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USD877079S1 - Electrode plate for plasma processing apparatus - Google Patents

Electrode plate for plasma processing apparatus Download PDF

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Publication number
USD877079S1
USD877079S1 US29/554,794 US201629554794F USD877079S US D877079 S1 USD877079 S1 US D877079S1 US 201629554794 F US201629554794 F US 201629554794F US D877079 S USD877079 S US D877079S
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US
United States
Prior art keywords
processing apparatus
electrode plate
plasma processing
view
taken
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/554,794
Inventor
Shinichi Kozuka
Ryosuke NIITSUMA
Manabu Ishikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Assigned to TOKYO ELECTRON LIMITED reassignment TOKYO ELECTRON LIMITED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ISHIKAWA, MANABU, KOZUKA, SHINICHI, NIITSUMA, RYOSUKE
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Description

FIG. 1 is a front view of an electrode plate for plasma processing apparatus of the present invention.
FIG. 2 is a rear view thereof.
FIG. 3 is a top plan view thereof.
FIG. 4 is a bottom view thereof.
FIG. 5 is a right side view thereof.
FIG. 6 is a left side view thereof.
FIG. 7 is a perspective view thereof.
FIG. 8 is an enlarged partial view thereof, taken at the area identified as FIG. 8 on FIG. 1.
FIG. 9 is an enlarged partial view thereof, taken at the area identified as FIG. 9 on FIG. 1.
FIG. 10 is an enlarged partial view thereof, taken at the area identified as FIG. 9 on FIG. 2;
FIG. 11 is an enlarged partial view thereof, taken at the area identified as FIG. 9 on FIG. 2;
FIG. 12 is a sectional view thereof, taken along line 12-12 of FIG. 2; and,
FIG. 13 is an enlarged partial sectional view thereof, taken at the area identified as FIG. 13 on FIG. 12.
The broken lines shown represent portions of the electrode plate for plasma processing apparatus that form no part of the claimed design. Where the dot-dash broken lines abut the shaded surface it is understood that those broken lines represent an unclaimed boundary between claimed and unclaimed surfaces. None of the broken lines form any part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for an electrode plate for plasma processing apparatus, as shown and described.
US29/554,794 2015-08-26 2016-02-16 Electrode plate for plasma processing apparatus Active USD877079S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015-018692 2015-08-26
JPD2015-18692F JP1545606S (en) 2015-08-26 2015-08-26

Publications (1)

Publication Number Publication Date
USD877079S1 true USD877079S1 (en) 2020-03-03

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ID=55484389

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/554,794 Active USD877079S1 (en) 2015-08-26 2016-02-16 Electrode plate for plasma processing apparatus

Country Status (3)

Country Link
US (1) USD877079S1 (en)
JP (1) JP1545606S (en)
TW (1) TWD178422S (en)

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD411516S (en) * 1996-03-15 1999-06-29 Tokyo Electron Limited Gas diffusion plate for electrode of semiconductor wafer processing apparatus
USD460350S1 (en) * 2001-03-22 2002-07-16 Alan Davis Compressed fabric article package having a wedge shape
US6537419B1 (en) * 2000-04-26 2003-03-25 David W. Kinnard Gas distribution plate assembly for providing laminar gas flow across the surface of a substrate
US6793733B2 (en) * 2002-01-25 2004-09-21 Applied Materials Inc. Gas distribution showerhead
US6872258B2 (en) * 2001-07-16 2005-03-29 Samsung Electronics Co., Ltd. Shower head of a wafer treatment apparatus having a gap controller
USD570310S1 (en) * 2006-08-01 2008-06-03 Tokyo Electron Limited Attracting plate of an electrostatic chuck for semiconductor manufacturing
USD609652S1 (en) * 2008-07-22 2010-02-09 Tokyo Electron Limited Wafer attracting plate
US8221582B2 (en) * 2008-07-07 2012-07-17 Lam Research Corporation Clamped monolithic showerhead electrode
US8702866B2 (en) * 2006-12-18 2014-04-22 Lam Research Corporation Showerhead electrode assembly with gas flow modification for extended electrode life
US9484190B2 (en) * 2014-01-25 2016-11-01 Yuri Glukhoy Showerhead-cooler system of a semiconductor-processing chamber for semiconductor wafers of large area
USD787458S1 (en) * 2015-11-18 2017-05-23 Asm Ip Holding B.V. Gas supply plate for semiconductor manufacturing apparatus
USD790041S1 (en) * 2016-01-08 2017-06-20 Asm Ip Holding B.V. Gas dispersing plate for semiconductor manufacturing apparatus
USD789888S1 (en) * 2016-01-08 2017-06-20 Asm Ip Holding B.V. Electrode plate for semiconductor manufacturing apparatus
USD793572S1 (en) * 2015-06-10 2017-08-01 Tokyo Electron Limited Electrode plate for plasma processing apparatus

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD411516S (en) * 1996-03-15 1999-06-29 Tokyo Electron Limited Gas diffusion plate for electrode of semiconductor wafer processing apparatus
US6537419B1 (en) * 2000-04-26 2003-03-25 David W. Kinnard Gas distribution plate assembly for providing laminar gas flow across the surface of a substrate
USD460350S1 (en) * 2001-03-22 2002-07-16 Alan Davis Compressed fabric article package having a wedge shape
US6872258B2 (en) * 2001-07-16 2005-03-29 Samsung Electronics Co., Ltd. Shower head of a wafer treatment apparatus having a gap controller
US6793733B2 (en) * 2002-01-25 2004-09-21 Applied Materials Inc. Gas distribution showerhead
USD570310S1 (en) * 2006-08-01 2008-06-03 Tokyo Electron Limited Attracting plate of an electrostatic chuck for semiconductor manufacturing
US8702866B2 (en) * 2006-12-18 2014-04-22 Lam Research Corporation Showerhead electrode assembly with gas flow modification for extended electrode life
US8221582B2 (en) * 2008-07-07 2012-07-17 Lam Research Corporation Clamped monolithic showerhead electrode
USD609652S1 (en) * 2008-07-22 2010-02-09 Tokyo Electron Limited Wafer attracting plate
US9484190B2 (en) * 2014-01-25 2016-11-01 Yuri Glukhoy Showerhead-cooler system of a semiconductor-processing chamber for semiconductor wafers of large area
USD793572S1 (en) * 2015-06-10 2017-08-01 Tokyo Electron Limited Electrode plate for plasma processing apparatus
USD787458S1 (en) * 2015-11-18 2017-05-23 Asm Ip Holding B.V. Gas supply plate for semiconductor manufacturing apparatus
USD790041S1 (en) * 2016-01-08 2017-06-20 Asm Ip Holding B.V. Gas dispersing plate for semiconductor manufacturing apparatus
USD789888S1 (en) * 2016-01-08 2017-06-20 Asm Ip Holding B.V. Electrode plate for semiconductor manufacturing apparatus

Also Published As

Publication number Publication date
JP1545606S (en) 2016-03-14
TWD178422S (en) 2016-09-21

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