WO2002068555A1 - Adhesive prepreg face sheets for sandwich panels - Google Patents
Adhesive prepreg face sheets for sandwich panels Download PDFInfo
- Publication number
- WO2002068555A1 WO2002068555A1 PCT/US2001/045309 US0145309W WO02068555A1 WO 2002068555 A1 WO2002068555 A1 WO 2002068555A1 US 0145309 W US0145309 W US 0145309W WO 02068555 A1 WO02068555 A1 WO 02068555A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- prepreg
- resin
- self
- adhesive
- forming particles
- Prior art date
Links
- 239000000853 adhesive Substances 0.000 title claims abstract description 56
- 230000001070 adhesive effect Effects 0.000 title claims description 14
- 229920005989 resin Polymers 0.000 claims abstract description 148
- 239000011347 resin Substances 0.000 claims abstract description 148
- 239000002245 particle Substances 0.000 claims abstract description 89
- 229920001169 thermoplastic Polymers 0.000 claims abstract description 36
- 239000004416 thermosoftening plastic Substances 0.000 claims abstract description 36
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 34
- 239000000835 fiber Substances 0.000 claims abstract description 27
- 239000004634 thermosetting polymer Substances 0.000 claims abstract description 7
- 239000004695 Polyether sulfone Substances 0.000 claims description 39
- 229920006393 polyether sulfone Polymers 0.000 claims description 39
- 239000004593 Epoxy Substances 0.000 claims description 34
- 238000000034 method Methods 0.000 claims description 24
- 239000004697 Polyetherimide Substances 0.000 claims description 9
- 239000004643 cyanate ester Substances 0.000 claims description 9
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 8
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 8
- 239000004744 fabric Substances 0.000 claims description 7
- 229920001601 polyetherimide Polymers 0.000 claims description 6
- 229920001187 thermosetting polymer Polymers 0.000 claims description 6
- 229920006162 poly(etherimide sulfone) Polymers 0.000 claims description 4
- 230000009477 glass transition Effects 0.000 claims description 3
- 239000011162 core material Substances 0.000 abstract description 40
- 230000015572 biosynthetic process Effects 0.000 abstract description 9
- 239000011342 resin composition Substances 0.000 abstract 1
- 239000000203 mixture Substances 0.000 description 38
- 229920000647 polyepoxide Polymers 0.000 description 20
- 239000010410 layer Substances 0.000 description 16
- 239000003822 epoxy resin Substances 0.000 description 12
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 9
- 229920004752 ULTEM® 1000P Polymers 0.000 description 8
- 125000003700 epoxy group Chemical group 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- 239000002131 composite material Substances 0.000 description 7
- 238000009472 formulation Methods 0.000 description 7
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- AHIPJALLQVEEQF-UHFFFAOYSA-N 4-(oxiran-2-ylmethoxy)-n,n-bis(oxiran-2-ylmethyl)aniline Chemical compound C1OC1COC(C=C1)=CC=C1N(CC1OC1)CC1CO1 AHIPJALLQVEEQF-UHFFFAOYSA-N 0.000 description 5
- LJGHYPLBDBRCRZ-UHFFFAOYSA-N 3-(3-aminophenyl)sulfonylaniline Chemical compound NC1=CC=CC(S(=O)(=O)C=2C=C(N)C=CC=2)=C1 LJGHYPLBDBRCRZ-UHFFFAOYSA-N 0.000 description 4
- IGFHQQFPSIBGKE-UHFFFAOYSA-N 4-nonylphenol Chemical compound CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 description 4
- 229920012266 Poly(ether sulfone) PES Polymers 0.000 description 4
- 239000012790 adhesive layer Substances 0.000 description 4
- 238000004458 analytical method Methods 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 239000004615 ingredient Substances 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 229920003986 novolac Polymers 0.000 description 4
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 239000004760 aramid Substances 0.000 description 3
- 229920003235 aromatic polyamide Polymers 0.000 description 3
- 239000004917 carbon fiber Substances 0.000 description 3
- 239000002657 fibrous material Substances 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- KZTROCYBPMKGAW-UHFFFAOYSA-N 4-[[4-amino-3,5-di(propan-2-yl)phenyl]methyl]-2,6-di(propan-2-yl)aniline Chemical compound CC(C)C1=C(N)C(C(C)C)=CC(CC=2C=C(C(N)=C(C(C)C)C=2)C(C)C)=C1 KZTROCYBPMKGAW-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 229920004738 ULTEM® Polymers 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 229940106691 bisphenol a Drugs 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- -1 for example Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000004005 microsphere Substances 0.000 description 2
- 239000000123 paper Substances 0.000 description 2
- IGALFTFNPPBUDN-UHFFFAOYSA-N phenyl-[2,3,4,5-tetrakis(oxiran-2-ylmethyl)phenyl]methanediamine Chemical compound C=1C(CC2OC2)=C(CC2OC2)C(CC2OC2)=C(CC2OC2)C=1C(N)(N)C1=CC=CC=C1 IGALFTFNPPBUDN-UHFFFAOYSA-N 0.000 description 2
- 229920003192 poly(bis maleimide) Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- FLNVGZMDLLIECD-UHFFFAOYSA-N 4-[(4-amino-3-methyl-5-propan-2-ylphenyl)methyl]-2-methyl-6-propan-2-ylaniline Chemical compound CC1=C(N)C(C(C)C)=CC(CC=2C=C(C(N)=C(C)C=2)C(C)C)=C1 FLNVGZMDLLIECD-UHFFFAOYSA-N 0.000 description 1
- 229920000784 Nomex Polymers 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 238000006664 bond formation reaction Methods 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000001010 compromised effect Effects 0.000 description 1
