WO2005029937A1 - Electromagnetic interference shield unit and method of manufacturing the same - Google Patents
Electromagnetic interference shield unit and method of manufacturing the same Download PDFInfo
- Publication number
- WO2005029937A1 WO2005029937A1 PCT/KR2004/002360 KR2004002360W WO2005029937A1 WO 2005029937 A1 WO2005029937 A1 WO 2005029937A1 KR 2004002360 W KR2004002360 W KR 2004002360W WO 2005029937 A1 WO2005029937 A1 WO 2005029937A1
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- WO
- WIPO (PCT)
- Prior art keywords
- thin metal
- metal film
- electromagnetic interference
- plastic
- interference shield
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 229910052751 metal Inorganic materials 0.000 claims abstract description 101
- 239000002184 metal Substances 0.000 claims abstract description 101
- 238000000034 method Methods 0.000 claims abstract description 22
- 230000001070 adhesive effect Effects 0.000 claims abstract description 13
- 239000000853 adhesive Substances 0.000 claims abstract description 11
- 230000008878 coupling Effects 0.000 claims abstract description 4
- 238000010168 coupling process Methods 0.000 claims abstract description 4
- 238000005859 coupling reaction Methods 0.000 claims abstract description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 34
- 229910052759 nickel Inorganic materials 0.000 claims description 14
- 239000010949 copper Substances 0.000 claims description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 229910052709 silver Inorganic materials 0.000 claims description 8
- 239000004332 silver Substances 0.000 claims description 8
- 238000007747 plating Methods 0.000 claims description 7
- 238000005507 spraying Methods 0.000 claims description 7
- 238000001771 vacuum deposition Methods 0.000 claims description 7
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 6
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 6
- 229910045601 alloy Inorganic materials 0.000 claims description 6
- 239000000956 alloy Substances 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 239000010935 stainless steel Substances 0.000 claims description 6
- 229910001220 stainless steel Inorganic materials 0.000 claims description 6
- 229910052719 titanium Inorganic materials 0.000 claims description 6
- 239000010936 titanium Substances 0.000 claims description 6
- 238000007493 shaping process Methods 0.000 claims description 5
- 238000005476 soldering Methods 0.000 abstract description 5
- 239000010408 film Substances 0.000 description 84
- 239000000463 material Substances 0.000 description 5
- 239000002253 acid Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000000638 solvent extraction Methods 0.000 description 2
- 230000001413 cellular effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/003—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields made from non-conductive materials comprising an electro-conductive coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0079—Electrostatic discharge protection, e.g. ESD treated surface for rapid dissipation of charges
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
- H01L2924/1617—Cavity coating
Definitions
- the present invention relates to an electromagnetic interference shield unit and a method of manufacturing the electromagnetic interference shield unit and more particularly, to an electromagnetic interference shield unit for shielding highly integrated chips mounted on a printed circuit board of a precise electronic apparatus sich as a cellular phone from electromagnetic waves.
- connection terminals might be electrically connected to the electromagnetic interference shield units.
- the electromagnetic interference shield units are coupled to the printed circuit boards through soldering, thermal deformation might be generated in the printed circuit board at the time of soldering and it was considerably difficult to remove the can at the time of repairing the electronic components. Furthermore, external impacts could not be buffed properly and it was difficult to restore the deformed shapes. Disclosure of Invention Technical Problem
- the present invention is contrived to solve the above problems, and it is an object of the present invention to provide an electromagnetic interference shield unit which made of plastic material, thereby having buffer action to external impacts and minimizing deformation, and a method of manufacturing the electromagnetic interference shield unit.
- a n electromagnetic interference shield unit for intercepting electromagnetic waves from electronic components mounted on a printed circuit board, the unit comprising: a plastic can provided to cover the electronic components mounted on the printed circuit board, the plastic can having a flange formed on the circumferential edge thereof and a shielded room formed therein ; a first thin metal film formed on the upper surface of the plastic can ; a second thin metal film formed on the lower surface of the plastic can to face the printed circuit board; a noncondictive film formed on the lower surface of the second thin metal film not corresponding to the flange; and a condictive bonding member electrically connecting a ground pattern formed on the printed circuit board and the second thin metal film on the flange each other and coupling the plastic can to the printed circuit board .
- the first thin metal film may be made of one of chrome, stainless steel, nickel, titanium, and alloys thereof and the second thin metal film may be made of one of nickel, copper, silver, and aluminum.
- the first thin metal film and the second thin metal film may be formed on the surface of the plastic can using one of a spray coating method, a vacuum evaporation method, and a wet plating method.
- the first thin metal film may be connected to the second thin metal film through the side surface of the flange and the conductive bonding member may be one of a oondictive adhesive and a conductive double-sided tape.
- the first thin metal film may perform an electrostatic discharge (ESD) intercepting function and the second thin metal film may perform an electromagnetic interference (EMI) intercepting function.
- ESD electrostatic discharge
- EMI electromagnetic interference
- the bonding member may include conductive material to be electrically oondictive and may have an adhesive property at a temperature of -35 ° C to 85 ° C.
- metal powders included in the oondictive material may include nickel, silver, copper, aluminum, etc. having a sub-micrometer size.
