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US3818983A - Cooled enclosure - Google Patents

Cooled enclosure Download PDF

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Publication number
US3818983A
US3818983A US00290028A US29002872A US3818983A US 3818983 A US3818983 A US 3818983A US 00290028 A US00290028 A US 00290028A US 29002872 A US29002872 A US 29002872A US 3818983 A US3818983 A US 3818983A
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US
United States
Prior art keywords
refrigerant
heat exchanger
heat
primary
cooled
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US00290028A
Inventor
W Grandia
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
York International Corp
Original Assignee
Borg Warner Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Borg Warner Corp filed Critical Borg Warner Corp
Priority to US00290028A priority Critical patent/US3818983A/en
Priority to ZA734475A priority patent/ZA734475B/en
Priority to GB3229873A priority patent/GB1401724A/en
Priority to CA175,882A priority patent/CA990088A/en
Priority to DE19732337573 priority patent/DE2337573C3/en
Priority to AU58480/73A priority patent/AU473754B2/en
Priority to IT27212/73A priority patent/IT1006068B/en
Priority to JP48095353A priority patent/JPS4970137A/ja
Priority to FR7333256A priority patent/FR2200488B1/fr
Application granted granted Critical
Publication of US3818983A publication Critical patent/US3818983A/en
Assigned to YORK INTERNATIONAL CORPORATION, 631 SOUTH RICHLAND AVENUE, YORK, PA 17403, A CORP. OF DE reassignment YORK INTERNATIONAL CORPORATION, 631 SOUTH RICHLAND AVENUE, YORK, PA 17403, A CORP. OF DE ASSIGNMENT OF ASSIGNORS INTEREST. Assignors: BORG-WARNER CORPORATION
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20936—Liquid coolant with phase change
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • ABSTRACT A cooled enclosure for housing heat generating devices, particularly solid state elements such as SCRs. diodes and other components, including a first chamber in which the heat generating devices are immersed in a refrigerant which will vaporize and abstract heat from the devices.
  • the refrigerant vapor is condensed in a second chamber in which a heat exchanger is disposed, said heat exchanger being supplied with a liquid coolant.
  • the condensed refrigerant then returns to the first chamber and is added to the body of liquid refrigerant in said chamber.
  • An important feature of the invention is an alternate, secondary flow path for the refrigerant vapor through a secondary heat exchanger which is preferably air cooled. Under conditions when the ambient air is effective to condense refrigerant without operation of the primary liquid cooled heat exchanger, the vapor is condensed in such secondary heat exchanger and returned to the refrigerant bath in the first chamber.
  • FIGS 1 COOLED ENCLOSURE BACKGROUND AND SUMMARY OF THE INVENTION The use of solid state devices such as silicon controlled rectifiers and diodes has been increasing in large power applications. Such applications would include, for example, power inverters for converting DC electrical energy to AC energy and related motor controls which vary the frequency of the AC supplied to the motors and accordingly vary the speed thereof. Such applications are increasingly important in transportation equipment, particularly for driving air conditioning compressor motors for such equipment.
  • the devices are preferably completely immersed in a refrigerant which boils at a relatively low temperature and suitable means are provided for condensing the vaporized refrigerant and returning it to the main supply enveloping the heat generating devices.
  • the industry has previously been reluctant to use any direct liquid cooled system because of the fear that contactwith liquid would ruin the SCRs.
  • I have discovered that the use of conventional halogenated hydrocarbon refrigerants such as R-l2, R-22, R-l 14 etc. have no deleterious effect. These refrigerants are stable,-non-corrosive and have a high dielectric coefficient, all such factors being required in the particular environment.
  • An important feature of the invention is the use of an alternate flow path for refrigerant vapor through a secondary, air cooled heat exchange system so that the primary heat exchanger can be discontinued when the ambicnt air is effective to condense the refrigerant.
  • FIG. I is a perspective view, with certain portions being broken away, of the improved enclosure forming the subject of the present invention.
  • FIG. 2 is a cross-sectional view taken generally along the plane of line 2--2 of FIG. 1;
  • FIG. 3 is a cross-sectional view taken generally along the plane of line 33 of FIG. 2.
  • FIG. 1 there is shown a cooled enclosure comprising a plurality of generally cylindrical shells l2 defining primary chambers 14 in which the solid state components 16 are disposed. Each shell is closed by cap members 18 and 20 at opposite ends thereof, the front cap member 18 being secured to the shell by means of fasteners 22.
  • the electrical bus bar connections 24 also extend through the front cap to a source of electrical power and logic circuits (not shown) housed in casing 26.
  • a primary heat exchanger 30 including a shell 32 and a tube 34 arranged therein through which a cooled medium such as water-or refrigerant is circulated.
  • the openings between the primary heat exchanger 30 and the individual shells 12 are designated at 36 (FIG. 2).
  • a vapor collecting header 38 Connected by conduit 37 to the primary heat exchanger is a vapor collecting header 38.
  • a plurality of secondary heat exchangers 40 interconnect header 38 with a second header 42 through the length of the assembly.
  • Each of the heat exchangers 40 is preferably provided with a finned surface 44 or other means for promoting heat transfer between ambient air and vapor flowing through the tube.
  • Condensate collecting header 42 is connected to the lower portion of the shells 12 by means of conduit 46 and condensate return pipe 48 which connects with each of the shells.
  • the solid state components 16 are submerged within a liquid refrigerant bath 50 maintained at any desired level. It has been found that such devices will operate very efficiently if they are completely submerged within the bath.
  • the primary heat exchanger 30 is supplied with a cooling medium which flows continuously through coil 34. As the solid state devices 16 are energized they liberate great quantities of heat which is passed through heat sinks into the body of liquid refrigerant 50. The refrigerant boils and flows into primary heat exchanger 30 where it condenses on the coil 34 and drops back as a liquid through communicating openings 36. Under some conditions, when atmospheric air is cool enough, the primary heat exchanger 30 may be discontinued. The air flowing over the surface of the secondary heat exchanger tubes 40 is effective to condense fluid which passes into header 38 and down through the tubes into the condensate receiving header 42. The liquid refrigerant then is collected in the header and transferred to the shells through conduits 46 and 48.
  • a cooled enclosure for housing heat generating devices comprising: a plurality of spaced, generally cylindrical shells defining primary chambers in which said heat generating devices are located; a primary heat exchanger extending traversely of said shells and communicating therewith through openings adjacent the top of each said shell, said heat exchanger including a coil through which a liquid coolant is adapted to be circulated; a vapor collecting header connected to said primary heat exchanger; a condensate collecting header; a plurality of air-cooled heat exchangers interconnecting said vapor collecting header 'and said condensate collecting header, said heat exchangers being provided with a heat transfer surface for promoting heat transfer between ambient air and vapor flowing through said heat exchangers; means for returning condensate from said collecting header to said shells; and a body of halogenated hydrocarbon refrigerant in said primary cham- 3 ,8 I 8,98 3 3 4 bers in contact with said heat generating devices changers when said ambient air is effective to condense whereby ref

