WO2000026152A1 - High dielectric constant buried capacitors with extended operating temperature ranges - Google Patents
High dielectric constant buried capacitors with extended operating temperature ranges Download PDFInfo
- Publication number
- WO2000026152A1 WO2000026152A1 PCT/US1999/026212 US9926212W WO0026152A1 WO 2000026152 A1 WO2000026152 A1 WO 2000026152A1 US 9926212 W US9926212 W US 9926212W WO 0026152 A1 WO0026152 A1 WO 0026152A1
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- WIPO (PCT)
- Prior art keywords
- capacitor
- lead
- molar percent
- mixture
- dielectric
- Prior art date
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- 239000003990 capacitor Substances 0.000 title claims abstract description 46
- 239000000203 mixture Substances 0.000 claims abstract description 43
- NKZSPGSOXYXWQA-UHFFFAOYSA-N dioxido(oxo)titanium;lead(2+) Chemical compound [Pb+2].[O-][Ti]([O-])=O NKZSPGSOXYXWQA-UHFFFAOYSA-N 0.000 claims abstract description 10
- ZBSCCQXBYNSKPV-UHFFFAOYSA-N oxolead;oxomagnesium;2,4,5-trioxa-1$l^{5},3$l^{5}-diniobabicyclo[1.1.1]pentane 1,3-dioxide Chemical compound [Mg]=O.[Pb]=O.[Pb]=O.[Pb]=O.O1[Nb]2(=O)O[Nb]1(=O)O2 ZBSCCQXBYNSKPV-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000000843 powder Substances 0.000 claims description 25
- 239000011521 glass Substances 0.000 claims description 14
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 239000002019 doping agent Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 239000004332 silver Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 6
- 230000004907 flux Effects 0.000 claims description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 4
- 229910052746 lanthanum Inorganic materials 0.000 claims description 4
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 claims description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 3
- VTLYFUHAOXGGBS-UHFFFAOYSA-N Fe3+ Chemical compound [Fe+3] VTLYFUHAOXGGBS-UHFFFAOYSA-N 0.000 claims description 3
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims description 3
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052787 antimony Inorganic materials 0.000 claims description 3
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims description 3
- 229910052788 barium Inorganic materials 0.000 claims description 3
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 claims description 3
- 229910052797 bismuth Inorganic materials 0.000 claims description 3
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 3
- 229910052804 chromium Inorganic materials 0.000 claims description 3
- 239000011651 chromium Substances 0.000 claims description 3
- 229910001447 ferric ion Inorganic materials 0.000 claims description 3
- 229910052700 potassium Inorganic materials 0.000 claims description 3
- 239000011591 potassium Substances 0.000 claims description 3
- 229910052708 sodium Inorganic materials 0.000 claims description 3
- 239000011734 sodium Substances 0.000 claims description 3
- 229910052810 boron oxide Inorganic materials 0.000 claims description 2
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 claims description 2
- 229910000464 lead oxide Inorganic materials 0.000 claims description 2
- YEXPOXQUZXUXJW-UHFFFAOYSA-N oxolead Chemical compound [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 claims description 2
- 239000000377 silicon dioxide Substances 0.000 claims description 2
- 239000011787 zinc oxide Substances 0.000 claims description 2
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 claims 2
- 239000000976 ink Substances 0.000 abstract description 17
- 239000000919 ceramic Substances 0.000 abstract description 5
- 238000010304 firing Methods 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 239000002270 dispersing agent Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 239000001856 Ethyl cellulose Substances 0.000 description 2
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 2
- 229910003781 PbTiO3 Inorganic materials 0.000 description 2
- WMWLMWRWZQELOS-UHFFFAOYSA-N bismuth(III) oxide Inorganic materials O=[Bi]O[Bi]=O WMWLMWRWZQELOS-UHFFFAOYSA-N 0.000 description 2
- LQZZUXJYWNFBMV-UHFFFAOYSA-N dodecan-1-ol Chemical compound CCCCCCCCCCCCO LQZZUXJYWNFBMV-UHFFFAOYSA-N 0.000 description 2
- 235000019325 ethyl cellulose Nutrition 0.000 description 2
- 229920001249 ethyl cellulose Polymers 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011877 solvent mixture Substances 0.000 description 2
- IIZPXYDJLKNOIY-JXPKJXOSSA-N 1-palmitoyl-2-arachidonoyl-sn-glycero-3-phosphocholine Chemical compound CCCCCCCCCCCCCCCC(=O)OC[C@H](COP([O-])(=O)OCC[N+](C)(C)C)OC(=O)CCC\C=C/C\C=C/C\C=C/C\C=C/CCCCC IIZPXYDJLKNOIY-JXPKJXOSSA-N 0.000 description 1
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910000416 bismuth oxide Inorganic materials 0.000 description 1
- 238000010344 co-firing Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- TYIXMATWDRGMPF-UHFFFAOYSA-N dibismuth;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Bi+3].[Bi+3] TYIXMATWDRGMPF-UHFFFAOYSA-N 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 235000010445 lecithin Nutrition 0.000 description 1
- 239000000787 lecithin Substances 0.000 description 1
- 229940067606 lecithin Drugs 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 230000002277 temperature effect Effects 0.000 description 1
- 229940116411 terpineol Drugs 0.000 description 1
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- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/495—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on vanadium, niobium, tantalum, molybdenum or tungsten oxides or solid solutions thereof with other oxides, e.g. vanadates, niobates, tantalates, molybdates or tungstates
- C04B35/497—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on vanadium, niobium, tantalum, molybdenum or tungsten oxides or solid solutions thereof with other oxides, e.g. vanadates, niobates, tantalates, molybdates or tungstates based on solid solutions with lead oxides
- C04B35/499—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on vanadium, niobium, tantalum, molybdenum or tungsten oxides or solid solutions thereof with other oxides, e.g. vanadates, niobates, tantalates, molybdates or tungstates based on solid solutions with lead oxides containing also titanates
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- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
Definitions
- This invention relates to high dielectric constant capacitors having extended operating temperature ranges and low temperature coefficient of capacitance (TCC) that are embedded in multilayer ceramic printed circuit boards.
- Low temperature firing multilayer ceramic circuit boards are known that are suitable for use with low melt temperature conductive metals, such as silver, gold and copper. They have a low thermal coefficient of expansion (TCE) and they may be formulated to be compatible with both silicon and gallium arsenide devices .
- TCE thermal coefficient of expansion
- These ceramic circuit boards are made from glasses that can be fired at low temperatures of less than 1000°C.
- the circuit boards are made by admixing finely divided selected glass particles or powders, and optional inorganic fillers, with an organic vehicle including resin, solvents, dispersants and the like.
- the resultant slurry is cast as a thin tape, called green tape.
- a circuit pattern may be screen printed onto the green tape using a conductive ink formulation of a conductive metal powder, e.g., of silver, an organic vehicle and a powdered glass, generally the same glass as that used to make the green tape .
- a plurality of green tapes having printed circuits thereon can be stacked together.
- via holes are punched into each green tape and the vias are filled with a conductive via fill ink to connect the circuits electrically.
- the green tapes are then aligned, laminated under heat and pressure and then fired to remove the organic materials and to vitrify the glass.
- Recently the green tapes have been supported on a metal support substrate to add mechanical strength to the fired green tape stack.
- An added advantage to this improvement is that bonding glasses used to adhere the green tape stack to the support substrate have been found to reduce shrinkage of the green tapes in the x and y dimensions. Thus almost all of the shrinkage occurs in the z dimension and thus reduces the tolerances required between the various circuits and contacts .
- embedded components such as capacitors and resistors
- PMN Lead magnesium niobate
- Fig. 1 illustrates the dramatic change in dielectric permittivity for PMN with temperature over the temperature range of 20-140°C, measured at 10 KHz.
- Fig. 1 shows that the permittivity of PMN decreases steadily with an increase in temperature.
- the loss tangent of buried capacitors made with PMN falls rapidly between 20-60°C and continues to decline thereafter as the temperature increases.
- the dielectric constant of these capacitors is generally quite high, which is very desirable.
- a method of reducing the temperature dependence of PMN dielectric properties while retaining their high dielectric constant, would be highly desirable.
- Fig. 1 is a graph of dielectric permittivity versus temperature of a thick film capacitor made from commercial PMN powders .
- Fig. 2 is a graph of loss tangent versus temperature of a capacitor made from the commercially available PMN powder.
- Fig. 3 is a graph of dielectric permittivity versus temperature of PMN-based powder mixtures of the invention.
- Fig. 4 is a graph of loss tangent versus temperature of PMN-based powder mixtures of the invention.
- Capacitor ink formulations based on PMN dielectrics are • known that have been mixed with a bismuth trioxide flux and a glass, together with a suitable organic vehicle so that the resultant capacitor ink can be screen printed onto a glass- based green tape.
- the above capacitor composition can be cast as a green tape layer by suitable adjustment of the organic vehicle.
- the capacitors are completed by screen printing silver electrodes on either side of the capacitor layer or green tape layer and electrically connecting the layers. These capacitors are sinterable below 900°C. These layers are connected together in parallel by means of suitable via fill inks. The capacitance of the multiple layer capacitors then add, permitting the formation of very high value capacitors. Their losses are very low.
- Various mixtures of PMN and relaxor based ferroelectric powders were made having the following compositions. The compositions in molar percent, and their Curie temperatures are given below in Table I .
- the Curie temperature of the powders varies widely from a low of -12°C up to 180°C.
- Thick film capacitor inks were prepared from mixtures A to D in conventional manner, mixing at least two of the mixtures with a glass and an organic vehicle comprising a resin binder and a solvent. Equal parts of 10 parts each of two of the above mixtures were mixed with 1.154 parts of bismuth trioxide as a flux; 0.865 part of a low melt temperature glass comprising less than 2% by weight of BaO, over 5.0% by weight of boron oxide, over 70% by weight of lead oxide, less than 2.0% by weight of silica and over 12.0% by weight of zinc oxide; 0.44 part of Hypermer PS2 , a dispersant of ICI Americas, Inc; and 6.25 parts of a resin-solvent mixture comprising 9.4 parts of ethyl cellulose having a molecular weight of 300, 18.8 parts of ethyl cellulose having a molecular weight of 14, 133 parts of butyl carbitol and 88.8 parts of dodecanol .
- Buried or embedded capacitors were made by screen printing a capacitor ink onto a green tape stack on a metal support substrate one or two layers beneath the top of the stack.
- the capacitors were terminated by screen printing a conductive layer, such as silver, over and under the dielectric capacitor ink layer.
- a suitable conductive ink is made from, in % by weight, 20.55% of silver powder, 61.64% of silver flake, available from the Degussa Corporation, 0.55% of the above glass, 0.16% of bismuth oxide flux, 2.06% of a dispersant, and a solvent of 50% lecithin in terpineol and 15.04% of the resin-solvent mixture described above for capacitor inks .
- Capacitor test structures were made in three different sizes; 50 mil square, 100 mil square and 200 mil square. The samples were fired at a peak temperature of 915°C for 30 minutes on a belt furnace. Fig. 3 illustrates the variation in dielectric permittivity of the various mixtures A to D versus temperature .
- Fig. 4 illustrates the variation in % loss tangent of the mixtures A to D versus temperature. Comparing the results with Fig. 2, it is apparent that the loss tangents of the mixtures of the invention are all higher than that of PMN alone up to about 100°C.
- the dielectric permittivity remains much higher up to higher temperatures and the temperature at which low loss tangent decreases is also higher, as compared to a commercial PMN powder.
- a mixture of PMN and PbTi0 3 containing from about 98 to 50 molar percent of PMN and 2 to 50 molar percent of lead titanate work well.
- a small amount, up to about 5 molar percent, of a dopant can also be added to further adjust the Curie temperature.
- Suitable dopants include lanthanum, sodium, potassium, bismuth, antimony, ferric ion, aluminum, chromium and barium.
- the capacitor inks can be screen printed onto green tapes particularly formulated for co-firing onto particular metal support substrates, as is known.