- 230000002153 concerted effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 150000001913 cyanates Chemical class 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004763 nomex Substances 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- SVSKNXCGFBCVOM-UHFFFAOYSA-N oxiran-2-ylmethylsilane Chemical class [SiH3]CC1CO1 SVSKNXCGFBCVOM-UHFFFAOYSA-N 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000012815 thermoplastic material Substances 0.000 description 1
- 238000013022 venting Methods 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/146—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers whereby one or more of the layers is a honeycomb structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D24/00—Producing articles with hollow walls
- B29D24/002—Producing articles with hollow walls formed with structures, e.g. cores placed between two plates or sheets, e.g. partially filled
- B29D24/005—Producing articles with hollow walls formed with structures, e.g. cores placed between two plates or sheets, e.g. partially filled the structure having joined ribs, e.g. honeycomb
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/10—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material
- B32B3/12—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material characterised by a layer of regularly- arranged cells, e.g. a honeycomb structure
Definitions
- the present invention relates generally to sandwich panels and other related structural composite materials.
- Sandwich panels are typically made up of face sheets which are adhesively bonded to opposite sides of a core material to form the sandwich panel.
- the present invention relates to sandwich panels in which the face sheets are self-adhesive so that a separate adhesive film is not required for bonding to the core.
- Sandwich panels are used in a wide variety of applications where high strength and light weight are required.
- the cores which are used in most sandwich panels are either lightweight honeycomb, rigid foam, paper or wood.
- Honeycomb is a popular core material because of its high strength to weight ratio and resistance to fatigue failures.
- Honeycomb cores are made from a wide variety of products including metals and composite materials.
- the face sheets which are bonded to each side of the sandwich core have also been made from a wide variety of materials which also include metals and composites.
- An important consideration in the formation of any sandwich panel is the adhesive which is used to bond the face sheets to the core.
- the adhesive must rigidly attach the facings to the core in order for loads to be transmitted from one facing to the other and to permit the structure to fulfill all the assumptions implied in the acceptance of the commonly used stress calculation methods. If the adhesive fails, the strength of the panel is severely compromised.
- the adhesive layer is especially critical in sandwich panels which use honeycomb cores because of the relatively small surface area over which the honeycomb edges contact the face sheets.
- honeycomb sandwich panels are used in many applications where stiffness and structural strength of the panel are primary considerations. Additionally, honeycomb sandwich panels are also widely used in the aerospace industry where the weight of the panel is also of primary importance. As a result, there has been and continues to be a concerted effort to reduce the weight of the honeycomb sandwich panels without sacrificing structural strength.
- One area which has been investigated to reduce weight is the elimination of separate adhesive layers. This has been accomplished by making the face sheets from composite materials which are self-adhesive. Exemplary self-adhesive face sheets are described in published European Patent Application Nos. EP0927737 Al and EP0819723 Al.
- One procedure for applying face sheets to honeycomb involves forming a prepreg sheet which includes at least one fabric or fiber layer and an uncured prepreg resin.
- Prepreg is a term of art used in the composite materials industry to identify mat, fabric, nonwoven material or roving which has been preimpregnated with resin and which is ready for final curing.
- An adhesive is typically applied to the prepreg and it is then bonded to the honeycomb by curing of both the prepreg resin and adhesive resin at elevated temperature.
- the prepreg resin must meet the dual requirements of providing suitable structural strength while still providing adequate adhesion to the honeycomb.
- prepreg resins which are suitable for use in self-adhesive prepregs to provide lightweight yet structurally strong sandwich panels.
- prepreg face sheets have been developed that are useful as self-adhesive face sheets which are bonded to honeycomb to form sandwich panels that are lightweight, structurally strong and exhibit many other desirable properties.
- Sandwich panels incorporating the self- adhesive prepregs of the present invention exhibit high peel strength, good hot/wet properties, low solvent absorption, high resistance to core crushing and other properties that are desirable for aerospace applications.
- Self-adhesive prepregs in accordance with the present invention include at least one fiber layer that is impregnated with a prepreg resin to form a prepreg which has a prepreg resin layer having a bonding surface which is bonded directly to the honeycomb during sandwich panel formation.
- the prepreg resin includes a thermoset resin, a curing agent and a sufficient amount of a viscosity control agent to provide a prepreg resin having a viscosity which is sufficient to allow the prepreg resin to be combined with the fiber layer to form the prepreg resin layer.
