WO2002029480A3 - High-density wire bond microdisplay - Google Patents
High-density wire bond microdisplay Download PDFInfo
- Publication number
- WO2002029480A3 WO2002029480A3 PCT/US2001/030579 US0130579W WO0229480A3 WO 2002029480 A3 WO2002029480 A3 WO 2002029480A3 US 0130579 W US0130579 W US 0130579W WO 0229480 A3 WO0229480 A3 WO 0229480A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- microdisplay
- density wire
- extended portion
- wire bond
- extended
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP01975597A EP1325384A2 (en) | 2000-10-03 | 2001-10-01 | High-density wire bond microdisplay |
AU2001294908A AU2001294908A1 (en) | 2000-10-03 | 2001-10-01 | High-density wire bond microdisplay |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US67848900A | 2000-10-03 | 2000-10-03 | |
US09/678,489 | 2000-10-03 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2002029480A2 WO2002029480A2 (en) | 2002-04-11 |
WO2002029480A3 true WO2002029480A3 (en) | 2002-11-28 |
Family
ID=24722992
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2001/030579 WO2002029480A2 (en) | 2000-10-03 | 2001-10-01 | High-density wire bond microdisplay |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP1325384A2 (en) |
AU (1) | AU2001294908A1 (en) |
WO (1) | WO2002029480A2 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP4147090A1 (en) * | 2020-05-08 | 2023-03-15 | Snap Inc. | Integrated display module or apparatus and methods for operating and manufacturing the same |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04365015A (en) * | 1991-06-12 | 1992-12-17 | Idemitsu Kosan Co Ltd | Electrode connecting method for liquid crystal display panel |
JPH06202135A (en) * | 1993-01-05 | 1994-07-22 | Nec Corp | Liquid crystal display device |
US5969783A (en) * | 1998-12-11 | 1999-10-19 | National Semiconductor Corporation | Reflective liquid crystal display and connection assembly and method |
WO2000037994A1 (en) * | 1998-12-19 | 2000-06-29 | The Secretary Of State For Defence | Electro-optic device |
-
2001
- 2001-10-01 WO PCT/US2001/030579 patent/WO2002029480A2/en not_active Application Discontinuation
- 2001-10-01 AU AU2001294908A patent/AU2001294908A1/en not_active Abandoned
- 2001-10-01 EP EP01975597A patent/EP1325384A2/en not_active Withdrawn
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04365015A (en) * | 1991-06-12 | 1992-12-17 | Idemitsu Kosan Co Ltd | Electrode connecting method for liquid crystal display panel |
JPH06202135A (en) * | 1993-01-05 | 1994-07-22 | Nec Corp | Liquid crystal display device |
US5969783A (en) * | 1998-12-11 | 1999-10-19 | National Semiconductor Corporation | Reflective liquid crystal display and connection assembly and method |
WO2000037994A1 (en) * | 1998-12-19 | 2000-06-29 | The Secretary Of State For Defence | Electro-optic device |
Non-Patent Citations (2)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 017, no. 242 (P - 1535) 14 May 1993 (1993-05-14) * |
PATENT ABSTRACTS OF JAPAN vol. 018, no. 557 (P - 1817) 24 October 1994 (1994-10-24) * |
Also Published As
Publication number | Publication date |
---|---|
EP1325384A2 (en) | 2003-07-09 |
AU2001294908A1 (en) | 2002-04-15 |
WO2002029480A2 (en) | 2002-04-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR910005416A (en) | Tape carrier and its mounting method and apparatus | |
WO1999004415A3 (en) | Integrated circuit package | |
IL158135A0 (en) | Printhead module assembly | |
AU6053996A (en) | Bear chip mounting printed circuit board | |
MY133136A (en) | Die attachment with reduced adhesive bleed-out | |
DE69421486D1 (en) | Electronic connection for inkjet printhead | |
ES2349960T3 (en) | RFID LABELS FOR PALLETS AND CARTONS AND PROCEDURE FOR THE SAME FIXATION. | |
JPS61157990A (en) | Ic card | |
HK1042013A1 (en) | Integrated circuit package having a substrate venthole | |
PH30714A (en) | Mult-chip electronic package module utilizing and an adhesive sheet. | |
TW303141U (en) | Printed wiring board that is printed with bonding agent on the land for bonding chip | |
WO2002029480A3 (en) | High-density wire bond microdisplay | |
AU2326700A (en) | Glass cloth and printed wiring board | |
TW438198U (en) | Wiring structure of a printed circuit board | |
AU2003207779A1 (en) | Attachment of surface mount devices to printed circuit boards using a thermoplastic adhesive | |
DK1049362T3 (en) | Conductor plate and method for its placement | |
GB0121891D0 (en) | Integrated circuit package and printed circuit board arrangement | |
KR200213988Y1 (en) | Educational board for making electronic circuit using adhesive on board | |
JPH07101462A (en) | Electronic part string | |
JP2009111141A (en) | Printed wiring board, and light emitting unit with same | |
JPH03122484U (en) | ||
EP0562569A3 (en) | Anisotropic adhesive for fixing an electronic component to a printed circuit module | |
JPH0428437U (en) | ||
WO2002058444A3 (en) | High-g mounting arrangement for electronic chip carrier | |
JPH03103484U (en) |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A2 Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ PH PL PT RO RU SD SE SG SI SK SL TJ TM TR TT TZ UA UG UZ VN YU ZA ZW |
|
AL | Designated countries for regional patents |
Kind code of ref document: A2 Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG |
|
DFPE | Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101) | ||
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
AK | Designated states |
Kind code of ref document: A3 Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ PH PL PT RO RU SD SE SG SI SK SL TJ TM TR TT TZ UA UG UZ VN YU ZA ZW |
|
AL | Designated countries for regional patents |
Kind code of ref document: A3 Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2001975597 Country of ref document: EP |
|
WWP | Wipo information: published in national office |
Ref document number: 2001975597 Country of ref document: EP |
|
REG | Reference to national code |
Ref country code: DE Ref legal event code: 8642 |
|
NENP | Non-entry into the national phase |
Ref country code: JP |
|
WWW | Wipo information: withdrawn in national office |
Ref document number: 2001975597 Country of ref document: EP |