US20220018609A1

US20220018609A1 - Three-dimensional heat dissipating device

Info

Publication number: US20220018609A1
Application number: US17/360,424
Authority: US
Inventors: Chih-Wei Chen; Tien-Yao Chang; Che-Wei KUO; Hsiang-Chih Chuang; Jyun-Wei Huang; Cheng-Ju Chang
Original assignee: Auras Technology Co Ltd
Current assignee: Auras Technology Co Ltd
Priority date: 2020-07-20
Filing date: 2021-06-28
Publication date: 2022-01-20
Also published as: CN214545253U; TW202205567A; CN113966135A; CN213583120U; TWI809391B; TWI728942B; CN215466658U; CN215269229U; CN215491237U; TWM621682U; CN215491238U; TWM616962U; US20220018610A1; TW202204839A; TWM612891U; TWI768877B; TW202204840A; CN215499871U; TW202204842A; US11698229B2

Abstract

A three-dimensional heat dissipating device includes a vapor chamber, a heat pipe and a working fluid. The vapor chamber includes an inner cavity, a first capillary structure disposed within the inner cavity, and a first joint connected with the inner cavity. The heat pipe includes a pipe body, a second capillary structure, and a second joint disposed at the pipe body and connected to the first joint, such that a pipe space of the pipe body is in communication with the inner cavity. The second capillary structure includes a first section and a second section. The first section is fixedly disposed within a pipe space and connected to the second section. The second section is curvedly extended from one end of the first section, and connected to the first capillary structure. The working fluid is filled within the pipe space and the inner cavity.

Description

RELATED APPLICATIONS

This application claims priority to U.S. Application Ser. No. 63/053,953, filed Jul. 20, 2020, which is herein incorporated by reference.

BACKGROUND

Field of Disclosure

The disclosure relates to a heat dissipating device. More particularly, the disclosure relates to a three-dimensional heat dissipating device.

Description of Related Art

With highly development of semiconductor technology, the speed of a working chip will be getting faster, and the heat generated by the working chip is getting higher. Therefore, the heat dissipation efficiency must be improved, otherwise a problem of excessive system temperature will appear immediately.
For example, since a vapor chamber is provided with characteristics of thermal conduction, light weight and simple structure etc., a conventional manner is to configure a vapor chamber on an electronic component. In order to send the vaporized working fluid back to an evaporation area in the vapor chamber, a capillary structure (e.g., wicks) is required to be formed in the vapor chamber for the next thermal cycle.
However, the heat dissipation efficiency of the vapor chamber is still insufficient, and structural improvement and refinement are required to increase, so as to improve the heat dissipation space and the reflux effect of the vaporized working fluid, thereby improving the thermal cycle efficiency.

