USD864135S1 - Semiconductor device - Google Patents
Semiconductor device Download PDFInfo
- Publication number
- USD864135S1 USD864135S1 US29/685,061 US201929685061F USD864135S US D864135 S1 USD864135 S1 US D864135S1 US 201929685061 F US201929685061 F US 201929685061F US D864135 S USD864135 S US D864135S
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- US
- United States
- Prior art keywords
- semiconductor device
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- ornamental design
- side perspective
- designs
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
The broken lines illustrate portions of the semiconductor device that form no part of the claimed designs.
Claims (1)
- The ornamental design for a semiconductor device, as shown and described.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/685,061 USD864135S1 (en) | 2017-10-26 | 2019-03-26 | Semiconductor device |
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017-023790 | 2017-02-13 | ||
JPD2017-23791F JP1604094S (en) | 2017-10-26 | 2017-10-26 | |
JP2017-023791 | 2017-10-26 | ||
JPD2017-23790F JP1604093S (en) | 2017-10-26 | 2017-10-26 | |
US29/643,229 USD859334S1 (en) | 2017-10-26 | 2018-04-05 | Semiconductor device |
US29/685,061 USD864135S1 (en) | 2017-10-26 | 2019-03-26 | Semiconductor device |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/643,229 Division USD859334S1 (en) | 2017-10-26 | 2018-04-05 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
USD864135S1 true USD864135S1 (en) | 2019-10-22 |
Family
ID=67809894
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/643,229 Active USD859334S1 (en) | 2017-10-26 | 2018-04-05 | Semiconductor device |
US29/685,061 Active USD864135S1 (en) | 2017-10-26 | 2019-03-26 | Semiconductor device |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/643,229 Active USD859334S1 (en) | 2017-10-26 | 2018-04-05 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
US (2) | USD859334S1 (en) |
Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD888673S1 (en) * | 2018-06-26 | 2020-06-30 | Rohm Co., Ltd. | Semiconductor module |
USD913978S1 (en) | 2018-06-26 | 2021-03-23 | Rohm Co., Ltd. | Semiconductor module |
USD934187S1 (en) * | 2020-01-21 | 2021-10-26 | Lang Cheng | Integrated circuit package |
USD945384S1 (en) * | 2019-09-26 | 2022-03-08 | Lapis Semiconductor Co., Ltd. | Semiconductor module |
USD953565S1 (en) * | 2019-08-30 | 2022-05-31 | Kyocera Corporation | Analysis chip for biochemical testing machine |
USD969762S1 (en) * | 2020-04-06 | 2022-11-15 | Wolfspeed, Inc. | Power semiconductor package |
USD971863S1 (en) * | 2020-01-28 | 2022-12-06 | Rohm Co., Ltd. | Semiconductor module |
USD972516S1 (en) * | 2020-01-28 | 2022-12-13 | Rohm Co., Ltd. | Semiconductor module |
USD973029S1 (en) * | 2020-12-15 | 2022-12-20 | Rohm Co., Ltd. | Semiconductor device |
USD978809S1 (en) * | 2018-04-13 | 2023-02-21 | Rohm Co., Ltd. | Semiconductor module |
USD981356S1 (en) * | 2020-01-28 | 2023-03-21 | Rohm Co., Ltd. | Semiconductor module |
USD1009819S1 (en) * | 2021-10-13 | 2024-01-02 | Rohm Co., Ltd. | Semiconductor device |
USD1009818S1 (en) * | 2021-10-13 | 2024-01-02 | Rohm Co., Ltd. | Semiconductor device |
USD1011300S1 (en) * | 2021-09-01 | 2024-01-16 | Dexerials Corporation | Fuse |
USD1037187S1 (en) * | 2022-05-12 | 2024-07-30 | Alpha And Omega Semiconductor International Lp | Power semiconductor module |
USD1042375S1 (en) * | 2022-05-12 | 2024-09-17 | Alpha And Omega Semiconductor International Lp | Power semiconductor module |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD864884S1 (en) * | 2017-10-23 | 2019-10-29 | Mitsubishi Electric Corporation | Semiconductor device |
