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USD864135S1 - Semiconductor device - Google Patents

Semiconductor device Download PDF

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Publication number
USD864135S1
USD864135S1 US29/685,061 US201929685061F USD864135S US D864135 S1 USD864135 S1 US D864135S1 US 201929685061 F US201929685061 F US 201929685061F US D864135 S USD864135 S US D864135S
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US
United States
Prior art keywords
semiconductor device
view
ornamental design
side perspective
designs
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/685,061
Inventor
Shuhei Yokoyama
Maki Hasegawa
Shigeru Mori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JPD2017-23791F external-priority patent/JP1604094S/ja
Priority claimed from JPD2017-23790F external-priority patent/JP1604093S/ja
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to US29/685,061 priority Critical patent/USD864135S1/en
Assigned to MITSUBISHI ELECTRIC CORPORATION reassignment MITSUBISHI ELECTRIC CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HASEGAWA, MAKI, MORI, SHIGERU, YOKOYAMA, SHUHEI
Application granted granted Critical
Publication of USD864135S1 publication Critical patent/USD864135S1/en
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Description

FIG. 1 is a front, bottom and right side perspective view of a semiconductor device showing our new design;
FIG. 2 is a rear, top and left side perspective view thereof;
FIG. 3 is a front view thereof;
FIG. 4 is a rear view thereof;
FIG. 5 is a top view thereof;
FIG. 6 is a bottom view thereof;
FIG. 7 is a left side view thereof; and,
FIG. 8 is a right side view thereof.
The broken lines illustrate portions of the semiconductor device that form no part of the claimed designs.

Claims (1)

    CLAIM
  1. The ornamental design for a semiconductor device, as shown and described.
US29/685,061 2017-10-26 2019-03-26 Semiconductor device Active USD864135S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/685,061 USD864135S1 (en) 2017-10-26 2019-03-26 Semiconductor device

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2017-023790 2017-02-13
JPD2017-23791F JP1604094S (en) 2017-10-26 2017-10-26
JP2017-023791 2017-10-26
JPD2017-23790F JP1604093S (en) 2017-10-26 2017-10-26
US29/643,229 USD859334S1 (en) 2017-10-26 2018-04-05 Semiconductor device
US29/685,061 USD864135S1 (en) 2017-10-26 2019-03-26 Semiconductor device

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US29/643,229 Division USD859334S1 (en) 2017-10-26 2018-04-05 Semiconductor device

Publications (1)

Publication Number Publication Date
USD864135S1 true USD864135S1 (en) 2019-10-22

Family

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Family Applications (2)

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US29/643,229 Active USD859334S1 (en) 2017-10-26 2018-04-05 Semiconductor device
US29/685,061 Active USD864135S1 (en) 2017-10-26 2019-03-26 Semiconductor device

Family Applications Before (1)

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US29/643,229 Active USD859334S1 (en) 2017-10-26 2018-04-05 Semiconductor device

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US (2) USD859334S1 (en)

Cited By (16)

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Publication number Priority date Publication date Assignee Title
USD888673S1 (en) * 2018-06-26 2020-06-30 Rohm Co., Ltd. Semiconductor module
USD913978S1 (en) 2018-06-26 2021-03-23 Rohm Co., Ltd. Semiconductor module
USD934187S1 (en) * 2020-01-21 2021-10-26 Lang Cheng Integrated circuit package
USD945384S1 (en) * 2019-09-26 2022-03-08 Lapis Semiconductor Co., Ltd. Semiconductor module
USD953565S1 (en) * 2019-08-30 2022-05-31 Kyocera Corporation Analysis chip for biochemical testing machine
USD969762S1 (en) * 2020-04-06 2022-11-15 Wolfspeed, Inc. Power semiconductor package
USD971863S1 (en) * 2020-01-28 2022-12-06 Rohm Co., Ltd. Semiconductor module
USD972516S1 (en) * 2020-01-28 2022-12-13 Rohm Co., Ltd. Semiconductor module
USD973029S1 (en) * 2020-12-15 2022-12-20 Rohm Co., Ltd. Semiconductor device
USD978809S1 (en) * 2018-04-13 2023-02-21 Rohm Co., Ltd. Semiconductor module
USD981356S1 (en) * 2020-01-28 2023-03-21 Rohm Co., Ltd. Semiconductor module
USD1009819S1 (en) * 2021-10-13 2024-01-02 Rohm Co., Ltd. Semiconductor device
USD1009818S1 (en) * 2021-10-13 2024-01-02 Rohm Co., Ltd. Semiconductor device
USD1011300S1 (en) * 2021-09-01 2024-01-16 Dexerials Corporation Fuse
USD1037187S1 (en) * 2022-05-12 2024-07-30 Alpha And Omega Semiconductor International Lp Power semiconductor module
USD1042375S1 (en) * 2022-05-12 2024-09-17 Alpha And Omega Semiconductor International Lp Power semiconductor module

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USD864884S1 (en) * 2017-10-23 2019-10-29 Mitsubishi Electric Corporation Semiconductor device
USD856948S1 (en) * 2018-05-07 2019-08-20 Adura Led Solutions Llc Circuit board having arrangements of light-emitting diodes
JP1632999S (en) * 2018-06-12 2019-06-03
USD933618S1 (en) 2018-10-31 2021-10-19 Asahi Kasei Microdevices Corporation Semiconductor module
JP1633578S (en) * 2018-11-07 2019-06-10
JP1665773S (en) * 2018-11-07 2020-08-11
USD902164S1 (en) * 2019-01-24 2020-11-17 Toshiba Memory Corporation Integrated circuit card
USD932452S1 (en) * 2019-11-27 2021-10-05 The Noco Company Semiconductor device
USD920264S1 (en) * 2019-11-27 2021-05-25 The Noco Company Semiconductor device
USD1033355S1 (en) * 2021-07-29 2024-07-02 Rohm Co., Ltd. Semiconductor module
JP1711705S (en) * 2021-07-29 2022-04-04
JP1711706S (en) * 2021-07-29 2022-04-04
JP1727399S (en) * 2022-01-28 2022-10-14 semiconductor element
JP1725616S (en) * 2022-02-25 2022-09-26 semiconductor module

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USD548202S1 (en) 2006-04-17 2007-08-07 Kabushiki Kaisha Toshiba Semiconductor
USD548203S1 (en) 2006-04-17 2007-08-07 Kabushiki Kaisha Toshiba Semiconductor
US7683494B1 (en) * 2008-06-18 2010-03-23 Zilog, Inc. Press-fit integrated circuit package involving compressed spring contact beams
USD648290S1 (en) * 2010-06-08 2011-11-08 Miyoshi Electronics Corporation Semiconductor device
USD717256S1 (en) 2012-09-20 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717253S1 (en) 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717254S1 (en) 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717255S1 (en) 2012-09-20 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD719113S1 (en) 2012-09-20 2014-12-09 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD719926S1 (en) * 2012-09-20 2014-12-23 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD770994S1 (en) 2014-04-02 2016-11-08 Mitsubishi Electric Corporation Power semiconductor device
USD796459S1 (en) * 2016-04-11 2017-09-05 Rohm Co., Ltd. Packaged semiconductor circuit module
USD824866S1 (en) 2016-09-30 2018-08-07 Rohm Co., Ltd. Semiconductor device