- a method of manufacturing an electromagnetic interference shield unit comprising: shaping a plastic can having a shielded room formed therein and a flange formed on the circumferential edge thereof; forming a first thin metal film on the upper surface of the plastic can; forming a second thin metal film on the lower surface of the plastic can; forming a nonconductive film on the lower surface of the second thin metal film not corresponding to the flange; and forming a oondictive bonding member on the lower surface of the second thin metal film under the flange of the plastic can.
- T he oondictive bonding member may be attached to a ground pattern formed on a printed circuit board and the conductive bonding member may be one of a conductive adhesive and a oondictive double-sided tape.
- the first thin metal film may be made of one of chrome, stainless steel, nickel, titanium, and alloys thereof and the second thin metal film may be made of one of nickel, copper, silver, and aluminum.
- the first thin metal film and the second thin metal film may be formed on the surfaces of the plastic can using one of a spray coating method, a vacuum evaporation method, and a wet plating method, and the first thin metal film may be connected to the second thin metal film through the side surface of the flange.
- the first thin metal film may perform an electrostatic discharge (ESD) intercepting function and the second thin metal film may perform an electromagnetic interference (EMI) intercepting function.
- ESD electrostatic discharge
- EMI electromagnetic interference
- FIG. 1 is a cross-sectional view illustrating an electromagnetic interference shield unit arjcording to an embodiment of the present invention , which is provided on a printed circuit board.
- FIG. 2 is a cross-sectional view illustrating the electromagnetic interference shield unit arjcording to another embodiment of the present invention, which is provided on a printed circuit board.
- FIG. 3 is a flowchart illustrating a method of manufacturing the electromagnetic interference shield unit according to the present invention. Best Mode for Carrying Out the Invention
- An electromagnetic interference shield unit comprises, as shown in FIG. 1, a plastic can 10 which is covered on a printed circuit board 1 to house a plurality of electronic components mounted on the printed circuit board 1 and has a shielded room formed therein and a flange 11 formed on the circumferential edge thereof.
- a first thin metal film 20 for intercepting the electrostatic discharge (ESD) is formed on the upper surface of the plastic can 10 and the flange 11 extending from the plastic can 10, and a second thin metal film 30 for intercepting the electromagnetic interference (EMI) is formed on the lower surface of the plastic can 10 and the flange 11.
- ESD electrostatic discharge
- EMI electromagnetic interference
- a noncondictive film 40 for efficiently intercepting the electrical connection between the electronic components on the printed circuit board 1, on which the electromagnetic interference shield unit is provided, and the second thin metal film 30 is formed on the lower surface of the second thin metal film 30 other than the lower surface of the flange 11.
- the electromagnetic interference shield unit comprises a conductive bonding member 50 for connecting the second thin metal film 30 formed on the flange 11 to a ground pattern 60 formed on the printed circuit board 1 and coupling the can 10 to the printed circuit board 1.
- the first thin metal film 20 serves as a thin metal film for intercepting the ESD and is formed by performing a spray coating method or a vacuum evaporation method or a wet plating method on the upper surface of the plastic can 10 using one of stainless steel, nickel, titanium, chrome, and nickel-chrome alloy.
- the second thin metal film 30 serves as a thin metal film for intercepting the EMI and is formed by performing a spray coating method or a vacuum evaporation method or a wet plating method on the lower surface of the plastic can 10 using one of nickel (Ni), copper (Cu), and silver (Ag).
- the conductive bonding member 50 includes conductive material to be electrically conductive and bonds the can 10 to the printed circuit board 1 using one of a conductive adhesive and a conductive double-sided tape of which the adhesive property is maintained at a temperature of -35 ° C to 85 ° C.
- the metal powders included in the conductive material may include nickel, silver, copper, and aluminum having a sub micrometer size.
- FIG. 2 is a cross-sectional view illustrating the electromagnetic interference shield unit according to another embodiment of the present invention, which is provided on the printed circuit board.
- the first thin metal film 20 intercepts the ESD and can perform the electromagnetic interference shield function without grounding the flange 11. However, if the flange 11 is grounded, the electromagnetic interference shield function can be more surely carried out and static electricity can be also prevented.
- the first thin metal film 20 is coated on the upper surface of the plastic can 10 to cover the side surface 13 of the flange 11 and the second thin metal film 30 is coated on the lower surface of the plastic can 10, so that the second thin metal film 30 is electrically connected to the first thin metal film 20. Therefore, the first thin metal film 20 is electrically connected to the ground pattern 60 on the printed circuit board 1 through the conductive double- sided tape 50 together with the second thin metal film 30, and is surely grounded.
- the can 10 is bonded to the printed circuit board 1 through the processes shown in FIG. 3, thereby shielding the electronic components.
- the plastic can 10 having the shielded room 15 formed therein and the flange 11 formed on the circumferential edge with a predetermined width is shaped using plastic material (S10).
- one or more shielded room having a cap shape is formed by shaping a thin plastic plate made of PE, PP, PC, PET, PEI, etc. in consideration of heights and areas of components to be shielded. At that time, the flange 11 is formed on the circumferential edge thereof.
