US3639220A - Electrodeposition of nickel - Google Patents
Electrodeposition of nickel Download PDFInfo
- Publication number
- US3639220A US3639220A US58700A US3639220DA US3639220A US 3639220 A US3639220 A US 3639220A US 58700 A US58700 A US 58700A US 3639220D A US3639220D A US 3639220DA US 3639220 A US3639220 A US 3639220A
- Authority
- US
- United States
- Prior art keywords
- compound
- sulfonic acid
- nickel
- bath
- unsaturated sulfonic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
Definitions
- IICEC-CH CH-S 03H 0. 0H
- enzene monoand disulfonic acids Li-l5
- naphthalene cliand tri-sulfonic acids LL-t (a. o-sulfobenzaldchydc 0,33
- the unsaturated aliphatic sulfonic acids shownin table I are unusually effective in decreasing the grain size and increasing the luster and brightness of nickel deposited from aqueous acidic: nickel-plating baths, without seriously decreasing the ductility of the plate or the current density range of the nickel bath.
- the compounds of table I are more effective than the aliphatic (four) carbon atom compound: 2-butyne-l,4-disulfonic acid in that they produce brightness and luster with much lower concentrations of material, and are vastly superior to the aliphatic (four) carbon atom compound: 2-butene-l,4-disulfonic acid in producing brightness and luster at any concentration.
- the compounds of table I are also far superior to Z-butene-l-sulfonic acid in producing luster without seriously decreasing the ductility of the plate or causing tensile stresses.
- the iirTs'iifrhtd aliphatic sulfonic acids illustrated in table I are effective not only in the Watts high nickel sulfate concentration baths, but also in high chloride, sulfamate or fluoborate nickel baths or mixtures of these baths and salts.
- concentrations of table l compounds in the nickel baths are not critical, though in general, no further improvements in luster or ductility are obtained with concentrations above about 10 grams per liter.
- the bathsoluble salts of the sulfonic acids of this invention are preferred for easier handling especially the sodium or potassium salts.
- the compounds of table I are, of course, present mainly as the sulfonicacids and their nickel salts even if added to the baths as sodium or potassium salts or for that matter. cobalt, magnesium or other salts.
- the compounds of table 1 may have halogen atoms substituted for some of the hydrogen atoms, with at the most two halogen atoms per molecule.
- the halogen atoms may be on the benzene rings as well as on the aliphatic portion of the molecules.
- a chlorine or bromine atom could replace one or both of the hydrogen atoms on the carbon next to the sulfonic group with improved results in luster of the nickel plate.
- one or two fluorine, chlorine, bromine or iodine atoms can be present, for example, on the benzene ring of compound of table I with slightly improved results in luster of the nickel deposit. In most cases,
- the best pH range for the acidic nickel-plating baths employing the compounds of table I is from about 2.5 to 5.5.
- the bath temperatures may be from room temperature to at least 180 F., and in this respect, the brighteners of table I used by themselves or with unsaturated compounds, such as a quaternary of pyridine or quinoline, or in conjunction with butynediol or a monoor di-ethylene oxide adduct of butynediol are superior to the well-known brighteners of table ll used alone or with the unsaturated compounds.
- the compound of table [I may be used in amounts of from 0.l g./l. to saturation.
- baths for the production of brilliant nickel plate with bright plate range from the highest current densities down to the very lowest current densities.
- the table l unsaturated aliphatic sulfonic acids of this invention can be used in very high concentrations in the acidic nickel-plating baths, in fact, up to saturation concentrations. which for some of the compounds, for example, compounds I and 2, are over 100 grams/liter. However, no further improvement of luster is obtained in concentrations above about 10 grams/liter, but since the compounds are noncritical in concentration, any concentration up to saturation concentrations can be used, preferably 0.05 to about 100 g./l.
- the compounds of table l are just as effective as brighteners in nickel-cobalt, nickel-iron and nickel-cobalt-iron alloy plating baths.
- the cobalt may be as high as at least 50 percent in the plate and the iron as high as at least 40 percent, and the total of cobalt plus iron may be as high as 50 percent of the plate. With cobalt concentrations in the plate higher than about 50 percent, it is preferred to have compound I of table II also present in the baths.
