WO2003092068A1

WO2003092068A1 - Substrate conveying mechanism and substrate conveying method

Info

Publication number: WO2003092068A1
Application number: PCT/JP2003/004979
Authority: WO
Inventors: Mitsuhiro Tanoue
Original assignee: Tokyo Electron Limited
Priority date: 2002-04-24
Filing date: 2003-04-18
Publication date: 2003-11-06
Also published as: JP2003318245A; AU2003227424A1; TWI246146B; TW200401388A

Abstract

A substrate conveying mechanism capable of reducing a contact area between holding members and a substrate and accurately delivering the substrate through a placing plate on the placing plate for conveying the substrate, comprising the first holding member moved on the placing plate in a specified direction and capable of pushing the substrate on the placing plate from one side face thereof and the plurality of second holding members capable of pushing the substrate from the reverse side of the one side face interlockingly with the movement of the first holding member, whereby since the first holding member and the second holding members push the side faces of the substrate, the substrate on the placing plate can be held at a placing position.

Description

Specification

Substrate transfer mechanism and substrate transfer method

Technical field

The present invention relates to a substrate transfer mechanism and a substrate transfer method for a substrate. Background of the Invention

In the photo resist treatment process in the manufacture of semiconductor devices, pre-bake, which is heat treatment after applying a resist solution to the surface of a semiconductor wafer (hereinafter, “wafer”), and pattern exposure are performed. Various heat treatments, such as post-tasting baking, which is a subsequent heat treatment, and post-baking, which is a heat treatment after the development treatment, and a cooling treatment performed immediately after each heat treatment are performed. In other words, in the photo resist processing step, heating and cooling processing are performed in one set. In performing such a series of processing, a coating and developing processing system has been conventionally used, and the transfer of wafers between processing apparatuses that perform each heating and cooling processing continuously is performed by a transfer apparatus installed in the system. Has been done.

The above-mentioned one set of heating and cooling processing is performed by a heating and cooling processing device that can perform both heating and cooling processing in consideration of the throughput of wafer processing and the uniformity of heat history. . Such a heating / cooling apparatus usually includes a cooling plate 15 1 for placing and cooling the wafer W in a casing 150, and a heating plate 15 for placing and heating the wafer W, as shown in FIG. And 2. For example, the heating plate 152 has a built-in heater (not shown) of a predetermined pattern. By placing the wafer W at a predetermined position, it is heated at a uniform temperature within the wafer surface. You.

The cooling plate 15 1 can move up and down from the transfer position with the transfer arm K of another transfer device to the position above the hot plate 15 2, and the wafer W can be transferred to and from the hot plate 15 2. it can. The cooling plate 15 1 and the hot plate 15 2 PT / JP03 / 04979

Two

Elevating pins 15 3 and 15 4 for transferring W are provided. The elevating pin 15 3 moves up and down in a slit 15 5 provided on the cooling plate 15 2, and the elevating pin 15 4 is provided with a through hole 15 5 provided on the hot plate 15 1. The wafer W is moved up and down in this way, and the wafer W is raised and lowered with the back surface supported.

When the heating / cooling process is performed, the wafer W transferred by the transfer arm K is placed on the cooling plate 15 1 via the lifting pins 15 3, and then the cooling plate 15 1 The wafer is moved onto the hot plate 152, and the wafer is placed on the hot plate 52 via the lifting pins 154. The wafer W placed on the hot plate 152 is heated at a predetermined temperature for a predetermined time. After that, the wafer W is delivered to the cooling plate 151, and the wafer W is cooled for a predetermined time. Thereafter, the wafer W is transferred to the transfer arm K via the lifting pins 153, and transferred to the next processing apparatus.

Wafer transfer in such a heating / cooling treatment system involves multiple transfers and movements of wafers, and it is important to ensure wafer transfer reliability. In other words, if the wafer on the cooling plate 15 1 is displaced and the wafer is not accurately transferred to the heating plate 15 2 or the transfer arm K, the wafer is placed at an appropriate heating position on the heating plate 15 2. Therefore, the wafer is not held at a predetermined position by the transfer arm K, and the transfer is not performed properly. Furthermore, if the cooling plate 151 is suddenly started and stopped suddenly from the viewpoint of improving the throughput, the wafer W may be greatly displaced and fall from the cooling plate 151. If this is done, wafer processing may be delayed, which may lead to a decrease in throughput.

In order to solve this problem, for example, a plurality of fixing pins and a pressing member for pressing the wafer against the fixing pins are provided on the cooling plate, and the wafer is fixed at a predetermined position on the cooling plate. It can be suggested to transfer the wafer. However, in such a case, since the wafer is pressed from one direction, for example, in order to properly guide the wafer to a predetermined position and press the wafer against the fixing pin, for example, the pressing is performed. It is necessary to increase the contact area between the pressing member and the wafer by giving the pressing member a predetermined width. However, when doing so, the shape of the pressing member is limited. In addition, since the contact area between the pressing member and the wafer is large, there is a possibility that the temperature of the wafer may be adversely affected. Furthermore, since the wafer is pushed from one direction, the impact when the wafer contacts the fixing pins is relatively large, and the wafer may be damaged. When the wafer is delivered, the pressing member retracts from the wafer, and the wafer remains in contact with the fixing pins. Then, in this state, the wafer is lifted and lowered by the lifting pins, so that the side surface of the wafer may be caught by the fixing pins, and the wafer may not be delivered accurately. Disclosure of the invention

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and reduces a contact area between a substrate holding member such as a wafer and a substrate on a mounting table such as a cooling plate. It is an object of the present invention to provide a substrate transport mechanism and a substrate transport method that can be performed accurately.

The present invention is a substrate transport mechanism for transporting a substrate to a predetermined position by mounting the substrate at a predetermined mounting position on a mounting plate and moving the mounting plate. In a predetermined direction, and a first holding member capable of pushing the substrate from one side of the substrate on the mounting plate; and interlocking with the movement of the first holding member, A plurality of second holding members capable of pushing the substrate from the side opposite to the side, and an interlocking mechanism for interlocking the first holding member and the second holding member are provided. The interlocking mechanism includes: a moving member that moves linearly in the predetermined direction integrally with the first holding member; and a self-rotating member that rotates in conjunction with the linear movement of the moving member; A rotating member for rotating the holding member toward the substrate on the mounting plate. Then, the first holding member and the second holding member press the side surface of the substrate, whereby the substrate on the mounting plate is held at the mounting position. According to the present invention, the substrate being transported is firmly held by the first and second holding members, so that the substrate can be prevented from dropping and slipping during transport, and the reliability of substrate transport can be improved. As a result, the processing equipment does not need to be stopped due to, for example, a fall of the substrate, thereby improving the operating rate of the processing equipment. Further, since the substrate is held at a predetermined mounting position, the substrate can be delivered at a desired position. For example, the substrate can be accurately delivered to a processing unit that is a delivery destination. Appropriate processing can be performed. In addition, since the substrate is held by the holding member that presses the side surface of the substrate from a plurality of directions, the contact between each holding member and the substrate can be made at a point, and the contact area with the substrate can be reduced.

As a result, for example, it is possible to suppress temperature fluctuation of the substrate due to contact with the holding member. In this regard, at least the contact surfaces of the first holding member and the second holding member with the substrate are made of a heat insulating material. Further, according to the present invention, the degree of freedom of the shape of the holding member is increased, and the design becomes easy. Furthermore, when the substrate is delivered, all the holding members are retracted from the substrate, and the holding member and the substrate can be brought into a non-contact state. Can be performed without shifting. Also, since the substrate is securely held from both sides, the reliability of substrate transfer is ensured even when the mounting plate moves at high speed. In the present invention, the mounting plate also includes a substrate on which the substrate is mounted while holding a portion on the back surface of the substrate, for example, an outer peripheral portion of the back surface of the substrate.

The first holding member and the second holding member are linked by an interlocking mechanism, and the interlocking mechanism moves linearly in the predetermined direction integrally with the first holding member. A moving member, and a rotating member that rotates by itself in conjunction with the linear movement of the moving member and that rotates the second holding member toward the substrate on the mounting plate.

In such a case, the first holding member is used to hold one side of the substrate. When the moving member is moved in the predetermined direction, the moving member moves linearly, and the rotating member rotates by the linear movement of the moving member. For example, the second holding member attached to the rotating member rotates to reverse the rotation. Can hold the side surface. That is, by moving the first holding member, the substrate can be held at a predetermined position, or the holding can be released. Therefore, the substrate holding and releasing operations can be controlled only by controlling the operation of the first holding member. The second holding member may be attached to the rotating member.

Two second holding members may be provided. In this case, the rotating member is disposed outside the opposite side of the mounting position, and the moving member is disposed at both side ends of the mounting plate. Then, the rotation member 回動 the moving member does not hinder the transfer of the substrate performed on the mounting plate.

The second holding member may be provided at a plurality of locations. In such a case, the contact pressure with the substrate at one location can be reduced, so that the substrate can be more reliably prevented from being damaged. In addition, because the board can be held more reliably, the reliability of board transfer is improved. The first holding member and the second holding member may be arranged so that the outer periphery of the substrate on the mounting plate can be held at equal intervals.

The interlocking mechanism may include a connecting member that connects the first holding member and the moving member. Further, the rotating member may be a member that rotates around a rotation axis provided vertically to the mounting plate.

Further, an elastic body may be attached to a connecting portion between the moving member and the rotating member to reduce an impact when the second holding member contacts the substrate. Since a strong force may be applied to the contact portion between the second holding member and the substrate, the presence of such an elastic body reduces the impact at the time of contact between the second holding member and the substrate, and reduces the impact on the substrate. Damage can be prevented. The mounting plate is provided in the same heat treatment apparatus as the heating plate on which the substrate is placed and heated, and the mounting plate is provided at a predetermined position on the heating plate and at another position outside the heat processing apparatus. It may be possible to transfer the substrate to a predetermined position in the heat treatment apparatus that can be accessed by the transfer apparatus.

In addition, the mounting plate may have a cooling function of cooling the mounted substrate.