SUMMARY

In one embodiment of the disclosure, a three-dimensional heat dissipating device is provided for solving the problems mentioned in the prior art.
In one embodiment of the disclosure, the three-dimensional heat dissipating device includes a vapor chamber, at least one heat pipe and a working fluid. The vapor chamber includes an inner cavity, a first capillary structure and at least one first joint. The first capillary structure is disposed within the inner cavity, and the first joint is in communication with the inner cavity. The heat pipe is provided with a pipe body, a second capillary structure and at least one second joint. The pipe body is formed with a pipe space therein. The second joint is disposed at one end of the pipe body and connected to the first joint, such that the pipe space is in communication with the inner cavity. The second capillary structure includes a first section and at least one second section. The first section is fixedly disposed within the pipe space of the pipe body and connected to the second section. The second section curvedly extended from one end of the first section, disposed within the inner cavity, and connected to the first capillary structure. The working fluid is filled within the pipe space and the inner cavity for being guided to flow by the first capillary structure and the second capillary structure.
According to one or more embodiments of the disclosure, in the three-dimensional heat dissipating device, the vapor chamber includes a cover body and a case body which are sealed to each other so as to form the inner cavity between the cover body and the case body. The first joint is formed on a top surface of the cover body, and the first capillary structure includes a first plate. The first plate is directly formed on one surface of the case body facing towards the cover body.
According to one or more embodiments of the disclosure, in the three-dimensional heat dissipating device, the first plate of the first capillary structure is directly sandwiched between the case body and the second section of the second capillary structure.
According to one or more embodiments of the disclosure, in the three-dimensional heat dissipating device, the first capillary structure includes a second plate, and the second plate is directly formed on one surface of the cover body facing towards the case body. One part of the first section of the second capillary structure is located within the inner cavity, and in contact with the first plate or the second plate of the first capillary structure.
According to one or more embodiments of the disclosure, in the three-dimensional heat dissipating device, the second joint is sleeved to surround the first joint, and the second joint is directly contacted with the vapor chamber.
According to one or more embodiments of the disclosure, the three-dimensional heat dissipating device further includes at least one solder bonding portion surrounding a periphery of the first joint, and the solder bonding portion is closely filled within a slit defined among the first joint, the second joint and the vapor chamber.
According to one or more embodiments of the disclosure, in the three-dimensional heat dissipating device, the second joint is connected to and surrounds the end of the pipe body, and the second joint gradually expands outwardly from the end of the pipe body radially in a direction facing away from the pipe body and the first joint such that the second joint surrounds to form a cone-shaped space. A maximum diameter of the cone-shaped space is greater than a maximum diameter of the pipe space.
According to one or more embodiments of the disclosure, the three-dimensional heat dissipating device further includes a fin assembly having a plurality of heat-dissipation fins, and the heat-dissipation fins are spaced arranged abreast and parallel to one another, and penetrated by the heat pipe simultaneously.
According to one or more embodiments of the disclosure, in the three-dimensional heat dissipating device, the heat pipe is in one of a linear shape, an L-type and a U-type.
According to one or more embodiments of the disclosure, the three-dimensional heat dissipating device further includes two first fin assemblies and a second fin assembly. The first fin assemblies are spaced arranged on the vapor chamber. Each of the first fin assemblies includes a plurality of first heat-dissipation fins. The heat pipe is plural, and each of the heat pipes is provided with a long axis direction that is perpendicularly passed through a top surface of the vapor chamber. The first heat-dissipation fins are spaced arranged abreast along the long axis direction. The heat pipes include at least one first heat pipe and at least one second heat pipe. The first heat-dissipation fins of one of the two first fin assemblies are vertically penetrated through by the first heat pipe simultaneously, and the first heat-dissipation fins of the other of the two first fin assemblies are vertically penetrated through by the second heat pipe simultaneously. The second fin assembly includes a trapezoidal body between the two first fin assemblies. The trapezoidal body includes a plurality of second heat-dissipation fins, and the second heat-dissipation fins are spaced arranged abreast on the vapor chamber along a traversal direction orthogonal to the long axis direction. The trapezoidal body includes a top portion, a bottom portion, and two inclined portions that are opposite to each other, the bottom portion is opposite to the top portion and fixedly connected to the vapor chamber, the top portion is located between the inclined portions, a void gap is formed between each of the two inclined portions and one adjacent of the two first fin assemblies.
According to one or more embodiments of the disclosure, in the three-dimensional heat dissipating device, a first gap is formed between any two adjacent ones of the first heat-dissipation fins, and a second gap is formed between the vapor chamber and one of the first heat-dissipation fins being adjacent to the vapor chamber. The second gap is greater than the first gap.
According to one or more embodiments of the disclosure, in the three-dimensional heat dissipating device, the first joint is two in number, the heat pipe is single one in number, and the second joint is two in number, and the second section of the second capillary structure is two in number. The second joints are located at two opposite ends of the heat pipe. Each of the second joints of the heat pipe is sleeved to surround the corresponding one of the first joints. The second section are connected to two opposite ends of the first section, respectively. The second sections are respectively connected to the first capillary structure in the inner cavity.
According to one or more embodiments of the disclosure, the three-dimensional heat dissipating device further includes a third fin assembly. The third fin assembly includes a top portion and a bottom portion being opposite to each other, the bottom portion is connected to the top surface of the vapor chamber. The third fin assembly includes a plurality of third heat-dissipation fins. The third heat-dissipation fins are spaced arranged abreast along a longitudinal direction orthogonal to a normal direction of the top surface of the vapor chamber. The heat pipe is in a U type, and one part of the heat pipe is disposed on the top portion of the third fin assembly, and the other part of the heat pipe extends into the third heat-dissipation fins from the top portion of the third fin assembly.
According to one or more embodiments of the disclosure, the three-dimensional heat dissipating device further includes a third fin assembly and a fourth fin assembly. The third fin assembly is disposed on the vapor chamber, and the third fin assembly includes a plurality of third heat-dissipation fins spaced arranged abreast along a longitudinal direction orthogonal to a normal direction of the top surface of the vapor chamber. The fourth fin assembly is stacked on the third fin assembly, and the fourth fin assembly includes a plurality of fourth heat-dissipation fins spaced arranged abreast along the longitudinal direction. The heat pipe is in a U type, and disposed within the third fin assembly and the fourth fin assembly.
According to one or more embodiments of the disclosure, the three-dimensional heat dissipating device further includes a third fin assembly. The third fin assembly includes a top portion and a bottom portion being opposite to each other. The bottom portion is connected to the top surface of the vapor chamber. The third fin assembly includes a plurality of third heat-dissipation fins. The third heat-dissipation fins are spaced arranged abreast along a longitudinal direction orthogonal to a normal direction of the top surface of the vapor chamber. The heat pipe is in an L type, and one part of the heat pipe is disposed on the top portion of the third fin assembly, and the other part of the heat pipe extends into the third heat-dissipation fins from the top portion of the third fin assembly.
According to one or more embodiments of the disclosure, the three-dimensional heat dissipating device further includes a third fin assembly and a fourth fin assembly. The third fin assembly is disposed on the vapor chamber, includes a plurality of third heat-dissipation fins spaced arranged abreast along a longitudinal direction orthogonal to a normal direction of the top surface of the vapor chamber. The fourth fin assembly is stacked on the third fin assembly, and includes a plurality of fourth heat-dissipation fins spaced arranged abreast along the longitudinal direction. The heat pipe is in an L type, and disposed within the third fin assembly and the fourth fin assembly.
With the structure described in the above embodiments, the above-mentioned three-dimensional heat dissipating device of the disclosure is allowed to increase the heat dissipation space, and can also accelerate the recirculation effect of the vaporized working fluid, thereby improving the thermal cycle efficiency.
The above description is merely used for illustrating the problems to be resolved, the technical methods for resolving the problems and their efficacies, etc. The specific details of the disclosure will be explained in the embodiments below and related drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings are included to provide a further understanding of the disclosure, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the disclosure and, together with the description, serve to explain the principles of the disclosure. In the drawings,

FIG. 1 is a partially exploded view of a three-dimensional heat dissipating device according to one embodiment of the disclosure;

FIG. 2 is a partial cross section view of an area M of the three-dimensional heat dissipating device of FIG. 1;

FIG. 3 is a partial side view of a three-dimensional heat dissipating device according to one embodiment of the disclosure;

FIG. 4 is a longitudinal section view of a three-dimensional heat dissipating device according to one embodiment of the disclosure;

FIG. 5 is a longitudinal section view of a three-dimensional heat dissipating device according to one embodiment of the disclosure;

FIG. 6A is a perspective view of a three-dimensional heat dissipating device according to one embodiment of the disclosure;

FIG. 6B is a side view of a three-dimensional heat dissipating device according to one embodiment of the disclosure;

FIG. 7A is a side view of a three-dimensional heat dissipating device according to one embodiment of the disclosure;

FIG. 7B is a side view of a three-dimensional heat dissipating device according to one embodiment of the disclosure;

FIG. 8A is a partial side view of a three-dimensional heat dissipating device according to one embodiment of the disclosure; and

FIG. 8B is a partial side view of a three-dimensional heat dissipating device according to one embodiment of the disclosure.

