side portions 16 b and 16 b is recessed in a circular arc shape. It is formed as follows. Accordingly, in the side surface portion 16 of the case 12, the thickness of the intermediate portion of the other side portions 16b, 16b is formed so as to gradually increase from the center toward the one side portions 16a, 16a on both sides, that is, The case 12 is formed so as to change in an inclined manner in a direction parallel to the main surface of the bottom surface portion 14.
[0040] さらに、図 8に示す超音波センサ 10では、ケース 12の底面部 14において、圧電素 子 20が設けられる中央部分とケース 12の側面部 16の厚みの薄い一方側部分 16a, 16aとの間における略楕円形板状の端側部分 14a, 14aの厚みが、ケース 12の底面 部 14の中央部分の厚み T2より薄く形成されている。 Furthermore, in the ultrasonic sensor 10 shown in FIG. 8, in the bottom surface portion 14 of the case 12, the central portion where the piezoelectric element 20 is provided and the thin side portions 16a and 16a of the side surface portion 16 of the case 12 are provided. The thickness of the substantially oval plate-like end portions 14a, 14a between the two is less than the thickness T2 of the central portion of the bottom surface portion 14 of the case 12.
[0041] なお、図 8に示す超音波センサ 10では、コンデンサが設けられておらず、信号線 2 2a, 22bにはコンデンサが接続されていない。 In the ultrasonic sensor 10 shown in FIG. 8, no capacitor is provided, and no capacitor is connected to the signal lines 22a and 22b.
[0042] このように図 8に示す超音波センサ 10では、図 1に示す超音波センサ 10と比べて、 ケース 12の側面部 16において厚みの厚い他方側部分 16b, 16bの厚みも均一では なく傾斜的に変化するように形成されているので、ケース 12の側面部 16の振動がさ らに抑えられ、残響がさらに低減される。 As described above, in the ultrasonic sensor 10 shown in FIG. 8, the thicknesses of the other side portions 16b and 16b having a large thickness in the side surface portion 16 of the case 12 are not uniform as compared with the ultrasonic sensor 10 shown in FIG. Since it is formed so as to change in an inclined manner, vibration of the side surface portion 16 of the case 12 is further suppressed, and reverberation is further reduced.
[0043] さらに、図 8に示す超音波センサ 10では、図 1に示す超音波センサ 10と比べて、ケ ース 12の底面部 14において、ケース 12の側面部 16の厚みの薄い一方側部分 16a , 16a側の部分である端側部分 14a, 14aの厚みが薄く形成されているので、指向性 や残響特性などの特性を改善することが可能である。 Furthermore, in the ultrasonic sensor 10 shown in FIG. 8, compared to the ultrasonic sensor 10 shown in FIG. 1, the side surface portion 16 of the case 12 has a thinner one side portion in the bottom surface portion 14 of the case 12. Since the end portions 14a and 14a, which are the portions on the 16a and 16a sides, are formed thin, it is possible to improve characteristics such as directivity and reverberation characteristics.
[0044] なお、上述の各超音波センサ 10では、各部が特定の大きさ、形状、配置、材料およ び数で規定されているが、この発明では、それらは任意に変更されてもよぐこのよう に変更することによって、指向性や残響特性などの特性がさらに改善されてもよい。 In each ultrasonic sensor 10 described above, each part is defined by a specific size, shape, arrangement, material, and number, but in the present invention, these may be arbitrarily changed. By changing in this way, characteristics such as directivity and reverberation characteristics may be further improved.
[0045] また、上述の各超音波センサ 10では、外部との電気的な接続のために信号線 22a , 22bが用いられる力 外部との電気的な接続のためにはピン端子が用いられてもよ い。
産業上の利用可能性 [0045] Further, in each of the ultrasonic sensors 10 described above, the signal lines 22a and 22b are used for electrical connection with the outside. Pin terminals are used for electrical connection with the outside. It's good. Industrial applicability
この発明にかかる超音波センサは、たとえば、自動車のパックソナ一などに利用さ れる。
The ultrasonic sensor according to the present invention is used in, for example, a pack sonar for an automobile.
