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USD920266S1 - Integrated circuit package - Google Patents

Integrated circuit package Download PDF

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Publication number
USD920266S1
USD920266S1 US29/728,332 US202029728332F USD920266S US D920266 S1 USD920266 S1 US D920266S1 US 202029728332 F US202029728332 F US 202029728332F US D920266 S USD920266 S US D920266S
Authority
US
United States
Prior art keywords
integrated circuit
circuit package
view
package
ornamental design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/728,332
Inventor
Jian Wei Yang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CHINA CHIPPACKING TECHNOLOGY Co Ltd
Original Assignee
CHINA CHIPPACKING TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CHINA CHIPPACKING TECHNOLOGY Co Ltd filed Critical CHINA CHIPPACKING TECHNOLOGY Co Ltd
Assigned to CHINA CHIPPACKING TECHNOLOGY CO., LTD. reassignment CHINA CHIPPACKING TECHNOLOGY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: YANG, JIAN WEI
Application granted granted Critical
Publication of USD920266S1 publication Critical patent/USD920266S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a front elevational view of an integrated circuit package showing my new design;
FIG. 2 is a rear elevational view thereof;
FIG. 3 is a left side elevational view thereof;
FIG. 4 is a right side elevational view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is a front perspective view thereof; and,
FIG. 8 is a rear perspective view thereof.

Claims (1)

    CLAIM
  1. The ornamental design for an integrated circuit package, as shown.
US29/728,332 2019-09-29 2020-03-17 Integrated circuit package Active USD920266S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201930539498.2 2019-09-29
CN201930539498 2019-09-29

Publications (1)

Publication Number Publication Date
USD920266S1 true USD920266S1 (en) 2021-05-25

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ID=75921083

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/728,332 Active USD920266S1 (en) 2019-09-29 2020-03-17 Integrated circuit package

Country Status (1)

Country Link
US (1) USD920266S1 (en)

Citations (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5220298A (en) * 1990-07-24 1993-06-15 Kabushiki Kaisha Toshiba Integrated circuit having a built-in noise filter
USD355411S (en) * 1993-06-04 1995-02-14 Cicon Components, Inc. Integrated circuit electronic package
USD396213S (en) * 1996-09-09 1998-07-21 Fuji Electric Co., Ltd. Integrated circuit device
USD396211S (en) * 1996-09-09 1998-07-21 Fuji Electric Co., Ltd. Integrated circuit device
USD396212S (en) * 1996-09-09 1998-07-21 Fuji Electric Co., Ltd. Integrated circuit device
USD397092S (en) * 1997-01-03 1998-08-18 Fujitsu Limited Integrated circuit package
USD416236S (en) * 1998-09-02 1999-11-09 Citizen Electronics Co., Ltd. Integrated circuit package
USD489338S1 (en) * 2003-07-28 2004-05-04 Semiconductor Components Industries, L.L.C. Packaged semiconductor device
USD510728S1 (en) * 2004-08-11 2005-10-18 Semiconductor Components Industries Llc Semiconductor device package
US9142531B1 (en) * 2011-03-23 2015-09-22 Stats Chippac Ltd. Integrated circuit packaging system with plated leads and method of manufacture thereof
US9184122B2 (en) * 2012-06-06 2015-11-10 Stats Chippac Ltd. Integrated circuit packaging system with interposer and method of manufacture thereof
US9299661B2 (en) * 2009-03-24 2016-03-29 General Electric Company Integrated circuit package and method of making same
US9355962B2 (en) * 2009-06-12 2016-05-31 Stats Chippac Ltd. Integrated circuit package stacking system with redistribution and method of manufacture thereof
US9437512B2 (en) * 2011-10-07 2016-09-06 Mediatek Inc. Integrated circuit package structure
US9530945B2 (en) * 1998-02-06 2016-12-27 Invensas Corporation Integrated circuit device
US9653442B2 (en) * 2014-01-17 2017-05-16 Taiwan Semiconductor Manufacturing Company, Ltd. Integrated circuit package and methods of forming same
USD796459S1 (en) * 2016-04-11 2017-09-05 Rohm Co., Ltd. Packaged semiconductor circuit module
US9859253B1 (en) * 2016-06-29 2018-01-02 Intel Corporation Integrated circuit package stack
US10134685B1 (en) * 2017-07-27 2018-11-20 Taiwan Semiconductor Manufacturing Co., Ltd. Integrated circuit package and method of fabricating the same
US10615151B2 (en) * 2016-11-30 2020-04-07 Shenzhen Xiuyuan Electronic Technology Co., Ltd Integrated circuit multichip stacked packaging structure and method
US10636757B2 (en) * 2017-08-29 2020-04-28 Taiwan Semiconductor Manufacturing Co., Ltd. Integrated circuit component package and method of fabricating the same
US10685896B2 (en) * 2017-04-13 2020-06-16 Taiwan Semiconductor Manufacturing Co., Ltd. Integrated circuit package and method of fabricating the same
US10790162B2 (en) * 2018-09-27 2020-09-29 Taiwan Semiconductor Manufacturing Company, Ltd. Integrated circuit package and method
USD902164S1 (en) * 2019-01-24 2020-11-17 Toshiba Memory Corporation Integrated circuit card
US10867879B2 (en) * 2018-09-28 2020-12-15 Taiwan Semiconductor Manufacturing Company, Ltd. Integrated circuit package and method