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)

Abstract

A cooled enclosure for housing heat generating devices, particularly solid state elements such as SCRs, diodes and other components, including a first chamber in which the heat generating devices are immersed in a refrigerant which will vaporize and abstract heat from the devices. The refrigerant vapor is condensed in a second chamber in which a heat exchanger is disposed, said heat exchanger being supplied with a liquid coolant. The condensed refrigerant then returns to the first chamber and is added to the body of liquid refrigerant in said chamber. An important feature of the invention is an alternate, secondary flow path for the refrigerant vapor through a secondary heat exchanger which is preferably air cooled. Under conditions when the ambient air is effective to condense refrigerant without operation of the primary liquid cooled heat exchanger, the vapor is condensed in such secondary heat exchanger and returned to the refrigerant bath in the first chamber.

Description

Grandia 1 June 25, 1974 COOLED ENCLOSURE William M. Grandia, York, Pa.
[73] Assignee: Borg-Warner Corporation, Chicago,
. Ill.
[22] Filed: Sept. 18, 1972 [2]] Appl. No.1 290,028
[75] Inventor:
[52] US. Cl. 165/105, 317/100, 317/234 B [51] Int. Cl F28d 15/00, l-lOll 1/12 [58] Field of Search...-.... l65/l05, 47 T; 317/234 A,
Primary ExaminerAlbcrt W. Davis, Jr. Assistant ExaminerS. J. Richter Attorney, Agent, or FirmD0nald W. Banner [57] ABSTRACT A cooled enclosure for housing heat generating devices, particularly solid state elements such as SCRs. diodes and other components, including a first chamber in which the heat generating devices are immersed in a refrigerant which will vaporize and abstract heat from the devices. The refrigerant vapor is condensed in a second chamber in which a heat exchanger is disposed, said heat exchanger being supplied with a liquid coolant. The condensed refrigerant then returns to the first chamber and is added to the body of liquid refrigerant in said chamber. An important feature of the invention is an alternate, secondary flow path for the refrigerant vapor through a secondary heat exchanger which is preferably air cooled. Under conditions when the ambient air is effective to condense refrigerant without operation of the primary liquid cooled heat exchanger, the vapor is condensed in such secondary heat exchanger and returned to the refrigerant bath in the first chamber.
1 Claim, 3 Drawing Figures PATENlEnJuuzsmu sum 2 ar 2 FIGS 1 COOLED ENCLOSURE BACKGROUND AND SUMMARY OF THE INVENTION The use of solid state devices such as silicon controlled rectifiers and diodes has been increasing in large power applications. Such applications would include, for example, power inverters for converting DC electrical energy to AC energy and related motor controls which vary the frequency of the AC supplied to the motors and accordingly vary the speed thereof. Such applications are increasingly important in transportation equipment, particularly for driving air conditioning compressor motors for such equipment.
One particular troublesome problem is the dissipation of the heat generated by the aforementioned solid state components. The maintenance of these devices at constant, relatively low temperature is essential for the proper operation of the same. Not only do high temper- Y atures adversely affect their performance, but even variations in temperature in the moderate range affect control and often result in erratic performance.
It is an important object of this invention to provide a cooled enclosure for housing semi-conductor devices and similar solid state components in a refrigerant cooled chamber. The devices are preferably completely immersed in a refrigerant which boils at a relatively low temperature and suitable means are provided for condensing the vaporized refrigerant and returning it to the main supply enveloping the heat generating devices. The industry has previously been reluctant to use any direct liquid cooled system because of the fear that contactwith liquid would ruin the SCRs. However, I have discovered that the use of conventional halogenated hydrocarbon refrigerants such as R-l2, R-22, R-l 14 etc. have no deleterious effect. These refrigerants are stable,-non-corrosive and have a high dielectric coefficient, all such factors being required in the particular environment.
An important feature of the invention is the use of an alternate flow path for refrigerant vapor through a secondary, air cooled heat exchange system so that the primary heat exchanger can be discontinued when the ambicnt air is effective to condense the refrigerant.