- the first thin metal film 20 is coated on the upper surface of the shaped plastic can 10 (S20).
- the vacuum evaporation method, the spray coating method, or the wet plating method is carried out on the upper surface of the plastic can 10, so that the resistance across a diagonal line should be 200[ohm]or less.
- the first thin metal film 20 should be kept in a salt water of 5% at a temperature of 35 ° C for 48 hours.
- the thin metal film may be formed as a multilayer film having a conductive thin film and a protection film formed thereon.
- the conductive thin film is usually made of one of copper, silver, and nickel, and these materials do not have resistance to the salt water. Therefore, the protection film is required for protecting the conductive thin film.
- the protection film may be made of one of stainless steel, titanium, nickel, chrome and alloys thereof.
- the multi-layer film may have one structure of 'SUS + Cu + Ag + Cu + SUS', 'Cr + AG + Cr', 'SUS + Ag + SUS,' and 'Ni + Ag + Ni'.
- the second thin metal film 30 is coated on the lower surface of the plastic can 10 (S30).
- the second thin metal film 30 serves as an EMI intercepting film, and may be made of Ag in consideration of product reliability.
- Cu has a defect that it does not have a resistance to the salt water and acid. Since Ag has a small bonding force to plastic, Ni, which has a large bonding force to plastic and an excellent resistance to acid and also has a large bonding force to Ag, may be combined therewith.
- the multi-layer thin metal film of 'Ni + Ag + Ni' is used as the second thin metal film 30.
- the nonconductive film 40 is formed on the lower surface of the second thin metal film 30 other than the lower portion of the flange 11 (S40).
- the nonconductive film 40 serves as preventing the electrical contact with the electronic components in working processes or others.
- the bonding member 50 that is, a conductive adhesive or a conductive double- sided tape is coated or attached to the lower surface of the second thin metal film 30 under the flange 11 of the plastic can 10 (S50).
- the second thin metal film 30 of the flange (11) and the ground pattern 60 formed around the shielded area of the printed circuit board 1 are bonded each other using the conductive adhesive or the conductive double-sided tape (S60). [42] Therefore, by attaching the plastic can to the printed circuit board to cover the electronic components thereon, the shielding process can be simplified and more sure shielding effect can be obtained.
- the thin metal films are formed on the upper surface and the lower surface of the plastic can 10 to perform the shielding, it is possible to more surely solve problems such as damage on the upper surface and lack of the resistance to acid, compared with the conventional case where the thin metal film is formed only on the upper surface.
- the shielding film is formed by depositing the thin metal film on the plastic can
- the present invention is not limited to the embodiments.
- a can in which a first thin metal film is formed on the upper surface of a plastic can and a second thin metal film is formed on the lower surface of the plastic can may be manufactured, by shaping the first thin metal film and the second thin metal film in a can shape, forming a nonconductive film on the lower surface of the second thin metal film other than the lower portion of the flange, inserting the plastic can between the first and second thin metal films, and then performing a compression molding integrally.
- ribs partitioning the shielded areas along edge patterns of the shielded areas are formed in the case of the electronic components to press the flange of the plastic can, so that the bonded state can be stably maintained.
- the ribs are designed to partition the shielded areas in a shielding structure of the electronic components on the printed circuit board and it is preferable that a case in which the ribs for partitioning the shielded areas are formed is used in the present invention.
- the electronic components mounted on the printed circuit board 1 are covered with the can and the electronic components in the shielded room are shielded. Accordingly, the electromagnetic waves generated from the electronic components can be accumulated in the thin metal films as a metal coating layer and can be removed through the conductive double-sided tape and the ground pattern of the printed circuit board 1.
- the present invention by forming the thin metal films on the upper surface and the lower surface of the plastic can and further forming the nonconductive film on the lower surface thereof, it is possible to considerably enhance the electromagnetic interference shield efficiency and it is difficult to form a short circuit with other components in the course of the bonding process and use thereof.
- the present invention employs the double-sided tape or the adhesive for the bonding process, the conventional thermal deformation due to the soldering can be prevented.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
There are provided an electromagnetic interference shield unit and a method of manufacturing the same. The electromagnetic interference shield unit for intercepting electromagnetic waves from electronic components mounted on a printed circuit board comprises: a plastic can provided to cover the electronic components mounted on the printed circuit board, the plastic can having a flange formed on the circumferential edge thereof and a shielded room formed therein ; a first thin metal film formed on the upper surface of the plastic can ; a second thin metal film formed on the lower surface of the plastic can to face the printed circuit board; a nonconductive film formed on the lower surface of the second thin metal film not corresponding to the flange; and a conductive bonding member electrically connecting a ground pattern formed on the printed circuit board and the second thin metal film on the flange each other and coupling the plastic can to the printed circuit board . Therefore, by forming the thin metal films on the upper surface and the lower surface of the plastic can and further forming the nonconductive film on the lower surface, it is possible to remarkably enhance the shielding efficiency and the short circuit to other components is not caused during an attaching process or use thereof. In addition, since the electromagnetic interference shield unit is attached to the printed circuit board using a double-sided tape or an adhesive, it is possible to prevent the thermal deformation due to a conventional soldering method.
Description
Description ELECTROMAGNETIC INTERFERENCE SHIELD UNIT AND METHOD OF MANUFACTURING THE SAME
[1] The present invention relates to an electromagnetic interference shield unit and a method of manufacturing the electromagnetic interference shield unit and more particularly, to an electromagnetic interference shield unit for shielding highly integrated chips mounted on a printed circuit board of a precise electronic apparatus sich as a cellular phone from electromagnetic waves. Background Art
[2] Recently, with decrease in size and increase in integration degree of electronic components, highly ntegrated devices were widely used. However, these highly- integrated devices generate electromagnetic waves resulting in disadvantages sich as electromagnetic interference (EMI), electrostatic discharge (ESD), etc., thereby having a harmful influence on adjacent components or equipments and human bodies.
[3] As a result, in order to intercept the electromagnetic waves, conventionally, the electromagnetic waves were intercepted by forming thin metal films on cases of electronic products. That is, thin metal films for intercepting the electromagnetic waves were formed on the cases to which printed circuit boards mounted with electronic components are fitted and side portions of shielded areas were covered with ribs protruded from the cases. Further, there have been developed electromagnetic interference shield units comprising metal cans.
[4] These can-shaped electromagnetic interference shield units have more excellent electromagnetic interference shield efficiency than the conventional thin metal films which were formed on the cases. However, since the can-shaped electromagnetic interference shield units are made of conductive metal, there were several problems in a method of providing the units on the printed circuit boards and in use thereof.
[5] That is, for the reason of material, connection terminals might be electrically connected to the electromagnetic interference shield units. Further, since the electromagnetic interference shield units are coupled to the printed circuit boards through soldering, thermal deformation might be generated in the printed circuit board at the time of soldering and it was considerably difficult to remove the can at the time of repairing the electronic components. Furthermore, external impacts could not be buffed properly and it was difficult to restore the deformed shapes. Disclosure of Invention
Technical Problem
[6] The present invention is contrived to solve the above problems, and it is an object of the present invention to provide an electromagnetic interference shield unit which made of plastic material, thereby having buffer action to external impacts and minimizing deformation, and a method of manufacturing the electromagnetic interference shield unit.
[7] It is another object of the present invention to provide an electromagnetic interference shield unit in which thin metal films are formed on the upper surface and the lower surface of a plastic can and a noncondictive film is formed on the lower surface of the thin metal film, thereby enhancing electromagnetic interference shield efficiency and preventing a short circuit, and a method of manufacturing the electromagnetic interference shield unit.
[8] It is also another object of the present invention to provide an electromagnetic interference shield unit which is coupled to a printed circuit board with conductive adhesive, thereby preventing the thermal deformation of the printed circuit board and facilitating separation between the electromagnetic unit and the printed circuit board and a method of manufacturing the electromagnetic interference shield unit. Technical Solution
[9] According to an aspect of the present invention, there is provided a n electromagnetic interference shield unit for intercepting electromagnetic waves from electronic components mounted on a printed circuit board, the unit comprising: a plastic can provided to cover the electronic components mounted on the printed circuit board, the plastic can having a flange formed on the circumferential edge thereof and a shielded room formed therein ; a first thin metal film formed on the upper surface of the plastic can ; a second thin metal film formed on the lower surface of the plastic can to face the printed circuit board; a noncondictive film formed on the lower surface of the second thin metal film not corresponding to the flange; and a condictive bonding member electrically connecting a ground pattern formed on the printed circuit board and the second thin metal film on the flange each other and coupling the plastic can to the printed circuit board .
[10] The first thin metal film may be made of one of chrome, stainless steel, nickel, titanium, and alloys thereof and the second thin metal film may be made of one of nickel, copper, silver, and aluminum. The first thin metal film and the second thin metal film may be formed on the surface of the plastic can using one of a spray coating
method, a vacuum evaporation method, and a wet plating method.
[11] The first thin metal film may be connected to the second thin metal film through the side surface of the flange and the conductive bonding member may be one of a oondictive adhesive and a conductive double-sided tape. The first thin metal film may perform an electrostatic discharge (ESD) intercepting function and the second thin metal film may perform an electromagnetic interference (EMI) intercepting function.
[12] The bonding member may include conductive material to be electrically oondictive and may have an adhesive property at a temperature of -35 ° C to 85 ° C. Examples of metal powders included in the oondictive material may include nickel, silver, copper, aluminum, etc. having a sub-micrometer size.
[13] According to another aspect of the present invention, there is provided a method of manufacturing an electromagnetic interference shield unit, the method comprising: shaping a plastic can having a shielded room formed therein and a flange formed on the circumferential edge thereof; forming a first thin metal film on the upper surface of the plastic can; forming a second thin metal film on the lower surface of the plastic can; forming a nonconductive film on the lower surface of the second thin metal film not corresponding to the flange; and forming a oondictive bonding member on the lower surface of the second thin metal film under the flange of the plastic can.
[14] T he oondictive bonding member may be attached to a ground pattern formed on a printed circuit board and the conductive bonding member may be one of a conductive adhesive and a oondictive double-sided tape. The first thin metal film may be made of one of chrome, stainless steel, nickel, titanium, and alloys thereof and the second thin metal film may be made of one of nickel, copper, silver, and aluminum.