DESCRIPTION OF THE EMBODIMENTS

Reference will now be made in detail to the present embodiments of the disclosure, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers are used in the drawings and the description to refer to the same or like parts. According to the embodiments, it will be apparent to those skilled in the art that various modifications and variations can be made to the structure of the disclosure without departing from the scope or spirit of the disclosure.
Reference is now made to FIG. 1 to FIG. 2, in which FIG. 1 is a partially exploded view of a three-dimensional heat dissipating device 10 according to one embodiment of the disclosure, and FIG. 2 is a partial cross section view of an area M of the three-dimensional heat dissipating device 10 of FIG. 1. As shown in FIG. 1 and FIG. 2, the three-dimensional heat dissipating device includes a vapor chamber 100, a plurality (e.g., two) of heat pipes 200 and a working fluid 500. The vapor chamber 100 includes a cover body 110, a case body 120 and a first capillary structure 150. The cover body 110 and the case body 120 are sealed to each other so as to form the inner cavity 140 between the cover body 110 and the case body 120. The first capillary structure 150 is disposed within the inner cavity 140. The case body 120 is formed with an inner surface 121 and a bottom surface 122 in which the inner surface 121 of the case body 120 faces towards the inner cavity 140, and the bottom surface 122 of the case body 120 faces away from the inner cavity 140. The cover body 110 is formed with a top surface 111 and a back surface 112 which are opposite to each other. The back surface 112 of the cover body 110 faces towards the inner cavity 140 and the top surface 111 of the cover body 110 faces away from the inner cavity 140.
The top surface 111 of the cover body 110 is provided with a plurality of (e.g., two) first joints 130. The first joints 130 are spaced arranged on the top surface 111 of the cover body 110. Each of the first joints 130 extends upwardly from the top surface 111 of the cover body 110, and each of the first joints 130 is formed with a passage 131 that is in communication with the inner cavity 140. Each of the passages 131 of the first joints 130 is provided with a long axis direction 131A, and the long axis directions 131A of the passages 131 are parallel to one another.
Each of the heat pipes 200 is provided with a pipe body 210, a second joint 280 and a second capillary structure 300. Each of the pipe body 210 is in a linear shape, and a long axis direction 211A of the pipe body 210 is coaxially aligned with the long axis direction 131A of each of the passage 131, and the long axis direction 211A of the pipe body 210 is perpendicular to, or at least approximately perpendicular to the top surface 111 of the cover body 110. A long axis direction 211A of the pipe body 210 is a normal direction of the top surface 111. The pipe body 210 is formed with a pipe space 211 extending along the long axis direction 131A of the passage 131. One end of the pipe body 210 facing away from the vapor chamber 100 is an enclosed end 212, and the second joint 280 is disposed on the other end of the pipe body 210. The second joint 280 is connected to the first joint 130, such that the pipe space 211 is in communication with the inner cavity 140. More specifically, in the embodiment, the second joint 280 is connected to surround the other end of the pipe body 210, and gradually expands outwardly from the other end of the pipe body 210 radially in a direction facing away from the pipe body 210 and the second joint 280 such that the second joint 280 surrounds to form a cone-shaped space 290. A maximum diameter D1 of the cone-shaped space 290 is greater than a maximum diameter D2 of the pipe space 211.
The second capillary structure 300 is in a L-shape, and the second capillary structure 300 includes a first section 310 and a second section 340. The first section 310 is disposed within the pipe space 211, and connected to the second section 340. Each of the first section 310 and the second section 340 is a linear strip, respectively. The second section 340 curvedly extends outwards from one end of the first section 310, disposed within the inner cavity 140, and fixedly connected to the first capillary structure 150. For example, the second section 340 and the first section 310 are orthogonal to each other, or at least approximately orthogonal to each other. The first section 310 of the second capillary structure 300 is not fixedly disposed on an inner wall 214 of the pipe space 211, and may be hung down within the pipe space 211, or may be non-fixedly attached to the inner wall 214 of the pipe space 211. The working fluid 500 is filled within the pipe space 211 and the inner cavity 140 for being guided to flow by the first capillary structure 150 and the second capillary structure 300.
Thus, when the vapor chamber 100 absorbs the working thermal energy of a heat source (not shown in figures) to heat and vaporize the working fluid 500, the vaporized working fluid 500 flows to the heat pipe 200 through the passage 131 and flows towards one end of the heat pipe 200 facing away from the heat source (not shown in figures) so as to be condensed back into a liquid state. Finally, the liquid working fluid 500 that is located away from the heat source can be guided back to the first capillary structure 150 by the second capillary structure 300 for achieving the purpose of heat dissipation.
More specifically, the first capillary structure 150 includes a first plate 151 and a second plate 152. The first plate 151 and the second plate 152 are respectively disposed at two opposite sides of the inner cavity 140, and remained a distance from each other. For example, the first plate 151 is directly formed on the inner surface 121 of the case body 120, and the inner surface 121 of the case body 120 is fully covered with the first plate 151; in other words, an outer contour of the first plate 151 and an outer contour of the inner surface 121 of the case body 120 are substantially the same, or at least similar to each other. The second plate 152 is directly formed on the back surface 112 of the cover body 110, and the back surface 112 of the cover body 110 is fully covered with the second plate 152; in other words, an outer contour of the second plate 152 and an outer contour of the back surface 112 of the cover body 110 are substantially the same, or at least similar to each other. One part of the first section 310 of the second capillary structure 300 is located within the inner cavity 140, and in contact with the second plate 152 of the first capillary structure 150. The second section 340 of the second capillary structure 300 directly covers the first plate 151 of the first capillary structure 150, and the first plate 151 of the first capillary structure 150 is directly sandwiched between the inner surface 121 of the case body 120 and the second section 340 of the second capillary structure 300.
Thus, one part of the working fluid 500 being away from the heat source can flow to the first capillary structure 150 from the first section 310 of the second capillary structure 300, and the other part of the working fluid 500 being away from the heat source can flow to the first capillary structure 150 from the second section 340 of the second capillary structure 300 so as to be flowed back into the aforementioned evaporation area in the vapor chamber 100, respectively.
In one embodiment, when the second section 340 of the second capillary structure 300 is plural in number, the plural second sections 340 are respectively curvedly extended outwards from one end of the first section 310, disposed within the inner cavity 140, and fixedly connected to the first capillary structures 150 which are located at different regions, however, the disclosure is not limited thereto. Through the design of the plural second sections 340, temperature equalization effect of the vapor chamber 100 can be increased to improve the heat dissipation effect. In this way, when the heat sources (not shown in figures) are plural in number, and arranged at the bottom surface 122 of the case body 120 at intervals, the second sections 340 can be respectively positioned above the heat sources exactly so as to quickly receive working thermal energy from these heat sources (not shown in figures).
Also, when the second joint 280 of the heat pipes 200 is connected to one of the first joints 130 of the vapor chamber 100, the first joint 130 inserts into the second joint 280 so that the second joint 280 is sleeved to surround one of the first joints 130, and the end surface 213 of the second joint 280 is directly contacted with the top surface 111 of the cover body 110 of the vapor chamber 100. Next, the three-dimensional heat dissipating device 10 further fixedly integrates the heat pipe 200 and the vapor chamber 100 together through soldering material so that the soldering material can be formed into a solder bonding portion S to be located at the second joint 280 and the top surface 111 of the cover body 110, and within a slit (referring to the cone-shaped space 290) defined among the first joint 130, the second joint 280 and the top surface 111 of the cover body 110. Accordingly, the heat pipe 200 and the vapor chamber 100 are fixedly integrated together. In other words, a part of the solder bonding portion S surrounds a periphery of the first joint 130 and is located on the top surface 111 of the cover body 110, and the other part of the solder bonding portion S is closely filled within the slit (referring to the cone-shaped space 290) defined among the first joint 130, the second joint 280 and the vapor chamber 100.
FIG. 3 is a partial side view of a three-dimensional heat dissipating device 11 according to one embodiment of the disclosure. As shown in FIG. 3, the three-dimensional heat dissipating device 11 of the embodiment is substantially the same to the three-dimensional heat dissipating device 10 of FIG. 1, and at least one of differences between the three-dimensional heat dissipating device 11 and the three-dimensional heat dissipating device 10 is that the three-dimensional heat dissipating device 11 further includes a fin assembly 400. The fin assembly 400 includes a plurality of heat-dissipation fins 410. The heat-dissipation fins 410 are penetrated by the heat pipes 200 simultaneously, and are spaced arranged abreast and parallel to one another.
More specifically, the heat-dissipation fins 410 are arranged abreast on the heat pipe 200 at equal distances along the long axis direction 211A of the pipe body 210. A first gap 420 is formed between any two adjacent ones of the heat-dissipation fins 410, and a second gap 430 is formed from the top surface 111 of the cover body 110 to the most bottom of the heat-dissipation fins 410 (i.e., the first heat-dissipation fin 410A closest to the vapor chamber 100). Any two of the first gaps 420 between the heat-dissipation fins 410 are substantially the same, and the second gap 430 is substantially the same as one of the first gaps 420. Thus, after the working thermal energy is transferred to the heat pipes 200, the working thermal energy can be quickly transferred to the heat-dissipation fins 410 from the heat pipes 200, and then dissipated into the atmosphere through the heat-dissipation fins 410.
FIG. 4 is a perspective view of a three-dimensional heat dissipating device 12 according to one embodiment of the disclosure. As shown in FIG. 4, the three-dimensional heat dissipating device 12 of the embodiment is substantially the same to the three-dimensional heat dissipating device 10 of FIG. 1, and at least one of differences between the three-dimensional heat dissipating device 12 and the three-dimensional heat dissipating device 10 is that the pipe body 210A of each of the heat pipes 201 is in a L-shape. The first section 311 of the second capillary structure 301 is in a L-shape rather than a linear shape.
More specifically, the pipe body 210A of each of the heat pipes 201 includes a first segment 220, a second segment 230, and a bending portion 240. The bending portion 240 is connected to the first segment 220 and the second segment 230 so that a long axis direction 220A of the first segment 220 is perpendicular to, or at least approximately perpendicular to a long axis direction 230A of the second segment 230, and the long axis direction 230A of the second segment 230 is perpendicularly passed through the top surface 111 of the cover body 110. The enclosed end 212 is located on the first segment 220, and the second joint 280 is located at the second segment 230.
Furthermore, the first section 311 of the second capillary structure 301 is located within the pipe space 211. In the embodiment, the first section 311 of the second capillary structure 301 is not fixedly disposed on the inner wall 214 of the pipe space 211, and possibly hung down within the pipe space 211, or may be non-fixedly attached to the inner wall 214 of the pipe space 211. One end of the first section 311 of the second capillary structure 301 is connected to the closed end 212 of the pipe body 210A, and the other end extends into the inner cavity 140 from the second gap 430 via the first segment 220, the bending portion 240 and the second segment 230 sequentially. The second section 340 of the second capillary structure 301 is in a linear shape, and a long axis direction 340A of the second section 340 and a long axis direction 220A of the first segment 220 are parallel to each other, or at least approximately parallel.