Claims
[1] 底面部および側面部を有する有底略 4角筒状のケース、および [1] a substantially quadrangular cylindrical case with a bottom surface and a side surface, and
前記ケースの底面部の内面に形成される圧電素子を備え、 Comprising a piezoelectric element formed on the inner surface of the bottom surface of the case;
前記ケースの側面部の厚み力 前記ケースの底面部の厚みより厚く形成され、 前記ケースの開口部が、前記ケースの側面部における対向する一方側部分の厚 み方向において長く形成され、その方向と直交する前記ケースの側面部における対 向する他方側部分の厚み方向にぉ 、て短く形成され、 The thickness force of the side surface portion of the case is formed to be thicker than the thickness of the bottom surface portion of the case, and the opening portion of the case is formed longer in the thickness direction of the opposite one side portion of the side surface portion of the case. In the thickness direction of the opposite side portion of the side surface portion of the case orthogonal to each other, it is formed to be short,
前記ケースの側面部において、前記開口部が長く形成される方向における前記一 方側部分の厚みが、前記開口部が短く形成される方向における前記他方側部分の 厚みより薄く形成され、 In the side surface portion of the case, the thickness of the one side portion in the direction in which the opening is formed long is thinner than the thickness of the other side portion in the direction in which the opening is formed short,
前記ケースの側面部にぉ 、て少なくとも前記一方側部分の厚みが、前記ケースの 底面部の主面に平行する方向にぉ 、て傾斜的に変化するように形成されて 、る、超 音波センサ。 The ultrasonic sensor is formed such that the thickness of at least the one side portion of the side surface portion of the case changes in an inclined manner in a direction parallel to the main surface of the bottom surface portion of the case. .
[2] 前記ケースの側面部において前記他方側部分の厚みが、前記ケースの底面部の 主面に平行する方向にお!ヽて傾斜的に変化するように形成されて!ヽる、請求項 1に 記載の超音波センサ。
[2] In the side surface portion of the case, the thickness of the other side portion is in a direction parallel to the main surface of the bottom surface portion of the case! Formed to change in a slanting manner! The ultrasonic sensor according to claim 1.
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Cited By (8)
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KR101095848B1 (en) | 2010-09-30 | 2011-12-21 | 주성대학산학협력단 | Manufacturing method of ultrasound sensor |
US20120192652A1 (en) * | 2011-01-28 | 2012-08-02 | Texmag Gmbh Vertriebsgesellschaft | Device for detecting a selvage of a material web |
CN102768355A (en) * | 2011-05-05 | 2012-11-07 | 同致电子企业股份有限公司 | Ultrasonic sensor |
US20130049535A1 (en) * | 2011-08-22 | 2013-02-28 | Samsung Electro-Mechanics Co., Ltd. | Ultrasonic sensor |
GB2536723A (en) * | 2015-03-27 | 2016-09-28 | Bae Systems Plc | Acoustic Transducer |
WO2016189812A1 (en) * | 2015-05-25 | 2016-12-01 | パナソニックIpマネジメント株式会社 | Ultrasonic device and ultrasonic sensor using same |
US10702888B2 (en) | 2015-03-27 | 2020-07-07 | Bae Systems Plc | Acoustic transducer |
WO2021256047A1 (en) * | 2020-06-17 | 2021-12-23 | パナソニックIpマネジメント株式会社 | Ultrasonic sensor device and vehicle |
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JPH09284896A (en) * | 1996-04-17 | 1997-10-31 | Murata Mfg Co Ltd | Ultrasonic wave transmitter-receiver |
JP3034685U (en) * | 1996-08-12 | 1997-02-25 | 日本セラミック株式会社 | Ultrasonic transducer |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101095848B1 (en) | 2010-09-30 | 2011-12-21 | 주성대학산학협력단 | Manufacturing method of ultrasound sensor |
US20120192652A1 (en) * | 2011-01-28 | 2012-08-02 | Texmag Gmbh Vertriebsgesellschaft | Device for detecting a selvage of a material web |
US8789421B2 (en) * | 2011-01-28 | 2014-07-29 | Texmag Gmbh Vertriebsgesellschaft | Device for detecting a selvage of a material web |
CN102768355A (en) * | 2011-05-05 | 2012-11-07 | 同致电子企业股份有限公司 | Ultrasonic sensor |
US20130049535A1 (en) * | 2011-08-22 | 2013-02-28 | Samsung Electro-Mechanics Co., Ltd. | Ultrasonic sensor |
GB2536723A (en) * | 2015-03-27 | 2016-09-28 | Bae Systems Plc | Acoustic Transducer |
US10702888B2 (en) | 2015-03-27 | 2020-07-07 | Bae Systems Plc | Acoustic transducer |
WO2016189812A1 (en) * | 2015-05-25 | 2016-12-01 | パナソニックIpマネジメント株式会社 | Ultrasonic device and ultrasonic sensor using same |
WO2021256047A1 (en) * | 2020-06-17 | 2021-12-23 | パナソニックIpマネジメント株式会社 | Ultrasonic sensor device and vehicle |
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JPWO2007091609A1 (en) | 2009-07-02 |
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