[15] The first thin metal film and the second thin metal film may be formed on the surfaces of the plastic can using one of a spray coating method, a vacuum evaporation method, and a wet plating method, and the first thin metal film may be connected to the second thin metal film through the side surface of the flange. The first thin metal film may perform an electrostatic discharge (ESD) intercepting function and the second thin metal film may perform an electromagnetic interference (EMI) intercepting function. Advantageous Effects
[16] According to the present invention described above, by forming thin metal films on the upper surface and the lower surface of the plastic can and further forming the noncondictive film on the lower surface thereof, it is possible to considerably enhance the electromagnetic interference shield efficiency and it is difficult to form a short circuit
with other components in the course of a bonding process and use thereof. In addition, since the present invention employs the double-sided tape or the adhesive for the bonding process, the conventional thermal deformation due to the soldering can be prevented. Brief Description of the Drawings
[17] FIG. 1 is a cross-sectional view illustrating an electromagnetic interference shield unit arjcording to an embodiment of the present invention , which is provided on a printed circuit board.
[18] FIG. 2 is a cross-sectional view illustrating the electromagnetic interference shield unit arjcording to another embodiment of the present invention, which is provided on a printed circuit board.
[19] FIG. 3 is a flowchart illustrating a method of manufacturing the electromagnetic interference shield unit according to the present invention. Best Mode for Carrying Out the Invention
[20] Hereinafter, exemplary embodiments of the present invention will be described in more detail with reference to the figures.
[21] An electromagnetic interference shield unit according to the present invention comprises, as shown in FIG. 1, a plastic can 10 which is covered on a printed circuit board 1 to house a plurality of electronic components mounted on the printed circuit board 1 and has a shielded room formed therein and a flange 11 formed on the circumferential edge thereof.
[22] A first thin metal film 20 for intercepting the electrostatic discharge (ESD) is formed on the upper surface of the plastic can 10 and the flange 11 extending from the plastic can 10, and a second thin metal film 30 for intercepting the electromagnetic interference (EMI) is formed on the lower surface of the plastic can 10 and the flange 11.
[23] A noncondictive film 40 for efficiently intercepting the electrical connection between the electronic components on the printed circuit board 1, on which the electromagnetic interference shield unit is provided, and the second thin metal film 30 is formed on the lower surface of the second thin metal film 30 other than the lower surface of the flange 11.
[24] Further, the electromagnetic interference shield unit comprises a conductive bonding member 50 for connecting the second thin metal film 30 formed on the flange 11 to a ground pattern 60 formed on the printed circuit board 1 and coupling the can 10 to the printed circuit board 1.
[25] The first thin metal film 20 serves as a thin metal film for intercepting the ESD and is formed by performing a spray coating method or a vacuum evaporation method or a wet plating method on the upper surface of the plastic can 10 using one of stainless steel, nickel, titanium, chrome, and nickel-chrome alloy.
[26] The second thin metal film 30 serves as a thin metal film for intercepting the EMI and is formed by performing a spray coating method or a vacuum evaporation method or a wet plating method on the lower surface of the plastic can 10 using one of nickel (Ni), copper (Cu), and silver (Ag).
[27] The conductive bonding member 50 includes conductive material to be electrically conductive and bonds the can 10 to the printed circuit board 1 using one of a conductive adhesive and a conductive double-sided tape of which the adhesive property is maintained at a temperature of -35 ° C to 85 ° C. Examples of the metal powders included in the conductive material may include nickel, silver, copper, and aluminum having a sub micrometer size.
[28] FIG. 2 is a cross-sectional view illustrating the electromagnetic interference shield unit according to another embodiment of the present invention, which is provided on the printed circuit board.
[29] In the structure shown in FIG.l, the first thin metal film 20 intercepts the ESD and can perform the electromagnetic interference shield function without grounding the flange 11. However, if the flange 11 is grounded, the electromagnetic interference shield function can be more surely carried out and static electricity can be also prevented. In order to ground the flange, as shown in FIG. 2, the first thin metal film 20 is coated on the upper surface of the plastic can 10 to cover the side surface 13 of the flange 11 and the second thin metal film 30 is coated on the lower surface of the plastic can 10, so that the second thin metal film 30 is electrically connected to the first thin metal film 20. Therefore, the first thin metal film 20 is electrically connected to the ground pattern 60 on the printed circuit board 1 through the conductive double- sided tape 50 together with the second thin metal film 30, and is surely grounded.
[30] In the present invention constructed in this way, the can 10 is bonded to the printed circuit board 1 through the processes shown in FIG. 3, thereby shielding the electronic components.
[31] First, the plastic can 10 having the shielded room 15 formed therein and the flange 11 formed on the circumferential edge with a predetermined width is shaped using plastic material (S10).
[32] In the process (S10) of shaping the plastic can 10, one or more shielded room
having a cap shape is formed by shaping a thin plastic plate made of PE, PP, PC, PET, PEI, etc. in consideration of heights and areas of components to be shielded. At that time, the flange 11 is formed on the circumferential edge thereof.
