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WO2003104528A1 - Tin-plated steel plate and method for production thereof - Google Patents

Tin-plated steel plate and method for production thereof Download PDF

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Publication number
WO2003104528A1
WO2003104528A1 PCT/JP2003/006983 JP0306983W WO03104528A1 WO 2003104528 A1 WO2003104528 A1 WO 2003104528A1 JP 0306983 W JP0306983 W JP 0306983W WO 03104528 A1 WO03104528 A1 WO 03104528A1
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WO
WIPO (PCT)
Prior art keywords
tin
steel sheet
chemical conversion
plated steel
plating layer
Prior art date
Application number
PCT/JP2003/006983
Other languages
French (fr)
Japanese (ja)
Inventor
中小路 尚匡
重国 智文
田中 匠
Original Assignee
Jfeスチール株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jfeスチール株式会社 filed Critical Jfeスチール株式会社
Priority to EP03733259.0A priority Critical patent/EP1518944B1/en
Publication of WO2003104528A1 publication Critical patent/WO2003104528A1/en

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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C23C28/34Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
    • C23C28/345Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one oxide layer
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/04Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the coating material
    • C23C2/08Tin or alloys based thereon
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/06Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
    • C23C22/07Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 containing phosphates
    • C23C22/08Orthophosphates
    • C23C22/10Orthophosphates containing oxidants
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C23C28/32Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
    • C23C28/321Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer with at least one metal alloy layer
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48After-treatment of electroplated surfaces
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2222/00Aspects relating to chemical surface treatment of metallic material by reaction of the surface with a reactive medium
    • C23C2222/20Use of solutions containing silanes

Definitions

  • Tin-plated steel sheet and its manufacturing method Tin-plated steel sheet and its manufacturing method
  • the present invention relates to a tin-plated steel sheet and a method for producing the same.
  • the present invention relates to a tin-plated steel sheet requiring solderability and a method for producing the same.
  • a steel sheet for soldering that does not use Pb is disclosed in, for example, Japanese Patent Publication No. 6-999837 and Japanese Patent Publication No. 6-3334666.
  • a film mainly composed of Sn-Zn, Zn_Ni, Sn-Ni and Fe-Ni is formed on a steel sheet, and a chromate film is formed on the film.
  • Japanese Patent Application Laid-Open No. 2001-32085 discloses a surface-treated steel sheet having a post-treatment film containing Si, which does not contain Cr on the surface of Sn or Sn alloy, and includes a steel sheet and a Sn plating layer.
  • a post-treatment film containing Si which does not contain Cr on the surface of Sn or Sn alloy
  • includes a steel sheet and a Sn plating layer since it does not have an Fe_Sn alloy layer, the adhesion between the steel sheet and the Sn plating layer was poor, and there was also a problem with the Pb free solderability.
  • 55-24516 discloses a technique in which a tin-plated steel sheet is used as a cathode in a phosphoric acid-based solution to perform DC electrolysis.
  • a surface treatment method for a tin-plated steel sheet in which a conversion coating containing no Cr is formed on the tin-plated steel sheet is disclosed.
  • P or P is contained in the conversion coating.
  • an electroplating tinplate for a seamless can in which a conversion coating not containing Cr and containing A1 is applied to the surface of a tin plating layer.
  • An object of the present invention is to provide excellent wettability in Pb-free soldering, and excellent corrosion resistance and whisker property without using Pb and Cr, which are undesirable due to environmental problems.
  • An object of the present invention is to provide a tin-plated steel sheet.
  • the present invention provides a steel sheet having a surface roughness of 1.5 ⁇ or less in Ra, a Fe—Sn alloy layer formed on the steel sheet surface,
  • the present invention provides a tin-coated steel sheet having a coating rate of more than 99% and a coating weight of 5 to 20 g / m 2 formed on the layer.
  • the tin plating layer has a chemical conversion film containing P and Si as an upper layer. It said chemical conversion coating has a 0. 5 ⁇ 1 O mg P adhesion amount Zm 2, S i adhesion amount of 3 ⁇ 3 O mg Zm 2.
  • the surface roughness Ra is preferably 1 m or less.
  • the Fe—Sn alloy layer is an Fe—Sn alloy layer formed by a molten tin treatment.
  • the chemical conversion film is preferably a chemical conversion film formed using a chemical conversion treatment solution containing P and a silane coupling agent. It is desirable that the silane coupling agent has an epoxy group. Further, the present invention provides (a) a steel sheet provided with a tin-containing plating layer on both surfaces of the steel sheet, and (b) a steel sheet provided with the plating layer, comprising a phosphate ion and a silane coupling agent. (C) dipping or applying the chemical conversion treatment liquid, and heating and drying the steel sheet at 80 to 200 ° C.
  • the chemical conversion treatment solution preferably contains a surfactant.
  • Pb_Sn alloy solder contains 37% Pb and has a low melting point of 184 ° C.
  • Sn-3.5% Ag-0.75% Cu alloy solder which is the mainstream of Pb-free solder, has a high melting point of 219 ° C. Due to its high melting point, Pb-free solder has worse solderability than Pb-Sn alloy solder. For this reason, a steel sheet for soldering is required to have a higher soldering regeneration than before.
  • a chemical conversion film containing an appropriate amount of P and Si on the upper layer of the tin plating layer, preferably with a chemical conversion treatment solution containing P and a silane coupling agent, excellent results are obtained.
  • the wettability with Pb-free solder is obtained.
  • this chemical conversion film is an effective protective film and suppresses the deterioration over time, so that excellent wettability with Pb-free solder is ensured even after the accelerated deterioration test.
  • this chemical conversion coating can provide excellent corrosion resistance and hoist resistance.
  • the tin-plated steel sheet of the present invention has a coating rate of 9 through the Fe—Sn alloy layer formed by the molten tin treatment on the surface of the steel sheet having a surface roughness of 1.5 ⁇ or less in Ra.
  • the amount of P in the film is in the range of 0.5 to 10 mg / m 2
  • the amount of Si in the film is in the range of 3 to 30 mg / m 2 .
  • the ratio (mass ratio) of SiZP in the chemical conversion film is preferably in the range of 5 to 30.
  • the tin-plated steel sheet is subjected to Sn plating on the steel sheet by a known electro-tin plating method, and then melted once by a molten tin treatment (reflow treatment) to form an Fe—Sn alloy layer at an interface with the steel sheet.
  • a molten tin treatment reflow treatment
  • the adhesion amount of the metal Sn layer after the formation of the Fe—Sn alloy layer is 5.0 to 20.0 g Zm 2 .
  • the silane coupling agent has an epoxy group.
  • the tin-plated steel sheet according to the present invention has a tin-plated layer formed on the surface of a steel sheet having a surface roughness of 1 & 1.5 m or less through an Fe—Sn alloy layer formed by a molten tin treatment.
  • This tin-plated layer is formed so as to cover almost the entire surface of the base, specifically, so as to have a coverage of more than 99%. If the tin plating layer covers the Fe—Sn alloy layer, that is, if the coverage in the surface area is less than 99%, not only sufficient solderability is not obtained, but also corrosion resistance becomes insufficient. is there.
  • the steel sheet is heated to a temperature equal to or higher than the melting point of Sn, and a molten tin treatment (also referred to as a riff opening one treatment) for temporarily melting the Sn plating is performed.
  • a molten tin treatment also referred to as a riff opening one treatment
  • Electrodeposited stress is present in the Sn layer that has been electroplated, and needle-like crystals called whiskers grow from the Sn surface by the energy to release the electrodeposited stress.
  • the growth of the whiskers causes a short circuit in the electrical circuit, so it is required that the whiskers do not grow.
  • the tin melting treatment is essential in the present invention.
  • the electroplated Sn becomes a molten state and becomes fluid, so that it flows into the concave portions of the steel sheet with roughness, and the Sn amount is large in the concave portions and the Sn amount is small in the convex portions.
  • the corrosion resistance is inferior in the steel plate roughness convex portion due to the decrease of the Sn content, and it is likely to be a starting point of the generation of heat. This tendency is more remarkable as the steel plate roughness increases.
  • the steel plate roughness is 1.5 ⁇ m in center line average roughness (R a). It has been newly found that the corrosion resistance deterioration at the convexity of the roughness does not become a problem if it is made as follows. Therefore, the roughness of the steel sheet should be less than 1.5 ⁇ at Ra.
  • the Fe—Sn alloy layer is formed at the interface between the steel sheet and the Sn layer by the molten tin treatment.
  • This Fe—Sn alloy layer improves the adhesion between the steel sheet and the tin-plated layer, prevents the Sn layer from peeling off during processing, and forms a bond between the steel sheet and the solder when the Sn layer dissolves in the solder bath during soldering. It is extremely important to ensure wettability. Therefore, in the present invention, it is essential that the Fe—Sn alloy layer is interposed between the steel sheet and the Sn layer. In order to exhibit the above effects, it is preferable that the amount of the Fe-Sn layer to be formed is 0.05 g / m 2 or more in terms of the adhesion amount.
  • the Fe-Sn alloy layer is 1 g Zm 2 or less. And more preferably 0.7 gZm 2 or less.
  • Ni-based pretreatment such as Ni flash plating treatment or Ni diffusion treatment
  • the amount of alloy formed during the molten tin treatment is suppressed, so that these Ni pretreatments can be used as appropriate.
  • the adhesion amount of the unalloyed tin plating layer after the molten tin treatment is preferably 5 to 20.0 g / m 2 . That's adhesion amount is less than 5. O gZm 2 of the tin plated layer, not only can not be obtained wettability with sufficient Pb pretended one solder, corrosion resistance is inadequate. On the other hand, if it exceeds 20.0 g / m 2 , the solder wettability and the corrosion resistance performance are sufficient, but the cost increases, which is not preferable.
  • the amount of Sn adhesion can be measured by a coulometric method or surface analysis using fluorescent X-rays.
  • the main feature of the constitution of the present invention is that a chemical conversion film containing P and Si is preferably formed on the tin plating layer by using a chemical conversion treatment solution containing P and a silane coupling agent. and is to the P and Si deposition amount of each 0.5 5 10. scope of OmgZm 2 and 3 to 30 mg Zm 2 in said chemical conversion coating.
  • P content is required to be in to 0.5 to 1 of 0. OmgZm 2 range that deposition amount. If it is less than 0.5 mg / m 2 , the conversion coating is insufficiently coated, and over time, Sn oxide grows on the Sn surface and solder wettability deteriorates. If it exceeds 1 0. OmgZm 2, because the solder wettability contact is inhibition of solder and Sn layer is poor. The amount of P attached was measured by surface analysis using fluorescent X-rays.
  • the Si content in the chemical conversion coat to be in the range of 3 to 3 Omg / m 2 and its adhesion amount
  • the molten tin treatment is essential as described above.
  • the electroplated Sn becomes a molten state and becomes fluid, flows into the recesses of the steel plate roughness which is the plating base plate, and the Sn amount increases in the recesses and the Sn amount increases in the protrusions. Is reduced.
  • the surface roughness is large, the surface area of the mother plate becomes larger than when the roughness is small. For this reason, in order to obtain sufficient solder wettability and corrosion resistance, the amount of Si in the chemical conversion film is required to sufficiently cover the protrusions with a small amount of Sn.
  • R a generally 0. 1 ⁇ 5.
  • Si content in the chemical conversion coating film is 3 Om g / m 2 or more
  • Si content in the chemical conversion coating film is 3 Om g / m 2 or more
  • a smaller amount of Si is more economically advantageous, so a smaller amount of Si is preferable. If the surface roughness Ra of the steel plate as the plating base plate is small, the surface area of the steel plate is small and the amount of Sn in the convex part can be increased, so that the Sn surface can be coated even if the amount of Si in the conversion coating is smaller, Sufficient solder wettability and corrosion resistance can be secured.
  • the present inventors have found that even when the attached amount of Si in the chemical conversion coating film is less than 3 Omg / m 2, 'the surface roughness of the steel sheet is plated base plate by controlling the surface roughness of the plating base plate It has been found that by setting the degree of Ra to 1.5 ⁇ m or less, sufficient solder wettability and corrosion resistance can be obtained.
  • the surface roughness of the steel sheet can be adjusted by, for example, controlling the roughness of the temper rolling roll in temper rolling performed when manufacturing a plated mother plate. That is, as described above, when the amount of Si in the chemical conversion film is small, it is necessary to reduce the surface roughness of the plating base plate.
  • the surface roughness of the steel sheet is plated base plate Ra less than 1.5 ⁇ It is necessary to. Further, even when the adhesion amount of Si in the chemical conversion coating film with 3 Omg / m 2 or less, the adhesion amount of Sn plating, from the viewpoint of stability of 5 g / m 2 or more and them if it forces the corrosion resistance as described above Is more preferably 7.5 g / m 2 or more, even more preferably 10 g / m 2 or more.
