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WO2001050814A8 - Microphone assembly with jfet flip-chip buffer for hearing aid - Google Patents

Microphone assembly with jfet flip-chip buffer for hearing aid

Info

Publication number
WO2001050814A8
WO2001050814A8 PCT/US2000/000252 US0000252W WO0150814A8 WO 2001050814 A8 WO2001050814 A8 WO 2001050814A8 US 0000252 W US0000252 W US 0000252W WO 0150814 A8 WO0150814 A8 WO 0150814A8
Authority
WO
WIPO (PCT)
Prior art keywords
hearing aid
jfet
flip
microphone assembly
chip buffer
Prior art date
Application number
PCT/US2000/000252
Other languages
French (fr)
Other versions
WO2001050814A1 (en
Inventor
Peter Madaffari
Walter P Sjursen
Christopher Poux
Richard Moroney
Ponnusamy Palanisamy
Original Assignee
Sarnoff Corp
Tibbetts Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sarnoff Corp, Tibbetts Industries filed Critical Sarnoff Corp
Priority to PCT/US2000/000252 priority Critical patent/WO2001050814A1/en
Publication of WO2001050814A1 publication Critical patent/WO2001050814A1/en
Publication of WO2001050814A8 publication Critical patent/WO2001050814A8/en

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/01—Electrostatic transducers characterised by the use of electrets
    • H04R19/016—Electrostatic transducers characterised by the use of electrets for microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R25/00—Deaf-aid sets, i.e. electro-acoustic or electro-mechanical hearing aids; Electric tinnitus maskers providing an auditory perception
    • H04R25/60—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles
    • H04R25/604—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles of acoustic or vibrational transducers

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Neurosurgery (AREA)
  • Otolaryngology (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Amplifiers (AREA)

Abstract

A hearing aid microphone module housing all the electronic components needed for a functional hearing aid other than the battery and receiver is described which uses flip-chip technology to couple a JFET buffer to the components. The buffer is disposed on a PCB which defines a back volume of the housing.
PCT/US2000/000252 2000-01-06 2000-01-06 Microphone assembly with jfet flip-chip buffer for hearing aid WO2001050814A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/US2000/000252 WO2001050814A1 (en) 2000-01-06 2000-01-06 Microphone assembly with jfet flip-chip buffer for hearing aid

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2000/000252 WO2001050814A1 (en) 2000-01-06 2000-01-06 Microphone assembly with jfet flip-chip buffer for hearing aid

Publications (2)

Publication Number Publication Date
WO2001050814A1 WO2001050814A1 (en) 2001-07-12
WO2001050814A8 true WO2001050814A8 (en) 2001-12-27

Family

ID=21740947

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2000/000252 WO2001050814A1 (en) 2000-01-06 2000-01-06 Microphone assembly with jfet flip-chip buffer for hearing aid

Country Status (1)

Country Link
WO (1) WO2001050814A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7142682B2 (en) 2002-12-20 2006-11-28 Sonion Mems A/S Silicon-based transducer for use in hearing instruments and listening devices
EP1903834A1 (en) * 2006-09-22 2008-03-26 Siemens Audiologische Technik GmbH Hearing device with a magnetic field sensor and method of mounting electronic elements on a circuit

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4764690A (en) * 1986-06-18 1988-08-16 Lectret S.A. Electret transducing
DE3807251A1 (en) * 1988-03-05 1989-09-14 Sennheiser Electronic CAPACITIVE SOUND CONVERTER
US5596222A (en) * 1994-08-12 1997-01-21 The Charles Stark Draper Laboratory, Inc. Wafer of transducer chips
NL1002783C2 (en) * 1996-04-03 1997-10-06 Microtronic Nederland Bv Integrated microphone / amplifier unit, and amplifier module therefor.
US5856914A (en) * 1996-07-29 1999-01-05 National Semiconductor Corporation Micro-electronic assembly including a flip-chip mounted micro-device and method

Also Published As

Publication number Publication date
WO2001050814A1 (en) 2001-07-12

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