[33] Then, the first thin metal film 20 is coated on the upper surface of the shaped plastic can 10 (S20). In this process, the vacuum evaporation method, the spray coating method, or the wet plating method is carried out on the upper surface of the plastic can 10, so that the resistance across a diagonal line should be 200[ohm]or less.
[34] The first thin metal film 20 should be kept in a salt water of 5% at a temperature of 35 ° C for 48 hours.
[35] In order to satisfy theses conditions, the thin metal film may be formed as a multilayer film having a conductive thin film and a protection film formed thereon. The conductive thin film is usually made of one of copper, silver, and nickel, and these materials do not have resistance to the salt water. Therefore, the protection film is required for protecting the conductive thin film. The protection film may be made of one of stainless steel, titanium, nickel, chrome and alloys thereof.
[36] The multi-layer film may have one structure of 'SUS + Cu + Ag + Cu + SUS', 'Cr + AG + Cr', 'SUS + Ag + SUS,' and 'Ni + Ag + Ni'.
[37] Next, the second thin metal film 30 is coated on the lower surface of the plastic can 10 (S30). The second thin metal film 30 serves as an EMI intercepting film, and may be made of Ag in consideration of product reliability. Cu has a defect that it does not have a resistance to the salt water and acid. Since Ag has a small bonding force to plastic, Ni, which has a large bonding force to plastic and an excellent resistance to acid and also has a large bonding force to Ag, may be combined therewith.
[38] Therefore, in the present invention, it is preferable that the multi-layer thin metal film of 'Ni + Ag + Ni' is used as the second thin metal film 30.
[39] Next, the nonconductive film 40 is formed on the lower surface of the second thin metal film 30 other than the lower portion of the flange 11 (S40). The nonconductive film 40 serves as preventing the electrical contact with the electronic components in working processes or others.
[40] The bonding member 50, that is, a conductive adhesive or a conductive double- sided tape is coated or attached to the lower surface of the second thin metal film 30 under the flange 11 of the plastic can 10 (S50).
[41] The second thin metal film 30 of the flange (11) and the ground pattern 60 formed around the shielded area of the printed circuit board 1 are bonded each other using the conductive adhesive or the conductive double-sided tape (S60).
[42] Therefore, by attaching the plastic can to the printed circuit board to cover the electronic components thereon, the shielding process can be simplified and more sure shielding effect can be obtained. In the present invention, since the thin metal films are formed on the upper surface and the lower surface of the plastic can 10 to perform the shielding, it is possible to more surely solve problems such as damage on the upper surface and lack of the resistance to acid, compared with the conventional case where the thin metal film is formed only on the upper surface.
[43] Although it has been exemplified in the above embodiments that the shielding film is formed by depositing the thin metal film on the plastic can, the present invention is not limited to the embodiments. For example, a can in which a first thin metal film is formed on the upper surface of a plastic can and a second thin metal film is formed on the lower surface of the plastic can may be manufactured, by shaping the first thin metal film and the second thin metal film in a can shape, forming a nonconductive film on the lower surface of the second thin metal film other than the lower portion of the flange, inserting the plastic can between the first and second thin metal films, and then performing a compression molding integrally.
[44] In this state, although not shown in the figures, ribs partitioning the shielded areas along edge patterns of the shielded areas are formed in the case of the electronic components to press the flange of the plastic can, so that the bonded state can be stably maintained. Here, the ribs are designed to partition the shielded areas in a shielding structure of the electronic components on the printed circuit board and it is preferable that a case in which the ribs for partitioning the shielded areas are formed is used in the present invention.
[45] Therefore, in the present invention constructed in this way, the electronic components mounted on the printed circuit board 1 are covered with the can and the electronic components in the shielded room are shielded. Accordingly, the electromagnetic waves generated from the electronic components can be accumulated in the thin metal films as a metal coating layer and can be removed through the conductive double-sided tape and the ground pattern of the printed circuit board 1.
[46] Since the nonconductive film is formed inside the plastic can, it is possible to prevent the short circuit with internal components in the course of the bonding process or others.
[47] According to the present invention described above, by forming the thin metal films on the upper surface and the lower surface of the plastic can and further forming the nonconductive film on the lower surface thereof, it is possible to considerably
enhance the electromagnetic interference shield efficiency and it is difficult to form a short circuit with other components in the course of the bonding process and use thereof. In addition, since the present invention employs the double-sided tape or the adhesive for the bonding process, the conventional thermal deformation due to the soldering can be prevented.