  • the adhesion amount of Si to be contained in the chemical conversion coating even if the surface roughness Ra of the steel sheet is plated base plate 1. below 5 m is less than 3m g / m 2, coating of the chemical conversion film is not adequate and, now solder wettability oxidized Sn is grown in Sn surface is poor over time, and to degrade corrosion resistance, it is necessary to be 3 mg / m 2 or more. Also, if the steel sheet surface roughness Ra is because with the mother board is less than 1.
  • the amount of Si contained in the chemical conversion film should be 3 Omg / m 2 or less in consideration of economy.
  • the measurement of the Si adhesion amount was performed by surface analysis using fluorescent X-rays.
  • the Si contained in the chemical conversion film is preferably contained by the silane coupling agent contained in the chemical conversion treatment solution.
  • the general chemical formula of the silane coupling agent is X-Si-OR 2 . r3 (OR: alkoxy group).
  • Silane coupling agents form alkoxysilyl groups (Si-ORs) that are hydrolyzed by water to form silanol groups, which adhere to the OH groups on the metal surface by a dehydration condensation reaction to form a strong film. .
  • silane coupling agent examples include 3-methallyl xypropynoletrimethoxysilane, 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, N-2- (Aminoethyl) 3-Aminopropyl trimethoxysilane, N-2 (Aminoethyl) 3-Aminopropylmethyldimethoxysilane, 3-Aminopropyltriethoxysilane, ⁇ -Feninole-3-Aminopropyltrimethoxysilane, 3-Mercaptopropylmethyl Toxoxysilane, 3-chloro mouth propyl trimethoxy silane, vinyl triethoxy silane, Burtris (2-methoxy ethoxy) silane, presence of an amino group, ⁇ -2 (aminoethyl) 3-amino propyl trimethoxy silane, presence of
  • X-Si-OR 2 in the general formula of the silane coupling agent.
  • X-Si-OR 2 in the general formula of the silane coupling agent.
  • the source of P in the chemical conversion treatment solution is ion phosphate
  • metal salts such as phosphoric acid, sodium phosphate, aluminum phosphate, potassium phosphate, and the like, and Z or monohydrogen phosphate at a conversion of 1 to 80 g / l. .
  • the silane coupling agent As a source of Si, it is preferable to use a chemical conversion treatment solution containing the above-described silane coupling agent, but in such a case, if the pH in the chemical conversion treatment solution is adjusted to a range of 1.5 to 5.5, the silane coupling agent may be used.
  • the agent can be uniformly dissolved in the chemical treatment solution.
  • the chemical conversion treatment liquid, Sn, Fe, Ni metal salts can be appropriately added metal salts such as SnCl 2, FeCl 2, NiCl 2 , SnS0 4, FeS0 4, NiS0 4.
  • an oxidizing agent such as sodium chlorate or nitrite, or an etching agent such as fluorine ion may be appropriately added as a promoter.
  • a surfactant such as sodium lauryl sulfate or acetylene glycol may be appropriately added for the purpose of improving the uniformity of the chemical conversion treatment solution.
  • the formation of a chemical conversion film using a phosphoric acid-based chemical conversion treatment may be performed by applying or dipping the above-mentioned chemical conversion treatment solution to a steel sheet and then drying it.
  • the chemical conversion solution contains 1 to 80 g / l of phosphoric acid in terms of phosphate ions, 0.001 to 10 g / l in terms of tin ions, stannous salt, and 0.1 to 1.0 g / l of sodium chlorate.
  • the conditions for the chemical conversion treatment are preferably such that the temperature is 40 to 80 ° C and the treatment (immersion) time is 1 to 5 seconds.
  • the tin-plated steel sheet immersed in the chemical conversion solution is dried at 80 to 150 ° C, then washed with water and dried with warm air.
  • a conversion coating was formed under the conversion treatment conditions shown in Table 1 on a tin-plated steel sheet on which a tin plating layer with an adhesion amount of was formed.
  • Table 2 shows the composition of the chemical conversion film formed at this time.
  • a tin-plated steel sheet in which at least one of the intermediate layer, the tin-plated layer, and the conversion coating is out of the proper range of the present invention was also manufactured.
  • the surface roughness Ra of the cold-rolled steel sheet as the plated mother plate used in the above-described present invention examples and comparative examples is the center line average roughness measured by “Surfcom 500 A” manufactured by Tokyo Seimitsu Co., Ltd.
  • the amount of Sn in the tin plating layer and the amount of P and Si contained in the chemical conversion film were measured by X-ray fluorescence.
  • the Sn coverage was measured by surface observation using a scanning electron microscope (10-field observation at a magnification of 50,000). table 1
  • the tin-plated steel sheets of Examples and Comparative Examples were evaluated for Pb-free solder wettability, corrosion resistance, and resistance to hoisting force.
  • solder As P free solder, Sn-3.5% Ag-0.75% Cu solder made by Senju Metal was used. The solder temperature was set to 245 ° C, and the zero-crossing time until the solder was wet was measured by the equilibrium method using a SAT-5100J device manufactured by Les Riki to evaluate the solder wettability. Using a 0.6 mm sample, the sample was exposed to a test tank at a temperature of 105 ° C and a humidity of 100% RH at a pressure of 1.22xl0 5 Pa for 8 hours to accelerate and degrade, and then evaluated. mm / sec, immersion depth: 3 mm Zero crossing time was 3 seconds or less.
  • tin-based plated steel sheet used in the present invention has a plated layer containing tin on one or both sides of the steel sheet.
  • the tin-containing plating layer include Sn, an alloy layer containing one or more selected from Ni, Fe, Zn, Bi, and Cu, or a metal tin layer, and the metal tin layer.
  • Examples include a plating layer formed between a steel sheet and an intermediate layer of a tin alloy layer containing one or two selected from the group consisting of Fe and iron, and the like, but are not particularly limited. Absent.
  • the present invention also includes a case where the intermediate layer includes two layers: a Fe—Ni alloy layer and a Fe—Sn—Ni alloy layer formed on the upper surface of the Fe—Ni alloy layer.
  • the Fe / Ni alloy layer preferably has a Ni / (Fe + Ni) mass ratio in the range of 0.02 to 0.50. If the mass ratio of NiZ (Fe + Ni) is less than 0.02, it is composed of quadrangular prism-shaped crystals mainly composed of Fe--Sn alloy, which has many gaps and lowers the corrosion resistance.In addition, it is difficult to form a silane film continuously. This is because the effect of improving paint adhesion is small.
  • the present invention also includes a steel plate and a tin-containing plating layer which are appropriately plated with a base such as nickel plating.
  • a phosphoric acid-based chemical conversion treatment As a method of forming a chemical conversion film containing P and Si, for example, it is preferable to carry out a phosphoric acid-based chemical conversion treatment.
  • a supply source of P in the chemical conversion treatment solution It is possible to use 1 to 80 g / l of phosphoric acid, metal salts such as sodium phosphate, aluminum phosphate, potassium phosphate, etc. in terms of ion phosphate, and Z or monohydrogen phosphate. More preferred.
  • a silane coupling agent is used as a source of Si.
  • the general formula for a silane coupling agent is X—Si—OR 2 .
  • r 3 (OR: alkoxy group), where an alkoxysilyl group (Si—OR) is hydrolyzed by water to form a silanol group, which adheres to the OH group on the metal surface by a dehydration condensation reaction.
  • the pH of the chemical conversion solution is preferably in the range of 1.5 to 5.5. That is, by adjusting the pH of the chemical conversion treatment solution to a range of 1.5 to 5.5, the silane coupling agent can be uniformly dissolved in the chemical conversion treatment solution.
  • silane coupling agents include 3-methacryloxypropyltrimethoxysilane, 2- (3,4-epoxycyclohexyl) ethy ⁇ trimethoxysilane, 3-glycidoxypropyltrimethoxysilane, N-2 -(Aminoethyl) 3-aminopropinoletrimethoxysilane, N-2 (aminoethyl) 3-aminopropylmethyldimethoxysilane, 3-aminopropyltriethoxysilane, N-phenyl-3-aminopropyltrime Toxoxysilane, 3-mercaptopropyl methoxysilane, 3-chloropropynoletrimethoxysilane, butyltriethoxysilane, vinylinotris (2-methoxyethoxy) silane, presence of amino group, N-2 (aminoethyl) 3-aminopropyl Todimethoxysilane, N-2
  • propyl tri-ethoxy silane but can be used, X-Si-OR 2 in particular in General I numerology type silane cutlet coupling agents.
  • the chemical conversion treatment liquid, Sn, Fe, Ni metal salts for example, can be appropriately added metal salts such as SnCl 2, FeCl 2, NiCl 2 , SnS0 4, FeS0 4, NiS0 4.
  • an oxidizing agent such as sodium chlorate and nitrite and an etching agent such as fluorine ion may be appropriately added.
  • a surfactant such as sodium lauryl sulfate or acetylendalcol for the purpose of improving the uniformity of the chemical conversion treatment solution.
  • the tin-plated steel sheet is immersed in the above-mentioned chemical conversion treatment solution at 40 to 80 ° C for 1 to 5 seconds, squeezed with a roll or the like to form a film of the chemical conversion treatment solution with an appropriate thickness, and then subjected to the chemical conversion treatment.
  • the steel sheet is heated to 80 to 200 ° C and dried while the liquid is present on the steel sheet.
  • the hydrolyzed silanol group of the alkoxysilyl group (Si-OR) and the OH group on the metal surface promote the dehydration condensation reaction, so that the formation of the chemically converted skin film is performed stably. is there. Since the dehydration condensation reaction is slow only by immersion treatment, it is difficult to obtain an amount of Si in the film of 5 mg Zm 2 or more.
  • Heating must be carried out while the chemical treatment liquid is present on the steel sheet. Therefore, the heating method that blows hot air, which is usually performed industrially, is not preferable, and infrared heating, induction heating, and radiation heating Is preferred.
  • the heating temperature must be 80-200 ° C as the steel sheet temperature. If the temperature is lower than 80 ° C, the rate of the dehydration / condensation reaction is low, the formation of the chemical conversion film becomes unstable, and a sufficient amount of Si cannot be obtained. Although it proceeds, it is not preferable because not only oxidation of tin on the tin-based plating surface occurs, but also heating energy is excessively consumed. '
  • the film of the chemical conversion treatment solution is formed on the plating layer by a method of applying the chemical conversion treatment solution using a roll coater that can easily control the thickness of the solution on the steel sheet, instead of performing the above-described immersion treatment. You may go.
  • a heat melting (reflow) treatment is performed at a temperature higher than the melting point of tin (231.9 ° C), and the Fe-Sn alloy layer (intermediate layer) and the metallic Sn layer (upper layer) are treated.
  • a tin-based plating layer consisting of two layers is formed, followed by chemical conversion by immersion.
  • the cathode treatment of 1 C / dm 2 may be performed in a 15 g / l aqueous solution of sodium carbonate.
  • the chemical conversion solution contains 1 to 80 g / l of phosphoric acid in terms of phosphate ion, 0.001 to in terms of tin ion: L0 g / 1 stannous chloride, and 0.1 to: LO g / 1 sodium chlorate. Further, an aqueous solution to which 0.5 to 20.0 mass% of a silane coupling agent is added is used.
  • the conditions for the chemical conversion treatment are preferably such that the temperature is 40 to 80 ° C and the treatment (immersion) time is 1 to 5 seconds.
  • the tin-plated steel sheet is squeezed with a ringer roll to control the film of the chemical conversion treatment liquid to a predetermined thickness, heated to 110 ° C by an infrared heating device, dried, and immediately washed with water. And dry with warm air at 35-90 ° C.
  • tin-plated steel sheets were produced by a production method in which the method of forming the chemical conversion coating was out of the proper range of the present invention.

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Abstract

A tin-plated steel plate which comprises a steel plate having a surface roughness of 1.5 μm or less in terms of Ra, a Fe-Sn alloy layer formed on the surface of the steel plate, a tin plating layer having a coating percentage of more than 99 % and a plated amount of 5 to 20 g/m2 formed on the Fe-Sn alloy layer, and a chemical coating film containing P and Si formed on the tin plating layer, wherein the chemical coating film has an attached amount for P of 0.5 to 10 mg/m2 and that for Si of 3 to 30 mg/m2; and a method for producing the tin-plated steel plate which comprises immersing a steel plate having the plating layer provided thereon in a chemical treatment fluid containing a phosphorus ion and a silane coupling agent or applying the chemical treatment fluid on the steel plate having the plating layer provided thereon, and then heating the resulting steel plate for drying.

