USD931823S1 - Reaction tube - Google Patents
Reaction tube Download PDFInfo
- Publication number
- USD931823S1 USD931823S1 US29/722,376 US202029722376F USD931823S US D931823 S1 USD931823 S1 US D931823S1 US 202029722376 F US202029722376 F US 202029722376F US D931823 S USD931823 S US D931823S
- Authority
- US
- United States
- Prior art keywords
- reaction tube
- view
- elevational view
- dash
- broken line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
The dash-dot broken line box in the FIG. 3 and FIG. 8 show the boundary of the enlarged portion view and form no part of the claimed design.
Claims (1)
- The ornamental design for a reaction tube, as shown and described.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/722,376 USD931823S1 (en) | 2020-01-29 | 2020-01-29 | Reaction tube |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/722,376 USD931823S1 (en) | 2020-01-29 | 2020-01-29 | Reaction tube |
Publications (1)
Publication Number | Publication Date |
---|---|
USD931823S1 true USD931823S1 (en) | 2021-09-28 |
Family
ID=77832302
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/722,376 Active USD931823S1 (en) | 2020-01-29 | 2020-01-29 | Reaction tube |
Country Status (1)
Country | Link |
---|---|
US (1) | USD931823S1 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD986826S1 (en) * | 2020-03-10 | 2023-05-23 | Kokusai Electric Corporation | Reaction tube |
USD1019583S1 (en) * | 2022-05-30 | 2024-03-26 | Kokusai Electric Corporation | Inner tube of reaction tube for semiconductor manufacturing equipment |
USD1019581S1 (en) * | 2022-05-30 | 2024-03-26 | Kokusai Electric Corporation | Inner tube of reaction tube for semiconductor manufacturing equipment |
USD1019582S1 (en) * | 2022-05-30 | 2024-03-26 | Kokusai Electric Corporation | Inner tube of reaction tube for semiconductor manufacturing equipment |
Citations (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4950870A (en) * | 1987-11-21 | 1990-08-21 | Tel Sagami Limited | Heat-treating apparatus |
US5618349A (en) * | 1993-07-24 | 1997-04-08 | Yamaha Corporation | Thermal treatment with enhanced intra-wafer, intra-and inter-batch uniformity |
USD405062S (en) * | 1997-08-20 | 1999-02-02 | Tokyo Electron Ltd. | Processing tube for use in a semiconductor wafer heat processing apparatus |
USD405431S (en) * | 1997-08-20 | 1999-02-09 | Tokyo Electron Ltd. | Tube for use in a semiconductor wafer heat processing apparatus |
USD405429S (en) * | 1997-01-31 | 1999-02-09 | Tokyo Electron Limited | Processing tube for use in a semiconductor wafer heat processing apparatus |
USD406113S (en) * | 1997-01-31 | 1999-02-23 | Tokyo Electron Limited | Processing tube for use in a semiconductor wafer heat processing apparatus |
US5968593A (en) * | 1995-03-20 | 1999-10-19 | Kokusai Electric Co., Ltd. | Semiconductor manufacturing apparatus |
USD417438S (en) * | 1997-01-31 | 1999-12-07 | Tokyo Electron Limited | Quartz outer tube |
USD423463S (en) * | 1997-01-31 | 2000-04-25 | Tokyo Electron Limited | Quartz process tube |
USD424024S (en) * | 1997-01-31 | 2000-05-02 | Tokyo Electron Limited | Quartz process tube |
US6251189B1 (en) * | 1999-02-18 | 2001-06-26 | Kokusai Electric Co., Ltd. | Substrate processing apparatus and substrate processing method |
US20010050054A1 (en) * | 2000-03-17 | 2001-12-13 | Samsung Electronics Co., Ltd. | Process tube having slit type process gas injection portion and hole type waste gas exhaust portion, and apparatus for fabricating semiconductor device |
US20030221779A1 (en) * | 2002-03-28 | 2003-12-04 | Kazuyuki Okuda | Substrate processing apparatus |
USD521464S1 (en) * | 2003-11-04 | 2006-05-23 | Tokyo Electron Limited | Process tube for semiconductor device manufacturing apparatus |
USD521465S1 (en) * | 2003-11-04 | 2006-05-23 | Tokyo Electron Limited | Process tube for semiconductor device manufacturing apparatus |
US20080083372A1 (en) * | 2006-08-04 | 2008-04-10 | Hisashi Inoue | Heat processing apparatus for semiconductor process |
