US3839023A - Creep resistant lead alloys - Google Patents
Creep resistant lead alloys Download PDFInfo
- Publication number
- US3839023A US3839023A US00303203A US30320372A US3839023A US 3839023 A US3839023 A US 3839023A US 00303203 A US00303203 A US 00303203A US 30320372 A US30320372 A US 30320372A US 3839023 A US3839023 A US 3839023A
- Authority
- US
- United States
- Prior art keywords
- lead
- alloys
- alloy
- barium
- creep
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C11/00—Alloys based on lead
- C22C11/02—Alloys based on lead with an alkali or an alkaline earth metal as the next major constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M4/00—Electrodes
- H01M4/02—Electrodes composed of, or comprising, active material
- H01M4/64—Carriers or collectors
- H01M4/66—Selection of materials
- H01M4/68—Selection of materials for use in lead-acid accumulators
- H01M4/685—Lead alloys
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Definitions
- ABSTRACT A creep resistant lead alloy comprising 0.001 1.0
- the present invention relates to lead alloys having improved mechanical properties and is concerned more particularly with lead alloys having high creep resistance.
- solder alloys with a low creep resistance show important drawbacks when used in certain fields of application or their application is considerably limited for this reason.
- the low creep resistance of solder alloys is often an important drawback since for example standard solder alloys do not even transmit the stress caused by the thermal expansion of soldered zinc roof gutters having a length of several meters.
- solder alloys are limited in their application if they must support a constant load in one direction, and also for example at elevated temperatures.
- the standard alloy for batteries is the PbSb -alloy with varying As contents.
- the admissible load for this alloy at a limitation of the creep characteristics to 1 percent per year is in the range of 30 to 70 kp/cm at room temperature (Hofman, Lead and Lead-Alloys, Springer Verlag, 2nd edition, page 227). Due to the migration of the antimony and the resulting contamination of the cell, there is still a tendency to reduce the antimony content of such alloys. So far, lead alloys with high creep strength and high fatigue strength without an antimony content are also advantageous for the battery manufacturing industry. Due to the higher rigidity of the alloys of the present invention, the weight of the batteries could be decreased by using grids of less thickness.
- the object of the present invention is to provide lead alloys having a higher creep resistance by which the above mentioned drawbacks are overcome and new fields of application can be opened.
- the lead alloys according to the present invention comprise 0.001 1.0 percent by weight of barium (Ba) and at least one element from the group consisting of silver (Ag), aluminum (Al), boron (B), bismuth (Bi), cadmium (Cd), magnesium (Mg), oxygen (0), hydrogen (H), sulphur (S), antimony (Sb), selenium (Se), silicon (Si), tin (Sn), zinc (Zn), tellurium (Te), the barium and the other element being present in a combination which has been formed either in the liquid or in the solid state of the alloy and which has a dispersion strengthening effect and/or which leads to order states in the lattice and/or to order like states (cluster formation) that have a strengthening effect.
- element from the group consisting of silver (Ag), aluminum (Al), boron (B), bismuth (Bi), cadmium (Cd), magnesium (Mg), oxygen (0), hydrogen (H), sulphur (
- Preferred creep resistant lead alloys are those alloys which consist of 0.01 1.0 percent by weight of barium (Ba) and one element in the given amounts of the mentioned group, balance lead or lead-tin.
- the alloys according to the invention must be corrosion resistant to the attack of diluted sulphuric acid.
- the alloys according to the invention did not show a worse corrosion behaviour than high-grade lead.
- a creep resistant lead alloy cons1st1ng essentlally f- Hydrogen 0.001 0.2% 0.00l1.0 percent by weight barium, Sulphur at least one addmonal element of the group consist- 5 selcmum 1/! ing of silver, boron, hydrogen, oxygen, sulphur, se- Silicon 0- 2% lenium and silicon wherein the barium and at least the balance being lead.
- one additional element are in the form of dispersions for strengthening the alloy, the additional elements being present in the following weight m 2.
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Cell Electrode Carriers And Collectors (AREA)
Abstract
A creep resistant lead alloy comprising 0.001 - 1.0 percent by weight of barium and at least one element of the group consisting of silver, aluminum, boron, bismuth, cadmium, hydrogen, magnesium, oxygen, sulphur, antimony, selenium, silicon, tin, tellurium and zinc. The barium and the one or more elements of this group are present in a combination which has been formed either in the liquid or in the solid state of the alloy and which has a dispersion strengthening effect on which leads to order states in the lattice or to order-like states, such as a cluster formation, that produce a strengthening effect.
Description
United States Patent Erdmann-Jesnitzer et al. Oct. 1, 1974 [54] CREEP RESISTANT LEAD ALLOYS 2,013,487 9/1935 Canfield et a1 75 166 R [75] Inventors: Friedrich Erdmann-Jesnitzer, FOREIGN PATENTS OR APPLICATIONS Hammer; Peter Paschal 6051a, 301,380 4/1921 German 75/167 both 9f Germany 307,672 7/1921 German 75/167 1731 Assign Meme, Luxembourg 222113 1311335 821222131113. 3:131:33 111111321123 Grande Duche dc Luxembourg 106,208 4/1927 Austria 75/167 Luxembourg 859,805 12 1952 Germany 75/167 [22] Filed: Nov. 2, 1972 Primary Examiner-L. Dewayne Rutledge [21] Appl' 303203 Assistant Examiner-E. L. Weise Related US. Application Data Attorney, Agent, or FirmJohn J. Dennemeyer [63] Continuation of Ser. No. 13,156, Feb. 20, 1970,
abandoned. [5 7] ABSTRACT A creep resistant lead alloy comprising 0.001 1.0 [30] Foreign Apphcatmn Pnomy Data percent by weight of barium and at least one element July 15, 1969 Luxembourg 59186 of the group consisting of Silver aluminum boron, i
- muth, cadmium, hydrogen, magnesium, oxygen, sul- [52] U.S. CI. 75/167, 75/175 R phur antimony selenium, Silicon tin ll i d 51 Int. 01. C22c 11/00, C22C 13/00 zine The barium and the one or more elements of this [58] Field M Search" 75/167 166 166 I66 group are present in a combination which has been 75/166 166 175 R formed either in the liquid or in the solid state of the alloy and which has a dispersion strengthening effect [56] References Cum on which leads to order states in the lattice or to or- UNITED STATES PAT TS der-like states, such as a cluster formation, that pro- 1,360,272 11 1920 De Campi 75 167 duce a strengthening effect. 1,384,056 7/1921 Fink 75/166 R 2 D 1,804,883 5/1931 Mathesius et a1 75/167 Clams N0 'awmgs CREEP RESISTANT LEAD ALLOYS This is a continuation of application Ser. No. 13,156, filed Feb. 20, 1970 now abandoned.
The present invention relates to lead alloys having improved mechanical properties and is concerned more particularly with lead alloys having high creep resistance.
It is known that lead alloys with a low creep resistance show important drawbacks when used in certain fields of application or their application is considerably limited for this reason. In this connection for example, the low creep resistance of solder alloys is often an important drawback since for example standard solder alloys do not even transmit the stress caused by the thermal expansion of soldered zinc roof gutters having a length of several meters. Furthermore in the electronics and packaging industry solder alloys are limited in their application if they must support a constant load in one direction, and also for example at elevated temperatures.
For lead alloys being used as semi-finished products such as strips, sheets, tubes, wires, the lack of creepresistance is a particularly important drawback.
With respect to the use of lead alloys in batteries, the problems of the creep strength are not as important as the electrochemical problems. The standard alloy for batteries is the PbSb -alloy with varying As contents. The admissible load for this alloy at a limitation of the creep characteristics to 1 percent per year is in the range of 30 to 70 kp/cm at room temperature (Hofman, Lead and Lead-Alloys, Springer Verlag, 2nd edition, page 227). Due to the migration of the antimony and the resulting contamination of the cell, there is still a tendency to reduce the antimony content of such alloys. So far, lead alloys with high creep strength and high fatigue strength without an antimony content are also advantageous for the battery manufacturing industry. Due to the higher rigidity of the alloys of the present invention, the weight of the batteries could be decreased by using grids of less thickness.
Radiation and sound protection are modern fields of application of lead and lead alloys wherein an improved creep strenght is also of importance.
Data on the creep resistance of lead-tin alloys as a function of the tin content are scarcely available from the technical literature. However, values for the creep rupture strength of lead-tin alloys are available. Hofman (Lead and Lead-Alloys, 2nd edition, page 451) indicates as creep rupture strength for a ten day service life with an Sn-content between 32 and 100 percent a tensile stress of 70 Kp/cm Tests made by the inventors have shown a creep resistance of about kp/cm", respectively 12 kp/cm for a PbSn 40 and PbSn alloy with a 1 percent elongation at room temperature.
The object of the present invention is to provide lead alloys having a higher creep resistance by which the above mentioned drawbacks are overcome and new fields of application can be opened.
The lead alloys according to the present invention comprise 0.001 1.0 percent by weight of barium (Ba) and at least one element from the group consisting of silver (Ag), aluminum (Al), boron (B), bismuth (Bi), cadmium (Cd), magnesium (Mg), oxygen (0), hydrogen (H), sulphur (S), antimony (Sb), selenium (Se), silicon (Si), tin (Sn), zinc (Zn), tellurium (Te), the barium and the other element being present in a combination which has been formed either in the liquid or in the solid state of the alloy and which has a dispersion strengthening effect and/or which leads to order states in the lattice and/or to order like states (cluster formation) that have a strengthening effect.
The elements can advantageously be present in the alloy in the following weight percentages:
Silver 0.001 l0 Aluminum 0.001 2 Boron 0.001 l Bismuth 0.001 6 7r Cadmium 0.001 l0 Magnesium 0.001 6 Oxygen 0.001 0.2% Hydrogen 0.001 0.2% Sulphur 0.001 2 7? Antimony 0.001 2 Selenium 0.001 l Silicon 0.001 2 Tin 0.001 Tellurium 0.001 l Zinc 0.001 l Preferred creep resistant lead alloys are those alloys which consist of 0.01 1.0 percent by weight of barium (Ba) and one element in the given amounts of the mentioned group, balance lead or lead-tin.
Creep resistant tests have been made for the alloy according to the invention, Pb-Ba-O comprising for example 0.07 percent by weight of Ba and 0.006 percent by weight of oxygen. From the resulting creep curves (10.000 hours) a value inferior to the admissible 1 percent per year elongation at room temperature could be obtained for a load of 1 l2 kp/cm It results therefrom that the creep resistance was superior to 112 kp/cm high grade lead Pb-Ba-O before rolling 4,15 7,91 after rolling 3,18 10,90
Since a major part of the semi-finished lead products are used in the sulphuric acid industry, the alloys according to the invention must be corrosion resistant to the attack of diluted sulphuric acid. The alloys according to the invention did not show a worse corrosion behaviour than high-grade lead.
Tests on lead-tin-base alloys have shown similar results. On the basis of the creep curves it has been shown that the lead-tin base alloys according to the present invention in comparison to the lead-tin alloys, despite a higher load, had a lower elongation. The charge capacity of the Pb-Sn-base alloys according to the invention at elevated loads is at least twice as high: at low loads there is a discontinuance of the creep action.
Soldering tests with these alloys have shown that the wetting properties of the solder on brass and zinc are at least as good as in the case of common Pb-Snsolders.
What is chimed is' 0.001 1% 0.001 0.2" l. A creep resistant lead alloy cons1st1ng essentlally f- Hydrogen 0.001 0.2% 0.00l1.0 percent by weight barium, Sulphur at least one addmonal element of the group consist- 5 selcmum 1/! ing of silver, boron, hydrogen, oxygen, sulphur, se- Silicon 0- 2% lenium and silicon wherein the barium and at least the balance being lead.
one additional element are in the form of dispersions for strengthening the alloy, the additional elements being present in the following weight m 2. A lead alloy as defined 1n claim 1 wherein t1n 1s tflg present in a percentage range of 0.001 90 percent Silver 0.001
Claims (2)
1. A CREEP RESISTANT LEAD ALLOY CONSISTING ESSENTIALLY OF: 0.001-1.0 PERCENT BY WEIGHT BARIUM, AT LEAST ONE ADDITIONAL ELEMENT OF THE GROUP CONSISTING OF SILVER, BORON, HYDROGEN, OXYGEN, SULPHUR, SELENIUM AND SILICON WHEREIN THE BARIUM AND AT LEAST ONE ADDITIONAL ELEMENT ARE IN THE FORM OF DISPERSIONS FOR STRENGTHENING THE ALLOY, THE ADDITIONAL ELEMENTS BEING PRESENT IN THE FOLLOWING WEIGHT PERCENTAGES:
2. A lead alloy as defined in claim 1 wherein tin is present in a percentage range of 0.001 - 90 percent.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US00303203A US3839023A (en) | 1969-07-15 | 1972-11-02 | Creep resistant lead alloys |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
LU59186 | 1969-07-15 | ||
US1315670A | 1970-02-20 | 1970-02-20 | |
US00303203A US3839023A (en) | 1969-07-15 | 1972-11-02 | Creep resistant lead alloys |
