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WO2005109488A3 - Methods of fabricating complex blade geometries from silicon wafers and strengthening blade geometries - Google Patents

Methods of fabricating complex blade geometries from silicon wafers and strengthening blade geometries Download PDF

Info

Publication number
WO2005109488A3
WO2005109488A3 PCT/US2005/015016 US2005015016W WO2005109488A3 WO 2005109488 A3 WO2005109488 A3 WO 2005109488A3 US 2005015016 W US2005015016 W US 2005015016W WO 2005109488 A3 WO2005109488 A3 WO 2005109488A3
Authority
WO
WIPO (PCT)
Prior art keywords
etching
blade
wafers
blades
poly
Prior art date
Application number
PCT/US2005/015016
Other languages
French (fr)
Other versions
WO2005109488A2 (en
Inventor
James Hughes
Vadim Daskal
Joseph Keenan
Attila Kiss
Susan Chavez
Original Assignee
Becton Dickinson Co
James Hughes
Vadim Daskal
Joseph Keenan
Attila Kiss
Susan Chavez
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Becton Dickinson Co, James Hughes, Vadim Daskal, Joseph Keenan, Attila Kiss, Susan Chavez filed Critical Becton Dickinson Co
Priority to AU2005241946A priority Critical patent/AU2005241946B2/en
Priority to EP05758045A priority patent/EP1751790A4/en
Priority to CA002564196A priority patent/CA2564196A1/en
Priority to JP2007511053A priority patent/JP2007535384A/en
Priority to NZ551031A priority patent/NZ551031A/en
Priority to BRPI0510488-2A priority patent/BRPI0510488A/en
Priority to MXPA06012320A priority patent/MXPA06012320A/en
Publication of WO2005109488A2 publication Critical patent/WO2005109488A2/en
Publication of WO2005109488A3 publication Critical patent/WO2005109488A3/en

Links

Classifications

    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B17/00Surgical instruments, devices or methods, e.g. tourniquets
    • A61B17/32Surgical cutting instruments
    • A61B17/3209Incision instruments
    • A61B17/3211Surgical scalpels, knives; Accessories therefor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B17/00Surgical instruments, devices or methods, e.g. tourniquets
    • A61B2017/00526Methods of manufacturing

Landscapes

  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Surgery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Veterinary Medicine (AREA)
  • Physics & Mathematics (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Medical Informatics (AREA)
  • Molecular Biology (AREA)
  • Animal Behavior & Ethology (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Biomedical Technology (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Micromachines (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • ing And Chemical Polishing (AREA)
  • Drying Of Semiconductors (AREA)

Abstract

Ophthalmic surgical blades are manufactured from either a single crystal or poly-crystalline material, preferably in the form of a wafer. The method comprises preparing the single crystal or poly-crystalline wafers by mounting them and etching trenches into the wafers using one of several processes. Methods for machining the trenches, which form the bevel blade surfaces, include a diamond blade saw, laser system, ultrasonic machine, a hot forge press and a router. Other processes include wet etching (isotropic and anisotropic) and dry etching (isotropic and anisotropic, including reactive ion etching), and combinations of these etching steps. The wafers are then placed in an etchant solution which isotropically etches the wafers in a uniform manner, such that layers of crystalline or poly-crystalline material are removed uniformly, producing single, double or multiple bevel blades. Nearly any angle can be machined into the wafer, and the machined angle remains after etching. The resulting radii of the blade edges is 5-500 nm, which is the same caliber as a diamond edged blade, but manufactured at a fraction of the cost. A range of radii may be 30 to 60 nm, with a specific implementation being about 40 nm. The blade profile may have an angle of, for example, about 60 . The ophthalmic surgical blades can be used for cataract and refractive surgical procedures, as well as microsurgical, biological and non-medical, non-biological purposes. Surgical and non-surgical blades and mechanical devices manufactured as described herein can also exhibit substantially smoother surfaces than metal blades.
PCT/US2005/015016 2004-04-30 2005-04-29 Methods of fabricating complex blade geometries from silicon wafers and strengthening blade geometries WO2005109488A2 (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
AU2005241946A AU2005241946B2 (en) 2004-04-30 2005-04-29 Methods of fabricating complex blade geometries from silicon wafers and strengthening blade geometries
EP05758045A EP1751790A4 (en) 2004-04-30 2005-04-29 Methods of fabricating complex blade geometries from silicon wafers and strengthening blade geometries
CA002564196A CA2564196A1 (en) 2004-04-30 2005-04-29 Methods of fabricating complex blade geometries from silicon wafers and strengthening blade geometries
JP2007511053A JP2007535384A (en) 2004-04-30 2005-04-29 Method for fabricating complex blade shapes on silicon wafers and method for strengthening blade shapes
NZ551031A NZ551031A (en) 2004-04-30 2005-04-29 Methods of fabricating surgical blades from silicon wafers by etching
BRPI0510488-2A BRPI0510488A (en) 2004-04-30 2005-04-29 methods of fabricating complex blade geometries from silicon pellets and reinforcing blade geometry
MXPA06012320A MXPA06012320A (en) 2004-04-30 2005-04-29 Methods of fabricating complex blade geometries from silicon wafers and strengthening blade geometries.