- cobalt and iron may also be present in the plate to the extent of about 50 percent of the plate as combined material, or as about 50 percent of either cobalt or iron separately, and still obtain bright plate that behaves essentially like bright nickel plate. It is therefore to be understood that the claimed nickel baths cover these nickel alloy plates.
- a bath for the electrodeposition of fine-grained lustrous nickel comprising essentially an aqueous acidic nickel-plating bath containing dissolved therein at least one of the unsaturated sulfonic acids listed in table I in a concentration of about 0.05 to about I00 grains/liter.
- a bath as claimed in claim 2 wherein the unsaturated sulfonic acid is compound 2 oftable l.
- a bath as claimed in claim 2 wherein the unsaturated sulfonic acid is compound I of table l.
- a bath as claimed in claim 2 wherein the unsaturated sulfonic acid is compound 5 of table l.
- a bath as claimed in claim 1 wherein the unsaturated sulfonic acid is compound 2 of table I.
- a bath as claimed in claim 1 wherein the unsaturated sulfonic acid is compound 1 of table I.
- -A method for electrodepositing fine-grained lustrous .nickel comprising the step of electrodepositing fine-grained lustrous nickel from an aqueous acidic nickel-plating bath containing dissolved therein at least one of the unsaturated sulfonic acids listed in table I in a concentration of about 0.05 to about grams/liter.
- a method as claimed in claim 10 wherein the'unsaturated sulfonic acid is compound l of table l.
- a method as claimed in claim 10 wherein the unsaturated sulfonic acid is compound 5 of table I.
- a method as claimed in claim 9 wherein the unsaturated sulfonic acid is compound 1 of table l.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
It has been found that certain unsaturated aliphatic sulfonic acids characterized by having four aliphatic carbon atoms and two separate aliphatic unsaturated linkages, such as the allene sulfonic acid CH2 C C-CH2SO3H are excellent when used in acidic nickel plating baths in making it possible to obtain lustrous ductile nickel plate over a very wide plating range. These sulfonic acids do not have critical upper concentration limits.
Description
United States Patent Fuchs et al,
ELECTRODEPOSITMUN 0F NICKEL Charles F. Fuchs, Evanston, 111.; lllenry Brown, Huntington Woods, Mich.
lnventors:
[1.5. CI ..204/49 lint. Cl. .1 C231) 5/08, C23b 5/46 Field of Search ..204/49, 44, 43, l 12;
References Cited UNITED STATES PATENTS Brown ..204/49 1 Feb, l, M72
2,800,440 7/ l 957 Brown ..204/49 2,841,602 7/1958 Brown et a ...204/49 X 3,306,83l 2/1967 Cope ..204/43 3,428,536 2/ 1969 Towle et a1 .104/49 Primary Examiner-G. L. Kaplan AttorneyStanley H. Lieberstein and William J. Schramm [5 7] ABSTRACT It has been found that certain unsaturated aliphatic sulfonic,
16 Claims, N0 Drawings ELECTRODEPOSITION OF NICKEL TABLE I Concentration, g./l.
1 CH2==C=CHCH:SO:H 0.1-10 2 CHz=CH-CH=CHSO;H 0.1-10
3 -CH=C=CHCHz-SO3H 0. -8
4 CHa=C=(IJ-CH S 01H 0.05-8
5 CH:=(]3CH=CHS 03H 0.05 8
f 6 CH2=CH--(|J=CHS 03H 0. 05-8 1 CHz=C=CH-C|1H-S 03H 0.05-8
s CHz=CH-CH=(]J-S 03H 0. 05-8 9 -oH=oH-oH=oH--s 03H 0. 058
10 |3H=OHS03H 0.05-s
11 t m=ons 0,11 0. 05-8 OH=CHS 0,11.
12 0H=0Hs05rt 0.05-8
[1]., IICEC-CH=CH-S 03H 0. 0H
14 HCEC(|J=CI[S 03H 0.05-8
TABLE I] Cone. all.
