US20200355445A1

US20200355445A1 - Vapor chamber

Info

Publication number: US20200355445A1
Application number: US16/818,244
Authority: US
Inventors: Chih-Wei Chen; Hsiang-Chih Chuang; Che-Wei KUO; Tien-Yao Chang
Original assignee: Auras Technology Co Ltd
Current assignee: Auras Technology Co Ltd
Priority date: 2019-05-10
Filing date: 2020-03-13
Publication date: 2020-11-12
Also published as: TW202041823A; TWI687643B

Abstract

A vapor chamber includes an upper plate and a lower plate. The lower plate is attached on the upper plate. The upper plate and the lower plate are combined together to define a working space. The lower plate is in thermal contact with a heat source. A reinforcing layer is formed on a surface of the upper plate or the lower plate away from the working space.

Description

FIELD OF THE INVENTION

The present invention relates to a heat dissipation device, and more particularly to a vapor chamber with a reinforcing layer on an upper plate or a lower plate.

BACKGROUND OF THE INVENTION

A vapor chamber is one of the heat dissipation devices. Generally, the thin vapor chamber is readily suffered from deformation. Especially, during the process of assembling the vapor chamber, the vapor chamber is attached on a heat source. It is important to increase the structural strength of the vapor chamber while maintaining the operations of the vapor chamber.

SUMMARY OF THE INVENTION

For solving the drawbacks of the conventional technologies, the present invention provides a vapor chamber. The vapor chamber includes an upper plate and a lower plate. A reinforcing layer is formed on the upper plate or the lower plate. Consequently, during the operation of the vapor chamber, the structural strength and the use reliability of the vapor chamber are increased.
In accordance with an embodiment of the present invention, a vapor chamber is provided. The vapor chamber includes an upper plate and a lower plate. The lower plate is attached on the upper plate. The upper plate and the lower plate are combined together to define a working space. The lower plate is in thermal contact with a heat source. A reinforcing layer is formed on a surface of the upper plate or the lower plate away from the working space.
In an embodiment, a metallic strength of the reinforcing layer is superior to a metallic strength of the upper plate or the lower plate, but a thermal conduction property of the reinforcing layer is inferior to a thermal conduction property of the upper plate or the lower plate.
In an embodiment, the metallic strength is measured according to a Vickers hardness, a tensile strength or an elasticity coefficient.
In an embodiment, the thermal conductivity is measured according to a thermal conductivity coefficient.
In an embodiment, the reinforcing layer is made of nickel, stainless steel or titanium.
In an embodiment, the reinforcing layer has corrosion resistance.
In an embodiment, a first capillary structure is formed on a surface of the upper plate facing the working space, and a second capillary structure is formed on a surface of the lower plate facing the working space. At least one support structure is arranged between the first capillary structure and the second capillary structure.
In an embodiment, the vapor chamber further includes a heat conduction block. The heat conduction block is arranged between the lower plate and the heat source. The heat conduction block is made of pure copper.
In an embodiment, a thermal conduction property of the lower plate is superior to a thermal conduction property of the upper plate.
In an embodiment, the lower plate includes a raised structure, and the raised structure is in thermal contact with the heat source.
In an embodiment, the reinforcing layer is formed on the surface of the lower plate away from the working space, and the reinforcing layer is arranged between the raised structure and the heat source.
In an embodiment, the reinforcing layer is formed on the surface of the lower plate away from the working space, the reinforcing layer has an open space corresponding to the raised structure, and the raised structure is exposed to the open space.
In an embodiment, the vapor chamber further includes a heat conduction block. The heat conduction block is arranged between the raised structure and the heat source. The heat conduction block is made of pure copper.
In an embodiment, the vapor chamber further includes a fixing frame. The fixing frame is attached on the lower plate. The fixing frame includes a fastening part.
In an embodiment, the heat source is fixed on a supporting plate, and the fastening part of the fixing frame is fixed on the supporting plate.
In an embodiment, a thermal conduction property of the lower plate is superior to a thermal conduction property of the upper plate.
In an embodiment, a thermal conduction property of the lower plate is superior to a thermal conduction property of the fixing frame.
In an embodiment, a metallic strength of the fixing frame is superior to a metallic strength of the lower plate.
In an embodiment, the lower plate is made of pure copper, and the fixing frame is made of copper alloy, stainless steel, plastic steel or aluminum alloy.
In an embodiment, the vapor chamber further includes a heat conduction block. The heat conduction block is arranged between the fixing frame and the heat source. The heat conduction block is made of pure copper.
In an embodiment, the vapor chamber further includes a fixing frame. The fixing frame includes a fastening part. The reinforcing layer is formed on the surface of the lower plate away from the working space. The fixing frame is attached on the reinforcing layer.
In an embodiment, the heat source is fixed on a supporting plate, and the fastening part of the fixing frame is fixed on the supporting plate.
In an embodiment, a thermal conduction property of the lower plate is superior to a thermal conduction property of the upper plate.
In an embodiment, a thermal conduction property of the lower plate is superior to a thermal conduction property of the fixing frame.
In an embodiment, a thermal conduction property of the lower plate is superior to a thermal conduction property of the reinforcing layer.
In an embodiment, a metallic strength of the fixing frame or the reinforcing layer is superior to a metallic strength of the lower plate.
In an embodiment, the lower plate is made of pure copper, the fixing frame is made of copper alloy, stainless steel, plastic steel or aluminum alloy, and the reinforcing layer is made of nickel, stainless steel or titanium.
In an embodiment, the vapor chamber further includes a heat conduction block. The heat conduction block is arranged between the fixing frame and the heat source. The heat conduction block is made of pure copper
The above objects and advantages of the present invention will become more readily apparent to those ordinarily skilled in the art after reviewing the following detailed description and accompanying drawings, in which:

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a schematic exploded view illustrating a vapor chamber according to a first embodiment of the present invention;

FIG. 1B is a schematic cross-sectional view illustrating the vapor chamber according to the first embodiment of the present invention;

FIGS. 1C, 1D and 1E are schematic perspective views illustrating some examples of the fixing frame of the vapor chamber according to the first embodiment of the present invention;

FIG. 1F is a schematic cross-sectional view illustrating a variant example of the vapor chamber according to the first embodiment of the present invention, in which the reinforcing layer has an open space;

FIG. 2A is a schematic exploded view illustrating a vapor chamber according to a second embodiment of the present invention;

FIG. 2B is a schematic cross-sectional view illustrating the vapor chamber according to the second embodiment of the present invention;

FIG. 2C is a schematic cross-sectional view illustrating a variant example of the vapor chamber according to the second embodiment of the present invention, in which the reinforcing layer has an open space;

FIG. 3A is a schematic exploded view illustrating a vapor chamber according to a third embodiment of the present invention;

FIG. 3B is a schematic cross-sectional view illustrating the vapor chamber according to the third embodiment of the present invention;

FIGS. 3C, 3D and 3E are schematic perspective views illustrating some examples of the fixing frame of the vapor chamber according to the third embodiment of the present invention; and

FIG. 3F is a schematic cross-sectional view illustrating a variant example of the vapor chamber according to the third embodiment of the present invention, in which the reinforcing layer has an open space.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

Please refer to FIGS. 1A and 1B. FIG. 1A is a schematic exploded view illustrating a vapor chamber according to a first embodiment of the present invention. FIG. 1B is a schematic cross-sectional view illustrating the vapor chamber according to the first embodiment of the present invention.
In this embodiment, the vapor chamber 1 at least comprises an upper plate 11, a lower plate 12 and a fixing frame 13. The lower plate 12 of the vapor chamber 1 is in thermal contact with at least one heat source 4. The heat source 4 is fixed on a supporting plate 5. After the upper plate 11 and the lower plate 12 of the vapor chamber 1 are attached on each other or laminated together, a working space 14 is defined. A first capillary structure 15 is formed on an inner surface of the upper plate 11 (i.e., the surface of the upper plate 11 facing the working space 14). A second capillary structure 16 is formed on an inner surface of the lower plate 12 (i.e., the surface of the lower plate 12 facing the working space 14). Moreover, a support structure 17 is arranged between the first capillary structure 15 and the second capillary structure 16. For example, the support structure 17 is a capillary powder post or a braided structure.
The support structure 17 is disposed within the working space 14 to increase the structural strength of the vapor chamber 1. For reinforcing the structural strength of the vapor chamber 1, a reinforcing layer 19 is formed on an outer surface of at least one of the upper plate 11 and the lower plate 12 (i.e., the surface of the upper plate 11 or the lower plate 12 away from the working space 14). As shown in the cross-sectional view of FIG. 1B, the upper layer 11 of the vapor chamber 1 is covered by or provided with the reinforcing layer 19, and the lower plate 12 is covered by or provided with the reinforcing layer 19. Preferably but not exclusively, the reinforcing layer 19 is formed on the outer surfaces of the upper plate 11 and the lower plate 12, or formed on the surface of the upper plate 11, or formed on the outer surface the lower plate 12 according to the product specifications and requirements.
In accordance with a feature of the present invention, the metallic strength of the reinforcing layer 19 is superior to the metallic strength of the upper plate 11 or the lower plate 12, but the thermal conduction property of the reinforcing layer 19 is inferior to the thermal conduction property of the upper plate 11 or the lower plate 12. The metallic strength is measured according to one of the following parameters: Vickers hardness, tensile strength and elasticity coefficient. The thermal conductivity is measured according to the thermal conductivity coefficient. For complying with the above design rules, the upper plate 11 is made of copper alloy, the lower plate 12 is made of pure copper, and the reinforcing layer 19 is made of nickel, stainless steel or titanium. Moreover, the material of the reinforcing layer 19 has the corrosion resistance in order to increase the reliability and the use life of the vapor chamber 1.
In the vapor chamber 1 of this embodiment, the thermal conduction property of the lower plate 12 is superior to the thermal conduction property of the upper plate 11. Since the temperature at the outer surface of the upper plate 11 is not too high, the hand feeling temperature of the electronic device (e.g., a smart phone or a tablet computer) using the vapor chamber 1 is not affected.
In this embodiment, at least one raised structure 121 is formed on a portion of the lower plate 12. The raised structure 121 is in thermal contact with the at least one heat source 4. In this context, the term “thermal contact” indicates that the raised structure 121 is directly attached on the heat source 4 or an intermediate medium (a thermal grease, or another component or a constituent) is arranged between the raised structure 121 and the heat source 4. The arrangement of the raised structure 121 has the following advantages. When the vapor chamber 1 is in thermal contact with the heat source 4, there is a height difference between the raised structure 121 and the other region of the lower plate 12. Consequently, the electronic components on the supporting plate 5 are not pressed or obstructed by the lower plate 12, and the installing flexibility and convenience are enhanced. When the reinforcing layer 19 is formed on the surface of the lower plate 12 away from the working space 14, the reinforcing layer 19 is arranged between the raised structure 121 of the lower plate 12 and the heat source 4.
FIGS. 1C, 1D and 1E are schematic perspective views illustrating some examples of the fixing frame of the vapor chamber according to the first embodiment of the present invention. FIG. 1F is a schematic cross-sectional view illustrating a variant example of the vapor chamber according to the first embodiment of the present invention, in which the reinforcing layer has an open space.
Please refer to FIG. 1F. In a variant example, the reinforcing layer 19 is partially formed on the outer surface of the lower plate 12. That is, the reinforcing layer 19 has an open space 19A. Under this circumstance, the lower plate 12 is not in thermal contact with the heat source 4 through the reinforcing layer 19.
For increasing the installation convenience and stability, the vapor chamber 1 is equipped with the fixing frame 13 (see FIG. 1A). The fixing frame 13 is attached on the reinforcing layer 19 on the outer surface of the lower plate 12 through a welding means or any other appropriate connecting means. When the fixing frame 13, the heat source 4 and the supporting plate 5 are combined together, the raised structure 121 provides a pressing force to suppress the heat source 4. Consequently, the heat energy generated by the heat source 4 can be quickly and completely transferred to the raised structure 121 through the reinforcing layer 19. Then, the heat energy is dissipated away through the vapor chamber 1. In this embodiment, the fixing frame 13 comprises a hollow portion 131 and at least one fastening part 132. Preferably but not exclusively, the raised structure 121 of the lower plate 12 and a portion of the reinforcing layer 19 are accommodated within the hollow portion 131 of the fixing frame 13, or the raised structure 121 of the lower plate 12 and a portion of the reinforcing layer 19 are extended or protruded out of the hollow portion 131 of the fixing frame 13.
In an embodiment, the fixing frame 13 is fixed on the supporting plate 5 through the at least one fastening part 132. The fastening part 132 of the fixing frame 13 is a female threaded rod. The supporting plate 5 has at least one perforation 51 corresponding to the at least one fastening part 132. After a screw 6 is penetrated through the perforation 51 and tightened into the fastening part 132 (e.g., the female threaded rod), the reinforcing layer 19 on the outer surface of the lower plate 12, the fixing frame 13 and the supporting plate 5 (along with the heat source 4) are combined together. It is noted that numerous modifications and alterations may be made while retaining the teachings of the invention. For example, in another embodiment, the fastening part 132 of the fixing frame 13 is a male threaded rod and the supporting plate 5 has at least one perforation 51 corresponding to the at least one fastening part 132. After the male threaded rod is penetrated through the perforation 51, a screw (not shown) is fixed on the male threaded rod. Consequently, the assembling process is completed. In another embodiment, the fastening part 132 of the fixing frame 13 is a threaded hole. After a screw 6 is penetrated through the perforation 51 of the supporting plate 5 and tightened into the threaded hole, the assembling process is completed.
In an embodiment, the fixing frame 13 is made of copper alloy, stainless steel, plastic steel or aluminum alloy. Since the fixing frame 13 has excellent metallic strength, the vapor chamber 1 is not readily suffered from deformation during the assembling process. The metallic strength is measured according to Vickers hardness, tensile strength or elasticity coefficient.
In accordance with the designing rules of the vapor chamber 1, the metallic strength of the reinforcing layer 19 is superior to the metallic strength of the upper plate 11 or the lower plate 12, the thermal conduction property of the reinforcing layer 19 is inferior to the thermal conduction property of the upper plate 11 or the lower plate 12, the thermal conduction property of the lower plate 12 is superior to the thermal conduction property of the upper plate 11, the thermal conduction property of the lower plate 12 is superior to the thermal conduction property of the fixing frame 13, or the metallic strength of the fixing frame 13 is superior to the metallic strength of the lower plate 12. That is, the designing rules may be determined according to the practical requirements.
Please refer to FIGS. 1A and 1C again. The fixing frame 13 is a hollow frame with a through-hole. That is, the hollow portion 131 is the through-hole. Since the raised structure 121 of the lower plate 12 and a portion of the reinforcing layer 19 are accommodated within the hollow portion 131, the overall thickness of the vapor chamber 1 is not increased.
Hereinafter, some variant examples of the hollow portion 131 of the fixing frame 13 will be described with reference to FIGS. 1D and 1E.
As shown in FIG. 1D, the fixing frame 13 is a hollow frame with a notch 133. That is, the hollow portion 131 is defined by the notch 133. The raised structure 121 of the lower plate 12 and a portion of the reinforcing layer 19 can be accommodated within the hollow portion 131. In other words, the fixing frame 13 is a frame with the notch 133 or a C-shaped frame.
As shown in FIG. 1E, the hollow portion 131 of the fixing frame 13 is defined by two individual sub-frames 13A and 13B. The raised structure 121 of the lower plate 12 and a portion of the reinforcing layer 19 can be accommodated within the hollow portion 131.
Please refer to FIG. 1F. The reinforcing layer 19 is partially formed on the outer surface of the lower plate 12, and the raised structure 121 is exposed. The raised structure 121 is disposed within the hollow portion of the fixing frame 13, and the raised structure 121 is in thermal contact with the heat source 4.
Please refer to FIGS. 2A and 2B. FIG. 2A is a schematic exploded view illustrating a vapor chamber according to a second embodiment of the present invention. FIG. 2B is a schematic cross-sectional view illustrating the vapor chamber according to the second embodiment of the present invention.
In this embodiment, the vapor chamber 2 at least comprises an upper plate 21, a lower plate 22 and a fixing frame 23. the fixing frame 23 comprises at least one fastening part 232. The lower plate 22 of the vapor chamber 2 is in thermal contact with at least one heat source 4. The heat source 4 is fixed on a supporting plate 5. After the upper plate 21 and the lower plate 22 of the vapor chamber 2 are attached on each other or laminated together, a working space 24 is defined. A first capillary structure 25 is formed on an inner surface of the upper plate 21 (i.e., the surface of the upper plate 21 facing the working space 24). A second capillary structure 26 is formed on an inner surface of the lower plate 22 (i.e., the surface of the lower plate 22 facing the working space 24). Moreover, a support structure 27 is arranged between the first capillary structure 25 and the second capillary structure 26. For example, the support structure 27 is a capillary powder post or a braided structure.
The support structure 27 is disposed within the working space 24 to increase the structural strength of the vapor chamber 2. For reinforcing the structural strength of the vapor chamber 2, a reinforcing layer 29 is formed on an outer surface of at least one of the upper plate 21 and the lower plate 22 (i.e., the surface of the upper plate 21 or the lower plate 22 away from the working space 24). As shown in the cross-sectional view of FIG. 2B, the upper layer 21 of the vapor chamber 2 is covered by or provided with the reinforcing layer 29, and the lower plate 22 is covered by or provided with the reinforcing layer 29. Preferably but not exclusively, the reinforcing layer 29 is formed on the outer surfaces of the upper plate 21 and the lower plate 22, or formed on the surface of the upper plate 21, or formed on the outer surface the lower plate 22 according to the product specifications and requirements.
In accordance with a feature of the present invention, the metallic strength of the reinforcing layer 29 is superior to the metallic strength of the upper plate 21 or the lower plate 22, but the thermal conduction property of the reinforcing layer 29 is inferior to the thermal conduction property of the upper plate 21 or the lower plate 22. The metallic strength is measured according to one of the following parameters: Vickers hardness, tensile strength and elasticity coefficient. The thermal conductivity is measured according to the thermal conductivity coefficient. For complying with the above design rules, the upper plate 21 is made of copper alloy, the lower plate 22 is made of pure copper, and the reinforcing layer 29 is made of nickel, stainless steel or titanium. Moreover, the material of the reinforcing layer 29 has the corrosion resistance in order to increase the reliability and the use life of the vapor chamber 2.
In the vapor chamber 2 of this embodiment, the thermal conduction property of the lower plate 22 is superior to the thermal conduction property of the upper plate 21. Since the temperature at the outer surface of the upper plate 21 is not too high, the hand feeling temperature of the electronic device (e.g., a smart phone or a tablet computer) using the vapor chamber 2 is not affected.
For increasing the installation convenience and stability, the vapor chamber 2 is equipped with the fixing frame 23. The fixing frame 23 is attached on the reinforcing layer 29 on the outer surface of the lower plate 22 through a welding means or any other appropriate connecting means. When the fixing frame 23, the heat source 4 and the supporting plate 5 are combined together, a pressing force is provided to suppress the heat source 4. Consequently, the heat energy generated by the heat source 4 can be quickly and completely transferred to the lower plate 22 through the reinforcing layer 29. Then, the heat energy is dissipated away through the vapor chamber 2. In this embodiment, the fixing frame 13 comprises the at least one fastening part 232.
In an embodiment, the fixing frame 23 is fixed on the supporting plate 5 through the at least one fastening part 232. The fastening part 232 of the fixing frame 23 is a female threaded rod. The supporting plate 5 has at least one perforation 51 corresponding to the at least one fastening part 232. After a screw 6 is penetrated through the perforation 51 and tightened into the fastening part 232 (e.g., the female threaded rod), the reinforcing layer 29 on the outer surface of the lower plate 22, the fixing frame 23 and the supporting plate 5 (along with the heat source 4) are combined together. It is noted that numerous modifications and alterations may be made while retaining the teachings of the invention. For example, in another embodiment, the fastening part 232 of the fixing frame 23 is a male threaded rod and the supporting plate 5 has at least one perforation 51 corresponding to the at least one fastening part 232. After the male threaded rod is penetrated through the perforation 51, a screw (not shown) is fixed on the male threaded rod. Consequently, the assembling process is completed. In another embodiment, the fastening part 232 of the fixing frame 23 is a threaded hole. After a screw 6 is penetrated through the perforation 51 of the supporting plate 5 and tightened into the threaded hole, the assembling process is completed.
In an embodiment, the fixing frame 23 is made of copper alloy, stainless steel, plastic steel or aluminum alloy. Since the fixing frame 23 has excellent metallic strength, the vapor chamber 2 is not readily suffered from deformation during the assembling process. The metallic strength is measured according to Vickers hardness, tensile strength or elasticity coefficient.
In accordance with the designing rules of the vapor chamber 2, the metallic strength of the reinforcing layer 29 is superior to the metallic strength of the upper plate 21 or the lower plate 22, the thermal conduction property of the reinforcing layer 29 is inferior to the thermal conduction property of the upper plate 21 or the lower plate 22, the thermal conduction property of the lower plate 22 is superior to the thermal conduction property of the upper plate 21, the thermal conduction property of the lower plate 22 is superior to the thermal conduction property of the fixing frame 23, or the metallic strength of the fixing frame 23 is superior to the metallic strength of the lower plate 22. That is, the designing rules may be determined according to the practical requirements.
FIG. 2C is a schematic cross-sectional view illustrating a variant example of the vapor chamber according to the second embodiment of the present invention, in which the reinforcing layer has an open space. In a variant example, the reinforcing layer 29 is partially formed on the outer surface of the lower plate 22. That is, the reinforcing layer 29 has an open space 29A. Under this circumstance, the lower plate 22 is not in thermal contact with the fixing frame 23 or the heat source 4 through the reinforcing layer 29. That is, the heat energy generated by the heat source 4 is transferred to the fixing frame 23, and then the heat energy is transferred to the lower plate 22. Then, the heat energy is dissipated away through the vapor chamber 2.
Please refer to FIGS. 3A and 3B. FIG. 3A is a schematic exploded view illustrating a vapor chamber according to a third embodiment of the present invention. FIG. 3B is a schematic cross-sectional view illustrating the vapor chamber according to the third embodiment of the present invention.
In this embodiment, the vapor chamber 3 at least comprises an upper plate 31, a lower plate 32, a fixing frame 33 and a heat conduction block 38. The vapor chamber 3 is in thermal contact with at least one heat source 4. The heat source 4 is fixed on a supporting plate 5. After the upper plate 31 and the lower plate 32 of the vapor chamber 3 are attached on each other or laminated together, a working space 34 is defined. A first capillary structure 35 is formed on an inner surface of the upper plate 31 (i.e., the surface of the upper plate 31 facing the working space 34). A second capillary structure 36 is formed on an inner surface of the lower plate 32 (i.e., the surface of the lower plate 32 facing the working space 34). Moreover, a support structure 37 is arranged between the first capillary structure 35 and the second capillary structure 36. For example, the support structure 37 is a capillary powder post or a braided structure.
The support structure 37 is disposed within the working space 34 to increase the structural strength of the vapor chamber 3. For reinforcing the structural strength of the vapor chamber 3, a reinforcing layer 39 is formed on an outer surface of at least one of the upper plate 31 and the lower plate 32 (i.e., the surface of the upper plate 31 or the lower plate 32 away from the working space 34). As shown in the cross-sectional view of FIG. 3B, the upper layer 31 of the vapor chamber 3 is covered by or provided with the reinforcing layer 39, and the lower plate 32 is covered by or provided with the reinforcing layer 39. Preferably but not exclusively, the reinforcing layer 39 is formed on the outer surfaces of the upper plate 31 and the lower plate 32, or formed on the surface of the upper plate 31, or formed on the outer surface the lower plate 32 according to the product specifications and requirements.
In accordance with a feature of the present invention, the metallic strength of the reinforcing layer 39 is superior to the metallic strength of the upper plate 31 or the lower plate 32, but the thermal conduction property of the reinforcing layer 39 is inferior to the thermal conduction property of the upper plate 31 or the lower plate 32. The metallic strength is measured according to one of the following parameters: Vickers hardness, tensile strength and elasticity coefficient. The thermal conductivity is measured according to the thermal conductivity coefficient. For complying with the above design rules, the upper plate 31 is made of copper alloy, the lower plate 32 is made of pure copper, and the reinforcing layer 39 is made of nickel, stainless steel or titanium. Moreover, the material of the reinforcing layer 39 has the corrosion resistance in order to increase the reliability and the use life of the vapor chamber 3.
In the vapor chamber 3 of this embodiment, the thermal conduction property of the lower plate 32 is superior to the thermal conduction property of the upper plate 31. Since the temperature at the outer surface of the upper plate 31 is not too high, the hand feeling temperature of the electronic device (e.g., a smart phone or a tablet computer) using the vapor chamber 3 is not affected.
In this embodiment, a first surface of the heat conduction block 38 is attached on the reinforcing layer 39 on the outer surface of the lower plate 32 through a welding means or any other appropriate connecting means. A second surface of the heat conduction block 38 is in thermal contact with the at least one heat source 4. In this context, the term “thermal contact” indicates that the heat conduction block 38 is directly attached on the heat source 4 or an intermediate medium (a thermal grease, or another component or a constituent) is arranged between the heat conduction block 38 and the heat source 4. When the heat conduction block 38, the reinforcing layer 39 and the heat source 4 are combined together, the heat energy generated by the heat source 4 is transferred to the reinforcing layer 39 through the heat conduction block 38. Then, the heat energy is transferred to the lower plate 32. Then, the heat energy is dissipated away through the vapor chamber 3.
For increasing the installation convenience and stability, the vapor chamber 3 is equipped with the fixing frame 33 (see FIG. 3A). The fixing frame 33 is attached on the reinforcing layer 39 on the outer surface of the lower plate 32 through a welding means or any other appropriate connecting means. When the fixing frame 33, the heat source 4 and the supporting plate 5 are combined together, a pressing force is provided to suppress the heat source 4. Consequently, the heat energy generated by the heat source 4 can be quickly and completely transferred to the lower plate 32 through the reinforcing layer 39. Then, the heat energy is dissipated away through the vapor chamber 3. In this embodiment, the fixing frame 33 comprises a hollow portion 331 and at least one fastening part 332. The heat conduction block 38 is disposed within the hollow portion 331. That is, the top surface of the heat conduction block 38 is at the same level with the top surface of the fixing frame 33. Consequently, the overall thickness of the vapor chamber 3 is not increased.
In an embodiment, the fixing frame 33 is fixed on the supporting plate 5 through the at least one fastening part 332. The fastening part 332 of the fixing frame 33 is a female threaded rod. The supporting plate 5 has at least one perforation 51 corresponding to the at least one fastening part 332. After a screw 6 is penetrated through the perforation 51 and tightened into the fastening part 332 (e.g., the female threaded rod), the reinforcing layer 39 on the outer surface of the lower plate 32, the fixing frame 33 and the supporting plate 5 (along with the heat source 4) are combined together. It is noted that numerous modifications and alterations may be made while retaining the teachings of the invention. For example, in another embodiment, the fastening part 332 of the fixing frame 33 is a male threaded rod and the supporting plate 5 has at least one perforation 51 corresponding to the at least one fastening part 332. After the male threaded rod is penetrated through the perforation 51, a screw (not shown) is fixed on the male threaded rod. Consequently, the assembling process is completed. In another embodiment, the fastening part 332 of the fixing frame 33 is a threaded hole. After a screw 6 is penetrated through the perforation 51 of the supporting plate 5 and tightened into the threaded hole, the assembling process is completed.
In an embodiment, the upper plate 31 is made of copper alloy, the lower plate 32 is made of pure copper, and the reinforcing layer 39 is made of nickel, stainless steel or titanium. The heat conduction block 38 is made of pure copper. The fixing frame 33 is made of copper alloy, stainless steel, plastic steel or aluminum alloy. Since the thermal conduction property of pure copper is better than the thermal conduction property of copper alloy, the heat energy can be transferred from the heat source 4 to the reinforcing layer 39 through the heat conduction block 38 more efficiently. Since the fixing frame 33 is made of copper alloy, stainless steel, plastic steel or aluminum alloy, the fixing frame 33 has excellent metallic strength. Consequently, the vapor chamber 3 is not readily suffered from deformation during the assembling process. The thermal conductivity is measured according to the thermal conductivity coefficient. The metallic strength is measured according to Vickers hardness, tensile strength or elasticity coefficient.
In accordance with the designing rules of the vapor chamber 3, the metallic strength of the reinforcing layer 39 is superior to the metallic strength of the upper plate 31, the lower plate 32 or the heat conduction block 38, the thermal conduction property of the reinforcing layer 39 is inferior to the thermal conduction property of the upper plate 31, the lower plate 32 or the heat conduction block 38, the thermal conduction property of the lower plate 32 is superior to the thermal conduction property of the upper plate 31, the thermal conduction property of the lower plate 32 is superior to the thermal conduction property of the fixing frame 33, or the metallic strength of the fixing frame 33 is superior to the metallic strength of the lower plate 32. That is, the designing rules may be determined according to the practical requirement.
FIG. 3C is a schematic perspective view illustrating the fixing frame of the vapor chamber according to the third embodiment of the present invention. Please refer to FIGS. 3A and 3C. The fixing frame 33 is a hollow frame with a through-hole. That is, the hollow portion 331 is the through-hole. Since the heat conduction block 38 is accommodated within the hollow portion 331, the overall thickness of the vapor chamber 3 is not increased.
It is noted that the examples of the hollow portion 331 are not restricted. Hereinafter, some variant examples of the hollow portion 331 of the fixing frame 33 will be described with reference to FIGS. 3D and 3E.
As shown in FIG. 3D, the fixing frame 33 is a hollow frame with a notch 333. That is, the hollow portion 331 is defined by the notch 333. The heat conduction block 38 can be accommodated within the hollow portion 331. In other words, the fixing frame 33 is a frame with the notch 333 or a C-shaped frame.
As shown in FIG. 3E, the hollow portion 331 of the fixing frame 33 is defined by two individual sub-frames 33A and 33B. The heat conduction block 38 can be accommodated within the hollow portion 331.
FIG. 3F is a schematic cross-sectional view illustrating a variant example of the vapor chamber according to the third embodiment of the present invention. In this embodiment, the reinforcing layer 39 is partially formed on the outer surface of the lower plate 32. That is, the reinforcing layer 39 has an open space 39A. The heat conduction block 38 is accommodated within the open space 39A. Unlike the embodiment of FIG. 3B, the lower plate 32 is not in thermal contact with the heat source 4 through the reinforcing layer 39. In this embodiment, the lower plate 32 is in thermal contact with the heat source 4 through the heat conduction block 38. Unlike the embodiment of FIG. 3B, the fixing frame 33 is not attached on the reinforcing layer 39. In this embodiment, the fixing frame 33 is attached on the lower plate 32 through the open space 39A.
While the invention has been described in terms of what is presently considered to be the most practical and preferred embodiments, it is to be understood that the invention needs not be limited to the disclosed embodiments. On the contrary, it is intended to cover various modifications and similar arrangements included within the spirit and scope of the appended claims which are to be accorded with the broadest interpretation so as to encompass all modifications and similar structures.

Claims

What is claimed is:

1. A vapor chamber, comprising:

an upper plate; and

a lower plate attached on the upper plate, wherein the upper plate and the lower plate are combined together to define a working space, and the lower plate is in thermal contact with a heat source,

wherein a reinforcing layer is formed on a surface of the upper plate or the lower plate away from the working space.

2. The vapor chamber according to claim 1, wherein a metallic strength of the reinforcing layer is superior to a metallic strength of the upper plate or the lower plate, but a thermal conduction property of the reinforcing layer is inferior to a thermal conduction property of the upper plate or the lower plate.

3. The vapor chamber according to claim 2, wherein the metallic strength is measured according to a Vickers hardness, a tensile strength or an elasticity coefficient.

4. The vapor chamber according to claim 2, wherein the thermal conductivity is measured according to a thermal conductivity coefficient.

5. The vapor chamber according to claim 1, wherein the reinforcing layer is made of nickel, stainless steel or titanium.

6. The vapor chamber according to claim 1, wherein the reinforcing layer has corrosion resistance.

7. The vapor chamber according to claim 1, wherein a first capillary structure is formed on a surface of the upper plate facing the working space, and a second capillary structure is formed on a surface of the lower plate facing the working space, wherein at least one support structure is arranged between the first capillary structure and the second capillary structure.

8. The vapor chamber according to claim 1, further comprising a heat conduction block, wherein the heat conduction block is arranged between the lower plate and the heat source, and the heat conduction block is made of pure copper.

9. The vapor chamber according to claim 1, wherein a thermal conduction property of the lower plate is superior to a thermal conduction property of the upper plate.

10. The vapor chamber according to claim 1, wherein the lower plate comprises a raised structure, and the raised structure is in thermal contact with the heat source.

11. The vapor chamber according to claim 10, wherein the reinforcing layer is formed on the surface of the lower plate away from the working space, and the reinforcing layer is arranged between the raised structure and the heat source.

12. The vapor chamber according to claim 10, wherein the reinforcing layer is formed on the surface of the lower plate away from the working space, the reinforcing layer has an open space corresponding to the raised structure, and the raised structure is exposed to the open space.

13. The vapor chamber according to claim 10, further comprising a heat conduction block, wherein the heat conduction block is arranged between the raised structure and the heat source, and the heat conduction block is made of pure copper.

14. The vapor chamber according to claim 1, further comprising a fixing frame, wherein the fixing frame is attached on the lower plate, and the fixing frame comprises a fastening part.

15. The vapor chamber according to claim 14, wherein the heat source is fixed on a supporting plate, and the fastening part of the fixing frame is fixed on the supporting plate.

16. The vapor chamber according to claim 14, wherein a thermal conduction property of the lower plate is superior to a thermal conduction property of the upper plate.

17. The vapor chamber according to claim 14, wherein a thermal conduction property of the lower plate is superior to a thermal conduction property of the fixing frame.

18. The vapor chamber according to claim 14, wherein a metallic strength of the fixing frame is superior to a metallic strength of the lower plate.

19. The vapor chamber according to claim 14, wherein the lower plate is made of pure copper, and the fixing frame is made of copper alloy, stainless steel, plastic steel or aluminum alloy.

20. The vapor chamber according to claim 14, further comprising a heat conduction block, wherein the heat conduction block is arranged between the fixing frame and the heat source, and the heat conduction block is made of pure copper.

21. The vapor chamber according to claim 1, further comprising a fixing frame, wherein the fixing frame comprises a fastening part, the reinforcing layer is formed on the surface of the lower plate away from the working space, and the fixing frame is attached on the reinforcing layer.

22. The vapor chamber according to claim 21, wherein the heat source is fixed on a supporting plate, and the fastening part of the fixing frame is fixed on the supporting plate.

23. The vapor chamber according to claim 21, wherein a thermal conduction property of the lower plate is superior to a thermal conduction property of the upper plate.

24. The vapor chamber according to claim 21, wherein a thermal conduction property of the lower plate is superior to a thermal conduction property of the fixing frame.

25. The vapor chamber according to claim 21, wherein a thermal conduction property of the lower plate is superior to a thermal conduction property of the reinforcing layer.

26. The vapor chamber according to claim 21, wherein a metallic strength of the fixing frame or the reinforcing layer is superior to a metallic strength of the lower plate.

27. The vapor chamber according to claim 21, wherein the lower plate is made of pure copper, the fixing frame is made of copper alloy, stainless steel, plastic steel or aluminum alloy, and the reinforcing layer is made of nickel, stainless steel or titanium.

28. The vapor chamber according to claim 21, further comprising a heat conduction block, wherein the heat conduction block is arranged between the fixing frame and the heat source, and the heat conduction block is made of pure copper.