Claims
Claims
[1] An electromagnetic interference shield unit for intercepting electromagnetic wave from electronic components mounted on a printed circuit board, the unit comprising: a plastic can provided to cover the electronic components mounted on the printed circuit board, the plastic can having a flange formed on the circumferential edge thereof and a shielded room formed therein ; a first thin metal film formed on the upper surface of the plastic can ; a second thin metal film formed on the lower surface of the plastic can to face the printed circuit board; a nonconductive film formed on the lower surface of the second thin metal film not corresponding to the flange; and a conductive bonding member electrically connecting a ground pattern formed on the printed circuit board and the second thin metal film on the flange each other and coupling the plastic can to the printed circuit board . [2] The electromagnetic interference shield unit according to claim 1, wherein the first thin metal film is made of one of chrome, stainless steel, nickel, titanium, and alloys thereof. [3] The electromagnetic interference shield unit according to claim 1, wherein the second thin metal film is made of one of nickel, copper, silver, and aluminum. [4] The electromagnetic interference shield unit according to claim 1, wherein the first thin metal film and the second thin metal film are formed on the surface of the plastic can using one of a spray coating method, a vacuum evaporation method, and a wet plating method. [5] The electromagnetic interference shield unit according to claim 1, wherein the first thin metal film is connected to the second thin metal film through the side surface of the flange. [6] The electromagnetic interference shield unit according to claim 1, wherein the conductive bonding member is one of a conductive adhesive and a conductive double-sided tape. [7] The electromagnetic interference shield unit according to claim 1, wherein the first thin metal film performs an electrostatic discharge (ESD) in-
tercepting function. [8] The electromagnetic interference shield unit according to claim 1, wherein the second thin metal film performs an electromagnetic interference (EMI) intercepting function. [9] A method of manufacturing an electromagnetic interference shield unit, the method comprising: shaping a plastic can having a shielded room formed therein and a flange formed on the circumferential edge thereof; forming a first thin metal film on the upper surface of the plastic can; forming a second thin metal film on the lower surface of the plastic can; forming a nonconductive film on the lower surface of the second thin metal film not corresponding to the flange; and forming a conductive bonding member on the lower surface of the second thin metal film under the flange of the plastic can. [10] The method of manufacturing an electromagnetic interference shield unit according to claim 9, wherein the conductive bonding member is attached to a ground pattern formed on a printed circuit board. [11] The method of manufacturing an electromagnetic interference shield unit according to claim 9, wherein the conductive bonding member is one of a conductive adhesive and a conductive double-sided tape. [12] The method of manufacturing an electromagnetic interference shield unit according to claim 9, wherein the first thin metal film is made of one of chrome, stainless steel, nickel, titanium, and alloys thereof. [13] The method of manufacturing an electromagnetic interference shield unit according to claim 9, wherein the second thin metal film is made of one of nickel, copper, silver, and aluminum. [14] The method of manufacturing an electromagnetic interference shield unit according to claim 9, wherein the first thin metal film and the second thin metal film are formed on the surfaces of the plastic can using one of a spray coating method, a vacuum evaporation method, and a wet plating method. [15] The method of manufacturing an electromagnetic interference shield unit according to claim 9, wherein the first thin metal film is connected to the second thin metal film through the side surface of the flange. [16] The method of manufacturing an electromagnetic interference shield unit
according to claim 9, wherein the first thin metal film performs an electrostatic discharge (ESD) intercepting function. [17] The method of manufacturing an electromagnetic interference shield unit according to claim 9, wherein the second thin metal film performs an electromagnetic interference (EMI) intercepting function.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2003-0065641 | 2003-09-22 | ||
| KR1020030065641A KR100618085B1 (en) | 2003-09-22 | 2003-09-22 | An apparutus and method for EMI and ESD shielding using plastic can in borad of electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2005029937A1 true WO2005029937A1 (en) | 2005-03-31 |
Family
ID=34374144
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/KR2004/002360 WO2005029937A1 (en) | 2003-09-22 | 2004-09-16 | Electromagnetic interference shield unit and method of manufacturing the same |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR100618085B1 (en) |
| WO (1) | WO2005029937A1 (en) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007135148A1 (en) * | 2006-05-23 | 2007-11-29 | Continental Automotive Gmbh | Electrical device with screen |
| WO2008062982A1 (en) * | 2006-11-21 | 2008-05-29 | Lg Innotek Co., Ltd | Electromagnetic shielding device, radio frequency module having the same, and method of manufacturing the radio frequency module |
| WO2012126269A1 (en) * | 2011-03-18 | 2012-09-27 | Telefonaktiebolaget L M Ericsson (Publ) | Electro-static shielding apparatus, electronic device, and method for manufacturing said electro-static shielding apparatus |
