US9180551B2 - Dual laser head - Google Patents
Dual laser head Download PDFInfo
- Publication number
- US9180551B2 US9180551B2 US13/904,617 US201313904617A US9180551B2 US 9180551 B2 US9180551 B2 US 9180551B2 US 201313904617 A US201313904617 A US 201313904617A US 9180551 B2 US9180551 B2 US 9180551B2
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- laser
- machine tool
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/02—Carriages for supporting the welding or cutting element
- B23K37/0211—Carriages for supporting the welding or cutting element travelling on a guide member, e.g. rail, track
- B23K37/0235—Carriages for supporting the welding or cutting element travelling on a guide member, e.g. rail, track the guide member forming part of a portal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/034—Observing the temperature of the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
- B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
- B23K26/0884—Devices involving movement of the laser head in at least one axial direction in at least two axial directions in at least in three axial directions, e.g. manipulators, robots
-
- B23K26/1405—
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/361—Removing material for deburring or mechanical trimming
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
-
- B23K26/365—
-
- B23K26/381—
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B23K26/4065—
-
- B23K26/4075—
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/57—Working by transmitting the laser beam through or within the workpiece the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/30—Organic material
- B23K2103/42—Plastics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
Definitions
- the present invention relates to a laser machine tool and laser heads for the machining of workpieces by laser ablation.
- FIG. 1 An imaginable configuration and design for such a known laser machine tool for machining workpieces by laser ablation is shown in FIG. 1 .
- the laser head 1 of the displayed machine operates with 5 mechanical axes and allows the positioning of the laser focal point and the direction of the emitted laser beam on the surface of a three-dimensional solid workpieces situated within the machine (not shown).
- a workpiece-holder or—as shown in FIG. 1 a laser head which is linear movable in three axis (Cartesian X, Y, Z system).
- the workpiece-holder or the laser head are in addition able to rotate with high precision on two rotational axes.
- the present invention aims therefore to solve this problem.
- the object of this invention is achieved by providing a laser machine tool for the machining of workpieces by laser ablation with a moveable laser head.
- FIG. 1 illustrates a laser machine tool having a laser head known in the prior art.
- FIGS. 2 and 3 illustrate a laser machine tool in accordance with the present invention.
- FIGS. 4 through 6 illustrate an embodiment of dual laser head in accordance with the present invention.
- a moveable laser head incorporating in its housing two laser sources each emitting a different, dedicated type of laser beams.
- the two laser beams have preferably the same input optical axis (collinear).
- the used galvanometer module contains 2 mirrors rotating with 2 servomotors (galvanometers).
- the galvanometer is able to move the laser beam very fast in 2 directions. This permits to cover a surface on the workpiece which is proportional to the F-Theta lens used.
- the inventive dual laser head even bulky workpiece have to be clamped and positioned only once in the laser machine tool.
- the moveable dual laser head just moves around the workpiece and accomplish the necessary machining steps without the need to move or to reposition the clamped bulky workpiece.
- the laser machining according to the invention requires the use of just one galvanometric head to move the laser beam resp. laser spot over the workpiece surface. This allows to perform a percussion drilling, in circular trepanning or in spiral trepanning.
- the dual laser head also allows, in the case of percussion drilling, to rotate the beam with a very small diameter, close to 0, which improves the edge and geometry of the produced hole.
- the 5 axis laser machine tool is preferably designed in the gantry type, with a moveable laser head on three linear axes plus two rotary axes.
- FIGS. 2 and 3 illustrate the laser machine tool according to the invention.
- FIG. 2 illustrates an example of a 5-axis gantry laser machine tool equipped with a moveable laser head according to the invention.
- the dual laser head 4 displayed can move on three linear axes X, Y, Z and on two rotary axes A, B.
- a workpiece (not visible) can be clamped on the table resp. workpiece-holder 7 within the laser machine tool.
- the displayed laser machine tool contains an integrated vacuum cleaner 3 to collect the fumes and dust around the laser head and a switch box integrated on the Z-axis.
- the machine has an opening to allow the loading of bulky workpieces, which can be closed for instance by a sliding door.
- the machine can further be equipped with a fume and dust suction hood 6 at the bottom of the machine.
- workpiece-holder 7 with for instance a threads holes matrix is intended for fixing the workpiece.
- the holder 7 can for instance be allocated directly on the ground.
- the machine is equipped, on all axes, with linear and rotary absolute encoders, which avoids having to reset the origins after a power outage.
- FIG. 3 illustrates a possible configuration for the inventive dual laser head 4 .
- the A-axis rotates around a horizontal axis parallel to the Y-axis.
- the B-axis is concentric to the Z-axis.
- Each axis is controlled preferably by a “Direct Drive” servomotor.
- the dual head includes a large number of functions integrated in one compact block. It is packed with components and energy transmission systems (mechanical, optical, electronic, electrical or compressed air) in a small footprint. All optics and the galvanometric head 2 are placed preferably in a pressurized compartment, called “white zone”, to ensure a good working life of the optics. Lasers and electrical components are placed in a so-called “grey” zone protected from dust.
- the dual laser head 4 incorporates in its housing two separate laser sources 8 , whereby each laser source emits a different type of laser beams. The first type of laser beams emitted by the first laser source are suitable for drilling operations. The second type of laser beams emitted by the second laser source is suitable for engraving operations on the workpiece.
- the two laser sources mounted in the dual laser head cannot operate simultaneously. In a further embodiment of the invention it is foreseen to design the laser head with more than two laser sources.
- FIGS. 4 , 5 and 6 illustrate a possible embodiment of the invention, showing the dual laser head in later view. Visible are the two different laser sources 8 , a camera 9 and the galvanometer 2 .
- the upper laser source 8 is an engraving laser. Further visible is in FIG. 4 the path of the laser beams from the laser source to the input of the galvanometric head 2 .
- the second, under laser source 8 is working. This second laser source is intended for several other purposes, particularly for drilling, or welding, or cutting or for a post-engraving treatment (e.g. heat treatment) of the workpiece.
- the camera 9 is active and uses the galvanometer 2 installed in the laser head for the image acquisition.
- the camera 9 can be used for several purposes. E.g. for a position resetting, such as centring an engraving around an existing hole or engraving in the centre of a groove (e.g. vents in glass moulds). Or it can be used for the analysis of the laser beam return (with an infrared/visible separation optic or with an diode instead respectively in combination with a camera). A further, possible application can be the automatic resetting on the Z-axis, by analysing the position of two triangulated laser beam.
- a position resetting such as centring an engraving around an existing hole or engraving in the centre of a groove (e.g. vents in glass moulds).
- it can be used for the analysis of the laser beam return (with an infrared/visible separation optic or with an diode instead respectively in combination with a camera).
- a further, possible application can be the automatic resetting on the Z-axis, by analysing the position of two triangulated laser beam.
- the first laser source producing the first type of laser beams emits laser pulses of 1500 W intensity for a duration of a single pulse of 20 ms up to a frequency of 1000 Hz up to CW (Continuous Waves) and is intended for drilling operations, for post-engraving treatment, micro drilling, micro welding, micro cuts or heat treatment for the local hardening of the workpiece of the dual laser head.
- the second laser source producing the second type of laser beams emits laser pulses of 20 W to a maximum of 250 W intensity, preferably 50 W or 100 W. That laser source is intended for engraving operations.
- Fiber Laser sources can be applied for cutting, welding, heat treatments from 1000 to 2000 W.
- the machine can be used just for milling or for engraving purposes of a workpiece.
- the laser head contains one galvanometer through which the laser beams of both laser sources are directed to the workpiece to be machined.
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Robotics (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
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- The dual laser head moveable on 5 axis allows a high-precision positioning of the laser tool, because it is the working head which rotates around the workpiece, while the workpiece remains fixed on the table. If the workpieces were to be moved, the precision would necessarily be lower given the weight and size of bulky workpieces. The invention allows the machining of heavy and large workpieces (e.g. moulds of 18′000 kg and 4000×3000×1500 mm size).
- A higher flexibility, since the inventive dual laser head offers the option to use either one or the other laser source depending on the application. The two lasers can however never operate simultaneously.
- An optional camera offers in addition the possibility to see the working area within the machine, eventually via an infrared/visible beam splitter. An optional camera offers also the possibility of performing some calibration and gauge tasks by keeping the machine door closed. An LCD shutter allows synchronising laser shots with the image display, analysis of plasma stain etc. It is also possible to install a thermal camera when using a laser for local heat treatment or a diode sensor for gauging the reflected laser power that returns to the laser.
- Further, all laser optical elements, camera and optical components move with precision at the same time with the galvanometric head and are mounted in the same rigid housing of the laser head. There are therefore no possible misalignments between all these elements.
- The necessary cables pass inside the axes of the rotation motors. Guides allow recentring the cables to the neutral axis in the rotor to prevent rubbing and twisting. It also avoids parasitic torques on the axes that may cause machining imprecisions.