If the substrate is not delivered at a predetermined position on the heating plate, for example, the substrate will not be placed at a desired position on the heating plate, and proper heat treatment cannot be performed. If the substrate is not transferred to another transfer device at a predetermined position, for example, the other transfer device cannot hold the substrate at a desired position, and the substrate cannot be transferred properly. According to the present invention, the substrate can be transferred to the transfer position while the substrate is held at the predetermined mounting position by the first and second holding members, so that the substrate can be transferred to an appropriate position with respect to the heating plate and other transfer devices. The substrate can be delivered.

The first holding member and the second holding member may be made of a material softer than the substrate. In this case, the impact at the time of contact between the substrate and the first or second holding member is reduced, and the damage of the substrate due to the contact itself can be more reliably prevented.

When the direction of movement of the first holding member is set to a direction toward the center of the substrate, two or more second holding members are arranged, and these second holding members are moved by the movement of the first holding member. The second holding member may be arranged at a position symmetrical with respect to the direction, and the direction in which the second holding member presses the side surface of the substrate may be set to a direction substantially toward the center of the substrate. Thus, the substrate can be accurately and stably held at a predetermined position.

The substrate transfer method of the present invention is a transfer method using a substrate transfer mechanism. The substrate transfer mechanism moves on the mounting plate in a predetermined direction, and transfers the substrate from one side of the substrate on the mounting plate. A first holding member that can be pushed, and a substrate that is pushed from the side opposite to the one side in conjunction with the movement of the first holding member. 03 04979

And a link mechanism for linking the first holding member and the second holding member. The interlocking mechanism includes: a moving member that moves linearly in the predetermined direction integrally with the first holding member; and a self-rotating member that rotates in conjunction with the linear movement of the moving member; A rotating member for rotating the holding member toward the substrate on the placing plate. During the movement of the mounting plate, the first holding member and the second holding member press the side surface of the substrate to hold the substrate on the mounting plate. Release the holding of the substrate by the holding member and the second holding member

According to this substrate transfer method, the substrate being transferred is held and fixed at a predetermined mounting position, and the substrate can be prevented from dropping or shifting. When transferring the board, the holding of the board is released, and the board can be transferred smoothly. BRIEF DESCRIPTION OF THE FIGURES

FIG. 1 is a plan view of a coating and developing processing system having a heating / cooling processing device provided with a transport mechanism according to the present embodiment.

Fig. 2 is a front view of the coating and developing system of Fig. 1. FIG. 3 is a rear view of the coating and developing system of FIG.

Figure 4 is an explanatory diagram showing a vertical cross section of the heating / cooling treatment device.

FIG. 5 is an explanatory plan view of the heating / cooling processing apparatus of FIG.

Figure 6 is an explanatory plan view of the cooling plate.

Fig. 7 is an explanatory diagram showing the configuration of the connection between the bracket and the linear motion shaft. Fig. 8 is an explanatory diagram showing the configuration of the connection between the bracket and the linear motion shaft. Figure 9 is an explanatory diagram showing the wafer held in the cooling section from a plan view.

FIG. 10 is an explanatory diagram showing a state in which the holding of the heater is released in the heating unit from a plan view. Fig. 11 is an explanatory diagram showing a state in which a wafer is held in a heating unit from a plan view.

FIG. 12 is an explanatory plan view of a cooling plate showing another configuration example of the holding mechanism. Fig. 13 is an explanatory plan view of a cooling plate provided with a holding member using a solenoid.

Figure 14 is an explanatory plan view of a conventional heating / cooling treatment device. BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, preferred embodiments of the present invention will be described. Fig. 1 is a plan view of a coating and developing system 1 equipped with a substrate transfer mechanism according to the present embodiment, Fig. 2 is a front view of the coating and developing system 1, and Fig. 3 is a coating and developing system. FIG. 2 is a rear view of the processing system 1.

As shown in FIG. 1, for example, the coating and developing system 1 loads and unloads 25 wafers W from the outside into the coating and developing system 1 in units of cassettes, Station 2 for loading and unloading, a processing station 3 in which various processing apparatuses for performing predetermined processing in a single-wafer manner in the coating and developing process are arranged, and a processing station 3 for this processing station. And an interface unit 4 for transferring wafers W to and from an exposure apparatus (not shown) provided adjacent to the camera.

In the cassette station 2, a plurality of cassettes D can be placed at predetermined positions on the cassette mounting table 5 in a line in the X direction (the vertical direction in FIG. 1). Then, the wafer carrier 7 that can be transferred in the cassette arrangement direction (X direction) and the wafer arrangement direction of the wafer W stored in the cassette D (Z direction; vertical direction) has a force S and a transfer path 8. It is provided so that it can be moved along, and each cassette D can be selectively accessed.

Wafer carrier 7 performs alignment of wafer W It has. As will be described later, the wafer carrier 7 is configured so as to be able to access the adhering device 31 and the extension device 32 belonging to the third processing device group G3 on the processing station 3 side. ing.

In the processing station 3, the main transfer device 13 as another transfer device is arranged at the center. The main transfer device 13 includes, for example, a plurality of transfer arms 13a that hold the outer periphery of the wafer W. Various processing devices are arranged in multiple stages around the main transfer device 13 to form a processing device group. In the coating and developing system 1, four processing unit groups Gl, G2, G3 and G4 are arranged, and the first and second processing unit groups G1 and G2 are used for the coating and developing process. The third processing unit group G3 is located adjacent to the cassette station 2, and the fourth processing unit group G4 is located adjacent to the interface unit 4. Have been. Furthermore, a fifth processing unit group G5 indicated by a broken line as an option can be separately arranged on the back side. The main transfer unit 13 is allocated to these processing unit groups G1, G2, G3, G4, and G5. Wafers W can be loaded and unloaded to and from the various processing equipment described below. The number and arrangement of the processing equipment groups can be arbitrarily selected.

In the first processing unit group G1, as shown in FIG. 2, two types of spinner-type liquid coating units, for example, a resist coating unit 15 that applies a resist to a wafer W and processes it, Developing apparatuses 16 for supplying a developing solution to the wafer W for processing are arranged in two stages from the bottom. Similarly, in the case of the second processing unit group G2, the resist coating unit 17 and the development processing unit 18 are stacked in two stages from the bottom.

In the third processing unit group G3, as shown in Fig. 3, a cooling device 30 for cooling the wafer W, an adhering device 31 for improving the fixability between the resist solution and the wafer W, Extension device 32 for holding wafer W on standby, pre-baking device 33 for heating after resist coating, and post-baking device for heating after development, post-baking devices 35, 36 Are stacked in order from the bottom, for example, in seven layers.

The fourth processing unit group G4 includes, for example, a cooling device 40, an extension cooling device 41 for naturally cooling the placed wafer W, an extension device 42, and a substrate transfer mechanism of the present embodiment. Heating / cooling treatment devices 43, 44, 45, postbaking devices 46, 47, etc., as heat treatment devices equipped with, are stacked in, for example, eight stages from the bottom.

At the center of the interface section 4, a wafer carrier 50 is provided. The wafer carrier 50 is provided to an extension 'cooling device 41, an extension device 42, a peripheral exposure device 51, and an exposure device (not shown) belonging to the fourth processing device group G4. It is configured to allow access.

Here, the configuration of the heating / cooling processing devices 43, 44, 45 will be described using the heating / cooling processing device 43 as an example. The heating / cooling processing device 43 performs post-tasting pouring baking for performing heat treatment after exposure processing, and cooling processing immediately after that.

The heating / cooling device 43 has a heating part 62 and a cooling part 63 in the casing 61 as shown in FIGS. A loading / unloading port 64 for loading / unloading the wafer W by the main transfer device 13 is provided on a side surface of the casing 61 on the cooling section 63 side.

The heating part 62 includes a lid 65 that can move up and down, and a hot plate housing part 66 that is located below the lid 65 and forms a processing chamber S integrally with the lid 65. Yes.

The lid 65 has a substantially conical shape that gradually rises toward the center, and an exhaust pipe 70 is connected to the top. The atmosphere in the processing chamber S is exhausted from the exhaust pipe 70.

The hot plate housing part 66 is fixed in a substantially cylindrical case 80 located on the outer periphery, a substantially cylindrical inner case 81, and an inner case 81 arranged in the case 80. It has a support ring 82 with good heat insulation and a hot plate 83 as a disk-shaped heating plate supported by the support ring 82. An outlet 81 a is provided on the upper surface of the inner case 81 so that, for example, air or an inert gas can be blown into the processing chamber S.

Inside the heating plate 83, a heater 84 that generates heat by supplying electric power is incorporated. The hot plate 83 has, for example, three through holes 85. In each of the through holes 85, a first elevating pin 86 for supporting and lowering the back surface of the wafer W is inserted. For example, between each of the through holes 85 and the bottom plate 81b of the inner case 81, a cylindrical guide 87 covering the outer periphery of the first lifting pin 86 is provided. The guide 87 prevents the outside atmosphere from flowing into the processing chamber S through the through holes 85.

The first lifting pin 86 is moved up and down by a lifting mechanism 88 provided with, for example, a cylinder. The first elevating pin 86 can support the wafer W in a horizontal position at a predetermined position above the hot plate 83, that is, at a transfer position P1 with a cooling plate described later. The first elevating pins 86 can place the wafer W at the heating position P 2 on the hot plate 83. Note that only the tip of the first lifting pin 86 is formed of an elastic material, for example, heat-resistant rubber.

The cooling unit 63 is provided with a cooling plate 90 on which the wafer W can be placed and cooled, and the loaded wafer W can be transported to the hot plate 83, and a second lifting / lowering unit on the cooling unit 63 side. Pin 91 is provided.

The cooling plate 90 is an example of the mounting plate of the present invention, and has a substantially rectangular and thick flat plate shape as shown in FIG. The wafer W is mounted on a predetermined mounting position P3 on the upper surface of the cooling plate 90. The cooling plate 90 is provided with a holding mechanism 92 for holding the side surface of the wafer W at three points and holding the wafer W at the mounting position P3. The holding mechanism 92 includes a first holding member 93, two second holding members 94, 95, a linear guide 96 to which the first holding member 93 is attached, and each second holding member 93. Bra as a rotating member with attached members The linear motion shafts 99, 100, and 90 as two moving members for linking the brackets 97, 98, the linear motion guide 96 and the brackets 97, 98. It mainly consists of a translation plate 101 as a connecting member.

The first holding member 93 presses the side surface of the wafer W from the rear side of the cooling plate 90 (the negative side in the X direction shown in FIG. 6). The second holding members 94, 95 are provided on the side opposite to the side of the cooling plate 90, that is, from the front end side of the cooling plate 90 (the X direction positive direction side shown in FIG. 6). It pushes the side. The first holding member 93 and the second holding members 94 and 95 are made of a resin that is more flexible than the wafer W, for example, polybendaimidazole (registered trademark of Clariant Japan). It is preferable to use a heat insulating material as the material of the tip portions of the first holding member 93 and the second holding members 94, 95, that is, the portions that come into contact with the wafer W.

The first holding member 93 is provided on the rear side of the cooling plate 90 from the mounting position # 3, for example, on the center line J in the X direction passing through the center of the mounting position # 3. The first holding member 93 is attached to a linear guide 96, and the linear guide 96 extends along a rail 102 provided on a center axis J on the cooling plate 90. Can be moved. The first holding member 93 is movable in the X direction, and can hold the side surface of the wafer W from the negative side in the X direction.

The second holding members 94 and 95 are fixed to brackets 97 and 98 as rotating members provided on the leading end side of the cooling plate 90 from the installation position P3, respectively. ing. Brackets 97 and 98 are arranged near both ends of the cooling plate 90, for example, the bracket 97 to which the second holding member 94 is fixed is the Y of the cooling plate 90. The bracket 98 to which the positive direction side (the right side in Fig. 6) and the second holding member 95 are fixed is placed on the negative side in the Y direction of the cooling plate 90 (the left side in Fig. 6). I have.

Each of the brackets 97 and 98 is formed in a substantially rectangular plate shape. For example, near the corner near the mounting position of brackets 97 and 98, the cooling plate Pins 103 standing upright at 90 penetrate, and brackets 97 and 98 are rotatable with respect to cooling plate 9 °. The second holding members 94, 95 are mounted on the central axes J of the brackets 97, 98 so as to face each other. The second holding member 94 and the second holding member 95 are provided, for example, at the same distance from the center line J, and the position for holding the wafer W on the mounting position P 3 is also relative to the center line J. Symmetrical position, that is, a position symmetrical with respect to the center line J. Therefore, the moving direction of the first holding member 93 is the direction of the central axis J, that is, the direction toward the center of the wafer W, and the second holding members 94, 95 push the side surfaces of the wafer W. The direction is the direction of the force toward the center of the wafer W.

The brackets 97 and 98 are connected to the linear guides 96 via the translation shafts 99 and 100 respectively connected to the brackets 97 and 98 and the translation plate 101. Linked.

The translation plate 101 has, for example, a plate shape that is long in the Y direction. The translation plate 101 is fixed to the translation guide 96, and translates in the X direction as the translation guide 96 moves. Both ends of the translation plate 101 extend outside both ends of the cooling plate 90.

The two direct-moving shafts 99, 100 are arranged on both sides of the cooling plate 90, respectively. The rear ends 99a, 100a (the negative side in the X direction) of the respective linear motion shafts 99, 100 are fixed to both ends of the translation plate 101, respectively. 9 b, 100 b side (X direction positive direction side)

9 7 and 9 8 respectively. As a result, the linear motion shaft 9 9,

1000 moves linearly in the X direction together with the translation plate 101, and the linear motion is converted to rotational motion in brackets 97 and 98. Therefore, the second holding members 94 and 95 rotate in conjunction with the linear movement of the first holding member 93.

For the connection between the linear shaft and each bracket, the linear shaft 9 The description will be made by taking the connection between the bracket 9 and the bracket 97 as an example. For example, on the opposite side of the center axis J of the bracket 97, that is, on the side end side of the cooling plate 90, a protruding through portion 97a is provided as shown in FIGS. The penetrating portion 97a has the distal end portion 99b of the linear motion shaft 99 movably penetrating therethrough, and the linear motion shaft 99 and the penetration portion 97a of the bracket 97 have a sliding pair. Even (sl iding p air) — For example, the diameter of the through-hole 97a is about 5 mm, while the diameter of the direct acting shaft 99 is about 3 mm. The linear shaft 99 is provided with a first stopper 104 and a second stopper 105 so as to sandwich the through portion 97a.

Linear shaft 99 Rear end 9 9 2nd stopper 105 on a side and through section

For example, a panel 106 is provided as an elastic body between the sheet and the sheet 97. Therefore, when the linear motion shaft 99 moves in the positive X direction as shown in Fig. 7, the second storage horn 105 presses the spring 106 and the panel 106 is urged. The bracket 97 pushed by the pivots inward of the cooling plate 90, that is, rotates counterclockwise. The rotation angle at this time is set to, for example, about 10 °. As shown in Fig. 8, when the linear motion shaft 99 moves in the negative X direction, the first stopper 104 pushes the bracket 97 out of the cooling plate 90. Turn in the direction, clockwise. The connecting portion between the linear motion shaft 100 and the bracket 98 has the same configuration as that of the linear motion shaft 99 side. That is, the direct-acting shaft 100 penetrates the penetrating portion 98 a of the bracket 98, and the above-mentioned first and second stoppers 104, 105 and springs 105. 6 are provided as well. The elastic body used here may be sponge, rubber, or the like.

When the first holding member 93 moves in the positive X direction and comes into contact with the outer edge of the mounting position P3 when viewed from a plane, the second holding members 94 and 95 are simultaneously moved to the mounting position P3. The positions of the holding members 93, 94, 95 are adjusted so as to come into contact with the outer edge of the holding member. Therefore, the first holding member 93 and the second holding portion When the materials 94 and 95 hold the wafer W at three points, the wafer W is aligned on the mounting position P3.

The linear motion guide 96 is provided with, for example, a motor (not shown) and the power of the motor is controlled by the control unit 110. Therefore, the control unit 110 can control the movement distance and the movement timing of the linear motion guide 96 in the X direction. For example, the first holding member 9 can be controlled according to the processing program of the control unit 110. The third and second holding members 94, 95 are moved. Note that a cylinder may be used as the drive source of the linear guide 96.

On the other hand, the cooling plate 90 is formed with two slits 120 and 121 extending from the tip of the cooling plate 90 to near the center. With the slits 120 and 121, when the cooling plate 90 moves over the hot plate 83, interference with the first lifting pins 86 protruding above the hot plate 83 is avoided. it can.

As shown in Fig. 4, the second lifting pin 91 is moved up and down by a lifting mechanism 122 equipped with, for example, a cylinder. The second elevating pin 91 supports the wafer W in a horizontal position at the transfer position P 4 with the main carrier 13 above the cooling plate 90 in the cooling section 63, and The wafer W can be mounted on the mounting position P3. Only the tip portion of the second elevating pin 91 is formed of an elastic body, for example, a heat-resistant rubber.

The cooling plate 90 is attached to a moving guide 124 that moves along a moving rail 123 extending in the X direction, and can move between the heating part 62 and the cooling part 63. A cooling pipe 90a is built in the cooling plate 90, and the cooling plate 90 is maintained at a predetermined cooling temperature by cooling water flowing through the cooling pipe 90a. The wafer W placed on the wafer can be cooled to a predetermined temperature. The substrate transport mechanism in the present embodiment is composed of a cooling plate 90 and a holding mechanism 92. In addition, the interlocking mechanism in the present embodiment is constituted by brackets 97, 98, a linear motion shaft 99, 100, a translation plate 101, and a linear motion guide 96. The heating / cooling processing device 43 according to the present embodiment is configured as described above, and the operation thereof will be described next. First, the wafer W that has been subjected to the exposure processing in the exposure apparatus is carried into the heating / cooling processing apparatus 43 belonging to the fourth processing apparatus group G4.

The wafer W is loaded from the loading / unloading port 64 by the main transfer device 13, and the wafer W is lifted at the transfer position P 4 on the cooling plate 90 in advance and waits for the second elevating pins 91 1 Passed to. Next, the second lifting pins 91 descend and the wafer W is placed on the cooling plate 90. When the wafer W is placed on the cooling plate 90, the linear motion guide 96 is operated by the control unit 110, and the first holding member 93 is moved in the X direction as shown in FIG. Move to the direction side. At this time, the translation plate 101 and the translation shafts 99 and 100 move in the positive X direction along with the movement of the translation guide 96. Then, the brackets 97, 98 rotate inside the cooling plate 90, respectively, by the movement of the linear motion shafts 99, 100, and the second holding members 94, 95 are also attached to the wafer W. Rotate toward. Thus, the first holding member 93 and the second holding members 94, 95 guide the wafer W on the cooling plate 90 to the installation position P3 and place the wafer W thereon. When located at position P3, wafer W is held at three points.

Subsequently, the cooling plate 90 moves to the hot plate 83 side in the positive X direction. When the cooling plate 90 moves to the transfer position P1 on the hot plate 83, the linear guide 96 slowly retreats as shown in Fig. 10, and the first holding members 93, 2 Holding members 94, 95 Force Slowly moves away from wafer W, and the holding of wafer W is released. When the holding of the wafer W is released, the first lifting pins 86 lift the wafer W. While the wafer W is being lifted, the cooling plate 90 retreats to the cooling section 63 side. Thereafter, the lid 65 is lowered, and the processing chamber S is formed integrally with the hot plate housing part 66. Subsequently, for example, nitrogen gas is blown out from the outlet 8 la, the atmosphere in the processing chamber S is exhausted from the exhaust pipe 70 of the lid 65, and an ascending airflow is formed in the processing chamber S. The inside of the science room S is maintained in a nitrogen gas atmosphere.

Thereafter, when the first elevating pins 86 descend, and the wafer W is placed on the heating position P 2 on the hot plate 83, the heating process of ゥ: I c W is started. As described above, the wafer W accurately placed at the mounting position P3 of the cooling plate 90 is lifted by the first elevating pins 91 and then lowered as it is. 4 exactly located. Thereafter, the wafer W is heated for a predetermined time.