Patent Citations (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3602846A (en) 1969-07-14 1971-08-31 Pulse Eng Inc Delay line
US3762039A (en) 1971-09-10 1973-10-02 Mos Technology Inc Plastic encapsulation of microcircuits
USD259560S (en) 1978-07-28 1981-06-16 Hitachi, Ltd. Semiconductor
USD259782S (en) 1978-07-28 1981-07-07 Hitachi, Ltd. Semiconductor
USD259783S (en) 1978-08-25 1981-07-07 Hitachi, Ltd. Semiconductor
USD260091S (en) 1978-08-25 1981-08-04 Hitachi, Ltd. Semiconductor
US4663833A (en) 1984-05-14 1987-05-12 Oki Electric Industry Co. Ltd. Method for manufacturing IC plastic package with window
USD317592S (en) * 1987-01-19 1991-06-18 Canon Kabushiki Kaisha Semiconductor element
US4916519A (en) * 1989-05-30 1990-04-10 International Business Machines Corporation Semiconductor package
US5172213A (en) * 1991-05-23 1992-12-15 At&T Bell Laboratories Molded circuit package having heat dissipating post
USD345731S (en) 1992-12-03 1994-04-05 Motorola, Inc. Semiconductor package
US5557504A (en) 1993-08-31 1996-09-17 Sgs-Thomson Microelectronics, Inc. Surface mountable integrated circuit package with detachable module
USD359028S (en) 1993-09-02 1995-06-06 Sgs-Thomson Microelectronics, Inc. Socketed integrated circuit package
USD358806S (en) 1993-09-24 1995-05-30 Sgs-Thomson Microelectronics, Inc. Socketed integrated circuit package
USD357901S (en) 1993-09-27 1995-05-02 Telefonaktiebolaget Lm Ericsson Power supply unit
USD394244S (en) 1995-11-27 1998-05-12 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
US5798570A (en) 1996-06-28 1998-08-25 Kabushiki Kaisha Gotoh Seisakusho Plastic molded semiconductor package with thermal dissipation means
USD396213S (en) 1996-09-09 1998-07-21 Fuji Electric Co., Ltd. Integrated circuit device
USD396212S (en) 1996-09-09 1998-07-21 Fuji Electric Co., Ltd. Integrated circuit device
USD396211S (en) 1996-09-09 1998-07-21 Fuji Electric Co., Ltd. Integrated circuit device
USD396847S (en) 1996-10-17 1998-08-11 Matsushita Electronics Corporation Semiconductor device
US6093957A (en) 1997-04-18 2000-07-25 Lg Semicon Co., Ltd. Multilayer lead frame structure that reduces cross-talk and semiconductor package using same and fabrication method thereof
US20010038143A1 (en) * 1997-06-12 2001-11-08 Yukio Sonobe Power semiconductor module
USD421421S (en) 1998-11-19 2000-03-07 Honda Tsushin Kogyo Co., Ltd. Connector receptacle for IC card
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USD466873S1 (en) 2001-10-31 2002-12-10 Siliconix Incorporated Semiconductor chip package
USD472528S1 (en) 2001-10-31 2003-04-01 Siliconix Incorporated Semiconductor chip package
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USD548202S1 (en) 2006-04-17 2007-08-07 Kabushiki Kaisha Toshiba Semiconductor
USD539761S1 (en) 2006-08-22 2007-04-03 Kabushiki Kaisha Toshiba Semiconductor
US7683494B1 (en) * 2008-06-18 2010-03-23 Zilog, Inc. Press-fit integrated circuit package involving compressed spring contact beams
USD648290S1 (en) * 2010-06-08 2011-11-08 Miyoshi Electronics Corporation Semiconductor device
USD719926S1 (en) * 2012-09-20 2014-12-23 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717255S1 (en) 2012-09-20 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD719113S1 (en) 2012-09-20 2014-12-09 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717256S1 (en) 2012-09-20 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717253S1 (en) 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717254S1 (en) 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD770994S1 (en) 2014-04-02 2016-11-08 Mitsubishi Electric Corporation Power semiconductor device
USD783550S1 (en) 2014-04-02 2017-04-11 Mitsubishi Electric Corporation Power semiconductor device
USD796459S1 (en) * 2016-04-11 2017-09-05 Rohm Co., Ltd. Packaged semiconductor circuit module
USD824866S1 (en) 2016-09-30 2018-08-07 Rohm Co., Ltd. Semiconductor device

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD978809S1 (en) * 2018-04-13 2023-02-21 Rohm Co., Ltd. Semiconductor module
USD888673S1 (en) * 2018-06-26 2020-06-30 Rohm Co., Ltd. Semiconductor module
USD903613S1 (en) 2018-06-26 2020-12-01 Rohm Co., Ltd. Semiconductor module
USD913978S1 (en) 2018-06-26 2021-03-23 Rohm Co., Ltd. Semiconductor module
USD953565S1 (en) * 2019-08-30 2022-05-31 Kyocera Corporation Analysis chip for biochemical testing machine
USD945384S1 (en) * 2019-09-26 2022-03-08 Lapis Semiconductor Co., Ltd. Semiconductor module
USD934187S1 (en) * 2020-01-21 2021-10-26 Lang Cheng Integrated circuit package
USD972516S1 (en) * 2020-01-28 2022-12-13 Rohm Co., Ltd. Semiconductor module
USD971863S1 (en) * 2020-01-28 2022-12-06 Rohm Co., Ltd. Semiconductor module
USD981356S1 (en) * 2020-01-28 2023-03-21 Rohm Co., Ltd. Semiconductor module
USD969762S1 (en) * 2020-04-06 2022-11-15 Wolfspeed, Inc. Power semiconductor package
USD973029S1 (en) * 2020-12-15 2022-12-20 Rohm Co., Ltd. Semiconductor device
USD1011300S1 (en) * 2021-09-01 2024-01-16 Dexerials Corporation Fuse
USD1009819S1 (en) * 2021-10-13 2024-01-02 Rohm Co., Ltd. Semiconductor device
USD1009818S1 (en) * 2021-10-13 2024-01-02 Rohm Co., Ltd. Semiconductor device
USD1037187S1 (en) * 2022-05-12 2024-07-30 Alpha And Omega Semiconductor International Lp Power semiconductor module
USD1042375S1 (en) * 2022-05-12 2024-09-17 Alpha And Omega Semiconductor International Lp Power semiconductor module

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