USD856948S1 (en) * | 2018-05-07 | 2019-08-20 | Adura Led Solutions Llc | Circuit board having arrangements of light-emitting diodes |
JP1632999S (en) * | 2018-06-12 | 2019-06-03 | ||
USD933618S1 (en) | 2018-10-31 | 2021-10-19 | Asahi Kasei Microdevices Corporation | Semiconductor module |
JP1633578S (en) * | 2018-11-07 | 2019-06-10 | ||
JP1665773S (en) * | 2018-11-07 | 2020-08-11 | ||
USD902164S1 (en) * | 2019-01-24 | 2020-11-17 | Toshiba Memory Corporation | Integrated circuit card |
USD932452S1 (en) * | 2019-11-27 | 2021-10-05 | The Noco Company | Semiconductor device |
USD920264S1 (en) * | 2019-11-27 | 2021-05-25 | The Noco Company | Semiconductor device |
USD1033355S1 (en) * | 2021-07-29 | 2024-07-02 | Rohm Co., Ltd. | Semiconductor module |
JP1711705S (en) * | 2021-07-29 | 2022-04-04 | ||
JP1711706S (en) * | 2021-07-29 | 2022-04-04 | ||
JP1727399S (en) * | 2022-01-28 | 2022-10-14 | semiconductor element | |
JP1725616S (en) * | 2022-02-25 | 2022-09-26 | semiconductor module |
Citations (53)
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US3602846A (en) | 1969-07-14 | 1971-08-31 | Pulse Eng Inc | Delay line |
US3762039A (en) | 1971-09-10 | 1973-10-02 | Mos Technology Inc | Plastic encapsulation of microcircuits |
USD259560S (en) | 1978-07-28 | 1981-06-16 | Hitachi, Ltd. | Semiconductor |
USD259783S (en) | 1978-08-25 | 1981-07-07 | Hitachi, Ltd. | Semiconductor |
USD259782S (en) | 1978-07-28 | 1981-07-07 | Hitachi, Ltd. | Semiconductor |
USD260091S (en) | 1978-08-25 | 1981-08-04 | Hitachi, Ltd. | Semiconductor |
US4663833A (en) | 1984-05-14 | 1987-05-12 | Oki Electric Industry Co. Ltd. | Method for manufacturing IC plastic package with window |
US4916519A (en) * | 1989-05-30 | 1990-04-10 | International Business Machines Corporation | Semiconductor package |
USD317592S (en) * | 1987-01-19 | 1991-06-18 | Canon Kabushiki Kaisha | Semiconductor element |
US5172213A (en) * | 1991-05-23 | 1992-12-15 | At&T Bell Laboratories | Molded circuit package having heat dissipating post |
USD345731S (en) | 1992-12-03 | 1994-04-05 | Motorola, Inc. | Semiconductor package |
USD357901S (en) | 1993-09-27 | 1995-05-02 | Telefonaktiebolaget Lm Ericsson | Power supply unit |
USD358806S (en) | 1993-09-24 | 1995-05-30 | Sgs-Thomson Microelectronics, Inc. | Socketed integrated circuit package |
USD359028S (en) | 1993-09-02 | 1995-06-06 | Sgs-Thomson Microelectronics, Inc. | Socketed integrated circuit package |
US5557504A (en) | 1993-08-31 | 1996-09-17 | Sgs-Thomson Microelectronics, Inc. | Surface mountable integrated circuit package with detachable module |
USD394244S (en) | 1995-11-27 | 1998-05-12 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD396213S (en) | 1996-09-09 | 1998-07-21 | Fuji Electric Co., Ltd. | Integrated circuit device |
USD396211S (en) | 1996-09-09 | 1998-07-21 | Fuji Electric Co., Ltd. | Integrated circuit device |
USD396212S (en) | 1996-09-09 | 1998-07-21 | Fuji Electric Co., Ltd. | Integrated circuit device |
USD396847S (en) | 1996-10-17 | 1998-08-11 | Matsushita Electronics Corporation | Semiconductor device |
US5798570A (en) | 1996-06-28 | 1998-08-25 | Kabushiki Kaisha Gotoh Seisakusho | Plastic molded semiconductor package with thermal dissipation means |
USD421421S (en) | 1998-11-19 | 2000-03-07 | Honda Tsushin Kogyo Co., Ltd. | Connector receptacle for IC card |
USD427977S (en) | 1999-06-18 | 2000-07-11 | Fujikura Ltd. | Piezoelectric conversion type semiconductor device |