After a lapse of a predetermined time, the W is raised again by the first elevating pin 86, and the heating process of the W is completed. When the heating process of the wafer W is completed, the lid 65 rises, the processing chamber S is opened, and then the cooling plate 90 moves to the reheating unit 62 side, and the wafer W and the heating plate 83 are connected. Into the transfer position P 2 between. Then, the first lifting pins 86 are lowered, and the wafer W is placed on the cooling plate 90. As soon as the wafer W is mounted on the cooling plate 90, the linear guide 96 moves to the mounting position P3 as shown in FIG. 11, and the first holding members 93, The second holding members 94 and 95 push the side surfaces of the wafer W, whereby the wafer W is held at the mounting position P3.

When the wafer W is placed on the cooling plate 90, the cooling of the wafer W is started. When the wafer W is held, the cooling plate 90 moves to the cooling unit 63 side, and waits for a predetermined time until the temperature of the wafer W decreases to a predetermined temperature. When the temperature of the wafer W decreases to a predetermined temperature, the holding of the wafer W by the first holding member 93 and the second holding members 94 and 95 is released, and the wafer W is cooled by the second elevating pins 91. It is raised to the transfer position P4 on the plate 90. At this time, the wafer W accurately placed on the placement position P3 is lifted as it is by the second lifting pins 91, so that the wafer W is accurately moved to the transfer position P4. The wafer W moved to the transfer position P4 is transferred to the main transfer device 13 and unloaded from the heating / cooling device 43. PC leak 3/04979

According to the above embodiment, the holding mechanism 92 for holding the wafer W at three points is provided on the cooling plate 90, so that the wafer W moves from the mounting position P3 during the movement of the cooling plate 90. Deviation is prevented. As a result, even if the cooling plate 90 is moved at a high speed, the wafer W does not fall off the cooling plate 90. The first holding member 93 and the second holding members 94 and 95 allow the wafer W to be accurately positioned at the mounting position P3. The delivery of W can be performed at an accurate position, and as a result, the wafer W is properly placed on the hot plate 83. Therefore, the wafer W can be appropriately heated. In addition, since the wafer W can be accurately transferred to the main transfer device 13, for example, the wafer W is placed at an appropriate position on the main transfer device 13, and the transfer of the wafer W by the main transfer device 13 is also preferable. You can go to

Since the second holding members 94 and 95 are linked to the first holding member 93, the wafer W can be held or released only by controlling the movement of the first holding member 93. .

Since the holding members 93 to 95 are made of resin that is softer than the wafer W, the wafer W can be prevented from being damaged when it comes into contact with the wafer W. Further, since a spring 106 is interposed between the brackets 97, 98 and the linear motion shafts 99, 100, the second holding members 94, 95 and the wafer W I can talk quietly about the impact of the contact.

In the above embodiment, the linear movement of the first holding member 93 is performed by the translation plate 101, the linear motion shafts 99, 100, and the brackets 97, 98 by the second movement. The rotation has been converted to the rotation of the holding members 94 and 95, but may be converted using another mechanism. For example, as shown in FIG. 12, the linear guide 96 and each linear shaft 99, 100 may be connected by a plurality of nodes.

In this case, for example, on the negative side in the X direction of the mounting position P3 of the cooling plate 130, and near both ends of the cooling plate 90, the sub-brackets 131, 1 32 is provided respectively. The sub-brackets 13 1 and 13 2 are rotatable with respect to the cooling plate 130 by the pins 13 3. Links 13 4 and 13 5 rotatably attached to the linear motion guide 96 are respectively attached to the sub-brackets 13 1 and 13 2 so as to be rotatable. The sub-bracket 13 1 and the linear shaft 99 are connected rotatably to the sub-bracket 13 32 and the linear shaft 100. Then, when the linear guide 96 moves in the X direction, the sub-brackets 13 1 and 13 2 rotate via the links 13 and 13 and the sub-brackets 13 1 and 13 With the rotation of 2, the linear motion shafts 99 and 100 move in the X direction. Even in such a case, the wafer W can be held and aligned only by the movement control of the linear guide 96.

In the above embodiment, the intervals between the three holding members 93, 94, and 95 are not particularly limited, but the holding members are arranged so that the outer periphery of the wafer W can be held at equal intervals. Is also good. When there are three holding members in total, the holding members are arranged on the outer periphery of the wafer W at a center angle of 120 °. By arranging in this manner, the force relationship applied to each holding member when holding the wafer W becomes uniform, and the wafer W can be held at an accurate position. The number of the second holding members is not necessarily two, but may be two or more.