1. o-henzoyl sulfimide 005-4 2. benzene sulfonamide 0.1-3
3. toluene sulfonamides 0. l-Z
4. enzene monoand disulfonic acids (Lil-l5 5. naphthalene cliand tri-sulfonic acids (LL-t (a. o-sulfobenzaldchydc 0,33
8. his-toluene suliunimitles 0, I4
It has now been found that the unsaturated aliphatic sulfonic acids shownin table I are unusually effective in decreasing the grain size and increasing the luster and brightness of nickel deposited from aqueous acidic: nickel-plating baths, without seriously decreasing the ductility of the plate or the current density range of the nickel bath. The compounds of table I are more effective than the aliphatic (four) carbon atom compound: 2-butyne-l,4-disulfonic acid in that they produce brightness and luster with much lower concentrations of material, and are vastly superior to the aliphatic (four) carbon atom compound: 2-butene-l,4-disulfonic acid in producing brightness and luster at any concentration. The compounds of table I are also far superior to Z-butene-l-sulfonic acid in producing luster without seriously decreasing the ductility of the plate or causing tensile stresses. The unsaturated aliphatic sulfonic acids of this invention cooperate to give nickel plate of high brilliance and leveling when used in conjunction with unsaturated compounds, such as those carrying thev C= N unsaturated linkage, for example, pyridine, quinoline, isoquinoline and their salts and especially their quaternary salts, or the unsaturated C C linkage as in coumarin, or the unsaturated C :;C linkage as in dimethylethynyl carbinol or butyne-diol, or the unsaturated allene linkage as in CH C=CHCHZOH, CH =C= CHCH OC H OH, and CH C=CHCH OCH CHOHCH CL or the unsaturated C N linkage as in ethylene cyanohydrin. or the unsaturated C=O linkage as in bromal, or of combinations of these types of unsaturated compounds. When one or more of the compounds of table I are used. with the above types of unsaturated compoundsand with one or more of the wellknown benzene and naphthalene sulfonic acids, sulfonarnides and sulfonimides illustrated in table ll, maximum ductility is obtained for the brilliant high levelling nickel K late. mm
p The iirTs'iifrhtd aliphatic sulfonic acids illustrated in table I are effective not only in the Watts high nickel sulfate concentration baths, but also in high chloride, sulfamate or fluoborate nickel baths or mixtures of these baths and salts. The concentrations of table l compounds in the nickel baths are not critical, though in general, no further improvements in luster or ductility are obtained with concentrations above about 10 grams per liter. The bathsoluble salts of the sulfonic acids of this invention are preferred for easier handling especially the sodium or potassium salts. In the acidic nickel baths, the compounds of table I are, of course, present mainly as the sulfonicacids and their nickel salts even if added to the baths as sodium or potassium salts or for that matter. cobalt, magnesium or other salts.
The compounds of table 1 may have halogen atoms substituted for some of the hydrogen atoms, with at the most two halogen atoms per molecule. The halogen atoms may be on the benzene rings as well as on the aliphatic portion of the molecules. in compound I of table I, for example, a chlorine or bromine atom could replace one or both of the hydrogen atoms on the carbon next to the sulfonic group with improved results in luster of the nickel plate. Also one or two fluorine, chlorine, bromine or iodine atoms can be present, for example, on the benzene ring of compound of table I with slightly improved results in luster of the nickel deposit. In most cases,
' the improvements are only slight from the presence of halogen atoms in the compounds of table l. The best pH range for the acidic nickel-plating baths employing the compounds of table I is from about 2.5 to 5.5. The bath temperatures may be from room temperature to at least 180 F., and in this respect, the brighteners of table I used by themselves or with unsaturated compounds, such as a quaternary of pyridine or quinoline, or in conjunction with butynediol or a monoor di-ethylene oxide adduct of butynediol are superior to the well-known brighteners of table ll used alone or with the unsaturated compounds. The compound of table [I may be used in amounts of from 0.l g./l. to saturation.
Below are listed some preferred examples of baths for the production of brilliant nickel plate, with bright plate range from the highest current densities down to the very lowest current densities.