- thermoplastic particles may be used as fillet forming particles that can be incorporated into the prepreg resin in amounts sufficient to make the prepreg self- adhesive while not adversely affecting the viscosity or other properties of the resin which are required for its use as a prepreg resin.
- thermoplastic fillet forming particles such as densified polyethersulfone
- the prepreg resin can be loaded with enough fillet forming particles to substantially increase the bonding strength of the resin while at the same time not increasing or decreasing the viscosity of the prepreg resin to unacceptable levels.
- the fillet forming particles dissolve during the curing process to provide the resin with adhesive characteristics that enhance fillet formation between the prepreg and honeycomb. Fillet size and shape are known to be an important consideration in the bonding of face sheets to honeycomb.
- the dissolved fillet forming particles provide toughening of the resin which improves overall bond strength.
- the present invention involves not only the uncured self-adhesive prepregs, but also includes the prepregs after they have been attached to honeycomb and cured to form finished sandwich panels.
- the invention also covers methods for bonding the self-adhesive prepregs to honeycomb in order to form sandwich panels.
- the methods involve forming a self-adhesive prepreg by providing at least one fiber layer and a prepreg resin wherein the prepreg resin is combined with the fiber layer to form a prepreg having a bonding surface which is adapted to be bonded directly to one or both faces of the honeycomb.
- the prepreg resin includes a thermosetting resin, or a combination of thermosetting resins such as epoxy, cyanate ester, bismaleimide, and the like, curing agents and a sufficient amount of viscosity control agent so that the prepreg resin has a viscosity which is sufficiently low to allow the prepreg resin to be combined with the fiber layer to form the prepreg and yet sufficiently high to be largely retained in the fiber layer during curing.
- the step of forming a self-adhesive prepreg further includes the step of incorporating thermoplastic fillet forming particles into the prepreg resin in an amount sufficient to form a bonding surface which is self-adhesive and wherein the fillet forming particles are not dissolved to any substantial degree in the prepreg resin.
- the self- adhesive prepreg is bonded to said honeycomb wherein the bonding involves curing the self-adhesive prepreg for a sufficient time and at a sufficient temperature to substantially dissolve the fillet forming particles.
- the prepregs and finished sandwich panels made in accordance with the present invention may be used in a wide variety of situations where a light weight and structurally strong material is needed.
- the invention is especially well-suited for use in aerospace applications where a multitude of strict mechanical and chemical requirements must be met while at the same time not exceeding weight limitations.
- FIG. 1 is a perspective view of an exemplary honeycomb core and two self- adhesive face sheets prior to bonding together to form the sandwich panel.
- FIG. 2 is a perspective view of an exemplary sandwich panel which has been formed by bonding together the honeycomb core and face sheets shown in FIG. 1
- FIG. 3 is a side view of a portion of the sandwich panel shown in FIG. 2.
- FIG. 4 is a side schematic view showing fillet formation and particle dissolution in accordance with the present invention.
- the prepregs of the present invention are preferably used to form self- adhesive faces sheets which are attached to honeycomb cores to form light weight structural panels for use in aerospace applications.
- a honeycomb sandwich panel is shown generally at 10.
- the sandwich panel 10 includes a honeycomb core 12 which has first and second faces 14 and 16, respectively.
- Uncured self-adhesive prepregs 17 and 19 are applied to the core 12 and then cured to form face sheets 18 and 20 of the finished panel 10 (see FIG. 2).
- the face sheets 18 and 20 are applied directly to the core 12 without a separate adhesive layer.
- Each of the face sheets 18 and 20 are made up of fibers 22 which are embedded in a prepreg resin matrix 24.
- the face sheets are shown as prepregs 17 and 19 prior to application to the honeycomb core 12.
- the honeycomb core 12 can be made from any of the materials which are used to form honeycomb cores.
- Exemplary honeycomb materials include aluminum, aramid, carbon or glass fiber composite materials, resin impregnated papers and the like.
- a preferred honeycomb material is an aramid-based substrate, for example, NOMEX® which is available from E.I. DuPont de Nemours & Company (Wilmington, Delaware).
- NOMEX® which is available from E.I. DuPont de Nemours & Company (Wilmington, Delaware).
- the dimensions of the honeycomb can be varied widely.
- the honeycomb cores will have '/_ to Vz inch (3.2 - 12.7 mm) cells with the cores being l A inch (6.4 mm) to 2 inches (50.8 mm) thick.
- self-adhesive is self-defining in that the prepreg will form a suitable panel without the use of an adhesive layer.
- a peel test is a primary way of verifying that the resultant panel is suitable.
- "self-adhesive" prepregs yield a peel strength (under ASTMD 1781) of 20 in-lb/3 in width or higher (8 pound core), and more preferably yield a peel strength of 28 in-lb/3 in width or higher (8 pound core).
- peel strength specifics are dependent on the type and size of honeycomb used.
- the fibers 22 which are used in the face sheets 18 and 20 can be any of the fiber materials which are used to form composite laminates.
- Exemplary fiber materials include glass, aramid, carbon, ceramic and hybrids thereof.
- the fibers may be woven, unidirectional or in the form of random fiber mat.
