US20190045111A1 - Resolution enhancement using sensor with plural photodiodes per microlens - Google Patents
Resolution enhancement using sensor with plural photodiodes per microlens Download PDFInfo
- Publication number
- US20190045111A1 US20190045111A1 US15/670,728 US201715670728A US2019045111A1 US 20190045111 A1 US20190045111 A1 US 20190045111A1 US 201715670728 A US201715670728 A US 201715670728A US 2019045111 A1 US2019045111 A1 US 2019045111A1
- Authority
- US
- United States
- Prior art keywords
- photodiode
- photodiodes
- light
- resampled
- luminance values
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000003287 optical effect Effects 0.000 claims abstract description 89
- 238000003384 imaging method Methods 0.000 claims abstract description 76
- 238000012545 processing Methods 0.000 claims description 58
- 238000000034 method Methods 0.000 claims description 24
- 230000002093 peripheral effect Effects 0.000 claims description 21
- 238000012952 Resampling Methods 0.000 claims description 14
- 238000001514 detection method Methods 0.000 claims description 9
- 238000003860 storage Methods 0.000 claims description 9
- 238000004590 computer program Methods 0.000 claims description 5
- 230000008569 process Effects 0.000 claims description 3
- 238000011144 upstream manufacturing Methods 0.000 description 16
- 238000004891 communication Methods 0.000 description 13
- 239000000758 substrate Substances 0.000 description 11
- 230000004888 barrier function Effects 0.000 description 10
- 230000004044 response Effects 0.000 description 8
- 230000006870 function Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 238000005259 measurement Methods 0.000 description 6
- 238000013459 approach Methods 0.000 description 4
- 230000004907 flux Effects 0.000 description 4
- 230000000712 assembly Effects 0.000 description 3
- 238000000429 assembly Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 238000002955 isolation Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000005315 distribution function Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000003826 tablet Substances 0.000 description 2
- 241000394635 Acetomicrobium mobile Species 0.000 description 1
- 229910000530 Gallium indium arsenide Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- KXNLCSXBJCPWGL-UHFFFAOYSA-N [Ga].[As].[In] Chemical compound [Ga].[As].[In] KXNLCSXBJCPWGL-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000007943 implant Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- -1 laptops Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000005055 memory storage Effects 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 230000037361 pathway Effects 0.000 description 1
- 238000000053 physical method Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Images
Classifications
-
- H04N5/23212—
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/60—Control of cameras or camera modules
- H04N23/67—Focus control based on electronic image sensor signals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1462—Coatings
- H01L27/14621—Colour filter arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
- H01L27/14627—Microlenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/60—Control of cameras or camera modules
- H04N23/67—Focus control based on electronic image sensor signals
- H04N23/672—Focus control based on electronic image sensor signals based on the phase difference signals
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/80—Camera processing pipelines; Components thereof
- H04N23/815—Camera processing pipelines; Components thereof for controlling the resolution by using a single image
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
- H04N25/77—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
-
- H04N5/3745—
Definitions
- This disclosure relates, among other things, to image sensors.
- Digital cameras and many mobile devices include an imaging assembly having a sensor disposed downstream of optical components.
- Typical optical components include one or more lenses and apertures.
- the optical components direct light of a scene onto the sensor, which measures the light.
- a processor processes the sensor's measurements (luminance and chrominance values) to produce an image.
- the optical components focus light from the scene onto the sensor. If the light is out of focus at the plane of the sensor, then the sensor will capture a blurry image.
- An imaging system includes an image sensor comprising a pixel.
- the pixel comprises first and second photodiodes sharing a common microlens.
- the common microlens is configured to simultaneously converge in-focus light onto a first area of the first photodiode and in-focus light onto a second area of the second photodiode.
- An effective optical center of the first area of the first photodiode is offset from a centroid of the first photodiode.
- An effective optical center of the second area of the second photodiode is offset from a centroid of the second photodiode.
- One or more processors are configured to: receive a first luminance value of the first area from the first photodiode; receive a second luminance value of the second area from the second photodiode; and resample a plurality of luminance values including the first luminance value and the second luminance value to provide a luminance of a first resampled pixel having an optical center located at the centroid of the first photodiode and a luminance of a second resampled pixel having an optical center located at the centroid of the second photodiode.
- a method of imaging with a sensor having a plurality of pixels comprises first and second photodiodes.
- the method comprises: receiving a first luminance value from the first photodiode and a second luminance value from the second photodiode.
- the first photodiode and the second photodiode share a common microlens.
- the common microlens is configured so light from a first area is gathered by the first photodiode and has an effective optical center at a first location offset from a centroid of the first photodiode, and so light from a second area is gathered by the second photodiode and has an effective optical center at a second position offset from a centroid of the second photodiode.
- the second position is different from the first position.
- Resampling is performed by interpolating among a plurality of luminance values collected by the sensor, including the first luminance value and the second luminance value, to determine a resampled luminance value of a resampled pixel having an optical center located at the centroid of the first photodiode in an evenly spaced row of pixels.
- An imaging system comprises a means for receiving luminance values from a plurality of photodiodes sharing a common microlens, such that the luminance values represent light gathered by each respective one of the plurality of photodiodes, and the light gathered by each respective photodiode has an effective optical center at a respective location that is offset from a respective centroid of the respective photodiode.
- a means for resampling the luminance values interpolates among the received luminance values to estimate respective resampled luminance values of a plurality of resampled pixels having respective optical centers located at respective centroids of each of the plurality of photodiodes.
- a non-transitory, machine-readable storage medium comprises computer program code for processing image sensor data.
- the computer program code comprising code for receiving luminance values from a plurality of photodiodes sharing a common microlens, such that the luminance values represent light impinging on each respective one of the plurality of photodiodes, and the light impinging on each respective photodiode has an effective optical center at a respective location that is offset from a respective centroid of the respective photodiode.
- the medium also comprises code for resampling the luminance values by interpolating among the received luminance values to estimate respective resampled luminance values of a plurality of resampled pixels having respective optical centers located at respective centroids of each of the plurality of photodiodes.
- FIG. 1 schematically shows mobile devices capturing a scene.
- FIG. 2 is a rear view of a mobile device as shown in FIG. 1 .
- FIG. 3 is a block diagram of a mobile device as shown in FIG. 1 .
- FIG. 4 is a schematic diagram of an optical system of the imaging system of FIG. 3 .
- FIG. 5 is a diagram of light rays extending between a scene and the imaging sensor of the mobile device as shown in FIG. 3 .
- FIG. 6 is a cross sectional view of two pixels in a central region of the imaging sensor of the mobile device as shown in FIG. 3 .
- FIG. 7 is a plan view of the two pixels in FIG. 6 .
- FIG. 8 is a plan view of the imaging sensor of the mobile device as shown in FIG. 3 .
- FIG. 9 is a cross sectional view of top pixels at a peripheral region of the sensor of FIG. 8 .
- FIG. 10 is a cross sectional view of light rays focused on the plane of the pixels of FIG. 6 .
- FIG. 11 is a plan view of two of the photodiodes of FIG. 6 with overlaid illumination areas of in-focus light.
- FIG. 12 is a graph of photoelectric response versus position relative to two photodiodes of FIG. 9 .
- FIG. 13 is a plan view of two pixels in a central region of a sensor having four photodiodes per microlens.
- FIG. 14 is a plan view of the photodiodes of one of the pixels shown in FIG. 13 .
- FIG. 15 is a schematic view of the photodiodes of FIG. 13 , showing the optical centers of received light.
- FIGS. 15A-15D are cross sectional views of the photodiodes of FIG. 14 while receiving light, taken along respective section lines 15 A- 15 A, 15 B- 15 B, 15 C- 15 C, and 15 D- 15 D of FIG. 14 .
- FIG. 16 is a schematic view of a pair of photodiodes receiving in-focus light.
- FIG. 17 is a schematic view of a pixel having four photodiodes receiving in-focus light.
- FIG. 18 is a block diagram of an exemplary method.
- each imaging pixel has a microlens shared by two photodiodes.
- the system described below can take advantage of the microlens shape in some sensors to increase the amount of information obtained from each pixel.
- Each photodiode collects light coming from a different spatial location, and the microlens shape causes light to converge onto different effective optical centers in each photodiode.
- the effective optical center of each photodiode is offset from the corresponding centroid of the photodiode.
- a plurality of luminance values including the luminance values from two photodiodes sharing the same microlens are resampled.
- the resampling uses interpolation to provide a luminance value of a resampled pixel having a corresponding optical center located at the centroid of each corresponding photodiode.
- the result is an evenly spaced array of resampled pixel data for further image processing and display.
- centroid of a photodiode refers to a point having a mean position among all the points in the top surface of the photodiodeor a two-dimensional projection of the top surface.
- FIG. 1 shows mobile devices 100 capturing a scene 10 a.
- Mobile devices 100 can include smartphones 101 , digital cameras 121 , tablets, laptops, vehicles, or the like.
- smartphone 101 can include a display 102 (e.g., a touchscreen), one or more front-facing imaging assemblies 103 and one or more rear-facing imaging assemblies 104 , 105 , 106 .
- Digital camera 121 can include rear-facing imaging assembly 107 having a display 122 and a lens assembly 123 .
- Mobile devices 100 can be configured to display soft buttons 108 , 109 .
- Mobile devices 100 can include hard buttons 124 .
- mobile devices 100 display an image 10 b of scene 10 a.
- a rear-facing imaging assembly 104 , 105 , 106 of smartphone 101 and lens assembly 123 of digital camera 121 focus light projecting from scene 10 a onto their respective sensors.
- the sensors measure the luminance (and for color sensors, the red, green and blue components) of received light, and an image signal processor converts the data representing luminance and chrominance values into image files.
- Mobile devices 100 cause the images 10 b to be displayed on displays 102 , 122 .
- Mobile devices 100 each include a processing system.
- processing system 300 can include one or more processors 301 , volatile memory 302 a, non-volatile memory 302 b, one or more input/output devices 304 , one or more sensors 305 , one or more user interfaces 306 , one or more motors/actuators 307 , one or more internal data busses 308 , and one or more external communications interfaces 309 .
- FIG. 3 shows the components of processing system 300 as distinct, a single component of processing system 300 may perform multiple functions. Alternatively, one or more components can perform a single function.
- a touchscreen display acts as a touch-sensitive input device and as a display output device.
- some mobile devices use a single random access memory (RAM) for instructions and data.
- Other mobile devices can have separate RAMs for instructions and data.
- RAM random access memory
- Processor 301 can include one or more distinct processors, each having one or more cores. Each of the distinct processors can have the same structure or respectively different structure. If processor 301 is a general-purpose processor, processor 301 can be configured by program code in memory 302 to serve as a special-purpose processor and perform a certain function or operation. In some mobile devices, a single processor 301 performs image processing functions and other instruction processing. Other mobile devices include a separate image signal processor.
- Processor 301 can include one or more central processing units (CPUs), one or more graphics processing units (GPUs), application specific integrated circuits (ASICs), digital signal processors (DSPs), and the like.
- CPUs central processing units
- GPUs graphics processing units
- ASICs application specific integrated circuits
- DSPs digital signal processors
- Memory 302 can include non-transitory, machine readable storage medium(s), such as volatile memory 302 a, non-volatile memory 302 b, and any other mediums capable of storing data. Volatile memory 302 a only maintains data when supplied with power. Non-volatile memory 302 b may maintain data with or without power, and can include flash memory storage, electrically erasable programmable read-only memory (EEPROM), a solid-state drive (SSD), and the like.
- EEPROM electrically erasable programmable read-only memory
- SSD solid-state drive
- Each of volatile memory 302 a, non-volatile memory 302 b, and any other type of non-transitory machine readable storage device can correspond to a respectively different memory device, located at one or more distinct locations and each having a different structure.
- Examples of memory 302 include a non-transitory computer-readable media such as random access memory (RAM), read-only memory (ROM), flash memory, electrically erasable programmable ROM (EEPROM), any kind of optical storage disk such as a digital versatile disk (DVD), a “BLU-RAY®” disc, magnetic storage, holographic storage, a hard disk drive (HDD), an SSD, any medium that can be used to store program code in the form of instructions or data structures, and the like.
- RAM random access memory
- ROM read-only memory
- flash memory electrically erasable programmable ROM
- EEPROM electrically erasable programmable ROM
- any kind of optical storage disk such as a digital versatile disk (DVD), a “BLU-
- the methods, functions, and operations described in the present application can be fully or partially embodied in the form of tangible and non-transitory machine-readable storage media encoded with program code.
- the program code configures the processor 301 as a special-purpose processor for performing a disclosed method or function.
- Input-output devices 304 can include any component for receiving or transmitting data such as ports and telematics. Input-output devices 304 can enable wired communication via USB®, DisplayPort®, HDMI®, Ethernet, and the like. Input-output devices 304 can enable optical, magnetic, and holographic communication with suitable memory 302 . Communications interfaces can enable wireless communication via WiFi®, Bluetooth®, cellular (e.g., Long-Term Evolution (LTE®), carrier-sense multiple access (CDMA®), Global System for Mobile Communications (GSM®), WiMax®), near-field communications (NFC®), global positioning system (GPS), and the like. Processor 301 and memory 302 can include dedicated processors and memory for performing input-output functions (e.g., an LTE® module can include a dedicated processor, dedicated memory, and a dedicated antenna).
- LTE® Long-Term Evolution
- CDMA® carrier-sense multiple access
- GSM® Global System for Mobile Communications
- WiMax® near-field communications
- NFC® near-
- Sensors 305 can capture physical measurements of an environment and report the same to processor 301 .
- Sensors 305 can include laser image detection and ranging (LIDAR) sensors.
- the system can include an acceleration sensor, a motion sensor, a gyro, and the like.
- User interface 306 enables user interaction with mobile device 100 .
- User interface 306 can include displays (e.g., an LED touchscreen), physical buttons, speakers, microphones, keyboards, and the like.
- Motor/actuator 307 can move any optical components of the lens assembly 123 to focus the lens for imaging the subject.
- Internal data bus 308 can include pathways located within mobile device 100 (e.g., smartphone 101 , digital camera 121 , vehicle, laptop, etc.). As shown in FIG. 3 , internal data bus 308 can transmit data between the processor 301 and the other components of processing system 300 .
- Internal data bus 308 can include conductive paths printed on, or otherwise applied to, a substrate (e.g., a logic board), or a separate bus integrated circuit.
- External communications interfaces 309 can include wireless communication paths and wired communication paths. External communications interfaces 309 can include an Internet connection, allowing the processing system 300 to communicate with a second processing system 300 , which may be located remotely.
- components of processing system 300 can be connected via internal data bus 308 and/or external communications interface 309 .
- processor 301 can be configured to store data on remote non-volatile memory 302 b, such as an SSD located in a remote server farm.
- a user interface 306 can be a touchscreen display connected to processor 301 via an HDMI® or via conductive paths printed on a substrate.
- the components of processing system 300 can be components located in a common location (e.g., a single mobile device housing and/or a single room). Alternatively, the components of processing system 300 can be geographically dispersed and connected via wired or wireless (e.g., Internet-based) communication.
- a common location e.g., a single mobile device housing and/or a single room.
- the components of processing system 300 can be geographically dispersed and connected via wired or wireless (e.g., Internet-based) communication.
- FIG. 4 is a schematic diagram of an imaging assembly 400 , which can be illustrative of some or all of imaging assemblies 103 - 106 or lens assembly 123 or other imaging assembly of a mobile device 100 (e.g., an imaging assembly/camera mounted on a vehicle).
- an imaging assembly 400 comprises image capture hardware, including optics and an imaging sensor 412 .
- Imaging assembly 400 can include upstream optics 401 that are controllable to set the focal length (e.g., a primary lens) and downstream optics 402 within the imaging sensor 412 (e.g., a microlens).
- Imaging assembly 400 can include a housing or cover assembly for enclosing upstream optics 401 and downstream optics 402 .
- Upstream optics 401 can be configured to transmit focused light to downstream optics 402 .
- Upstream optics 401 can include lenses (e.g., convex lenses and/or concave lenses), mirrors, shutters, apertures, filters (e.g., color or ultraviolet filters), and the like. Some of these components can include motors/actuators for autofocus adjustment.
- processor 301 can be configured to: (a) instruct a motor to move (e.g., slide or actuate) a lens of upstream optics 401 along the X axis to focus incoming light 403 on downstream optics 402 ; (b) instruct a motor to rotate a lens of upstream optics 401 about the Z axis for autofocus adjustment; (c) control opening time of a shutter to yield a certain exposure time.
- Processor 301 can use phase detection autofocus (PDAF) to control the motor of upstream optics 401 to capture an image so that a desired region of interest within the field of view is in focus.
- PDAF phase detection autofocus
- Downstream optics 402 can include a sensor 412 (also called an imaging sensor) having photodiodes, microlenses, color filters, and barriers.
- Imaging sensor 412 can have a rectangular (e.g., square), annular (e.g., circular) perimeter in the Y-Z plane.
- Imaging sensor 412 can have a width along the Y axis, a thickness along the X axis, and a height along the Z axis.
- Imaging sensor 412 can receive light 403 that has passed through upstream optics 401 .
- the light 403 can pass through microlenses and color filters before being gathered by photodiodes. When the photons contact the photodiodes, the photodiodes convert the light to electrical current.
- the photons of light 403 can disturb electrons in the photodiodes through the photoelectric effect. Some of the disturbed electrons can fall into an electron well in the photodiode. The number of electrons falling into the electron well corresponds with brightness of the light passing through.
- a voltage generated by each photodiode's electron well can correspond to the number of electrons residing within the well.
- processor 301 can estimate the brightness of light incident upon each photodiode.
- Processor 301 can use the estimated brightness of light to generate an image file.
- FIG. 5 is a schematic and plan ray diagram illustrating upstream optics 401 focusing light 403 on imaging sensor 412 .
- Upstream optics 401 has been approximated as a plano-convex lens with an optical axis 502 .
- Rays of light 403 emanate and/or reflect from first object O 1 and second object O 2 in a scene 501 .
- Upstream optics 401 focuses the light 403 , thus causing the rays of light 403 from O 1 to converge at a first region I 1 on imaging sensor 412 and the rays of light 403 from O 2 to converge at a second region I 2 on imaging sensor 412 . Because first and second regions I 1 , I 2 lie on imaging sensor 412 , both first object O 1 and second object O 2 are in focus on the plane of imaging sensor 412 .
- Processing system 300 of FIG. 3 is configured to perform an autofocus operation.
- a user or processing system 300 automatically can select one or more focus points, such as focus points in regions I 1 and I 2 , corresponding to regions of interest within the field of view containing objects O 1 and O 2 , respectively.
- Processing system 300 then controls mechanical adjustment of imaging assembly 400 (e.g., upstream optics 401 ) based on measurements from imaging sensor 412 , so that the region(s) of interest corresponding to the selected focus point(s) is (are) in-focus.
- imaging assembly 400 e.g., upstream optics 401
- processing system 300 may instruct one or more components of upstream optics 401 to (a) slide along the X-axis or (b) rotate about the Z-axis.
- upstream optics 401 is configured to move with respect to (e.g., slide along and/or rotate about) the X-axis, the Y-axis, and/or the Z-axis. Exemplary techniques for mechanical control of imaging assembly 400 based on measurements from imaging sensor 412 are discussed below.
- the processing system 300 provides a means for receiving luminance values from a plurality of photodiodes sharing a common microlens, such that the luminance values represent light gathered by each respective one of the plurality of photodiodes, and the light gathered by each respective photodiode has an effective optical center at a respective location that is offset from a respective centroid of the respective photodiode.
- FIG. 6 is a cross sectional view of two pixels 640 in imaging sensor 412 .
- Imaging sensor 412 can include a first layer 630 , a second layer 620 , and a third layer 610 .
- First layer 630 can include a substrate 631 , barriers 632 , and photodiode (“PD”) groups 633 having individual PDs 634 , 635 .
- PD group 633 includes all of the photodiodes which share a common microlens.
- Second layer 620 can include one or more layers of dielectric material (e.g., SiO 2 or SiO).
- Third layer 610 can include an array of microlenses 611 and color filters 612 . In the embodiment of FIG.
- each PD group 633 includes two photodiodes 634 , 635 .
- each pixel can have four photodiodes per microlens, and a PD group includes four photodiodes.
- Some sensors can have “ideal” microlenses generally shaped as a portion of an elliptic paraboloid or paraboloid of revolution, to converge the incoming collimated light at the centroid of the area of the PD group and increase a percentage of incoming light that falls within the perimeters of the photodiodes.
- the upstream optics are focused on the subject, light rays from a point on the subject converge at a point on the sensor.
- imaging sensors 412 have microlenses 611 shaped with a top surface (referred to below as a “non-ideal” shape) that deviates from the “ideal” shape of an elliptic paraboloid or paraboloid of revolution.
- non-ideal is used herein for convenient identification, but does not characterize the quality the identified microlens.
- microlenses 611 can have a generally planar top surface 611 b, and a curved peripheral region 611 a in the top surface.
- the top surface 611 b of the microlenses may be slightly curved. That is, the curvature of the top surface 611 b, if any, is a more gradual curvature than the curvature of the curved peripheral region 611 a.
- the top surface 611 b has a radius of curvature larger or substantially larger than the radius of the curved peripheral region 611 a.
- the system can take advantage of the shape of the non-ideal microlens to obtain additional spatial information from each PD group.
- the microlens 611 deviates sufficiently from the “ideal” (elliptic paraboloid or paraboloid of revolution) shape to cause incoming collimated light to converge in two different locations, with one location on the surface of each respective photodiode 634 , 635 .
- the term “effective optical center” describes the average location of the light gathered by a photodiode. For a pixel having two or more photodiodes and a single microlens, the effective optical center of the light gathered by one of the photodiodes is offset from the centroid of the area occupied by the photodiode.
- microlens 611 causes light from a point in the region of interest to converge on two different points which are separated from each other by a distance of approximately 0.5 times the pixel size.
- a first one of the two different points is located on the first photodiode, and a second one of the two different points is located on the second photodiode.
- the system and method described herein can take advantage of the separation between the two locations of the effective optical centers of the respective photodiodes 634 , 635 to obtain additional spatial information.
- microlenses 611 can collect focused light and transmit the focused light to all of the photodiodes 634 , 634 in each PD group 633 .
- Microlenses 611 can be configured to cause the light to converge.
- Color filters 612 can remove unwanted light spectrum from respective color channels.
- a green color filter 612 can be configured to block light having a wavelength less than a predetermined value (e.g., 505 nm) and greater than a second predetermined value (e.g., 530 nm), but admit light having a wavelength of 505-530 nm.
- Second layer 620 can provide space enabling light transmitted by microlenses 611 and through color filters 612 to converge, as shown in FIG. 10 .
- Substrate 631 can include a silicon substrate, a germanium substrate, an indium gallium arsenide substrate, or the like.
- Barriers 632 (also called light shields) can include first portions 632 a projecting from substrate 631 toward microlenses 611 .
- First portions 632 a can be arranged to isolate adjacent PDs within a PD group 633 and/or to isolate adjacent PD groups 633 .
- First portions 632 a can project through second layer 620 until reaching color filter 612 .
- barriers 632 can include second portions 632 b extending into substrate 631 to isolate adjacent PDs within a PD group 633 and/or to isolate adjacent PD groups 633 .
- First and/or second portions 632 a, 632 b can include electrical isolation grid segments.
- second portions 632 b can be a shallow trench isolation region or an implant isolation region.
- Each PD 634 , 635 can include a plurality of different portions.
- Each PD can include a first portion (e.g., 634 x ) extending from substrate 631 toward microlens 611 and a second portion (e.g., 634 y ) extending into a void defined in substrate 631 .
- the first portion 634 x is only shown for one PD 634 , but can be included in any PD described in the present application.
- Each PD 634 , 635 can include, for example, one or more coatings, contacts, p-n junctions, doped wells, and the like.
- PDs 634 , 635 can be configured such that photons of incoming light bias electrons toward electron wells. PDs 634 , 635 can be configured to output voltages of their electron wells, which are based on the number of incident photons. Due to a greater photon density, brighter light displaces more electrons into the electron wells and dimmer light displaces fewer electrons into the electron wells. As such, the voltage of each PD 634 , 635 indicates the brightness of light incident thereon.
- a pixel 640 can include one microlens 611 , one color filter 612 , one PD group 633 , and any barriers 632 between adjacent PDs within the PD group 633 .
- FIG. 6 shows two different pixels 640 .
- the above description of PDs 634 , 635 can apply to the PDs in each PD group 633 . If the imaging sensor 412 is a monochrome sensor, the color filter 612 can be omitted.
- each microlens 611 can include an arced curved peripheral region 611 a, a planar top surface 611 b and a planar or generally planar bottom surface 611 c.
- Bottom surface 611 c is above the PDs 634 , 635
- top surface 611 a, 611 b is above the bottom surface 611 c.
- the central portion of top surface 611 b of the microlens 611 approximates a flat surface. That is, the curvature of the top surface 611 b, if any, is a more gradual curvature than the curvature of the curved peripheral region 611 a.
- the shape of the microlens 611 can be a paraboloid, an elliptic hyperboloid, a hemisphere, half of a prolate spheroid, half of a spherical ellipsoid, half of an oblate spheroid or other aspherical shape.
- the radius of curvature r c may be constant or variable.
- the microlens 611 can have any shape that converges collimated light received by the microlens 611 on respectively different effective optical centers in each respective photodiode.
- the top surface 611 b has a radius of curvature much larger than an edge of the curved peripheral region 611 a.
- a substantially planar central portion 611 b of the microlens 611 may have a radius of curvature about 10-50 times larger than the radius of curvature of the peripheral region of arced top surface 611 a.
- FIG. 7 is a plan view as viewed from section line 7 - 7 of FIG. 6 .
- the curved peripheral region may be an annular region.
- Each curved peripheral region 611 a may have a cross section with a radius of curvature r c , as shown in FIG. 6 .
- microlens 611 is configured to converge light and provide the converged light to PD group 633 .
- microlens 611 at least partially covers photodiodes 634 , 635 .
- pixels 640 are only examples of the many pixel structures consistent with the present application.
- a subset of the pixels 640 within a single imaging sensor 412 can have different structures from the remaining pixels.
- some pixels may be disposed in a central region 801 of imaging sensor 412 , while other pixels may be disposed in a peripheral region 802 of imaging sensor 412 .
- incoming light is approximately normal to planar top surface 611 b.
- Central region 801 may represent a minority or a majority portion of imaging sensor 412 .
- Pixels 640 of FIG. 6 may be disposed in central region 801 of imaging sensor 412 .
- incoming collimated light 901 can be approximately normal to a point on curved peripheral region 611 a and thus PD group 633 can be offset with respect to microlens 611 .
- the offset enables microlens 611 to converge angled light onto PD group 633 corresponding to the microlens 611 .
- the amount of offset in a pixel 640 can be based on a distance from the pixel 640 to central region 801 .
- the Figures, other than FIG. 9 depict pixels 640 disposed in central region 801 .
- FIG. 10 shows incoming, in-focus, and collimated light 1001 incident on pixels 640 in central region 801 ( FIG. 8 ).
- upstream optics 401 have already focused light 901 , 1001 on imaging sensor 412 .
- the light 901 , 1001 is considered collimated because the lens is adjusted so the region of interest (e.g., O 2 of scene 501 ) corresponding to the focus point selected by the user is in focus.
- each microlens 611 causes collimated focused light 1001 to converge so light converges on an optical area 1004 c, 1005 c of each PD 634 , 635 .
- the optical area 1004 c, 1005 c of each photodiode 634 , 635 is the portion of the area of the photodiode illuminated by the incoming light.
- Curved peripheral region 611 a causes incoming light to bend radially inward, toward central axis C.
- Light incident on planar top surface 611 b proceeds in the same direction.
- FIG. 10 shows that light 1001 comprises three portions.
- a first portion 1004 converges onto a first area of first PD 634 .
- a second portion 1005 converges onto a second area of second PD 635 .
- a third portion 1006 is incident upon barrier 632 and/or the region between PDs 634 , 635 .
- focused light 1004 a, 1005 a impinges on a surface area (the top surface area of microlens 611 ).
- the focused light converges as indicated by converging rays 1004 b, 1005 b.
- the converged focused light is gathered by the optical area 1004 c, 1005 c within the surface area on each respective photodiode 634 , 635 .
- microlens 611 can cause a greater percentage of incoming photons to impinge on the PDs 634 , 635 and be converted to current by the PDs 634 , 635 .
- the light 1004 , 1005 impinges on a portion 1104 , 1105 (referred to herein as the “optical area”) of the area of each respective photodiode 634 , 635 . That is, the optical area 1104 ( 1105 ) of a photodiode 634 ( 635 ) is the portion of the area of the photodiode that gathers light passing through the microlens 611 .
- Each of first and second optical areas 1104 , 1105 can correspond to a respective region of interest in scene 501 .
- the union of first and second optical areas 1104 , 1105 can roughly correspond to the field of view from microlens 611 .
- First optical area 1104 is shown in phantom, and second optical area 1105 is shown in solid lines.
- First and second optical areas 1104 , 1105 can have respective first and second effective optical centers 1101 , 1102 , separated by distance 1103 .
- the term “effective optical center” refers to the average location of light gathered by the photodiode.
- the effective optical centers 1101 , 1102 can be obtained by detecting a light flux distribution function throughout the first and second optical areas 1104 , 1105 , integrating the light flux distribution function times y over the first and second optical areas 1104 , 1105 , individually, and dividing the integrals by the integral of the light flux over first and second areas, respectively.
- the z coordinates are assumed to be the same as the z coordinates of the centroids of the respective photodiodes, because of symmetry.
- the y coordinate ( y ) of the effective optical center 1101 , 1102 is given by equation (1).
- I is the light flux on a differential area dydz
- the double integral for each respective photodiode is integrated over the respective optical area of the photodiode.
- the light beams passing through the left and right portions of microlens 611 can overlap.
- light 1004 incident on first PD 634 can include rays of light from a first area of scene 501 and light 1005 incident on second PD 635 can include rays of light from a second area of scene 501 .
- the first and second areas of scene 501 can partially overlap, but the non-overlapping areas provide additional spatial information in each PD 634 , 635 .
- the amount of light gathered by the second photodiode 635 can be different from the amount of light gathered by first photodiode 634 .
- the distance 1103 between the effective optical centers 1101 , 1102 increases, the amount of additional spatial information increases.
- the amount of information (for a sensor having two photodiodes per microlens) approaches twice the information provided by a sensor having a single photodiode per microlens.
- the amount of information (for a sensor having two photodiodes per microlens) approaches the same amount of information provided by a sensor having a single photodiode per microlens.
- processing system 300 of FIG. 3 can apply the distance between the effective optical centers 1101 , 1102 during autofocus.
- Each imaging pixel provides a first photodiode and a second photodiode that can be used both for imaging and for phase detection autofocus (PDAF).
- processing system 300 has a PDAF block 302 c ( FIG. 3 ) that provides a means for generating a lens positioning signal for a lens, based on a phase difference determined using at least two of the plurality of photodiodes.
- PDAF block 302 c detects a phase difference between light arriving at a first one of the plurality of photodiodes and light arriving at a second one of the plurality of photodiodes.
- PDAF block 302 c generates the lens positioning signal for positioning the lens so that the phase difference between light arriving at the first one of the plurality of photodiodes and light arriving at the second one of the plurality of photodiodes has a predetermined non-zero value.
- Intensity profile 1201 is an of a response of a plurality of consecutive and identically oriented first PDs 634 of a plurality of consecutive PD groups 633 .
- Intensity profile 1202 can be an exemplary response of a plurality of consecutive and identically oriented second PDs 635 of the same consecutive PD groups 633 .
- the peak-to-peak distance 1203 is the phase difference (phase disparity), and is zero at optimal focus.
- the peak-to-peak distance 1203 has a non-zero value when the lens is optimally focused.
- Intensity profiles 1201 and 1202 are similar in shape due to the overlapping optical information sensed by the first and second PDs 634 , 635 of each PD group 633 .
- the horizontal axis of FIG. 12 corresponds to pixel position along a particular axis (e.g., the Y axis of FIG. 10 ).
- the vertical axis of FIG. 12 corresponds to PD response (e.g., brightness measured or electrons deposited in an electron well).
- the distance between similar features of intensity profiles 1201 , 1202 is peak-to-peak distance 1203 .
- Horizontal and vertical, as used herein, relate to the graph of FIG. 12 , and do not necessarily correspond to any particular axis.
- a processing system 300 can generate pixel data from a single exposure period, corresponding to left and right (and/or top and bottom) phase detection pixels.
- Each set of data can include two intensity profiles 1201 , 1202 .
- Each intensity profile 1201 , 1202 can include values of a respective PD sharing a common microlens.
- adjacent PD groups 633 can be orthogonal. That is, the respective microlenses 611 of the two PD groups 633 are rotated about the X axis by an angle of 90 degrees from each other (where the X, Y, and Z axes are shown in FIG. 11 ).
- pixels 640 can be useful for autofocus along the Y axis; when the lens is in focus, light passing through the single microlens converges on two effective optical centers having respectively different Y values.
- Other pixels can be useful for autofocus along the Z axis; when the lens is in focus, light passing through the single microlens converges on two effective optical centers having respectively different Z coordinates.
- a intensity profile 1201 may thus only include measurements from first PDs 634 that are oriented in a common direction (e.g., with effective optical centers having respectively different Y coordinates).
- phase difference peak-to-peak distance 1203
- the predetermined value may be a known dimension 1203 (also called minimum phase difference), which represents the distance between effective optical centers 1104 , 1105 when light from the region of interest is optimally focused.
- the minimum phase difference can be determined at the time of manufacturing imaging sensor 412 .
- a microlens 611 having a substantially planar top surface 611 b converges light on two different areas of respective PDs 634 and 635 , resulting in a non-zero minimum phase difference at the optimum focal length.
- each PD group 633 of each pixel 640 may include any suitable number of PDs 634 , 635 .
- each PD group 633 can include four different PDs 634 a, 634 b, 635 a, 635 b.
- Barriers 632 can be arranged in a crossing pattern to separate adjacent PDs in PD group 633 along the Y and Z axes. As shown in FIG. 14 , a single barrier 632 can include a plurality of different and non-contacting sub-barriers 632 w, 632 x, 632 y, 632 z.
- a common microlens 611 ( FIG. 13 ) can produce four different optical areas (not shown) with first, second, third, and fourth effective optical centers 1501 , 1502 , 1503 , 1504 ( FIG. 15 ).
- first, second, third, and fourth effective optical centers 1501 , 1502 , 1503 , 1504 ( FIG. 15 ).
- the difference in Z coordinates between adjacent effective optical centers can be dimension 1505 and the Y-axis distance between adjacent effective optical centers can be dimension 1506 .
- any and all features described with reference to the two-PD pixels 640 in FIGS. 6-11 can apply to the four-PD pixels 640 in FIGS. 13-15 .
- FIGS. 15A, 15B, 15C, 15D show cross sections taken along respective section lines 15 A- 15 A, 15 B- 15 B, 15 C- 15 C, and 15 D- 15 D of FIG. 14 .
- Focused and collimated incoming light 1001 (shown in FIG. 10 ) includes first, second, third, fourth, and fifth portions 1511 - 1515 .
- First portion 1511 is incident on first PD 634 a.
- Second portion 1512 is incident on second PD 635 a.
- Third portion 1513 is incident on third PD 634 b.
- Fourth portion 1514 is incident on fourth PD 635 b.
- Fifth portion 1515 which is incident on barrier 632 and/or the spaces between adjacent PDs 634 , 635 is not gathered by any of the photodiodes 634 a, 634 b, 635 a, 635 b.
- Imaging sensor 412 can include any number (e.g., several millions) of pixels 640 .
- each pixel 640 can include two PDs.
- each pixel 640 can include four PDs.
- each pixel 640 can include any suitable number of PDs (e.g., 8 or 16).
- every pixel 640 can include the same number of PDs.
- different pixels 640 can include different numbers of PDs (e.g., some may include one PD, others may include two PDs, and others may include four PDs).
- Each pixel 640 can have a red, green, or blue color filter 612 , or no color filter if the sensor is a monochrome sensor.
- the color filters can be arranged in any suitable pattern (e.g., a Bayer pattern). Although not shown, only a portion of the total area of imaging sensor 412 is occupied by pixels 640 . Other portions of imaging sensor 412 can include circuitry (e.g., horizontal and vertical registers) to measure outputs of pixels 640 . Further, adjacent pixels 640 can be separated by circuitry.
- Two-PD pixels If multiple two-PD pixels 640 are present, then the first and second PDs 634 , 635 of each PD group 633 can be arranged in the same directions. Alternatively, some PD groups 633 can be rotated with respect to other PD groups 633 . For example, half of the PD groups 633 can have the orientations shown in FIG. 11 (with the PDs separated in the y direction) and the other half of the PD groups 633 can have orientations perpendicular to those shown in FIG. 11 (e.g. with the PDs separated in the z direction). Alternatively, the imaging sensor 412 can predominantly comprise pixels having a left PD and a right PD, and be sparsely populated with pixels having a top PD and a bottom PD. Such an arrangement enables autofocus in two-dimensions.
- a phase detection intensity profile can be collected: a first intensity profile corresponding to first PDs 634 in the orientation of FIG. 11 , a second intensity profile corresponding to second PDs 635 in the orientation of FIG. 11 , a third intensity profile corresponding to first PDs 634 perpendicular to the orientation of FIG. 11 , and a fourth intensity profile corresponding to second PDs 635 perpendicular to the orientation of FIG. 11 .
- processing system 300 can perform autofocus to minimize the phase difference, corresponding to placing the peaks of the first and second intensity profiles a predetermined minimum distance apart and/or to place the peaks of the third and fourth intensity profiles a predetermined distance apart.
- a first intensity profile can correspond to first PDs 634 a
- a second intensity profile can correspond to second PDs 635 a
- a third intensity profile can correspond to third PDs 634 b
- a fourth intensity profile can correspond to fourth PDs 635 b.
- the system can determine the phase difference between any two of the PDs 634 a, 635 a, 634 b, 635 b of the pixel 640 during autofocus.
- the autofocus system can determine the phase difference between the peak of the first intensity profile and the peak of the the second, third, or fourth intensity profile.
- the second intensity profile can be compared to the first, third, or fourth intensity profile.
- the third intensity profile can be compared to the first, second, or fourth intensity profile.
- the fourth intensity profile can be compared to the first, second, or third intensity profile.
- FIG. 18 is a flow chart showing a series of operations that processing system 300 can be configured to perform to (a) autofocus imaging assembly 400 using phase detection, for example, and (b) enhance resolution of imaging assembly 400 using the extra spatial information from the pixels 640 having a non-ideal microlens (e.g., having planar top surface 611 b ) and curved peripheral region 611 a of the top surface.
- FIG. 18 is only one example of operations consistent with the present application.
- one or more regions of interest within the field of view of the sensor can be selected by a user (e.g., by touching a focus point in a region on a display 102 , 122 ) or by processing system 300 automatically.
- Each region of interest can correspond to a two-dimensional area of a scene 501 to be brought into focus.
- each focal point can correspond to one or more pixels 640 (processing system 300 can store a map linking each selected focal point to a corresponding group of pixels 640 ).
- an autofocus operation is initiated to bring light from the region of interest into focus at the plane of the imaging sensor 412 .
- processing system 300 can command imaging assembly 400 to expose imaging sensor 412 to incoming light. Within each pixel, light passing through the microlens of the pixel converges on the optical areas of each photodiode of the pixel.
- processing system 300 can normalize responses of pixels 640 . For example, processing system 300 can (a) multiply responses of PDs under green color filters 612 by a first value (e.g., one), (b) multiply responses of PDs under blue color filters 612 by a second value, and (c) multiply responses of PDs under red color filters 612 by a third value. Operators other than multiplication can be applied.
- processing system 300 can determine the phase difference between the PDs in each PD group. At block 1806 , processing system 300 can determine the phase difference between left PD 634 a and right PD 635 a, and/or the difference between top PD 634 b and bottom PD 634 a.
- processing system 300 can compare the phase difference to a predetermined minimum phase difference value corresponding to optimal focus for a region of interest within the field of view of the sensor.
- the phase difference corresponds to the dimension between the light intensity peaks detected by a left photodiode and a right photodiode, such as peak-to-peak distance 1203 ( FIG. 12 ).
- the phase difference at optimal focus is zero, but for the flattened, non-ideal microlens, the phase difference at optimal focus is a non-zero value.
- Processing system 300 can store one or more predetermined values corresponding to different types of PD. As stated above, the predetermined values can be determined at the time of manufacturing.
- the predetermined minimum phase difference values can be the distances between optical centers when incoming light 1001 is in-focus.
- the predetermined value can be distance 1103 of FIG. 11 .
- the values can be distances 1505 and 1506 of FIG. 15 .
- processing system 300 can command imaging assembly 400 to focus based on one or more of the phase differences.
- the processing system 300 determines a lens positioning command, based on the comparison between the measured phase difference and the minimum phase difference at optimal focus.
- Processing system 300 can be configured to perform block 1810 such that after adjusting the lens based on the lens positioning command, the phase difference between left and right photodiodes is substantially equal to the predetermined minimum phase difference value(s).
- Blocks 1804 - 1810 can represent a phase detection autofocus technique.
- the processing system 300 controls the mobile device 100 to capture an image.
- the sensor voltages are zeroed out, and the imaging sensor 412 is exposed to incoming light from the region of interest for an exposure period, which can be automatically determined by the processor 301 .
- the photodiodes of the imaging sensor 412 accumulate charge according to the intensity of the light received by each pixel.
- processing system 300 can perform one or more interpolation techniques to resample the measurements (e.g., voltage values representing luminance values) of pixels 640 to correspond to a set of evenly spaced pixel values, which can be processed using image processing techniques for an evenly spaced pixel array.
- interpolation techniques to resample the measurements (e.g., voltage values representing luminance values) of pixels 640 to correspond to a set of evenly spaced pixel values, which can be processed using image processing techniques for an evenly spaced pixel array.
- processing system 300 can save the interpolated values as an image file.
- the resampled image data are processed according to an image processing chain for a uniformly spaced sensor array having uniformly spaced pixels, and saved in Joint Photographic Experts Group (JPEG) or Tagged Image File Format (TIFF).
- JPEG Joint Photographic Experts Group
- TIFF Tagged Image File Format
- the image processing operations can include demosaicing, white balance, cross talk reduction, noise reduction, sharpening, image filtering, lens artifact or defect correction, or the like.
- the raw and non-interpolated measurements (voltages representing luminance values of each PD can be output in a RAW format file.
- the imaging sensor 412 can include on-chip circuitry to perform the bilinear or bicubic interpolation to resample the image data, and output the resampled image data in a RAW file format.
- processing system 300 can: resample the raw data and store results of the resampling (interpolation); and/or (b) command display elements (e.g., LEDs, OLEDs) of a display to light up based on each processed image pixel.
- command display elements e.g., LEDs, OLEDs
- processing system 300 can transmit the image file over an external communications interface 309 .
- An image can be represented as a two-dimensional matrix with a plurality of display pixels.
- Each display pixel can correspond to a unit of resolution of the image and can include RGB data or luminance and chrominance data.
- the RGB data include a red value, a green value, and a blue value.
- a processing system 300 displaying the image can then illuminate a liquid crystal display (LCD) or light emitting diodes (“LEDs”) (e.g. OLEDs, micro LEDs) based on each RGB coordinate.
- LCD liquid crystal display
- LEDs light emitting diodes
- processing system 300 can resample the image data so the pixels in each resampled row are uniformly spaced.
- the microlenses 611 cause the light to converge on locations centered at positions 1501 - 1504 .
- the positions 1501 - 1504 are offset from the centroids of the two-dimensional area of each photodiode 634 a, 634 b, 635 a, 635 b.
- the distance 1505 between effective optical centers among adjacent photodiodes 634 a, 634 b, 635 a, 635 b can be shorter than one half the size of the pixel (i.e., less than one half of the centroid-to-centroid distance between adjacent microlenses).
- the distance between the optical centers 1501 - 1504 of the photodiodes 634 a, 634 b, 635 a, 635 b and the optical centers of the nearest photodiode in a neighboring pixel (not shown) is longer than one half the size of the pixel.
- the distances between effective optical centers of successive photodiodes along a row alternates between short-long-short-long.
- resolution enhancement is achieved by resampling (e.g., using interpolation) to provide uniformly spaced resampled pixels.
- the number of resampled pixels can equal the number of photodiodes, and each resampled pixel can be located at a centroid of a respective photodiode.
- Resampling Block 302 d ( FIG. 3 ) of processing system 300 provides a means for resampling the luminance values by interpolating among the received luminance values to determine respective resampled luminance values of a plurality of resampled pixels having respective optical centers located at respective centroids of each of the plurality of photodiodes.
- resampling Block 302 d of processing system 300 can perform bilinear or bicubic interpolation to estimate or approximate how resampled pixels located at the centroids of PDs 634 , 635 , 634 a, 635 a, 634 b, 635 b would respond to the same scene. Because the resampled pixels are themselves evenly spaced, the resampled image data correspond to an array having a set of evenly spaced pixels at the location of the centroid of each photodiode. That is, the locations of the resampled pixels can match the locations of the corresponding photodiodes.
- the resampled image data provides an enhanced resolution of between one and two times the resolution of a similarly sized sensor having one photodiode per microlens.
- the amount of the resolution enhancement depends on the distance between the effective optical center of the first photodiode and the effective optical center of the second photodiode. A larger distance between effective optical centers leads to larger resolution enhancement.
- the resampled image data provide a resolution of between one and four times the resolution of a similarly sized sensor having one photodiode per microlens.
- illuminance values from at least five photodiodes are used, including a first PD for which a resampled pixel is being computed and adjacent PDs on left, right, top and bottom sides of the first PD. For example, referring to FIG.
- the luminance values of PDs 634 a, 634 b, 635 a, a fifth PD 1711 to the left of PD 634 a, and a sixth PD 1712 below PD 634 a can be used to find a resampled luminance value of a resampled pixel located at the centroid 1701 of photodiode 634 a.
- illuminance values of at least three PDs are used, including an adjacent PD to the left or right of the PD for which a resampled pixel is being computed, and an adjacent PD above or below the PD for which a resampled pixel is being computed.
- luminance values of PD 634 a, PD 1711 , and PD 1712 at their respective optical centers can be used to find a resampled luminance value of a resampled pixel located at the centroid 1701 of photodiode 634 a.
- first PD 634 can have a first centroid 1601 and second PD 635 can have a second centroid 1602 .
- processing system 300 can perform the bicubic or bilinear interpolation described above to estimate the resampled luminance value of a resampled pixel having an optical center at the centroid 1601 of the two-dimensional area of photodiode 634 .
- Processing system 300 can perform the same bicubic or bilinear interpolation techniques discussed above to estimate the resampled luminance value of a resampled pixel having an optical center at the centroid 1602 of the two-dimensional area of photodiode 635 .
- Distances 1603 and 1604 between the locations of the effective optical centers 1101 , 1102 and the corresponding locations 1601 , 1602 of the resampled PDs may be equal magnitudes and opposite signs.
- each pixel 640 depends on the amount of offset between microlens 611 and PD group 633 .
- Processing system 300 can perform this interpolation on all pixels 640 to resample all of the pixels 640 in the imaging sensor 412 .
- first through fourth PDs 634 a, 635 a, 634 b, 635 b can have first through fourth centroids 1701 - 1704 .
- processing system 300 can perform interpolation to estimate or approximate the luminance values of first through fourth PDs 634 a - 635 b if the optical centers of light 1501 - 1504 were respectively located at the centroids 1701 - 1704 .
- each distance 1705 , 1706 can be equal for each PD 634 a - 635 b and the signs may adjust accordingly.
- PD 634 b can have a negative first distance 1705 and a negative second distance 1706 while PD 635 a can have a positive first distance 1705 and a positive second distance 1706 .
- PDs 634 a and 635 b can each have one positive distance and one negative distance. If each PD 634 a - 635 b is a square, then the magnitudes of first and second distances 1705 , 1706 can be equal.
- each pixel 640 depends on the amount of offset between microlens 611 and PD group 633 .
- Processing system 300 can perform this interpolation on all pixels 640
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Signal Processing (AREA)
- Multimedia (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Automatic Focus Adjustment (AREA)
- Studio Devices (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
Description
- None.
- None.
- This disclosure relates, among other things, to image sensors.
- Digital cameras and many mobile devices (e.g., smartphones, tablets, laptops, and the like) include an imaging assembly having a sensor disposed downstream of optical components. Typical optical components include one or more lenses and apertures. The optical components direct light of a scene onto the sensor, which measures the light. A processor processes the sensor's measurements (luminance and chrominance values) to produce an image.
- To record a clear image, the optical components focus light from the scene onto the sensor. If the light is out of focus at the plane of the sensor, then the sensor will capture a blurry image.
- An imaging system includes an image sensor comprising a pixel. The pixel comprises first and second photodiodes sharing a common microlens. The common microlens is configured to simultaneously converge in-focus light onto a first area of the first photodiode and in-focus light onto a second area of the second photodiode. An effective optical center of the first area of the first photodiode is offset from a centroid of the first photodiode. An effective optical center of the second area of the second photodiode is offset from a centroid of the second photodiode. One or more processors are configured to: receive a first luminance value of the first area from the first photodiode; receive a second luminance value of the second area from the second photodiode; and resample a plurality of luminance values including the first luminance value and the second luminance value to provide a luminance of a first resampled pixel having an optical center located at the centroid of the first photodiode and a luminance of a second resampled pixel having an optical center located at the centroid of the second photodiode.
- A method of imaging with a sensor having a plurality of pixels is provided. At least one of the plurality of pixels comprises first and second photodiodes. The method comprises: receiving a first luminance value from the first photodiode and a second luminance value from the second photodiode. The first photodiode and the second photodiode share a common microlens. The common microlens is configured so light from a first area is gathered by the first photodiode and has an effective optical center at a first location offset from a centroid of the first photodiode, and so light from a second area is gathered by the second photodiode and has an effective optical center at a second position offset from a centroid of the second photodiode. The second position is different from the first position. Resampling is performed by interpolating among a plurality of luminance values collected by the sensor, including the first luminance value and the second luminance value, to determine a resampled luminance value of a resampled pixel having an optical center located at the centroid of the first photodiode in an evenly spaced row of pixels.
- An imaging system comprises a means for receiving luminance values from a plurality of photodiodes sharing a common microlens, such that the luminance values represent light gathered by each respective one of the plurality of photodiodes, and the light gathered by each respective photodiode has an effective optical center at a respective location that is offset from a respective centroid of the respective photodiode. A means for resampling the luminance values interpolates among the received luminance values to estimate respective resampled luminance values of a plurality of resampled pixels having respective optical centers located at respective centroids of each of the plurality of photodiodes.
- A non-transitory, machine-readable storage medium comprises computer program code for processing image sensor data. The computer program code comprising code for receiving luminance values from a plurality of photodiodes sharing a common microlens, such that the luminance values represent light impinging on each respective one of the plurality of photodiodes, and the light impinging on each respective photodiode has an effective optical center at a respective location that is offset from a respective centroid of the respective photodiode. The medium also comprises code for resampling the luminance values by interpolating among the received luminance values to estimate respective resampled luminance values of a plurality of resampled pixels having respective optical centers located at respective centroids of each of the plurality of photodiodes.
- For clarity and ease of reading, some Figures omit views of certain features. Unless expressly stated otherwise, the drawings are not drawn to scale.
-
FIG. 1 schematically shows mobile devices capturing a scene. -
FIG. 2 is a rear view of a mobile device as shown inFIG. 1 . -
FIG. 3 is a block diagram of a mobile device as shown inFIG. 1 . -
FIG. 4 is a schematic diagram of an optical system of the imaging system ofFIG. 3 . -
FIG. 5 is a diagram of light rays extending between a scene and the imaging sensor of the mobile device as shown inFIG. 3 . -
FIG. 6 is a cross sectional view of two pixels in a central region of the imaging sensor of the mobile device as shown inFIG. 3 . -
FIG. 7 is a plan view of the two pixels inFIG. 6 . -
FIG. 8 is a plan view of the imaging sensor of the mobile device as shown inFIG. 3 . -
FIG. 9 is a cross sectional view of top pixels at a peripheral region of the sensor ofFIG. 8 . -
FIG. 10 is a cross sectional view of light rays focused on the plane of the pixels ofFIG. 6 . -
FIG. 11 is a plan view of two of the photodiodes ofFIG. 6 with overlaid illumination areas of in-focus light. -
FIG. 12 is a graph of photoelectric response versus position relative to two photodiodes ofFIG. 9 . -
FIG. 13 is a plan view of two pixels in a central region of a sensor having four photodiodes per microlens. -
FIG. 14 is a plan view of the photodiodes of one of the pixels shown inFIG. 13 . -
FIG. 15 is a schematic view of the photodiodes ofFIG. 13 , showing the optical centers of received light. -
FIGS. 15A-15D are cross sectional views of the photodiodes ofFIG. 14 while receiving light, taken alongrespective section lines 15A-15A, 15B-15B, 15C-15C, and 15D-15D ofFIG. 14 . -
FIG. 16 is a schematic view of a pair of photodiodes receiving in-focus light. -
FIG. 17 is a schematic view of a pixel having four photodiodes receiving in-focus light. -
FIG. 18 is a block diagram of an exemplary method. - In some image sensors each imaging pixel has a microlens shared by two photodiodes. The system described below can take advantage of the microlens shape in some sensors to increase the amount of information obtained from each pixel. Each photodiode collects light coming from a different spatial location, and the microlens shape causes light to converge onto different effective optical centers in each photodiode. The effective optical center of each photodiode is offset from the corresponding centroid of the photodiode. A plurality of luminance values including the luminance values from two photodiodes sharing the same microlens are resampled. The resampling uses interpolation to provide a luminance value of a resampled pixel having a corresponding optical center located at the centroid of each corresponding photodiode. The result is an evenly spaced array of resampled pixel data for further image processing and display.
- As discussed herein, the centroid of a photodiode refers to a point having a mean position among all the points in the top surface of the photodiodeor a two-dimensional projection of the top surface.
-
FIG. 1 showsmobile devices 100 capturing ascene 10 a.Mobile devices 100 can includesmartphones 101,digital cameras 121, tablets, laptops, vehicles, or the like. As shown inFIGS. 1 and 2 ,smartphone 101 can include a display 102 (e.g., a touchscreen), one or more front-facingimaging assemblies 103 and one or more rear-facingimaging assemblies Digital camera 121 can include rear-facingimaging assembly 107 having adisplay 122 and alens assembly 123.Mobile devices 100 can be configured to displaysoft buttons Mobile devices 100 can includehard buttons 124. - In
FIG. 1 ,mobile devices 100 display animage 10 b ofscene 10 a. To generate the displayedimage 10 b, a rear-facingimaging assembly smartphone 101 andlens assembly 123 ofdigital camera 121 focus light projecting fromscene 10a onto their respective sensors. The sensors measure the luminance (and for color sensors, the red, green and blue components) of received light, and an image signal processor converts the data representing luminance and chrominance values into image files.Mobile devices 100 cause theimages 10 b to be displayed ondisplays -
Mobile devices 100 each include a processing system. As shown inFIG. 3 ,processing system 300 can include one ormore processors 301,volatile memory 302 a,non-volatile memory 302 b, one or more input/output devices 304, one ormore sensors 305, one ormore user interfaces 306, one or more motors/actuators 307, one or more internal data busses 308, and one or more external communications interfaces 309. - Although
FIG. 3 shows the components ofprocessing system 300 as distinct, a single component ofprocessing system 300 may perform multiple functions. Alternatively, one or more components can perform a single function. For example, a touchscreen display acts as a touch-sensitive input device and as a display output device. In another example, some mobile devices use a single random access memory (RAM) for instructions and data. Other mobile devices can have separate RAMs for instructions and data. -
Processor 301 can include one or more distinct processors, each having one or more cores. Each of the distinct processors can have the same structure or respectively different structure. Ifprocessor 301 is a general-purpose processor,processor 301 can be configured by program code inmemory 302 to serve as a special-purpose processor and perform a certain function or operation. In some mobile devices, asingle processor 301 performs image processing functions and other instruction processing. Other mobile devices include a separate image signal processor. -
Processor 301 can include one or more central processing units (CPUs), one or more graphics processing units (GPUs), application specific integrated circuits (ASICs), digital signal processors (DSPs), and the like. -
Memory 302 can include non-transitory, machine readable storage medium(s), such asvolatile memory 302 a,non-volatile memory 302 b, and any other mediums capable of storing data.Volatile memory 302 a only maintains data when supplied with power.Non-volatile memory 302 b may maintain data with or without power, and can include flash memory storage, electrically erasable programmable read-only memory (EEPROM), a solid-state drive (SSD), and the like. - Each of
volatile memory 302 a,non-volatile memory 302 b, and any other type of non-transitory machine readable storage device can correspond to a respectively different memory device, located at one or more distinct locations and each having a different structure. Examples ofmemory 302 include a non-transitory computer-readable media such as random access memory (RAM), read-only memory (ROM), flash memory, electrically erasable programmable ROM (EEPROM), any kind of optical storage disk such as a digital versatile disk (DVD), a “BLU-RAY®” disc, magnetic storage, holographic storage, a hard disk drive (HDD), an SSD, any medium that can be used to store program code in the form of instructions or data structures, and the like. - The methods, functions, and operations described in the present application can be fully or partially embodied in the form of tangible and non-transitory machine-readable storage media encoded with program code. The program code configures the
processor 301 as a special-purpose processor for performing a disclosed method or function. - Input-
output devices 304 can include any component for receiving or transmitting data such as ports and telematics. Input-output devices 304 can enable wired communication via USB®, DisplayPort®, HDMI®, Ethernet, and the like. Input-output devices 304 can enable optical, magnetic, and holographic communication withsuitable memory 302. Communications interfaces can enable wireless communication via WiFi®, Bluetooth®, cellular (e.g., Long-Term Evolution (LTE®), carrier-sense multiple access (CDMA®), Global System for Mobile Communications (GSM®), WiMax®), near-field communications (NFC®), global positioning system (GPS), and the like.Processor 301 andmemory 302 can include dedicated processors and memory for performing input-output functions (e.g., an LTE® module can include a dedicated processor, dedicated memory, and a dedicated antenna). -
Sensors 305 can capture physical measurements of an environment and report the same toprocessor 301.Sensors 305 can include laser image detection and ranging (LIDAR) sensors. In addition, the system can include an acceleration sensor, a motion sensor, a gyro, and the like. -
User interface 306 enables user interaction withmobile device 100.User interface 306 can include displays (e.g., an LED touchscreen), physical buttons, speakers, microphones, keyboards, and the like. - Motor/
actuator 307 can move any optical components of thelens assembly 123 to focus the lens for imaging the subject.Internal data bus 308 can include pathways located within mobile device 100 (e.g.,smartphone 101,digital camera 121, vehicle, laptop, etc.). As shown inFIG. 3 ,internal data bus 308 can transmit data between theprocessor 301 and the other components ofprocessing system 300.Internal data bus 308 can include conductive paths printed on, or otherwise applied to, a substrate (e.g., a logic board), or a separate bus integrated circuit. - External communications interfaces 309 can include wireless communication paths and wired communication paths. External communications interfaces 309 can include an Internet connection, allowing the
processing system 300 to communicate with asecond processing system 300, which may be located remotely. - As shown in
FIG. 3 , components ofprocessing system 300 can be connected viainternal data bus 308 and/orexternal communications interface 309. For example,processor 301 can be configured to store data on remotenon-volatile memory 302 b, such as an SSD located in a remote server farm. As another example, auser interface 306 can be a touchscreen display connected toprocessor 301 via an HDMI® or via conductive paths printed on a substrate. - The components of
processing system 300 can be components located in a common location (e.g., a single mobile device housing and/or a single room). Alternatively, the components ofprocessing system 300 can be geographically dispersed and connected via wired or wireless (e.g., Internet-based) communication. -
FIG. 4 is a schematic diagram of animaging assembly 400, which can be illustrative of some or all of imaging assemblies 103-106 orlens assembly 123 or other imaging assembly of a mobile device 100 (e.g., an imaging assembly/camera mounted on a vehicle). As discussed below, animaging assembly 400 comprises image capture hardware, including optics and animaging sensor 412.Imaging assembly 400 can includeupstream optics 401 that are controllable to set the focal length (e.g., a primary lens) anddownstream optics 402 within the imaging sensor 412 (e.g., a microlens).Imaging assembly 400 can include a housing or cover assembly for enclosingupstream optics 401 anddownstream optics 402. -
Upstream optics 401 can be configured to transmit focused light todownstream optics 402.Upstream optics 401 can include lenses (e.g., convex lenses and/or concave lenses), mirrors, shutters, apertures, filters (e.g., color or ultraviolet filters), and the like. Some of these components can include motors/actuators for autofocus adjustment. For example,processor 301 can be configured to: (a) instruct a motor to move (e.g., slide or actuate) a lens ofupstream optics 401 along the X axis to focusincoming light 403 ondownstream optics 402; (b) instruct a motor to rotate a lens ofupstream optics 401 about the Z axis for autofocus adjustment; (c) control opening time of a shutter to yield a certain exposure time. -
Processor 301 can use phase detection autofocus (PDAF) to control the motor ofupstream optics 401 to capture an image so that a desired region of interest within the field of view is in focus. -
Downstream optics 402 can include a sensor 412 (also called an imaging sensor) having photodiodes, microlenses, color filters, and barriers.Imaging sensor 412 can have a rectangular (e.g., square), annular (e.g., circular) perimeter in the Y-Z plane.Imaging sensor 412 can have a width along the Y axis, a thickness along the X axis, and a height along the Z axis. -
Imaging sensor 412 can receive light 403 that has passed throughupstream optics 401. The light 403 can pass through microlenses and color filters before being gathered by photodiodes. When the photons contact the photodiodes, the photodiodes convert the light to electrical current. - For example, the photons of light 403 can disturb electrons in the photodiodes through the photoelectric effect. Some of the disturbed electrons can fall into an electron well in the photodiode. The number of electrons falling into the electron well corresponds with brightness of the light passing through.
- A voltage generated by each photodiode's electron well can correspond to the number of electrons residing within the well. By receiving the voltage values of each electron well,
processor 301 can estimate the brightness of light incident upon each photodiode.Processor 301 can use the estimated brightness of light to generate an image file. -
FIG. 5 is a schematic and plan ray diagram illustratingupstream optics 401 focusing light 403 onimaging sensor 412.Upstream optics 401 has been approximated as a plano-convex lens with anoptical axis 502. - Rays of light 403 emanate and/or reflect from first object O1 and second object O2 in a
scene 501.Upstream optics 401 focuses the light 403, thus causing the rays of light 403 from O1 to converge at a first region I1 onimaging sensor 412 and the rays of light 403 from O2 to converge at a second region I2 onimaging sensor 412. Because first and second regions I1, I2 lie onimaging sensor 412, both first object O1 and second object O2 are in focus on the plane ofimaging sensor 412. -
Processing system 300 ofFIG. 3 is configured to perform an autofocus operation. During autofocus, a user (orprocessing system 300 automatically) can select one or more focus points, such as focus points in regions I1 and I2, corresponding to regions of interest within the field of view containing objects O1 and O2, respectively.Processing system 300 then controls mechanical adjustment of imaging assembly 400 (e.g., upstream optics 401) based on measurements fromimaging sensor 412, so that the region(s) of interest corresponding to the selected focus point(s) is (are) in-focus. - For example,
processing system 300 may instruct one or more components ofupstream optics 401 to (a) slide along the X-axis or (b) rotate about the Z-axis. According to some examples,upstream optics 401 is configured to move with respect to (e.g., slide along and/or rotate about) the X-axis, the Y-axis, and/or the Z-axis. Exemplary techniques for mechanical control ofimaging assembly 400 based on measurements fromimaging sensor 412 are discussed below. - The
processing system 300 provides a means for receiving luminance values from a plurality of photodiodes sharing a common microlens, such that the luminance values represent light gathered by each respective one of the plurality of photodiodes, and the light gathered by each respective photodiode has an effective optical center at a respective location that is offset from a respective centroid of the respective photodiode. -
FIG. 6 is a cross sectional view of twopixels 640 inimaging sensor 412.Imaging sensor 412 can include afirst layer 630, asecond layer 620, and athird layer 610.First layer 630 can include asubstrate 631,barriers 632, and photodiode (“PD”)groups 633 havingindividual PDs PD group 633 includes all of the photodiodes which share a common microlens.Second layer 620 can include one or more layers of dielectric material (e.g., SiO2 or SiO).Third layer 610 can include an array ofmicrolenses 611 andcolor filters 612. In the embodiment ofFIG. 6 , eachPD group 633 includes twophotodiodes FIG. 13 ), each pixel can have four photodiodes per microlens, and a PD group includes four photodiodes. - Some sensors (not shown) can have “ideal” microlenses generally shaped as a portion of an elliptic paraboloid or paraboloid of revolution, to converge the incoming collimated light at the centroid of the area of the PD group and increase a percentage of incoming light that falls within the perimeters of the photodiodes. When the upstream optics are focused on the subject, light rays from a point on the subject converge at a point on the sensor.
- As shown in
FIG. 6 ,other imaging sensors 412 havemicrolenses 611 shaped with a top surface (referred to below as a “non-ideal” shape) that deviates from the “ideal” shape of an elliptic paraboloid or paraboloid of revolution. The term “non-ideal” is used herein for convenient identification, but does not characterize the quality the identified microlens. - A non-ideal microlens does not focus light at a single point. For example, in some embodiments,
microlenses 611 can have a generally planartop surface 611 b, and a curvedperipheral region 611 a in the top surface. In other embodiments, thetop surface 611 b of the microlenses may be slightly curved. That is, the curvature of thetop surface 611 b, if any, is a more gradual curvature than the curvature of the curvedperipheral region 611 a. In a non-limiting example, thetop surface 611 b has a radius of curvature larger or substantially larger than the radius of the curvedperipheral region 611 a. As explained herein, the system can take advantage of the shape of the non-ideal microlens to obtain additional spatial information from each PD group. Themicrolens 611 deviates sufficiently from the “ideal” (elliptic paraboloid or paraboloid of revolution) shape to cause incoming collimated light to converge in two different locations, with one location on the surface of eachrespective photodiode - The term “effective optical center” describes the average location of the light gathered by a photodiode. For a pixel having two or more photodiodes and a single microlens, the effective optical center of the light gathered by one of the photodiodes is offset from the centroid of the area occupied by the photodiode.
- When the lens is optimally focused on a region of interest,
microlens 611 causes light from a point in the region of interest to converge on two different points which are separated from each other by a distance of approximately 0.5 times the pixel size. A first one of the two different points is located on the first photodiode, and a second one of the two different points is located on the second photodiode. As described below, the system and method described herein can take advantage of the separation between the two locations of the effective optical centers of therespective photodiodes - As described below,
microlenses 611 can collect focused light and transmit the focused light to all of thephotodiodes PD group 633.Microlenses 611 can be configured to cause the light to converge.Color filters 612 can remove unwanted light spectrum from respective color channels. For example, agreen color filter 612 can be configured to block light having a wavelength less than a predetermined value (e.g., 505 nm) and greater than a second predetermined value (e.g., 530 nm), but admit light having a wavelength of 505-530 nm.Second layer 620 can provide space enabling light transmitted bymicrolenses 611 and throughcolor filters 612 to converge, as shown inFIG. 10 . -
Substrate 631 can include a silicon substrate, a germanium substrate, an indium gallium arsenide substrate, or the like. Barriers 632 (also called light shields) can includefirst portions 632 a projecting fromsubstrate 631 towardmicrolenses 611.First portions 632 a can be arranged to isolate adjacent PDs within aPD group 633 and/or to isolateadjacent PD groups 633.First portions 632 a can project throughsecond layer 620 until reachingcolor filter 612. Alternatively, or in addition,barriers 632 can includesecond portions 632 b extending intosubstrate 631 to isolate adjacent PDs within aPD group 633 and/or to isolateadjacent PD groups 633. First and/orsecond portions second portions 632 b can be a shallow trench isolation region or an implant isolation region. - Each
PD substrate 631 towardmicrolens 611 and a second portion (e.g., 634 y) extending into a void defined insubstrate 631. For convenience, thefirst portion 634 x is only shown for onePD 634, but can be included in any PD described in the present application. EachPD - As discussed above,
PDs PDs PD - A
pixel 640 can include onemicrolens 611, onecolor filter 612, onePD group 633, and anybarriers 632 between adjacent PDs within thePD group 633.FIG. 6 shows twodifferent pixels 640. The above description ofPDs PD group 633. If theimaging sensor 412 is a monochrome sensor, thecolor filter 612 can be omitted. - In the example of
FIG. 6 , eachmicrolens 611 can include an arced curvedperipheral region 611 a, a planartop surface 611 b and a planar or generally planarbottom surface 611 c.Bottom surface 611 c is above thePDs top surface bottom surface 611 c. In other sensor examples (not shown), the central portion oftop surface 611 b of themicrolens 611 approximates a flat surface. That is, the curvature of thetop surface 611 b, if any, is a more gradual curvature than the curvature of the curvedperipheral region 611 a. The shape of themicrolens 611 can be a paraboloid, an elliptic hyperboloid, a hemisphere, half of a prolate spheroid, half of a spherical ellipsoid, half of an oblate spheroid or other aspherical shape. The radius of curvature rc may be constant or variable. Themicrolens 611 can have any shape that converges collimated light received by themicrolens 611 on respectively different effective optical centers in each respective photodiode. - In a non-limiting example, the
top surface 611 b has a radius of curvature much larger than an edge of the curvedperipheral region 611 a. For example, a substantially planarcentral portion 611 b of themicrolens 611 may have a radius of curvature about 10-50 times larger than the radius of curvature of the peripheral region of arcedtop surface 611 a. -
FIG. 7 is a plan view as viewed from section line 7-7 ofFIG. 6 . Ifmicrolens 611 is circular in plan, then the curved peripheral region may be an annular region. Each curvedperipheral region 611 a may have a cross section with a radius of curvature rc, as shown inFIG. 6 . With respect to apixel 640, and as further discussed below,microlens 611 is configured to converge light and provide the converged light toPD group 633. InFIG. 7 ,microlens 611 at least partially coversphotodiodes - The depicted structures of
pixels 640 are only examples of the many pixel structures consistent with the present application. - In some sensors, a subset of the
pixels 640 within asingle imaging sensor 412 can have different structures from the remaining pixels. With reference toFIG. 8 , some pixels may be disposed in acentral region 801 ofimaging sensor 412, while other pixels may be disposed in aperipheral region 802 ofimaging sensor 412. Incentral region 801, incoming light is approximately normal to planartop surface 611 b.Central region 801 may represent a minority or a majority portion ofimaging sensor 412.Pixels 640 ofFIG. 6 may be disposed incentral region 801 ofimaging sensor 412. - In
peripheral region 802, and as shown inFIG. 9 , incoming collimated light 901 can be approximately normal to a point on curvedperipheral region 611 a and thusPD group 633 can be offset with respect tomicrolens 611. The offset enablesmicrolens 611 to converge angled light ontoPD group 633 corresponding to themicrolens 611. The amount of offset in apixel 640 can be based on a distance from thepixel 640 tocentral region 801. For the reader's convenience, the Figures, other thanFIG. 9 , depictpixels 640 disposed incentral region 801. -
FIG. 10 shows incoming, in-focus, and collimated light 1001 incident onpixels 640 in central region 801 (FIG. 8 ). In bothFIGS. 9 and 10 ,upstream optics 401 have already focused light 901, 1001 onimaging sensor 412. The light 901, 1001 is considered collimated because the lens is adjusted so the region of interest (e.g., O2 of scene 501) corresponding to the focus point selected by the user is in focus. - As shown in
FIG. 10 , eachmicrolens 611 causes collimated focused light 1001 to converge so light converges on anoptical area PD optical area photodiode peripheral region 611 a causes incoming light to bend radially inward, toward central axis C. Light incident on planartop surface 611 b proceeds in the same direction. -
FIG. 10 shows that light 1001 comprises three portions. A first portion 1004 converges onto a first area offirst PD 634. Asecond portion 1005 converges onto a second area ofsecond PD 635. Athird portion 1006 is incident uponbarrier 632 and/or the region betweenPDs - As shown in
FIG. 10 , focused light 1004 a, 1005 a, impinges on a surface area (the top surface area of microlens 611). The focused light converges as indicated by convergingrays optical area respective photodiode - By converging the light the first area of the
first PD 634 and the second area of thesecond PD 635,microlens 611 can cause a greater percentage of incoming photons to impinge on thePDs PDs - With reference to
FIG. 11 , the light 1004, 1005 impinges on aportion 1104, 1105 (referred to herein as the “optical area”) of the area of eachrespective photodiode microlens 611. Each of first and secondoptical areas scene 501. The union of first and secondoptical areas microlens 611. Firstoptical area 1104 is shown in phantom, and secondoptical area 1105 is shown in solid lines. First and secondoptical areas optical centers distance 1103. As used herein, the term “effective optical center” refers to the average location of light gathered by the photodiode. The effectiveoptical centers optical areas optical areas FIG. 11 , the z coordinates are assumed to be the same as the z coordinates of the centroids of the respective photodiodes, because of symmetry. The y coordinate (y ) of the effectiveoptical center -
- where I is the light flux on a differential area dydz, and the double integral for each respective photodiode is integrated over the respective optical area of the photodiode.
- As shown in
FIG. 11 , the light beams passing through the left and right portions ofmicrolens 611 can overlap. Put differently, light 1004 incident onfirst PD 634 can include rays of light from a first area ofscene 501 and light 1005 incident onsecond PD 635 can include rays of light from a second area ofscene 501. The first and second areas ofscene 501 can partially overlap, but the non-overlapping areas provide additional spatial information in eachPD second photodiode 635 can be different from the amount of light gathered byfirst photodiode 634. As thedistance 1103 between the effectiveoptical centers distance 1103 between the effectiveoptical centers photodiodes distance 1103 approaches zero, the amount of information (for a sensor having two photodiodes per microlens) approaches the same amount of information provided by a sensor having a single photodiode per microlens. - Referring to
FIGS. 12 and 18 ,processing system 300 ofFIG. 3 can apply the distance between the effectiveoptical centers processing system 300 has aPDAF block 302 c (FIG. 3 ) that provides a means for generating a lens positioning signal for a lens, based on a phase difference determined using at least two of the plurality of photodiodes. PDAF block 302 c detects a phase difference between light arriving at a first one of the plurality of photodiodes and light arriving at a second one of the plurality of photodiodes. PDAF block 302 c generates the lens positioning signal for positioning the lens so that the phase difference between light arriving at the first one of the plurality of photodiodes and light arriving at the second one of the plurality of photodiodes has a predetermined non-zero value. -
Intensity profile 1201 is an of a response of a plurality of consecutive and identically orientedfirst PDs 634 of a plurality ofconsecutive PD groups 633.Intensity profile 1202 can be an exemplary response of a plurality of consecutive and identically orientedsecond PDs 635 of the sameconsecutive PD groups 633. For a sensor (not shown) having an “ideal” paraboloid shaped microlenses, the peak-to-peak distance 1203 is the phase difference (phase disparity), and is zero at optimal focus. For the “non-ideal” sensor discussed herein, the peak-to-peak distance 1203 has a non-zero value when the lens is optimally focused. -
Intensity profiles second PDs PD group 633. The horizontal axis ofFIG. 12 corresponds to pixel position along a particular axis (e.g., the Y axis ofFIG. 10 ). The vertical axis ofFIG. 12 corresponds to PD response (e.g., brightness measured or electrons deposited in an electron well). The distance between similar features ofintensity profiles peak distance 1203. Horizontal and vertical, as used herein, relate to the graph ofFIG. 12 , and do not necessarily correspond to any particular axis. - As further discussed below, a
processing system 300 can generate pixel data from a single exposure period, corresponding to left and right (and/or top and bottom) phase detection pixels. Each set of data can include twointensity profiles intensity profile adjacent PD groups 633 can be orthogonal. That is, therespective microlenses 611 of the twoPD groups 633 are rotated about the X axis by an angle of 90 degrees from each other (where the X, Y, and Z axes are shown inFIG. 11 ). As such, somepixels 640 can be useful for autofocus along the Y axis; when the lens is in focus, light passing through the single microlens converges on two effective optical centers having respectively different Y values. Other pixels (not shown) can be useful for autofocus along the Z axis; when the lens is in focus, light passing through the single microlens converges on two effective optical centers having respectively different Z coordinates. Aintensity profile 1201 may thus only include measurements fromfirst PDs 634 that are oriented in a common direction (e.g., with effective optical centers having respectively different Y coordinates). - Some of the operations of
FIG. 18 , which are further discussed below, generally causeimaging assembly 400 to mechanically adjust until peak-to-peak distance 1203 (also called a phase difference) reaches (e.g., approximately reaches) a predetermined value. The predetermined value may be a known dimension 1203 (also called minimum phase difference), which represents the distance between effectiveoptical centers manufacturing imaging sensor 412. As discussed above, amicrolens 611 having a substantially planartop surface 611 b converges light on two different areas ofrespective PDs - The
PD group 633 of eachpixel 640 may include any suitable number ofPDs FIGS. 13-15 and 17 , eachPD group 633 can include fourdifferent PDs Barriers 632 can be arranged in a crossing pattern to separate adjacent PDs inPD group 633 along the Y and Z axes. As shown inFIG. 14 , asingle barrier 632 can include a plurality of different andnon-contacting sub-barriers - As shown in
FIGS. 13 and 15 , a common microlens 611 (FIG. 13 ) can produce four different optical areas (not shown) with first, second, third, and fourth effectiveoptical centers FIG. 15 ). When incoming light is optimally focused, the difference in Z coordinates between adjacent effective optical centers can bedimension 1505 and the Y-axis distance between adjacent effective optical centers can be dimension 1506. - Besides the smaller shapes and arrangements of the
PD groups 633 andbarriers 632, any and all features described with reference to the two-PD pixels 640 inFIGS. 6-11 can apply to the four-PD pixels 640 inFIGS. 13-15 . -
FIGS. 15A, 15B, 15C, 15D show cross sections taken alongrespective section lines 15A-15A, 15B-15B, 15C-15C, and 15D-15D ofFIG. 14 . Focused and collimated incoming light 1001 (shown inFIG. 10 ) includes first, second, third, fourth, and fifth portions 1511-1515. -
First portion 1511 is incident onfirst PD 634 a.Second portion 1512 is incident onsecond PD 635 a.Third portion 1513 is incident onthird PD 634 b.Fourth portion 1514 is incident onfourth PD 635 b.Fifth portion 1515, which is incident onbarrier 632 and/or the spaces betweenadjacent PDs photodiodes -
Imaging sensor 412 can include any number (e.g., several millions) ofpixels 640. In some embodiments, eachpixel 640 can include two PDs. Alternatively, eachpixel 640 can include four PDs. In various examples, eachpixel 640 can include any suitable number of PDs (e.g., 8 or 16). In some embodiments, everypixel 640 can include the same number of PDs. Alternatively,different pixels 640 can include different numbers of PDs (e.g., some may include one PD, others may include two PDs, and others may include four PDs). - Each
pixel 640 can have a red, green, orblue color filter 612, or no color filter if the sensor is a monochrome sensor. The color filters can be arranged in any suitable pattern (e.g., a Bayer pattern). Although not shown, only a portion of the total area ofimaging sensor 412 is occupied bypixels 640. Other portions ofimaging sensor 412 can include circuitry (e.g., horizontal and vertical registers) to measure outputs ofpixels 640. Further,adjacent pixels 640 can be separated by circuitry. - Two-PD pixels: If multiple two-
PD pixels 640 are present, then the first andsecond PDs PD group 633 can be arranged in the same directions. Alternatively, somePD groups 633 can be rotated with respect toother PD groups 633. For example, half of thePD groups 633 can have the orientations shown inFIG. 11 (with the PDs separated in the y direction) and the other half of thePD groups 633 can have orientations perpendicular to those shown inFIG. 11 (e.g. with the PDs separated in the z direction). Alternatively, theimaging sensor 412 can predominantly comprise pixels having a left PD and a right PD, and be sparsely populated with pixels having a top PD and a bottom PD. Such an arrangement enables autofocus in two-dimensions. - As a result, and with reference to
FIG. 12 , a phase detection intensity profile can be collected: a first intensity profile corresponding tofirst PDs 634 in the orientation ofFIG. 11 , a second intensity profile corresponding tosecond PDs 635 in the orientation ofFIG. 11 , a third intensity profile corresponding tofirst PDs 634 perpendicular to the orientation ofFIG. 11 , and a fourth intensity profile corresponding tosecond PDs 635 perpendicular to the orientation ofFIG. 11 . In such a case,processing system 300 can perform autofocus to minimize the phase difference, corresponding to placing the peaks of the first and second intensity profiles a predetermined minimum distance apart and/or to place the peaks of the third and fourth intensity profiles a predetermined distance apart. - Four-PD pixels: The same result is obtained if multiple four-
PD pixels 640 are included. For example, a first intensity profile can correspond to first PDs 634 a, a second intensity profile can correspond to second PDs 635 a, a third intensity profile can correspond tothird PDs 634 b, and a fourth intensity profile can correspond tofourth PDs 635 b. The system can determine the phase difference between any two of thePDs pixel 640 during autofocus. For example, the autofocus system can determine the phase difference between the peak of the first intensity profile and the peak of the the second, third, or fourth intensity profile. The second intensity profile can be compared to the first, third, or fourth intensity profile. The third intensity profile can be compared to the first, second, or fourth intensity profile. The fourth intensity profile can be compared to the first, second, or third intensity profile. -
FIG. 18 is a flow chart showing a series of operations thatprocessing system 300 can be configured to perform to (a)autofocus imaging assembly 400 using phase detection, for example, and (b) enhance resolution ofimaging assembly 400 using the extra spatial information from thepixels 640 having a non-ideal microlens (e.g., having planartop surface 611 b) and curvedperipheral region 611 a of the top surface.FIG. 18 is only one example of operations consistent with the present application. - At
block 1802, one or more regions of interest within the field of view of the sensor can be selected by a user (e.g., by touching a focus point in a region on adisplay 102, 122) or by processingsystem 300 automatically. Each region of interest can correspond to a two-dimensional area of ascene 501 to be brought into focus. Alternatively, or in addition, each focal point can correspond to one or more pixels 640 (processing system 300 can store a map linking each selected focal point to a corresponding group of pixels 640). - At
block 1804, an autofocus operation is initiated to bring light from the region of interest into focus at the plane of theimaging sensor 412. For example,processing system 300 can commandimaging assembly 400 to exposeimaging sensor 412 to incoming light. Within each pixel, light passing through the microlens of the pixel converges on the optical areas of each photodiode of the pixel. - Because
different color filters 612 impact the measured luminance,processing system 300 can normalize responses ofpixels 640. For example,processing system 300 can (a) multiply responses of PDs undergreen color filters 612 by a first value (e.g., one), (b) multiply responses of PDs underblue color filters 612 by a second value, and (c) multiply responses of PDs underred color filters 612 by a third value. Operators other than multiplication can be applied. - At
block 1806,processing system 300 can determine the phase difference between the PDs in each PD group. Atblock 1806,processing system 300 can determine the phase difference betweenleft PD 634 a andright PD 635 a, and/or the difference betweentop PD 634 b andbottom PD 634 a. - At
block 1808,processing system 300 can compare the phase difference to a predetermined minimum phase difference value corresponding to optimal focus for a region of interest within the field of view of the sensor. For this purpose, the phase difference corresponds to the dimension between the light intensity peaks detected by a left photodiode and a right photodiode, such as peak-to-peak distance 1203 (FIG. 12 ). As discussed above, with an ideal paraboloid microlens, the phase difference at optimal focus is zero, but for the flattened, non-ideal microlens, the phase difference at optimal focus is a non-zero value.Processing system 300 can store one or more predetermined values corresponding to different types of PD. As stated above, the predetermined values can be determined at the time of manufacturing. The predetermined minimum phase difference values can be the distances between optical centers when incoming light 1001 is in-focus. When allpixels 640 are identically oriented and include two PDs (i.e., all left-and-right PDs, or all top-and-bottom PDs), the predetermined value can bedistance 1103 ofFIG. 11 . When allpixels 640 include four PDs, the values can bedistances 1505 and 1506 ofFIG. 15 . - At
block 1810,processing system 300 can commandimaging assembly 400 to focus based on one or more of the phase differences. Theprocessing system 300 determines a lens positioning command, based on the comparison between the measured phase difference and the minimum phase difference at optimal focus.Processing system 300 can be configured to performblock 1810 such that after adjusting the lens based on the lens positioning command, the phase difference between left and right photodiodes is substantially equal to the predetermined minimum phase difference value(s). Blocks 1804-1810 can represent a phase detection autofocus technique. - In
block 1811, theprocessing system 300 controls themobile device 100 to capture an image. The sensor voltages are zeroed out, and theimaging sensor 412 is exposed to incoming light from the region of interest for an exposure period, which can be automatically determined by theprocessor 301. The photodiodes of theimaging sensor 412 accumulate charge according to the intensity of the light received by each pixel. - In
block 1812,processing system 300 can perform one or more interpolation techniques to resample the measurements (e.g., voltage values representing luminance values) ofpixels 640 to correspond to a set of evenly spaced pixel values, which can be processed using image processing techniques for an evenly spaced pixel array. - At
block 1814,processing system 300 can save the interpolated values as an image file. In some embodiments, the resampled image data are processed according to an image processing chain for a uniformly spaced sensor array having uniformly spaced pixels, and saved in Joint Photographic Experts Group (JPEG) or Tagged Image File Format (TIFF). For example, the image processing operations can include demosaicing, white balance, cross talk reduction, noise reduction, sharpening, image filtering, lens artifact or defect correction, or the like. - The raw and non-interpolated measurements (voltages representing luminance values of each PD can be output in a RAW format file. Alternatively, the
imaging sensor 412 can include on-chip circuitry to perform the bilinear or bicubic interpolation to resample the image data, and output the resampled image data in a RAW file format. - At
block 1816,processing system 300 can: resample the raw data and store results of the resampling (interpolation); and/or (b) command display elements (e.g., LEDs, OLEDs) of a display to light up based on each processed image pixel. - At
block 1818,processing system 300 can transmit the image file over anexternal communications interface 309. - An image can be represented as a two-dimensional matrix with a plurality of display pixels. Each display pixel can correspond to a unit of resolution of the image and can include RGB data or luminance and chrominance data. The RGB data include a red value, a green value, and a blue value. A
processing system 300 displaying the image can then illuminate a liquid crystal display (LCD) or light emitting diodes (“LEDs”) (e.g. OLEDs, micro LEDs) based on each RGB coordinate. - Besides color interpolation techniques,
processing system 300 can resample the image data so the pixels in each resampled row are uniformly spaced. As noted above in the discussion ofFIG. 15 , themicrolenses 611 cause the light to converge on locations centered at positions 1501-1504. The positions 1501-1504 (the effective optical centers) are offset from the centroids of the two-dimensional area of eachphotodiode distance 1505 between effective optical centers amongadjacent photodiodes photodiodes - Because many image processing techniques are based on uniform spacing between pixels, resolution enhancement is achieved by resampling (e.g., using interpolation) to provide uniformly spaced resampled pixels. The number of resampled pixels can equal the number of photodiodes, and each resampled pixel can be located at a centroid of a respective photodiode.
-
Resampling Block 302 d (FIG. 3 ) ofprocessing system 300 provides a means for resampling the luminance values by interpolating among the received luminance values to determine respective resampled luminance values of a plurality of resampled pixels having respective optical centers located at respective centroids of each of the plurality of photodiodes. - For example,
resampling Block 302 d ofprocessing system 300 can perform bilinear or bicubic interpolation to estimate or approximate how resampled pixels located at the centroids ofPDs - For bicubic interpolation, illuminance values from at least five photodiodes are used, including a first PD for which a resampled pixel is being computed and adjacent PDs on left, right, top and bottom sides of the first PD. For example, referring to
FIG. 17 , using bicubic interpolation, the luminance values of PDs 634 a, 634 b, 635 a, afifth PD 1711 to the left ofPD 634 a, and asixth PD 1712 belowPD 634 a (all measured at their respective effective optical centers 1501-1503) can be used to find a resampled luminance value of a resampled pixel located at thecentroid 1701 ofphotodiode 634 a. - Alternatively, using bilinear interpolation, illuminance values of at least three PDs are used, including an adjacent PD to the left or right of the PD for which a resampled pixel is being computed, and an adjacent PD above or below the PD for which a resampled pixel is being computed. For example, luminance values of
PD 634 a,PD 1711, andPD 1712 at their respective optical centers can be used to find a resampled luminance value of a resampled pixel located at thecentroid 1701 ofphotodiode 634 a. - Two-PD pixels: Referring to
FIG. 16 ,first PD 634 can have afirst centroid 1601 andsecond PD 635 can have asecond centroid 1602. Duringblock 1812,processing system 300 can perform the bicubic or bilinear interpolation described above to estimate the resampled luminance value of a resampled pixel having an optical center at thecentroid 1601 of the two-dimensional area ofphotodiode 634. -
Processing system 300 can perform the same bicubic or bilinear interpolation techniques discussed above to estimate the resampled luminance value of a resampled pixel having an optical center at thecentroid 1602 of the two-dimensional area ofphotodiode 635.Distances optical centers corresponding locations - The interpolation of each
pixel 640 depends on the amount of offset betweenmicrolens 611 andPD group 633.Processing system 300 can perform this interpolation on allpixels 640 to resample all of thepixels 640 in theimaging sensor 412. - Four-PD pixels: Referring to
FIG. 17 , first through fourth PDs 634 a, 635 a, 634 b, 635 b can have first through fourth centroids 1701-1704. Inblock 1812,processing system 300 can perform interpolation to estimate or approximate the luminance values of first throughfourth PDs 634 a-635 b if the optical centers of light 1501-1504 were respectively located at the centroids 1701-1704. - The magnitudes of each
distance PD 634 a-635 b and the signs may adjust accordingly. For example:PD 634 b can have a negativefirst distance 1705 and a negativesecond distance 1706 whilePD 635 a can have a positivefirst distance 1705 and a positivesecond distance 1706. PDs 634 a and 635 b can each have one positive distance and one negative distance. If eachPD 634 a-635 b is a square, then the magnitudes of first andsecond distances - In both the two-PD case and the four-PD case, the interpolation of each
pixel 640 depends on the amount of offset betweenmicrolens 611 andPD group 633.Processing system 300 can perform this interpolation on allpixels 640 - While the features, methods, devices, and systems described herein can be embodied in various forms, some exemplary and non-limiting embodiments are shown in the drawings, and are described above. Some of the components described in this disclosure are optional, and some implementations can include additional, different, or fewer components from those expressly described in this disclosure. Relative terms (e.g., lower, horizontal, up, down, bottom, etc.) are provided for convenience in understanding the figures and does not limit the subject matter of the disclosure.
- The subject matter has been described with illustrative examples. The claimed inventions are not limited to these examples. Changes and modifications can be made to the claimed inventions without departing from their spirit. It is intended that the claims cover such changes and modifications.
Claims (21)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/670,728 US10567636B2 (en) | 2017-08-07 | 2017-08-07 | Resolution enhancement using sensor with plural photodiodes per microlens |
PCT/US2018/039123 WO2019032208A1 (en) | 2017-08-07 | 2018-06-22 | Resolution enhancement using sensor with plural photodiodes per microlens |
CN201880048761.0A CN110959285B (en) | 2017-08-07 | 2018-06-22 | Imaging system, imaging method, and non-transitory machine-readable storage medium |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/670,728 US10567636B2 (en) | 2017-08-07 | 2017-08-07 | Resolution enhancement using sensor with plural photodiodes per microlens |
Publications (2)
Publication Number | Publication Date |
---|---|
US20190045111A1 true US20190045111A1 (en) | 2019-02-07 |
US10567636B2 US10567636B2 (en) | 2020-02-18 |
Family
ID=63080460
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US15/670,728 Active 2037-08-22 US10567636B2 (en) | 2017-08-07 | 2017-08-07 | Resolution enhancement using sensor with plural photodiodes per microlens |
Country Status (3)
Country | Link |
---|---|
US (1) | US10567636B2 (en) |
CN (1) | CN110959285B (en) |
WO (1) | WO2019032208A1 (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10708556B2 (en) * | 2017-08-29 | 2020-07-07 | Canon Kabushiki Kaisha | Imaging device and imaging system |
US20200243578A1 (en) * | 2019-01-30 | 2020-07-30 | Samsung Electronics Co., Ltd. | Image sensor |
US10886318B2 (en) | 2019-01-30 | 2021-01-05 | Samsung Electronics Co., Ltd. | Image sensor |
WO2021044716A1 (en) * | 2019-09-05 | 2021-03-11 | ソニーセミコンダクタソリューションズ株式会社 | Solid-state imaging device and electronic apparatus |
WO2021133025A1 (en) * | 2019-12-23 | 2021-07-01 | Samsung Electronics Co., Ltd. | Electronic device comprising image sensor and method of operation thereof |
CN114136591A (en) * | 2021-11-26 | 2022-03-04 | 广东工业大学 | Method and system for evaluating ultra-precision machining error of micro lens array |
US20230016604A1 (en) * | 2021-07-13 | 2023-01-19 | SK Hynix Inc. | Image sensing device |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN117097335B (en) * | 2023-10-18 | 2024-01-26 | 南京天易合芯电子有限公司 | High-sensitivity proximity light detection sensor |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100245656A1 (en) * | 2009-03-31 | 2010-09-30 | Sony Corporation | Imaging device and focus detecting method |
US20120194714A1 (en) * | 2011-01-28 | 2012-08-02 | Canon Kabushiki Kaisha | Solid-state image sensor and camera |
US20130002936A1 (en) * | 2011-06-30 | 2013-01-03 | Nikon Corporation | Image pickup apparatus, image processing apparatus, and storage medium storing image processing program |
US20130161774A1 (en) * | 2010-08-24 | 2013-06-27 | Fujifilm Corporation | Solid state imaging device |
US20160006931A1 (en) * | 2012-06-14 | 2016-01-07 | Olympus Corporation | Imaging apparatus and method for controlling the imaging apparatus |
US20170118395A1 (en) * | 2015-10-27 | 2017-04-27 | Blackberry Limited | Auto-focus control in a camera to prevent oscillation |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7128266B2 (en) * | 2003-11-13 | 2006-10-31 | Metrologic Instruments. Inc. | Hand-supportable digital imaging-based bar code symbol reader supporting narrow-area and wide-area modes of illumination and image capture |
EP1812968B1 (en) | 2004-08-25 | 2019-01-16 | Callahan Cellular L.L.C. | Apparatus for multiple camera devices and method of operating same |
WO2012036019A1 (en) | 2010-09-13 | 2012-03-22 | 富士フイルム株式会社 | Monocular 3d-imaging device, shading correction method for monocular 3d-imaging device, and program for monocular 3d-imaging device |
JP6120508B2 (en) | 2011-10-03 | 2017-04-26 | キヤノン株式会社 | Imaging device and imaging apparatus |
JP5690977B2 (en) | 2012-06-07 | 2015-03-25 | 富士フイルム株式会社 | Imaging device and imaging apparatus |
US20150062422A1 (en) | 2013-08-27 | 2015-03-05 | Semiconductor Components Industries, Llc | Lens alignment in camera modules using phase detection pixels |
US9445018B2 (en) | 2014-05-01 | 2016-09-13 | Semiconductor Components Industries, Llc | Imaging systems with phase detection pixels |
US20160295122A1 (en) | 2015-04-03 | 2016-10-06 | Canon Kabushiki Kaisha | Display control apparatus, display control method, and image capturing apparatus |
CN106982328B (en) * | 2017-04-28 | 2020-01-10 | Oppo广东移动通信有限公司 | Dual-core focusing image sensor, focusing control method thereof and imaging device |
-
2017
- 2017-08-07 US US15/670,728 patent/US10567636B2/en active Active
-
2018
- 2018-06-22 WO PCT/US2018/039123 patent/WO2019032208A1/en active Application Filing
- 2018-06-22 CN CN201880048761.0A patent/CN110959285B/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100245656A1 (en) * | 2009-03-31 | 2010-09-30 | Sony Corporation | Imaging device and focus detecting method |
US20130161774A1 (en) * | 2010-08-24 | 2013-06-27 | Fujifilm Corporation | Solid state imaging device |
US20120194714A1 (en) * | 2011-01-28 | 2012-08-02 | Canon Kabushiki Kaisha | Solid-state image sensor and camera |
US20130002936A1 (en) * | 2011-06-30 | 2013-01-03 | Nikon Corporation | Image pickup apparatus, image processing apparatus, and storage medium storing image processing program |
US20160006931A1 (en) * | 2012-06-14 | 2016-01-07 | Olympus Corporation | Imaging apparatus and method for controlling the imaging apparatus |
US20170118395A1 (en) * | 2015-10-27 | 2017-04-27 | Blackberry Limited | Auto-focus control in a camera to prevent oscillation |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10708556B2 (en) * | 2017-08-29 | 2020-07-07 | Canon Kabushiki Kaisha | Imaging device and imaging system |
US20200243578A1 (en) * | 2019-01-30 | 2020-07-30 | Samsung Electronics Co., Ltd. | Image sensor |
US10886318B2 (en) | 2019-01-30 | 2021-01-05 | Samsung Electronics Co., Ltd. | Image sensor |
US10998365B2 (en) * | 2019-01-30 | 2021-05-04 | Samsung Electronics Co., Ltd. | Image sensor |
US11955497B2 (en) | 2019-01-30 | 2024-04-09 | Samsung Electronics Co., Ltd. | Image sensor |
WO2021044716A1 (en) * | 2019-09-05 | 2021-03-11 | ソニーセミコンダクタソリューションズ株式会社 | Solid-state imaging device and electronic apparatus |
WO2021133025A1 (en) * | 2019-12-23 | 2021-07-01 | Samsung Electronics Co., Ltd. | Electronic device comprising image sensor and method of operation thereof |
US11626447B2 (en) | 2019-12-23 | 2023-04-11 | Samsung Electronics Co., Ltd | Electronic device comprising image sensor for identifying an operation setting and an external environmental condition and method of operation thereof |
US20230016604A1 (en) * | 2021-07-13 | 2023-01-19 | SK Hynix Inc. | Image sensing device |
US11700466B2 (en) * | 2021-07-13 | 2023-07-11 | SK Hynix Inc. | Image sensing device |
CN114136591A (en) * | 2021-11-26 | 2022-03-04 | 广东工业大学 | Method and system for evaluating ultra-precision machining error of micro lens array |
Also Published As
Publication number | Publication date |
---|---|
WO2019032208A1 (en) | 2019-02-14 |
US10567636B2 (en) | 2020-02-18 |
CN110959285B (en) | 2021-07-06 |
CN110959285A (en) | 2020-04-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US10567636B2 (en) | Resolution enhancement using sensor with plural photodiodes per microlens | |
US10044959B2 (en) | Mask-less phase detection autofocus | |
US9866810B2 (en) | Optimization of optical systems for improved light field capture and manipulation | |
US10044926B2 (en) | Optimized phase detection autofocus (PDAF) processing | |
US9338380B2 (en) | Image processing methods for image sensors with phase detection pixels | |
US20170347042A1 (en) | Imaging systems with high dynamic range and phase detection pixels | |
US9432568B2 (en) | Pixel arrangements for image sensors with phase detection pixels | |
US9363425B2 (en) | Color filter arrangements for fused array imaging systems | |
US20180301484A1 (en) | Image sensors with high dynamic range and autofocusing hexagonal pixels | |
US10593712B2 (en) | Image sensors with high dynamic range and infrared imaging toroidal pixels | |
KR101517704B1 (en) | Image recording device and method for recording an image | |
US20130222546A1 (en) | Solid-state image pickup element and image pickup apparatus | |
EP3700192B1 (en) | Imaging device and signal processing device | |
KR20220063575A (en) | Apparatus and method for obtaining image emplying color separation lens array | |
US20180288306A1 (en) | Mask-less phase detection autofocus | |
WO2023016144A1 (en) | Focusing control method and apparatus, imaging device, electronic device, and computer readable storage medium | |
JP2019092145A (en) | Image sensor with shifted microlens array | |
US20150116562A1 (en) | Compact spacer in multi-lens array module | |
US10580807B2 (en) | Color pixel and range pixel combination unit | |
CN103503447B (en) | The control method of filming apparatus and filming apparatus | |
US20240127407A1 (en) | Image sensor apparatus for capturing depth information |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: QUALCOMM INCORPORATED, CALIFORNIA Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:GALOR GLUSKIN, MICHA;REEL/FRAME:043333/0831 Effective date: 20170817 |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: RESPONSE TO NON-FINAL OFFICE ACTION ENTERED AND FORWARDED TO EXAMINER |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: FINAL REJECTION MAILED |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: DOCKETED NEW CASE - READY FOR EXAMINATION |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: NOTICE OF ALLOWANCE MAILED -- APPLICATION RECEIVED IN OFFICE OF PUBLICATIONS |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: PUBLICATIONS -- ISSUE FEE PAYMENT VERIFIED |
|
STCF | Information on status: patent grant |
Free format text: PATENTED CASE |
|
MAFP | Maintenance fee payment |
Free format text: PAYMENT OF MAINTENANCE FEE, 4TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1551); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY Year of fee payment: 4 |