Description

錫めつき鋼板及ぴその製造方法 技術分野 Tin-plated steel sheet and its manufacturing method
本発明は、錫めつき鋼板及ぴその製造方法に関する。 特に、 本発明は、半田付 け性を要求される錫めつき鋼板及びその製造方法に関する。 背景技術  The present invention relates to a tin-plated steel sheet and a method for producing the same. In particular, the present invention relates to a tin-plated steel sheet requiring solderability and a method for producing the same. Background art
従来、オーディオ製品やパソコン等の家電製品においては、 Pb— Sn合金半田 を用いた接合が行われてきた。 しかし、 この半田中の Pbが人体に有害であるこ とから Pbの使用が規制され、 Pbを使わない Pbフリー半田に切り替えられてき ている。 家電製品のシャーシーや部品ケースには、 従来の Pb—Sn半田付け性 に適した Pb— Sn合金めつき鋼板が使われていたが、 Pb使用規制に対応するた め Pbを使用せずに Pbフリー半田付け性に優れる新たな鋼板が求められている。 さらに、 従来の Pb— Sn合金めつき鋼板には、 表面にクロメート処理がなさ れているが、 家電業界では有害な 6価 Crを使用しない方向にあり、新たな半田 付け用の鋼板にはクロメート処理を使用しないことが求められている。  Conventionally, bonding using Pb—Sn alloy solder has been performed for home appliances such as audio products and personal computers. However, since Pb in the solder is harmful to the human body, the use of Pb has been regulated, and Pb-free soldering without Pb has been replaced. Conventionally, Pb-Sn alloy-plated steel sheets suitable for Pb-Sn solderability were used for chassis and component cases of home appliances, but in order to comply with Pb usage regulations, Pb was not used. There is a need for a new steel sheet having excellent free solderability. Furthermore, although the surface of conventional Pb-Sn alloy-plated steel sheets has been subjected to chromate treatment, there is a tendency in the consumer electronics industry to not use harmful hexavalent Cr, and new steel sheets for soldering have a chromate treatment. It is required that no processing be used.
Pbを使わない半田付け用の鋼板は、 例えば、 特公平 6 _ 9 9 8 3 7号公報お ょぴ特公平 6— 3 3 4 6 6号公報に、 開示されている。 鋼板上に Sn— Zn、 Zn _Ni、 Sn—Ni、 Fe— Niを主体とする皮膜が形成され、 その皮膜上にクロメー ト皮膜が形成されている。  A steel sheet for soldering that does not use Pb is disclosed in, for example, Japanese Patent Publication No. 6-999837 and Japanese Patent Publication No. 6-3334666. A film mainly composed of Sn-Zn, Zn_Ni, Sn-Ni and Fe-Ni is formed on a steel sheet, and a chromate film is formed on the film.
しかしながら、 前記公報に記載された鋼板はいずれも、 Znを使用しているた めに Pbフリ一半田付け性に劣り、またクロメート皮膜を有するために家電業界 には受け入れられないものである。  However, all of the steel sheets described in the above publication are inferior in Pb-free solderability because of using Zn, and are unacceptable to the home appliance industry because of having a chromate film.
また、 特開 2001-32085には Sn、 Sn合金めつきの表面に Crを含有せず、 Si を含有する後処理皮膜を有する表面処理鋼板が開示されている力 鋼板と Snめ つき層との間に Fe_Sn合金層を有するものではないため鋼板と Snめっき層と の密着性が悪く、 また Pbフリ一半田付け性にも問題があった。 缶用錫めつき鋼板のクロメート処理に代わる化成処理に関する技術としては、 例えば、 特公昭 55— 24516号公報に、 りん酸系溶液中で錫めつき鋼板を陰極と して直流電解することにより、錫めつき鋼板上に Crを含有しない化成皮膜を形 成した錫めつき鋼板の表面処理法が開示されており、 また、 特公平 1-32308号 公報には、 化成皮膜中に Pもしくは Pと A1を含有させて、 Crを含有しない化 成皮膜を錫めつき層表面に施したシームレス缶用電気めつきぶりきが開示され ている。 Also, Japanese Patent Application Laid-Open No. 2001-32085 discloses a surface-treated steel sheet having a post-treatment film containing Si, which does not contain Cr on the surface of Sn or Sn alloy, and includes a steel sheet and a Sn plating layer. However, since it does not have an Fe_Sn alloy layer, the adhesion between the steel sheet and the Sn plating layer was poor, and there was also a problem with the Pb free solderability. As a technology related to chemical conversion treatment instead of chromate treatment for tin-plated steel sheets for cans, for example, Japanese Patent Publication No. 55-24516 discloses a technique in which a tin-plated steel sheet is used as a cathode in a phosphoric acid-based solution to perform DC electrolysis. A surface treatment method for a tin-plated steel sheet in which a conversion coating containing no Cr is formed on the tin-plated steel sheet is disclosed.In Japanese Patent Publication No. 1-32308, P or P is contained in the conversion coating. There is disclosed an electroplating tinplate for a seamless can in which a conversion coating not containing Cr and containing A1 is applied to the surface of a tin plating layer.
しかしながら、塗料密着性、耐食性などの性能を総合的に見た場合、前記公報に 記載された化成皮膜はいずれも、従来の重クロム酸やクロム酸を含有する溶液によつ て形成したクロメート皮膜に比べると上記性能が十分に得られているとはいえない。 発明の開示  However, from a comprehensive viewpoint of performance such as paint adhesion and corrosion resistance, all of the conversion coatings described in the above publications are conventional chromate coatings formed using dichromic acid or a solution containing chromic acid. It cannot be said that the above performance is sufficiently obtained. Disclosure of the invention
本発明の目的は、 環境上の問題から望ましくないとされる Pbおよぴ Crを使 用することなく、 Pbフリー半田付けにおける濡れ性に優れ、 さらに耐食性およ' びホイスカー性にも優れた錫めつき鋼板を提供することにある。  An object of the present invention is to provide excellent wettability in Pb-free soldering, and excellent corrosion resistance and whisker property without using Pb and Cr, which are undesirable due to environmental problems. An object of the present invention is to provide a tin-plated steel sheet.
上記'目的を達成するために、 本発明は、 R aで 1 . 5 πι以下の表面粗度を 有する鋼板と、該鋼板表面上に形成された Fe—Sn合金層と、該 Fe— Sn合金層 上に形成された、 被覆率が 9 9 %超え、 付着量が 5〜2 0 g /m2の錫めつき層 と, を有する錫めつき鋼板を提供する。 該錫めっき層は、 その上層に Pと S i を含有する化成皮膜を有する。 該化成皮膜は、 0 . 5〜1 O m g Zm2の P付着 量、 3〜3 O m g Zm2の S i付着量を有する。 In order to achieve the above-mentioned object, the present invention provides a steel sheet having a surface roughness of 1.5 πι or less in Ra, a Fe—Sn alloy layer formed on the steel sheet surface, The present invention provides a tin-coated steel sheet having a coating rate of more than 99% and a coating weight of 5 to 20 g / m 2 formed on the layer. The tin plating layer has a chemical conversion film containing P and Si as an upper layer. It said chemical conversion coating has a 0. 5~1 O mg P adhesion amount Zm 2, S i adhesion amount of 3~3 O mg Zm 2.
前記表面粗度は R aで 1 m以下であるのが好ましい。  The surface roughness Ra is preferably 1 m or less.
前記 Fe—Sn合金層が、溶錫処理によつて形成された Fe—Sn合金層であるの が好ましい。  It is preferable that the Fe—Sn alloy layer is an Fe—Sn alloy layer formed by a molten tin treatment.
前記化成皮膜は、 Pとシランカップリング剤を含有する化成処理液を用いて 形成された化成皮膜であるのが好ましい。 前記シランカップリング剤がェポキ シ基を有するのが望ましい。 さらに、 本発明は、 (a ) 鋼板の両面に錫を含むめっき層を設け、 (b ) め つき層が設けられた鋼板を、 りん酸イオンとシランカツプリング剤を含有する ィ匕成処理液に浸漬または該化成処理液を塗布し、 ( C ) 化成処理液が鋼板のめ つき層上に存在した状態で該鋼板を 80〜200°Cに加熱して乾燥させ、 (d ) 乾燥 した鋼板を水洗し、 (e ) 水洗後、 再度乾燥させる、 錫めつき鋼板の製造方法 を提供する。 The chemical conversion film is preferably a chemical conversion film formed using a chemical conversion treatment solution containing P and a silane coupling agent. It is desirable that the silane coupling agent has an epoxy group. Further, the present invention provides (a) a steel sheet provided with a tin-containing plating layer on both surfaces of the steel sheet, and (b) a steel sheet provided with the plating layer, comprising a phosphate ion and a silane coupling agent. (C) dipping or applying the chemical conversion treatment liquid, and heating and drying the steel sheet at 80 to 200 ° C. in a state where the chemical conversion treatment liquid is present on the plating layer of the steel sheet; d) A method for producing a tin-plated steel sheet, in which the dried steel sheet is washed with water, and (e) the washed steel sheet is washed and then dried again.
前記化成処理液は界面活性剤を含有するのが好ましい。 発明を実施するための形態  The chemical conversion treatment solution preferably contains a surfactant. BEST MODE FOR CARRYING OUT THE INVENTION
錫めつき鋼板 Tin-plated steel plate
Pb_Sn合金半田は、 3 7 %Pbを含有するもので融点が 1 8 4 °Cと低い。 し かし、 Pbフリ一半田の主流である Sn— 3.5%Ag— 0.75%Cu合金半田は融点が 2 1 9 °Cと高い。 融点が高いため、 Pbフリー半田は Pb— Sn合金半田に比べて 半田付け作業性が悪くなつている。 このため、 半田付け用の鋼板には従来以上 の半田付け†生が要求されている。  Pb_Sn alloy solder contains 37% Pb and has a low melting point of 184 ° C. However, Sn-3.5% Ag-0.75% Cu alloy solder, which is the mainstream of Pb-free solder, has a high melting point of 219 ° C. Due to its high melting point, Pb-free solder has worse solderability than Pb-Sn alloy solder. For this reason, a steel sheet for soldering is required to have a higher soldering regeneration than before.
また、 半田付け用鋼板には耐食性おょぴ耐ホイスカー性が要求される。 この ため、 発明者らは、 Pbフリー半田の主成分である Snを主体とする錫めつきを 元に、 上記課題を解決すべく鋭意研究を重ねた。 その結果、 尺&で1 . 5 μ πι 以下の表面粗度を有する鋼板上に溶錫処理によって形成された Fe— Sn合金層 を介して所定量の錫めつき層を有し、 その上層に、 Pと Siを含有した化成皮膜 を形成した場合には、 上記性能の全てを満足させることができることを見出し た。  In addition, steel sheets for soldering are required to have corrosion resistance and whisker resistance. For this reason, the inventors conducted intensive research to solve the above-mentioned problems based on tin plating mainly composed of Sn which is a main component of Pb-free solder. As a result, a predetermined amount of tin-plated layer was formed on a steel plate having a surface roughness of 1.5 μπι or less with a length of < ' > It has been found that when a chemical conversion film containing P and Si is formed, all of the above performances can be satisfied.
より具体的には、 錫めつき層の上層に、 好ましくは Pとシランカップリング 剤を含有する化成処理液により、 適正量の Pと Siを含有する化成皮膜を形成す ることによって、優れた Pbフリー半田との濡れ性が得られ、特にこの化成皮膜 が有効な保護皮膜として経時劣化を抑制するので加速劣化試験後においても優 れた Pbフリー半田との濡れ性が確保される。加えて、 この化成皮膜によって優 れた耐食性およぴ耐ホイス力一性が得られることも見出した。  More specifically, by forming a chemical conversion film containing an appropriate amount of P and Si on the upper layer of the tin plating layer, preferably with a chemical conversion treatment solution containing P and a silane coupling agent, excellent results are obtained. The wettability with Pb-free solder is obtained. In particular, this chemical conversion film is an effective protective film and suppresses the deterioration over time, so that excellent wettability with Pb-free solder is ensured even after the accelerated deterioration test. In addition, it has been found that this chemical conversion coating can provide excellent corrosion resistance and hoist resistance.
本発明の錫めつき鋼板は、 R aで 1 . 5 μ πι以下の表面粗度を有する鋼板表 面上に溶錫処理によつて形成された Fe— Sn合金層を介して被覆率が 9 9 %超 えとなる錫めつき層を有し、 該錫めっき層の上層に、 Pとシランカツプリング 剤を含有する化成処理液を用いて Pと Siを含有する化成皮膜を有し、 該化成皮 膜中の Pの付着量を 0 . 5〜 1 0 mg/m2、 Siの付着量を 3〜 3 0 mg/m2の範囲 とするものである。 なお、 化成皮膜中の SiZ Pの比 (質量比) は 5〜3 0の範 囲にすることが好ましい。 The tin-plated steel sheet of the present invention has a coating rate of 9 through the Fe—Sn alloy layer formed by the molten tin treatment on the surface of the steel sheet having a surface roughness of 1.5 μπι or less in Ra. A tin plating layer of more than 9%, and a chemical conversion film containing P and Si using a chemical conversion solution containing P and a silane coupling agent on the tin plating layer; leather The amount of P in the film is in the range of 0.5 to 10 mg / m 2 , and the amount of Si in the film is in the range of 3 to 30 mg / m 2 . The ratio (mass ratio) of SiZP in the chemical conversion film is preferably in the range of 5 to 30.
また、前記錫めつき鋼板は、鋼板上に公知の電気錫めつき法で Snめっきを施 した後、 溶錫処理 (リフロー処理) によって、 一旦溶融させて鋼板との界面に Fe—Sn合金層を中間層として形成させるが、 Fe— Sn合金層形成後の金属 Sn 層の付着量は 5 . 0〜2 0 . 0 g Zm2であることが好適である。 In addition, the tin-plated steel sheet is subjected to Sn plating on the steel sheet by a known electro-tin plating method, and then melted once by a molten tin treatment (reflow treatment) to form an Fe—Sn alloy layer at an interface with the steel sheet. Is formed as an intermediate layer, and it is preferable that the adhesion amount of the metal Sn layer after the formation of the Fe—Sn alloy layer is 5.0 to 20.0 g Zm 2 .
さらに、 前記シランカップリング剤は、 エポキシ基を有することがより好適 である。  Further, it is more preferable that the silane coupling agent has an epoxy group.
以下にこの発明の構成を詳細に説明する。  Hereinafter, the configuration of the present invention will be described in detail.
この発明の錫めつき鋼板は、 1 &で1 . 5 m以下の表面粗度を有する鋼板 表面上に溶錫処理によつて形成された Fe—Sn合金層を介して錫めつき層を形 成したものであり、 この錫めつき層は下地表面のほぼ全面を覆うように、 具体 的には被覆率が 9 9 %超えとなるように形成されたものである。 錫めつき層が Fe— Sn合金層を被覆する割合、すなわち表面積での被覆率が 9 9 %以下である と十分な半田付け性が得られないばかりでなく、 耐食性も不十分となるからで ある。  The tin-plated steel sheet according to the present invention has a tin-plated layer formed on the surface of a steel sheet having a surface roughness of 1 & 1.5 m or less through an Fe—Sn alloy layer formed by a molten tin treatment. This tin-plated layer is formed so as to cover almost the entire surface of the base, specifically, so as to have a coverage of more than 99%. If the tin plating layer covers the Fe—Sn alloy layer, that is, if the coverage in the surface area is less than 99%, not only sufficient solderability is not obtained, but also corrosion resistance becomes insufficient. is there.
本発明においては、鋼板上に公知の電気錫めっき法で Snめっきを行った後、 鋼板を Snの融点以上に加熱し、 一旦 Snめっきを溶融させる溶錫処理 (リフ口 一処理ともいう) を行う。 電気めつきされたままの Sn層には電着応力が存在し、 この電着応力を開放しようとするエネルギーによって Sn表面からホイスカー と称される針状結晶が成長する。 ホイスカーが成長すると電気回路での短絡事 故を引き起こすため、 ホイスカーの成長が無いことが要求される。 電気めつき された Sn層を一旦溶融すると、電着応力が開放されてホイスカーの発生がほと んど無くなる、 このため本発明では溶錫処理が必須である。  In the present invention, after performing Sn plating on a steel sheet by a known electrotin plating method, the steel sheet is heated to a temperature equal to or higher than the melting point of Sn, and a molten tin treatment (also referred to as a riff opening one treatment) for temporarily melting the Sn plating is performed. Do. Electrodeposited stress is present in the Sn layer that has been electroplated, and needle-like crystals called whiskers grow from the Sn surface by the energy to release the electrodeposited stress. The growth of the whiskers causes a short circuit in the electrical circuit, so it is required that the whiskers do not grow. Once the electroplated Sn layer is melted, the electrodeposition stress is released, and whiskers are almost eliminated. Therefore, the tin melting treatment is essential in the present invention.
溶錫処理時には、電気めつきされた Snが溶融状態となり流動性となることか ら、 鋼板粗度凹凸の凹部に流れ込み、 凹部で Sn量が多く、 凸部で Sn量が少な くなる。 このため、鋼板粗度凸部では Sn量が薄くなる分耐食性が劣り、 鲭発生 の起点となりやすい。 この傾向は鋼板粗度が大きいほど顕著であり、 本発明者 らは本願の Sn付着量の場合、鋼板粗度を中心線平均粗さ (R a ) で 1 . 5 μ m 以下にすれば粗度凸部での耐食性劣化が問題とならないことを新規に見出した。 したがって、 鋼板粗度は R aで 1. 5 ιη以下とする。 At the time of the molten tin treatment, the electroplated Sn becomes a molten state and becomes fluid, so that it flows into the concave portions of the steel sheet with roughness, and the Sn amount is large in the concave portions and the Sn amount is small in the convex portions. For this reason, the corrosion resistance is inferior in the steel plate roughness convex portion due to the decrease of the Sn content, and it is likely to be a starting point of the generation of heat. This tendency is more remarkable as the steel plate roughness increases. In the case of the Sn adhesion amount according to the present invention, the present inventors assume that the steel plate roughness is 1.5 μm in center line average roughness (R a). It has been newly found that the corrosion resistance deterioration at the convexity of the roughness does not become a problem if it is made as follows. Therefore, the roughness of the steel sheet should be less than 1.5 ιη at Ra.
溶錫処理によって鋼板と Sn層との界面に Fe— Sn合金層が形成される。 この Fe— Sn合金層は鋼板と錫めつき層の密着を向上させて、 加工時の Sn層の剥離 を防止するとともに、半田付け時に Sn層が半田浴に溶解した際の鋼板と半田と の濡れ性を確保するので極めて重要である。 したがつて本願発明では鋼板と Sn 層との間を Fe-Sn合金層が介していることが必須である。 上記効果を発揮する ためには、 Fe-Sn層の生成量は付着量にして 0.05 g/m2以上とすることが好ま しい。 この合金層は錫めつき層に比べ硬レ、合金層であるため加工性を低下させ るので、 なるべく合金性生成量を抑えることが必要で、 Fe— Sn合金層は、 1 g Zm2以下が好ましく、 0. 7 gZm2以下とすることがより好ましい。 The Fe—Sn alloy layer is formed at the interface between the steel sheet and the Sn layer by the molten tin treatment. This Fe—Sn alloy layer improves the adhesion between the steel sheet and the tin-plated layer, prevents the Sn layer from peeling off during processing, and forms a bond between the steel sheet and the solder when the Sn layer dissolves in the solder bath during soldering. It is extremely important to ensure wettability. Therefore, in the present invention, it is essential that the Fe—Sn alloy layer is interposed between the steel sheet and the Sn layer. In order to exhibit the above effects, it is preferable that the amount of the Fe-Sn layer to be formed is 0.05 g / m 2 or more in terms of the adhesion amount. Since this alloy layer is harder and more alloyed than the tin-plated layer, it reduces the workability because it is an alloy layer. Therefore, it is necessary to minimize the amount of alloying generated. The Fe-Sn alloy layer is 1 g Zm 2 or less. And more preferably 0.7 gZm 2 or less.
Niフラッシュめっき処理や Ni拡散処理など Ni系の前処理を行つた鋼板を用 レヽると、溶錫処理時に形成される合金量が抑制されるので、 これら Ni前処理は 適宜用いることができる。  When a steel sheet that has been subjected to Ni-based pretreatment such as Ni flash plating treatment or Ni diffusion treatment is used, the amount of alloy formed during the molten tin treatment is suppressed, so that these Ni pretreatments can be used as appropriate.
溶錫処理後の合金化していない錫めつき層の付着量は、 5〜20. 0 g/m2 であることが好ましい。 前記錫めつき層の付着量が 5. O gZm2未満だと、 十 分な Pbフリ一半田との濡れ性が得られないばかりでなく、耐食性も不十分であ る。 また、 20. 0 g/m2超えだと、 半田濡れ性および耐食性の性能は十分で あるがコスト高になるので好ましくないからである。 なお、 Sn付着量は、 電量 法または蛍光 X線による表面分析により測定できる。 The adhesion amount of the unalloyed tin plating layer after the molten tin treatment is preferably 5 to 20.0 g / m 2 . That's adhesion amount is less than 5. O gZm 2 of the tin plated layer, not only can not be obtained wettability with sufficient Pb pretended one solder, corrosion resistance is inadequate. On the other hand, if it exceeds 20.0 g / m 2 , the solder wettability and the corrosion resistance performance are sufficient, but the cost increases, which is not preferable. The amount of Sn adhesion can be measured by a coulometric method or surface analysis using fluorescent X-rays.
そして、 この発明の構成上の主な特徴は、 該錫めっき層の上層に、 好ましく は Pとシランカップリング剤を含有する化成処理液を用いて、 Pと Siを含有す る化成皮膜を有し、 該化成皮膜中の Pおよび Siの付着量をそれぞれ 0. 5〜 10. OmgZm2および 3〜30 m g Zm2の範囲とすることにある。 The main feature of the constitution of the present invention is that a chemical conversion film containing P and Si is preferably formed on the tin plating layer by using a chemical conversion treatment solution containing P and a silane coupling agent. and is to the P and Si deposition amount of each 0.5 5 10. scope of OmgZm 2 and 3 to 30 mg Zm 2 in said chemical conversion coating.
(1) 化成皮膜中の P含有量をその付着量にして 0. 5〜10. OmgZm2の 範囲とすること (1) 0.5 to 10 and the P content in the chemical conversion coat to the deposition amount. In the range of OmgZm 2
りん酸塩として S n表面を覆い、 Snと S i化合物間のバインダーとして働 き化成皮膜を形成する。 このバインダー効果は鋼板表面の構造による影響を受 けにくく、 表面粗度の大小による変化が小さく、 表面粗度によらず化成皮膜中 の P含有量は、 その付着量にして 0. 5〜1 0. OmgZm2の範囲とすること が必要である。 0. 5mg/m2未満では、 化成皮膜の被覆が不十分であり時 間の経過とともに Sn表面で酸化 Snが成長して半田濡れ性が劣ィ匕する。 また、 1 0. OmgZm2を超えると、 半田と Sn層の接触が阻害されて半田濡れ性が 劣るからである。 なお、 P付着量の測定は、 蛍光 X線による表面分析により行 つた。 It covers the Sn surface as phosphate and acts as a binder between Sn and Si compounds to form a chemical conversion film. This binder effect is not easily affected by the structure of the steel sheet surface, has little change depending on the surface roughness, and is not affected by the surface roughness. P content is required to be in to 0.5 to 1 of 0. OmgZm 2 range that deposition amount. If it is less than 0.5 mg / m 2 , the conversion coating is insufficiently coated, and over time, Sn oxide grows on the Sn surface and solder wettability deteriorates. If it exceeds 1 0. OmgZm 2, because the solder wettability contact is inhibition of solder and Sn layer is poor. The amount of P attached was measured by surface analysis using fluorescent X-rays.
(2)化成皮膜中の Si含有量をその付着量にして 3〜3 Omg/m2の範囲とする こと (2) The Si content in the chemical conversion coat to be in the range of 3 to 3 Omg / m 2 and its adhesion amount
本発明では前述のように溶錫処理を必須としている。 溶錫処理時には、 電気 めっきされた Snが溶融状態となって流動性を有するようになり、 めっき母板で ある鋼板粗度の凹部に流れ込み、 凹部で Sn量が多くなるとともに凸部で Sn量 が少なくなる。 また、 表面粗度が大きな場合、 粗度が小さい場合にくらべてめ つき母板の表面積も大きくなる。 このため十分な半田濡れ性、 耐食性を得るに は Sn量が少ない凸部を十分被覆するだけの化成皮膜中の S i量が必要となる。 工業的に生産される鋼板 (めっき母板) の粗度範囲 (R aで概ね 0. 1 μπι〜 5. 0 μια) では、 化成皮膜中の Si含有量は 3 Omg/m 2以上であれば、 溶錫処 理行う本発明の場合でも、 十分な半田濡れ性、 耐食性を得ることができる。 一方、 Siの付着量は、 少ない方が経済的に有利であるため、 Siの付着量は少 ない方が好ましい。 めっき母板である鋼板の表面粗度 Raが小さいと、鋼板の表 面積は小さく凸部の Sn量を大きくできるため、 化成皮膜中の Si量がより少な くても' Sn表面を被覆でき、 十分な半田濡れ性、 耐食性を確保できる。本発明者 らは、 化成皮膜中の Siの付着量が 3 Omg/m2未満の場合であっても、'めっき 母板の表面粗度を制御してめつき母板である鋼板の表面粗度を Raで 1. 5 μ m 以下とすることにより、 十分な半田濡れ性、 耐食性を得ることができることを 見出した。 なお、 鋼板の表面粗度は、 例えばめつき母板を製造する際に行う調 質圧延において、 調質圧延口一ルの粗度制御により調整することができる。 すなわち、 前述のように、 化成皮膜中の Siの付着量が少ない場合、 めっき母 板の表面粗度を小さくすることが必要となる。 化成皮膜中の Siの付着量を 3〜 3 Omg/m2とした場合であっても、 良好な半田濡れ性や耐食性といった特性を 満足させるためには、 めっき母板である鋼板の表面粗度 Raを 1. 5 μπι以下と することが必要である。 また、 化成皮膜中の Siの付着量を 3 Omg/m2以下と する場合でも、 Snめっきの付着量は、 前述のように 5 g/m2以上とすればよい 力 耐食性の安定という観点からは、 より好ましくは 7. 5 g/m2以上、 さらに 好ましくは、 10 g/m2以上である。 In the present invention, the molten tin treatment is essential as described above. During the molten tin treatment, the electroplated Sn becomes a molten state and becomes fluid, flows into the recesses of the steel plate roughness which is the plating base plate, and the Sn amount increases in the recesses and the Sn amount increases in the protrusions. Is reduced. Also, when the surface roughness is large, the surface area of the mother plate becomes larger than when the roughness is small. For this reason, in order to obtain sufficient solder wettability and corrosion resistance, the amount of Si in the chemical conversion film is required to sufficiently cover the protrusions with a small amount of Sn. There (in R a generally 0. 1 μπι~ 5. 0 μια) roughness range of industrially produced by the steel sheet (plating base plate) In, Si content in the chemical conversion coating film is 3 Om g / m 2 or more For example, even in the case of the present invention in which the molten tin treatment is performed, sufficient solder wettability and corrosion resistance can be obtained. On the other hand, a smaller amount of Si is more economically advantageous, so a smaller amount of Si is preferable. If the surface roughness Ra of the steel plate as the plating base plate is small, the surface area of the steel plate is small and the amount of Sn in the convex part can be increased, so that the Sn surface can be coated even if the amount of Si in the conversion coating is smaller, Sufficient solder wettability and corrosion resistance can be secured. The present inventors have found that even when the attached amount of Si in the chemical conversion coating film is less than 3 Omg / m 2, 'the surface roughness of the steel sheet is plated base plate by controlling the surface roughness of the plating base plate It has been found that by setting the degree of Ra to 1.5 μm or less, sufficient solder wettability and corrosion resistance can be obtained. The surface roughness of the steel sheet can be adjusted by, for example, controlling the roughness of the temper rolling roll in temper rolling performed when manufacturing a plated mother plate. That is, as described above, when the amount of Si in the chemical conversion film is small, it is necessary to reduce the surface roughness of the plating base plate. Even when the adhesion amount of Si in the chemical conversion coating and 3~ 3 Omg / m 2, in order to satisfy the properties such as good solderability and corrosion resistance, the surface roughness of the steel sheet is plated base plate Ra less than 1.5 μπι It is necessary to. Further, even when the adhesion amount of Si in the chemical conversion coating film with 3 Omg / m 2 or less, the adhesion amount of Sn plating, from the viewpoint of stability of 5 g / m 2 or more and them if it forces the corrosion resistance as described above Is more preferably 7.5 g / m 2 or more, even more preferably 10 g / m 2 or more.
ここで、 化成皮膜中に含有する Siの付着量は、 3mg/m2未満ではめつき母板 である鋼板の表面粗度 Raを 1. 5 m以下にしても、化成皮膜の被覆が不十分 で、 時間の経過とともに Sn表面で酸化 Snが成長して半田濡れ性が劣るように なり、 また耐食性も劣化するため、 3mg/m2以上とする必要がある。 また、 め つき母板である鋼板表面粗度 Raが 1. 5 μπι以下の場合、化成皮膜中に含有す る Siの付着量が 3 Omg/m2超えであっても、十分な半田濡れ性と耐食性は得ら れるが、 経済性を鑑み、 化成皮膜中に含有する Siの付着量は 3 Omg/m2以下と する。 なお、 Si付着量の測定は、 蛍光 X線による表面分析により行った。 Here, the adhesion amount of Si to be contained in the chemical conversion coating, even if the surface roughness Ra of the steel sheet is plated base plate 1. below 5 m is less than 3m g / m 2, coating of the chemical conversion film is not adequate and, now solder wettability oxidized Sn is grown in Sn surface is poor over time, and to degrade corrosion resistance, it is necessary to be 3 mg / m 2 or more. Also, if the steel sheet surface roughness Ra is because with the mother board is less than 1. 5 μπι, even if the adhesion amount of Si you contained in the chemical conversion coating was in greater than 3 Omg / m 2, sufficient wettability Although corrosion resistance can be obtained, the amount of Si contained in the chemical conversion film should be 3 Omg / m 2 or less in consideration of economy. The measurement of the Si adhesion amount was performed by surface analysis using fluorescent X-rays.
本発明において、 化成皮膜中に含有する Siは、 好ましくは、 化成処理液中に 含有させたシランカツプリング剤によって含有させたものである。 シランカツ プリング剤の一般化学式は、 X-Si-OR2r3 (OR :アルコキシ基) である。 シランカップリング剤は、 アルコキシシリル基 (Si-OR) が水により加水分 解されてシラノ一ル基を生成し、 金属表面の O H基との脱水縮合反応により密 着し強固な皮膜を形成する。 In the present invention, the Si contained in the chemical conversion film is preferably contained by the silane coupling agent contained in the chemical conversion treatment solution. The general chemical formula of the silane coupling agent is X-Si-OR 2 . r3 (OR: alkoxy group). Silane coupling agents form alkoxysilyl groups (Si-ORs) that are hydrolyzed by water to form silanol groups, which adhere to the OH groups on the metal surface by a dehydration condensation reaction to form a strong film. .
尚、 シランカップリング剤としては、 3 -メタタリ '口キシプロピノレトリメ トキ シシラン、 2- (3, 4-エポキシシクロへキシル) ェチルトリメ トキシシラン、 3 -グリシドキシプロピルトリメトキシシラン、 N- 2 - (ァミノェチル) 3 -アミ ノプロビルトリメ トキシシラン、 N- 2 (ァミノェチル) 3 -ァミノプロピルメチ ルジメ トキシシラン、 3-ァミノプロピ トリエトキシシラン、 Ν-フエ二ノレ- 3- ァミノプロピルトリメ トキシシラン、 3 -メルカプトプロピルメ トキシシラン、 3-クロ口プロビルトリメ トキシシラン、 ビニルトリエトキシシラン、 ビュルト リス (2-メ トキシエトキシ) シラン、 ァミノ基の存在する、 Ν-2 (アミノエチ ル) 3-ァミノプロビルトリメ トキシシラン、 Ν-2- (アミノエチル) 3-ァミノ プロピルメチルジメ トキシシラン、 3 -ァミノプロビルトリエトキシシランな どが使用できるが、特にシランカツプリング剤の一般化学式における X-Si-OR 2r。の Xにエポキシ基が存在する 2- (3, 4-エポキシシクロへキシノレ) ェチ ルトリメ トキシシランや 3—グリシドキシプロピルトリメ トキシシランが好適 である。 Examples of the silane coupling agent include 3-methallyl xypropynoletrimethoxysilane, 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, N-2- (Aminoethyl) 3-Aminopropyl trimethoxysilane, N-2 (Aminoethyl) 3-Aminopropylmethyldimethoxysilane, 3-Aminopropyltriethoxysilane, フ -Feninole-3-Aminopropyltrimethoxysilane, 3-Mercaptopropylmethyl Toxoxysilane, 3-chloro mouth propyl trimethoxy silane, vinyl triethoxy silane, Burtris (2-methoxy ethoxy) silane, presence of an amino group, Ν-2 (aminoethyl) 3-amino propyl trimethoxy silane, Ν-2 -(Aminoethyl) 3-aminopropylmethyldimethoxy Orchid, 3-aminopropyl triethoxysilane, etc. can be used, but in particular, X-Si-OR 2 in the general formula of the silane coupling agent. r . 2- (3,4-epoxycyclohexynole) ethyl with an epoxy group at X Rutrimethoxysilane and 3-glycidoxypropyltrimethoxysilane are preferred.
また、 Pと Siを含有する化成皮膜の形成方法としては、 例えば、 リン酸系ィ匕 成処理によつて行なうことが好ましく、 この場合、 化成処理液中の Pの供給源 としてはリン酸ィオン換算で 1〜80g/lのリン酸、 リン酸ナトリウム、 リン酸ァ ルミ二ゥム、 リン酸カリウム等の金属塩、 および Zまたは、 1水素リン酸塩な ど使用することがより好適である。 Siの供給源としては、 前述したシランカツ プリング剤を含有する化成処理液を用いることが好ましいが、 かかる場合、 化 成処理液中の p Hを 1.5〜5.5の範囲に調整すれば、 シラン力ップリング剤を化 成処理液中に均一に溶解することができる。  Further, as a method of forming the chemical conversion film containing P and Si, for example, it is preferable to perform the conversion by phosphoric acid-based conversion treatment. In this case, the source of P in the chemical conversion treatment solution is ion phosphate It is more preferable to use metal salts such as phosphoric acid, sodium phosphate, aluminum phosphate, potassium phosphate, and the like, and Z or monohydrogen phosphate at a conversion of 1 to 80 g / l. . As a source of Si, it is preferable to use a chemical conversion treatment solution containing the above-described silane coupling agent, but in such a case, if the pH in the chemical conversion treatment solution is adjusted to a range of 1.5 to 5.5, the silane coupling agent may be used. The agent can be uniformly dissolved in the chemical treatment solution.
尚、 化成処理液には、 Sn、 Fe、 Niの金属塩、 例えば、 SnCl2、 FeCl2、 NiCl2、 SnS04、 FeS04、 NiS04などの金属塩を適宜添加することができる。 この場合に は、 促進剤として塩素酸ナトリウム、 亜硝酸塩などの酸化剤、 フッ素イオンな どのエッチング剤を適宜添加してもよい。 また、 化成処理液の均一処理性を向 上させる目的でラウリル硫酸ナトリゥム、 アセチレングリコールなどの界面活 性剤を適宜添加しても良い。 Note that the chemical conversion treatment liquid, Sn, Fe, Ni metal salts, for example, can be appropriately added metal salts such as SnCl 2, FeCl 2, NiCl 2 , SnS0 4, FeS0 4, NiS0 4. In this case, an oxidizing agent such as sodium chlorate or nitrite, or an etching agent such as fluorine ion may be appropriately added as a promoter. In addition, a surfactant such as sodium lauryl sulfate or acetylene glycol may be appropriately added for the purpose of improving the uniformity of the chemical conversion treatment solution.
りん酸系化成処理を用いた化成皮膜の形成は、 上記化成処理液の鋼板への塗 布または浸漬処理を行った後、 乾燥させることによって行えば良い。  The formation of a chemical conversion film using a phosphoric acid-based chemical conversion treatment may be performed by applying or dipping the above-mentioned chemical conversion treatment solution to a steel sheet and then drying it.
以上のことから、 この発明では、 鋼板表面に形成した錫めつき層の上層に、 P及び Siを上記適正範囲で含有する化成皮膜を形成すること、 あるいは表面粗 度を適正ィ匕した鋼板表面に形成した錫めつき層の上層に、 P及ぴ Siを上記適正 範囲で含有する化成皮膜を形成することによって、 Pbフリ一半田との濡れ性、 耐食性およぴ耐ホイス力一性の全ての性能を満足させることに成功したのであ る。 次にこの発明に従う具体的な製造方法の一例を説明する。  From the above, according to the present invention, it is possible to form a chemical conversion film containing P and Si in the above-mentioned appropriate range on the tin plating layer formed on the surface of the steel plate, or to obtain a steel plate surface having a proper surface roughness. By forming a chemical conversion film containing P and Si in the above-mentioned appropriate range on the tin plating layer formed on the substrate, all of the wettability with Pb-free solder, corrosion resistance, and resistance to hoisting force are achieved. We succeeded in satisfying the performance of this. Next, an example of a specific manufacturing method according to the present invention will be described.
