Nothing Special   »   [go: up one dir, main page]

WO2003035739A1 - Electroconductive resin composition and electronic parts using the same - Google Patents

Electroconductive resin composition and electronic parts using the same Download PDF

Info

Publication number
WO2003035739A1
WO2003035739A1 PCT/JP2002/010830 JP0210830W WO03035739A1 WO 2003035739 A1 WO2003035739 A1 WO 2003035739A1 JP 0210830 W JP0210830 W JP 0210830W WO 03035739 A1 WO03035739 A1 WO 03035739A1
Authority
WO
WIPO (PCT)
Prior art keywords
electroconductive
powder
resin composition
group
organic solvent
Prior art date
Application number
PCT/JP2002/010830
Other languages
French (fr)
Japanese (ja)
Inventor
Takehiro Shimizu
Hidekazu Matsuura
Original Assignee
Hitachi Chemical Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co., Ltd. filed Critical Hitachi Chemical Co., Ltd.
Priority to JP2003538251A priority Critical patent/JP3915779B2/en
Priority to KR1020047005635A priority patent/KR100616368B1/en
Publication of WO2003035739A1 publication Critical patent/WO2003035739A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

An electroconductive resin composition which comprises a silver-plated cooper powder (a1) having an aspect ratio of 1 to 20, an electroconductive powder containing a silver powder (A1), a thermoplastic resin (B1) having one or more functional groups selected from the group consisting of an amide group, an ester group, an imide group and en ether group, and an organic solvent (C); an electroconductive resin composition which comprises a silver-plated cooper powder (a2) having cooper exposed on a part of the surface thereof, an electroconductive powder (A2) containing a silver powder, the above thermoplastic resin (B1), and an organic solvent (C); an electroconductive resin composition which comprises the electroconductive powder (A1), a thermoplastic resin (B2) selected from the group consisting of a polyamide silicone resin, a polyamideimide silicone resin and a polyimide silicone resin, and an organic solvent (C); and an electroconductive resin composition which comprises the above electroconductive powder (A2), the above thermoplastic resin (B2) and an organic solvent (C).
PCT/JP2002/010830 2001-10-19 2002-10-18 Electroconductive resin composition and electronic parts using the same WO2003035739A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2003538251A JP3915779B2 (en) 2001-10-19 2002-10-18 Conductive resin composition and electronic component using the same
KR1020047005635A KR100616368B1 (en) 2001-10-19 2002-10-18 Electroconductive resin composition and electronic parts using the same

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP2001322321 2001-10-19
JP2001322320 2001-10-19
JP2001/322321 2001-10-19
JP2001/322320 2001-10-19
JP2001333650 2001-10-31
JP2001/333649 2001-10-31
JP2001/333650 2001-10-31
JP2001333649 2001-10-31

Publications (1)

Publication Number Publication Date
WO2003035739A1 true WO2003035739A1 (en) 2003-05-01

Family

ID=27482633

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2002/010830 WO2003035739A1 (en) 2001-10-19 2002-10-18 Electroconductive resin composition and electronic parts using the same

Country Status (4)

Country Link
JP (1) JP3915779B2 (en)
KR (1) KR100616368B1 (en)
TW (1) TWI253457B (en)
WO (1) WO2003035739A1 (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005109078A (en) * 2003-09-30 2005-04-21 Nippon Chemicon Corp Method of manufacturing solid electrolytic capacitor
JP2005109077A (en) * 2003-09-30 2005-04-21 Nippon Chemicon Corp Method of manufacturing solid electrolytic capacitor
JP2005109265A (en) * 2003-09-30 2005-04-21 Nippon Chemicon Corp Solid electrolytic capacitor and its manufacturing method
JP2008300637A (en) * 2007-05-31 2008-12-11 E I Du Pont De Nemours & Co Conductive paste for solid electrolytic capacitor electrode, and manufacturing method of electrode of solid electrolytic capacitor using the conductive paste
WO2011024587A1 (en) * 2009-08-31 2011-03-03 シャープ株式会社 Electrically conductive paste, electrode for semiconductor device, semiconductor device, and process for production of semiconductor device
EP3236479A1 (en) 2016-04-21 2017-10-25 Henkel AG & Co. KGaA An electrically conductive, hot-melt adhesive or moulding composition
IT201800021346A1 (en) 2018-12-28 2020-06-28 Enrico Luigi Seveso Hot-melt resin to dissipate heat, electrically non-conductive and / or electrically insulating.
JP2021105135A (en) * 2019-12-26 2021-07-26 住友金属鉱山株式会社 Thermally conductive composition
JPWO2021220976A1 (en) * 2020-05-01 2021-11-04