- Preferred fiber materials include 193 gsm plain weave carbon fabric with 3K fibers which are commercially available.
- the resins which are combined with the fiber layer to form prepregs in accordance with the present invention include epoxy and/or cyanate ester resins, curing agents, viscosity control agents and thermoplastic fillet forming particles.
- Epoxy or cyanate ester resins are first mixed with viscosity control agents to form a resin mixture. If necessary, the mixture is heated to ensure that viscosity control agents are completely dissolved. Curing agents and fillet forming particles are then added to the resin mixture. The final resin mixture is kept below the temperature at which the fillet forming particles dissolve in the resin.
- the fillet forming particles which at this stage are uniformly mixed throughout the resin are not dissolved to a substantial degree and therefore do not increase the resin viscosity to an unacceptable level.
- the viscosity of the resin mixture is important because it must be such that the resin can be impregnated into the fiber to form the prepreg. For the purposes of this specification, particles which retain at least 90 weight percent of their original particle weight are considered to be not dissolved to a substantial degree. Particles are considered to be substantially dissolved when less than 10 percent by weight of the original particle remains intact within the resin.
- the viscosity of the final resin mixture, including fillet forming particles should be between 150 and 1500 poise. The preferred viscosity is between 300 to 1200 poise.
- the preceding viscosity ranges represent minimum viscosities for the final resin mixture prior to making prepreg when said viscosity is measured by Rheometric Dynamic Analysis (Rheometrics RDA2) at settings of 2°C/min, 10 rads/sec and 0.8-1.0 mm gap.
- the viscosity of the resin mixture gradually increases when the fillet forming particles dissolve during the curing process.
- the fillet forming particles tend to be concentrated toward the surface of the prepreg due to inherent filtering of the particles by the fiber layer.
- the fillet forming particles may be applied (e.g., by powder deposition) to the surface of the resin after it has been formed into a prepreg film or after the resin has been impregnated into the fiber layer. In this way, the fillet forming particles are distributed substantially on the surface of the prepreg. In either case, the resin temperature is maintained at a sufficiently low level to prevent fillet forming particles from dissolving until the prepreg is applied to the core material and cured.
- the prepreg is heated to a sufficient level to substantially dissolve the fillet forming particles.
- the dissolving of the particles during the curing process was found to control the flow of resin at the prepreg-core interface to promote fillet formation.
- the dissolved thermoplastic particles enhance the toughness of the bond. Fillet size and shape have long been known to be an important aspect of bond formation between honeycomb core and adhesively bonded face sheets.
- the uncured face sheet 17 is shown in position against the face 14 of one wall of the honeycomb 12.
- the prepreg 17 includes a fiber layer 22 which has been combined with the prepreg resin to form a prepreg resin layer 30 which includes a bonding surface 32 which is adapted to be bonded directly to the honeycomb 12 at face 14.
- the thermoplastic fillet forming particles 34 are shown being distributed preferentially on the outer faces of the face sheet 17. It will be noted by those skilled in the art that the fibers and particles are not shown to scale in FIG. 4. Typically, the diameter of the fibers 22 will be much smaller than the thermoplastic particles 34.
- the prepreg 30 is cured at elevated temperature to form the single ply face sheet 18.
- the cured face sheet 18 includes a cured prepreg resin matrix 38 in which the thermoplastic fillet forming particles are substantially dissolved.
- the viscosity of the prepreg resin increases so as to form fillets 40 and 42.
- the fillets 40 and 42 are preferably sized so that the "A" dimension (parallel to the prepreg face sheet) is approximately equal to the "B" dimension (perpendicular to the face sheet).
- the length of dimensions A and B are preferably maximized as much as possible in order to achieve optimum bond strength for a given resin.
- resins having a viscosity which is too low during the curing process will produce fillets wherein the B dimension is relatively large and the A dimension is very small. Such fillet shapes do not provide good bonding.
- the B dimension of the fillet is unacceptably small so that adequate bonding is not achieved.
- thermoplastic fillet forming particles in the resin matrix provides the appropriate resin viscosity during the curing process, such that fillets were formed where dimensions A and B were equivalent and sufficiently large to provide good bonding.
- the gradual dissolving of the fillet forming particles during the curing process provides a gradual increase in resin viscosity which enhances fillet formation.
- the gradually dissolving thermoplastic particles control the flow of the resin at the honeycomb surface 14 so that fillets of the type shown in FIG. 4 at 40 and 42 are formed.
- thermosetting resins which may be used to make the prepreg resin include epoxy, cyanate ester and bismaleimide resins.
- Exemplary epoxy and cyanate ester resins include glycidylamine type epoxy resins, such as triglycidyl-p- aminophenol, tetraglycidyldiaminodiphenyl-methane; glycidyl ether type epoxy resins, such as bisphenol A type epoxy resins, bisphenol F type epoxy resins, bisphenol S type epoxy resins, phenol novolak type epoxy resins, cresol novolak type epoxy resins and resorcinol type epoxy resins; cyanate esters, such as 1,1'- bis(4-cyanatophenyl) ethane (AroCy L-10, available from Vantico, Inc., Brewster, NY), 1,3 -Bis (4-cyanateophenyl-l-l-(l-methylethylidene) benzene (RTX366, available from Vantico, Inc., Brewster, NY). Epoxy resins are preferred. Especially preferred epoxy blends include a mixture of
- Curing agents and viscosity control agents are also added to the thermosetting resin to form the basic prepreg resin.