- a conductor ink is screen printed onto green tapes to form layers underlying and overlying the capacitor layer. These layers are aligned with a green tape stack and at least one green tape overlying the top conductor layer, to prevent damage to the conductor layer during the lamination step.
- the green tape stack can be adhered to a suitable metal support substrate.
- the laminated, supported green tape stack is them fired to devitrify the glass.
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Structural Engineering (AREA)
- Dispersion Chemistry (AREA)
- Ceramic Capacitors (AREA)
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000579543A JP2003521809A (en) | 1998-11-05 | 1999-11-05 | High dielectric constant embedded capacitor with wide operating temperature range |
EP99967096A EP1144326A4 (en) | 1998-11-05 | 1999-11-05 | High dielectric constant buried capacitors with extended operating temperature ranges |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US107098P | 1998-11-05 | 1998-11-05 | |
US60/107,098 | 1998-11-05 | ||
US09/434,059 US6300267B1 (en) | 1998-11-05 | 1999-11-04 | High dielectric constant buried capacitors with extended operating temperature ranges |
US09/434,059 | 1999-11-04 |
Publications (1)
Publication Number | Publication Date |
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WO2000026152A1 true WO2000026152A1 (en) | 2000-05-11 |
Family
ID=26668509
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/US1999/026212 WO2000026152A1 (en) | 1998-11-05 | 1999-11-05 | High dielectric constant buried capacitors with extended operating temperature ranges |
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WO (1) | WO2000026152A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110085282A1 (en) * | 2009-10-11 | 2011-04-14 | Indian Institute Of Technology Madras | Liquid composite dielectric material |
CN106383062A (en) * | 2016-08-26 | 2017-02-08 | 巨石集团有限公司 | Method for evaluating mineral raw materials |
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US4482935A (en) * | 1981-07-03 | 1984-11-13 | Itt Industries, Inc. | Ceramic capacitors and dielectric compositions |
US5004715A (en) * | 1989-02-23 | 1991-04-02 | Matsushita Electric Industrial Co., Ltd. | Dielectric ceramic composition and a multilayer ceramic capacitor and a method of manufacturing a multilayer ceramic capacitor |
US5337209A (en) * | 1992-09-10 | 1994-08-09 | Martin Marietta Corporation | High energy density lead magnesium niobate-based dielectric ceramic and process for the preparation thereof |
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1999
- 1999-11-05 WO PCT/US1999/026212 patent/WO2000026152A1/en active IP Right Grant
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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US4482935A (en) * | 1981-07-03 | 1984-11-13 | Itt Industries, Inc. | Ceramic capacitors and dielectric compositions |
US5004715A (en) * | 1989-02-23 | 1991-04-02 | Matsushita Electric Industrial Co., Ltd. | Dielectric ceramic composition and a multilayer ceramic capacitor and a method of manufacturing a multilayer ceramic capacitor |
US5337209A (en) * | 1992-09-10 | 1994-08-09 | Martin Marietta Corporation | High energy density lead magnesium niobate-based dielectric ceramic and process for the preparation thereof |
Non-Patent Citations (1)
Title |
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See also references of EP1144326A4 * |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110085282A1 (en) * | 2009-10-11 | 2011-04-14 | Indian Institute Of Technology Madras | Liquid composite dielectric material |
US8431037B2 (en) | 2009-10-11 | 2013-04-30 | Indian Institute Of Technology Madras | Liquid composite dielectric material |
WO2011058406A1 (en) * | 2009-11-10 | 2011-05-19 | Indian Institute Of Technology Madras | Liquid composite dielectric material |
CN102696077A (en) * | 2009-11-10 | 2012-09-26 | 印度马德拉斯理工学院 | Liquid composite dielectric material |
JP2013510413A (en) * | 2009-11-10 | 2013-03-21 | インディアン インスティテュート オブ テクノロジー マドラス | Liquid composite dielectric material |
CN106383062A (en) * | 2016-08-26 | 2017-02-08 | 巨石集团有限公司 | Method for evaluating mineral raw materials |
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