BRIEF DESCRIPTION OF THE DRAWINGS FIG. I is a perspective view, with certain portions being broken away, of the improved enclosure forming the subject of the present invention;
FIG. 2 is a cross-sectional view taken generally along the plane of line 2--2 of FIG. 1; and
FIG. 3 is a cross-sectional view taken generally along the plane of line 33 of FIG. 2.
DETAILED DESCRIPTION OF THE INVENTION Referring first to FIG. 1 there is shown a cooled enclosure comprising a plurality of generally cylindrical shells l2 defining primary chambers 14 in which the solid state components 16 are disposed. Each shell is closed by cap members 18 and 20 at opposite ends thereof, the front cap member 18 being secured to the shell by means of fasteners 22. The electrical bus bar connections 24 also extend through the front cap to a source of electrical power and logic circuits (not shown) housed in casing 26.
Extending transversely across each of the shells l2 and in fluid communication therewith is a primary heat exchanger 30 including a shell 32 and a tube 34 arranged therein through which a cooled medium such as water-or refrigerant is circulated. The openings between the primary heat exchanger 30 and the individual shells 12 are designated at 36 (FIG. 2). Connected by conduit 37 to the primary heat exchanger is a vapor collecting header 38. A plurality of secondary heat exchangers 40 interconnect header 38 with a second header 42 through the length of the assembly. Each of the heat exchangers 40 is preferably provided with a finned surface 44 or other means for promoting heat transfer between ambient air and vapor flowing through the tube. Condensate collecting header 42 is connected to the lower portion of the shells 12 by means of conduit 46 and condensate return pipe 48 which connects with each of the shells.
The solid state components 16 are submerged within a liquid refrigerant bath 50 maintained at any desired level. It has been found that such devices will operate very efficiently if they are completely submerged within the bath.
OPERATION During normal operation, the primary heat exchanger 30 is supplied with a cooling medium which flows continuously through coil 34. As the solid state devices 16 are energized they liberate great quantities of heat which is passed through heat sinks into the body of liquid refrigerant 50. The refrigerant boils and flows into primary heat exchanger 30 where it condenses on the coil 34 and drops back as a liquid through communicating openings 36. Under some conditions, when atmospheric air is cool enough, the primary heat exchanger 30 may be discontinued. The air flowing over the surface of the secondary heat exchanger tubes 40 is effective to condense fluid which passes into header 38 and down through the tubes into the condensate receiving header 42. The liquid refrigerant then is collected in the header and transferred to the shells through conduits 46 and 48.
While the invention has been described in connection with a certain specific embodiment thereof, it is to be understood that this is by way of illustration and not by way of limitation; and the scope of the appended claims should be construed as broadly as the prior art will permit.
What is claimed is:
l. A cooled enclosure for housing heat generating devices comprising: a plurality of spaced, generally cylindrical shells defining primary chambers in which said heat generating devices are located; a primary heat exchanger extending traversely of said shells and communicating therewith through openings adjacent the top of each said shell, said heat exchanger including a coil through which a liquid coolant is adapted to be circulated; a vapor collecting header connected to said primary heat exchanger; a condensate collecting header; a plurality of air-cooled heat exchangers interconnecting said vapor collecting header 'and said condensate collecting header, said heat exchangers being provided with a heat transfer surface for promoting heat transfer between ambient air and vapor flowing through said heat exchangers; means for returning condensate from said collecting header to said shells; and a body of halogenated hydrocarbon refrigerant in said primary cham- 3 ,8 I 8,98 3 3 4 bers in contact with said heat generating devices changers when said ambient air is effective to condense whereby refrigerant vapor generated in said primary said refrigerant without operation of said primary heat chambers may be condensed in said primary heat exexchanger.
changer or alternatively by said air-cooled heat ex-

Claims (1)

1. A cooled enclosure for housing heat generating devices comprising: a plurality of spaced, generally cylindrical shells defining primary chambers in which said heat generating devices are located; a primary heat exchanger extending traversely of said shells and communicating therewith through openings adjacent the top of each said shell, said heat exchanger including a coil through which a liquid coolant is adapted to be circulated; a vapor collecting header connected to said primary heat exchanger; a condensate collecting header; a plurality of air-cooled heat exchangers interconnecting said vapor collecting header and said condensate collecting header, said heat exchangers being provided with a heat transfer surface for promoting heat transfer between ambient air and vapor flowing through said heat exchangers; means for returning condensate from said collecting header to said shells; and a body of halogenated hydrocarbon refrigerant in said primary chambers in contact with said heat Generating devices whereby refrigerant vapor generated in said primary chambers may be condensed in said primary heat exchanger or alternatively by said air-cooled heat exchangers when said ambient air is effective to condense said refrigerant without operation of said primary heat exchanger.
US00290028A 1972-09-18 1972-09-18 Cooled enclosure Expired - Lifetime US3818983A (en)

Priority Applications (9)

Application Number Priority Date Filing Date Title
US00290028A US3818983A (en) 1972-09-18 1972-09-18 Cooled enclosure
ZA734475A ZA734475B (en) 1972-09-18 1973-07-03 Cooled enclosure
CA175,882A CA990088A (en) 1972-09-18 1973-07-06 Cooled enclosure
GB3229873A GB1401724A (en) 1972-09-18 1973-07-06 Cooled enclosure
DE19732337573 DE2337573C3 (en) 1972-09-18 1973-07-24 Evaporative cooling device for heat-generating components
AU58480/73A AU473754B2 (en) 1972-09-18 1973-07-25 Cooled enclosure
IT27212/73A IT1006068B (en) 1972-09-18 1973-07-27 COOLED CONTAINER FOR HOUSING SEMICONDUCTOR DEVICES AND SIMILAR COMPONENTS
JP48095353A JPS4970137A (en) 1972-09-18 1973-08-27
FR7333256A FR2200488B1 (en) 1972-09-18 1973-09-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US00290028A US3818983A (en) 1972-09-18 1972-09-18 Cooled enclosure

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US3818983A true US3818983A (en) 1974-06-25