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106663494B (en) 2014-07-22 2018-11-30 阿尔法装配解决方案公司 Stretchable interconnection for flexible electrical component surface
US10629323B2 (en) * 2015-08-28 2020-04-21 Dupont Electronics, Inc. Electrically conductive adhesives
CN107922802B (en) 2015-08-28 2020-09-25 杜邦公司 Conductive adhesive
CN107922800B (en) 2015-08-28 2020-02-28 杜邦公司 Coated copper particles and uses thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08161930A (en) * 1994-12-02 1996-06-21 Murata Mfg Co Ltd Conductive paste, and conductive body and multilayer ceramic board using it
JPH08199041A (en) * 1994-11-22 1996-08-06 Matsushita Electric Ind Co Ltd Structure having solder layer and conductive composition used to make same
JP2000007824A (en) * 1998-06-22 2000-01-11 Jsr Corp Electroconductive composition and transfer film for forming electrode
JP2001351436A (en) * 2000-06-06 2001-12-21 Hitachi Chem Co Ltd Conductive paste composition and electronic components using same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08199041A (en) * 1994-11-22 1996-08-06 Matsushita Electric Ind Co Ltd Structure having solder layer and conductive composition used to make same
JPH08161930A (en) * 1994-12-02 1996-06-21 Murata Mfg Co Ltd Conductive paste, and conductive body and multilayer ceramic board using it
JP2000007824A (en) * 1998-06-22 2000-01-11 Jsr Corp Electroconductive composition and transfer film for forming electrode
JP2001351436A (en) * 2000-06-06 2001-12-21 Hitachi Chem Co Ltd Conductive paste composition and electronic components using same

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4720076B2 (en) * 2003-09-30 2011-07-13 日本ケミコン株式会社 Solid electrolytic capacitor and manufacturing method thereof
JP4529404B2 (en) * 2003-09-30 2010-08-25 日本ケミコン株式会社 Manufacturing method of solid electrolytic capacitor
JP2005109265A (en) * 2003-09-30 2005-04-21 Nippon Chemicon Corp Solid electrolytic capacitor and its manufacturing method
JP2005109078A (en) * 2003-09-30 2005-04-21 Nippon Chemicon Corp Method of manufacturing solid electrolytic capacitor
JP4529403B2 (en) * 2003-09-30 2010-08-25 日本ケミコン株式会社 Manufacturing method of solid electrolytic capacitor
JP2005109077A (en) * 2003-09-30 2005-04-21 Nippon Chemicon Corp Method of manufacturing solid electrolytic capacitor
JP2008300637A (en) * 2007-05-31 2008-12-11 E I Du Pont De Nemours & Co Conductive paste for solid electrolytic capacitor electrode, and manufacturing method of electrode of solid electrolytic capacitor using the conductive paste
WO2011024587A1 (en) * 2009-08-31 2011-03-03 シャープ株式会社 Electrically conductive paste, electrode for semiconductor device, semiconductor device, and process for production of semiconductor device
JP2011054313A (en) * 2009-08-31 2011-03-17 Sharp Corp Conductive paste, electrode for semiconductor device, semiconductor device, and method of manufacturing semiconductor device
EP3236479A1 (en) 2016-04-21 2017-10-25 Henkel AG & Co. KGaA An electrically conductive, hot-melt adhesive or moulding composition
WO2017182621A1 (en) 2016-04-21 2017-10-26 Henkel Ag & Co. Kgaa An electrically conductive, hot-melt adhesive or moulding composition
IT201800021346A1 (en) 2018-12-28 2020-06-28 Enrico Luigi Seveso Hot-melt resin to dissipate heat, electrically non-conductive and / or electrically insulating.
JP2021105135A (en) * 2019-12-26 2021-07-26 住友金属鉱山株式会社 Thermally conductive composition
JPWO2021220976A1 (en) * 2020-05-01 2021-11-04
WO2021220976A1 (en) * 2020-05-01 2021-11-04 昭栄化学工業株式会社 Electroconductive resin composition and manufacturing method for electronic component
JP7078194B2 (en) 2020-05-01 2022-05-31 昭栄化学工業株式会社 Conductive resin composition for forming electrodes of electronic components

Also Published As

Publication number Publication date
JPWO2003035739A1 (en) 2005-02-10
KR20040058202A (en) 2004-07-03
KR100616368B1 (en) 2006-08-28
TWI253457B (en) 2006-04-21
JP3915779B2 (en) 2007-05-16

Similar Documents

Publication Publication Date Title
WO2003035739A1 (en) Electroconductive resin composition and electronic parts using the same
EP1160972A3 (en) Electronic parts
EP1207726A3 (en) Conductive ink composition
HK1176172A1 (en) Antenna device
ATE328354T1 (en) ENCAPSULATED ELECTRONIC COMPONENT AND METHOD FOR THE PRODUCTION THEREOF
WO2001048870A3 (en) Interconnect for microelectronic structures with enhanced spring characteristics
AU2002211084A1 (en) Methods of manufacturing a printed circuit board shielded against interfering radiation
EP2256785A3 (en) Electronic Device
SG170618A1 (en) Polymeric oligonucleotide prodrugs
EP1460688A3 (en) Resin sealed electronic assembly and method of manufacturing the same
WO2003081638A3 (en) Method for conductance switching in molecular electronic junctions
EP1453364A4 (en) Film for circuit board
KR910009127A (en) Printed circuit board, manufacturing method thereof and method for attaching electronic components to printed circuit board
ATE303538T1 (en) CONDUCTIVE COATING ON A NON-CONDUCTIVE, FLEXIBLE SUBSTRATE
EP1178712A3 (en) Structure with blended polymer conformal coating of controlled electrical resistivity
EP0875906A3 (en) Electronic part and process for manufacturing the same
DE60205664D1 (en) HEAT-CURABLE RESIN COMPOSITION
TW200513494A (en) Composition for resin of composite dielectric material, the material itself and electric circuit board using the same
MY127384A (en) Electronic component material containing pest repellent electronic component using the same, and its manufacturing method
KR960025832A (en) Conductive Paste, Conductor and Multilayer Ceramic Substrate Using the Same
TW200729440A (en) Electronic assembly having graded wire bonding
SE9800709L (en) Leader
EP1100297A3 (en) Releasably contacting a contactlead onto a conductive path of a circuit board
WO2006068741A3 (en) Flexible electronic circuit articles and methods of making thereof
DE50205819D1 (en) Connector with insulation and sealing element

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ OM PH PL PT RO RU SD SE SG SI SK SL TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR IE IT LU MC NL PT SE SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
WWE Wipo information: entry into national phase

Ref document number: 2003538251

Country of ref document: JP

WWE Wipo information: entry into national phase

Ref document number: 20028194802

Country of ref document: CN

WWE Wipo information: entry into national phase

Ref document number: 1020047005635

Country of ref document: KR

122 Ep: pct application non-entry in european phase