冷延鋼板に Snめっきを施した後、 錫の融点 (231.9 °C) 以上の温度で加熱 溶融(リフロー)処理を行い、 Fe— Sn合金からなる中間層と上層の金属 Sn層を 形成させ、 引き続き、 浸漬処理によって化成処理を行う。 尚、 リフロー処理後 PC漏雇 983 に表面に生成した錫酸ィヒ物を除去するため、 15g/lの炭酸ナトリゥム水溶液中で 1 C/dm2の陰極処理を行ってもよレ、。 After applying Sn plating to the cold-rolled steel sheet, it is heated and melted (reflowed) at a temperature equal to or higher than the melting point of tin (231.9 ° C) to form an intermediate layer made of an Fe-Sn alloy and an upper metallic Sn layer. Subsequently, chemical conversion treatment is performed by immersion treatment. After reflow processing In order to remove stannic acid generated on the surface of the PC 983 , the cathode treatment of 1 C / dm 2 in a 15 g / l sodium carbonate aqueous solution may be performed.
化成処理液としては、 リン酸イオン換算で l〜80g/lのリン酸、 錫イオン換算 で 0.001〜10g/lの塩ィヒ第一錫、 0.1〜1.0 g/lの塩素酸ナトリウムを含有し、 さら にシランカップリング剤を 0.5〜20.0 mass%¾¾加した水溶液を用いる。  The chemical conversion solution contains 1 to 80 g / l of phosphoric acid in terms of phosphate ions, 0.001 to 10 g / l in terms of tin ions, stannous salt, and 0.1 to 1.0 g / l of sodium chlorate. Use an aqueous solution to which 0.5 to 20.0 mass% of a silane coupling agent is further added.
化成処理の条件は、 温度を 40〜80°C、 処理 (浸漬) 時間を 1〜 5秒間とする ことが好ましい。化成処理液中に浸漬した後の錫めつき鋼板は、 80〜150°Cで乾 燥させ、 その後、 水洗し、 温風で乾燥する。  The conditions for the chemical conversion treatment are preferably such that the temperature is 40 to 80 ° C and the treatment (immersion) time is 1 to 5 seconds. The tin-plated steel sheet immersed in the chemical conversion solution is dried at 80 to 150 ° C, then washed with water and dried with warm air.
' 尚、 上述したところは、 この発明の実施形態の一例を示したにすぎず、 請求 の範囲内において種々の変更を加えることができる。 実施例  Note that the above is only an example of the embodiment of the present invention, and various changes can be made within the scope of the claims. Example
次に、 この発明の実施例について以下で詳細に説明する。  Next, embodiments of the present invention will be described in detail below.
実施例 1-1〜1- 7 Examples 1-1 to 1-7
板厚 0 . 4〜1 . 8 mmの低炭素鋼または極低炭素鋼からなる冷延鋼板の両 面に Fe— Sn合金層を介して片面当たり 5 . 0〜2 0 . 0 g /m2の付着量の錫 めっき層を形成させた錫めつき鋼板に、 表 1に示す化成処理条件で化成皮膜を 形成させた。 このとき形成した化成皮膜の組成については表 2に示す。 A cold-rolled steel sheet made of low-carbon steel or ultra-low-carbon steel with a thickness of 0.4 to 1.8 mm, with a Fe--Sn alloy layer on both sides, with 5.0 to 2.0 g / m 2 per side A conversion coating was formed under the conversion treatment conditions shown in Table 1 on a tin-plated steel sheet on which a tin plating layer with an adhesion amount of was formed. Table 2 shows the composition of the chemical conversion film formed at this time.
比較例 1-1〜1- 6  Comparative Examples 1-1 to 1-6
尚、 比較のため、 中間層、 錫めつき層、 化成皮膜のうちの少なくとも一つが この発明の適正範囲外である錫めつき鋼板についても製造した。  For comparison, a tin-plated steel sheet in which at least one of the intermediate layer, the tin-plated layer, and the conversion coating is out of the proper range of the present invention was also manufactured.
上記本発明例およぴ比較例に用いためっき母板である冷延鋼板の表面粗度 Ra は、東京精密社製の 「サーフコム 5 0 0 A」 で測定した中心線平均粗さである。 また、 錫めつき層の Sn付着量および化成皮膜に含有される P,Siの付着量は蛍 光 X線により測定した。 また、 Sn被覆率は走査電子顕微鏡を用いた表面観察 (倍率 5 0 0 0倍での 1 0視野観察) により測定した。 表 1 The surface roughness Ra of the cold-rolled steel sheet as the plated mother plate used in the above-described present invention examples and comparative examples is the center line average roughness measured by “Surfcom 500 A” manufactured by Tokyo Seimitsu Co., Ltd. The amount of Sn in the tin plating layer and the amount of P and Si contained in the chemical conversion film were measured by X-ray fluorescence. The Sn coverage was measured by surface observation using a scanning electron microscope (10-field observation at a magnification of 50,000). table 1
Figure imgf000011_0001
Figure imgf000011_0001
シランカップリング剤 ( a ) : y -グリシドキシプロピルトリメ トキシシラン (エポキシ系) シランカップリング剤 ( b ) : 2- (3,4-エポキシシクロキシル)ェチルトリメ トキシシラン (エポキシ系) Silane coupling agent (a): y-glycidoxypropyltrimethoxysilane (epoxy) Silane coupling agent (b): 2- (3,4-epoxycycloxyl) ethyltrimethoxysilane (epoxy)
シランカツプリング剤 ( c ) : N-2- (ァミノェチル) 3-ァミノプロピルトリメ トキシシラン (ァミン系) Silane coupling agent (c): N-2- (Aminoethyl) 3-Aminopropyltrimethoxysilane (Amine series)
(性能評価) (Performance evaluation)
実施例おょぴ比較例の各錫めつき鋼板について、 Pbフリ一半田濡れ性、 耐食 性、 耐ホイス力一性の性能評価を行った。  The tin-plated steel sheets of Examples and Comparative Examples were evaluated for Pb-free solder wettability, corrosion resistance, and resistance to hoisting force.
( 1 ) 半田濡れ性の評価  (1) Evaluation of solder wettability
P フリ一半田として、千住金属製の Sn— 3.5%Ag— 0.75%Cu半田を用いた。 半田温度を 245°Cとし、 レス力製 「SAT—5100J 装置を用いて平衡法にて、 半 田が濡れるまでのゼロクロスタイムを測定し、 半田濡れ性の評価とした。 なお、 サンプルは板厚 0.6mmのものを用い、 温度 105°C—湿度 100%RHで圧力 1.22xl05Paの試験槽に 8時間曝して加速劣化させた後評価した。サンプルの半 田槽への浸漬は浸漬速度 3 mm/ s e c、 浸漬深さ 3 mmとした。 ゼロクロス タイムは 3秒以下を合格レベルとした。 As P free solder, Sn-3.5% Ag-0.75% Cu solder made by Senju Metal was used. The solder temperature was set to 245 ° C, and the zero-crossing time until the solder was wet was measured by the equilibrium method using a SAT-5100J device manufactured by Les Riki to evaluate the solder wettability. Using a 0.6 mm sample, the sample was exposed to a test tank at a temperature of 105 ° C and a humidity of 100% RH at a pressure of 1.22xl0 5 Pa for 8 hours to accelerate and degrade, and then evaluated. mm / sec, immersion depth: 3 mm Zero crossing time was 3 seconds or less.
( 2 ) 耐食性の評価 塩水噴霧 (JIS Z 2371準拠) 8時間と噴霧休止 16時間とを 1サイクルとする サイクル腐食試験を 3サイクル行い、 赤鲭ぴの発生面積率 (%) で耐食性を評 価した。 (2) Evaluation of corrosion resistance Three cycles of the cyclic corrosion test were performed, with one cycle consisting of 8 hours of salt spray (based on JIS Z 2371) and 16 hours of suspension of spraying, and the corrosion resistance was evaluated based on the area ratio (%) of reddish brown.
( 3 ) ホイスカー試験  (3) Whisker test
サンプルを曲げ半径 5 mmで曲げ、 -25°Cと 120°Cの繰返し熱サイクルを 500 回行ったのち、 曲げ部表面を走查型電子顕微鏡で観察し、 ホイスカーの発生状 況を観察した。 ホイスカーの発生および長さで耐ホイス力一性を評価した。 表 2の評価結果から明らかなように、 実施例 1-1〜1-7はいずれも、 半田濡れ 性、 耐食性および耐ホイスカー性の全性能について優れていた。 —方、 比較例 1-1〜1-6はいずれも、 半田濡れ性、 耐食性おょぴ耐ホイスカー性のいずれかの 性能が悪く、 実用レベルにないことがわかる。 The sample was bent at a bending radius of 5 mm, and after 500 thermal cycles at -25 ° C and 120 ° C, the surface of the bent portion was observed with a scanning electron microscope to observe the occurrence of whiskers. Whisker resistance was evaluated by the occurrence and length of whiskers. As is clear from the evaluation results in Table 2, all of Examples 1-1 to 1-7 were excellent in all properties of solder wettability, corrosion resistance and whisker resistance. On the other hand, Comparative Examples 1-1 to 1-6 all show poor solder wettability, corrosion resistance, and whisker resistance, which are not practical levels.
表 2 Table 2
Snめつさ層 化成処理層 性能評価  Sn mesas layer Chemical conversion treatment layer Performance evaluation
鋼板粗度 溶錫処理 Sn付着量 Sn被覆率 化成処理 P付着量 Si付着量 半田濡れ性 耐食性 耐ホイスカー Steel plate roughness Melted tin treatment Sn adhesion amount Sn coverage conversion treatment P adhesion amount Si adhesion amount Solder wettability Corrosion resistance Whisker resistance
Ra( / m) (gZm2) (%) (mE/m2) (mg/m') セ'口クロスタイム (sec)赤鲭び面積率(%) 長さ( m) 実施例 1 — 1 0.4 あり 5.1 99.3 A 5.5 12.0 2.4 1 発生なし 実施例 1 —2 0.7 あり 11.2 99.9 B 7.1 18.5 1.9 0 発生なし 蓥施例 1 —3 1.0 あり 16.8 99.9 C 3.9 6.5 1.6 0 発生なし 室施你 h 1.2 あり 19.8 9Θ.9 A 0.6 3.2 1.4 0 発生なし 室施你 h 0.8 あり 14.5 99.9 A 8.8 24.5 1.7 0 発生なし 実施例 1一 6 0.6 あり 7.8 99.8 C 2.1 4.5 2.2 1 発生なし 実施例 1 -7 1.4 あり 9.3 99.9 B 1.6 4.0 2.1 3 発生なし 比較例 1 - 1 1.3 9.0 98.0 B 1.8 3.9 2.6 3 200 比較例 1一 2 0.9 あり 4.7 99.1 A 4.2 5.5 4.1 10 発生なし 比較例 1 -3 1.1 あり 11.8 99.9 B 0.4 2.7 7.8 10 20 比較例 1 -4 0.6 あり 5.1 98.0 C 0.5 2.9 8.1 25 20 比較例 1一 5 0.8 あり 9.3 99.9 A 12.0 27.0 6.8 0 発生なし 比較例 1一 6 1.6 あり 7.8 99.9 C 2.0 4.3 3.3 15 発生なし Ra (/ m) (gZm 2 ) (%) (m E / m 2 ) (mg / m ')' mouth cross time (sec) Red area area ratio (%) Length (m) Example 1 — 1 0.4 Yes 5.1 99.3 A 5.5 12.0 2.4 1 No occurrence Example 1 — 2 0.7 Yes 11.2 99.9 B 7.1 18.5 1.9 0 No occurrence 蓥 Example 1 — 3 1.0 Yes 16.8 99.9 C 3.9 6.5 1.6 0 No occurrence Room 1.2 Yes 19.8 9Θ.9 A 0.6 3.2 1.4 0 No emission Room application h 0.8 Yes 14.5 99.9 A 8.8 24.5 1.7 0 No emission Example 1 1 6 0.6 Yes 7.8 99.8 C 2.1 4.5 2.2 1 No emission Example 1 -7 1.4 Yes 9.3 99.9 B 1.6 4.0 2.1 3 No occurrence Comparative example 1-1 1.3 9.0 98.0 B 1.8 3.9 2.6 3 200 Comparative example 1 1 2 0.9 Yes 4.7 99.1 A 4.2 5.5 4.1 10 No occurrence Comparative example 1 -3 1.1 Yes 11.8 99.9 B 0.4 2.7 7.8 10 20 Comparative example 1 -4 0.6 Yes 5.1 98.0 C 0.5 2.9 8.1 25 20 Comparative example 1 1 5 0.8 Yes 9.3 99.9 A 12.0 27.0 6.8 0 No occurrence Comparative example 1 6 1.6 Yes 7.8 99.9 C 2.0 4.3 3.3 15 None
6983 6983
13 錫めつき鋼板の製造方法  13 Manufacturing method of tin-plated steel sheet
錫系めつき層の上層に、 Pと Siを含有する化成皮膜を安定して形成させる方 法として、 特に、 3 m g Zm2以上の Si量を安定して得られる製造方法を鋭意 研究を重ねた結果、 りん酸イオンとシランカツプリング剤を含有する化成処理 液に錫系めつき鋼板を浸漬または該化成処理液を塗布し、 化成処理液が鋼板の めっき層上に存在した状態で該鋼板を 80〜200°Cに加熱して乾燥させ、 次いで 水洗した後、 再度乾燥させる方法により、 短時間で安定して化成皮膜が得られ ることを新規に見いだした。 As a method of stably forming a chemical conversion film containing P and Si on the tin-based plating layer, we have been conducting intensive research, especially on a production method that can obtain a stable Si content of 3 mg Zm 2 or more. As a result, the tin-plated steel sheet was immersed or applied in a chemical conversion solution containing phosphate ions and a silane coupling agent, and the chemical conversion solution was present on the plating layer of the steel sheet. It was newly found that a chemical conversion film could be stably obtained in a short period of time by heating to 80 to 200 ° C, drying it, then washing it with water and then drying it again.