US6093957A (en) | 1997-04-18 | 2000-07-25 | Lg Semicon Co., Ltd. | Multilayer lead frame structure that reduces cross-talk and semiconductor package using same and fabrication method thereof |
USD432097S (en) | 1999-11-20 | 2000-10-17 | Samsung Electronics Co., Ltd. | Semiconductor package |
USD441727S1 (en) * | 2000-10-04 | 2001-05-08 | Sony Corporation | Semiconductor element |
US6238953B1 (en) | 1999-01-12 | 2001-05-29 | Sony Corporation | Lead frame, resin-encapsulated semiconductor device and fabrication process for the device |
USD448739S1 (en) | 2000-09-12 | 2001-10-02 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
US20010038143A1 (en) * | 1997-06-12 | 2001-11-08 | Yukio Sonobe | Power semiconductor module |
USD466485S1 (en) | 2001-05-23 | 2002-12-03 | Shindengen Electric Manufactuturing Co., Ltd. | Semiconductor package |
USD466873S1 (en) | 2001-10-31 | 2002-12-10 | Siliconix Incorporated | Semiconductor chip package |
US20030042584A1 (en) * | 2001-09-05 | 2003-03-06 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device and method of manufacturing the same |
USD472528S1 (en) | 2001-10-31 | 2003-04-01 | Siliconix Incorporated | Semiconductor chip package |
USD473199S1 (en) | 2001-11-30 | 2003-04-15 | Kabushiki Kaisha Toshiba | Portion of semiconductor device |
US6555899B1 (en) | 1999-10-15 | 2003-04-29 | Amkor Technology, Inc. | Semiconductor package leadframe assembly and method of manufacture |
USD476962S1 (en) | 2002-03-29 | 2003-07-08 | Kabushiki Kaisha Toshiba | Semiconductor device |
USD480371S1 (en) | 2001-11-30 | 2003-10-07 | Kabushiki Kaisha Toshiba | Semiconductor device |
US6716670B1 (en) * | 2002-01-09 | 2004-04-06 | Bridge Semiconductor Corporation | Method of forming a three-dimensional stacked semiconductor package device |
US6992386B2 (en) | 2003-07-31 | 2006-01-31 | Renesas Technology Corp. | Semiconductor device and a method of manufacturing the same |
USD539761S1 (en) | 2006-08-22 | 2007-04-03 | Kabushiki Kaisha Toshiba | Semiconductor |
USD548202S1 (en) | 2006-04-17 | 2007-08-07 | Kabushiki Kaisha Toshiba | Semiconductor |
USD548203S1 (en) | 2006-04-17 | 2007-08-07 | Kabushiki Kaisha Toshiba | Semiconductor |
US7683494B1 (en) * | 2008-06-18 | 2010-03-23 | Zilog, Inc. | Press-fit integrated circuit package involving compressed spring contact beams |
USD648290S1 (en) * | 2010-06-08 | 2011-11-08 | Miyoshi Electronics Corporation | Semiconductor device |
USD717256S1 (en) | 2012-09-20 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD717253S1 (en) | 2012-10-11 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD717254S1 (en) | 2012-10-11 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD717255S1 (en) | 2012-09-20 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD719113S1 (en) | 2012-09-20 | 2014-12-09 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD719926S1 (en) * | 2012-09-20 | 2014-12-23 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD770994S1 (en) | 2014-04-02 | 2016-11-08 | Mitsubishi Electric Corporation | Power semiconductor device |
USD796459S1 (en) * | 2016-04-11 | 2017-09-05 | Rohm Co., Ltd. | Packaged semiconductor circuit module |
USD824866S1 (en) | 2016-09-30 | 2018-08-07 | Rohm Co., Ltd. | Semiconductor device |
-
2018
- 2018-04-05 US US29/643,229 patent/USD859334S1/en active Active
-
2019
- 2019-03-26 US US29/685,061 patent/USD864135S1/en active Active
Patent Citations (54)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3602846A (en) | 1969-07-14 | 1971-08-31 | Pulse Eng Inc | Delay line |
US3762039A (en) | 1971-09-10 | 1973-10-02 | Mos Technology Inc | Plastic encapsulation of microcircuits |
USD259560S (en) | 1978-07-28 | 1981-06-16 | Hitachi, Ltd. | Semiconductor |