- Suction nozzles can be placed around the dual laser head, allowing to collect fumes and dust and discharged by a dedicated vacuum cleaner.
- Preferably a process monitoring camera (IP type) is also installed, equipped with lighting, monitors the proper functioning of the machine (e.g. remotely via the Internet).
- Optionally, a camera positioned on the side of the head allows calibrating or positioning the machine with precision on a point of the workpiece.
- Optionally, a retractable 3D touch probe allows to locate with precision the work piece in 3D.
- Further, a photo sensor optionally installed allows measuring the power return of the laser source in use.
Claims (11)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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EP12170208.8A EP2669038B1 (en) | 2012-05-31 | 2012-05-31 | Dual laser head |
EP12170208 | 2012-05-31 | ||
EP12170208.8 | 2012-05-31 |
Publications (2)
Publication Number | Publication Date |
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US20130319981A1 US20130319981A1 (en) | 2013-12-05 |
US9180551B2 true US9180551B2 (en) | 2015-11-10 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US13/904,617 Active 2034-05-06 US9180551B2 (en) | 2012-05-31 | 2013-05-29 | Dual laser head |
Country Status (4)
Country | Link |
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US (1) | US9180551B2 (en) |
EP (1) | EP2669038B1 (en) |
JP (1) | JP6150619B2 (en) |
TW (1) | TWI626104B (en) |
Cited By (3)
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RU2639200C1 (en) * | 2016-10-14 | 2017-12-20 | Российская Федерация, от имени которой выступает Государственная корпорация по атомной энергии "Росатом" (Госкорпорация "Росатом") | Method of double-laser welding |
IT201900009366A1 (en) | 2019-06-18 | 2020-12-18 | Prima Ind Spa | LASER PROCESSING APPARATUS AND CORRESPONDING LASER PROCESSING PROCESS |
US11935978B2 (en) | 2017-09-08 | 2024-03-19 | The Regents Of The University Of Michigan | Electromagnetic energy converter |
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Publication number | Priority date | Publication date | Assignee | Title |
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CN107020451B (en) * | 2017-06-19 | 2019-09-24 | 中国工程物理研究院激光聚变研究中心 | The laser output device of rotatable scanning |
JP6603278B2 (en) * | 2017-08-31 | 2019-11-06 | ファナック株式会社 | Fiber selector and laser device |
CN111673292B (en) * | 2020-06-04 | 2022-05-27 | 西安中科微精光子科技股份有限公司 | RTCP error calibration compensation method for five-axis laser processing equipment |
RU2750603C1 (en) * | 2020-09-02 | 2021-06-29 | Российская Федерация, от имени которой выступает ФОНД ПЕРСПЕКТИВНЫХ ИССЛЕДОВАНИЙ | Apparatus for production of parts using additive-subtractive-hardening technology |
CN112404755B (en) * | 2020-09-23 | 2023-10-03 | 浙江圣石激光科技股份有限公司 | Laser drilling method for photovoltaic glass |
CN113751882A (en) * | 2021-09-01 | 2021-12-07 | 苏州和瑞科智能装备有限公司 | Double-station laser engraving machine and control method thereof |
CN117139848B (en) * | 2023-07-07 | 2024-04-12 | 上海君屹工业自动化股份有限公司 | Flexible multi-compatible laser welding system and multi-compatible welding device thereof |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5239160A (en) * | 1990-08-14 | 1993-08-24 | Tsubakimoto Chain Co. | Five-axis table for laser beam machine tool |
US5779696A (en) * | 1990-07-23 | 1998-07-14 | Sunrise Technologies International, Inc. | Method and apparatus for performing corneal reshaping to correct ocular refractive errors |
US20050205778A1 (en) | 2003-10-17 | 2005-09-22 | Gsi Lumonics Corporation | Laser trim motion, calibration, imaging, and fixturing techniques |
US20060113375A1 (en) | 2003-06-16 | 2006-06-01 | Caiger Simon G | Monitoring and controlling of laser operation |
US20090191481A1 (en) * | 2008-01-25 | 2009-07-30 | Fujifilm Corporation | Method of manufacturing relief printing plate and printing plate precursor for laser engraving |
US20090206065A1 (en) | 2006-06-20 | 2009-08-20 | Jean-Pierre Kruth | Procedure and apparatus for in-situ monitoring and feedback control of selective laser powder processing |
US20100044356A1 (en) * | 2008-08-22 | 2010-02-25 | Pioneer Hi-Bred International, Inc. | Apparatus for removal of specific seed tissue or structure for seed analysis |