In the above-described embodiment, the first holding member and the second holding member are mechanically linked, but the first holding member and the second holding member are linked electrically, so that the wafer holding force is reduced. May be held. In such a case, as shown in FIG. 13, for example, the first holding member 140 and the second holding members 141 and 142 are made movable with respect to the wafer W by the solenoid 144. The solenoid 144 is controlled by, for example, the control unit 144, and when the W is held at the mounting position P3, the first holding member 140 and the second holding member 141 are held. , 14 2 to protrude and hold wafer W at three points. And the wafer W When the delivery is performed, the first holding member 140 and the second holding members 141 and 142 are retracted to release the holding. Even in such a case, the wafer W can be held and fixed at three points, so that the wafer W can be prevented from dropping during transfer.

According to the present invention, it is possible to reliably hold a substrate during transfer, so that the reliability of substrate transfer can be improved. In addition, since the position of the substrate to be transferred is accurately adjusted, the transfer of the substrate can be performed accurately and reliably.

In the above embodiment, the mounting plate of the present invention is applied to the cooling plate 90. However, the present invention is not limited to such a cooling plate, and the transfer mechanism of the present invention has a configuration similar to that of the heating / cooling processing device 43 of the above-described embodiment, or a mounting plate or a transfer device without a cooling function. It may be applied to a transfer arm or the like.

Although an example of the embodiment of the present invention has been described, the present invention is not limited to this example but may take various forms. For example, the substrate need not be limited to the wafer W as described above. The present invention is also applicable to a transfer mechanism and a transfer method for transferring other rectangular substrates, for example, an LCD substrate.

Industrial applicability

According to the present invention, when the substrate on the mounting plate is transported to another location, the substrate being transported can be reliably held. Moreover, the position of the substrate to be transferred is accurately adjusted. Therefore, it is useful for quickly, safely and accurately transporting substrates such as semiconductor wafers.

Claims

The scope of the claims

1. A substrate transport mechanism that transports a substrate to a predetermined position by mounting the substrate at a predetermined mounting position on a mounting plate and moving the mounting plate.

(1) a first holding member capable of moving on the mounting plate in a predetermined direction and pressing the substrate from one side of the substrate on the mounting plate;

A plurality of second holding members capable of pushing a substrate from a side opposite to the one side in conjunction with movement of the first holding member;

An interlocking mechanism for moving the first holding member and the second holding member,

The interlocking mechanism includes a moving member that moves linearly in the predetermined direction integrally with the first holding member; A rotating member for rotating the holding member toward the substrate on the mounting plate,

The substrate on the mounting plate is held at the mounting position by the first holding member and the second holding member pressing the side surface of the substrate.

2. In the frame 1 substrate transfer mechanism,

At least a contact surface of the first holding member and the second holding member with the substrate is made of a heat insulating material.

3. In the board transfer mechanism of claim 1,

The second holding member is attached to the rotating member.

4. In the board transfer mechanism of claim 1,

Having two of the second holding members, The rotating member is disposed outside the opposite side of the mounting position, and the moving member is disposed at both side ends of the mounting plate.

5. In the frame 1 substrate transfer mechanism,

The interlocking mechanism includes a connecting member that connects the first holding member and the moving member.

6. In the frame 1 substrate transfer mechanism,

The rotation member rotates about a rotation axis provided perpendicular to the mounting plate.

7. In the frame 1 board transfer mechanism,

An elastic body is provided at a connecting portion between the moving member and the rotating member to reduce an impact at the time of contact between the second holding member and the substrate.

8. In the frame 1 substrate transfer mechanism,

The first holding member and the second holding member are arranged so as to press the outer periphery of the side surface of the substrate on the mounting plate at equal intervals.

9. In the substrate 4 transfer mechanism of claim 4,

1. In the substrate 1 transfer mechanism of claim 1,

The mounting plate described above is installed in the same heat treatment apparatus as the heating plate that heats the substrate by mounting it.

The mounting plate is provided at a predetermined position on the heating plate and at another position outside the heat treatment apparatus. The substrate can be transferred to a predetermined position in the heat treatment apparatus that can be accessed by the transfer apparatus.

1 1. In the frame 1 substrate transfer mechanism,

The mounting plate has a cooling function of cooling the mounted substrate.

1 2. In the frame 1 substrate transfer mechanism,

The first holding member and the second holding member are made of a material softer than the substrate.

1 3. In the frame 1 substrate transfer mechanism,

The moving direction of the first holding member is a direction toward the center of the substrate,

The two or more second holding members are arranged, and the second holding members are arranged at line-symmetric positions along the moving direction of the first holding member. The direction in which the side of the substrate is pushed is the direction toward the center of the substrate.

14 4. A substrate transfer method using a substrate transfer mechanism,

A first holding member configured to move on the mounting plate in a predetermined direction and to push the substrate from one side of the substrate on the mounting plate; A plurality of second holding members capable of pressing the substrate from the side opposite to the one side in conjunction with the movement of the member; and interlocking the first holding member and the second holding member. And an interlocking mechanism

The interlocking mechanism includes: a moving member that moves linearly in the predetermined direction integrally with the first holding member; and a self-rotating member that rotates in conjunction with the linear movement of the moving member; A rotation for rotating the holding member toward the substrate on the placing plate. With a moving member,

While the mounting plate is moving, the first holding member and the second holding member press the side surface of the substrate to hold the substrate on the mounting plate,

When transferring the substrate, the holding of the substrate by the first holding member and the second holding member is released.