Publications (1)
Publication Number | Publication Date |
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US3839023A true US3839023A (en) | 1974-10-01 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US00303203A Expired - Lifetime US3839023A (en) | 1969-07-15 | 1972-11-02 | Creep resistant lead alloys |
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0476734A1 (en) * | 1990-08-27 | 1992-03-25 | Koninklijke Philips Electronics N.V. | Dispersion strengthened lead-tin alloy solder |
US5393489A (en) * | 1993-06-16 | 1995-02-28 | International Business Machines Corporation | High temperature, lead-free, tin based solder composition |
EP0671241A1 (en) * | 1994-03-09 | 1995-09-13 | NIHON SUPERIOR Co., Ltd. | Solder alloy |
EP0748666A1 (en) * | 1994-06-13 | 1996-12-18 | Nihon Almit Co.,Ltd. | High-strength solder alloy |
US6585150B1 (en) * | 2000-10-12 | 2003-07-01 | International Business Machines Corporation | Solder protective coating and fluxless joining of flip chip devices on laminates with plated solder |
CN102554508A (en) * | 2012-02-22 | 2012-07-11 | 南京航空航天大学 | Silver solder suitable for brazing of lead-free free cutting copper alloy |
US20160039077A1 (en) * | 2008-10-21 | 2016-02-11 | Michael A. Logan | Automobile rim hammer |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE307672C (en) * | ||||
DE301380C (en) * | ||||
US1360272A (en) * | 1919-07-30 | 1920-11-30 | United Lead Company | Lead-base alloy |
US1384056A (en) * | 1920-01-26 | 1921-07-12 | Chile Exploration Company | Alloy |
DE359812C (en) * | 1917-11-15 | 1922-09-26 | Metallbank | Lead alloy |
DE366189C (en) * | 1917-12-02 | 1922-12-30 | Metallbank | Lead alloy |
AT106208B (en) * | 1924-03-12 | 1927-04-25 | Metallbank & Metallurg Ges Ag | High lead bearing metal. |
US1804883A (en) * | 1926-05-17 | 1931-05-12 | Mathesius Walther | Alloy metal for bearings |
US2013487A (en) * | 1934-06-07 | 1935-09-03 | Robert H Canfield | Lead alloy |
DE859805C (en) * | 1951-02-09 | 1952-12-15 | Metallgesellschaft Ag | Lead-bearing metal |
-
1972
- 1972-11-02 US US00303203A patent/US3839023A/en not_active Expired - Lifetime
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE307672C (en) * | ||||
DE301380C (en) * | ||||
DE359812C (en) * | 1917-11-15 | 1922-09-26 | Metallbank | Lead alloy |
DE366189C (en) * | 1917-12-02 | 1922-12-30 | Metallbank | Lead alloy |
US1360272A (en) * | 1919-07-30 | 1920-11-30 | United Lead Company | Lead-base alloy |
US1384056A (en) * | 1920-01-26 | 1921-07-12 | Chile Exploration Company | Alloy |
AT106208B (en) * | 1924-03-12 | 1927-04-25 | Metallbank & Metallurg Ges Ag | High lead bearing metal. |
US1804883A (en) * | 1926-05-17 | 1931-05-12 | Mathesius Walther | Alloy metal for bearings |
US2013487A (en) * | 1934-06-07 | 1935-09-03 | Robert H Canfield | Lead alloy |
DE859805C (en) * | 1951-02-09 | 1952-12-15 | Metallgesellschaft Ag | Lead-bearing metal |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0476734A1 (en) * | 1990-08-27 | 1992-03-25 | Koninklijke Philips Electronics N.V. | Dispersion strengthened lead-tin alloy solder |
US5393489A (en) * | 1993-06-16 | 1995-02-28 | International Business Machines Corporation | High temperature, lead-free, tin based solder composition |
EP0671241A1 (en) * | 1994-03-09 | 1995-09-13 | NIHON SUPERIOR Co., Ltd. | Solder alloy |
EP0748666A1 (en) * | 1994-06-13 | 1996-12-18 | Nihon Almit Co.,Ltd. | High-strength solder alloy |
EP0748666A4 (en) * | 1994-06-13 | 1998-11-11 | Nihon Almit Co Ltd | High-strength solder alloy |
US6585150B1 (en) * | 2000-10-12 | 2003-07-01 | International Business Machines Corporation | Solder protective coating and fluxless joining of flip chip devices on laminates with plated solder |
US20160039077A1 (en) * | 2008-10-21 | 2016-02-11 | Michael A. Logan | Automobile rim hammer |
CN102554508A (en) * | 2012-02-22 | 2012-07-11 | 南京航空航天大学 | Silver solder suitable for brazing of lead-free free cutting copper alloy |
CN102554508B (en) * | 2012-02-22 | 2014-03-05 | 南京航空航天大学 | Silver solder suitable for brazing of lead-free free cutting copper alloy |
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