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US00290028A Expired - Lifetime US3818983A (en) 1972-09-18 1972-09-18 Cooled enclosure

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US (1) US3818983A (en)
JP (1) JPS4970137A (en)
AU (1) AU473754B2 (en)
CA (1) CA990088A (en)
FR (1) FR2200488B1 (en)
GB (1) GB1401724A (en)
IT (1) IT1006068B (en)
ZA (1) ZA734475B (en)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4027728A (en) * 1975-03-31 1977-06-07 Mitsubishi Denki Kabushiki Kaisha Vapor cooling device for semiconductor device
US4084406A (en) * 1976-01-22 1978-04-18 Fedders Corporation Chiller controls
US4350026A (en) * 1978-08-26 1982-09-21 Bbc Brown, Boveri & Company, Limited Cooling device for electrical and/or electronic component elements producing lost heat and a procedure for operating such
US4998181A (en) * 1987-12-15 1991-03-05 Texas Instruments Incorporated Coldplate for cooling electronic equipment
AU629761B2 (en) * 1989-10-26 1992-10-08 Mitsubishi Denki Kabushiki Kaisha Boiling and condensing heat transfer type cooler device for power semiconductor switching elements
US5285347A (en) * 1990-07-02 1994-02-08 Digital Equipment Corporation Hybird cooling system for electronic components
US5925929A (en) * 1992-07-03 1999-07-20 Hitachi, Ltd. Cooling apparatus for electronic elements
US6109337A (en) * 1993-06-02 2000-08-29 Actionenergy Limited Apparatus for controlling temperature
US6515383B1 (en) 2000-11-06 2003-02-04 Satcon Technology Corporation Passive, phase-change, stator winding end-turn cooled electric machine
WO2005055688A1 (en) * 2003-11-28 2005-06-16 Rolls Royce Plc Control arrangement
US20080141692A1 (en) * 2004-12-22 2008-06-19 York International Corporation Medium voltage starter for a chiller unit
US20100277867A1 (en) * 2009-04-29 2010-11-04 Raytheon Company Thermal Dissipation Mechanism for an Antenna
EP2429274A3 (en) * 2010-08-31 2013-10-30 Hitachi Ltd. Cooling system for onboard electrical power converter, and electrical power converter for railway vehicle
US8590329B2 (en) 2004-12-22 2013-11-26 Johnson Controls Technology Company Medium voltage power controller
US11581243B2 (en) 2016-05-11 2023-02-14 Hypertechnologie Ciara Inc. CPU cooling system with direct spray cooling

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51101252A (en) * 1975-03-04 1976-09-07 Mitsubishi Electric Corp FUTSUTOREI KYAKUSOCHI
JPS51145043A (en) * 1975-06-06 1976-12-13 Mitsubishi Electric Corp Boiling type refrigeration system
JPS51145042A (en) * 1975-06-06 1976-12-13 Mitsubishi Electric Corp Boiling type refrigeration system
GB1597469A (en) * 1977-12-14 1981-09-09 Jackson P A Cooling of a shelter containing a heat source
GB2040033B (en) * 1979-01-12 1983-03-02 Nippon Electric Co Cooling arrangements
AU617957B2 (en) * 1989-10-26 1991-12-05 Mitsubishi Denki Kabushiki Kaisha Boiling and condensing heat transfer type cooler device for power semiconductor switching elements
GB2389174B (en) * 2002-05-01 2005-10-26 Rolls Royce Plc Cooling systems

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB706209A (en) * 1950-11-30 1954-03-24 Thomson Houston Comp Francaise Apparatus for cooling electronic tubes
US3243495A (en) * 1963-01-10 1966-03-29 Era Patents Ltd Transformers with evaporative cooling system
US3270250A (en) * 1963-02-06 1966-08-30 Ariel R Davis Liquid vapor cooling of electrical components
US3609991A (en) * 1969-10-13 1971-10-05 Ibm Cooling system having thermally induced circulation
US3718850A (en) * 1970-07-17 1973-02-27 Tokyo Shibaura Electric Co Semiconductor rectifier device

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4415152Y1 (en) * 1965-09-21 1969-06-30
BE754580A (en) * 1969-08-08 1971-01-18 Balcke Maschbau Ag PROCESS FOR THE OPERATION OF A DRY REFRIGERATION TOWER UNDER HIGH AIR TEMPERATURES