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US56639704P 2004-04-30 2004-04-30
US60/566,397 2004-04-30
US58485004P 2004-07-02 2004-07-02
US60/584,850 2004-07-02

Publications (2)

Publication Number Publication Date
WO2005109488A2 WO2005109488A2 (en) 2005-11-17
WO2005109488A3 true WO2005109488A3 (en) 2006-11-16

Family

ID=35320912

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/015016 WO2005109488A2 (en) 2004-04-30 2005-04-29 Methods of fabricating complex blade geometries from silicon wafers and strengthening blade geometries

Country Status (10)

Country Link
EP (1) EP1751790A4 (en)
JP (1) JP2007535384A (en)
KR (1) KR20070005725A (en)
AU (1) AU2005241946B2 (en)
BR (1) BRPI0510488A (en)
CA (1) CA2564196A1 (en)
MX (1) MXPA06012320A (en)
NZ (1) NZ551031A (en)
RU (1) RU2006137478A (en)
WO (1) WO2005109488A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011169784A (en) * 2010-02-19 2011-09-01 Disco Corp Method of preparing sample for inspection
JP5995954B2 (en) * 2011-03-22 2016-09-28 チャン へ バイオ−メディカル サイエンス(ヤンジョウ) カンパニー リミテッド Medical device and manufacturing method thereof

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6099543A (en) * 1998-03-18 2000-08-08 Smith; Thomas C. Ophthalmic surgical blade
US20030199165A1 (en) * 2002-03-11 2003-10-23 Becton, Dickinson And Company System and method for the manufacture of surgical blades

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19859905C2 (en) * 1998-01-27 2002-05-23 Gfd Ges Fuer Diamantprodukte M Diamond cutting tool
US20020078576A1 (en) * 2000-11-10 2002-06-27 Carr William N. Micromachined surgical scalpel

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6099543A (en) * 1998-03-18 2000-08-08 Smith; Thomas C. Ophthalmic surgical blade
US20030199165A1 (en) * 2002-03-11 2003-10-23 Becton, Dickinson And Company System and method for the manufacture of surgical blades

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP1751790A4 *

Also Published As

Publication number Publication date
JP2007535384A (en) 2007-12-06
AU2005241946A1 (en) 2005-11-17
NZ551031A (en) 2010-08-27
EP1751790A2 (en) 2007-02-14
RU2006137478A (en) 2008-06-10
BRPI0510488A (en) 2007-11-13
MXPA06012320A (en) 2007-01-31
AU2005241946B2 (en) 2010-06-03
KR20070005725A (en) 2007-01-10
WO2005109488A2 (en) 2005-11-17
CA2564196A1 (en) 2005-11-17
EP1751790A4 (en) 2011-03-23

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