USD259782S (en) | 1978-07-28 | 1981-07-07 | Hitachi, Ltd. | Semiconductor |
USD259783S (en) | 1978-08-25 | 1981-07-07 | Hitachi, Ltd. | Semiconductor |
USD260091S (en) | 1978-08-25 | 1981-08-04 | Hitachi, Ltd. | Semiconductor |
US4663833A (en) | 1984-05-14 | 1987-05-12 | Oki Electric Industry Co. Ltd. | Method for manufacturing IC plastic package with window |
USD317592S (en) * | 1987-01-19 | 1991-06-18 | Canon Kabushiki Kaisha | Semiconductor element |
US4916519A (en) * | 1989-05-30 | 1990-04-10 | International Business Machines Corporation | Semiconductor package |
US5172213A (en) * | 1991-05-23 | 1992-12-15 | At&T Bell Laboratories | Molded circuit package having heat dissipating post |
USD345731S (en) | 1992-12-03 | 1994-04-05 | Motorola, Inc. | Semiconductor package |
US5557504A (en) | 1993-08-31 | 1996-09-17 | Sgs-Thomson Microelectronics, Inc. | Surface mountable integrated circuit package with detachable module |
USD359028S (en) | 1993-09-02 | 1995-06-06 | Sgs-Thomson Microelectronics, Inc. | Socketed integrated circuit package |
USD358806S (en) | 1993-09-24 | 1995-05-30 | Sgs-Thomson Microelectronics, Inc. | Socketed integrated circuit package |
USD357901S (en) | 1993-09-27 | 1995-05-02 | Telefonaktiebolaget Lm Ericsson | Power supply unit |
USD394244S (en) | 1995-11-27 | 1998-05-12 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
US5798570A (en) | 1996-06-28 | 1998-08-25 | Kabushiki Kaisha Gotoh Seisakusho | Plastic molded semiconductor package with thermal dissipation means |
USD396213S (en) | 1996-09-09 | 1998-07-21 | Fuji Electric Co., Ltd. | Integrated circuit device |
USD396212S (en) | 1996-09-09 | 1998-07-21 | Fuji Electric Co., Ltd. | Integrated circuit device |
USD396211S (en) | 1996-09-09 | 1998-07-21 | Fuji Electric Co., Ltd. | Integrated circuit device |
USD396847S (en) | 1996-10-17 | 1998-08-11 | Matsushita Electronics Corporation | Semiconductor device |
US6093957A (en) | 1997-04-18 | 2000-07-25 | Lg Semicon Co., Ltd. | Multilayer lead frame structure that reduces cross-talk and semiconductor package using same and fabrication method thereof |
US20010038143A1 (en) * | 1997-06-12 | 2001-11-08 | Yukio Sonobe | Power semiconductor module |
USD421421S (en) | 1998-11-19 | 2000-03-07 | Honda Tsushin Kogyo Co., Ltd. | Connector receptacle for IC card |
US6238953B1 (en) | 1999-01-12 | 2001-05-29 | Sony Corporation | Lead frame, resin-encapsulated semiconductor device and fabrication process for the device |
USD427977S (en) | 1999-06-18 | 2000-07-11 | Fujikura Ltd. | Piezoelectric conversion type semiconductor device |
US6555899B1 (en) | 1999-10-15 | 2003-04-29 | Amkor Technology, Inc. | Semiconductor package leadframe assembly and method of manufacture |
USD432097S (en) | 1999-11-20 | 2000-10-17 | Samsung Electronics Co., Ltd. | Semiconductor package |
USD448739S1 (en) | 2000-09-12 | 2001-10-02 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD441727S1 (en) * | 2000-10-04 | 2001-05-08 | Sony Corporation | Semiconductor element |
USD466485S1 (en) | 2001-05-23 | 2002-12-03 | Shindengen Electric Manufactuturing Co., Ltd. | Semiconductor package |
US20030042584A1 (en) * | 2001-09-05 | 2003-03-06 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device and method of manufacturing the same |
USD466873S1 (en) | 2001-10-31 | 2002-12-10 | Siliconix Incorporated | Semiconductor chip package |
USD472528S1 (en) | 2001-10-31 | 2003-04-01 | Siliconix Incorporated | Semiconductor chip package |
USD473199S1 (en) | 2001-11-30 | 2003-04-15 | Kabushiki Kaisha Toshiba | Portion of semiconductor device |