| US20170325365A1 (en) | 2016-05-04 | 2017-11-09 | Samsung Electronics Co., Ltd. | Hollow shielding structure for different types of circuit elements and manufacturing method thereof |
| US10201072B2 (en) | 2016-12-12 | 2019-02-05 | Samsung Electronics Co., Ltd. | EMI shielding structure and manufacturing method thereof |
| US10477687B2 (en) | 2016-08-04 | 2019-11-12 | Samsung Electronics Co., Ltd. | Manufacturing method for EMI shielding structure |
| US10531599B2 (en) | 2017-09-08 | 2020-01-07 | Samsung Electronics Co., Ltd. | Electromagnetic interference shielding structure |
| US10566293B2 (en) | 2015-03-06 | 2020-02-18 | Samsung Electronics Co., Ltd. | Circuit element package, manufacturing method thereof, and manufacturing apparatus thereof |
| US10594020B2 (en) | 2017-07-19 | 2020-03-17 | Samsung Electronics Co., Ltd. | Electronic device having antenna element and method for manufacturing the same |
| US11056441B2 (en) | 2019-12-05 | 2021-07-06 | Apple Inc. | Electromagnetic shielding of compact electronic modules |
| CN115226303A (en) * | 2021-04-16 | 2022-10-21 | 庆鼎精密电子（淮安）有限公司 | Manufacturing method of packaging structure with electromagnetic shielding effect |
| WO2022231586A1 (en) * | 2021-04-28 | 2022-11-03 | John Victor Fontaine | Electromagnetic pulse shield assembly and enclosure for protecting electrical equipment |
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|---|---|---|---|---|
| KR101248820B1 (en) * | 2011-02-18 | 2013-04-01 | 주식회사 파인테크닉스 | Shut off device of eletric wave |
| KR101925258B1 (en) * | 2018-07-03 | 2018-12-04 | (주)크린앤사이언스 | Electro Magnetic Shielding Materials Having Metal Foil & Liner and Process for Producing The Same |
| KR102474751B1 (en) | 2018-07-20 | 2022-12-07 | 삼성전자주식회사 | Electronic device including structure for protecting display driver from static electricity |
| KR102567412B1 (en) | 2018-10-31 | 2023-08-16 | 삼성전자주식회사 | Shield-film including a plurality of layers and electric device using the same |
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| US6178318B1 (en) * | 1997-04-16 | 2001-01-23 | Telefonaktiebolaget L M Ericsson | Shielding housing and a method of producing a shielding housing |
| WO2002030170A1 (en) * | 2000-10-06 | 2002-04-11 | Stork Prints B.V. | Methods of manufacturing a printed circuit board shielded against interfering radiation |
| US20030118857A1 (en) * | 2000-01-22 | 2003-06-26 | Helmut Kahl | Method for producing an electromagnetic shield |
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| US6178318B1 (en) * | 1997-04-16 | 2001-01-23 | Telefonaktiebolaget L M Ericsson | Shielding housing and a method of producing a shielding housing |
| US20030118857A1 (en) * | 2000-01-22 | 2003-06-26 | Helmut Kahl | Method for producing an electromagnetic shield |
| WO2002030170A1 (en) * | 2000-10-06 | 2002-04-11 | Stork Prints B.V. | Methods of manufacturing a printed circuit board shielded against interfering radiation |
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007135148A1 (en) * | 2006-05-23 | 2007-11-29 | Continental Automotive Gmbh | Electrical device with screen |
| US8289726B2 (en) | 2006-05-23 | 2012-10-16 | Continental Automotive Gmbh | Electrical device with screen |
| WO2008062982A1 (en) * | 2006-11-21 | 2008-05-29 | Lg Innotek Co., Ltd | Electromagnetic shielding device, radio frequency module having the same, and method of manufacturing the radio frequency module |
| WO2012126269A1 (en) * | 2011-03-18 | 2012-09-27 | Telefonaktiebolaget L M Ericsson (Publ) | Electro-static shielding apparatus, electronic device, and method for manufacturing said electro-static shielding apparatus |
| US9072161B2 (en) | 2011-03-18 | 2015-06-30 | Ericsson (China) Communications Co., Ltd. | Electro-static shielding apparatus, electronic device, and method for manufacturing said electro-static shielding apparatus |
| US10566293B2 (en) | 2015-03-06 | 2020-02-18 | Samsung Electronics Co., Ltd. | Circuit element package, manufacturing method thereof, and manufacturing apparatus thereof |
| US10477737B2 (en) | 2016-05-04 | 2019-11-12 | Samsung Electronics Co., Ltd. | Manufacturing method of a hollow shielding structure for circuit elements |
| US20170325365A1 (en) | 2016-05-04 | 2017-11-09 | Samsung Electronics Co., Ltd. | Hollow shielding structure for different types of circuit elements and manufacturing method thereof |
| US11445645B2 (en) | 2016-05-04 | 2022-09-13 | Samsung Electronics Co., Ltd. | Hollow shielding structure for different types of circuit elements and manufacturing method thereof |
| US10477687B2 (en) | 2016-08-04 | 2019-11-12 | Samsung Electronics Co., Ltd. | Manufacturing method for EMI shielding structure |
| US10201072B2 (en) | 2016-12-12 | 2019-02-05 | Samsung Electronics Co., Ltd. | EMI shielding structure and manufacturing method thereof |
| US10594020B2 (en) | 2017-07-19 | 2020-03-17 | Samsung Electronics Co., Ltd. | Electronic device having antenna element and method for manufacturing the same |
| US10531599B2 (en) | 2017-09-08 | 2020-01-07 | Samsung Electronics Co., Ltd. | Electromagnetic interference shielding structure |
| US11056441B2 (en) | 2019-12-05 | 2021-07-06 | Apple Inc. | Electromagnetic shielding of compact electronic modules |
| CN115226303A (en) * | 2021-04-16 | 2022-10-21 | 庆鼎精密电子（淮安）有限公司 | Manufacturing method of packaging structure with electromagnetic shielding effect |
| WO2022231586A1 (en) * | 2021-04-28 | 2022-11-03 | John Victor Fontaine | Electromagnetic pulse shield assembly and enclosure for protecting electrical equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20050029389A (en) | 2005-03-28 |
| KR100618085B1 (en) | 2006-08-29 |
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