- the curing agent is preferably an amine curing agent and the viscosity control agent is preferably a thermoplastic material which dissolves in the thermosetting resin.
- thermoplastic fillet forming particles in a wide variety of prepreg resins to enhance formation of fillets between the face sheets and honeycomb core
- prepreg resins based on epoxy and cyanate ester formulations are preferred.
- the following examples and description will be limited to epoxy formulations with it being understood that the bonding between other prepreg face sheets and honeycomb core may be improved by incorporating the thermoplastic fillet forming particles of the present invention into the prepreg face sheet.
- this description will be limited to a discussion of sandwich panels which have two prepreg plies on each face of the honeycomb.
- the two layers are preferably either two (0/90) plies or two ( ⁇ 45, 0/90) plies with warp direction aligned with the lengthwise direction of the honeycomb.
- Those of ordinary skill in the art will recognize that the present invention is also applicable to multiple ply face sheets which include two or more fiber layers.
- Exemplary preferred prepreg resin formulations are as follows: ⁇ 1 to 70 parts by weight of an epoxy; 5 to 40 parts by weight of an amine curing agent;
- thermoplastic fillet forming particles 5 to 50 parts by weight of thermoplastic fillet forming particles.
- thermoplastic fillet forming particles 8 to 30 parts by weight of thermoplastic fillet forming particles.
- the epoxy may be composed of trifunctional epoxy, difunctional epoxy and a wide variety of combinations of trifunctional and difunctional epoxies. Tetrafunctional epoxies may also be used.
- Exemplary trifunctional epoxy include triglycidyl p-aminophenol and N,N-Diglycidyl-4-glycidyloxyaniline (MY-0510 or MY-0500 available from Vantico, Inc., Brewster, NY).
- Exemplary difunctional epoxies which may be used in the resin include Bis-F epoxies, such as GY-281, LY- 9703 and GY-285 which are available from Vantico, Inc., Brewster, NY).
- Bis-A epoxies such as GY-6010 (Vantico, Inc., Brewster, NY) and DER 331 (Dow Chemical, Midland, MI) are suitable Bisphenol-A type epoxies and may also be used.
- An exemplary tetrafunctional epoxy is tetraglycidyl diaminodiphenyl methane (MY-721, MY-720 and MY-9512 available from Vantico, Inc., Brewster, NY).
- Other suitable epoxies include phenol novolak type epoxy, cresol novolak epoxy and resorcinol type epoxy.
- Preferred bis-F epoxies include GY281 and GY285 which are available from Vantico, Inc., Brewster, NY.
- Exemplary curative agents include dicyandiamide, 3,3-diamino- diphenylsulfone (3,3-DDS), amino or glycidyl-silanes such as 3-amino propyltriethoxysilane, CuAcAc/Nonylphenol (1/0.1), 4,4'-diaminodiphenylsulfone (4,4'-DDS), 4,4'-methylenebis(2-isopropyl-6-methylaniline), e.g., Lonzacure M- MIPA (Lonza Corporation, Fair Lawn, NJ), 4,4'-methylenebis(2,6- diisopropylaniline), e.g., Lonzacure M-DIPA (Lonza Corp., Fair Lawn, NJ).
- Dicyandiamide and 3,3-DDS are preferred curative agents. Especially preferred are combinations of 3,3-DDS and dicyandiamide.
- Exemplary viscosity control agents include thermoplastic polyetherimides such as ULTEM® 1000P which is available from General Electric (Pittsfield, MA); micronized polyethersulfone such as 5003P, which is available from Sumitomo Chemical Co., Ltd. (Osaka, Japan); HRI-1, which is available from Hexcel Corp. (Dublin, CA); and polyimide MATRJMID® 9725, which is available from Vantico, Inc. (Brewster, NY).
- ULTEM® 1000P and micronized PES are preferred. Micronized PES is especially preferred.
- the amount and type of viscosity control agent which is added to the epoxy resin mixture may be varied provided that the minimum viscosity of the final resin mixture is maintained between 150 and 1500 poise when said viscosity is measured by Rheometric Dynamic Analysis (Rheometrics RDA2) at settings of 2°C/mni, 10 rads/sec and 0.8-1.0 mm gap. As previously mentioned, mixtures with minimum viscosities of between 300 to 1200 poise are preferred.
- the viscosity of the prepreg resin prior to addition of the fillet forming particles should be between about 50 poise and 2000 poise at room temperature. The preferred viscosity range is 100 poise to 1500 poise at room temperature.
- Densified polyethersulfone (PES) and densified polyetherimide particles may be used as suitable fillet forming particles. Densified PES particles are preferred.
- the densified polyethersulfone (PES) particles are preferably made in accordance with the teachings of United States Patent No. 4,945, 154, the contents of which is hereby incorporated by reference.