EXAMPLE I Grams per Liter ZOO-300 NiCI.,'6H,O 30-60 H BO, 40 Compound 2 of table I l-4 Allyl quinaldinium hromidc 0.003-(L0l Compound I of table II Compound 8 of table ll 7 The plate from nickel baths with one or more of the compounds of table I present are remarkably free from pitting especially when the concentration of the compounds is about 0.5 g./l. and higher. In general, however, a surface-active agent such as sodium n-octyl sulfate or sodium 2-ethyl hexyl sulfate in concentrations of 0.1 to l g./l. is preferred to be used in air'agitated baths, and sodium lauryl sulfate or sodium lauryl ethoxy sulfatewith non-air-agitated baths. The plate of highest brilliance as previously mentioned is obtained by the conjunctive use of unsaturated class II nickel brighteners as EXAMPLE II Grams per liter NlCh-BH 0.; 100-220 NlSO -6H 0. o-so H BO; 40 Compound 1 01 Table I 2-4 Compound 1 of Table 11.. 1-6 Compound 2 of Table II 1-2 (|)H HOH,C-C C-.OH,OCH CH-CH,SO3N9. 0.10.6
EXAMPLE m NiSOrH o 150400 NiCl,-6H 0 30-150 H3803 4O 0.5-3 Compound 5 of table I shown in examples I and ll.
The table l unsaturated aliphatic sulfonic acids of this invention can be used in very high concentrations in the acidic nickel-plating baths, in fact, up to saturation concentrations. which for some of the compounds, for example, compounds I and 2, are over 100 grams/liter. However, no further improvement of luster is obtained in concentrations above about 10 grams/liter, but since the compounds are noncritical in concentration, any concentration up to saturation concentrations can be used, preferably 0.05 to about 100 g./l.
The compounds of table l are just as effective as brighteners in nickel-cobalt, nickel-iron and nickel-cobalt-iron alloy plating baths. The cobalt may be as high as at least 50 percent in the plate and the iron as high as at least 40 percent, and the total of cobalt plus iron may be as high as 50 percent of the plate. With cobalt concentrations in the plate higher than about 50 percent, it is preferred to have compound I of table II also present in the baths. Thus, with the nickel baths and nickel plate described in this invention as in examples 1, ll and Ill, cobalt and iron may also be present in the plate to the extent of about 50 percent of the plate as combined material, or as about 50 percent of either cobalt or iron separately, and still obtain bright plate that behaves essentially like bright nickel plate. It is therefore to be understood that the claimed nickel baths cover these nickel alloy plates.
Compounds of table I produce lustrous nickel plate even when the bath temperatures are as high as 180 to l F.
What is claimed is:
l. A bath for the electrodeposition of fine-grained lustrous nickel comprising essentially an aqueous acidic nickel-plating bath containing dissolved therein at least one of the unsaturated sulfonic acids listed in table I in a concentration of about 0.05 to about I00 grains/liter.
2. A bath as claimed in claim I wherein there is also present dissolved in said bath at least one of the compounds listed in table ll in a concentration of about 0.l gram/liter to saturation.
3. A bath as claimed in claim 2 wherein the unsaturated sulfonic acid is compound 2 oftable l.
4. A bath as claimed in claim 2 wherein the unsaturated sulfonic acid is compound I of table l.
5. A bath as claimed in claim 2 wherein the unsaturated sulfonic acid is compound 5 of table l.
6. A bath as claimed in claim 1 wherein the unsaturated sulfonic acid is compound 2 of table I.
7. A bath as claimed in claim 1 wherein the unsaturated sulfonic acid is compound 1 of table I.
8. A bath as claimed-in claim 1 wherein the unsaturated sulfonic acid is compound 5 of table I.
9. -A method for electrodepositing fine-grained lustrous .nickel comprising the step of electrodepositing fine-grained lustrous nickel from an aqueous acidic nickel-plating bath containing dissolved therein at least one of the unsaturated sulfonic acids listed in table I in a concentration of about 0.05 to about grams/liter.
10. A method as claimed in claim 9 wherein there is also present dissolved in said bath at least one of the compounds listed in table ll in a concentration of about 0.1 gram/liter to saturation.
11. A method as claimed in claim 10 wherein the unsaturated sulfonic acid is compound 2 of table I. 7
12. A method as claimed in claim 10 wherein the'unsaturated sulfonic acid is compound l of table l.
13. A method as claimed in claim 10 wherein the unsaturated sulfonic acid is compound 5 of table I.
14. A method as claimed in claim 9 wherein the unsaturated sulfonic acid is compound 2 of table I.
15. A method as claimed in claim 9 wherein the unsaturated sulfonic acid is compound 1 of table l.
16. A method as claimed in claim 9 wherein the unsaturated sulfonic acid is compound 5 of table I.
Claims (15)
- 2. A bath as claimed in claim 1 wherein there is also present dissolved in said bath at least one of the compounds listed in table II in a concentration of about 0.1 gram/liter to saturation.
- 3. A bath as claimed in claim 2 wherein the unsaturated sulfonic acid is compound 2 of table I.
- 4. A bath as claimed in claim 2 wherein the unsaturated sulfonic acid is compound 1 of table I.
- 5. A bath as claimed in claim 2 wherein the unsaturated sulfonic acid is compound 5 of table I.
- 6. A bath as claimed in claim 1 wherein the unsaturated sulfonic acid is compound 2 of table I.
- 7. A bath as claimed in claim 1 wherein the unsaturated sulfonic acid is compound 1 of table I.
- 8. A bath as claimed in claim 1 wherein the unsaturated sulfonic acid is compound 5 of table I.
- 9. A method for electrodepositing fine-grained lustrous nickel comprising the step of electrodepositing fine-grained lustrous nickel from an aqueous acidic nickel-plating bath containing dissolved therein at least one of the unsaturated sulfonic acids listed in table I in a concentration of about 0.05 to about 100 grams/liter.
- 10. A method as claimed in claim 9 wherein there is also present dissolved in said bath at least one of the compounds listed in table II in a concentration of about 0.1 gram/liter to saturation.
- 11. A method as claimed in claim 10 wherein the unsaturated sulfonic acid is compound 2 of table I.
- 12. A method as claimed in claim 10 wherein the unsaturated sulfonic acid is compound 1 of table I.
- 13. A method as claimed in claim 10 wherein the unsaturated sulfonic acid is compound 5 of table I.
- 14. A method as claimed in claim 9 wherein the unsaturated sulfonic acid is compound 2 of table I.
- 15. A method as claimed in claim 9 wherein the unsaturated sulfonic acid is compound 1 of table I.
- 16. A method as claimed in claim 9 wherein the unsaturated sulfonic acid is compound 5 of table I.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US5870070A | 1970-07-27 | 1970-07-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US3639220A true US3639220A (en) | 1972-02-01 |
Family
ID=22018388
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US58700A Expired - Lifetime US3639220A (en) | 1970-07-27 | 1970-07-27 | Electrodeposition of nickel |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | US3639220A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01263103A (en) * | 1988-04-15 | 1989-10-19 | Japan Synthetic Rubber Co Ltd | Production of polymer of sulfonated conjugated diene |
| US6045682A (en) * | 1998-03-24 | 2000-04-04 | Enthone-Omi, Inc. | Ductility agents for nickel-tungsten alloys |
| US20070102300A1 (en) * | 2005-11-07 | 2007-05-10 | Jin-Shing Dai | Method for ceramic electroplating a cylinder assembly of an internal combustion engine |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2678910A (en) * | 1950-08-16 | 1954-05-18 | Udylite Corp | Electroplating of nickel |
| US2800440A (en) * | 1955-10-04 | 1957-07-23 | Udylite Res Corp | Electrodeposition of nickel |
| US2841602A (en) * | 1955-10-04 | 1958-07-01 | Udylite Res Corp | Alkynoxy acids |
| US3306831A (en) * | 1963-10-30 | 1967-02-28 | Cowles Chem Co | Electroplating electrolytes |
| US3428536A (en) * | 1966-05-09 | 1969-02-18 | Kewanee Oil Co | Process of and electrolytes for bright nickel electroplating |
-
1970
- 1970-07-27 US US58700A patent/US3639220A/en not_active Expired - Lifetime
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2678910A (en) * | 1950-08-16 | 1954-05-18 | Udylite Corp | Electroplating of nickel |
| US2800440A (en) * | 1955-10-04 | 1957-07-23 | Udylite Res Corp | Electrodeposition of nickel |
| US2841602A (en) * | 1955-10-04 | 1958-07-01 | Udylite Res Corp | Alkynoxy acids |
| US3306831A (en) * | 1963-10-30 | 1967-02-28 | Cowles Chem Co | Electroplating electrolytes |
