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USD905647S1 - Combination heat pipe and heat sink - Google Patents

Combination heat pipe and heat sink Download PDF

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Publication number
USD905647S1
USD905647S1 US29/657,394 US201829657394F USD905647S US D905647 S1 USD905647 S1 US D905647S1 US 201829657394 F US201829657394 F US 201829657394F US D905647 S USD905647 S US D905647S
Authority
US
United States
Prior art keywords
combination
heat
heat sink
heat pipe
pipe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/657,394
Inventor
Ali Mira
Yashar Mira
Michael Mira
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HeatscapeCom Inc
Original Assignee
HeatscapeCom Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HeatscapeCom Inc filed Critical HeatscapeCom Inc
Priority to US29/657,394 priority Critical patent/USD905647S1/en
Assigned to HEATSCAPE.COM, INC. reassignment HEATSCAPE.COM, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MIRA, MICHAEL, MIRA, YASHAR, MIRA, ALI
Application granted granted Critical
Publication of USD905647S1 publication Critical patent/USD905647S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a top, front, right, perspective view of a combination heat pipe and heat sink, showing our new design;
FIG. 2 is a bottom, front, left perspective view thereof;
FIG. 3 is a front elevation view thereof;
FIG. 4 is a rear elevation view thereof;
FIG. 5 is a right side elevation view thereof;
FIG. 6 is a left side elevation view thereof;
FIG. 7 is a bottom plan view thereof;
FIG. 8 is a top plan view thereof;
FIG. 9 is a top, front, right perspective view of the combination heat pipe and heat sink of FIG. 1, shown in a first condition for use and exploded for clarity of disclosure; and,
FIG. 10 is a top, front, right perspective view of the combination heat pipe and heat sink of FIG. 1, shown in a second condition for use and assembled for clarity of disclosure.
The broken lines depict portions of the combination heat pipe and heat sink that form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a combination heat pipe and heat sink, as shown and described.
US29/657,394 2018-07-20 2018-07-20 Combination heat pipe and heat sink Active USD905647S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/657,394 USD905647S1 (en) 2018-07-20 2018-07-20 Combination heat pipe and heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/657,394 USD905647S1 (en) 2018-07-20 2018-07-20 Combination heat pipe and heat sink

Publications (1)

Publication Number Publication Date
USD905647S1 true USD905647S1 (en) 2020-12-22

Family

ID=73823835

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/657,394 Active USD905647S1 (en) 2018-07-20 2018-07-20 Combination heat pipe and heat sink

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US (1) USD905647S1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD953280S1 (en) * 2020-01-17 2022-05-31 Furukawa Electric Co., Ltd Heat sink
USD954005S1 (en) 2019-09-12 2022-06-07 Furukawa Electric Co., Ltd. Heatsink
USD971862S1 (en) * 2018-12-28 2022-12-06 Furukawa Electric Co., Ltd. Heatsink

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0129297B2 (en) * 1982-09-09 1989-06-09 Matsushita Electronics Corp
USD427159S (en) * 1997-06-27 2000-06-27 Sony Corporation Semiconductor element
US20060181856A1 (en) * 2005-02-11 2006-08-17 Inventec Corporation Heatsink device of video graphics array and chipset
US20090194260A1 (en) * 2008-02-04 2009-08-06 Chih-Peng Liao Cooling apparatus for graphic cards
US20110186269A1 (en) * 2010-02-04 2011-08-04 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Thermal module
US20140022724A1 (en) * 2012-07-20 2014-01-23 Hon Hai Precision Industry Co., Ltd. Heat dissipation apparatus
US20140182817A1 (en) * 2013-01-03 2014-07-03 Adlink Technology Inc. Low thermal resistance cooler module for embedded system
USD722573S1 (en) * 2013-11-26 2015-02-17 Heatscape, Inc. U-shaped condenser heat sink for low profile modules
USD732487S1 (en) * 2013-08-06 2015-06-23 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
US20170199554A1 (en) * 2016-01-13 2017-07-13 Msi Computer (Shenzhen) Co.,Ltd. Heat dissipation system
USD807824S1 (en) * 2016-07-18 2018-01-16 General Electric Company Heat spreader
US20180062347A1 (en) * 2016-08-31 2018-03-01 Nlight, Inc. Laser cooling system
USD819578S1 (en) * 2016-07-14 2018-06-05 Enermax Technology Corporation Heat dissipating fin
JP6429297B1 (en) * 2017-08-04 2018-11-28 泰碩電子股▲分▼有限公司 Vapor chamber complex

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0129297B2 (en) * 1982-09-09 1989-06-09 Matsushita Electronics Corp
USD427159S (en) * 1997-06-27 2000-06-27 Sony Corporation Semiconductor element
US20060181856A1 (en) * 2005-02-11 2006-08-17 Inventec Corporation Heatsink device of video graphics array and chipset
US20090194260A1 (en) * 2008-02-04 2009-08-06 Chih-Peng Liao Cooling apparatus for graphic cards
US20110186269A1 (en) * 2010-02-04 2011-08-04 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Thermal module
US20140022724A1 (en) * 2012-07-20 2014-01-23 Hon Hai Precision Industry Co., Ltd. Heat dissipation apparatus
US20140182817A1 (en) * 2013-01-03 2014-07-03 Adlink Technology Inc. Low thermal resistance cooler module for embedded system
USD732487S1 (en) * 2013-08-06 2015-06-23 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
USD722573S1 (en) * 2013-11-26 2015-02-17 Heatscape, Inc. U-shaped condenser heat sink for low profile modules
US20170199554A1 (en) * 2016-01-13 2017-07-13 Msi Computer (Shenzhen) Co.,Ltd. Heat dissipation system
USD819578S1 (en) * 2016-07-14 2018-06-05 Enermax Technology Corporation Heat dissipating fin
USD807824S1 (en) * 2016-07-18 2018-01-16 General Electric Company Heat spreader
US20180062347A1 (en) * 2016-08-31 2018-03-01 Nlight, Inc. Laser cooling system
JP6429297B1 (en) * 2017-08-04 2018-11-28 泰碩電子股▲分▼有限公司 Vapor chamber complex

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
"Dell Heatpipe Heatsink". Found online Mar. 12, 2020 at newegg.com. Reference dated Mar. 30, 2019. Retrieved from https://www.newegg.com/p/2RM-000M-00776?Description=heatpipe%20heatsink&cm_re=heatpipe_heatsink-_-9SIAH9B9331370-_-Product. (Year: 2019). *
"Double heatpipe heatsink". Found online Apr. 13, 2020 at aliexpress.com. Reference dated Dec. 2, 2016. Retrieved from https://www.aliexpress.com/i/2045174681.html. (Year: 2016). *
"Heat Pipe Overview". Found online Apr. 13, 2020 at youtube.com. Reference dated Jul. 9, 2015. Retrieved from https://www.youtube.com/watch?v=WoJnnHTQfuw. (Year: 2015). *
"Microcool General Liquid Cooling". Found online Mar. 12, 2020 at slideshare.net. Reference dated Sep. 23, 2016. Retrieved from https://www.slideshare.net/ScottHolland13/microcool-general-liquid-cooling-presentation-10215. (Year: 2016). *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD971862S1 (en) * 2018-12-28 2022-12-06 Furukawa Electric Co., Ltd. Heatsink
USD954005S1 (en) 2019-09-12 2022-06-07 Furukawa Electric Co., Ltd. Heatsink
USD953280S1 (en) * 2020-01-17 2022-05-31 Furukawa Electric Co., Ltd Heat sink

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