USD480371S1 (en) | 2001-11-30 | 2003-10-07 | Kabushiki Kaisha Toshiba | Semiconductor device |
US6716670B1 (en) * | 2002-01-09 | 2004-04-06 | Bridge Semiconductor Corporation | Method of forming a three-dimensional stacked semiconductor package device |
USD476962S1 (en) | 2002-03-29 | 2003-07-08 | Kabushiki Kaisha Toshiba | Semiconductor device |
US6992386B2 (en) | 2003-07-31 | 2006-01-31 | Renesas Technology Corp. | Semiconductor device and a method of manufacturing the same |
USD548203S1 (en) | 2006-04-17 | 2007-08-07 | Kabushiki Kaisha Toshiba | Semiconductor |
USD548202S1 (en) | 2006-04-17 | 2007-08-07 | Kabushiki Kaisha Toshiba | Semiconductor |
USD539761S1 (en) | 2006-08-22 | 2007-04-03 | Kabushiki Kaisha Toshiba | Semiconductor |
US7683494B1 (en) * | 2008-06-18 | 2010-03-23 | Zilog, Inc. | Press-fit integrated circuit package involving compressed spring contact beams |
USD648290S1 (en) * | 2010-06-08 | 2011-11-08 | Miyoshi Electronics Corporation | Semiconductor device |
USD719926S1 (en) * | 2012-09-20 | 2014-12-23 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD717255S1 (en) | 2012-09-20 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD719113S1 (en) | 2012-09-20 | 2014-12-09 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD717256S1 (en) | 2012-09-20 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD717253S1 (en) | 2012-10-11 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD717254S1 (en) | 2012-10-11 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
USD770994S1 (en) | 2014-04-02 | 2016-11-08 | Mitsubishi Electric Corporation | Power semiconductor device |
USD783550S1 (en) | 2014-04-02 | 2017-04-11 | Mitsubishi Electric Corporation | Power semiconductor device |
USD796459S1 (en) * | 2016-04-11 | 2017-09-05 | Rohm Co., Ltd. | Packaged semiconductor circuit module |
USD824866S1 (en) | 2016-09-30 | 2018-08-07 | Rohm Co., Ltd. | Semiconductor device |
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD978809S1 (en) * | 2018-04-13 | 2023-02-21 | Rohm Co., Ltd. | Semiconductor module |
USD888673S1 (en) * | 2018-06-26 | 2020-06-30 | Rohm Co., Ltd. | Semiconductor module |
USD903613S1 (en) | 2018-06-26 | 2020-12-01 | Rohm Co., Ltd. | Semiconductor module |
USD913978S1 (en) | 2018-06-26 | 2021-03-23 | Rohm Co., Ltd. | Semiconductor module |
USD953565S1 (en) * | 2019-08-30 | 2022-05-31 | Kyocera Corporation | Analysis chip for biochemical testing machine |
USD945384S1 (en) * | 2019-09-26 | 2022-03-08 | Lapis Semiconductor Co., Ltd. | Semiconductor module |
USD934187S1 (en) * | 2020-01-21 | 2021-10-26 | Lang Cheng | Integrated circuit package |
USD972516S1 (en) * | 2020-01-28 | 2022-12-13 | Rohm Co., Ltd. | Semiconductor module |
USD971863S1 (en) * | 2020-01-28 | 2022-12-06 | Rohm Co., Ltd. | Semiconductor module |
USD981356S1 (en) * | 2020-01-28 | 2023-03-21 | Rohm Co., Ltd. | Semiconductor module |
USD969762S1 (en) * | 2020-04-06 | 2022-11-15 | Wolfspeed, Inc. | Power semiconductor package |
USD973029S1 (en) * | 2020-12-15 | 2022-12-20 | Rohm Co., Ltd. | Semiconductor device |
USD1011300S1 (en) * | 2021-09-01 | 2024-01-16 | Dexerials Corporation | Fuse |
USD1009819S1 (en) * | 2021-10-13 | 2024-01-02 | Rohm Co., Ltd. | Semiconductor device |
USD1009818S1 (en) * | 2021-10-13 | 2024-01-02 | Rohm Co., Ltd. | Semiconductor device |
USD1037187S1 (en) * | 2022-05-12 | 2024-07-30 | Alpha And Omega Semiconductor International Lp | Power semiconductor module |
USD1042375S1 (en) * | 2022-05-12 | 2024-09-17 | Alpha And Omega Semiconductor International Lp | Power semiconductor module |
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