- the average particle size of the PES particles range from 1 to 150 microns. Average particle sizes of 1 to 50 microns are preferred and average particle sizes of 10 to 25 microns are particularly preferred.
- the microspheres are generally spherical in shape and are classified by passing the densified microsphere powder through a micron sieve.
- the glass transition temperature (Tg) for the particles be above 200°C.
- the PES is "micronized.” Micronized PES refers to PES particles which have a rough surface configuration which is produced by grinding the particles or other abrasive techniques of manufacture which are known in the art. Micronized PES particles may also be made by spraying and drying procedures which are also known in the art. Micronized PES particles are preferably less than 120 microns in size. Especially preferred are particles under 50 microns in size with a range of 10 to 25 microns being particularly preferred. [0037] The prepreg resin is made by first mixing the epoxy components together and then slowly adding the polyetherimide or micronized PES viscosity control agents.
- the resulting mixture is heated to around 130°C and mixed for a sufficient time to dissolve the polyetherimide/PES particles. Once the polyetherimide/PES is dissolved, the mixture is cooled to around 75°C. The aromatic amine curing agent and the fillet forming densified PES particles are then added to the mixture.
- the resin should be kept at temperatures below about 70°C-75°C while the curative agent and densified PES particles are being mixed into the resin.
- the final resin has a minimum viscosity of between 150 to 1500 poise when said viscosity is measured by Rheomerric Dynamic Analysis (Rheometrics RDA2) at settings of 2°C/min, 10 rads/sec and 0.8-1.0 mm gap.
- the preferred viscosity range is 300 to 1200 poise.
- the finished resin is applied to the desired fabric to form a prepreg.
- the resin content of the prepreg may be varied depending upon a number of different parameters in order to achieve desired mechanical and structural properties for the sandwich panel. It is preferred that the prepreg have a resin content of 35-45 weight percent.
- the prepreg is bonded to the faces of the honeycomb core using vacuum and/or pressure and heat to cure the prepreg and form face sheets which are securely bonded to the honeycomb.
- the amount of vacuum, pressure and heat required to cure and bond the prepreg to the honeycomb may be varied depending upon the particular resin formulation and the amount of resin in the prepreg. In general, sufficient pressure must be applied to the prepreg to ensure that the resin flows into the honeycomb cells a sufficient amount to provide adequate fillet formation and bonding.
- the temperature and other curing conditions are selected such that the densified PES particles are substantially dissolved during the curing process. It has also been found that panels made with the inventive self-adhesive provide excellent resistance to core crush. For example, panels of the type set forth in Examples 1 and 2 exhibit essentially 0% core crush. Other conventional aviation panels utilizing 3K carbon fabric prepregs in accordance with the present invention will also show improved resistance to core crushing. Even panels made utilizing 12K carbon fabric prepreg in accordance with the present invention will produce panels which exhibit only 5% core crush. [0041] Examples of practice are as follows:
- the densified PES was made from PES 5003P which is available from Sumitomo Chemical Co. Ltd. (Osaka, Japan).
- the PES was densified in accordance with U.S. Patent No. 4,945,154.
- MY0510 and GY281 were first mixed in a mixing vessel, heated to 70°C for approximately 10 minutes.
- the ULTEM® 1000P particles were then added and the resulting mixture heated to 130°C with mixing for approximately 75 minutes to fully dissolve the ULTEM® 1000P particles.
- the mixture was then cooled to 75°C and the 3,3-DDS was mixed in for about 15 minutes.
- the densified PES was slowly added and mixed in for approximately 10 minutes to provide the final resin mixture.
- the viscosity of the homogeneous resin was measured over the entire curing temperature range (i.e., 20°C to 177°C) using Rheometric Dynamic Analysis as previously described.
- the resin had a minimum viscosity of 900 poise.
- Panels were prepared by first forming a prepreg of 193 gsm 3K PW fabric containing 138 grams of resin square meter.
- the prepreg was formed as follows: [0045] The resin was coated on release paper by reverse roller at about 175°F (79°C) to form a film containing 69 g/m 2 . Two resin films were impregnated into the carbon fiber with an areal weight of 193 g/m 2 .
- the prepreg was applied to HRH® 10 core having V% inch (0.31 cm) cells and being V ⁇ inch (1.27 cm) thick under vacuum at 22 inches (56 cm) Hg and cured for 2 hours at 177°C with a pressure of 45 psi, venting at 20 psi and ramp cooling at a rate of 2°C per minute.
- the minimum viscosity of the homogeneous resin mixture was found to be about 500 poise.
- the viscosity of the final resin mixture was measured as set forth in Example 1.
- the final resin mixture was used to form a prepreg and applied to HRH® 10 core in the same manner as Example 1.
- the peel strength of the resulting face sheet was 26 in-lb/3 in width.