Patent Citations (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5220298A (en) * 1990-07-24 1993-06-15 Kabushiki Kaisha Toshiba Integrated circuit having a built-in noise filter
USD355411S (en) * 1993-06-04 1995-02-14 Cicon Components, Inc. Integrated circuit electronic package
USD396213S (en) * 1996-09-09 1998-07-21 Fuji Electric Co., Ltd. Integrated circuit device
USD396211S (en) * 1996-09-09 1998-07-21 Fuji Electric Co., Ltd. Integrated circuit device
USD396212S (en) * 1996-09-09 1998-07-21 Fuji Electric Co., Ltd. Integrated circuit device
USD397092S (en) * 1997-01-03 1998-08-18 Fujitsu Limited Integrated circuit package
US9530945B2 (en) * 1998-02-06 2016-12-27 Invensas Corporation Integrated circuit device
USD416236S (en) * 1998-09-02 1999-11-09 Citizen Electronics Co., Ltd. Integrated circuit package
USD489338S1 (en) * 2003-07-28 2004-05-04 Semiconductor Components Industries, L.L.C. Packaged semiconductor device
USD510728S1 (en) * 2004-08-11 2005-10-18 Semiconductor Components Industries Llc Semiconductor device package
US9299661B2 (en) * 2009-03-24 2016-03-29 General Electric Company Integrated circuit package and method of making same
US9355962B2 (en) * 2009-06-12 2016-05-31 Stats Chippac Ltd. Integrated circuit package stacking system with redistribution and method of manufacture thereof
US9142531B1 (en) * 2011-03-23 2015-09-22 Stats Chippac Ltd. Integrated circuit packaging system with plated leads and method of manufacture thereof
US9437512B2 (en) * 2011-10-07 2016-09-06 Mediatek Inc. Integrated circuit package structure
US9184122B2 (en) * 2012-06-06 2015-11-10 Stats Chippac Ltd. Integrated circuit packaging system with interposer and method of manufacture thereof
US9653442B2 (en) * 2014-01-17 2017-05-16 Taiwan Semiconductor Manufacturing Company, Ltd. Integrated circuit package and methods of forming same
USD796459S1 (en) * 2016-04-11 2017-09-05 Rohm Co., Ltd. Packaged semiconductor circuit module
US9859253B1 (en) * 2016-06-29 2018-01-02 Intel Corporation Integrated circuit package stack
US10615151B2 (en) * 2016-11-30 2020-04-07 Shenzhen Xiuyuan Electronic Technology Co., Ltd Integrated circuit multichip stacked packaging structure and method
US10685896B2 (en) * 2017-04-13 2020-06-16 Taiwan Semiconductor Manufacturing Co., Ltd. Integrated circuit package and method of fabricating the same
US10134685B1 (en) * 2017-07-27 2018-11-20 Taiwan Semiconductor Manufacturing Co., Ltd. Integrated circuit package and method of fabricating the same
US10636757B2 (en) * 2017-08-29 2020-04-28 Taiwan Semiconductor Manufacturing Co., Ltd. Integrated circuit component package and method of fabricating the same
US10790162B2 (en) * 2018-09-27 2020-09-29 Taiwan Semiconductor Manufacturing Company, Ltd. Integrated circuit package and method
US10867879B2 (en) * 2018-09-28 2020-12-15 Taiwan Semiconductor Manufacturing Company, Ltd. Integrated circuit package and method
USD902164S1 (en) * 2019-01-24 2020-11-17 Toshiba Memory Corporation Integrated circuit card

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
What is μMAX IC package? https://electronics.stackexchange.com/questions/15839/what-is-%c2%b5max-ic-package, Jun. 23, 2011. (Year: 2011). *

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