In specific, the first section 311 includes a first subsection 311A, a second subsection 311B and a bending section 311C. The first subsection 311A and the second subsection 311B are in a linear shape, respectively, and the bending section 311C that is in a curved shape is connected to the first subsection 311A and the second subsection 311B. The first subsection 311A is disposed within one part of the pipe space 211 corresponding to the first segment 220, the second subsection 311B is disposed within another part of the pipe space 211 corresponding to the second segment 230, and the bending section 311C is disposed within the other part of the pipe space 211 corresponding to the bending portion 240.
In one embodiment, when the second section 340 of the second capillary structure 301 is plural in number, the plural second sections 340 are respectively curvedly extended outwards from one end (e.g., second subsection 311B) of the first section 311, disposed within the inner cavity 140, and fixedly connected to the first capillary structures 150 (e.g., the first plate 151 or the second plate 152) which are located at different regions, however, the disclosure is not limited thereto. Through the design of the plural second sections 340, temperature equalization effect of the vapor chamber 100 can be increased to improve the heat dissipation effect. In this way, when the heat sources (not shown in figures) are plural in number, and arranged at the bottom surface 122 of the case body 120 at intervals, the second sections 340 can be respectively positioned above the heat sources exactly so as to quickly receive working thermal energy from these heat sources (not shown in figures).
In one embodiment, one surface of the first segment 220 of the pipe body 210A facing towards the vapor chamber 100 is flat, but the disclosure is not limited thereto.
FIG. 5 is a perspective view of a three-dimensional heat dissipating device 13 according to one embodiment of the disclosure. As shown in FIG. 5, the three-dimensional heat dissipating device 13 of the embodiment is substantially the same to the three-dimensional heat dissipating device 10 of FIG. 1, and at least one of differences between the three-dimensional heat dissipating device 13 and the three-dimensional heat dissipating device 10 is that the heat pipe 202 can be single or plural, and the pipe body 210B of the heat pipe 202 is in a U-shape rather than a linear shape. The second joint 280 is two in number, and the second joints 280 are respectively disposed at two opposite ends of the pipe body 210B for being sleeved with corresponding one of the first joints 130, respectively. The second capillary structure 302 includes a first section 312, a second section 340 and a third section 350. The first section 312 of the second capillary structure 302 is in a U-shape rather than a linear shape. The second section 340 and the third section 350 of the second capillary structure 302 are respectively disposed at the two opposite ends of the first section 312, and curvedly extended towards the inner cavity 140 so as to fixedly connected to the first capillary structure 150. The first section 312 of the second capillary structure 302 is located within the pipe space 211.
In other words, the heat pipe 202 is provided without an enclosed end 212. In specific, the pipe body 210B includes a first segment 250, two second segments 260 and two bending portions 270. Each of the bending portions 270 is connected to one end of the first segment 250 and one of the second segments 260 so that a long axis direction 250A of the first segment 250 is perpendicular to a long axis direction 260A of the second segment 260, and the long axis direction 260A of the second segment 260 is perpendicularly passed through or at least approximately perpendicularly passed through the top surface 111 of the cover body 110. Each of the second joints 280 is located at one distal end of each of the second segments 260. The first section 312 of the second capillary structure 302 is arranged into the heat pipe 202 via one of the second segments 260, one of the bending portions 270, the first segment 250, the other of the bending portions 270 and the other of the second segments 260 in order. Thus, refer to FIG. 2, the working fluid 500 can be sent into the pipe space 211 from the inner cavity 140 of the vapor chamber 100 through one of the second joints 280, and sent back to the inner cavity 140 from the pipe space 211 through the other of the second joints 280. Thus, the vaporized working fluid 500 can be flowed into the pipe space 211 from the inner cavity 140 of the vapor chamber 100 through one of the second joints 280. When the vaporized working fluid 500 is condensed back into a liquid working fluid 500, the liquid working fluid 500 can be guided by the second capillary structure 302 to the first capillary structure 150, or even back to the aforementioned evaporation area for achieving the heat dissipation function.
In specific, the first section 312 includes a first subsection 312A, two second subsections 312B and two bending sections 312C. The first subsection 312A and one of the second subsections 312B are in a curved shape, respectively, and each of the bending sections 312C is connected to the first subsection 312A and one of the second subsections 312B. The first subsection 312A is disposed within one part of the pipe space 211 corresponding to the first segment 250, each of the second subsections 312B is disposed within another part of the pipe space 211 corresponding to one of the second segments 260, and each of the bending sections 312C is disposed within one another part of the pipe space 211 corresponding to one of the bending portions 270.
In one embodiment, when the second section 340 and the third section 350 of the second capillary structure 302 are respectively plural in number, the plural second sections 340 are respectively curvedly extended outwards from one end (e.g., one of the second subsection 312B) of the first section 312, disposed within the inner cavity 140, and fixedly connected to the first capillary structures 150 (e.g., first plate 151 or second plate 152) which are located at different regions. The plural third sections 530 are respectively curvedly extended outwards from one end (e.g., the other of the second subsection 312B) of the first section 312, disposed within the inner cavity 140, and fixedly connected to the first capillary structures 150 (e.g., first plate 151 or second plate 152) which are located at different regions; however, the disclosure is not limited thereto. Through the design of the plural second sections 340 and the plural third sections 530, temperature equalization effect of the vapor chamber 100 can be increased to improve the heat dissipation effect. In this way, when the heat sources (not shown in figures) are plural in number, and arranged at the bottom surface 122 of the case body 120 at intervals, the second sections 340 and the third sections 530 can be respectively positioned above the heat sources exactly so as to quickly receive working thermal energy from these heat sources (not shown in figures).
In one embodiment, one surface of the first segment 250 of the pipe body 210B facing towards the vapor chamber 100 is flat, but the disclosure is not limited thereto.
In the above embodiment, the first sections 310, 311, 312 of the disclosure are respectively occupied three-quarters of the corresponding pipe space 211. At this time, after the vaporized working fluid 500 is condensed back into the liquid working fluid 500, the first sections 310, 311, 312 can absorb more liquid working fluid 500 in the pipe space 211, and guide more liquid working fluid 500 to the first capillary structure 150 (e.g., the first plate 151 or the second plate 152), thereby improving the heat dissipation effect, however, the disclosure is not limited thereto.
FIG. 6A is a perspective view of a three-dimensional heat dissipating device 14 according to one embodiment of the disclosure, and FIG. 6B is a side view of a three-dimensional heat dissipating device 14 according to one embodiment of the disclosure. As shown in FIG. 6A and FIG. 6B, the three-dimensional heat dissipating device 14 of the embodiment is substantially the same to the three-dimensional heat dissipating device 11 of FIG. 3, and at least one of differences between the three-dimensional heat dissipating device 14 and the three-dimensional heat dissipating device 11 is that the three-dimensional heat dissipating device 14 further includes two first fin assemblies 440 and a second fin assembly 450. The first fin assemblies 440 are spaced arranged on the vapor chamber 100. Each of the first fin assemblies 440 includes a plurality of first heat-dissipation fins 441. The aforementioned heat pipes are divided into several first heat pipes 200A and several second heat pipes 200B. Some of the first heat-dissipation fins 441 are arranged abreast along the long axis direction 211A, and vertically penetrated through by the first heat pipes 200A, simultaneously. Others of the first heat-dissipation fins 441 are arranged abreast along the long axis direction 211A, and vertically penetrated through by the second heat pipes 200B, simultaneously. One of the first fin assemblies 440, the second fin assembly 450 and the other of the first fin assemblies 440 are arranged in a longitudinal direction 474 sequentially. The second fin assembly 450 includes a trapezoidal body 460 between the first fin assemblies 440. The trapezoidal body 460 includes a plurality of second heat-dissipation fins 465. The second heat-dissipation fins 465 are spaced arranged abreast along a traversal direction 466 that is orthogonal to the aforementioned long axis direction 211A and the aforementioned longitudinal direction 474.
The trapezoidal body 460 includes a top portion 461, a bottom portion 462 and two inclined portions 463 that are opposite to each other. The bottom portion 462 is opposite to the top portion 461 and fixedly connected to the vapor chamber 100. The top portion 461 is located between the inclined portions 463. A void gap 464 is formed between each of the inclined portions 463 and one adjacent of the first fin assemblies 440. Thus, when one part of the working thermal energy can be transferred to one of the first fin assemblies 440 through the first heat pipes 200A, and the other of the first fin assemblies 440 through the second heat pipes 200B, and the other part of the working thermal energy can be transferred to the second fin assembly 450 through the vapor chamber 100 so as to be dissipated into the atmosphere through the first heat-dissipation fins 441 and the second heat-dissipation fins 465. In one embodiment, a straight portion 467 of the trapezoidal body 460 is defined between the bottom portion 462 and one side of the inclined portions 463 opposite to the top portion 461. The straight portion 467 is perpendicular to the bottom portion 462. However, the disclosure is not limited thereto.
It is noted, after the working thermal energy is transferred to the second fin assembly 450, the working thermal energy further can be dissipated into the atmosphere through the void gap 464 between the inclined portion 463 and the first fin assembly 440.
Furthermore, a first gap 420 is formed between any two adjacent ones of the first heat-dissipation fins 441, and any two of the first gap 420 are substantially the same. A second gap 431 is formed between the vapor chamber 100 and the most bottom one of the first heat-dissipation fins 441 (i.e., the first heat-dissipation fin 441A closest to the vapor chamber 100). The second gap 431 is greater than the first gap 420. Thus, after the working thermal energy is transferred to the vapor chamber 100, the working thermal energy further can be dissipated into the atmosphere through the second gap 431.
FIG. 7A is a side view of a three-dimensional heat dissipating device 15 according to one embodiment of the disclosure. As shown in FIG. 7A, the three-dimensional heat dissipating device 15 of the embodiment is substantially the same to the three-dimensional heat dissipating device 13 of FIG. 5, and at least one of differences between the three-dimensional heat dissipating device 15 and the three-dimensional heat dissipating device 13 is that the three-dimensional heat dissipating device 15 includes a third fin assembly 470. The third fin assembly 470 includes a top portion 471 and a bottom portion 472 opposite to each other. The bottom portion 472 is connected to the vapor chamber 100. The third fin assembly 470 includes a plurality of third heat-dissipation fins 473. The third heat-dissipation fins 473 are spaced arranged abreast along a longitudinal direction 474 that is orthogonal to the aforementioned traversal direction 466 and the aforementioned long axis direction 211A. The pipe body 210B of the heat pipe 202 is in a U type. One part of the pipe body 210B in the U type is disposed on the top portion 471 of the third fin assembly 470, and the other part of the pipe body 210B in the U type extends into the third heat-dissipation fins 473 from the top portion 471 of the third fin assembly 470.
More specifically, the third fin assembly 470 is provided with two penetrating channels 475. Each of the penetrating channels 475 extends along the long axis direction 211A to connect to the top portion 471 and the bottom portion 472 of the third fin assembly 470, respectively. The first segment 250 of the pipe body 210B is located outside the third heat-dissipation fins 473, and directly placed on the top portion 471 of the third fin assembly 470, and each of the second segments 260 extends into one of the penetrating channels 475 from the top portion 471 of the third fin assembly 470.
In this embodiment, a width of each of the penetrating channels 475 is approximately the same as a width of the second segment 260 of the pipe body 210B, or a width of each of the penetrating channels 475 is greater than a width of the second segment 260 of the pipe body 210B.
In one embodiment, one surface of the first segment 250 of the pipe body 210B facing towards the top portion 471 of the third fin assembly 470 is flat, but the disclosure is not limited thereto.
FIG. 7B is a side view of a three-dimensional heat dissipating device 16 according to one embodiment of the disclosure. As shown in FIG. 7B, the three-dimensional heat dissipating device 16 of the embodiment is substantially the same to the three-dimensional heat dissipating device 15 of FIG. 7A, and at least one of differences between the three-dimensional heat dissipating device 16 and the three-dimensional heat dissipating device 15 is that the three-dimensional heat dissipating device 16 further includes a fourth fin assembly 480. The fourth fin assembly 480 is stacked above the third fin assembly 470. The fourth fin assembly 480 includes a plurality of fourth heat-dissipation fins 482 spaced arranged abreast along the longitudinal direction 474. One part of the pipe body 210B in the U type is disposed within the fourth fin assembly 480, and the other part of the pipe body 210B in the U type extends into the third fin assembly 470 from the fourth fin assembly 480.
More specifically, a lateral groove 481 is recessed on one surface of the fourth fin assembly 480 facing towards the third fin assembly 470. The lateral groove 481 is located between the fourth fin assembly 480 and the third fin assembly 470, and recessed on several of the fourth heat-dissipation fins 482. The first segment 250 of the pipe body 210B of the heat pipe 202 is located within the lateral groove 481, and directly placed on the third fin assembly 470. Each of the second segments 260 of the pipe body 210B extends into one of the penetrating channels 475 in the third fin assembly 470.
In the embodiment, a width of the lateral groove 481 is substantially the same to a width of the first segment 250 of the pipe body 2106, and a width of one of the penetrating channels 475 is substantially the same to a width of one of the second segments 260 of the pipe body 2106. Alternatively, a width of the lateral groove 481 is greater than a width of the first segment 250 of the pipe body 2106, and a width of one of the penetrating channels 475 is greater than a width of one of the second segments 260 of the pipe body 210B.
FIG. 8A is a partial side view of a three-dimensional heat dissipating device 17 according to one embodiment of the disclosure. As shown in FIG. 8A, the three-dimensional heat dissipating device 17 of the embodiment is substantially the same to the three-dimensional heat dissipating device 15 of FIG. 7A, and at least one of differences between the three-dimensional heat dissipating device 17 and the three-dimensional heat dissipating device 15 is that the pipe body 210A of the heat pipe 201 is in an L type, and one part of the pipe body 210A is disposed on the top portion 471 of the third fin assembly 470, and the other part of the pipe body 210A extends into the third heat-dissipation fins 473 from the top portion 471 of the third fin assembly 470.
More specifically, the first segment 220 of the pipe body 210A with the L type is located outside the third heat-dissipation fins 473, and directly placed on the top portion 471 of the third fin assembly 470, and the second segment 230 of the pipe body 210A extends into one of the penetrating channels 475 from the top portion 471 of the third fin assembly 470.
In this embodiment, a width of each of the penetrating channels 475 is approximately the same as a width of the second segment 230 of the pipe body 210A, or a width of each of the penetrating channels 475 is greater than a width of the second segment 230 of the pipe body 210A.
In one embodiment, one surface of the first section 220 of the pipe body 210A facing towards the top portion 471 of the third fin assembly 470 is flat, but the disclosure is not limited thereto.
FIG. 8B is a partial side view of a three-dimensional heat dissipating device 18 according to one embodiment of the disclosure. As shown in FIG. 8B, the three-dimensional heat dissipating device 18 of the embodiment is substantially the same to the three-dimensional heat dissipating device 16 of FIG. 7B, and at least one of differences between the three-dimensional heat dissipating device 18 and the three-dimensional heat dissipating device 16 is that the pipe body 210A of the heat pipe 201 is in an L type rather than a U type. The pipe body 210A in the L type is collectively disposed within the third fin assembly 470 and the fourth fin assembly 480.
More specifically, the first segment 220 of the pipe body 210A in the L type is located within the lateral groove 481, and the second segment 230 of the pipe body 210A extends into one of the penetrating channels 475 in the third fin assembly 470.
In the embodiment, a width of the lateral groove 481 is substantially the same to a width of the first segment 220 of the pipe body 210A, and a width of one of the penetrating channels 475 is substantially the same to a width of the second segment 230 of the pipe body 210A.
To sump, in the foregoing embodiments, each of the vapor chamber and the heat pipe includes a metal material or a composite material with high conductivity. The conductivity is, for example, a thermal conductivity, however, the disclosure is not limited to thereto. The metal material is, for example, copper, aluminum, stainless steel, or heterogeneous metals, etc. However, the disclosure is not limited thereto. The working fluid is, for example, pure water, inorganic compounds, alcohols, ketones, liquid metals, refrigerant, organic compounds, or mixtures thereof, however, the present invention is not limited thereto. Each of the first capillary structure and the second capillary structure is a porous structure that is allowed to provide capillary force to drive the working fluid. For example, the capillary structure is made of powder sintered body, mesh body, fiber body, groove, whisker or any combination of the foregoing. When the capillary structure is sintered metal powders, the sintered metal powders are formed on the inner surfaces of the inner cavity. When the capillary structure is a fibrous body, the fibrous body includes fiber bundles twisted and wound by a plurality of fiber threads. The fiber thread is a metal fiber thread, a glass fiber thread, a carbon fiber thread, a polymer fiber thread, or other capillary material that is able to guide the flow of the working fluid, but the disclosure is not limited thereto.
Although the disclosure has been described in considerable detail with reference to certain embodiments thereof, other embodiments are possible. Therefore, the spirit and scope of the appended claims should not be limited to the description of the embodiments contained herein.
It will be apparent to those skilled in the art that various modifications and variations can be made to the structure of the disclosure without departing from the scope or spirit of the disclosure. In view of the foregoing, it is intended that the disclosure cover modifications and variations of this disclosure provided they fall within the scope of the following claims and their equivalents.

Claims

What is claimed is:

1. A three-dimensional heat dissipating device, comprising:

a vapor chamber comprising an inner cavity, a first capillary structure and at least one first joint, the first capillary structure disposed within the inner cavity, and the at least one first joint that is in communication with the inner cavity;

at least one heat pipe provided with a pipe body, a second capillary structure and at least one second joint, the pipe body having a pipe space therein, the at least one second joint that is disposed at one end of the pipe body and connected to the at least one first joint, such that the pipe space is in communication with the inner cavity, the second capillary structure comprising a first section and at least one second section, the first section fixedly disposed within the pipe space of the pipe body and connected to the second section, and the second section curvedly extended from one end of the first section, disposed within the inner cavity, and connected to the first capillary structure; and

a working fluid filled within the pipe space and the inner cavity for being guided to flow by the first capillary structure and the second capillary structure.

2. The three-dimensional heat dissipating device of claim 1, wherein the vapor chamber comprises a cover body and a case body which are sealed to each other so as to form the inner cavity between the cover body and the case body, wherein the at least one first joint is formed on a top surface of the cover body, and the first capillary structure comprises a first plate, the first plate is directly formed on one surface of the case body facing towards the cover body.

3. The three-dimensional heat dissipating device of claim 2, wherein the first plate of the first capillary structure is directly sandwiched between the case body and the at least one second section of the second capillary structure.

4. The three-dimensional heat dissipating device of claim 2, wherein the first capillary structure comprises a second plate, and the second plate is directly formed on one surface of the cover body facing towards the case body; and

one part of the first section of the second capillary structure is located within the inner cavity, and in contact with the first plate or the second plate of the first capillary structure.

5. The three-dimensional heat dissipating device of claim 1, wherein the at least one second joint is sleeved to surround the at least one first joint, and the at least one second joint is directly contacted with the vapor chamber.

6. The three-dimensional heat dissipating device of claim 5, further comprising:

at least one solder bonding portion surrounding a periphery of the at least one first joint, and the at least one solder bonding portion closely filled within a slit defined among the at least one first joint, the at least one second joint and the vapor chamber.

7. The three-dimensional heat dissipating device of claim 5, wherein the at least one second joint is connected to and surrounds the end of the pipe body, and the at least one second joint gradually expands outwardly from the end of the pipe body radially in a direction facing away from the pipe body and the at least one first joint such that the at least one second joint surrounds to form a cone-shaped space,

wherein a maximum diameter of the cone-shaped space is greater than a maximum diameter of the pipe space.

8. The three-dimensional heat dissipating device of claim 1, further comprising:

a fin assembly comprising a plurality of heat-dissipation fins, and the heat-dissipation fins which are spaced arranged abreast and parallel to one another, and penetrated by the at least one heat pipe simultaneously.

9. The three-dimensional heat dissipating device of claim 1, wherein the at least one heat pipe is in one of a linear shape, an L-type and a U-type.

10. The three-dimensional heat dissipating device of claim 1, further comprising:

two first fin assemblies spaced arranged on the vapor chamber, each of the first fin assemblies comprising a plurality of first heat-dissipation fins, wherein the at least one heat pipe is plural, and each of the at least one heat pipes is provided with a long axis direction that is perpendicularly passed through a top surface of the vapor chamber, the first heat-dissipation fins are spaced arranged abreast along the long axis direction, and the heat pipes comprise at least one first heat pipe and at least one second heat pipe, the first heat-dissipation fins of one of the two first fin assemblies are vertically penetrated through by the at least one first heat pipe simultaneously, and the first heat-dissipation fins of the other of the two first fin assemblies are vertically penetrated through by the at least one second heat pipe simultaneously; and

a second fin assembly comprising a trapezoidal body between the two first fin assemblies, and the trapezoidal body comprising a plurality of second heat-dissipation fins, and the second heat-dissipation fins are spaced arranged abreast on the vapor chamber along a traversal direction orthogonal to the long axis direction,

wherein the trapezoidal body comprises a top portion, a bottom portion, and two inclined portions that are opposite to each other, the bottom portion is opposite to the top portion and fixedly connected to the vapor chamber, the top portion is located between the inclined portions, a void gap is formed between each of the two inclined portions and one adjacent of the two first fin assemblies.

11. The three-dimensional heat dissipating device of claim 10, wherein a first gap is formed between any two adjacent ones of the first heat-dissipation fins, and a second gap is formed between the vapor chamber and one of the first heat-dissipation fins being adjacent to the vapor chamber, wherein the second gap is greater than the first gap.

12. The three-dimensional heat dissipating device of claim 1, wherein the at least one first joint is two in number;

the at least one heat pipe is one in number, the at least one second joint is two in number, and the second joints are located at two opposite ends of the at least one heat pipe, wherein each of the second joints of the at least one heat pipe is sleeved to surround the corresponding one of the first joints; and

the at least one second section of the second capillary structure is two in number, the at least one second section are connected to two opposite ends of the first section, respectively, wherein the second sections are respectively connected to the first capillary structure in the inner cavity.

13. The three-dimensional heat dissipating device of claim 1, further comprising:

a third fin assembly comprising a top portion and a bottom portion being opposite to each other, the bottom portion that is connected to a top surface of the vapor chamber,

the third fin assembly comprising a plurality of third heat-dissipation fins, the third heat-dissipation fins that are spaced arranged abreast along a longitudinal direction orthogonal to a normal direction of the top surface of the vapor chamber,

wherein the at least one heat pipe is in a U type, and one part of the at least one heat pipe is disposed on the top portion of the third fin assembly, and the other part of the at least one heat pipe extends into the third heat-dissipation fins from the top portion of the third fin assembly.

14. The three-dimensional heat dissipating device of claim 1, further comprising:

a third fin assembly disposed on the vapor chamber, comprising a plurality of third heat-dissipation fins spaced arranged abreast along a longitudinal direction orthogonal to a normal direction of a top surface of the vapor chamber; and

a fourth fin assembly stacked on the third fin assembly, and comprising a plurality of fourth heat-dissipation fins spaced arranged abreast along the longitudinal direction,

wherein the at least one heat pipe is in a U type, and disposed within the third fin assembly and the fourth fin assembly.

15. The three-dimensional heat dissipating device of claim 1, further comprising:

wherein the at least one heat pipe is in an L type, and one part of the at least one heat pipe is disposed on the top portion of the third fin assembly, and the other part of the at least one heat pipe extends into the third heat-dissipation fins from the top portion of the third fin assembly.

16. The three-dimensional heat dissipating device of claim 1, further comprising:

wherein the at least one heat pipe is in an L type, and disposed within the third fin assembly and the fourth fin assembly.