- Resin was prepared having the following formulation: 27.0 weight percent MY-0510 (N,N-Diglycidyl-4-glycidyloxyaniline) 24.9 weight percent GY285 (bis-F epoxy) 15.8 weight percent 3,3'-Diaminodiphenylsulfone 1.3 weight percent Dicyandiamide 13.5 weight percent micronized Polyethersulfone (PES) 17.5 weight percent densified Polyethersulfone (PES) [0051] Resin formulations in accordance with this example may also be made wherein the amounts of MY-510, GY281 and 3,3-DDS are varied by up to ⁇ 15%. Also, the amounts of both types of PES may be varied by as much as + 40%. The amount of dicyandiamide may be varied by up to ⁇ 50%.
- the densified PES was the same as used in Examples 1 and 2. Average particle size was 10-25 microns with no more than 13 weight percent smaller than 5 microns and no more than 4 weight percent greater than 40 microns.
- 24.9 parts by weight of GY285 and 6.0 parts by weight of MY0510 were mixed in a resin kettle and heated, with stirring, to 65°C. Once this temperature is attained, 13.5 parts by weight micronized PES 5003P is added to the resin kettle. The mixture is then heated to 128 ⁇ 2°C and held at this temperature for 75 minutes. At the end of 75 minutes, heating is removed and 21 parts by weight of MY0510 are added to the kettle. Stirring is continued as the mixture cools to 65°C.
- the resin was coated on release paper by reverse-roll coater at about 165°F (74°C) to form a film containing 70 g/m 2 .
- the resin film was impregnated into a carbon fiber fabric having an areal weight of 193 g m " .
- the prepreg was then applied to HRH® 10 core and cured in the same manner as Example 1.
- the peel strength was around 32 in-lb/3 in width on 3 pound core and around 31 in-lb/3 in width on 8 pound core.
- Resin was prepared as follows:
- the minimum viscosity of the resin was measured as set forth in Example 1 and found to be 123 poise.
- Prepregs and sandwich panels were prepared in the same manner as the preceding examples.
- the peel strength for the resulting face sheets was 20 in-lb/3 in width.
- the minimum viscosity of the resin was measured as set forth in Example 1 and found to be about 30 poise. [0059] Prepregs and sandwich panels were prepared in accordance with the preceding examples. The peel strength was 13 in-lb/3 in width.
- Resin was prepared following the same procedure as the previously described Comparative Examples except that the ingredients were as follows:
- the minimum viscosity of this resin was measured as set forth in Example 1 and found to be 3187 poise.
- the resulting prepreg had low tack and poor draping properties because the viscosity was too high.
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Laminated Bodies (AREA)
- Reinforced Plastic Materials (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU2002228697A AU2002228697B2 (en) | 2001-02-27 | 2001-11-14 | Adhesive prepreg face sheets for sandwich panels |
JP2002568654A JP4175894B2 (en) | 2001-02-27 | 2001-11-14 | Adhesive prepreg sheet for sandwich panels |
CA2439361A CA2439361C (en) | 2001-02-27 | 2001-11-14 | Adhesive prepreg face sheets for sandwich panels |
EP01989821A EP1419207A4 (en) | 2001-02-27 | 2001-11-14 | Adhesive prepreg face sheets for sandwich panels |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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US09/795,177 | 2001-02-27 | ||
US09/795,177 US6508910B2 (en) | 2000-05-18 | 2001-02-27 | Self-adhesive prepreg face sheet for sandwich panels |
Publications (1)
Publication Number | Publication Date |
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WO2002068555A1 true WO2002068555A1 (en) | 2002-09-06 |
Family
ID=25164915
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/US2001/045309 WO2002068555A1 (en) | 2001-02-27 | 2001-11-14 | Adhesive prepreg face sheets for sandwich panels |
Country Status (5)
Country | Link |
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EP (1) | EP1419207A4 (en) |
JP (2) | JP4175894B2 (en) |
AU (1) | AU2002228697B2 (en) |
CA (1) | CA2439361C (en) |
WO (1) | WO2002068555A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005105267A (en) * | 2003-09-26 | 2005-04-21 | Hexcel Corp | Heat-settable resin |
WO2016177685A1 (en) * | 2015-05-05 | 2016-11-10 | Tesa Se | Adhesive strip having a temporary fixing adhesive |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007537331A (en) * | 2004-05-14 | 2007-12-20 | サイテク・テクノロジー・コーポレーシヨン | Self-adhesive prepreg |
JP4972865B2 (en) * | 2005-03-09 | 2012-07-11 | 横浜ゴム株式会社 | Process for producing resin composition for self-adhesive prepreg |
JP4765399B2 (en) * | 2005-05-18 | 2011-09-07 | 横浜ゴム株式会社 | Epoxy resin composition |