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB706209A (en) * 1950-11-30 1954-03-24 Thomson Houston Comp Francaise Apparatus for cooling electronic tubes
US3243495A (en) * 1963-01-10 1966-03-29 Era Patents Ltd Transformers with evaporative cooling system
US3270250A (en) * 1963-02-06 1966-08-30 Ariel R Davis Liquid vapor cooling of electrical components
US3609991A (en) * 1969-10-13 1971-10-05 Ibm Cooling system having thermally induced circulation
US3718850A (en) * 1970-07-17 1973-02-27 Tokyo Shibaura Electric Co Semiconductor rectifier device

Cited By (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4027728A (en) * 1975-03-31 1977-06-07 Mitsubishi Denki Kabushiki Kaisha Vapor cooling device for semiconductor device
US4084406A (en) * 1976-01-22 1978-04-18 Fedders Corporation Chiller controls
US4350026A (en) * 1978-08-26 1982-09-21 Bbc Brown, Boveri & Company, Limited Cooling device for electrical and/or electronic component elements producing lost heat and a procedure for operating such
US4998181A (en) * 1987-12-15 1991-03-05 Texas Instruments Incorporated Coldplate for cooling electronic equipment
AU629761B2 (en) * 1989-10-26 1992-10-08 Mitsubishi Denki Kabushiki Kaisha Boiling and condensing heat transfer type cooler device for power semiconductor switching elements
US5285347A (en) * 1990-07-02 1994-02-08 Digital Equipment Corporation Hybird cooling system for electronic components
US5925929A (en) * 1992-07-03 1999-07-20 Hitachi, Ltd. Cooling apparatus for electronic elements
US6109337A (en) * 1993-06-02 2000-08-29 Actionenergy Limited Apparatus for controlling temperature
US6515383B1 (en) 2000-11-06 2003-02-04 Satcon Technology Corporation Passive, phase-change, stator winding end-turn cooled electric machine
US20060259156A1 (en) * 2003-11-28 2006-11-16 Jones Alan R Control arrangement
US7278475B2 (en) 2003-11-28 2007-10-09 Rolls-Royce Plc Control arrangement for cooling power electronic components
WO2005055688A1 (en) * 2003-11-28 2005-06-16 Rolls Royce Plc Control arrangement
US8590329B2 (en) 2004-12-22 2013-11-26 Johnson Controls Technology Company Medium voltage power controller
US20080141692A1 (en) * 2004-12-22 2008-06-19 York International Corporation Medium voltage starter for a chiller unit
US7918099B2 (en) 2004-12-22 2011-04-05 York International Corporation Medium voltage starter for a chiller unit
US20110179821A1 (en) * 2004-12-22 2011-07-28 York International Corporation Medium voltage starter for a chiller unit
US8820105B2 (en) 2004-12-22 2014-09-02 Johnson Controls Technology Company Medium voltage power controller
US8544290B2 (en) 2004-12-22 2013-10-01 Johnson Controls Technology Company Medium voltage variable speed drive for a chiller unit
US20100277867A1 (en) * 2009-04-29 2010-11-04 Raytheon Company Thermal Dissipation Mechanism for an Antenna
US8045329B2 (en) 2009-04-29 2011-10-25 Raytheon Company Thermal dissipation mechanism for an antenna
EP2429274A3 (en) * 2010-08-31 2013-10-30 Hitachi Ltd. Cooling system for onboard electrical power converter, and electrical power converter for railway vehicle
US8879259B2 (en) 2010-08-31 2014-11-04 Hitachi, Ltd. Cooling system for onboard electrical power converter, and electrical power converter for railway vehicle
US11581243B2 (en) 2016-05-11 2023-02-14 Hypertechnologie Ciara Inc. CPU cooling system with direct spray cooling

Also Published As

Publication number Publication date
FR2200488A1 (en) 1974-04-19
JPS4970137A (en) 1974-07-06
FR2200488B1 (en) 1976-10-01
AU473754B2 (en) 1976-07-01
AU5848073A (en) 1975-01-30
GB1401724A (en) 1975-07-30
CA990088A (en) 1976-06-01
DE2337573A1 (en) 1974-04-04
IT1006068B (en) 1976-09-30
DE2337573B2 (en) 1976-05-13
ZA734475B (en) 1974-07-31

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