| US3428536A (en) * | 1966-05-09 | 1969-02-18 | Kewanee Oil Co | Process of and electrolytes for bright nickel electroplating |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01263103A (en) * | 1988-04-15 | 1989-10-19 | Japan Synthetic Rubber Co Ltd | Production of polymer of sulfonated conjugated diene |
| JP2590790B2 (en) | 1988-04-15 | 1997-03-12 | 日本合成ゴム株式会社 | Method for producing conjugated diene sulfonated polymer |
| US6045682A (en) * | 1998-03-24 | 2000-04-04 | Enthone-Omi, Inc. | Ductility agents for nickel-tungsten alloys |
| US20070102300A1 (en) * | 2005-11-07 | 2007-05-10 | Jin-Shing Dai | Method for ceramic electroplating a cylinder assembly of an internal combustion engine |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US2647866A (en) | Electroplating of nickel | |
| US2635076A (en) | Bright nickel plating | |
| USRE31508E (en) | Electrodeposition of chromium | |
| US4053373A (en) | Electroplating of nickel, cobalt, nickel-cobalt, nickel-iron, cobalt-iron and nickel-iron-cobalt deposits | |
| US3804726A (en) | Electroplating processes and compositions | |
| US3697391A (en) | Electroplating processes and compositions | |
| US3812566A (en) | Composite nickel iron electroplate and method of making said electroplate | |
| US2882208A (en) | Electrodeposition of nickel | |
| US4014759A (en) | Electroplating iron alloys containing nickel, cobalt or nickel and cobalt | |
| US3639220A (en) | Electrodeposition of nickel | |
| US3922209A (en) | Electrode position of alloys of nickel, cobalt or nickel and cobalt with iron and electrolytes therefor | |
| US4046647A (en) | Additive for improved electroplating process | |
| US2849353A (en) | Bright nickel plating | |
| US3220940A (en) | Electrodeposition of nickel | |
| US2773022A (en) | Electrodeposition from copper electrolytes containing dithiocarbamate addition agents | |
| US3378470A (en) | Electrodeposition of nickel | |
| US4069112A (en) | Electroplating of nickel, cobalt, mutual alloys thereof or ternary alloys thereof with iron | |
| US4435254A (en) | Bright nickel electroplating | |
| US2648628A (en) | Electroplating of nickel | |
| US3969399A (en) | Electroplating processes and compositions | |
| US2994648A (en) | Nickel plating additives | |
| US3152975A (en) | Electrodeposition of nickel | |
| US3093557A (en) | Methods and electrolytes for depositing nickel and cobalt | |
| US3000799A (en) | Nickel plating solutions | |
| CA1086679A (en) | Electrodepositing nickel, cobalt and their alloys with unsaturated cyclosulfone added |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| AS | Assignment |
Owner name: OXY METAL INDUSTRIES CORPORATION Free format text: CHANGE OF NAME;ASSIGNOR:OXY METAL FINISHING CORPORATION;REEL/FRAME:003967/0084 Effective date: 19741220 |
|
| AS | Assignment |
Owner name: HOOKER CHEMICALS & PLASTICS CORP. Free format text: MERGER;ASSIGNOR:OXY METAL INDUSTRIES CORPORATION;REEL/FRAME:004075/0885 Effective date: 19801222 |
|
| AS | Assignment |
Owner name: OCCIDENTAL CHEMICAL CORPORATION Free format text: CHANGE OF NAME;ASSIGNOR:HOOKER CHEMICAS & PLASTICS CORP.;REEL/FRAME:004126/0054 Effective date: 19820330 |
|
| AS | Assignment |
Owner name: OMI INTERNATIONAL CORPORATION, 21441 HOOVER ROAD, Free format text: ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNOR:OCCIDENTAL CHEMICAL CORPORATION;REEL/FRAME:004190/0827 Effective date: 19830915 |
|
| AS | Assignment |
Owner name: MANUFACTURERS HANOVER TRUST COMPANY, A CORP OF NY Free format text: SECURITY INTEREST;ASSIGNOR:INTERNATIONAL CORPORATION, A CORP OF DE;REEL/FRAME:004201/0733 Effective date: 19830930 |