JP4141478B2 (en) | 2006-04-25 | 2008-08-27 | 横浜ゴム株式会社 | Epoxy resin composition for fiber reinforced composite materials |
CN102216394A (en) * | 2008-11-13 | 2011-10-12 | 东邦特耐克丝株式会社 | Thermosetting resin composition and prepreg utilizing same |
ES2655906T3 (en) | 2009-09-25 | 2018-02-22 | The Yokohama Rubber Co., Ltd. | Composition of thermosetting resin, composition of thermosetting resin for fiber reinforced composite material, prepreg that uses the same, and honeycomb sandwich panel |
JP7200928B2 (en) | 2018-02-27 | 2023-01-10 | 東レ株式会社 | Thermosetting resin compositions, prepregs and fiber-reinforced composites |
JP7200996B2 (en) * | 2018-03-30 | 2023-01-10 | 東レ株式会社 | Benzoxazine resin composition, prepreg, and fiber-reinforced composite material |
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US2952579A (en) * | 1955-07-14 | 1960-09-13 | Martin Co | Honeycomb sandwich panel structure and method of making same |
US3530087A (en) * | 1967-02-21 | 1970-09-22 | Ciba Ltd | Adhesive compositions of polyepoxide and polysulfones |
US3607518A (en) * | 1969-12-12 | 1971-09-21 | Daniel H Ellinor | Method of producing expanded double-faced honeycomb panels |
US5368922A (en) * | 1990-01-19 | 1994-11-29 | Minnesota Mining And Manufacturing Company | Prepreg of thermoplastic polymer particles in liquid thermosettable resin |
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EP0351028A3 (en) * | 1988-07-15 | 1991-10-23 | Amoco Corporation | Resin particle-filled, fiber-reinforced composites |
JPH0639519B2 (en) * | 1988-12-02 | 1994-05-25 | 東邦レーヨン株式会社 | Epoxy resin composition and prepreg |
EP0392348A3 (en) * | 1989-04-14 | 1991-12-27 | Cytec Technology Corp. | Toughened thermosetting structural materials |
JP3602228B2 (en) * | 1995-11-09 | 2004-12-15 | 横浜ゴム株式会社 | Epoxy resin composition |
JP3483684B2 (en) * | 1995-11-24 | 2004-01-06 | 横浜ゴム株式会社 | Epoxy resin composition |
WO1997024398A1 (en) * | 1995-12-27 | 1997-07-10 | Hexcel Corporation | Epoxy resin(s) with curing agent and toughener |
US6045898A (en) * | 1996-02-02 | 2000-04-04 | Toray Industried, Inc. | Resin compositions for fiber-reinforced composite materials and processes for producing the same, prepregs, fiber-reinforced composite materials, and honeycomb structures |
DE19612211C2 (en) * | 1996-03-27 | 2000-05-25 | Isola Ag | Sandwich structure |
US6429157B1 (en) * | 1997-07-11 | 2002-08-06 | Toray Industries, Inc. | Prepreg fabric and honeycomb sandwich panel |
JP3958471B2 (en) * | 1999-07-22 | 2007-08-15 | 東邦テナックス株式会社 | Epoxy resin composition for self-adhesive surface material and prepreg |
US6508910B2 (en) * | 2000-05-18 | 2003-01-21 | Hexcel Corporation | Self-adhesive prepreg face sheet for sandwich panels |
-
2001
- 2001-11-14 WO PCT/US2001/045309 patent/WO2002068555A1/en not_active Application Discontinuation
- 2001-11-14 AU AU2002228697A patent/AU2002228697B2/en not_active Ceased
- 2001-11-14 EP EP01989821A patent/EP1419207A4/en not_active Withdrawn
- 2001-11-14 JP JP2002568654A patent/JP4175894B2/en not_active Expired - Fee Related
- 2001-11-14 CA CA2439361A patent/CA2439361C/en not_active Expired - Fee Related
-
2006
- 2006-06-01 JP JP2006153127A patent/JP2006291218A/en active Pending
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US2952579A (en) * | 1955-07-14 | 1960-09-13 | Martin Co | Honeycomb sandwich panel structure and method of making same |
US3530087A (en) * | 1967-02-21 | 1970-09-22 | Ciba Ltd | Adhesive compositions of polyepoxide and polysulfones |
US3607518A (en) * | 1969-12-12 | 1971-09-21 | Daniel H Ellinor | Method of producing expanded double-faced honeycomb panels |
US5368922A (en) * | 1990-01-19 | 1994-11-29 | Minnesota Mining And Manufacturing Company | Prepreg of thermoplastic polymer particles in liquid thermosettable resin |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005105267A (en) * | 2003-09-26 | 2005-04-21 | Hexcel Corp | Heat-settable resin |
JP4700311B2 (en) * | 2003-09-26 | 2011-06-15 | ヘクセル コーポレイション | Thermoset resin |
WO2016177685A1 (en) * | 2015-05-05 | 2016-11-10 | Tesa Se | Adhesive strip having a temporary fixing adhesive |
US10287461B2 (en) | 2015-05-05 | 2019-05-14 | Tesa Se | Adhesive strip having a temporary fixing adhesive |
Also Published As
Publication number | Publication date |
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JP2006291218A (en) | 2006-10-26 |
EP1419207A1 (en) | 2004-05-19 |
JP2005506394A (en) | 2005-03-03 |
EP1419207A4 (en) | 2005-05-04 |
AU2002228697B2 (en) | 2006-03-02 |
CA2439361A1 (en) | 2002-09-06 |
JP4175894B2 (en) | 2008-11-05 |
CA2439361C (en) | 2011-10-18 |
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