前記化成処理液に界面活性剤を含有させると、 加熱乾燥時の鋼板上での化成 処理液の膜がより均一となり安定した化成皮膜が得られるのでより好適である。 以下にこの発明の構成を詳細に説明する。  It is more preferable to include a surfactant in the chemical conversion treatment liquid, since the film of the chemical conversion treatment liquid on the steel sheet during heating and drying becomes more uniform and a stable chemical conversion film can be obtained. Hereinafter, the configuration of the present invention will be described in detail.
この発明でいう 「錫系めつき鋼板」 とは、 鋼板の片面または両面に錫を含む めっき層を有するものである。錫を含むめっき層としては、 Snと、 Ni、 Fe、 Zn、 Biおよび Cuのうちから選んだ 1種または 2種以上を含有する合金層、 あるい は金属錫層と、 該金属錫層と鋼板との間に形成した、 Feおよびてのうちから 選んだ 1種または 2種を含有する錫合金層の中間層との 2層からなるめっき層 等が挙げられるが、 特に限定されるものではない。  The term “tin-based plated steel sheet” used in the present invention has a plated layer containing tin on one or both sides of the steel sheet. Examples of the tin-containing plating layer include Sn, an alloy layer containing one or more selected from Ni, Fe, Zn, Bi, and Cu, or a metal tin layer, and the metal tin layer. Examples include a plating layer formed between a steel sheet and an intermediate layer of a tin alloy layer containing one or two selected from the group consisting of Fe and iron, and the like, but are not particularly limited. Absent.
また、 前記中間層には、 Fe— Ni合金層と、 該 Fe— Ni合金層の上面に形成し た Fe— Sn—Ni合金層の 2層からなる場合も本発明に含まれる。 このとき、 Fe 一 Ni合金層は、 Ni/ (Fe+Ni) 質量比が 0.02〜0.50の範囲であることが好ま しい。 NiZ (Fe+Ni) 質量比が 0.02未満だと、 Fe—Sn合金主体の四角柱状の 結晶からなり、 隙間部分が多く耐食性が低下するのに加えて、 シラン皮膜も連 続的に形成されにくくなるため塗料密着性の向上効果が小さいからである。 一 方、 Ni/ (Fe+Ni) 質量比が 0.50を超えると、 Fe— Sn—Ni合金の結晶状態が 疎となり、 鋼板自体の耐食性が劣化するとともに、 シラン皮膜も緻密に形成さ れないため、 塗料密着性の向上効果が小さいからである。 なお、 鋼板と、 錫を 含有するめつき層の間にニッケルめっき等の下地めつきを適宜施したものも本 . 発明に含まれる。  The present invention also includes a case where the intermediate layer includes two layers: a Fe—Ni alloy layer and a Fe—Sn—Ni alloy layer formed on the upper surface of the Fe—Ni alloy layer. At this time, the Fe / Ni alloy layer preferably has a Ni / (Fe + Ni) mass ratio in the range of 0.02 to 0.50. If the mass ratio of NiZ (Fe + Ni) is less than 0.02, it is composed of quadrangular prism-shaped crystals mainly composed of Fe--Sn alloy, which has many gaps and lowers the corrosion resistance.In addition, it is difficult to form a silane film continuously. This is because the effect of improving paint adhesion is small. On the other hand, if the Ni / (Fe + Ni) mass ratio exceeds 0.50, the crystalline state of the Fe—Sn—Ni alloy becomes sparse, the corrosion resistance of the steel sheet itself deteriorates, and the silane film is not formed densely. This is because the effect of improving paint adhesion is small. The present invention also includes a steel plate and a tin-containing plating layer which are appropriately plated with a base such as nickel plating.
Pと Siを含有させた化成皮膜の形成方法としては、 例えば、 りん酸系化成処 理によって行うことが好ましく、 この場合、 化成処理液中の Pの供給源として は、 りん酸ィオン換算で 1〜80g/lのりん酸、 りん酸ナトリウム、 りん酸アルミ 二ゥム、 りん酸カリウム等の金属塩、 および Zまたは、 1水素りん酸塩など使 用することがより好適である。 As a method of forming a chemical conversion film containing P and Si, for example, it is preferable to carry out a phosphoric acid-based chemical conversion treatment. In this case, as a supply source of P in the chemical conversion treatment solution, It is possible to use 1 to 80 g / l of phosphoric acid, metal salts such as sodium phosphate, aluminum phosphate, potassium phosphate, etc. in terms of ion phosphate, and Z or monohydrogen phosphate. More preferred.
なお、 化成処理液中のりん酸イオン換算の好適範囲を 1〜80g/lとした理由は、 lg/1未満だと、 塗料密着性と耐食性が劣るからであり、 一方、 80glを超えると、 化成皮膜に欠陥が生じやすくなり、 塗料密着性や耐食性が低下するからであり、 加えて、 未反応のりん酸が残存し塗料密着性が低下する場合もあるからである。 化成処理液中には、 Si の供給源としてはシランカップリング剤を用いる。 シ ランカップリング剤の一般ィヒ学式は、 X— Si— OR2r 3 (OR :アルコキシ基) であり、 アルコキシシリル基 (Si— OR) が水により加水分解されてシラノー ル基を生成し、 金属表面の OH基との脱水縮合反応により密着する。 化成処理 液の pHは 1.5〜5.5の範囲にすることが好ましい。 すなわち、 化成処理液の p Hを 1.5〜5.5の範囲に調整すれば、 シランカツプリング剤を化成処理液中に均 一に溶解することができる。 The reason why the preferred range in terms of phosphate ion in the chemical conversion treatment solution is 1 to 80 g / l is that if it is less than lg / 1, paint adhesion and corrosion resistance are poor, and on the other hand, it exceeds 80 gl This is because the conversion coating is likely to have defects, and the paint adhesion and corrosion resistance are reduced. In addition, unreacted phosphoric acid remains and the paint adhesion may be reduced. In the chemical conversion treatment solution, a silane coupling agent is used as a source of Si. The general formula for a silane coupling agent is X—Si—OR 2 . r 3 (OR: alkoxy group), where an alkoxysilyl group (Si—OR) is hydrolyzed by water to form a silanol group, which adheres to the OH group on the metal surface by a dehydration condensation reaction. The pH of the chemical conversion solution is preferably in the range of 1.5 to 5.5. That is, by adjusting the pH of the chemical conversion treatment solution to a range of 1.5 to 5.5, the silane coupling agent can be uniformly dissolved in the chemical conversion treatment solution.
尚、 シランカップリング剤としては、 3 -メタクリロキシプロピルトリメ トキ シシラン、 2- (3, 4-エポキシシクロへキシル) エチ^^トリメトキシシラン、 3-グリシドキシプロビルトリメ トキシシラン、 N-2- (アミノエチル) 3-アミ ノプロピノレトリメ トキシシラン、 N-2 (アミノエチル) 3-ァミノプロピルメチ ルジメ トキシシラン、 3-ァミノプロピルトリエトキシシラン、 N-フエニル -3- ァミノプロビルトリメ トキシシラン、 3-メルカプトプロピルメ トキシシラン、 3 -クロ口プロピノレトリメ トキシシラン、 ビュルトリエトキシシラン、 ビニノレト リス (2-メ トキシエトキシ) シラン、 ァミノ基の存在する、 N-2 (アミノエチ ル) 3-ァミノプロピルトジメ トキシシラン、 N-2- (アミノエチル) 3-ァミノ プロピルメチルジメ トキシシラン、 3 -ァミノプロピルトリエトキシシランな どが使用できるが、 特にシランカツプリング剤の一般ィヒ学式における X-Si-OR 2r3の Xにエポキシ基が存在する 2- (3, 4-エポキシシクロへキシル) ェチル トリ,メ トキシシランや 3—ダリシドキシプロピルトリメ トキシシランが好適で める。 Examples of silane coupling agents include 3-methacryloxypropyltrimethoxysilane, 2- (3,4-epoxycyclohexyl) ethy ^^ trimethoxysilane, 3-glycidoxypropyltrimethoxysilane, N-2 -(Aminoethyl) 3-aminopropinoletrimethoxysilane, N-2 (aminoethyl) 3-aminopropylmethyldimethoxysilane, 3-aminopropyltriethoxysilane, N-phenyl-3-aminopropyltrime Toxoxysilane, 3-mercaptopropyl methoxysilane, 3-chloropropynoletrimethoxysilane, butyltriethoxysilane, vinylinotris (2-methoxyethoxy) silane, presence of amino group, N-2 (aminoethyl) 3-aminopropyl Todimethoxysilane, N-2- (aminoethyl) 3-aminopropylmethyldimethoxysilane 3 - § Mino etc. propyl tri-ethoxy silane but can be used, X-Si-OR 2 in particular in General I numerology type silane cutlet coupling agents. 2- (3,4-epoxycyclohexyl) ethyl tri, methoxy silane and 3-daricidoxy propyl trimethoxy silane, in which an epoxy group is present in X of r3 , are preferred.
尚、 化成処理液には、 Sn、 Fe、 Niの金属塩、 例えば、 SnCl2、 FeCl2、 NiCl2、 SnS04、 FeS04、 NiS04などの金属塩を適宜添加することができる。 この場合に は、 促進剤として塩素酸ナトリウム、 亜硝酸塩などの酸化剤、 フッ素イオンな どのェッチング剤を適宜添加してもよい。 Note that the chemical conversion treatment liquid, Sn, Fe, Ni metal salts, for example, can be appropriately added metal salts such as SnCl 2, FeCl 2, NiCl 2 , SnS0 4, FeS0 4, NiS0 4. In this case As an accelerator, an oxidizing agent such as sodium chlorate and nitrite and an etching agent such as fluorine ion may be appropriately added.
また、 化成処理液の均一処理性を向上させる目的で、 ラウリル硫酸ナトリウ ム、 アセチレンダリコールなどの界面活性剤を適宜添加することがより好適で める。  It is more preferable to appropriately add a surfactant such as sodium lauryl sulfate or acetylendalcol for the purpose of improving the uniformity of the chemical conversion treatment solution.
錫系めつきされた鋼板は、 前記化成処理液に 40〜80°Cで 1〜 5秒間浸漬後、 ロール等で適当な厚さの化成処理液の膜になるように絞った後、 化成処理液が 鋼板上に存在した状態で該鋼板を 80〜200°Cに加熱して乾燥させる。 この加熱 乾燥工程において、 前述したアルコキシシリル基 (Si— O R) の加水分解した シラノール基と金属表面の O H基とが脱水縮合反応が促進されるため、 化成皮 膜形成が安定して行われるのである。 浸漬処理だけでは脱水縮合反応が遅いた め、 5 m g Zm2以上の皮膜中の Si量を得ることは困難である。 The tin-plated steel sheet is immersed in the above-mentioned chemical conversion treatment solution at 40 to 80 ° C for 1 to 5 seconds, squeezed with a roll or the like to form a film of the chemical conversion treatment solution with an appropriate thickness, and then subjected to the chemical conversion treatment. The steel sheet is heated to 80 to 200 ° C and dried while the liquid is present on the steel sheet. In the heating and drying step, the hydrolyzed silanol group of the alkoxysilyl group (Si-OR) and the OH group on the metal surface promote the dehydration condensation reaction, so that the formation of the chemically converted skin film is performed stably. is there. Since the dehydration condensation reaction is slow only by immersion treatment, it is difficult to obtain an amount of Si in the film of 5 mg Zm 2 or more.