DE102009037979A1 (en) | 2009-08-18 | 2011-02-24 | Georg Meyndt | Device for coupling laser diodes such as single emitter or diode bars, which are arranged rotational-symmetrical to an optical and mechanical axis, where the fast-axis of the laser diodes or bars continually presents itself in a plane |
EP2301706A2 (en) | 2009-09-25 | 2011-03-30 | Agie Charmilles SA | Laser machining machine |
US20110204045A1 (en) | 2008-05-02 | 2011-08-25 | Applied Materials, Inc. | Suitably short wavelength light for laser annealing of silicon in dsa type systems |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001147399A (en) * | 1999-11-18 | 2001-05-29 | Nec Corp | Laser beam machining device and adjusting method therefor |
JP5010832B2 (en) * | 2006-01-19 | 2012-08-29 | 株式会社ディスコ | Laser processing equipment |
JP4833773B2 (en) * | 2006-08-31 | 2011-12-07 | 本田技研工業株式会社 | Micro drilling method |
DE102007061549B4 (en) * | 2007-12-20 | 2010-06-17 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Method for changing the beam diameter of a laser beam in a working plane and arrangement designed for this purpose |
CN101750711B (en) * | 2008-12-19 | 2011-12-21 | 财团法人工业技术研究院 | Focusing method and automatic focusing device and detection module thereof |
JP2012170956A (en) * | 2011-02-17 | 2012-09-10 | Amada Co Ltd | Laser processing machine |
JP2013180295A (en) * | 2012-02-29 | 2013-09-12 | Mitsubishi Heavy Ind Ltd | Machining apparatus and machining method |
-
2012
- 2012-05-31 EP EP12170208.8A patent/EP2669038B1/en active Active
-
2013
- 2013-04-25 TW TW102114848A patent/TWI626104B/en active
- 2013-05-29 US US13/904,617 patent/US9180551B2/en active Active
- 2013-05-31 JP JP2013115533A patent/JP6150619B2/en active Active
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5779696A (en) * | 1990-07-23 | 1998-07-14 | Sunrise Technologies International, Inc. | Method and apparatus for performing corneal reshaping to correct ocular refractive errors |
US5239160A (en) * | 1990-08-14 | 1993-08-24 | Tsubakimoto Chain Co. | Five-axis table for laser beam machine tool |
US20060113375A1 (en) | 2003-06-16 | 2006-06-01 | Caiger Simon G | Monitoring and controlling of laser operation |
US20050205778A1 (en) | 2003-10-17 | 2005-09-22 | Gsi Lumonics Corporation | Laser trim motion, calibration, imaging, and fixturing techniques |
US20090206065A1 (en) | 2006-06-20 | 2009-08-20 | Jean-Pierre Kruth | Procedure and apparatus for in-situ monitoring and feedback control of selective laser powder processing |
US20090191481A1 (en) * | 2008-01-25 | 2009-07-30 | Fujifilm Corporation | Method of manufacturing relief printing plate and printing plate precursor for laser engraving |
US20110204045A1 (en) | 2008-05-02 | 2011-08-25 | Applied Materials, Inc. | Suitably short wavelength light for laser annealing of silicon in dsa type systems |
US20100044356A1 (en) * | 2008-08-22 | 2010-02-25 | Pioneer Hi-Bred International, Inc. | Apparatus for removal of specific seed tissue or structure for seed analysis |
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EP2301706A2 (en) | 2009-09-25 | 2011-03-30 | Agie Charmilles SA | Laser machining machine |
US20110120981A1 (en) | 2009-09-25 | 2011-05-26 | Agie Charmilles Sa | Laser machining machine |
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RU2639200C1 (en) * | 2016-10-14 | 2017-12-20 | Российская Федерация, от имени которой выступает Государственная корпорация по атомной энергии "Росатом" (Госкорпорация "Росатом") | Method of double-laser welding |
US11935978B2 (en) | 2017-09-08 | 2024-03-19 | The Regents Of The University Of Michigan | Electromagnetic energy converter |
IT201900009366A1 (en) | 2019-06-18 | 2020-12-18 | Prima Ind Spa | LASER PROCESSING APPARATUS AND CORRESPONDING LASER PROCESSING PROCESS |
Also Published As
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US20130319981A1 (en) | 2013-12-05 |
JP2013248669A (en) | 2013-12-12 |
TWI626104B (en) | 2018-06-11 |
JP6150619B2 (en) | 2017-06-21 |
TW201404513A (en) | 2014-02-01 |
EP2669038B1 (en) | 2021-06-23 |
EP2669038A1 (en) | 2013-12-04 |
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