USD586768S1 (en) * | 2006-10-12 | 2009-02-17 | Tokyo Electron Limited | Process tube for manufacturing semiconductor wafers |
USD600659S1 (en) * | 2006-09-12 | 2009-09-22 | Tokyo Electron Limited | Process tube for manufacturing semiconductor wafers |
US20090250005A1 (en) * | 2008-04-03 | 2009-10-08 | Tokyo Electron Limited | Reaction tube and heat processing apparatus for a semiconductor process |
USD610559S1 (en) * | 2008-05-30 | 2010-02-23 | Hitachi Kokusai Electric, Inc. | Reaction tube |
USD611013S1 (en) * | 2008-03-28 | 2010-03-02 | Tokyo Electron Limited | Process tube for manufacturing semiconductor wafers |
USD618638S1 (en) * | 2008-05-09 | 2010-06-29 | Hitachi Kokusai Electric, Inc. | Reaction tube |
USD698641S1 (en) * | 2013-06-12 | 2014-02-04 | Target Brands, Inc. | Display fixture with cylindrical container |
USD711843S1 (en) * | 2013-06-28 | 2014-08-26 | Hitachi Kokusai Electric Inc. | Reaction tube |
USD725055S1 (en) * | 2013-06-28 | 2015-03-24 | Hitachi Kokusai Electric Inc. | Reaction tube |
USD739832S1 (en) * | 2013-06-28 | 2015-09-29 | Hitachi Kokusai Electric Inc. | Reaction tube |
US9460946B2 (en) * | 2010-07-09 | 2016-10-04 | Hitachi Kokusai Electric Inc. | Substrate processing apparatus and heating equipment |
USD770993S1 (en) * | 2015-09-04 | 2016-11-08 | Hitachi Kokusai Electric Inc. | Reaction tube |
USD772824S1 (en) * | 2015-02-25 | 2016-11-29 | Hitachi Kokusai Electric Inc. | Reaction tube |
USD778458S1 (en) | 2015-02-23 | 2017-02-07 | Hitachi Kokusai Electric Inc. | Reaction tube |
USD791090S1 (en) * | 2015-09-04 | 2017-07-04 | Hitachi Kokusai Electric Inc. | Reaction tube |
US9748125B2 (en) * | 2012-01-31 | 2017-08-29 | Applied Materials, Inc. | Continuous substrate processing system |
USD842823S1 (en) * | 2017-08-10 | 2019-03-12 | Kokusai Electric Corporation | Reaction tube |
USD842824S1 (en) | 2017-08-09 | 2019-03-12 | Kokusai Electric Corporation | Reaction tube |
USD853979S1 (en) * | 2017-12-27 | 2019-07-16 | Kokusai Electric Corporation | Reaction tube |
US10605530B2 (en) * | 2017-07-26 | 2020-03-31 | Asm Ip Holding B.V. | Assembly of a liner and a flange for a vertical furnace as well as the liner and the vertical furnace |
USD901406S1 (en) * | 2019-03-20 | 2020-11-10 | Kokusai Electric Corporation | Inner tube of reactor for semiconductor fabrication |
US10883175B2 (en) * | 2018-08-09 | 2021-01-05 | Asm Ip Holding B.V. | Vertical furnace for processing substrates and a liner for use therein |
-
2020
- 2020-01-29 US US29/722,376 patent/USD931823S1/en active Active
Patent Citations (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4950870A (en) * | 1987-11-21 | 1990-08-21 | Tel Sagami Limited | Heat-treating apparatus |
US5618349A (en) * | 1993-07-24 | 1997-04-08 | Yamaha Corporation | Thermal treatment with enhanced intra-wafer, intra-and inter-batch uniformity |
US5968593A (en) * | 1995-03-20 | 1999-10-19 | Kokusai Electric Co., Ltd. | Semiconductor manufacturing apparatus |
USD423463S (en) * | 1997-01-31 | 2000-04-25 | Tokyo Electron Limited | Quartz process tube |
USD405429S (en) * | 1997-01-31 | 1999-02-09 | Tokyo Electron Limited | Processing tube for use in a semiconductor wafer heat processing apparatus |
USD406113S (en) * | 1997-01-31 | 1999-02-23 | Tokyo Electron Limited | Processing tube for use in a semiconductor wafer heat processing apparatus |
USD417438S (en) * | 1997-01-31 | 1999-12-07 | Tokyo Electron Limited | Quartz outer tube |
USD424024S (en) * | 1997-01-31 | 2000-05-02 | Tokyo Electron Limited | Quartz process tube |
USD405431S (en) * | 1997-08-20 | 1999-02-09 | Tokyo Electron Ltd. | Tube for use in a semiconductor wafer heat processing apparatus |
USD405062S (en) * | 1997-08-20 | 1999-02-02 | Tokyo Electron Ltd. | Processing tube for use in a semiconductor wafer heat processing apparatus |
US6251189B1 (en) * | 1999-02-18 | 2001-06-26 | Kokusai Electric Co., Ltd. | Substrate processing apparatus and substrate processing method |
US20010050054A1 (en) * | 2000-03-17 | 2001-12-13 | Samsung Electronics Co., Ltd. | Process tube having slit type process gas injection portion and hole type waste gas exhaust portion, and apparatus for fabricating semiconductor device |
US20030221779A1 (en) * | 2002-03-28 | 2003-12-04 | Kazuyuki Okuda | Substrate processing apparatus |
USD521464S1 (en) * | 2003-11-04 | 2006-05-23 | Tokyo Electron Limited | Process tube for semiconductor device manufacturing apparatus |
USD521465S1 (en) * | 2003-11-04 | 2006-05-23 | Tokyo Electron Limited | Process tube for semiconductor device manufacturing apparatus |
US20080083372A1 (en) * | 2006-08-04 | 2008-04-10 | Hisashi Inoue | Heat processing apparatus for semiconductor process |
USD600659S1 (en) * | 2006-09-12 | 2009-09-22 | Tokyo Electron Limited | Process tube for manufacturing semiconductor wafers |
USD586768S1 (en) * | 2006-10-12 | 2009-02-17 | Tokyo Electron Limited | Process tube for manufacturing semiconductor wafers |
USD611013S1 (en) * | 2008-03-28 | 2010-03-02 | Tokyo Electron Limited | Process tube for manufacturing semiconductor wafers |
US20090250005A1 (en) * | 2008-04-03 | 2009-10-08 | Tokyo Electron Limited | Reaction tube and heat processing apparatus for a semiconductor process |
USD618638S1 (en) * | 2008-05-09 | 2010-06-29 | Hitachi Kokusai Electric, Inc. | Reaction tube |
USD610559S1 (en) * | 2008-05-30 | 2010-02-23 | Hitachi Kokusai Electric, Inc. | Reaction tube |
US9460946B2 (en) * | 2010-07-09 | 2016-10-04 | Hitachi Kokusai Electric Inc. | Substrate processing apparatus and heating equipment |
US9748125B2 (en) * | 2012-01-31 | 2017-08-29 | Applied Materials, Inc. | Continuous substrate processing system |
USD698641S1 (en) * | 2013-06-12 | 2014-02-04 | Target Brands, Inc. | Display fixture with cylindrical container |
USD711843S1 (en) * | 2013-06-28 | 2014-08-26 | Hitachi Kokusai Electric Inc. | Reaction tube |
USD725055S1 (en) * | 2013-06-28 | 2015-03-24 | Hitachi Kokusai Electric Inc. | Reaction tube |
USD739832S1 (en) * | 2013-06-28 | 2015-09-29 | Hitachi Kokusai Electric Inc. | Reaction tube |
USD778458S1 (en) | 2015-02-23 | 2017-02-07 | Hitachi Kokusai Electric Inc. | Reaction tube |
USD772824S1 (en) * | 2015-02-25 | 2016-11-29 | Hitachi Kokusai Electric Inc. | Reaction tube |
USD791090S1 (en) * | 2015-09-04 | 2017-07-04 | Hitachi Kokusai Electric Inc. | Reaction tube |
USD770993S1 (en) * | 2015-09-04 | 2016-11-08 | Hitachi Kokusai Electric Inc. | Reaction tube |
US10605530B2 (en) * | 2017-07-26 | 2020-03-31 | Asm Ip Holding B.V. | Assembly of a liner and a flange for a vertical furnace as well as the liner and the vertical furnace |
USD842824S1 (en) | 2017-08-09 | 2019-03-12 | Kokusai Electric Corporation | Reaction tube |
USD842823S1 (en) * | 2017-08-10 | 2019-03-12 | Kokusai Electric Corporation | Reaction tube |
USD853979S1 (en) * | 2017-12-27 | 2019-07-16 | Kokusai Electric Corporation | Reaction tube |
US10883175B2 (en) * | 2018-08-09 | 2021-01-05 | Asm Ip Holding B.V. | Vertical furnace for processing substrates and a liner for use therein |
USD901406S1 (en) * | 2019-03-20 | 2020-11-10 | Kokusai Electric Corporation | Inner tube of reactor for semiconductor fabrication |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD986826S1 (en) * | 2020-03-10 | 2023-05-23 | Kokusai Electric Corporation | Reaction tube |
USD1019583S1 (en) * | 2022-05-30 | 2024-03-26 | Kokusai Electric Corporation | Inner tube of reaction tube for semiconductor manufacturing equipment |
USD1019581S1 (en) * | 2022-05-30 | 2024-03-26 | Kokusai Electric Corporation | Inner tube of reaction tube for semiconductor manufacturing equipment |
USD1019582S1 (en) * | 2022-05-30 | 2024-03-26 | Kokusai Electric Corporation | Inner tube of reaction tube for semiconductor manufacturing equipment |
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Legal Events
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FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |