Nothing Special   »   [go: up one dir, main page]

USD845369S1 - Spoked solder pad - Google Patents

Spoked solder pad Download PDF

Info

Publication number
USD845369S1
USD845369S1 US29/636,910 US201829636910F USD845369S US D845369 S1 USD845369 S1 US D845369S1 US 201829636910 F US201829636910 F US 201829636910F US D845369 S USD845369 S US D845369S
Authority
US
United States
Prior art keywords
solder pad
spoked
spoked solder
view
illustrative
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/636,910
Inventor
Myron Walker
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to US29/636,910 priority Critical patent/USD845369S1/en
Application granted granted Critical
Publication of USD845369S1 publication Critical patent/USD845369S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Description

FIG. 1 is a top plan view of my new design for a solder pad.
FIG. 2 is a top plan view of the solder pad of FIG. 1 with illustrative radial axes drawn.
FIG. 3 is a top plan view of the solder pad of FIG. 1 with illustrative adjacent circuit board traces and vias.
FIG. 4 is a perspective view of the solder pad of FIG. 1 on an illustrative integrated circuit package; and,
FIG. 5 is a perspective view of the solder pad of FIG. 1 on an illustrative circuit board.
Broken line illustrations of environmental structure in the drawings, including the radial axes in FIG. 2, circuit board traces and vias in FIG. 3, integrated circuit package outlines in FIG. 4, and circuit board outlines in FIG. 5, are provided for illustrative purposes only and form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a spoked solder pad, as shown and described.
US29/636,910 2014-12-19 2018-02-12 Spoked solder pad Active USD845369S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/636,910 USD845369S1 (en) 2014-12-19 2018-02-12 Spoked solder pad

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US29/512,592 USD816135S1 (en) 2014-12-19 2014-12-19 Spoked solder pad
US29/636,910 USD845369S1 (en) 2014-12-19 2018-02-12 Spoked solder pad

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US29/512,592 Division USD816135S1 (en) 2014-12-19 2014-12-19 Spoked solder pad

Publications (1)

Publication Number Publication Date
USD845369S1 true USD845369S1 (en) 2019-04-09

Family

ID=61951999

Family Applications (3)

Application Number Title Priority Date Filing Date
US29/512,592 Active USD816135S1 (en) 2014-12-19 2014-12-19 Spoked solder pad
US29/636,910 Active USD845369S1 (en) 2014-12-19 2018-02-12 Spoked solder pad
US29/636,907 Active USD845368S1 (en) 2014-12-19 2018-02-12 Spoked solder pad

Family Applications Before (1)

Application Number Title Priority Date Filing Date
US29/512,592 Active USD816135S1 (en) 2014-12-19 2014-12-19 Spoked solder pad

Family Applications After (1)

Application Number Title Priority Date Filing Date
US29/636,907 Active USD845368S1 (en) 2014-12-19 2018-02-12 Spoked solder pad

Country Status (1)

Country Link
US (3) USD816135S1 (en)

Citations (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61102089A (en) 1984-10-25 1986-05-20 松下電工株式会社 Mount structure of flat package ic
JPH09107173A (en) 1995-10-11 1997-04-22 Tokai Rika Co Ltd Pad structure and wiring board device
US5900674A (en) 1996-12-23 1999-05-04 General Electric Company Interface structures for electronic devices
US6054563A (en) 1997-03-05 2000-04-25 Rhodia Chimie Preparation of solid, powdery rare earth carboxylates by evaporation method
US20020071642A1 (en) 1999-09-09 2002-06-13 Fujitsu Limited Installation structure and method for optical parts and electric parts
US20020092672A1 (en) 2001-01-16 2002-07-18 Primavera Anthony A. Contact pads and circuit boards incorporating same
US20030057515A1 (en) 1999-11-19 2003-03-27 Fillion Raymond Albert Methods of fabrication of electronic interface structures
US20040020972A1 (en) 2002-07-30 2004-02-05 Yoshiyuki Miyajima Printed circuit board and soldering structure for electronic parts thereto
US20070126030A1 (en) 2005-12-02 2007-06-07 Sony Corporation Semiconductor device and method for manufacturing same, and semiconductor wafer
USD571810S1 (en) * 2006-06-20 2008-06-24 Kabushiki Kaisha Toshiba Module with built-in integrated circuits for use with IC cards
US20090091025A1 (en) 2007-10-04 2009-04-09 Agency For Science, Technology And Research Method for forming and releasing interconnects
US20090211087A1 (en) 2004-07-08 2009-08-27 International Business Machines Corporation Method and system for improving alignment precision of parts in mems
US7902666B1 (en) 2009-10-05 2011-03-08 Powertech Technology Inc. Flip chip device having soldered metal posts by surface mounting
US20110067911A1 (en) 2008-06-12 2011-03-24 Mitsubishi Materials Corporation Method of bonding parts to substrate using solder paste
US20130323526A1 (en) 2012-05-29 2013-12-05 Essence Solar Solutions Ltd. Self aligning soldering
USD701864S1 (en) * 2012-04-23 2014-04-01 Blackberry Limited UICC apparatus
USD702240S1 (en) * 2012-04-13 2014-04-08 Blackberry Limited UICC apparatus