加熱は、 化成処理液が鋼板上に存在したままで行う必要があり、 このため、 通常、 工業的に行われている熱風を吹き付ける加熱方法は好ましくなく、 赤外 線加熱、 誘導加熱、 輻射加熱が好適である。  Heating must be carried out while the chemical treatment liquid is present on the steel sheet. Therefore, the heating method that blows hot air, which is usually performed industrially, is not preferable, and infrared heating, induction heating, and radiation heating Is preferred.
加熱温度は、 鋼板温度として 80〜200°Cとする必要がある。 80°C未満では、 前記脱水縮合反応の速度が遅く、 化成皮膜形成が不安定となり、 十分な Si量が 得られないからであり、 また、 200°Cを超えると、 脱水縮合反応は十分早く進む が、 錫系めつき表面での錫の酸化が起こるばかりでなく、 加熱エネルギーを過 剰に消費するので好ましくない。 '  The heating temperature must be 80-200 ° C as the steel sheet temperature. If the temperature is lower than 80 ° C, the rate of the dehydration / condensation reaction is low, the formation of the chemical conversion film becomes unstable, and a sufficient amount of Si cannot be obtained. Although it proceeds, it is not preferable because not only oxidation of tin on the tin-based plating surface occurs, but also heating energy is excessively consumed. '
化成処理液を加熱乾燥させた後は、 直ちに水洗し、 未反応のシランカツプリ ング剤やりん酸イオンを洗い落とす。 未反応のシランカツプリング剤やり.ん酸 イオンが表面に残存していると、 塗料密着性や耐食性が劣るので、 必ず水洗除 去する必要がある。 水洗後の乾燥は通常の熱風乾燥を行えば良い。  Immediately after heat-drying the chemical conversion solution, wash it with water to remove unreacted silane coupling agent and phosphate ions. If unreacted silane coupling agent or sulphate ions remain on the surface, paint adhesion and corrosion resistance are inferior and must be removed by washing with water. Drying after washing with water may be performed by ordinary hot air drying.
なお、 めっき層上への化成処理液の膜の形成は、 上述した浸漬処理で行う代 わりに、 鋼板上の液の膜厚制御が容易なロールコーターを用いて化成処理液を 塗布する方法によつて行つても良い。  The film of the chemical conversion treatment solution is formed on the plating layer by a method of applying the chemical conversion treatment solution using a roll coater that can easily control the thickness of the solution on the steel sheet, instead of performing the above-described immersion treatment. You may go.
以上のことから、 本発明では、 錫系めつき表面に、 Pおよび Siを含有する化 成皮膜を安定して形成することに成功したのである。  From the above, according to the present invention, it was possible to stably form a conversion film containing P and Si on a tin-based plating surface.
次にこの発明に従う具体的な製造方法の一例を説明する。 冷延鋼板に Snめっきを施した後、 錫の融点 (231.9°C) 以上の温度で加熱溶 融 (リフロー)処理を行い、 Fe— Sn合金層 (中間層) と金属 Sn層 (上層) の 2 層からなる錫系めつき層を形成させ、 引き続き、 浸漬処理によって化成処理を 行う。 尚、 リフロー処理後に表面に生成した錫酸ィ匕物を除去するため、 15g/lの 炭酸ナトリウム水溶液中で 1 C/dm2の陰極処理を行ってもよレ、。 Next, an example of a specific manufacturing method according to the present invention will be described. After applying Sn plating to the cold-rolled steel sheet, a heat melting (reflow) treatment is performed at a temperature higher than the melting point of tin (231.9 ° C), and the Fe-Sn alloy layer (intermediate layer) and the metallic Sn layer (upper layer) are treated. A tin-based plating layer consisting of two layers is formed, followed by chemical conversion by immersion. In addition, in order to remove the stannic oxide formed on the surface after the reflow treatment, the cathode treatment of 1 C / dm 2 may be performed in a 15 g / l aqueous solution of sodium carbonate.
化成処理液としては、 リン酸イオン換算で 1〜80g/lのリン酸、 錫イオン換算 で 0.001〜: L0g/1の塩化第一錫、 0.1〜: L.O g/1の塩素酸ナトリゥムを含有し、 さら にシラン力ップリング剤を 0.5〜20.0 mass%添加した水溶液を用いる。  The chemical conversion solution contains 1 to 80 g / l of phosphoric acid in terms of phosphate ion, 0.001 to in terms of tin ion: L0 g / 1 stannous chloride, and 0.1 to: LO g / 1 sodium chlorate. Further, an aqueous solution to which 0.5 to 20.0 mass% of a silane coupling agent is added is used.
化成処理の条件は、 温度を 40〜80°C、 処理 (浸漬) 時間を 1〜5秒とするこ とが好ましい。 化成処理後の錫めつき鋼板は、 リンガーロールで絞って化成処 理液の膜を所定の膜厚に制御し、赤外線加熱装置により該鋼板を 110°Cに加熱し 乾燥させ、 その後、 直ちに水洗し、 35〜90°Cの温風で乾燥する。  The conditions for the chemical conversion treatment are preferably such that the temperature is 40 to 80 ° C and the treatment (immersion) time is 1 to 5 seconds. After the chemical conversion treatment, the tin-plated steel sheet is squeezed with a ringer roll to control the film of the chemical conversion treatment liquid to a predetermined thickness, heated to 110 ° C by an infrared heating device, dried, and immediately washed with water. And dry with warm air at 35-90 ° C.
尚、 上述したところは、 この発明の実施形態の一例を示したにすぎず、 請求 の範囲において種々の変更を加えることができる。  The above description is only an example of the embodiment of the present invention, and various changes can be made within the scope of the claims.
次に、 この発明の実施例について以下で詳細に説明する。  Next, embodiments of the present invention will be described in detail below.
実施例 2-1〜2- 8 Example 2-1 to 2-8
板厚 0.1〜2.0 mmの低炭素鋼または極低炭素鋼からなる冷延鋼板の両面に、 表 3に示すめっき構成の錫系めつき層を片面当り 10 g /m 2の付着量で形成し た後、 表 1に示す 3種類の化成処理液 A〜Cから選んだ化成処理液を用いて浸 漬あるいはロール塗布を行い、 加熱乾燥後、 直ちに水洗し、 温風乾燥すること により、 化成皮膜を形成した。 化成皮膜形成のため加熱乾燥させるときの加熱 方法および加熱温度についても表 3に示す。 On both surfaces of the cold-rolled steel sheet consisting of thickness 0.1 to 2.0 mm low carbon steel or ultra-low carbon steel, to form a tin-based plated layer of the plated structure shown in Table 3 at a coverage of one side per 10 g / m 2 Then, immersion or roll coating is carried out using the three types of chemical conversion treatment liquids A to C shown in Table 1, and after heating and drying, immediately wash with water and dry with warm air to form a chemical conversion coating. Was formed. Table 3 also shows the heating method and heating temperature when heating and drying to form a chemical conversion film.
比較例 2-1〜2-4 Comparative Example 2-1 to 2-4
尚、 比較のため、 化成皮膜の形成方法がこの発明の適正範囲外である製造方 法でも錫系めつき鋼板を製造した。
Figure imgf000018_0001
For comparison, tin-plated steel sheets were produced by a production method in which the method of forming the chemical conversion coating was out of the proper range of the present invention.
Figure imgf000018_0001
(化成皮膜の評価) (Evaluation of chemical conversion film)
実施例おょぴ比較例の各錫系め き鋼板について、 化成皮膜中の Pおよび Si 量の測定を蛍光 X線による表面分析により行った。 表 3にそれらの評価結果を 示す。  For each tin-plated steel sheet of Example and Comparative Example, the amounts of P and Si in the chemical conversion film were measured by X-ray fluorescence surface analysis. Table 3 shows the evaluation results.
(耐食性の評価)  (Evaluation of corrosion resistance)
実施例および比較例の各錫系めつき鋼板について、塩水噴霧試験 (JIS Z 2371 準拠) を 24時間行い、 赤鲭発生面積率 (%) で耐食性を評価した。 表 3にその 評価結果を示す。  Each of the tin-plated steel sheets of Examples and Comparative Examples was subjected to a salt spray test (according to JIS Z 2371) for 24 hours, and the corrosion resistance was evaluated based on the reddish area (%). Table 3 shows the evaluation results.
表 3の評価結果から明らかなように、 実施例 2-1〜2- 8はいずれも、化成皮膜 中の Si量は安定して 3 m g Zm2以上であり、 良好な耐食性を示した。 一方、 比較例 2-1〜2-4はいずれも、 化成皮膜中の Si量が 3 m g /m2未満であり、 実 用レベルにないことがわかる。 As is evident from the evaluation results in Table 3, in all of Examples 2-1 to 2-8, the amount of Si in the chemical conversion film was 3 mg Zm 2 or more stably and showed good corrosion resistance. On the other hand, in each of Comparative Examples 2-1 to 2-4, the amount of Si in the chemical conversion film was less than 3 mg / m 2 , indicating that it was not at a practical level.

Claims

請求の範囲 The scope of the claims
1. 3で1. 5 / m以下の表面粗度を有する鋼板と、 該鋼板表面上に形成さ れた Fe— Sn合金層と、該 Fe—Sn合金層上に形成された、被覆率が 99 %超え、 付着量が 5〜 20 gZm2の錫めつき層と, 該錫めっき層上の Pと S iを含有す る化成皮膜とを有し、 該ィヒ成皮膜が 0. 5〜1 Omg/m2の P付着量、 3〜3 0111 § 1112の3 i付着量を有する錫めつき鋼板。 1.3, a steel sheet having a surface roughness of 1.5 / m or less; a Fe—Sn alloy layer formed on the steel sheet surface; and a coating rate formed on the Fe—Sn alloy layer. A tin plating layer having an adhesion amount of 5 to 20 gZm 2 exceeding 99%, and a conversion coating containing P and Si on the tin plating layer; 1 Omg / m P coating weight of 2, tin plated steel sheet having a 3 i adhesion amount of 3 to 3 0111 § 111 2.
2. 前記 Fe— Sn合金層が、溶錫処理によって形成された Fe—Sn合金層である 請求の範囲 1に記載の錫めつき鋼板。 2. The tin-plated steel sheet according to claim 1, wherein the Fe—Sn alloy layer is a Fe—Sn alloy layer formed by a molten tin treatment.
3. 前記 Fe—Sn合金層が、 多くとも 1 g /m2である Fe—Sn合金量を有する 請求の範囲 1に記載の錫めつき鋼板。 3. The tin-plated steel sheet according to claim 1, wherein the Fe—Sn alloy layer has an Fe—Sn alloy amount of at most 1 g / m 2 .
4. 前記化成皮膜は、 Pとシランカップリング剤を含有する化成処理液を用い て形成された化成皮膜である請求の範囲 1に記載の錫めつき鋼板。 4. The tin-plated steel sheet according to claim 1, wherein the chemical conversion film is a chemical conversion film formed using a chemical conversion solution containing P and a silane coupling agent.
5. 前記シランカップリング剤がエポキシ基を有する請求の範囲 4に記載の錫 めっき鋼板。 5. The tin-plated steel sheet according to claim 4, wherein the silane coupling agent has an epoxy group.
6 ·前記化成皮膜が、 S i ZPの質量比 5-30を有する請求の範囲 1に記載の錫めつ さ鋼板。 6. The tin-coated steel sheet according to claim 1, wherein the conversion coating has a mass ratio of Si ZP of 5 to 30.
7. 鋼板の片面または両面に錫を含むめっき層を設け、 7. Provide a plating layer containing tin on one or both sides of the steel plate,
めっき層が設けられた鋼板を、 りん酸ィオンとシランカップリング剤を含 有する化成処理液に浸漬または該化成処理液を塗布し、  The steel sheet provided with the plating layer is immersed in or coated with a chemical conversion treatment solution containing ion phosphate and a silane coupling agent,
化成処理液が鋼板のめっき層上に存在した状態で該鋼板を 80〜200°Cに加 熱して乾燥させ、  In the state where the chemical conversion treatment solution was present on the plating layer of the steel sheet, the steel sheet was dried by heating to 80 to 200 ° C,
乾燥した鋼板を水洗し、  Wash the dried steel sheet with water,
水洗後、 再度乾燥させる、 錫めつき鋼板の製造方法。 After washing with water, dry again, Manufacturing method of tin-plated steel sheet.
8 . 前記化成処理液が界面活性剤を含有する請求の範囲 7に記載の錫めつき鋼 板の製造方法。 8. The method for producing a tin-plated steel sheet according to claim 7, wherein the chemical conversion treatment solution contains a surfactant.
PCT/JP2003/006983 2002-06-05 2003-06-03 Tin-plated steel plate and method for production thereof WO2003104528A1 (en)

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