Patent Citations (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61102089A (en) 1984-10-25 1986-05-20 松下電工株式会社 Mount structure of flat package ic
JPH09107173A (en) 1995-10-11 1997-04-22 Tokai Rika Co Ltd Pad structure and wiring board device
US5900674A (en) 1996-12-23 1999-05-04 General Electric Company Interface structures for electronic devices
US6054563A (en) 1997-03-05 2000-04-25 Rhodia Chimie Preparation of solid, powdery rare earth carboxylates by evaporation method
US20020071642A1 (en) 1999-09-09 2002-06-13 Fujitsu Limited Installation structure and method for optical parts and electric parts
US20030057515A1 (en) 1999-11-19 2003-03-27 Fillion Raymond Albert Methods of fabrication of electronic interface structures
US20020092672A1 (en) 2001-01-16 2002-07-18 Primavera Anthony A. Contact pads and circuit boards incorporating same
US20040020972A1 (en) 2002-07-30 2004-02-05 Yoshiyuki Miyajima Printed circuit board and soldering structure for electronic parts thereto
US20090211087A1 (en) 2004-07-08 2009-08-27 International Business Machines Corporation Method and system for improving alignment precision of parts in mems
US20070126030A1 (en) 2005-12-02 2007-06-07 Sony Corporation Semiconductor device and method for manufacturing same, and semiconductor wafer
USD571810S1 (en) * 2006-06-20 2008-06-24 Kabushiki Kaisha Toshiba Module with built-in integrated circuits for use with IC cards
US20090091025A1 (en) 2007-10-04 2009-04-09 Agency For Science, Technology And Research Method for forming and releasing interconnects
US20110067911A1 (en) 2008-06-12 2011-03-24 Mitsubishi Materials Corporation Method of bonding parts to substrate using solder paste
US7902666B1 (en) 2009-10-05 2011-03-08 Powertech Technology Inc. Flip chip device having soldered metal posts by surface mounting
USD702240S1 (en) * 2012-04-13 2014-04-08 Blackberry Limited UICC apparatus
USD701864S1 (en) * 2012-04-23 2014-04-01 Blackberry Limited UICC apparatus
USD702241S1 (en) * 2012-04-23 2014-04-08 Blackberry Limited UICC apparatus
US20130323526A1 (en) 2012-05-29 2013-12-05 Essence Solar Solutions Ltd. Self aligning soldering

Also Published As

Publication number Publication date
USD845368S1 (en) 2019-04-09
USD816135S1 (en) 2018-04-24

Similar Documents

Publication Publication Date Title
USD834094S1 (en) Board game
USD851829S1 (en) Personal carrying case for electronic vaping devices
USD839830S1 (en) Protective electrical wiring device
USD781807S1 (en) Portable electronic device
USD773325S1 (en) Mount for portable electronic devices
USD800732S1 (en) Electronic device shell
USD763857S1 (en) Electronic device shell
USD758649S1 (en) Electronic cigarette
USD732852S1 (en) Table for electronic device
USD725887S1 (en) Upper of a footwear article
USD725888S1 (en) Upper of a footwear article
USD725886S1 (en) Upper of a footwear article
USD725890S1 (en) Upper of a footwear article
USD726402S1 (en) Upper of a footwear article
USD725885S1 (en) Upper of a footwear article
USD725894S1 (en) Upper of a footwear article
USD714581S1 (en) Electronic kettle
USD725371S1 (en) Upper of a footwear article
USD713890S1 (en) Game board apparatus
USD725884S1 (en) Upper of a footwear article
USD725369S1 (en) Upper of a footwear article
USD725370S1 (en) Upper of a footwear article
USD702686S1 (en) Tri-connector attachment for electronic devices
USD816774S1 (en) Spiral pattern for cribbage board
USD725372S1 (en) Upper of a footwear article

Legal Events

Date Code Title Description
FEPP Fee payment procedure

Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY

FEPP Fee payment procedure

Free format text: ENTITY STATUS SET TO SMALL (ORIGINAL EVENT CODE: SMAL); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY